CN108878689B - Substrate, preparation method thereof and display device - Google Patents
Substrate, preparation method thereof and display device Download PDFInfo
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- CN108878689B CN108878689B CN201810672316.3A CN201810672316A CN108878689B CN 108878689 B CN108878689 B CN 108878689B CN 201810672316 A CN201810672316 A CN 201810672316A CN 108878689 B CN108878689 B CN 108878689B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The embodiment of the invention provides a substrate, a preparation method thereof and a display device, relates to the technical field of display, and can solve the problem that the thickness of a light-emitting function layer formed in an opening area of an existing pixel definition layer is not uniform. The preparation method of the substrate comprises the following steps: forming a pixel defining layer film on a substrate; the material of the pixel defining layer film comprises photoresist, and a hydrophilic material, an elastic material and auxiliary particles which are doped in the photoresist; the auxiliary particles are used for releasing gas when being decomposed, and the elastic material is used for expanding the pixel defining layer film when the auxiliary particles release the gas; the molecular weight of the hydrophilic material, the photoresist and the elastic material is larger than that of the auxiliary particles; heating the pixel defining layer film to enable the auxiliary particles to move in a direction far away from the substrate; and processing the pixel defining layer film to form a pixel defining layer, and decomposing the auxiliary particles to release gas. For the preparation of the pixel defining layer.
Description
Technical Field
The invention relates to the technical field of display, in particular to a substrate, a preparation method of the substrate and a display device.
Background
Organic electroluminescent devices (OLEDs) have many advantages such as self-luminescence, high light-emitting efficiency, low operating voltage, thinness, flexibility, and simple process, and are widely used in the fields of Display and lighting.
At present, two film forming modes of a light emitting layer in an OLED device are provided, one mode is an evaporation process, and the mode is suitable for the production of small-size OLED devices; the other is a solution process, which includes spin coating, ink-jet printing or screen printing. The method of forming a film by using a solution process has the advantages of low cost, high productivity, suitability for the production of large-size OLED devices and the like, and is widely used in the production process of OLED devices.
A conventional Pixel Definition Layer (PDL) is formed by a bank, as shown in fig. 1, the width of the bank gradually decreases along a direction from the substrate 10 to the substrate 10, that is, a cross section of the Pixel Definition Layer 20 perpendicular to the substrate 10 is a regular trapezoid. Since the material forming the pixel defining layer 20 has affinity (the material forming the pixel defining layer 20 includes photoresist and the affinity material), when the light emitting functional layer (EL) 30 is formed in the opening region of the pixel defining layer 20 by a solution process such as Ink-Jet Printing (IJP), and the Ink includes the affinity material, the Ink climbs along the sidewall of the pixel defining layer 20 during drying, so that the middle of the light emitting functional layer 30 formed in the opening region of the pixel defining layer 20 is thin and the edge is thick, that is, the thickness of the light emitting functional layer 30 is not uniform, thereby affecting the light emitting effect of the OLED device, resulting in poor uniformity of the luminance of the OLED device, and further affecting the lifetime of the OLED device.
Disclosure of Invention
Embodiments of the present invention provide a substrate, a method for manufacturing the same, and a display device, which can solve the problem of non-uniform thickness of a light-emitting functional layer formed in an opening region of an existing pixel defining layer.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
in a first aspect, a method for manufacturing a substrate is provided, including: forming a pixel defining layer film on a substrate; wherein, the material of the pixel defining layer film comprises photoresist and hydrophilic material, elastic material and auxiliary particles doped in the photoresist; the auxiliary particles are used for releasing gas when being decomposed, and the elastic material is used for expanding the pixel defining layer film when the auxiliary particles release gas; the molecular weight of the hydrophilic material, the photoresist and the elastic material is larger than that of the auxiliary particles; heating the pixel defining layer film to enable the auxiliary particles to move in a direction away from the substrate base plate; and processing the pixel defining layer film to form a pixel defining layer, and decomposing the auxiliary particles to release gas.
Preferably, the processing of the pixel defining layer film to form a pixel defining layer and the decomposition of the auxiliary particles to release gas specifically includes: exposing and developing the pixel defining layer film to form a pixel defining layer; decomposing the auxiliary particles in the pixel defining layer to decompose the auxiliary particles to release gas; or, exposing and developing the pixel defining layer film to form a pixel defining layer, and decomposing the auxiliary particles to release gas.
Further preferably, the decomposing treatment of the auxiliary particles in the pixel defining layer to decompose the auxiliary particles to release gas includes: and carrying out heating treatment or light irradiation treatment on the auxiliary particles in the pixel defining layer to decompose the auxiliary particles to release gas.
Preferably, the pixel defining layer includes an opening region and a pixel defining region for defining the opening region; after the pixel defining layer thin film is processed to form a pixel defining layer, the preparation method further comprises the following steps: and forming a light emitting function layer in an opening region of the pixel defining layer.
Further preferably, the forming of the light emitting function layer in the opening region of the pixel defining layer includes: and printing ink containing the material of the luminous function layer on the opening region of the pixel defining layer by using an ink-jet printing method.
Preferably, the auxiliary particles are azo compound particles.
Preferably, the elastic material comprises at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, or a thermoplastic ethylene propylene diene monomer dynamically vulcanized elastomer.
Preferably, the hydrophilic material includes at least one of polyimide, bisphenol a polycarbonate, a polymer having an alkyl group in the main chain, and a polymer having a cyclic rigid structure in the main chain.
In a second aspect, a substrate is provided, and the substrate is prepared by the preparation method.
In a third aspect, a display device is provided, which includes the substrate.
The embodiment of the invention provides a substrate, a preparation method thereof and a display device, when a pixel defining layer is prepared on a substrate, because the materials of a pixel defining layer film comprise a photoresist and an affinity material, and also comprise auxiliary particles and an elastic material, after the pixel defining layer film is heated, the auxiliary particles in the pixel defining layer film can move towards the direction far away from the substrate, so that the distribution density of the auxiliary particles is gradually increased along the direction from the substrate to the substrate, when the pixel defining layer film is processed and the auxiliary particles release gas, because the distribution density of the auxiliary particles is gradually increased along the direction from the substrate to the substrate, the amount of the gas released by the decomposition of the auxiliary particles is gradually increased along the direction from the substrate to the substrate, so that the expansion degree of the pixel defining layer is gradually increased, thus, when the pixel defining layer is formed by the bank, the width of the bank gradually increases in a direction from the substrate to the substrate (i.e., the cross section of the pixel defining layer perpendicular to the substrate is formed in an inverted trapezoid shape). Based on this, when the light emitting function layer is formed in the opening region of the pixel defining layer, since the width of the retaining wall gradually increases along the direction from the side close to the substrate to the side away from the substrate, the side wall of the retaining wall applies stress to the light emitting function layer material toward the substrate, so that when the light emitting function layer is formed by using a solution process, the material of the light emitting function layer is prevented from climbing along the side wall of the retaining wall in the drying process, and the formed light emitting function layer has a uniform thickness. When the substrate is applied to the OLED device, the light emitting uniformity of the OLED device is ensured, and the service life of the OLED device is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art pixel definition layer formed on a substrate;
fig. 2 is a schematic flow chart illustrating a method for manufacturing a substrate according to an embodiment of the present invention;
FIG. 3 is a first schematic structural diagram illustrating a pixel defining layer film formed on a substrate according to an embodiment of the present invention;
FIG. 4 is a second schematic structural diagram illustrating a pixel defining layer film formed on a substrate according to an embodiment of the present invention;
fig. 5 is a first schematic structural diagram of a substrate according to an embodiment of the present invention;
fig. 6 is a second schematic structural diagram of a substrate according to an embodiment of the present invention;
FIG. 7(a) is a first schematic structural diagram illustrating a pixel definition layer formed on a substrate according to an embodiment of the present invention;
fig. 7(b) is a second structural diagram illustrating a pixel defining layer formed on a substrate according to an embodiment of the present invention.
Reference numerals:
10-a substrate base plate; 20-a pixel defining layer; 30-a light-emitting functional layer; 40-pixel definition layer film; 50-auxiliary particles; 60-TFT drive circuit; 70-a planar layer; 80-an electrode layer; 801-sub-electrodes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a method for manufacturing a substrate, as shown in fig. 2, including:
s100, as shown in fig. 3, forming a pixel defining layer film 40 on the base substrate 10; wherein, the material of the pixel defining layer film 40 includes photoresist and hydrophilic material, elastic material and auxiliary particles 50 doped in the photoresist; the auxiliary particles 50 are for releasing gas upon decomposition, and the elastic material is for expanding the pixel defining layer film 40 upon release of the gas from the auxiliary particles 50; the molecular weight of the hydrophilic material, the photoresist, and the elastic material are all greater than the molecular weight of the auxiliary particles 50.
First, the material of the base substrate 10 is not limited. As an example, the material of the base substrate 10 may be silicon nitride (SiN)x) Silicon oxide (SiO)x) Or silicon oxynitride (SiO)xNy) At least one of (1).
Second, how to form the pixel defining layer thin film 40 on the substrate base 10 is not limited, and for example, the pixel defining layer thin film 40 may be formed on the substrate base 10 by spin coating, spray coating, or the like.
Third, the material of the auxiliary particle 50 is not limited to release gas upon decomposition. Further, there is no limitation on how the auxiliary particle 50 is decomposed, the auxiliary particle 50 may emit gas when heated, in this case, the auxiliary particle 50 is a thermal decomposition material, and the material of the auxiliary particle 50 may be, for example, an azo compound, wherein the general structural formula of the azo compound is R-N-R', R may be a hydrocarbon group or an alkali metal, and the hydrocarbon group may specifically be an organic group such as an aliphatic group, an acyl group, or a sulfonyl group, and further, when the thermal decomposition of the auxiliary particle 50 does not affect other components of the pixel defining layer film 40, an azide compound may be selected as the material of the auxiliary particle 50; the auxiliary particle 50 may emit gas when irradiated with light, in which case the auxiliary particle 50 is a photodegradable material, and the material of the auxiliary particle 50 may be, for example, an o-azidonaphthoquinone compound.
On this basis, the type of the gas released from the auxiliary particle 50 is not limited, and in order to avoid the gas released from the auxiliary particle 50 reacting with the film on the substrate and affecting the performance of the film on the substrate, the auxiliary particle 50 is preferably decomposed to release nitrogen (N) gas2) And gases with relatively stable performance such as argon (Ar) or carbon monoxide (CO). Further preferably, the nitrogen gas has stable performance and is not easy to react with other materials, so the method is implementedExample the assisting particles 50 decompose to release nitrogen.
The specific material of the elastic material is not limited, and the elastic material should be selected to have high elasticity since the elastic material can expand the pixel defining layer film 40 when the auxiliary particles 50 release gas. Illustratively, the elastomeric material may include at least one of a Thermoplastic polyester elastomer, a Thermoplastic polyurethane elastomer (TPU), or a Thermoplastic ethylene propylene diene monomer dynamically vulcanized elastomer (TPV). Among them, thermoplastic polyester elastomer (TPEE), also called polyester rubber, is a linear block copolymer containing PBT (polybutylene terephthalate) polyester hard segment and aliphatic polyester or polyether soft segment.
The material of the photoresist is not limited, and may include Polyimide (PI), for example. In addition, the photoresist can be a positive photoresist or a negative photoresist.
Here, the hydrophilic material may be a hydrophilic material or an oleophilic material. The hydrophilic material is a rigid polymer, and the specific material of the hydrophilic material is not limited, and for example, the hydrophilic material may include at least one of polyimide, bisphenol a polycarbonate, a polymer having an alkyl group in the main chain, and a polymer having a cyclic rigid structure in the main chain. The polymer having an alkyl group in the main chain may be, for example, a polymer such as polyacrylic acid, polyacryl phthalide, polyvinyl alcohol, polyurethane, and polyphthalamide, or a derivative thereof. In addition, it should be noted that, since the polyimide can be used as both the photoresist material and the hydrophilic material, both the photoresist material and the hydrophilic material can be selected from polyimide, and when both the photoresist material and the hydrophilic material are selected from polyimide, the elastic material and the auxiliary particles 50 are added to the polyimide.
Based on the above, the materials of the pixel defining layer film 40 provided by the implementation of the present invention include, but are not limited to, the photoresist and the hydrophilic material, the elastic material and the auxiliary particles 50 doped in the photoresist, and may further include other materials such as a solvent.
S101, as shown in fig. 4, the pixel defining layer film 40 is heated, and the auxiliary particles 50 are moved in a direction away from the base substrate 10.
Since the molecular weight of the auxiliary particles 50 is smaller than the molecular weight of the photoresist, the elastic material and the hydrophilic material in the material of the pixel defining layer film 40, when the pixel defining layer film is heated, the auxiliary particles 50 move away from the substrate 10, and thus, as shown in fig. 4, the distribution density of the auxiliary particles 50 gradually increases along the direction from the substrate 10 to the substrate 10 (as shown by the arrow in fig. 4).
Here, when the material of the auxiliary particle 50 is a thermal decomposition material, since the auxiliary particle 50 moves away from the substrate base plate 10 during the process of heating the pixel defining layer film 40, the auxiliary particle 50 cannot be decomposed, and thus the temperature for heating the pixel defining layer film 40 is selected to be lower than the thermal decomposition temperature of the auxiliary particle 50. In the preferred embodiment of the present invention, the heating temperature for heating the pixel defining layer film 40 is 30 to 40 ℃.
S102, as shown in fig. 5, the pixel defining layer film 40 is processed to form the pixel defining layer 20, and the auxiliary particles 50 are decomposed to release gas.
Here, when the pixel defining layer film 40 is processed, the auxiliary particles 50 may be decomposed to release gas while the pixel defining layer 20 is formed; the pixel defining layer 20 may be formed first, and then the auxiliary particles 50 may be decomposed to release gas, which is not limited to this.
It should be noted that, because the distribution density of the auxiliary particles 50 gradually increases along the direction from the substrate 10 to the substrate 10, the amount of the gas released by the auxiliary particles 50 gradually increases along the direction from the substrate 10 to the substrate 10, and the elastic material in the pixel defining layer film 40 can expand the pixel defining layer film 40 when the auxiliary particles 50 release the gas, the larger the amount of the gas released by the auxiliary particles 50, the larger the expansion degree of the pixel defining layer film 40, and thus the larger the expansion degree of the pixel defining layer 20 along the direction from the substrate 10 to the substrate 10. Based on this, when the pixel defining layer 20 is formed by the bank, the width of the bank gradually increases along a direction from the substrate 10 to the substrate 10, that is, the cross section of the pixel defining layer 20 perpendicular to the substrate 10 is an inverse trapezoid.
The embodiment of the invention provides a method for preparing a substrate, when a pixel defining layer 20 is prepared on a substrate 10, because the material of a pixel defining layer film 40 comprises a photoresist and an affinity material, and also comprises auxiliary particles 50 and an elastic material, after the pixel defining layer film 40 is heated, the auxiliary particles 50 in the pixel defining layer film 40 can move towards the direction far away from the substrate 10, so that the distribution density of the auxiliary particles 50 is gradually increased along the direction close to the substrate 10 to far away from the substrate 10, when the pixel defining layer film 40 is processed and the auxiliary particles 50 release gas, because the distribution density of the auxiliary particles 50 is gradually increased along the direction close to the substrate 10 to far away from the substrate 10, the amount of the gas released by the auxiliary particles 50 in decomposition is gradually increased along the direction close to the substrate 10 to far away from the substrate 10, the expansion degree of the pixel defining layer 20 is gradually increased, and thus, when the pixel defining layer 20 is formed of the bank, the width of the bank is gradually increased in a direction from near the substrate 10 to far from the substrate 10 (i.e., the cross section of the pixel defining layer 20 formed perpendicular to the substrate 10 is in an inverted trapezoid shape). Based on this, when the light emitting function layer 30 is formed in the opening region of the pixel defining layer 20, since the width of the dam is gradually increased in the direction from the substrate 10 to the substrate 10, the sidewall of the dam applies stress (as shown by the arrow in fig. 5) to the light emitting function layer 30 material toward the substrate 10, so that when the light emitting function layer 30 is formed by the solution process, the material of the light emitting function layer 30 is prevented from climbing along the sidewall of the dam during the drying process, thereby making the thickness of the formed light emitting function layer 30 uniform. When the substrate is applied to the OLED device, the light emitting uniformity of the OLED device is ensured, and the service life of the OLED device is prolonged.
In view of the above, before the pixel defining layer Film 40 is formed on the substrate 10, as shown in fig. 6, a TFT (Thin Film Transistor) driver circuit 60 may be formed on the substrate 10, a planarization layer 70 may be formed on the TFT driver circuit 60, the planarization layer 70 may cover the TFT driver circuit 60, and an electrode layer 80 may be formed on the planarization layer 70, the electrode layer 80 may include a plurality of sub-electrodes 801 independent of each other, the sub-electrodes 801 may be connected to the TFT driver circuit 60 through via holes in the planarization layer 70, and each sub-electrode 801 may be located in one opening region of the pixel defining layer 20. The thickness of the planarization layer 70 is not limited, and the thickness of the planarization layer 70 is preferably 1 to 10 μm. In addition, how to form the electrode layer 80 is not limited, and for example, a conductive film may be sputtered on the planarization layer 70, and then the conductive film is exposed, developed, and etched to form a plurality of sub-electrodes 801. The material of the sub-electrode 801 may be, for example, a transparent material such as ITO (Indium Tin Oxide).
Preferably, step S102 includes:
s200, exposing and developing the pixel defining layer film 40 to form the pixel defining layer 20.
It should be noted that, when the photoresist material in the pixel defining layer film 40 is a positive photoresist, the exposed position of the positive photoresist is dissolved after development, and the unexposed position is remained after development, and since the finally formed pixel defining layer 20 is not irradiated with light, no matter whether the material of the auxiliary particles 50 is a photodecomposition material or a thermal decomposition material, when preparing the substrate, step S101 may be performed first, as shown in fig. 4, and then step S200 may be performed, at this time, the obtained pixel defining layer 20 is as shown in fig. 7(a), that is, after the auxiliary particles 50 in the pixel defining layer film 40 are moved first, the distribution density of the auxiliary particles 50 is gradually increased along the direction from the substrate 10 to the substrate 10, and then the pixel defining layer film 40 is exposed and developed to form the pixel defining layer 20; step S200 may be performed first, and then the obtained pixel defining layer 20 is as shown in fig. 7(b), and step S101 is performed to obtain the pixel defining layer as shown in fig. 7(a), that is, the pixel defining layer film 40 is exposed and developed to form the pixel defining layer 20, and then the auxiliary particles 50 in the pixel defining layer 20 are moved, so that the distribution density of the auxiliary particles 50 is gradually increased along the direction from the substrate 10 to the direction away from the substrate 10.
When the photoresist material in the pixel defining layer film 40 is a negative photoresist, the unexposed position of the negative photoresist is dissolved after development, the exposed position is remained after development, and the photoresist at the exposed position is subjected to a curing reaction, so that the auxiliary particles 50 are not easily moved during heating, and thus in the embodiment of the invention, when the photoresist material is a negative photoresist, the step S101 is performed first, and then the step S200 is performed when the substrate is prepared.
Here, after the pixel defining layer film 40 is exposed and developed to form the pixel defining layer 20, at this time, as shown in fig. 7(a) and 7(b), if the pixel defining layer 20 is formed by a bank, the width of the bank is the same along the direction from the substrate 10 to the substrate 10, that is, the cross section of the pixel defining layer 20 perpendicular to the substrate 10 is rectangular.
S201, performing decomposition treatment on the auxiliary particles 50 in the pixel defining layer 20 to decompose the auxiliary particles 50 and release gas.
Here, the decomposition treatment is not limited to the treatment that decomposes the auxiliary particles 50 to release the gas. Specifically, the decomposition treatment may be a heat treatment or a light irradiation treatment. When the material of the auxiliary particle 50 is a thermal decomposition material, the auxiliary particle 50 in the pixel defining layer 20 is subjected to a heating treatment to decompose the auxiliary particle 50 to release a gas, and a heating temperature of the heating treatment may be selected according to a thermal decomposition temperature of the auxiliary particle 50; when the material of the auxiliary particle 50 is a photodecomposition material, the auxiliary particle 50 in the pixel defining layer 20 is subjected to light treatment to decompose the auxiliary particle 50 to release a gas. Here, when the auxiliary particles 50 in the pixel defining layer 20 are irradiated with light, the light is selected in relation to the auxiliary particles 50, for example, if the auxiliary particles 50 can be decomposed to release gas under the irradiation of ultraviolet light, the light irradiation is selected as ultraviolet light; if the auxiliary particles 50 can decompose to release a gas under irradiation with visible light, the light treatment is selected from visible light.
When the photoresist material in the pixel defining layer film 40 is a negative photoresist and the exposed position of the negative photoresist is remained after development, if the auxiliary particles 50 in the pixel defining layer film 40 are a photodegradable material and can be decomposed under visible light such as yellow light to release gas, step S102 includes:
s300, exposing and developing the pixel defining layer film 40 to form the pixel defining layer 20, and decomposing the auxiliary particles 50 to release gas.
Since the photoresist material in the pixel defining layer film 40 is a negative photoresist and the exposed position of the negative photoresist is remained after development, the auxiliary particles 50 are decomposed to release gas under irradiation of visible light when the negative photoresist is exposed, and thus the auxiliary particles 50 are decomposed to release gas while the pixel defining layer 20 is formed, so that the decomposition treatment of the auxiliary particles 50 is not required.
Preferably, the pixel defining layer 20 includes an opening region and a pixel defining region for defining the opening region.
After the pixel defining layer film 40 is processed to form the pixel defining layer 20, the preparation method further includes: the light emitting function layer 30 is formed in the opening region of the pixel defining layer 20.
The light-emitting functional layer 30 may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, in addition to the light-emitting layer.
In addition, the material of the light-emitting layer is not limited, and may be an organic light-emitting layer; or a quantum dot light emitting layer.
In addition, the process of forming the light emitting function layer 30 in the opening region of the pixel defining layer 20 is not limited, and the light emitting function layer 30 may be formed in the opening region of the pixel defining layer 20 by a screen printing process or an inkjet printing process, for example.
When the step S200 and the step S201 are included in processing the pixel defining layer film 40 to form the pixel defining layer 20, the light emitting function layer 30 may be formed in the opening region of the pixel defining layer 20 after the step S200 and before the step S201; the light emitting function layer 30 may be formed in the opening region of the pixel defining layer 20 after step S201. Since the light-emitting functional layer 30 is formed first, and then the auxiliary particles 50 in the pixel defining layer 20 are decomposed to release gas, on one hand, the material of the light-emitting functional layer 30 can be better inhibited from climbing along the sidewall of the pixel defining layer 20 in the process that the auxiliary particles 50 are decomposed to release gas to expand the pixel defining layer 20; on the other hand, when the decomposition process of the auxiliary particle 50 is a heating process, the light-emitting functional layer 30 may be baked while the auxiliary particle 50 is heated to decompose the auxiliary particle 50 to release gas, so as to simplify the manufacturing process of the substrate, and therefore, it is preferable in the embodiment of the present invention that the light-emitting functional layer 30 is formed in the opening region of the pixel defining layer 20 after step S200 and before step S201. On this basis, after step S200 and before step S201, when the light-emitting functional layer 30 is formed in the opening region of the pixel defining layer 20, when the auxiliary particle 50 is subjected to the thermal decomposition treatment, a heating temperature of the appropriate heating treatment may be selected according to the thermal decomposition temperature of the auxiliary particle 50 and the material of the light-emitting functional layer 30. The heating treatment may be normal pressure heating or low pressure heating.
Further preferably, the light emitting function layer 30 is formed in an opening region of the pixel defining layer 20, and includes: the ink including the material of the light emitting functional layer is printed in the opening region of the pixel defining layer 20 by an ink jet printing method.
Since the inkjet printing method has advantages of high precision and material saving compared to other solution processes such as screen printing, the embodiment of the invention preferably uses the inkjet printing method to print the ink containing the material of the light-emitting functional layer in the opening region of the pixel defining layer 20 to form the light-emitting functional layer 30.
The embodiment of the invention provides a substrate, which is prepared by adopting the preparation method.
It should be noted that, when the substrate is prepared and formed by the above-mentioned substrate preparation method, the formed pixel defining layer 20 is as shown in fig. 5, and the cross section of the pixel defining layer 20 perpendicular to the substrate 10 is in an inverted trapezoid shape, that is, when the pixel defining layer 20 is composed of a retaining wall, the width of the retaining wall gradually increases along the direction from the substrate 10 to the direction away from the substrate 10.
When the pixel defining layer 20 on the substrate is formed by the retaining wall, since the width of the retaining wall gradually increases along the direction from the position close to the substrate 10 to the position away from the substrate 10, when the light emitting functional layer 30 is formed in the opening region of the pixel defining layer 20, the sidewall of the retaining wall applies stress to the light emitting functional layer 30 material towards the substrate 10, so that when the light emitting functional layer 30 is formed by using a solution process, the material of the light emitting functional layer 30 is prevented from climbing along the sidewall of the retaining wall in the drying process, and the thickness of the formed light emitting functional layer 30 is uniform. When the substrate is applied to the OLED device, the light emitting uniformity of the OLED device is ensured, and the service life of the OLED device is prolonged.
The embodiment of the invention also provides a display device, which comprises the substrate.
The display device provided by the embodiment of the invention can be any device which displays images, whether moving (such as video) or fixed (such as still images), and whether texts or pictures. More particularly, it is contemplated that the embodiments may be implemented in or associated with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, Personal Data Assistants (PDAs), hand-held or portable computers, GPS receivers/navigators, cameras, MP4 video players, camcorders, game consoles, wrist watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), navigators, cockpit controls and/or displays, displays of camera views (e.g., of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., a display of images for a piece of jewelry), and so forth. In addition, the display device provided by the embodiment of the invention can also be a display panel.
Here, when the light emitting function layer 30 formed on the substrate includes an organic light emitting layer, the display device is an organic electroluminescent display device; when the Light Emitting function layer 30 formed on the substrate includes a Quantum Dot Light Emitting layer, the display device is a Quantum Dot Light Emitting display device (QLED for short).
The display device may further include an encapsulation layer or an encapsulation substrate formed over the substrate, in addition to the substrate described above.
Embodiments of the present invention further provide a display device, where the display device includes the substrate, and the substrate in the display device has the same structure and beneficial effects as those of the substrate provided in the embodiments, and since the technical features and beneficial effects of the substrate have been described in detail in the embodiments, detailed descriptions thereof are omitted here.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A method of preparing a substrate, comprising:
forming a pixel defining layer film on a substrate; wherein, the material of the pixel defining layer film comprises photoresist and hydrophilic material, elastic material and auxiliary particles doped in the photoresist; the auxiliary particles are used for releasing gas when being decomposed, and the elastic material is used for expanding the pixel defining layer film when the auxiliary particles release gas; the molecular weight of the hydrophilic material, the photoresist and the elastic material is larger than that of the auxiliary particles; the hydrophilic material is a hydrophilic material or a lipophilic material;
heating the pixel defining layer film to enable the auxiliary particles to move in a direction away from the substrate base plate;
and processing the pixel defining layer film to form a pixel defining layer, and decomposing the auxiliary particles to release gas.
2. The method according to claim 1, wherein the processing of the pixel defining layer film to form a pixel defining layer and the decomposition of the auxiliary particles to release a gas comprises:
exposing and developing the pixel defining layer film to form a pixel defining layer;
decomposing the auxiliary particles in the pixel defining layer to decompose the auxiliary particles to release gas;
alternatively, the first and second electrodes may be,
and exposing and developing the pixel defining layer film to form a pixel defining layer, and decomposing the auxiliary particles to release gas.
3. A method according to claim 2, wherein the decomposing treatment of the auxiliary particles in the pixel defining layer to decompose the auxiliary particles to release a gas comprises:
and carrying out heating treatment or light irradiation treatment on the auxiliary particles in the pixel defining layer to decompose the auxiliary particles to release gas.
4. The production method according to claim 1, wherein the pixel defining layer includes an opening region and a pixel defining region for defining the opening region;
after the pixel defining layer thin film is processed to form a pixel defining layer, the preparation method further comprises the following steps: and forming a light emitting function layer in an opening region of the pixel defining layer.
5. The production method according to claim 4, wherein forming a light-emitting function layer in an opening region of the pixel defining layer comprises:
and printing ink containing the material of the luminous function layer on the opening region of the pixel defining layer by using an ink-jet printing method.
6. The production method according to claim 1, wherein the auxiliary particles are azo compound particles.
7. The method of claim 1, wherein the elastomeric material comprises at least one of a thermoplastic polyester elastomer, a thermoplastic polyurethane elastomer, or a thermoplastic ethylene-propylene-diene dynamically vulcanized elastomer.
8. The method according to claim 1, wherein the hydrophilic material comprises at least one of polyimide, bisphenol a polycarbonate, a polymer having an alkyl group in a main chain, and a polymer having a cyclic rigid structure in a main chain.
9. A substrate produced by the production method according to any one of claims 1 to 8.
10. A display device comprising the substrate according to claim 9.
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| CN111697024B (en) | 2019-03-11 | 2023-09-08 | 合肥鑫晟光电科技有限公司 | Display substrate and preparation method thereof |
| CN110379839B (en) | 2019-07-24 | 2021-11-02 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method of display substrate and display device |
| CN110649185B (en) * | 2019-09-26 | 2022-08-09 | 合肥京东方卓印科技有限公司 | Display substrate, ink-jet printing method thereof and display device |
| CN111223901B (en) * | 2019-11-29 | 2022-07-29 | 云谷（固安）科技有限公司 | Display panel and preparation method thereof |
| CN111710706B (en) * | 2020-06-30 | 2022-11-29 | 云谷（固安）科技有限公司 | Display panel, preparation method of display panel and display device |
| CN111864090A (en) * | 2020-07-07 | 2020-10-30 | 武汉华星光电半导体显示技术有限公司 | Display panel, display panel manufacturing method and display device |
| CN112909057B (en) * | 2021-01-27 | 2024-03-15 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
| CN112968045B (en) * | 2021-02-02 | 2022-11-25 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
| CN112909061A (en) * | 2021-02-02 | 2021-06-04 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
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| JP4479381B2 (en) * | 2003-09-24 | 2010-06-09 | セイコーエプソン株式会社 | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
| KR102057470B1 (en) * | 2013-07-31 | 2019-12-19 | 엘지디스플레이 주식회사 | Organic Light Emitting Diode Display Device and Method of manufacturing the same |
| CN104241329A (en) * | 2014-08-22 | 2014-12-24 | 京东方科技集团股份有限公司 | Display panel provided with pixel defining layer and manufacturing method of pixel defining layer |
| CN105470408B (en) * | 2015-12-08 | 2017-05-31 | 深圳市华星光电技术有限公司 | Groove structure for printing-filming technique and preparation method thereof |
| CN108075045A (en) * | 2016-11-16 | 2018-05-25 | 中国科学院苏州纳米技术与纳米仿生研究所 | Limiting structure for printing OLED pixel and preparation method thereof |
| CN107591432B (en) * | 2017-09-27 | 2020-05-26 | 京东方科技集团股份有限公司 | Pixel defining layer, display substrate, manufacturing method and display device |
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