CN108878689A - A kind of substrate and preparation method thereof, display device - Google Patents
A kind of substrate and preparation method thereof, display device Download PDFInfo
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- CN108878689A CN108878689A CN201810672316.3A CN201810672316A CN108878689A CN 108878689 A CN108878689 A CN 108878689A CN 201810672316 A CN201810672316 A CN 201810672316A CN 108878689 A CN108878689 A CN 108878689A
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- defining layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The embodiment of the present invention provides a kind of substrate and preparation method thereof, display device, is related to field of display technology, can solve the problems, such as that the light emitting functional layer formed in the open area of existing pixel defining layer is in uneven thickness.The preparation method of the substrate includes：Pixel defining layer film is formed on underlay substrate；Wherein, the material of pixel defining layer film includes parent's property material, elastic material and the auxiliary particle of photoresist and doping in the photoresist；Auxiliary particle is used to release gas when decomposing, and elastic material is for making pixel defining layer film expansion when auxiliary particle releases gas；The molecular weight of parent's property material, photoresist and elastic material is all larger than the molecular weight of auxiliary particle；Pixel defining layer film is heated, keeps auxiliary particle mobile to the direction far from underlay substrate；Processing is carried out to pixel defining layer film and forms pixel defining layer, and auxiliary particle decomposition is made to release gas.Preparation for pixel defining layer.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of substrate and preparation method thereof, display device.
Background technique
Organic electroluminescence device (Organic Electro-luminescent Display, abbreviation OLED) is because having
Self-luminous, luminous efficiency is high, operating voltage is low, it is frivolous, can flexibility and making technology it is simple many advantages, such as, in display, shine
Bright equal fields are widely used.
At present in OLED device there are two types of the thin film-forming methods of luminescent layer, one is vapor deposition processing procedures, and this mode is suitable for small
The production of size OLED device；Another kind is solution process, and solution process includes the side such as spin coating, inkjet printing or silk-screen printing
Formula.Due to at low cost, production capacity is high, excellent suitable for the production of large scale OLED device etc. in the way of solution process film forming
Point, and be widely used in the production process of OLED device.
Existing pixel defining layer (Pixel Definition Layer, abbreviation PDL) is made of barricade, as shown in Figure 1,
The direction far from underlay substrate 10 is arrived along close to underlay substrate 10, the width of barricade is gradually reduced, i.e., pixel defining layer 20 is vertical
It is positive trapezoidal shape in the section of underlay substrate 10.Material due to forming pixel defining layer 20 has the attached property (pixel defining layer of parent
20 material includes photoresist and parent's property material), when in the open area of pixel defining layer 20 pass through solution process such as ink-jet
It prints (Ink-Jet Printing, abbreviation IJP) and forms light emitting functional layer (Electroluminescent, abbreviation EL) 30, and
When including parent's property material in ink, ink can be climbed in the drying process along the side wall of pixel defining layer 20, so that in picture
It is thick that element defines 30 intermediate thin of light emitting functional layer formed in the open area of layer 20, edge, i.e., the thickness of light emitting functional layer 30 is not
Uniformly, to influence the light-out effect of OLED device, cause OLED device brightness homogeneity poor, and then affect OLED device
Service life.
Summary of the invention
The embodiment of the present invention provides a kind of substrate and preparation method thereof, display device, can solve to define in existing pixel
The light emitting functional layer that the open area of layer is formed problem in uneven thickness.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that：
In a first aspect, a kind of preparation method of substrate is provided, including：Pixel defining layer film is formed on underlay substrate；
Wherein, the material of the pixel defining layer film includes photoresist and the parent's property material being entrained in the photoresist, elastic material
Material and auxiliary particle；The auxiliary particle is used to release gas when decomposing, and the elastic material is used in the auxiliary
Grain makes the pixel defining layer film expansion when releasing gas；Parent's property material, the photoresist and the elastic material
The molecular weight of material is all larger than the molecular weight of the auxiliary particle；The pixel defining layer film is heated, the auxiliary is made
Particle is mobile to the direction far from the underlay substrate；Processing is carried out to the pixel defining layer film and forms pixel defining layer,
And the auxiliary particle decomposition is made to release gas.
Preferably, processing is carried out to the pixel defining layer film and forms pixel defining layer, and make the auxiliary particle point
Solution releases gas, specifically includes：To the pixel defining layer film is exposed, developing forms pixel defining layer；To described
The auxiliary particle in pixel defining layer carries out resolution process, so that auxiliary particle decomposition releases gas；Alternatively, right
The pixel defining layer film is exposed, developing forms pixel defining layer, and the auxiliary particle decomposition is made to release gas.
It is further preferred that resolution process is carried out to the auxiliary particle in the pixel defining layer, so that described auxiliary
It helps particle breakdown to release gas, specifically includes：To the auxiliary particle in the pixel defining layer carry out heat treatment or
Lighting process makes the auxiliary particle decomposition release gas.
Preferably, the pixel defining layer includes open area and the pixel bounded area for defining the open area
Domain；After carrying out processing formation pixel defining layer to the pixel defining layer film, the preparation method further includes：In the picture
The open area that element defines layer forms light emitting functional layer.
It is further preferred that light emitting functional layer is formed in the open area of the pixel defining layer, including：It is beaten using ink-jet
Print method is in the ink that the printing of the open area of the pixel defining layer includes light-emitting function layer material.
Preferably, the auxiliary particle is azo compounds composition granule.
Preferably, the elastic material includes thermoplastic polyester elastomer, thermoplastic polyurethane elastomer or thermoplasticity three
At least one of first the third dynamic vulcanization of second elastomer.
Preferably, parent's property material includes polyimides, bisphenol-a polycarbonate, the polymer containing alkyl in main chain
And at least one of polymer containing annular rigid structure in main chain.
Second aspect, provides a kind of substrate, and the substrate prepares to be formed using above-mentioned preparation method.
The third aspect provides a kind of display device, including above-mentioned substrate.
The embodiment of the present invention provides a kind of substrate and preparation method thereof, display device, and pixel is prepared on underlay substrate
When defining layer, due in addition to including photoresist and parent's property material, further include in the material of pixel defining layer film auxiliary particle and
Elastic material, after to pixel defining layer film heating, the auxiliary particle in pixel defining layer film can be to far from underlay substrate
Direction it is mobile, in this way along close to underlay substrate to the direction of separate underlay substrate, the distribution density of auxiliary particle is gradually increased,
Therefore when handling pixel defining layer film, and auxiliary particle being made to release gas, due to being arrived along close to underlay substrate
Direction far from underlay substrate, the distribution density of auxiliary particle gradually increase, thus along close to underlay substrate to separate substrate base
The direction of plate, the amount that auxiliary particle decomposes the gas released gradually increases, therefore the degrees of expansion of pixel defining layer is gradually got over
Greatly, so, when pixel defining layer is made of barricade, along close to underlay substrate to the direction of separate underlay substrate, barricade
Width gradually increase (pixel defining layer formed perpendicular to underlay substrate section be inverted ladder shape).Based on this, when
When the open area of pixel defining layer forms light emitting functional layer, due to along close to underlay substrate to the direction of separate underlay substrate,
The width of barricade gradually increases, thus the side wall of barricade can apply the stress towards underlay substrate to light-emitting function layer material, this
Sample one just to prevent the material of light emitting functional layer in the drying process along gear when forming light emitting functional layer using solution process
The side wall of wall is climbed, so that the light emitting functional layer thickness formed is uniform.Ensure when the substrate is applied in OLED device
The luminous homogeneity of OLED device, improves the service life of OLED device.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram that pixel defining layer is formed on underlay substrate that the prior art provides；
Fig. 2 is a kind of flow diagram of the preparation method of substrate provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram that pixel defining layer film is formed on underlay substrate provided in an embodiment of the present invention
One；
Fig. 4 is a kind of structural schematic diagram that pixel defining layer film is formed on underlay substrate provided in an embodiment of the present invention
Two；
Fig. 5 is a kind of structural schematic diagram one of substrate provided in an embodiment of the present invention；
Fig. 6 is a kind of structural schematic diagram two of substrate provided in an embodiment of the present invention；
Fig. 7 (a) is a kind of structural schematic diagram that pixel defining layer is formed on underlay substrate provided in an embodiment of the present invention
One；
Fig. 7 (b) is a kind of structural schematic diagram that pixel defining layer is formed on underlay substrate provided in an embodiment of the present invention
Two.
Appended drawing reference：
10- underlay substrate；20- pixel defining layer；30- light emitting functional layer；40- pixel defining layer film；50- auxiliary
Grain；60-TFT driving circuit；70- flatness layer；80- electrode layer；801- sub-electrode.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of preparation method of substrate, as shown in Fig. 2, including：
S100, as shown in figure 3, on underlay substrate 10 formed pixel defining layer film 40；Wherein, pixel defining layer film
40 material includes parent's property material, elastic material and the auxiliary particle 50 of photoresist and doping in the photoresist；Auxiliary particle 50
For releasing gas when decomposing, elastic material is for making pixel defining layer film 40 when auxiliary particle 50 releases gas
Expansion；The molecular weight of parent's property material, photoresist and elastic material is all larger than the molecular weight of auxiliary particle 50.
It should be noted that first, for underlay substrate 10 material without limiting.It is exemplary, underlay substrate 10
Material can be silicon nitride (SiNx), silica (SiOx) or silicon oxynitride (SiOxNyAt least one of).
Second, for how on underlay substrate 10 formed pixel defining layer film 40 without limit, for example, can benefit
Pixel defining layer film 40 is formed on underlay substrate 10 with spin coating or spraying etc..
Third, for auxiliary particle 50 material without limit, be subject to can decompose when release gas.In addition,
For decomposing auxiliary particle 50 without limiting, auxiliary particle 50 can decompose when heated and release gas, at this time
Auxiliary particle 50 is thermal cracking material, and the material of auxiliary particle 50 for example can be azo-compound, wherein azo-compound
General structure be R-N=N-R ', R be can be alkyl or alkali metal, alkyl is specifically as follows aliphatic group, acyl group, sulfonyl etc.
Organic group, furthermore in the case where the thermal decomposition of auxiliary particle 50 does not influence pixel defining layer 40 other ingredients of film, auxiliary
The material of grain 50 can also select azido compound；Auxiliary particle 50 can also release gas in illumination time-division solution, auxiliary at this time
Helping particle 50 is photodegradation material, and the material of auxiliary particle 50 can be for example adjacent nitrine naphthoquinone compound.
On this basis, the gas type released for auxiliary particle 50 is without limiting, in order to avoid auxiliary particle
50 gases released are reacted with the film layer on substrate, influence the performance of film layer on substrate, thus the preferred auxiliary particle of the present invention
50 decomposition release nitrogen (N2), the more stable gas of performances such as argon gas (Ar) or carbon monoxide (CO).It is further preferred that by
Stablize in nitrogen performance, is not easy to react with other materials, thus the decomposition of auxiliary particle of the embodiment of the present invention 50 releases nitrogen.
For elastic material specific material without limit, since elastic material is when auxiliary particle 50 releases gas
Pixel defining layer film 40 can be made to expand, thus elastic material should select highly elastic material.Exemplary, elastic material can wrap
Include thermoplastic polyester elastomer, thermoplastic polyurethane elastomer (Thermoplastic polyyrethane, abbreviation TPU) or heat
At least one of plasticity EPDM dynamic vulcanization elastomer (Thermoplastic Vulcanizate, abbreviation TPV).Its
In, thermoplastic polyester elastomer (TPEE), also known as lactoprene are a kind of poly- containing PBT (polybutylene terephthalate (PBT))
The line-type block polymer of ester hard section and aliphatic polyester or polyester soft segment.
For photoresist material without limiting, such as may include polyimides (Polyimide, abbreviation PI).This
Outside, photoresist can be also possible to negative photoresist with positive photoresist.
Herein, parent's property material can be hydrophilic material or lipophile material.Parent's property material is rigid polymer, for parent
Property material specific material without limit, exemplary, parent's property material may include polyimides, bisphenol-a polycarbonate, main chain
In at least one of the polymer containing annular rigid structure in polymer and main chain containing alkyl.Wherein, in main chain
Polymer containing alkyl for example can be the macromolecules such as cruel, the poly- phthalein amine of polyacrylic acid, polypropylene phthalein amine, polyvinyl alcohol, poly- ammonia
And its derivative.In addition, it should be noted that, since polyimides not only can be used as the material of photoresist, but also can be used as parent
Property material, thus the material of photoresist and parent's property material can all select polyimides, when the material and parent's property material of photoresist
When all selecting polyimides, elastic material and auxiliary particle 50 are added in polyimides.
Based on above-mentioned, the present invention implements the material of the pixel defining layer film 40 provided and includes but is not limited to photoresist and mix
It can also include other materials such as solvent outside miscellaneous parent's property material in the photoresist, elastic material and auxiliary particle 50.
S101, as shown in figure 4, heated to pixel defining layer film 40, make auxiliary particle 50 to far from underlay substrate
10 direction is mobile.
Wherein, since the molecular weight of auxiliary particle 50 is less than photoresist in the material of pixel defining layer film 40, elastic material
The molecular weight of material and parent's property material, thus when to pixel defining layer film heating, auxiliary particle 50 can be to far from substrate base
The direction of plate 10 moves, so, as shown in figure 4, along the direction far from underlay substrate 10 is arrived close to underlay substrate 10 (as schemed
In 4 shown in arrow), the distribution density of auxiliary particle 50 gradually increases.
Herein, when the material of auxiliary particle 50 is thermal cracking material, due to being heated to pixel defining layer film 40
During, auxiliary particle 50 is mobile to the direction far from underlay substrate 10, thus auxiliary particle 50 cannot decompose, therefore select
The temperature heated to pixel defining layer film 40 taken should be less than the thermal decomposition temperature of auxiliary particle 50.The embodiment of the present invention is preferred
, the heating temperature heated to pixel defining layer film 40 is 30~40 DEG C.
S102, as shown in figure 5, to pixel defining layer film 40 carry out processing formed pixel defining layer 20, and make auxiliary
Grain 50 decomposes and releases gas.
Herein, when handling pixel defining layer film 40, can make auxiliary while forming pixel defining layer 20
The decomposition of particle 50 is helped to release gas；It can also be initially formed pixel defining layer 20, then the decomposition of auxiliary particle 50 is made to release gas,
To this without limiting.
It should be noted that due to arriving the direction far from underlay substrate 10 along close to underlay substrate 10, auxiliary particle 50
Distribution density gradually increases, thus along the direction far from underlay substrate 10 is arrived close to underlay substrate 10, auxiliary particle 50 releases
The amount of gas gradually increase, and the elastic material in pixel defining layer film 40 can be with when auxiliary particle 50 releases gas
Expand pixel defining layer film 40, the amount for the gas that auxiliary particle 50 releases is more, and pixel defining layer film 40 expands journey
Degree is bigger, thus along the direction far from underlay substrate 10 is arrived close to underlay substrate 10, the degrees of expansion of pixel defining layer 20 is bigger.
Based on this, when pixel defining layer 20 is made of barricade, the direction far from underlay substrate 10, barricade are arrived along close to underlay substrate 10
Width gradually increase, i.e., pixel defining layer 20 perpendicular to underlay substrate 10 section be inverted ladder shape.
The embodiment of the present invention provides a kind of preparation method of substrate, when preparing pixel defining layer 20 on underlay substrate 10,
Due in addition to including photoresist and parent's property material, further including auxiliary particle 50 and elastic material in the material of pixel defining layer film 40
Material, after heating to pixel defining layer film 40, the auxiliary particle 50 in pixel defining layer film 40 can be to far from underlay substrate
10 direction is mobile, arrives the direction far from underlay substrate 10, the distribution density of auxiliary particle 50 along close to underlay substrate 10 in this way
It gradually increases, therefore when handling pixel defining layer film 40, and auxiliary particle 50 being made to release gas, since edge is leaned on
Nearly underlay substrate 10 arrives the direction far from underlay substrate 10, and the distribution density of auxiliary particle 50 gradually increases, thus along close to lining
Substrate 10 arrives the direction far from underlay substrate 10, and the amount that auxiliary particle 50 decomposes the gas released gradually increases, therefore picture
The degrees of expansion that element defines layer 20 is gradually bigger, so, when pixel defining layer 20 is made of barricade, along close to substrate base
Plate 10 arrives the direction far from underlay substrate 10, and the width of barricade gradually increases that (pixel defining layer 20 formed is perpendicular to substrate
The section of substrate 10 is inverted ladder shape).Based on this, when forming light emitting functional layer 30 in the open area of pixel defining layer 20,
Due to arriving the direction far from underlay substrate 10 along close to underlay substrate 10, the width of barricade is gradually increased, thus the side wall of barricade
The stress (as shown by the arrows in Figure 5) towards underlay substrate 10 can be applied to 30 material of light emitting functional layer, so utilized
When solution process forms light emitting functional layer 30, just prevent the material of light emitting functional layer 30 in the drying process along the side wall of barricade
Climbing, so that 30 thickness of light emitting functional layer formed is uniform.OLED is ensured when the substrate is applied in OLED device
The luminous homogeneity of device, improves the service life of OLED device.
Based on the foregoing, it is desirable to which explanation, forms before pixel defining layer film 40 on underlay substrate 10, such as Fig. 6 institute
Show, can also first form TFT (Thin Film Transistor, thin film transistor (TFT)) driving circuit 60 on underlay substrate 10,
Flatness layer 70 is formed on TFT driving circuit 60, flatness layer 70 covers TFT driving circuit 60, then forms electrode in flatness layer 70
Layer 80, electrode layer 80 include multiple mutually independent sub-electrodes 801, and sub-electrode 801 is driven by the via hole on flatness layer 70 with TFT
Dynamic circuit 60 connects, and each sub-electrode 801 is located at an open area of pixel defining layer 20.Herein, for flatness layer 70
Thickness without limit, it is preferred that flatness layer 70 with a thickness of 1~10 μm.In addition, for how to be formed electrode layer 80 without
It limits, it is exemplary, layer of conductive film can be sputtered on present flatness layer 70, then by being exposed, developing to conductive film
And etching forms multiple sub-electrodes 801.The material of sub-electrode 801 for example can be ITO (Indium Tin Oxide, indium oxide
Tin) etc. transparent materials.
Preferably, step S102 includes：
S200, pixel defining layer film 40 is exposed, developing forms pixel defining layer 20.
It should be noted that when the Other substrate materials in pixel defining layer film 40 are positive photoresist, positive-tone photo
It dissolves, retains after unexposed position development, since finally formed pixel defining layer 20 does not have after the position development of glue exposure
It,, can when preparing substrate because regardless of the material of auxiliary particle 50 is photodegradation material or thermal cracking material by illumination
With first implementation steps S101, as shown in figure 4, implementation steps S200 again, the pixel defining layer 20 obtained at this time such as Fig. 7 (a) is shown,
After first making the auxiliary particle 50 in pixel defining layer film 40 mobile, arrive along close to underlay substrate 10 far from underlay substrate 10
The distribution density in direction, auxiliary particle 50 gradually increases, then forms pixel defining layer to 40 exposure development of pixel defining layer film
20；Can also first implementation steps S200, the pixel defining layer 20 obtained at this time is such as shown in Fig. 7 (b), then implementation steps S101, obtains
To the pixel defining layer as shown in Fig. 7 (a), i.e., pixel defining layer 20 first is formed to 40 exposure development of pixel defining layer film, then
After keeping the auxiliary particle 50 in pixel defining layer 20 mobile, the direction far from underlay substrate 10 is arrived along close to underlay substrate 10, it is auxiliary
The distribution density of particle 50 is helped to gradually increase.
When the Other substrate materials in pixel defining layer film 40 are negative photoresist, the unexposed position of negative photoresist
It dissolves after development, retains after the position development of exposure, since the position photoresist of exposure can be cured reaction, so,
Auxiliary particle 50 when heated can be not easily shifted, thus the embodiment of the present invention, when photoresist is negative photoresist, is preparing base
When plate, first implementation steps S101, then implementation steps S200.
Herein, after being exposed to pixel defining layer film 40, developing and form pixel defining layer 20, at this time such as Fig. 7 (a) and
Shown in Fig. 7 (b), if pixel defining layer 20 is made of barricade, the direction far from underlay substrate 10 is arrived along close to underlay substrate 10,
Barricade it is of same size, i.e., pixel defining layer 20 perpendicular to underlay substrate 10 section be rectangle.
S201, resolution process is carried out to the auxiliary particle 50 in pixel defining layer 20, so that auxiliary particle 50 decomposes release
Gas out.
Herein, for resolution process without limiting, being subject to can make the decomposition of auxiliary particle 50 release gas.Specifically
, resolution process can be heat treatment, be also possible to lighting process.When the material of auxiliary particle 50 is thermal cracking material,
Auxiliary particle 50 in pixel defining layer 20 is heated so that auxiliary particle 50 decomposition release gas, at this time plus
The heating temperature of heat treatment can accordingly be selected according to the thermal decomposition temperature of auxiliary particle 50；When the material of auxiliary particle 50
When for photodegradation material, lighting process is carried out to the auxiliary particle 50 in pixel defining layer 20, so that the decomposition of auxiliary particle 50 is released
Release gas.Herein, when carrying out lighting process to the auxiliary particle 50 in pixel defining layer 20, the light and auxiliary particle 50 of selection
Related, exemplary, if auxiliary particle 50 can decompose under ultraviolet light releases gas, lighting process selection is ultraviolet
Light；If auxiliary particle 50 can decompose release gas under visible light illumination, lighting process selects visible light.
When the Other substrate materials in pixel defining layer film 40 are negative photoresist, the position development of negative photoresist exposure
After retain, if the auxiliary particle 50 in pixel defining layer film 40 is photodegradation material, and can divide under visible light such as yellow light
Solution releases gas, then step S102 includes：
S300, pixel defining layer film 40 is exposed, developing forms pixel defining layer 20, and divide auxiliary particle 50
Solution releases gas.
Since the Other substrate materials in pixel defining layer film 40 are negative photoresist, the position of negative photoresist exposure is aobvious
Movie queen retains, and when exposing to negative photoresist, auxiliary particle 50 can decompose in the irradiation of visible light and release gas, thus
While forming pixel defining layer 20, auxiliary particle 50, which can decompose, releases gas, therefore may not need again to auxiliary particle 50
Carry out resolution process.
Preferably, pixel defining layer 20 includes open area and the pixel delimited area for defining open area.
After carrying out processing formation pixel defining layer 20 to pixel defining layer film 40, above-mentioned preparation method further includes：?
The open area of pixel defining layer 20 forms light emitting functional layer 30.
Wherein, light emitting functional layer 30 can also include hole injection layer, hole transmission layer, electronics in addition to including luminescent layer
At least one of transport layer and electron injecting layer.
In addition, for luminescent layer material without limit, can be organic luminous layer；It is also possible to quantum dot light emitting
Layer.
On this basis, for which kind of technique to form light emitting functional layer 30 not in the open area of pixel defining layer 20 using
It is defined, it is exemplary, silk-screen printing technique or InkJet printing processes can be used in the open area shape of pixel defining layer 20
At light emitting functional layer 30.
It should be noted that carrying out processing to form pixel defining layer 20 including step S200 when to pixel defining layer film 40
And when step S201, hair can be formed in the open area of pixel defining layer 20 after step S200, before step S201
Light functional layer 30；Light emitting functional layer 30 can also be formed in the open area of pixel defining layer 20 after step S201.Due to
It is initially formed light emitting functional layer 30, then resolution process is carried out to the auxiliary particle 50 in pixel defining layer 20, so that auxiliary particle 50
Decomposition releases gas, so, on the one hand, auxiliary particle 50, which decomposes, releases the mistake that gas expands pixel defining layer 20
Journey can preferably inhibit the material of light emitting functional layer 30 to climb along the side wall of pixel defining layer 20；On the other hand when to auxiliary
When the resolution process of particle 50 is heat treatment, auxiliary particle 50 can heated so that auxiliary particle 50 decomposes
While releasing gas, light emitting functional layer 30 is toasted, simplifies the manufacture craft of substrate, thus the embodiment of the present invention
Preferably, after step S200, before step S201, light emitting functional layer 30 is formed in the open area of pixel defining layer 20.
On this basis, after step S200, before step S201, light emitting functional layer is formed in the open area of pixel defining layer 20
It, can be according to the thermal decomposition temperature and light-emitting function of auxiliary particle 50 when carrying out thermal decomposition process to auxiliary particle 50 when 30
The material of layer 30 selects the heating temperature suitably heated.In addition, heat treatment can be normal heating, it is also possible to low
Pressure heating.
It is further preferred that light emitting functional layer 30 is formed in the open area of pixel defining layer 20, including：It is beaten using ink-jet
Print method is in the ink that the printing of the open area of pixel defining layer 20 includes light-emitting function layer material.
Since ink-jet printing has many advantages, such as that precision is high, saves material relative to such as silk-screen printing of other solution process,
Thus the embodiment of the present invention includes light emitting functional layer in the printing of the open area of pixel defining layer 20 preferably by ink-jet printing
The ink of material, to form light emitting functional layer 30.
The embodiment of the present invention provides a kind of substrate, and the substrate prepares to be formed using above-mentioned preparation method.
It should be noted that when substrate prepares to be formed using the preparation method of aforesaid substrate, the pixel defining layer of formation
20 as shown in figure 5, pixel defining layer 20 perpendicular to underlay substrate 10 section be inverted ladder shape, i.e., pixel defining layer 20 is by barricade
When composition, the direction far from underlay substrate 10 is arrived along close to underlay substrate 10, the width of barricade gradually increases.
The embodiment of the present invention provides a kind of substrate, when the pixel defining layer 20 on substrate is made of barricade, since edge is leaned on
Nearly underlay substrate 10 arrives the direction far from underlay substrate 10, and the width of barricade gradually increases, thus when in pixel defining layer 20
When open area forms light emitting functional layer 30, the side wall of barricade can apply towards underlay substrate 10 30 material of light emitting functional layer
Stress just prevents the material of light emitting functional layer 30 dry so when forming light emitting functional layer 30 using solution process
It is climbed during dry along the side wall of barricade, so that 30 thickness of light emitting functional layer formed is uniform.When the substrate is applied to
The luminous homogeneity that OLED device is ensured when in OLED device, improves the service life of OLED device.
Offer of the embodiment of the present invention also provides a kind of display device, including above-mentioned substrate.
Wherein, no matter display device provided in an embodiment of the present invention can be display movement (for example, video) or fix
(for example, static image) no matter and the image of text or picture any device.More particularly, it is contemplated that the embodiment
It may be implemented in a variety of electronic devices or be associated with a variety of electronic devices, a variety of electronic devices such as (but not limited to) mobile
Phone, wireless device, personal digital assistant (PDA), hand-held or portable computer, GPS receiver/omniselector, camera,
MP4 video player, video camera, game console, wrist-watch, clock, calculator, televimonitor, flat-panel monitor, computer
Monitor, automotive displays (for example, odometer display etc.), navigator, Cockpit Control Unit and/or display, camera view
The display display of rear view camera (for example, in vehicle), electronic photographs, electronic bill-board or direction board, projector, building
Structure, packaging and aesthetic structures (for example, for display of the image of a jewelry) etc..In addition, the embodiment of the present invention provides
Display device can also be display panel.
Herein, when the light emitting functional layer 30 formed on substrate includes organic luminous layer, display device is organic electroluminescence hair
Electro-optical display device；When the light emitting functional layer 30 formed on substrate includes quantum dot light emitting layer, display device is quantum dot light emitting
Display device (Quantum Dot Light Emitting Diodes, abbreviation QLED).
It should be noted that display device in addition to including above-mentioned substrate, can also include the encapsulation being formed on substrate
Layer or package substrate.
The embodiment of the present invention also provides a kind of display device, and display device includes above-mentioned substrate, the base in display device
Plate has structure identical with substrate provided by the above embodiment and beneficial effect, since above-described embodiment is to the skill of substrate
Art feature and beneficial effect are described in detail, thus details are not described herein again.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of preparation method of substrate, which is characterized in that including：
Pixel defining layer film is formed on underlay substrate；Wherein, the material of the pixel defining layer film include photoresist and
Parent's property material, elastic material and the auxiliary particle being entrained in the photoresist；The auxiliary particle is used to discharge when decomposing
Gas out, the elastic material is for making the pixel defining layer film expansion when the auxiliary particle releases gas；Institute
The molecular weight for stating parent's property material, the photoresist and the elastic material is all larger than the molecular weight of the auxiliary particle；
The pixel defining layer film is heated, keeps the auxiliary particle mobile to the direction far from the underlay substrate；
Processing is carried out to the pixel defining layer film and forms pixel defining layer, and the auxiliary particle is made to decompose release outlet
Body.
2. preparation method according to claim 1, which is characterized in that carry out processing to the pixel defining layer film and formed
Pixel defining layer, and the auxiliary particle decomposition is made to release gas, it specifically includes：
To the pixel defining layer film is exposed, developing forms pixel defining layer；
Resolution process is carried out to the auxiliary particle in the pixel defining layer, so that the auxiliary particle decomposes release outlet
Body；
Alternatively,
The pixel defining layer film is exposed, developing forms pixel defining layer, and the auxiliary particle is made to decompose release
Gas out.
3. preparation method according to claim 2, which is characterized in that the auxiliary particle in the pixel defining layer
Resolution process is carried out, so that auxiliary particle decomposition releases gas, is specifically included：
Carrying out heat treatment or lighting process to the auxiliary particle in the pixel defining layer decomposes the auxiliary particle
Release gas.
4. preparation method according to claim 1, which is characterized in that the pixel defining layer includes open area and is used for
Define the pixel delimited area of the open area；
After carrying out processing formation pixel defining layer to the pixel defining layer film, the preparation method further includes：Described
The open area of pixel defining layer forms light emitting functional layer.
5. the preparation method according to claim 4, which is characterized in that form hair in the open area of the pixel defining layer
Light functional layer, including：
Using ink-jet printing in ink of the open area of the pixel defining layer printing comprising light-emitting function layer material.
6. preparation method according to claim 1, which is characterized in that the auxiliary particle is azo compounds composition granule.
7. preparation method according to claim 1, which is characterized in that the elastic material includes thermoplastic polyester elastomer
At least one of body, thermoplastic polyurethane elastomer or thermoplasticity EPDM dynamic vulcanization elastomer.
8. preparation method according to claim 1, which is characterized in that parent's property material includes polyimides, polymer with bis phenol A
At least one of polymer in polymer and main chain in carbonic ester, main chain containing alkyl containing annular rigid structure.
9. a kind of substrate, which is characterized in that the substrate uses the described in any item preparation methods of claim 1-8 such as to prepare shape
At.
10. a kind of display device, which is characterized in that including substrate as claimed in claim 9.
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