CN109309022A - A kind of defect sampling observation method - Google Patents
A kind of defect sampling observation method Download PDFInfo
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- CN109309022A CN109309022A CN201811340879.9A CN201811340879A CN109309022A CN 109309022 A CN109309022 A CN 109309022A CN 201811340879 A CN201811340879 A CN 201811340879A CN 109309022 A CN109309022 A CN 109309022A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
The present invention provides a kind of defect sampling observation method, is applied in defect random check system, defect random check system includes multiple boards, and method includes step S1, each board is classified according to the type of the configuration parameter of processing technology, and obtain sorted every group of board；Step S2 is monitored every group of board, and obtain every group of board does not monitor quantity and non-monitoring period；Step S3, to not monitor quantity with do not monitor amount threshold and be compared, and non-monitoring period is compared with non-monitoring period threshold value: not monitoring amount threshold if not monitoring quantity and exceeding, or non-monitoring period exceeds non-monitoring period threshold value, then inspects by random samples to the wafer on the every group of board not monitored；If not monitoring quantity without departing from not monitoring amount threshold, and non-monitoring period is without departing from non-monitoring period threshold value, then return step S2.The beneficial effects of the present invention are: improve the accuracy of sampling Detection.
Description
Technical field
The present invention relates to technical field of semiconductors more particularly to a kind of defect to inspect method by random samples.
Background technique
At present in the production process of wafer, each board can process multiple tracks processing procedure, need to the board of per pass processing procedure into
Row detection.
It is in the prior art usually detection to be sampled according to the mantissa that product batches are numbered according to process section, or press
Board converted products reaches certain amount to be sampled detection, but the method that the prior art uses is difficult to monitor per pass system
The problem of single processing procedure in journey.
Summary of the invention
For the above-mentioned problems in the prior art, now provides and a kind of be intended to the matching according to processing technology by each board
The type for setting parameter is classified, and does not monitor quantity or non-monitoring period according to the wafer on every group of board come on board
Wafer be sampled detection, thus improve the accuracy of sampling Detection defect sampling observation method.
Specific technical solution is as follows:
A kind of defect sampling observation method, is applied in defect random check system, defect random check system includes multiple boards, wherein
Method the following steps are included:
Each board is classified according to the type of the configuration parameter of processing technology, and obtained sorted by step S1
Every group of board；
Step S2 is monitored every group of board, and obtain every group of board does not monitor quantity and non-monitoring period；
Step S3, will not monitor quantity with do not monitor amount threshold and be compared, and will non-monitoring period with do not monitor
Time threshold is compared:
Do not monitor amount threshold if not monitoring quantity and exceeding, or non-monitoring period exceeds non-monitoring period threshold value, then it is right
The wafer on every group of board not monitored is inspected by random samples；
If not monitoring quantity without departing from not monitoring amount threshold, and non-monitoring period is without departing from non-monitoring period threshold value, then
Return step S2；
Quantity is not monitored for indicating the batch size that the wafer on board is not monitored continuously；
Non- monitoring period is for indicating the time that the wafer on board is not monitored continuously.
Preferably, defect inspect by random samples method, wherein step S1 the following steps are included:
Step S11 classifies each board according to the type of processing technology, to obtain multiple machines of each type
Platform；
Step S12 classifies same type of multiple boards according to the type of configuration parameter, sorted to obtain
Every group of board.
Preferably, defect inspect by random samples method, wherein step S2 the following steps are included:
Step S21 is in real time monitored every group of board；
Step S22 carries out statistics to the batch size that the wafer on every group of board is not monitored continuously and to every group
The time that wafer on board is not monitored continuously is counted；
Step S23, obtain all every group of boards does not monitor quantity and non-monitoring period.
Preferably, defect inspects method by random samples, wherein preset in step S3 does not monitor amount threshold and preset do not supervise
It controls time threshold and is set certainly all in accordance with user demand.
Preferably, defect inspects method by random samples, wherein
In step S3, amount threshold is not monitored if not monitoring quantity and exceeding, or non-monitoring period exceeds non-monitoring period
The wafer mark of present lot on the every group of board not monitored is then marking wafer, and marking wafer is sent by threshold value
It is inspected by random samples in detection website.
Preferably, defect inspects method by random samples, wherein monitors in real time to the sampling observation state of marking wafer, until label is brilliant
Circle be admitted to detection website in inspected by random samples until.
Preferably, defect inspects method by random samples, wherein
Real time monitoring includes monitoring in real time to the sampling observation state of marking wafer in the detection, comprising the following steps:
Step A1 monitors the sampling observation state of a marking wafer in real time；
Current markers wafer is put into measuring station point and detected by step A2；
Whether the sampling observation state of step A3, judge mark wafer are to scrap or need to reform；
If so, abandoning current markers wafer, other marking wafers are monitored again, are then returned to step A1, until all marks
Remember that wafer completes detection, return step S2；
If it is not, continuing to test, is finished until current markers wafer detects, be then returned to step A1.
Preferably, defect inspects method by random samples, wherein
Real time monitoring includes monitoring in real time to the sampling observation state of marking wafer before detection, comprising the following steps:
Step B1 monitors the sampling observation state of a marking wafer in real time；
Step B2, judges whether the waiting detection time of current wafer exceeds preset waiting detection time；
If so, abandoning current markers wafer, other marking wafers are monitored again, are then returned to step B1, until all marks
Remember that wafer completes detection, return step S2；
It detects, is finished until current markers wafer detects, then if it is not, current markers wafer is put into measuring station point
Return step B1.
Preferably, defect inspects method by random samples, wherein
Real time monitoring includes monitoring in real time to the sampling observation state of marking wafer in the detection, comprising the following steps:
Step C1 monitors the sampling observation state of a marking wafer in real time；
Current markers wafer is put into measuring station point and detected by step C2；
Step C3, judges whether the remaining detection time of current markers wafer is less than preset remaining detection time；
If so, abandoning current markers wafer, other marking wafers are monitored again, are then returned to step C1, until all marks
Remember that wafer completes detection, return step S2；
If it is not, continuing to test, is finished until current markers wafer detects, be then returned to step C1.
Preferably, defect inspects method by random samples, wherein
Real time monitoring includes monitoring in real time to the sampling observation state of marking wafer in the detection, comprising the following steps:
One marking wafer is put into measuring station point and detected by step D1；
Step D2 monitors other marking wafers in real time, and counts the non-amount detection of other marking wafers；
Step D3 judges whether non-amount detection is less than and does not monitor amount threshold；
It is detected if so, cancelling to current markers wafer, return step S2；
If it is not, continuing to test, is finished until current markers wafer detects, be then returned to step D1.
Above-mentioned technical proposal has the following advantages that or the utility model has the advantages that by joining each board according to the configuration of processing technology
Several types are classified, and do not monitor quantity or non-monitoring period according to the wafer on every group of board come to the crystalline substance on board
Circle is sampled detection, to improve the accuracy of sampling Detection.
Detailed description of the invention
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the flow chart that defect of the present invention inspects embodiment of the method by random samples；
Fig. 2 is the flow chart for the step S1 that defect of the present invention inspects embodiment of the method by random samples；
Fig. 3 is the flow chart for the step S2 that defect of the present invention inspects embodiment of the method by random samples；
Fig. 4 A is the flow chart A for the real time monitoring that defect of the present invention inspects embodiment of the method by random samples；
Fig. 4 B is the flow chart B for the real time monitoring that defect of the present invention inspects embodiment of the method by random samples；
Fig. 4 C is the flow chart C for the real time monitoring that defect of the present invention inspects embodiment of the method by random samples；
Fig. 4 D is the flow chart D for the real time monitoring that defect of the present invention inspects embodiment of the method by random samples.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
The present invention includes a kind of defect sampling observation method, is applied in defect random check system, defect random check system includes multiple
Board, as shown in Figure 1, method the following steps are included:
Each board is classified according to the type of the configuration parameter of processing technology, and obtained sorted by step S1
Every group of board；
Step S2 is monitored every group of board, and obtain every group of board does not monitor quantity and non-monitoring period；
Step S3, will not monitor quantity with do not monitor amount threshold and be compared, and will non-monitoring period with do not monitor
Time threshold is compared:
Do not monitor amount threshold if not monitoring quantity and exceeding, or non-monitoring period exceeds non-monitoring period threshold value, then it is right
The wafer on every group of board not monitored is inspected by random samples；
If not monitoring quantity without departing from not monitoring amount threshold, and non-monitoring period is without departing from non-monitoring period threshold value, then
Return step S2；
Quantity is not monitored for indicating the batch size that the wafer on board is not monitored continuously；
Non- monitoring period is for indicating the time that the wafer on board is not monitored continuously.
Further, as preferred embodiment, first by each board according to the class of the configuration parameter of processing technology
Type is classified, to obtain every group of board；Again in real time the interval quantity to wafer on every group of board away from last time detection and
Every the time, i.e., do not monitor quantity continuously and continuous non-monitoring period counted, will finally not monitor quantity, non-monitoring period with
It is corresponding do not monitor amount threshold, non-monitoring period threshold value is compared, finally (referred mainly in the present embodiment according to comparison result
Do not monitor quantity, non-monitoring period and do not monitor amount threshold, non-monitoring period threshold value beyond corresponding) to the wafer on board into
Line sampling detection, can make the result of entire sampling Detection more accurate, and pass through the configuration of the processing technology to board in this way
Parameter, which is grouped, to be carried out sampling Detection and may be implemented to detect the wafer on single processing procedure, and then makes the result of sampling Detection
It is more accurate.
Further, in the above-described embodiments, as shown in Fig. 2, step S1 the following steps are included:
Step S11 classifies each board according to the type of processing technology, to obtain multiple machines of each type
Platform；
Step S12 classifies same type of multiple boards according to the type of configuration parameter, sorted to obtain
Every group of board.
Further, as preferred embodiment, first each board is classified according to processing technology, then will classification
Obtained every class board is grouped according to the configuration parameter of every class processing technology, to obtain every group of board of single processing procedure, this
It is more convenient that the group mode of sample makes entire grouping process, and is less prone to confusion, to realize to the wafer on single processing procedure
It is detected, and then keeps the result of sampling Detection more accurate.
Further, in the above-described embodiments, as shown in figure 3, step S2 the following steps are included:
Step S21 is in real time monitored every group of board；
Step S22 carries out statistics to the batch size that the wafer on every group of board is not monitored continuously and to every group
The time that wafer on board is not monitored continuously is counted；
Step S23, obtain all every group of boards does not monitor quantity and non-monitoring period.
In the above-described embodiments, by every group of board is monitored in real time can obtain wafer in time do not monitor quantity
Non- monitoring period is sampled detection to wafer in time to realize.
Further, in the above-described embodiments, preset in step S3 does not monitor amount threshold and preset does not supervise
It controls time threshold and is set certainly all in accordance with user demand.But under normal circumstances, it is preset do not monitor amount threshold 20-30 it
Between, naturally it is also possible to exceed above range；Preset non-monitoring period threshold value was at 24 hours or so, naturally it is also possible to exceed above-mentioned
Range.
Further, in the above-described embodiments, in step S3, amount threshold is not monitored if not monitoring quantity and exceeding, or
Non- monitoring period exceeds non-monitoring period threshold value, then is label by the wafer mark of the present lot on the every group of board not monitored
Wafer, and marking wafer is sent into detection website and is inspected by random samples.
Further, in the above-described embodiments, the sampling observation state of marking wafer is monitored in real time, until marking wafer
It is admitted to until being inspected by random samples in detection website.
In the above-described embodiments, by the way that the wafer on each board inspected by random samples is marked, to realize more square
Just the wafer inspected by random samples to needs monitors in real time, to make that the wafer inspected by random samples is needed to be fully completed sampling observation, and then realizes
The result of sampling Detection is allowed more accurately to act on.
Further, in the above-described embodiments, as shown in Figure 4 A, real time monitoring includes the pumping to marking wafer in the detection
Inspection state is monitored in real time, comprising the following steps:
Step A1 monitors the sampling observation state of a marking wafer in real time；
Current markers wafer is put into measuring station point and detected by step A2；
Whether the sampling observation state of step A3, judge mark wafer are to scrap or need to reform；
If so, abandoning current markers wafer, other marking wafers are monitored again, are then returned to step A1, until all marks
Remember that wafer completes detection, return step S2；
If it is not, continuing to test, is finished until current markers wafer detects, be then returned to step A1.
In the above-described embodiments, whether marking wafer is scrapped or is needed to reform the purpose detected and be to prevent from examining
The wafer scrapped or need to reform is detected during survey and wastes detection time, thus control entire sampling Detection when
Between, and then improve the accuracy of sampling Detection.
Further, in the above-described embodiments, as shown in Figure 4 B, real time monitoring includes the pumping to marking wafer before detection
Inspection state is monitored in real time, comprising the following steps:
Step B1 monitors the sampling observation state of a marking wafer in real time；
Step B2, judges whether the waiting detection time of current wafer exceeds preset waiting detection time；
If so, abandoning current markers wafer, other marking wafers are monitored again, are then returned to step B1, until all marks
Remember that wafer completes detection, return step S2；
It detects, is finished until current markers wafer detects, then if it is not, current markers wafer is put into measuring station point
Return step B1.
Wherein, preset waiting detection time is set certainly according to the demand of user, but under normal circumstances, preset waiting
Detection time can be 2-3 days or so, naturally it is also possible to exceed the preset range.
In the above-described embodiments, to the waiting detection time of wafer carry out judgement be to control entire sampling Detection when
Between, to improve the efficiency of sampling Detection.
Further, in the above-described embodiments, as shown in Figure 4 C, real time monitoring includes the pumping to marking wafer in the detection
Inspection state is monitored in real time, comprising the following steps:
Step C1 monitors the sampling observation state of a marking wafer in real time；
Current markers wafer is put into measuring station point and detected by step C2；
Step C3, judges whether the remaining detection time of current markers wafer is less than preset remaining detection time；
If so, abandoning current markers wafer, other marking wafers are monitored again, are then returned to step C1, until all marks
Remember that wafer completes detection, return step S2；
If it is not, continuing to test, is finished until current markers wafer detects, be then returned to step C1.
Wherein, every group of board of the configuration parameter of processing technology has corresponding detection time requirement, therefore preset surplus
Remaining detection time is the fixed setting time of every group of board of the configuration parameter of corresponding processing technology.
It should be noted that due to the detection time requirement of the corresponding every group of board of the configuration parameter of different processing technologys
It is different, therefore the wafer detection time under each processing procedure is also different.
In the above-described embodiments, to the remaining detection time of wafer carry out judgement be in order to avoid wafer in the detection process
It breaks down, so that the time of entire sampling Detection is controlled, to improve the efficiency of sampling Detection.
Further, in the above-described embodiments, as shown in Figure 4 D, real time monitoring includes the pumping to marking wafer in the detection
Inspection state is monitored in real time, comprising the following steps:
One marking wafer is put into measuring station point and detected by step D1；
Step D2 monitors other marking wafers in real time, and counts the non-amount detection of other marking wafers；
Step D3 judges whether non-amount detection is less than and does not monitor amount threshold；
It is detected if so, cancelling to current markers wafer, return step S2；
If it is not, continuing to test, is finished until current markers wafer detects, be then returned to step D1.
In the above-described embodiments, by the non-amount detection of real-time statistics marking wafer, and not examining marking wafer
Quantitation with do not monitor amount threshold and compare, to reduce the working quantity of sampling Detection, and then shorten sampling inspection
The time of survey, while also improving the efficiency of sampling Detection.
The above is only preferred embodiments of the present invention, are not intended to limit the implementation manners and the protection scope of the present invention, right
For those skilled in the art, it should can appreciate that and all replace with being equal made by description of the invention and diagramatic content
It changes and obviously changes obtained scheme, should all be included within the scope of the present invention.
Claims (10)
1. a kind of defect inspects method by random samples, it is applied in defect random check system, the defect random check system includes multiple boards, special
Sign is, the described method comprises the following steps:
Each board is classified according to the type of the configuration parameter of processing technology, and obtained sorted by step S1
Every group of board；
Step S2, the board described in every group are monitored, and when not monitoring quantity and not monitoring of board described in obtaining every group
Between；
Step S3, by it is described do not monitor quantity with do not monitor amount threshold and be compared, and will the non-monitoring period with not
Monitoring period threshold value is compared:
If it is described do not monitor quantity beyond it is described do not monitor amount threshold or the non-monitoring period beyond it is described do not monitor when
Between threshold value, then the wafer on board described in every group not monitored is inspected by random samples；
Quantity is not monitored do not monitor amount threshold without departing from described, and the non-monitoring period does not monitor without departing from described if described
Time threshold, then return step S2；
The quantity that do not monitor is for indicating the batch size that the wafer on the board is not monitored continuously；
The non-monitoring period is for indicating the time that the wafer on the board is not monitored continuously.
2. defect as described in claim 1 inspects method by random samples, which is characterized in that the step S1 the following steps are included:
Step S11 classifies each board, according to the type of processing technology to obtain multiple machines of each type
Platform；
Step S12 classifies same type of multiple boards according to the type of configuration parameter, sorted to obtain
Board described in every group.
3. defect as described in claim 1 inspects method by random samples, which is characterized in that the step S2 the following steps are included:
Step S21, the board described in every group is monitored in real time；
Step S22, the batch size that the wafer on the board described in every group is not monitored continuously carry out statistics and to every groups
The time that wafer on the board is not monitored continuously is counted；
Step S23, obtain all every groups described in board do not monitor quantity and non-monitoring period.
4. defect as described in claim 1 inspects method by random samples, which is characterized in that preset in the step S3 described does not monitor
Amount threshold and the preset non-monitoring period threshold value are set certainly all in accordance with user demand.
5. defect as described in claim 1 inspects method by random samples, which is characterized in that
In the step S3, quantity is not monitored do not monitor amount threshold or the non-monitoring period is super beyond described if described
The wafer mark of present lot on board described in every group not monitored is then label by the non-monitoring period threshold value out
Wafer, and the marking wafer is sent into detection website and is inspected by random samples.
6. defect as claimed in claim 5 inspects method by random samples, which is characterized in that carried out to the sampling observation state of the marking wafer real
When monitor, until the marking wafer is admitted to and is inspected by random samples in the detection website.
7. defect as claimed in claim 6 inspects method by random samples, which is characterized in that
The real time monitoring includes monitoring in real time to the sampling observation state of the marking wafer in the detection, including following step
It is rapid:
Step A1 monitors the sampling observation state of a marking wafer in real time；
Presently described marking wafer is put into the measuring station point and detected by step A2；
Step A3 judges whether the sampling observation state of the marking wafer is to scrap or need to reform；
If so, abandoning presently described marking wafer, other marking wafers are monitored again, are then returned to step A1, Zhi Daosuo
There is the marking wafer to complete detection, return step S2；
If it is not, continuing to test, is finished until presently described marking wafer detects, be then returned to step A1.
8. defect as claimed in claim 6 inspects method by random samples, which is characterized in that
The real time monitoring includes monitoring in real time to the sampling observation state of the marking wafer before detection, including following step
It is rapid:
Step B1 monitors the sampling observation state of a marking wafer in real time；
Step B2, judges whether the waiting detection time of presently described wafer exceeds preset waiting detection time；
If so, abandoning presently described marking wafer, other marking wafers are monitored again, are then returned to step B1, Zhi Daosuo
There is the marking wafer to complete detection, return step S2；
It is detected if it is not, presently described marking wafer is put into the measuring station point, until presently described marking wafer detects
It finishes, is then returned to step B1.
9. defect as claimed in claim 6 inspects method by random samples, which is characterized in that
The real time monitoring includes monitoring in real time to the sampling observation state of the marking wafer in the detection, including following step
It is rapid:
Step C1 monitors the sampling observation state of a marking wafer in real time；
Presently described marking wafer is put into the measuring station point and detected by step C2；
Step C3, judges whether the remaining detection time of presently described marking wafer is less than preset remaining detection time；
If so, abandoning presently described marking wafer, other marking wafers are monitored again, are then returned to step C1, Zhi Daosuo
There is the marking wafer to complete detection, return step S2；
If it is not, continuing to test, is finished until presently described marking wafer detects, be then returned to step C1.
10. defect as claimed in claim 6 inspects method by random samples, which is characterized in that
The real time monitoring includes monitoring in real time to the sampling observation state of the marking wafer in the detection, including following step
It is rapid:
One marking wafer is put into the measuring station point and detected by step D1；
Step D2 monitors other described marking wafers in real time, and counts the non-amount detection of other marking wafers；
Step D3, judges the non-amount detection does not monitor amount threshold described in whether being less than；
It is detected if so, cancelling to presently described marking wafer, return step S2；
If it is not, continuing to test, is finished until presently described marking wafer detects, be then returned to step D1.
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| CN112185831A (en) * | 2019-07-01 | 2021-01-05 | 华润微电子（重庆）有限公司 | Sampling defect detection method, and device and system thereof |
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| CN112614790A (en) * | 2020-12-16 | 2021-04-06 | 上海华力微电子有限公司 | Wafer defect scanning system and scanning method and computer storage medium |
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| CN110097260B (en) * | 2019-04-12 | 2023-12-19 | 格力电器（芜湖）有限公司 | Product inspection method, apparatus, device, and storage medium |
| CN112185831A (en) * | 2019-07-01 | 2021-01-05 | 华润微电子（重庆）有限公司 | Sampling defect detection method, and device and system thereof |
| CN112185830A (en) * | 2019-07-01 | 2021-01-05 | 华润微电子（重庆）有限公司 | Sampling defect detection method, device, equipment and system |
| CN112614790A (en) * | 2020-12-16 | 2021-04-06 | 上海华力微电子有限公司 | Wafer defect scanning system and scanning method and computer storage medium |
| CN112614790B (en) * | 2020-12-16 | 2024-01-23 | 上海华力微电子有限公司 | Wafer defect scanning system, scanning method and computer storage medium |
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