CN108872262A - A kind of electronic component detection method - Google Patents
A kind of electronic component detection method Download PDFInfo
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- CN108872262A CN108872262A CN201810434678.9A CN201810434678A CN108872262A CN 108872262 A CN108872262 A CN 108872262A CN 201810434678 A CN201810434678 A CN 201810434678A CN 108872262 A CN108872262 A CN 108872262A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a kind of electronic component detection methods, include the following steps：S1：It after the wiped clean of electronic component outer surface to be detected, is placed on monitor station, and fixation is clamped to the electronic component to be detected；S2：Control infrared detecting device issues infrared light and penetrates the electronic component outer packaging layer to be detected and silicon layer, scan the inner metal layer shape feature of electronic component to be detected, identification positioning is carried out to the measured electronic elements according to the shape feature of metal layer, and generates the image of electronic component to be detected；S3：Control infrared detecting device issues infrared light and penetrates standard electronics outer packaging layer and silicon layer, the interior metal shape feature of scanning standard electronic component.The present invention has detection efficiency height, promotes the working efficiency of detection workman, reduces the working strength of worker, improve the work incentive of worker, and has the high advantage of Detection accuracy, and be applicable to the detection of a variety of electronic components.
Description
Technical field
The present invention relates to electronic component detection technique field more particularly to a kind of electronic component detection methods.
Background technique
Electronic component is the basis for forming electronic product, understands the type of common electronic component, properity and can be just
Really select is to learn, grasp the basic of electronic technology.Common electronic component has：Resistance, capacitor, inductance, potentiometer, transformer
Verification test Deng, electronic component is the important composition that China's modern social science continues method battle array, industrial products due to manufacture at
This considerations of, the work such as detection and rejecting for faulty materials are still had and are completed by the way of offline by manually, therefore
The criterion of faulty materials is difficult to reach consistency in checking process, while examining the carry out efficiency of work dependent on identifier
The concentration of member, therefore untrue flaw management is so that the yield of product is restricted with quality, so the inspection of electronic component
It surveys and each business unit, each employee is needed to work in concert, need to use many electronic components in electric equipment products, in order to guarantee
The product qualified rate of electric equipment products, thus need to detect each electronic component before using electronic component, so as to timely
Underproof electronic component is screened out, for this purpose, we only have clearly this work importance, takes the methods of science, system
Fixed perfect verification test countermeasure, can really promote electronic component detection level, push modern society to realize sustainable complete
Face development.
In the prior art, electronic component is screened using the method for artificial detection, leads to intensity of workers
Greatly, detection efficiency is low；And a kind of detection mode cannot detect a variety of electronic components, simultaneously as small in size, the use of electronic component
It measures big thus staff artificial detection speed and is unable to meet production demand, seriously affect production efficiency.
Summary of the invention
The purpose of the present invention is to provide a kind of electronic component detection method, have that detection speed is fast, and detection efficiency is high, inspection
The high advantage of accuracy rate is surveyed, solves the problems, such as existing detection great work intensity.
A kind of electronic component detection method according to an embodiment of the present invention, includes the following steps：Include the following steps：
S1：It after the wiped clean of electronic component outer surface to be detected, is placed on monitor station, and to the electronics to be detected
Element is clamped fixation；
S2：Control infrared detecting device issues infrared light and penetrates the electronic component outer packaging layer to be detected and silicon
Layer, scans the inner metal layer shape feature of electronic component to be detected, according to the shape feature of metal layer to the electronics to be measured
Element carries out identification positioning, and generates the image of electronic component to be detected；
S3：Control infrared detecting device issues infrared light and penetrates standard electronics outer packaging layer and silicon layer, scans
The interior metal shape feature of standard electronics, it is fixed identify to standard electronics according to the shape feature of metal layer
Position, and generate the image of standard electronics；
S4：The image of the image of electronic component to be detected and standard electronics is subjected to comprehensive ratio using computer automatically
It is right, if the image of electronic component to be detected is consistent with the image of standard electronics, which is concluded
Enter area undetermined, if the image of electronic component to be detected and the image of standard electronics are not met, the electronic component to be detected
For substandard product, and concluded into unqualified region；
S5：Resistance is measured to multiple standard electronics using multimeter, arrives target zone；
S6：It is measured using electronic component of the multimeter to area undetermined, when multimeter shows measured resistance symbol
Target zone is closed, then measured electronic component is qualified electronic component, if the resistance value that multimeter is measured is not in target
Then the electronic component measured by it is unqualified electronic component in range.
On the basis of above scheme, when electronic component is substandard product, concluded into unqualified region, and record it
Specific product model carries out editor's arrangement.
On the basis of above scheme, record is numbered for the qualified electronic component for detecting completion and unified conclude is placed on conjunction
Lattice region waits staff to be collected arrangement.
On the basis of above scheme, measurement method is that after selecting suitable range, two test pencils are connect respectively in electronic component
Two fixed pin weld tabs between, two test pencils are connect into the either end in electronic component center head and two fixing ends respectively, slowly
Electronic component handle is moved in slow-speed, it is made to rotate the change for measuring its resistance to another extreme position from a extreme position
Change.
On the basis of above scheme, its indicator should be from nominal resistance when the electronic component of detection is resistor, potentiometer
Consecutive variations to 0 Europe is qualified component.
On the basis of above scheme, when the electronic component of detection is capacitor, numerical value has by a relatively large margin from small to large
Swing, then slowly return to again at infinite as qualified component.
On the basis of above scheme, detection electronic component be inductor when, resistance value be not shown as zero when
For qualified component.
On the basis of above scheme, when the electronic component of detection is transformer, numerical value is shown as at infinite
For standard component.
On the basis of above scheme, the infrared detecting device concrete model is SAJ75-ABT-60.
On the basis of above scheme, the general-purpose is digital multimeter.
Compared with the prior art, the invention has the beneficial effects that：
1, first using infrared detecting device to the shape feature and standard electronics of the metal layer inside electronic component
It compares, the electronic component that inner metal layer shape does not meet standard requirements is excluded；Again by multimeter to electronics
The resistance variations of element measure, and compare with numerical value change measured by standard component, and numerical value change is not in mesh
Marking the electronic component in parameter area is unqualified electronic component, since its qualified electronic component is when it passes through electric current,
For closed circuit, there are different voltages for the red-black needle of multimeter, by being to show after the quantitative resistance measurement in multimeter
The resistance sizes of its surveyed electronic component, and the resistance number by measuring its electronic component can determine the electric conductivity of its electronic component
With the qualification of internal element, resistance will will lead to electron detachment electronics core, flow institute to same direction under the action of potential
It causes, electronics flowing, electronics core is motionless, and the binding force of electronics verification electronics is stronger, and electronics is just less susceptible to be detached from, flow, electricity
Resistance is bigger, because of the charge characteristic that identical charges repel each other, there is a natural attraction between the sexes, electric current is to flow along conductor, and surface is more smooth
Then resistance is smaller, and resistance contained in different electronic components is also different, with detection electronic component type not
Together, numerical value change shown by multimeter is also different, then carries out the numerical value of the data measured and standard component measurement pair
Than, detection is carried out to resistance using this kind of method and greatly improves the accuracy of detection, judgement that can be more accurate
The qualification of its electronic component；
2, used multimeter is digital multimeter, more clear can accurately measure its numerical value change, then pass through
Data are transferred to computer, so that the way of contrast in its detection mode is all made of computer and compare automatically, and way of contrast is quick, square
Just, the labor intensity of detection workman is considerably reduced, detection speed is promoted, increases detection efficiency；To all qualified products with
Record is numbered in substandard product respectively and arrangement arranges, and can be adjusted by numbering record to its direct labor or machine
It is whole, increase product qualification rate, promotes product quality.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings：
Fig. 1 is a kind of flow chart of electronic component detection method proposed by the present invention.
Specific embodiment
To further understand the features of the present invention, technological means and concrete function achieved, below with specific implementation
The invention will be described in further detail for mode.
Embodiment 1
A kind of electronic component detection mode is present embodiments provided, is included the following steps：
S1：It after the wiped clean of electronic component outer surface to be detected, is placed on monitor station, and to the electronics to be detected
Element is clamped fixation；
S2：Control infrared detecting device issues infrared light and penetrates the electronic component outer packaging layer to be detected and silicon
Layer, scans the inner metal layer shape feature of electronic component to be detected, according to the shape feature of metal layer to the electronics to be measured
Element carries out identification positioning, and generates the image of electronic component to be detected；
S3：Control infrared detecting device issues infrared light and penetrates standard electronics outer packaging layer and silicon layer, scans
The interior metal shape feature of standard electronics, it is fixed identify to standard electronics according to the shape feature of metal layer
Position, and generate the image of standard electronics；
S4：The image of the image of electronic component to be detected and standard electronics is subjected to comprehensive ratio using computer automatically
It is right, if the image of electronic component to be detected is consistent with the image of standard electronics, which is concluded
Enter area undetermined, if the image of electronic component to be detected and the image of standard electronics are not met, the electronic component to be detected
For substandard product, and concluded into unqualified region；
S5：Resistance is measured to multiple standard electronics using multimeter, arrives target zone；
S6：It is measured using electronic component of the multimeter to area undetermined, when multimeter shows measured resistance symbol
Target zone is closed, then measured electronic component is qualified electronic component, if the resistance value that multimeter is measured is not in target
Then the electronic component measured by it is unqualified electronic component in range.
Wherein, it when electronic component is substandard product, is concluded into unqualified region, and record its specific product type
Number, editor's arrangement is carried out, record is numbered for the qualified electronic component for detecting completion and unified conclude is placed on qualified region, etc.
It is collected arrangement to staff, measurement method is that after selecting suitable range, two test pencils are connect respectively in electronic component
Between two fixed pin weld tabs, two test pencils are connect into the either end in electronic component center head and two fixing ends respectively, slowly
Electronic component handle is rotated, it is made to rotate the variation for measuring its resistance to another extreme position from a extreme position,
Its indicator should be qualified component from nominal resistance consecutive variations to 0 Europe when its electronic component detected is resistor, potentiometer, red
Outer detection device concrete model is SAJ75-ABT-60, and general-purpose is digital multimeter.
Embodiment 2
A kind of electronic component detection mode is present embodiments provided, is included the following steps：
S1：It after the wiped clean of electronic component outer surface to be detected, is placed on monitor station, and to the electronics to be detected
Element is clamped fixation；
S2：Control infrared detecting device issues infrared light and penetrates the electronic component outer packaging layer to be detected and silicon
Layer, scans the inner metal layer shape feature of electronic component to be detected, according to the shape feature of metal layer to the electronics to be measured
Element carries out identification positioning, and generates the image of electronic component to be detected；
S3：Control infrared detecting device issues infrared light and penetrates standard electronics outer packaging layer and silicon layer, scans
The interior metal shape feature of standard electronics, it is fixed identify to standard electronics according to the shape feature of metal layer
Position, and generate the image of standard electronics；
S4：The image of the image of electronic component to be detected and standard electronics is subjected to comprehensive ratio using computer automatically
It is right, if the image of electronic component to be detected is consistent with the image of standard electronics, which is concluded
Enter area undetermined, if the image of electronic component to be detected and the image of standard electronics are not met, the electronic component to be detected
For substandard product, and concluded into unqualified region；
S5：Resistance is measured to multiple standard electronics using multimeter, arrives target zone；
S6：It is measured using electronic component of the multimeter to area undetermined, when multimeter shows measured resistance symbol
Target zone is closed, then measured electronic component is qualified electronic component, if the resistance value that multimeter is measured is not in target
Then the electronic component measured by it is unqualified electronic component in range.
Wherein, it when electronic component is substandard product, is concluded into unqualified region, and record its specific product type
Number, editor's arrangement is carried out, record is numbered for the qualified electronic component for detecting completion and unified conclude is placed on qualified region, etc.
It is collected arrangement to staff, measurement method is that after selecting suitable range, two test pencils are connect respectively in electronic component
Between two fixed pin weld tabs, two test pencils are connect into the either end in electronic component center head and two fixing ends respectively, slowly
Electronic component handle is rotated, it is made to rotate the variation for measuring its resistance to another extreme position from a extreme position,
When its electronic component detected is capacitor, numerical value has swing by a relatively large margin from small to large, then slowly returns to electricity again
Hindering infinite general goal is qualified component, and infrared detecting device concrete model is SAJ75-ABT-60, and general-purpose is digital multimeter.
Embodiment 3
A kind of electronic component detection mode is present embodiments provided, is included the following steps：
S1：It after the wiped clean of electronic component outer surface to be detected, is placed on monitor station, and to the electronics to be detected
Element is clamped fixation；
S2：Control infrared detecting device issues infrared light and penetrates the electronic component outer packaging layer to be detected and silicon
Layer, scans the inner metal layer shape feature of electronic component to be detected, according to the shape feature of metal layer to the electronics to be measured
Element carries out identification positioning, and generates the image of electronic component to be detected；
S3：Control infrared detecting device issues infrared light and penetrates standard electronics outer packaging layer and silicon layer, scans
The interior metal shape feature of standard electronics, it is fixed identify to standard electronics according to the shape feature of metal layer
Position, and generate the image of standard electronics；
S4：The image of the image of electronic component to be detected and standard electronics is subjected to comprehensive ratio using computer automatically
It is right, if the image of electronic component to be detected is consistent with the image of standard electronics, which is concluded
Enter area undetermined, if the image of electronic component to be detected and the image of standard electronics are not met, the electronic component to be detected
For substandard product, and concluded into unqualified region；
S5：Resistance is measured to multiple standard electronics using multimeter, arrives target zone；
S6：It is measured using electronic component of the multimeter to area undetermined, when multimeter shows measured resistance symbol
Target zone is closed, then measured electronic component is qualified electronic component, if the resistance value that multimeter is measured is not in target
Then the electronic component measured by it is unqualified electronic component in range.
Wherein, it when electronic component is substandard product, is concluded into unqualified region, and record its specific product type
Number, editor's arrangement is carried out, record is numbered for the qualified electronic component for detecting completion and unified conclude is placed on qualified region, etc.
It is collected arrangement to staff, measurement method is that after selecting suitable range, two test pencils are connect respectively in electronic component
Between two fixed pin weld tabs, two test pencils are connect into the either end in electronic component center head and two fixing ends respectively, slowly
Electronic component handle is rotated, it is made to rotate the variation for measuring its resistance to another extreme position from a extreme position,
When its electronic component detected is inductor, resistance value be not shown as zero when for qualified component, infrared detecting device tool
Body model SAJ75-ABT-60, general-purpose are digital multimeter.
Embodiment 4
A kind of electronic component detection mode is present embodiments provided, is included the following steps：
S1：It after the wiped clean of electronic component outer surface to be detected, is placed on monitor station, and to the electronics to be detected
Element is clamped fixation；
S2：Control infrared detecting device issues infrared light and penetrates the electronic component outer packaging layer to be detected and silicon
Layer, scans the inner metal layer shape feature of electronic component to be detected, according to the shape feature of metal layer to the electronics to be measured
Element carries out identification positioning, and generates the image of electronic component to be detected；
S3：Control infrared detecting device issues infrared light and penetrates standard electronics outer packaging layer and silicon layer, scans
The interior metal shape feature of standard electronics, it is fixed identify to standard electronics according to the shape feature of metal layer
Position, and generate the image of standard electronics；
S4：The image of the image of electronic component to be detected and standard electronics is subjected to comprehensive ratio using computer automatically
It is right, if the image of electronic component to be detected is consistent with the image of standard electronics, which is concluded
Enter area undetermined, if the image of electronic component to be detected and the image of standard electronics are not met, the electronic component to be detected
For substandard product, and concluded into unqualified region；
S5：Resistance is measured to multiple standard electronics using multimeter, arrives target zone；
S6：It is measured using electronic component of the multimeter to area undetermined, when multimeter shows measured resistance symbol
Target zone is closed, then measured electronic component is qualified electronic component, if the resistance value that multimeter is measured is not in target
Then the electronic component measured by it is unqualified electronic component in range.
Wherein, it when electronic component is substandard product, is concluded into unqualified region, and record its specific product type
Number, editor's arrangement is carried out, record is numbered for the qualified electronic component for detecting completion and unified conclude is placed on qualified region, etc.
It is collected arrangement to staff, measurement method is that after selecting suitable range, two test pencils are connect respectively in electronic component
Between two fixed pin weld tabs, two test pencils are connect into the either end in electronic component center head and two fixing ends respectively, slowly
Electronic component handle is rotated, it is made to rotate the variation for measuring its resistance to another extreme position from a extreme position,
When its electronic component detected is transformer, numerical value is shown as at infinite as standard component, infrared detecting device tool
Body model SAJ75-ABT-60, general-purpose are digital multimeter.
Experimental example
Investigation sample number：500 electronic components, 30 workers
Test method：It allows 30 workers to detect 500 electronic components respectively, is above-mentioned Electron YuanJianJianCeZhuangZhi
Comparative test is done with a kind of common detection device, pilot project is the inspection of the accuracy rate, electronic component that detect to electronic component
Duration, and worker is investigated to the number that is satisfied with of its method, report is as follows：
It summarizes：1.8%, when the detection of 500 electronic components is promoted compared to Detection accuracy compared to existing detection device
It is promoted 4 minutes, worker's satisfaction promotes 38%.
Place is not described in detail by the present invention, is the well-known technique of those skilled in the art.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of electronic component detection method, it is characterised in that：Include the following steps：
S1：It after the wiped clean of electronic component outer surface to be detected, is placed on monitor station, and to the electronic component to be detected
It is clamped fixation；
S2：Control infrared detecting device issues infrared light and penetrates the electronic component outer packaging layer to be detected and silicon layer, sweeps
The inner metal layer shape feature for retouching electronic component to be detected, according to the shape feature of metal layer to the measured electronic elements into
Row identification positioning, and generate the image of electronic component to be detected；
S3：Control infrared detecting device issues infrared light and penetrates standard electronics outer packaging layer and silicon layer, scanning standard
The interior metal shape feature of electronic component carries out identification positioning to standard electronics according to the shape feature of metal layer, and
Generate the image of standard electronics；
S4：The image of the image of electronic component to be detected and standard electronics is carried out using computer automatically it is comprehensive compare,
If the image of electronic component to be detected is consistent with the image of standard electronics, by the electronic component to be detected conclude into
Determine area, if the image of electronic component to be detected and the image of standard electronics are not met, which is not
Qualified products, and concluded into unqualified region；
S5：Resistance is measured to multiple standard electronics using multimeter, obtains target zone；
S6：It is measured using electronic component of the multimeter to area undetermined, when multimeter shows that measured resistance meets mesh
Range is marked, then measured electronic component is qualified electronic component, if the resistance value that multimeter is measured is not in target zone
Inside then the electronic component measured by it is unqualified electronic component.
2. a kind of electronic component detection method according to claim 1, it is characterised in that：Electronic component is substandard product
When, it is concluded into unqualified region, and record its specific product model, carries out editor's arrangement.
3. a kind of electronic component detection method according to claim 1, it is characterised in that：Detect the qualified electronics member completed
Record is numbered in part and unified conclude is placed on qualified region, and staff is waited to be collected arrangement.
4. a kind of electronic component detection method according to claim 1, it is characterised in that：Measurement method is to select suitably
After range, two test pencils are connect respectively between two fixed pin weld tabs of electronic component, two test pencils are connect into electronic component respectively
Either end in center head and two fixing ends slowly rotates electronic component handle, rotates it to another from a extreme position
One extreme position, measures the variation of its resistance.
5. a kind of electronic component detection method according to claim 1, it is characterised in that：Its electronic component detected is electricity
Its indicator should be qualified component from nominal resistance consecutive variations to 0 Europe when hindering device, potentiometer.
6. a kind of electronic component detection method according to claim 1, it is characterised in that：Its electronic component detected is electricity
When container, numerical value has swing by a relatively large margin from small to large, then slowly returns to again at infinite as qualified component.
7. a kind of electronic component detection method according to claim 1, it is characterised in that：Its electronic component detected is electricity
When sensor, resistance value be not shown as zero when for qualified component.
8. a kind of electronic component detection method according to claim 1, it is characterised in that：Its electronic component detected is to become
When depressor, numerical value is shown as at infinite as standard component.
9. a kind of electronic component detection method according to claim 1, it is characterised in that：The infrared detecting device is specific
Model SAJ75-ABT-60.
10. a kind of electronic component detection method according to claim 1, it is characterised in that：The general-purpose is digital versatile
Table.
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| CN201810434678.9A CN108872262A (en) | 2018-05-08 | 2018-05-08 | A kind of electronic component detection method |
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| CN201810434678.9A CN108872262A (en) | 2018-05-08 | 2018-05-08 | A kind of electronic component detection method |
Publications (1)
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| CN108872262A true CN108872262A (en) | 2018-11-23 |
Family
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| CN201810434678.9A Pending CN108872262A (en) | 2018-05-08 | 2018-05-08 | A kind of electronic component detection method |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112526969A (en) * | 2020-11-27 | 2021-03-19 | 一拖(洛阳)柴油机有限公司 | Method for detecting performance of common rail engine ECU |
| CN112731111A (en) * | 2020-12-30 | 2021-04-30 | 苏州谨测检测技术服务有限公司 | Novel PCBA device failure short circuit test method |
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| CN201844980U (en) * | 2010-08-31 | 2011-05-25 | 常州视觉龙机电设备有限公司 | Automatic detection system of solar silicon wafer |
| CN202614177U (en) * | 2012-06-25 | 2012-12-19 | 北京合能阳光新能源技术有限公司 | Comprehensive detection device of silicon wafer |
| CN106409716A (en) * | 2016-11-03 | 2017-02-15 | 南通富士通微电子股份有限公司 | Detection system and detection method of electronic component |
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| CN1063061A (en) * | 1990-12-06 | 1992-07-29 | 马丁·莱曼 | Method and pick-up unit that container is selected automatically and the equipment that this pick-up unit is housed |
| CN201844980U (en) * | 2010-08-31 | 2011-05-25 | 常州视觉龙机电设备有限公司 | Automatic detection system of solar silicon wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112526969A (en) * | 2020-11-27 | 2021-03-19 | 一拖(洛阳)柴油机有限公司 | Method for detecting performance of common rail engine ECU |
| CN112731111A (en) * | 2020-12-30 | 2021-04-30 | 苏州谨测检测技术服务有限公司 | Novel PCBA device failure short circuit test method |
| CN112731111B (en) * | 2020-12-30 | 2022-12-20 | 苏州谨测检测技术服务有限公司 | Novel PCBA device failure short circuit test method |
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Application publication date: 20181123 |