CN106210199B - Center component and electronic equipment - Google Patents
Center component and electronic equipment Download PDFInfo
- Publication number
- CN106210199B CN106210199B CN201610669074.3A CN201610669074A CN106210199B CN 106210199 B CN106210199 B CN 106210199B CN 201610669074 A CN201610669074 A CN 201610669074A CN 106210199 B CN106210199 B CN 106210199B
- Authority
- CN
- China
- Prior art keywords
- framework
- center
- hole structure
- plastic cement
- transaudient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of center component and electronic equipment, the center component includes framework and conductive transaudient layer, it is offered in the framework for transaudient through-hole structure, the framework is provided with grounded metal region, and the transaudient layer of conduction is filled in the through-hole structure and is electrically connected with the grounded metal region.The present invention is by being arranged conductive transaudient layer in the filling slot in framework, and the transaudient layer of the conduction and the grounded metal region on center component are electrically connected, the electrostatic generated at the through-hole structure near called device assembly is imported into the grounded metal region to realize, has and improves antistatic beneficial effect.
Description
Technical field
The present invention relates to the communications fields, more particularly to a kind of center component and electronic equipment.
Background technique
Currently, mobile phone has been the most frequently used most important electronic equipment of current most users.Because being held in for a long time
On hand, it or is placed in pocket for clothing, is faced with more serious Electro-static Driven Comb problem, therefore all big enterprises have to constantly mention
Rise the ESD standard of oneself.In the total of mobile phone, as the place of the blow-by such as hole, seam, socket, there is anti-ESD is crisp
Weak problem, the outlet sound mouth at earpiece is exactly one of them, if be unable to satisfy without some subsequent artificial measures at all
Consumer actually uses the ESD problem faced when mobile phone.And cell-phone receiver component that is to say headphone, need to pass sound
Be multicast to human ear, thus herein must there are openings, and there are opening can have electrostatic risk.
Therefore, the prior art is defective, needs to improve.
Summary of the invention
The embodiment of the present invention provides a kind of center component and electronic equipment;With solve existing mobile terminal device due to
The problem of electrostatic interference caused by opening is opened up at called device assembly.
The embodiment of the present invention provides a kind of center component, including framework and conductive transaudient layer, offers in the framework
For transaudient through-hole structure, the framework is provided with grounded metal region, and the transaudient layer of conduction is filled in the through-hole knot
It is electrically connected in structure and with the grounded metal region.
In center component of the present invention, the framework includes plastic cement frame and metal center, the through-hole knot
Structure is opened on the plastic cement frame, and the metal center is mounted on the end of the plastic cement scuncheon and the metal center
It protrudes into the through-hole structure, the grounded metal region is located on the metal center.
In center component of the present invention, the through-hole structure includes the filling slot being opened on the plastic cement frame
And be opened in the second gap on the bottom wall of the filling slot, the transaudient layer of conduction be covered in the filling slot and with it is described
The end of metal center is bonded.
In center component of the present invention, the filling slot is rectangular or round rectangle shape, second gap
It is rectangular.
In center component of the present invention, the transaudient layer of conduction is conducting foam.
In center component of the present invention, the conducting foam is aluminium foil cloth foam, conductive fibre fabric foam or plating
Golden cloth foam.
The present invention also provides a kind of electronic equipment, comprising: rear cover, called device assembly, display panel assembly and center group
Part;
The center component includes that framework and conductive transaudient layer, the framework are covered in the open face of the rear cover,
The called device assembly is installed between the framework and the rear cover, area corresponding with the called device assembly in the framework
Domain offers the through-hole structure for being connected to the called device assembly;The display panel assembly is covered in the framework, described
The first gap being connected to the through-hole structure is provided on display panel assembly;The framework is provided with grounded metal region,
The transaudient layer of conduction is filled in the through-hole structure and is electrically connected with the grounded metal region.
In electronic equipment of the present invention, the framework includes plastic cement frame and metal center, the plastic cement side
Frame is installed on the side wall of the rear cover along upper, and the through-hole structure is opened on the plastic cement frame, the metal center installation
It is protruded into the through-hole structure in the end of the plastic cement scuncheon and the metal center, the grounded metal region is located at
On the metal center.
In electronic equipment of the present invention, the through-hole structure includes the filling slot being opened on the plastic cement frame
And it is opened in the second gap on the bottom wall of the filling slot, second gap area is described to the called device assembly
Conductive transaudient layer is covered in the filling slot and is bonded with the end of the metal center.
In electronic equipment of the present invention, the transaudient layer of conduction is conducting foam.
Compared to the prior art, center component of the invention and electronic equipment pass through filling out in the framework of center component
The conductive transaudient layer of setting in slot is filled, and the transaudient layer of the conduction and the grounded metal region on center component are electrically connected, from
And realize and the electrostatic generated at the through-hole structure near called device assembly imported into the grounded metal region have raising anti-
The beneficial effect of electrostatic interference.
Detailed description of the invention
Fig. 1 is the structure chart of a preferred embodiment of center component of the invention;
Fig. 2 is the structure chart of a preferred embodiment of electronic equipment of the invention;
Fig. 3 is the a-quadrant of the electronic equipment in embodiment illustrated in fig. 2 of the invention along the partial sectional view in the direction B.
Specific embodiment
The explanation of following embodiment is to can be used to the particular implementation of implementation to illustrate the present invention with reference to additional schema
Example.The direction term that the present invention is previously mentioned, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outside", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be to illustrate and understand the present invention, rather than to
The limitation present invention.
The similar unit of structure is to be given the same reference numerals in the figure.
Embodiment one
Fig. 1 is please referred to, Fig. 1 is the structural schematic diagram of one preferred embodiment of center component of the invention, the center component 10
Including framework 11 and conductive transaudient layer 12.It is offered in the framework 10 for transaudient through-hole structure 113, the framework 11 setting
There is grounded metal region, conductive transaudient layer 12 is filled in through-hole structure 113 and is electrically connected with grounded metal region.
Specifically, which includes plastic cement frame 111 and metal center 112, which is opened in plastic cement
On frame 111, which is mounted on 111 inside of plastic cement frame and the end of metal center 112 and protrudes into through-hole structure
In 113, grounded metal region is located on metal center 112, and the metal center 112 is entirely exactly the ground connection for ground connection in other words
Metallic region.
In the present embodiment, the generally rectangular shaped shape of metal center 112 or round rectangle shape.The direction of metal center 112
One end of the through-hole structure 113 is formed with a protrusion 1121, which protrudes into the through-hole structure 113.
In the present embodiment, which includes the filling slot 1131 being opened on plastic cement frame 111 and opens up
In the second gap 1132 on the bottom wall of filling slot 1131, conductive transaudient layer 12 be covered in the filling slot 1131 and with metal center
The protrusion 1121 of 112 end is bonded, to be electrically connected with the metal center 112.Wherein, the filling slot 1131 it is rectangular or
Round rectangle shape, second gap 1132 is rectangular, and the length in second gap 1132 and width are respectively smaller than this
The length and width of filling slot 1131.
In the present embodiment, conductive transaudient layer 12 is conducting foam.The conducting foam can be aluminium foil cloth foam, conductive fibre
Tie up cloth foam or gold-plated cloth foam.It, can be in conductive transaudient layer and filling slot for the ease of the fixation of the transaudient layer 12 of the conduction
One layer of layers of two-sided is set between 1131 inner sidewall.
From the foregoing, it will be observed that the present invention is passed by the way that conductive transaudient layer is arranged in the filling slot on center component, and by the conduction
Sound layer is electrically connected with the grounded metal region on center component, so that realizing will be at the through-hole structure near called device assembly
The electrostatic of generation is imported into the grounded metal region, is had and is improved antistatic beneficial effect.
Embodiment two
Referring to Fig. 2 and Fig. 3, Fig. 2 is the structure chart of a preferred embodiment of electronic equipment of the invention, Fig. 3
For the partial sectional view in the region of the A meaning of the electronic equipment in Fig. 2.The electronic equipment can be mobile eventually for mobile phone, IPAD etc.
End.Electronic equipment in this preferred embodiment includes center component 10, display panel assembly 20, rear cover 30 and called device assembly
40。
Wherein, which is covered in the open face of the rear cover 30.Display panel assembly 20 is covered in the center
On component 10.The called device assembly 40 is installed between center component 10 and the rear cover 30.
Specifically, which is the center component 10 in embodiment one.Referring concurrently to Fig. 1, the center component 10
Including framework 11 and conductive transaudient layer 12.Region corresponding with called device assembly 40 is offered for transaudient in the framework 10
Through-hole structure 113, the through-hole structure 113 are connected to the installation region of the called device assembly 40.The framework 11 is provided with ground connection gold
Belong to region, conductive transaudient layer 12 is filled in through-hole structure 113 and is electrically connected with grounded metal region.The framework 11 includes plastic cement
Frame 111 and metal center 112, the through-hole structure 113 are opened on plastic cement frame 111.It opens the inside of the plastic cement frame 111
Equipped with the mounting structure for installing the metal center 112, which is mounted on the inside of the plastic cement frame 111, and
Its end is protruded into the through-hole structure 113.The edge of the metal center 112 is arranged in the mounting structure.The mounting structure can
Think card slot or installation step.Grounded metal region is located on metal center 112, and the metal center 112 is entire just in other words
It is the grounded metal region for ground connection.
In the present embodiment, the generally rectangular shaped shape of metal center 112 or round rectangle shape.It is towards the through-hole structure
113 one end is formed with a protrusion 1121, which protrudes into the through-hole structure 113.
In the present embodiment, which includes the filling slot 1131 being opened on plastic cement frame 111 and opens up
In the second gap 1132 on the bottom wall of filling slot 1131, conductive transaudient layer 12 be covered in the filling slot 1131 and with metal center
The protrusion 1121 of 112 end is bonded, to be electrically connected with the metal center 112.Wherein, the filling slot 1131 it is rectangular or
Round rectangle shape, second gap 1132 is rectangular, and the length in second gap 1132 and width are respectively smaller than this
The length and width of filling slot 1131.
In the present embodiment, conductive transaudient layer 12 is conducting foam.The conducting foam can be aluminium foil cloth foam, conductive fibre
Tie up cloth foam or gold-plated cloth foam.It, can be in conductive transaudient layer 12 and filling slot for the ease of the fixation of the transaudient layer 12 of the conduction
One layer of layers of two-sided is set between 1131 inner sidewall.
When installation, the plastic cement frame 111 of the framework 11 is installed on the side wall of the open face of the rear cover 30 along upper.In the metal
Frame 112 is installed on the inside of the plastic cement frame 111.
The first gap 23 being connected to the filling slot 1131 of the through-hole structure 113 is provided on the display panel assembly 20.
Specifically, in the present embodiment, which includes display area 21 and the outline border positioned at display area surrounding
22.The display area 21 has display layer and touch sensitive layer, which is located at the center component 20 and the touch sense
It answers between layer.First gap 23 is set on the outline border 22.Wherein, which can incude for capacitance touch
Layer, is also possible to resistive touch inductive layer.The display panel assembly 20 further include the driving circuit that is arranged in outline border 22 with
And control circuit.
The called device assembly 40 is used to leak (or high/low suction ring of 3.2 types by ITU standard) condition in voiceless sound
It is lower that audio electrical signal is converted into voice signal, the voice signal is then passed through into second gap 1132, conductive transaudient layer 12
And first gap 23 is transmitted to user and listens to.
It is to be appreciated that being additionally provided with mainboard, CPU, power supply, radio frequency in the rear cover 30 when the electronic equipment is mobile phone
Communication module and GPS module etc. realize basic function of the electronic equipment as a mobile phone by these structures, are existing
There is technology, this will not be repeated here.
From the foregoing, it will be observed that electronic equipment provided in this embodiment is led by being arranged in the filling slot in the framework of center component
Fax sound layer, and the transaudient layer of the conduction and the grounded metal region on center component are electrically connected, so that realizing will be called
The electrostatic generated at through-hole structure near device assembly is imported into the grounded metal region, has raising is antistatic to have
Beneficial effect.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (10)
1. a kind of center component, which is characterized in that including framework and conductive transaudient layer, offer in the framework for transaudient
Through-hole structure, the framework is provided with grounded metal region, the transaudient layer of conduction be filled in the through-hole structure and with
The grounded metal region electrical connection, the framework includes plastic cement frame and metal center, and the through-hole structure is opened in institute
It states on plastic cement frame, the metal center is mounted on the plastic cement scuncheon and described lead to is protruded into the end of the metal center
In pore structure, the side of the transaudient layer of conduction is bonded with the side of the end of the metal center.
2. center component according to claim 1, which is characterized in that the grounded metal region is located at the metal center
On.
3. center component according to claim 2, which is characterized in that the through-hole structure includes being opened in the plastic cement side
Filling slot on frame and the second gap being opened on the bottom wall of the filling slot, the transaudient layer of conduction are covered with the filling
It is bonded in slot and with the end of the metal center.
4. center component according to claim 3, which is characterized in that the filling slot is rectangular or round rectangle shape,
Second gap is rectangular.
5. center component according to claim 1, which is characterized in that the transaudient layer of conduction is conducting foam.
6. center component according to claim 5, which is characterized in that the conducting foam is aluminium foil cloth foam, conductive fibre
Tie up cloth foam or gold-plated cloth foam.
7. a kind of electronic equipment characterized by comprising rear cover, called device assembly, display panel assembly and center component;
The center component includes framework and conductive transaudient layer, and the framework is covered in the open face of the rear cover, described
Called device assembly is installed between the framework and the rear cover, and region corresponding with the called device assembly is opened in the framework
Equipped with the through-hole structure for being connected to the called device assembly;The display panel assembly is covered in the framework, the display
The first gap being connected to the through-hole structure is provided on panel assembly;The framework is provided with grounded metal region, described
Conductive transaudient layer is filled in the through-hole structure and is electrically connected with the grounded metal region.
8. electronic equipment according to claim 7, which is characterized in that the framework includes in plastic cement frame and metal
Frame, the plastic cement frame are installed on the side wall of the rear cover along upper, and the through-hole structure is opened on the plastic cement frame, described
Metal center is mounted on the plastic cement scuncheon and the end of the metal center is protruded into the through-hole structure, the ground connection
Metallic region is located on the metal center.
9. electronic equipment according to claim 8, which is characterized in that the through-hole structure includes being opened in the plastic cement side
Filling slot on frame and the second gap being opened on the bottom wall of the filling slot, second gap area is to described called
Device assembly, the transaudient layer of conduction are covered in the filling slot and are bonded with the end of the metal center.
10. electronic equipment according to claim 9, which is characterized in that the transaudient layer of conduction is conducting foam.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610669074.3A CN106210199B (en) | 2016-08-15 | 2016-08-15 | Center component and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610669074.3A CN106210199B (en) | 2016-08-15 | 2016-08-15 | Center component and electronic equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106210199A CN106210199A (en) | 2016-12-07 |
CN106210199B true CN106210199B (en) | 2019-03-22 |
Family
ID=57522374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610669074.3A Active CN106210199B (en) | 2016-08-15 | 2016-08-15 | Center component and electronic equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106210199B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2729962C1 (en) * | 2019-02-22 | 2020-08-13 | Бейдзин Сяоми Мобайл Софтвэр Ко., Лтд. | Antenna unit and electronic device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107205064B (en) | 2017-05-23 | 2019-11-15 | 维沃移动通信有限公司 | A kind of ground structure and mobile terminal |
CN109219283A (en) * | 2017-07-03 | 2019-01-15 | 北京小米移动软件有限公司 | Electronic equipment |
CN107734086B (en) * | 2017-09-15 | 2020-12-15 | 惠州Tcl移动通信有限公司 | Mobile terminal for reducing interference of supplementary lighting lamp on WIFI signal reception |
CN108023978B (en) * | 2017-11-29 | 2019-10-18 | 维沃移动通信有限公司 | A kind of terminal device |
CN108811285B (en) * | 2018-07-16 | 2021-02-02 | Oppo广东移动通信有限公司 | Electronic device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102548173A (en) * | 2012-01-30 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Electrostatic discharge protection method and mobile terminal |
CN204669414U (en) * | 2015-04-27 | 2015-09-23 | 闻泰通讯股份有限公司 | A kind of Anti-static cell phone |
CN205071521U (en) * | 2015-07-03 | 2016-03-02 | 上海与德通讯技术有限公司 | Electronic equipment and shells assembly thereof |
CN105430123A (en) * | 2015-10-27 | 2016-03-23 | 惠州Tcl移动通信有限公司 | Display module and mobile terminal with display module |
US9369165B1 (en) * | 2014-06-13 | 2016-06-14 | Amazon Technologies, Inc. | Mitigating desense in collocated speaker and antenna system |
-
2016
- 2016-08-15 CN CN201610669074.3A patent/CN106210199B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102548173A (en) * | 2012-01-30 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Electrostatic discharge protection method and mobile terminal |
US9369165B1 (en) * | 2014-06-13 | 2016-06-14 | Amazon Technologies, Inc. | Mitigating desense in collocated speaker and antenna system |
CN204669414U (en) * | 2015-04-27 | 2015-09-23 | 闻泰通讯股份有限公司 | A kind of Anti-static cell phone |
CN205071521U (en) * | 2015-07-03 | 2016-03-02 | 上海与德通讯技术有限公司 | Electronic equipment and shells assembly thereof |
CN105430123A (en) * | 2015-10-27 | 2016-03-23 | 惠州Tcl移动通信有限公司 | Display module and mobile terminal with display module |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2729962C1 (en) * | 2019-02-22 | 2020-08-13 | Бейдзин Сяоми Мобайл Софтвэр Ко., Лтд. | Antenna unit and electronic device |
Also Published As
Publication number | Publication date |
---|---|
CN106210199A (en) | 2016-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106210199B (en) | Center component and electronic equipment | |
CN203289422U (en) | Portable terminal | |
CN107403995B (en) | Electronic device | |
US8428285B2 (en) | Microphone screen with common mode interference reduction | |
WO2018113157A1 (en) | Support, functional device and terminal equipment | |
US9960489B2 (en) | Electronic device and method of operating the same | |
CN105898980A (en) | Electromagnetic Shield Structure For Electronic Device and Electronic Device | |
WO2016072667A1 (en) | Antenna apparatus and electronic device having the same | |
EP3024090A1 (en) | Antenna and electronic device including the same | |
KR102229382B1 (en) | Electronic device and operating method with the same | |
CN108736134B (en) | Antenna assembly and electronic equipment | |
US10129966B2 (en) | Backlight module, display device and method for manufacturing the display device | |
US11582863B2 (en) | Circuit board component and terminal | |
CN112291394A (en) | Electronic device | |
KR20180015737A (en) | User equipment | |
CN106254592A (en) | A kind of mobile terminal | |
CN109391871A (en) | A kind of bluetooth headset | |
US8000738B2 (en) | Mobile terminal with leakage current prevention | |
CN107948353A (en) | Electronic device and electronic equipment | |
CN208271542U (en) | Special-shaped display screen body, display screen and electronic equipment | |
US20080107288A1 (en) | Microphone | |
CN102143667B (en) | Electronic device | |
CN207011213U (en) | A kind of shielded box | |
CN110072331A (en) | A kind of bonding structure and terminal device | |
CN108848437A (en) | Loudspeaker mould group |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong Applicant before: Guangdong OPPO Mobile Communications Co., Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |