CN108848437A - Loudspeaker mould group - Google Patents
Loudspeaker mould group Download PDFInfo
- Publication number
- CN108848437A CN108848437A CN201810838025.7A CN201810838025A CN108848437A CN 108848437 A CN108848437 A CN 108848437A CN 201810838025 A CN201810838025 A CN 201810838025A CN 108848437 A CN108848437 A CN 108848437A
- Authority
- CN
- China
- Prior art keywords
- mould group
- loudspeaker
- connecting portion
- magnetic yoke
- conduct piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000002265 prevention Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
- H04R9/025—Magnetic circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The invention discloses a kind of loudspeaker mould group, which includes：Module casing, loudspeaker assembly, conduct piece and conductive magnetic yoke；The module casing has the first face and the second face being parallel to each other, is formed with the space for accommodating the loudspeaker assembly between first face and second face in flat；It include the conductive magnetic yoke on first face, the conduct piece is arranged between the conductive magnetic yoke and second face, and the conduct piece connects the conductive magnetic yoke with the module casing.Of the invention one has technical effect that, improves the integrally-built compactedness of mould group, external electrostatic prevention structure is avoided to fail because of external force.
Description
Technical field
The present invention relates to technical field of acoustics, more particularly, to a kind of loudspeaker mould group.
Background technique
Loudspeaker mould group is the important acoustic element of portable electronic device, for completing between electric signal and acoustical signal
Conversion, is usually used in the electronic equipments such as mobile phone, computer.
Currently, more stringent requirements are proposed to Microspeaker by people with the fast development of Microspeaker.Usually need
More functional modules are set in the inside of Microspeaker, such as be integrally designed Microspeaker and microphone.
Microphone is to the more demanding of antistatic, and electrostatic easily leads to microphone breakdown, to cause the functionality of microphone
Failure.And in the integrated design of existing Microspeaker and microphone, although external anti-static device, due to being outer
It sets, this anti-static device easily leads to destructurized in external force or transportational process, and electrostatic can not be fast out of loudspeaker mould group
Speed export, causes serious threat to reliability, the service life etc. of microphone and electronic equipment.In addition, traditional preventing is quiet
The assembly precision of electric installation is not high, and external anti-static device easily shakes, to influence to contact, leads to imperfect earth.
Therefore, it is necessary to a kind of novel loudspeaker mould group be proposed, to overcome drawbacks described above.
Summary of the invention
It is an object of the present invention to provide a kind of new solutions of loudspeaker mould group.
According to the first aspect of the invention, a kind of loudspeaker mould group is provided, which includes：Module casing, loudspeaker
Component, conduct piece and conductive magnetic yoke；
The module casing has the first face and the second face being parallel to each other in flat, first face and described the
The space for accommodating the loudspeaker assembly is formed between two faces；
Include the conductive magnetic yoke on first face, conduct piece setting the conductive magnetic yoke and second face it
Between, the conduct piece connects the conductive magnetic yoke with the module casing.
Optionally, the conduct piece includes：First connecting portion, second connecting portion and elasticity arm；
The elasticity arm both ends, which each extend over, is provided with first connecting portion and second connecting portion, constitutes the conduct piece.
Optionally, conductive contact has been stamped and formed out in the first connecting portion, the conductive contact is led with the conductive magnetic yoke
It is logical.
Optionally, the position that the first connecting portion is connect with the elasticity arm is formed with bending part.
Optionally, the surface of the conductive contact has Gold plated Layer.
Optionally, the elasticity arm, first connecting portion and the second connecting portion are integrally formed.
Optionally, the bending angle between the elasticity arm and first connecting portion and second connecting portion is obtuse angle.
Optionally, the module casing includes：Shell and rear cover in mould group upper casing, mould group；
It is covered after described and is provided with the conductive magnetic yoke, be connected with the conduction between the conductive magnetic yoke and the mould group upper casing
Part；
The loudspeaker assembly is arranged in the mould group in shell, and the rear cover is fixedly connected with shell in the mould group.
Optionally, pad is provided on the mould group upper casing, the pad is located at the edge of the mould group upper casing, described to lead
The second connecting portion of electric part is connect with the mould group upper casing.
Optionally, integrated injection molding has metal insert in the mould group upper casing, and the metal insert is led by pad with described
Electric part conducting.
Optionally, the second connecting portion and the mould group upper casing are electrically connected by pad.
Optionally, the conductive magnetic yoke includes being used to form the first part of magnetic circuit system and extending to the loudspeaker group
Second part outside part, the second part are connected with the first connecting portion of the conduct piece.
Of the invention one has technical effect that, by setting between the conductive magnetic yoke and module casing of loudspeaker module internal
Conduct piece is set, the charge of loudspeaker module internal is exported.Both the integrally-built compactedness of mould group had been improved, had been avoided external anti-
Electrostatic structure fails because of external force；Also improve the stability and service life of electronic equipment entirety.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the structural schematic diagram for the loudspeaker mould group that the specific embodiment of the invention provides；
Fig. 2 is the partial enlarged view of Fig. 1；
The structural schematic diagram for the mould group upper casing for being connected with conduct piece that Fig. 3 specific embodiment of the invention provides；
Fig. 4 is the explosive view for the loudspeaker mould group that the specific embodiment of the invention provides.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should be noted that：Unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
The present invention provides a kind of novel loudspeaker mould group, is applied in Microspeaker.Fig. 1 shows of the invention specific
Embodiment provide loudspeaker mould group structural schematic diagram, Fig. 2 to Fig. 4 be by taking the structure of each component of loudspeaker mould group as an example,
Structure, the principle of loudspeaker mould group of the invention are described in detail.
Loudspeaker mould group and microphone are as the important component in electronic equipment, internal loudspeaker assembly, magnetic circuit system
The often interference by electromagnetism, electrostatic such as system.Its surface is often populated with a large amount of charges, these charges influence inside equipment
The sound quality of loudspeaker and microphone in electronic equipment；When moment, electrostatic charge was more, loudspeaker in electronic equipment is easily led to
And the functional failure of microphone.
The present invention provides a kind of loudspeaker mould group, which includes：Module casing, loudspeaker assembly 20, conduct piece 30 with
And conductive magnetic yoke 40, the module casing have the first face and the second face being parallel to each other in flat, first face and described
The space for accommodating the loudspeaker assembly 20 is formed between second face, the loudspeaker assembly 20 is configured as electric signal
Be converted to acoustical signal.
It include the conductive magnetic yoke 40 on first face in module casing, the conduct piece 30 is arranged in the conductive magnetic yoke
Between 40 and second face, the conduct piece 30 connects the conductive magnetic yoke 30 with the module casing.
Particularly, in loudspeaker mould group, conductive magnetic yoke 40 include be used to form first part's conductive magnetic yoke of magnetic circuit system with
And extend to second part conductive magnetic yoke outside the loudspeaker assembly.The conductive magnetic yoke be connected with conduct piece in the present embodiment, refers to
Be the second part conductive magnetic yoke outside the loudspeaker assembly.
As shown in Figure 1, the conduct piece 30 is arranged between the conductive magnetic yoke 40 and the module casing, i.e. conductive magnetic yoke 40
With the fixed space for being formed with receiving conduct piece 30 inside module casing, conduct piece 30 is arranged in module casing, this knot
Structure mode advantageously reduces the integral thickness of loudspeaker mould group, makes full use of the inner space of loudspeaker mould group；Meanwhile compared to
External anti-static part, built-in conduct piece 30 effectively reduce the risk of shaking, ensure that good ground connection.Electrostatic energy from
Module internal exports rapidly, is conducive to the reliability and service life that improve electronic equipment.
It will be appreciated by those skilled in the art that, conduct piece 30 can be metal clips, flexible circuit board, spring etc., this
Type, form of embodiment conduct piece etc. are with no restrictions.
In in a zigzag, one end of the conduct piece 30 and the conductive magnetic yoke 40 are connected conduct piece 30 shown in the present embodiment,
The other end of the conduct piece 30 is connect with the module casing.In this way, what loudspeaker module internal can be full of by conduct piece 30
A large amount of charges export loudspeaker by conductive magnetic yoke or module casing, to achieve the purpose that antistatic.
Loudspeaker modular structure provided in this embodiment, by loudspeaker module internal conductive magnetic yoke and module casing it
Between conduct piece is set, conduct piece is connected with conductive magnetic yoke and module casing, and the charge of loudspeaker module internal is exported.In this way,
Both the integrally-built compactedness of mould group had been improved, external electrostatic prevention structure is eliminated, has avoided external electrostatic prevention structure because of external force
And it fails；Also improve the stability and service life of electronic equipment entirety.
Further, the conduct piece 30 includes：First connecting portion 31, second connecting portion 33 and elasticity arm 32, it is described
32 both ends of elasticity arm, which each extend over, is provided with first connecting portion 31 and second connecting portion 33, constitutes the conduct piece 30.Such as Fig. 2 institute
Show, first connecting portion 31 is connect with the conductive magnetic yoke in loudspeaker mould group on conduct piece 30, and second connecting portion 33 and module casing connect
It connects, in this way, a large amount of charges being full of in conductive magnetic yoke can be transferred on module casing by conduct piece 30, to be grounded antistatic
Effect.
A kind of optional shape of conduct piece 30 is shown in Fig. 2, the present embodiment does not do specific requirement to the shape of conduct piece,
The shape of suitable conduct piece can be selected according to the interior spatial structure of conductive magnetic yoke and module casing.Those skilled in the art can
With understanding, in order to reach preferable anti-static effect, the material of conduct piece preferably selects the good metal of electric conductivity, example
Such as, gold, silver, copper etc..
Specifically, it has been stamped and formed out conductive contact 311 in the first connecting portion 31, as shown in Fig. 2, conductive contact 311
In the arcuate structure of protrusion, when first connecting portion 31 is connect with conductive magnetic yoke 40, conductive contact 311 can be with the company in conductive magnetic yoke 40
Socket part conducting, had both increased the contact between conduct piece 30 and conductive magnetic yoke 40 in this way, and the design of 311 protrusion of conductive contact also can
Reinforce stability of the conduct piece 30 between conductive magnetic yoke 40 and module casing.
Optionally, the surface of the conductive contact 311 has Gold plated Layer, to enhance between conductive magnetic yoke 40 and conduct piece 30
Electric conductivity.On the surface of conductive contact 311, setting Gold plated Layer is a kind of optional scheme, also may be selected that other electric conductivity are electroplated
The good material of energy, the present embodiment are without limitation.
In the present embodiment, the elasticity arm 32, first connecting portion 31 and second connecting portion 33 are integrally formed, and in this way can
While guaranteeing conduct piece electric conductivity and structural stability, moreover it is possible to simplify installation.
As shown in Fig. 2, the position that the first connecting portion 31 is connect with the elasticity arm 32 is formed with bending part 321.I.e.
First connecting portion 31 is then flat by bending part 321 again to when 32 transition of elasticity arm, being first transitioned into the lesser bending part 321 of corner
Cunning transits to elasticity arm 32.In this way, first connecting portion on the one hand can be reduced to when elasticity arm transition, since connection corner is larger
Caused problem of stress concentration；On the other hand, the bending part between first connecting portion and elasticity arm is also avoided that first
Interconnecting piece jacks up upwards under the action of elasticity arm, by conductive magnetic yoke.To improve conduct piece structure in loudspeaker mould group
Stability.
In conduct piece provided in this embodiment, between the elasticity arm 32 and first connecting portion 31 and second connecting portion 33
Bending angle is obtuse angle.Such design can reduce conduct piece because bending generates biggish screen resilience to a certain extent.
In addition, module casing provided in this embodiment includes：Shell 12 and rear cover 13 in mould group upper casing 11, mould group.It is described
It is provided with the conductive magnetic yoke 40 on rear cover 13, is connected with the conduct piece between the conductive magnetic yoke 40 and the mould group upper casing 11
30.The loudspeaker assembly 20 is arranged in the mould group in shell 12, and the rear cover 13 is fixedly connected with shell 12 in the mould group.
Particularly, the rear cover is made of metal material, has metal connecting piece on the mould group upper casing 11 of non-metallic material,
A large amount of charges of module internal can be exported by the both ends of conduct piece in this way.
On the basis of the above embodiments, the first connecting portion 31 of the conduct piece 30 and the conductive magnetic yoke 40 are connected, institute
The second connecting portion 33 for stating conduct piece 30 is connect with the mould group upper casing 11.The a large amount of charges being full of in conductive magnetic yoke 40 are logical mostly conductive
Part 30 is transferred on mould group upper casing 11, to be grounded the effect of antistatic.
Optionally, pad 111 is provided on the mould group upper casing 11, the pad 111 is located at the mould group upper casing 11
Edge, the second connecting portion 33 are electrically connected with the mould group upper casing 11 by pad 111.
Specifically, integrated injection molding has metal insert 112 in the mould group upper casing 11, and one end of the metal insert is located at institute
It states on pad 111, the metal insert 112 is connected by pad 111 and the conduct piece 30.For example, laser welding can be used
Mode, the second connecting portion 33 of conduct piece is connected by pad 111 with metal insert 112.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (11)
1. a kind of loudspeaker mould group, which is characterized in that including：It module casing, loudspeaker assembly (20), conduct piece (30) and leads
Magnetic yoke (40)；
The module casing has opposite the first face and the second face, is formed with receiving between first face and second face
There is the space of the loudspeaker assembly (20)；
It include the conductive magnetic yoke (40) that the conduct piece (30) setting is in the conductive magnetic yoke (40) and described the on first face
Between two faces, the conduct piece (30) connects the conductive magnetic yoke (40) with the module casing.
2. loudspeaker mould group according to claim 1, which is characterized in that the conduct piece (30) includes：First connecting portion
(31), second connecting portion (33) and elasticity arm (32)；
Elasticity arm (32) both ends, which each extend over, is provided with first connecting portion (31) and second connecting portion (33), leads described in composition
Electric part (30).
3. loudspeaker mould group according to claim 2, which is characterized in that be stamped and formed out on the first connecting portion (31)
Conductive contact (311), the conductive contact (311) and the conductive magnetic yoke (40) are connected.
4. loudspeaker mould group according to claim 2, which is characterized in that the first connecting portion (31) and the elasticity arm
(32) position connected is formed with bending part (321).
5. loudspeaker mould group according to claim 3, which is characterized in that the surface of the conductive contact (311) has plating
Layer gold.
6. loudspeaker mould group according to claim 2, which is characterized in that the elasticity arm (32), first connecting portion (31)
And second connecting portion (33) is integrally formed.
7. loudspeaker mould group according to claim 1, which is characterized in that the module casing includes：Mould group upper casing (11),
Shell (12) and rear cover (13) in mould group；
It is provided with the conductive magnetic yoke (40) on the rear cover (13), connects between the conductive magnetic yoke (40) and the mould group upper casing (11)
It is connected to the conduct piece (30)；
The loudspeaker assembly (20) is arranged in the mould group in shell (12), shell (12) in the rear cover (13) and the mould group
It is fixedly connected.
8. loudspeaker mould group according to claim 7, which is characterized in that be provided with pad on the mould group upper casing (11)
(111), the pad (111) is located at the edge of the mould group upper casing (11), the second connecting portion (33) of the conduct piece (30)
It is connect with the mould group upper casing (11).
9. loudspeaker assembly according to claim 8, which is characterized in that integrated injection molding has gold in the mould group upper casing (11)
Belong to inserts (112), the metal insert (112) is connected by pad (111) and the conduct piece (30).
10. loudspeaker mould group according to claim 8, which is characterized in that the second connecting portion (33) and the mould group
Upper casing (11) is electrically connected by pad (111).
11. loudspeaker mould group according to claim 1, which is characterized in that the conductive magnetic yoke (40) includes being used to form magnetic
The first part of road system and second part outside the loudspeaker assembly is extended to, the second part and the conduct piece
(30) first connecting portion (33) conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810838025.7A CN108848437B (en) | 2018-07-26 | Loudspeaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810838025.7A CN108848437B (en) | 2018-07-26 | Loudspeaker module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108848437A true CN108848437A (en) | 2018-11-20 |
| CN108848437B CN108848437B (en) | 2024-07-12 |
Family
ID=
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182424A (en) * | 2019-12-20 | 2020-05-19 | 歌尔股份有限公司 | Sound production device and electronic terminal |
| WO2021077459A1 (en) * | 2019-10-24 | 2021-04-29 | 瑞声声学科技(深圳)有限公司 | Speaker box and terminal device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1771575A (en) * | 2004-01-27 | 2006-05-10 | 松下电工株式会社 | Micro relay |
| CN1882195A (en) * | 2005-06-07 | 2006-12-20 | 日本电产鸽株式会社 | Speaker |
| CN205283806U (en) * | 2015-12-31 | 2016-06-01 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN205596332U (en) * | 2016-03-28 | 2016-09-21 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN206024101U (en) * | 2016-08-09 | 2017-03-15 | 歌尔股份有限公司 | Loudspeaker module and mobile terminal |
| WO2018040397A1 (en) * | 2016-08-31 | 2018-03-08 | 歌尔股份有限公司 | Moving-coil loudspeaker |
| CN208434105U (en) * | 2018-07-26 | 2019-01-25 | 歌尔股份有限公司 | Loudspeaker mould group |
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1771575A (en) * | 2004-01-27 | 2006-05-10 | 松下电工株式会社 | Micro relay |
| CN1882195A (en) * | 2005-06-07 | 2006-12-20 | 日本电产鸽株式会社 | Speaker |
| CN205283806U (en) * | 2015-12-31 | 2016-06-01 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN205596332U (en) * | 2016-03-28 | 2016-09-21 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN206024101U (en) * | 2016-08-09 | 2017-03-15 | 歌尔股份有限公司 | Loudspeaker module and mobile terminal |
| WO2018040397A1 (en) * | 2016-08-31 | 2018-03-08 | 歌尔股份有限公司 | Moving-coil loudspeaker |
| CN208434105U (en) * | 2018-07-26 | 2019-01-25 | 歌尔股份有限公司 | Loudspeaker mould group |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021077459A1 (en) * | 2019-10-24 | 2021-04-29 | 瑞声声学科技(深圳)有限公司 | Speaker box and terminal device |
| CN111182424A (en) * | 2019-12-20 | 2020-05-19 | 歌尔股份有限公司 | Sound production device and electronic terminal |
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