CN111864090A - Display panel, display panel manufacturing method and display device - Google Patents

Display panel, display panel manufacturing method and display device Download PDF

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Publication number
CN111864090A
CN111864090A CN202010644800.2A CN202010644800A CN111864090A CN 111864090 A CN111864090 A CN 111864090A CN 202010644800 A CN202010644800 A CN 202010644800A CN 111864090 A CN111864090 A CN 111864090A
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China
Prior art keywords
layer
deformation
display panel
hole transport
manufacturing
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Chinese (zh)
Inventor
潘杰
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN202010644800.2A priority Critical patent/CN111864090A/en
Priority to PCT/CN2020/114680 priority patent/WO2022007183A1/en
Publication of CN111864090A publication Critical patent/CN111864090A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17—Carrier injection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application relates to a display panel, a display panel manufacturing method and a display device, wherein the display panel comprises a deformation layer; the deformation layer is a material layer formed by a material which can be expanded and deformed and can be restored to the original shape; the deformation layer is clamped between the pixel defining layer and the hole injection layer of the display panel; the deformation layer is used for disconnecting the hole injection layer and the hole transport layer of the display panel in the manufacturing process of the display panel, and the deformation layer is used for disconnecting the hole injection layer and the hole transport layer in the manufacturing process of the display panel, so that transverse leakage current formed by transverse flow of holes is prevented, the luminous purity of pixels is improved, and the display effect is improved.

Description

Display panel, display panel manufacturing method and display device
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the display panel, and a display device.
Background
An OLED (Organic Light-Emitting Diode) panel has many advantages such as lightness, thinness, and low power consumption, and is gradually becoming the mainstream display technology at present, and generally, an OLED panel includes an anode layer, a hole injection layer, a hole transport layer, a Light-Emitting layer, an electron transport layer, an electron injection layer, and a cathode layer.
The OLED panel has the working principle that the anode layer emits holes under the action of an electric field, the holes pass through the hole injection layer, the hole transport layer is transmitted to the light emitting layer, the cathode layer emits electrons under the action of the electric field, the electrons are transmitted to the light emitting layer through the electron injection layer and the electron transport layer, the holes and the electrons are combined in the light emitting layer to emit light, and the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer and the electron injection layer are formed by evaporation of a whole mask plate and cover the whole pixel area. Since the hole injection layer and the hole transport layer have good conductivity, when a certain pixel is controlled to emit light, holes flow from the anode layer to the cathode layer, and reach an adjacent pixel through the hole transport layer and the hole injection layer, so that a transverse leakage current is generated, the inventor finds that at least the following problems exist in the conventional technology in the implementation process: the traditional OLED panel is impure in light emission and poor in display effect due to hole transverse leakage.
Disclosure of Invention
Accordingly, it is necessary to provide a display panel, a method for manufacturing the display panel, and a display device, which are directed to the problems of impure light emission and poor display effect of the conventional OLED panel due to hole lateral leakage.
In order to achieve the above object, in one aspect, embodiments of the present application provide a display panel including a deformation layer; the deformation layer is a material layer formed by a material which can be expanded and deformed and can be restored to the original shape;
the deformation layer is clamped between the pixel defining layer and the hole injection layer of the display panel; the deformation layer is used for disconnecting the hole injection layer and the hole transport layer of the display panel in the manufacturing process of the display panel.
In one embodiment, the deformable layer is a layer of material formed from an azophenyl polymer.
On the other hand, the embodiment of the application also provides a manufacturing method of the display panel, which comprises the following steps:
providing a substrate; an anode layer and a pixel defining layer are sequentially formed on the substrate;
forming a deformation layer on the pixel defining layer; the deformation layer is a material layer formed by a material which can be expanded and deformed and can be restored to the original shape;
carrying out expansion deformation treatment on the deformation layer;
sequentially forming a hole injection layer and a hole transport layer; the hole injection layer and the hole transmission layer are covered on the anode layer and the deformation layer after expansion deformation;
and performing the original-state restoration treatment on the deformed layer after the expansion deformation.
In one embodiment, the deformable layer is a layer of material formed from an azophenyl polymer.
In one of the embodiments, the first and second electrodes are,
the step of carrying out expansion deformation treatment on the deformation layer comprises the following steps: carrying out ultraviolet irradiation on the deformation layer;
and in the step of performing the original-state restoration treatment on the deformed layer after the expansion deformation: and performing green light irradiation on the deformation layer after the expansion deformation.
In one embodiment, after the step of performing the resilient processing on the deformed layer after the expansion deformation, the method further includes the steps of:
a light emitting layer is formed on the hole transport layer overlying the anode layer.
In one embodiment, after the step of forming the light emitting layer on the hole transport layer overlying the anode layer, the method further comprises the steps of:
an electron transport layer is formed on the light emitting layer and the hole transport layer.
In one embodiment, after the step of forming the electron transport layer on the light emitting layer and the hole transport layer, the method further comprises the steps of:
an electron injection layer is formed on the electron transport layer.
In one embodiment, after the step of forming the electron injection layer on the electron transport layer, the method further comprises the steps of:
a cathode layer is formed on the electron injection layer.
On the other hand, the embodiment of the application also provides a display device which comprises the display panel.
On the other hand, the embodiment of the application also provides a display device which comprises the display panel manufactured by the display panel manufacturing method.
In the implementation process, the inventor finds that at least the following problems exist in the conventional technology:
the display panel provided by the embodiments of the present application includes a deformation layer; the deformation layer is a material layer formed by a material which can be expanded and deformed and can be restored to the original shape; the deformation layer is clamped between the pixel defining layer and the hole injection layer of the display panel; the deformation layer is used for disconnecting the hole injection layer and the hole transport layer of the display panel in the manufacturing process of the display panel, and the deformation layer is used for disconnecting the hole injection layer and the hole transport layer in the manufacturing process of the display panel, so that transverse leakage current formed by transverse flow of holes is prevented, the luminous purity of pixels is improved, and the display effect is improved.
Drawings
FIG. 1 is a schematic diagram of a display panel according to an embodiment;
FIG. 2 is a flow chart illustrating a method for fabricating a display panel according to an embodiment;
FIG. 3 is a schematic diagram of a process for forming a deformable layer in one embodiment;
FIG. 4 is a schematic view of an embodiment of a process for expansion deformation of a deformable layer;
FIG. 5 is a schematic diagram of an embodiment of a process for restoring a strained layer.
Description of reference numerals:
11. a deformation layer; 13. a pixel defining layer; 15. a hole injection layer; 17. a hole transport layer; 19. a substrate; 21. an anode layer; 23. an electron transport layer; 25. an electron injection layer; 27. a cathode layer; 29. and a light emitting layer.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The term "sandwiched" and similar expressions are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In order to solve the problems of impure light emission and poor display effect of the conventional OLED panel due to hole lateral leakage, in one embodiment, as shown in fig. 1, a display panel is provided, which includes a deformation layer 11; the deformation layer 11 is a material layer formed of a material that is expandable and deformable and restorable;
the deformation layer 11 is sandwiched between the pixel defining layer 13 and the hole injection layer 15 of the display panel; the deformation layer 11 is used to break the hole injection layer 15 and the hole transport layer 17 of the display panel during the manufacturing process of the display panel.
It should be noted that, in the conventional OLED panel, the hole injection layer 15 and the hole transport layer 17 are formed by evaporation of a mask plate on the whole surface, and continuously cover the entire pixel region, and holes are easily transported laterally to generate lateral leakage current. The present application adds the distortion layer 11 between the pixel defining layer 13 and the hole injection layer 15 of the display panel. In the manufacturing process of the display panel, specifically, after the pixel defining layer 13 is formed, the deformation layer 11 is formed on the pixel defining layer 13, the deformation layer 11 is subjected to an expansion deformation treatment, and a hole injection layer 15 and a hole transport layer 17 are formed in this order, because the deformation layer 11 expands to have larger volume and thicker thickness, the distance between the top end of the formation layer after expansion deformation and the anode layer 21 is larger, the hole injection layer 15 covering the anode and the hole injection layer 15 covering the formation layer after expansion deformation are broken, the hole transport layer 17 covering the anode and the hole transport layer 17 covering the formation layer after expansion deformation are broken, the hole injection layer 15 and the hole transport layer 17 do not continuously cover the whole pixel region any more, therefore, the transverse leakage current generated by the transverse transmission of the holes is blocked, and the problem of impure light emission caused by the light emission of other pixels because the holes of a certain pixel flow into other pixels is avoided.
The deformation layer 11 is a material layer formed by a material which can be expanded and deformed and can restore to the original state, under a certain condition, the deformation layer 11 can be expanded and deformed, and under another certain condition, the deformation layer 11 can restore to the original state from the expanded and deformed state. In one example, the deformation layer 11 is a material layer formed of an azophenyl polymer. The azophenyl polymer can change from a trans form to a cis form and generate swelling deformation under the irradiation of ultraviolet light, and can change from the cis form to the trans form again and restore the original form under the irradiation of green light.
Further, as shown in fig. 1, the display panel further includes a substrate 19, a light emitting layer 29, an electron transport layer 23, an electron injection layer 25, and a cathode layer 27, and the anode layer 21, the pixel defining layer 13, the deformation layer 11, the hole injection layer 15, the hole transport layer 17, the light emitting layer 29, the electron transport layer 23, the electron injection layer 25, and the cathode layer 27 are sequentially disposed on the substrate 19.
In the embodiments of the display panel of the present application, a deformation layer 11 is included; the deformation layer 11 is a material layer formed of a material that is expandable and deformable and restorable; the deformation layer 11 is sandwiched between the pixel defining layer 13 and the hole injection layer 15 of the display panel; the deformation layer 11 is used for disconnecting the hole injection layer 15 and the hole transport layer 17 of the display panel in the manufacturing process of the display panel, and the deformation layer 11 is used for disconnecting the hole injection layer 15 and the hole transport layer 17 in the manufacturing process of the display panel, so that transverse leakage current formed by transverse flow of holes is prevented, the luminous purity of pixels is improved, and the display effect is improved.
In an embodiment, as shown in fig. 2, there is also provided a display panel manufacturing method, including the steps of:
step S21, providing the substrate 19; an anode layer 21 and a pixel defining layer 13 are formed on the substrate 19 in this order;
step S23, forming a distortion layer 11 on the pixel defining layer 13; the deformation layer 11 is a material layer formed of a material that is expandable and deformable and restorable;
step S25 of performing an expansion deformation process on the deformation layer 11;
step S27, forming a hole injection layer 15 and a hole transport layer 17 in this order; the hole injection layer 15 and the hole transport layer 17 are covered on the anode layer 21 and the deformation layer 11 after expansion deformation;
in step S29, the deformed layer 11 after the expansion deformation is subjected to the restoration process.
It should be noted that the substrate 19 can be made of, but not limited to, the following materials: polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, glass, and quartz.
An anode layer 21 is formed on the substrate 19, and the anode layer 21 can be made of, but is not limited to, the following materials: ITO (indium tin oxide), IZO, Au, Pt and Si, for example, the anode layer 21 is made of TIO/Ag/TIO. Specifically, the anode layer 21 may be formed on the substrate 19 by a deposition process, which may be any one of the following processes, unless otherwise specified: chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Atomic Layer Deposition (ALD), Low Pressure Chemical Vapor Deposition (LPCVD), Laser Ablation Deposition (LAD), and Selective Epitaxial Growth (SEG).
A pixel defining layer 13 is formed on the anode layer 21, and the pixel defining layer 13 can be made of, but not limited to, the following materials: organic insulating materials containing fluorine and/or the like. Specifically, the pixel defining layer 13 may be formed on the substrate 19 using a deposition process.
As shown in fig. 3, a deformation layer 11 is formed on the pixel defining layer 13, the deformation layer 11 is formed of a material that can be deformed by expansion and can be restored to an original shape, and in one example, the deformation layer 11 is formed of an azobenzene polymer. Specifically, the deformation layer 11 may be formed by chemical vapor deposition, followed by etching, evaporation, or transfer.
After the deformation layer 11 is manufactured, the deformation layer 11 is subjected to an expansion deformation treatment, for example, the deformation layer 11 formed by an azobenzene polymer is irradiated by ultraviolet light, and after the deformation layer 11 expands and deforms (as shown in fig. 4), the volume of the deformation layer is increased too much, so that the distance between the top end of the deformation layer and the anode is increased, and the fracture of the hole injection layer 15 and the hole transport layer 17 is facilitated.
After the deformation layer 11 expands and deforms, a hole injection layer 15 and a hole transport layer 17 are sequentially formed, wherein the hole injection layer 15 can be made of, but is not limited to, the following materials: polyester carbonate, titanyl phthalocyanine, m-MTDATA, and 2-TNATA, hole transport layer 17 may be made using, but not limited to, the following materials: TPD, NPB, PVK, Spiro-TPD and Spiro-NPB. Specifically, the hole injection layer 15 and the hole transport layer 17 may be formed using a deposition process.
After the hole injection layer 15 and the hole transport layer 17 are formed, the deformed layer 11 after the expansion deformation is subjected to the recovery treatment, and for example, the deformed layer 11 formed of an azobenzene polymer is subjected to green light irradiation, the deformed layer 11 after the expansion deformation becomes small in volume (as shown in fig. 5), the distance between the top end of the deformed layer 11 and the anode layer 21 decreases, the hole injection layer 15 and the hole transport layer 17 formed finally are broken and discontinuous (as shown in fig. 5), and the lateral flow of holes in the hole injection layer 15 and the hole transport layer 17 can be blocked.
In one example, after the step of performing the resilient processing on the deformed layer 11 after the expansion deformation, the method further includes the steps of:
a light-emitting layer 29 is formed on the hole transport layer 17 covering the anode layer 21.
Note that, the light-emitting layer 29 is formed on the hole transport layer 17 covering the anode layer 21, and the light-emitting layer 29 may be made of, but is not limited to, the following materials: alq3, Almq3, Blue and TBADN. Specifically, the light emitting layer 29 may be formed using a deposition process.
In one example, after the step of forming the light emitting layer 29 on the hole transport layer 17 overlying the anode layer 21, the method further includes the steps of:
the electron transport layer 23 is formed on the light emitting layer 29 and the hole transport layer 17.
Note that, the electron transport layer 23 is formed on the light-emitting layer 29 and the hole transport layer 17, and the electron transport layer 23 may be made of, but is not limited to, the following materials: alq3, Almq3, DVPBi, TAZ, OXD, PBD, BND, and PV. Specifically, the electron transport layer 23 may be formed using a deposition process.
In one example, after the step of forming the electron transport layer 23 on the light emitting layer 29 and the hole transport layer 17, the method further includes the steps of:
an electron injection layer 25 is formed on the electron transit layer 23.
Note that, the electron injection layer 25 is formed on the electron transport layer 23, and the electron injection layer 25 may be made of, but is not limited to, the following materials: LiF, MgP, MgF2And Al2O3. Specifically, the electron injection layer 25 may be formed using a deposition process.
In one example, after the step of forming the electron injection layer 25 on the electron transport layer 23, the method further includes the steps of:
a cathode layer 27 is formed on the electron injection layer 25.
Note that, a cathode layer 27 is formed on the electron injection layer 25, and the cathode layer 27 is made of, but not limited to, the following materials: ag. Al, Li, Mg, Ca and In. In particular, the electron cathode layer 27 may be formed using a deposition process.
In the embodiments of the display panel manufacturing method of the application, the steps are as follows: providing a substrate 19; an anode layer 21 and a pixel defining layer 13 are formed on the substrate 19 in this order; on the pixel defining layer 13, the deformation layer 11 is formed; the deformation layer 11 is a material layer formed of a material that is expandable and deformable and restorable; performing expansion deformation treatment on the deformation layer 11; sequentially forming a hole injection layer 15 and a hole transport layer 17; the hole injection layer 15 and the hole transport layer 17 are covered on the anode layer 21 and the deformation layer 11 after expansion deformation; the deformation layer 11 after the expansion deformation is subjected to the original-state restoration treatment, so that before the hole injection layer 15 and the hole transmission layer 17 are formed, the deformation layer 11 is subjected to the expansion deformation treatment, the distance between the top end of the deformation layer 11 and the anode layer 21 is increased, the hole injection layer 15 and the hole transmission layer 17 are cut off, after the hole injection layer 15 and the hole transmission layer 17 are formed, the deformation layer 11 is restored to the original state, the hole injection layer 15 and the hole transmission layer 17 are finally formed to be disconnected and discontinuous, therefore, transverse leakage current caused by transverse flow of holes is prevented, the luminous purity of pixels is improved, and the display effect is improved.
In an embodiment, the present application further provides a display device including the display panel described in the embodiments of the display panel of the present application.
It should be noted that the display panel described in this embodiment is the same as the display panel described in the embodiments of the display panel of the present application, and please refer to the embodiments of the display panel of the present application for details, which are not described herein again.
The display panel has high luminous purity and good display effect.
In an embodiment, a display device is further provided, which includes a display panel manufactured by the display panel manufacturing method according to the embodiments of the display panel manufacturing method of the present application.
It should be noted that the display panel manufacturing method described in this embodiment is the same as the display panel manufacturing method described in each embodiment of the display panel manufacturing method of the present application, and please refer to each embodiment of the display panel manufacturing method of the present application for details, which is not described herein again.
The display device is high in luminous purity and good in display effect.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (11)

1. A display panel comprising a deformation layer; the deformation layer is a material layer formed by a material which can be expanded and deformed and can be restored to the original shape;
the deformation layer is clamped between the pixel defining layer and the hole injection layer of the display panel; the deformation layer is used for disconnecting the hole injection layer and the hole transport layer of the display panel in the manufacturing process of the display panel.
2. The display panel according to claim 1, wherein the deformation layer is a material layer formed of an azophenyl polymer.
3. A manufacturing method of a display panel is characterized by comprising the following steps:
providing a substrate; an anode layer and a pixel defining layer are sequentially formed on the substrate;
Forming a deformation layer on the pixel definition layer; the deformation layer is a material layer formed by a material which can be expanded and deformed and can be restored to the original shape;
carrying out expansion deformation treatment on the deformation layer;
sequentially forming a hole injection layer and a hole transport layer; the hole injection layer and the hole transport layer are covered on the anode layer and the deformation layer after expansion deformation;
and performing the restoration treatment on the deformed layer after the expansion deformation.
4. The method for manufacturing a display panel according to claim 3, wherein the deformation layer is a material layer formed of an azophenyl polymer.
5. The method for manufacturing a display panel according to claim 4,
the step of subjecting the deformation layer to an expansion deformation process includes: carrying out ultraviolet irradiation on the deformation layer;
and a step of performing a restoration process on the deformed layer after the expansion deformation: and performing green light irradiation on the deformation layer after the expansion deformation.
6. The method for manufacturing a display panel according to any one of claims 3 to 5, further comprising, after the step of subjecting the deformed layer after the expansion deformation to a resilient treatment, the steps of:
Forming a light emitting layer on the hole transport layer covering the anode layer.
7. The method of claim 6, further comprising, after the step of forming a light-emitting layer on the hole transport layer overlying the anode layer:
an electron transport layer is formed on the light emitting layer and the hole transport layer.
8. The method for manufacturing a display panel according to claim 7, further comprising, after the step of forming an electron transport layer on the light emitting layer and the hole transport layer:
an electron injection layer is formed on the electron transport layer.
9. The method for manufacturing a display panel according to claim 8, further comprising, after the step of forming an electron injection layer on the electron transport layer:
and forming a cathode layer on the electron injection layer.
10. A display device characterized by comprising the display panel according to claim 1 or 2.
11. A display device comprising the display panel manufactured by the display panel manufacturing method according to any one of claims 3 to 9.
CN202010644800.2A 2020-07-07 2020-07-07 Display panel, display panel manufacturing method and display device Pending CN111864090A (en)

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PCT/CN2020/114680 WO2022007183A1 (en) 2020-07-07 2020-09-11 Display panel, method for manufacturing display panel, and display apparatus

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