CN209057366U - A kind of electric connection structure and electronic equipment of sensor - Google Patents
A kind of electric connection structure and electronic equipment of sensor Download PDFInfo
- Publication number
- CN209057366U CN209057366U CN201822167468.6U CN201822167468U CN209057366U CN 209057366 U CN209057366 U CN 209057366U CN 201822167468 U CN201822167468 U CN 201822167468U CN 209057366 U CN209057366 U CN 209057366U
- Authority
- CN
- China
- Prior art keywords
- sensor
- electric connection
- connection structure
- nip portion
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 10
- 230000005611 electricity Effects 0.000 claims description 4
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 13
- 238000010992 reflux Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 239000006071 cream Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model relates to a kind of electric connection structure of sensor and electronic equipments.The electric connection structure of the sensor includes sensor-packaging structure and electrical connector；Wherein, the sensor-packaging structure includes the external structure surrounded by circuit board and shell, contains sensor chip in the external structure；Being located at the position on the outside of external structure on the circuit board has for external pad；The supporting part that the electrical connector includes main part, is extended outward from main part, and the nip portion being hinged on main part；The nip portion is configured as deflecting toward the direction of supporting part, to form grasping part with supporting part；The conductive part for exposing grasping part is provided on the supporting part；The conductive part is connected together with the pad of sensor-packaging structure.One of the utility model, which has the technical effect that, changes the original electric connection structure of sensor chip, avoids the techniques such as reflux, reduces influence of the assembling process bring to sensor.
Description
Technical field
The present invention relates to electroacoustic techniques fields, more particularly it relates to the electric connection structure and electricity of a kind of sensor
Sub- equipment.
Background technique
In recent years, with the fast development of electronics technology, electronic product is more and more widely used.People are to electricity
Sub- product proposes lightening requirement, and it is smaller and smaller that this requires electronic product to the size of its inner components, especially
It is smaller and smaller to be that size in a thickness direction requires.
Microphone is more one of the ost important components in electronic equipment.Nowadays, take measurements greatly smaller, the preferable MEMS of quality
Microphone has obtained paying attention to developing with faster, and application is also more and more extensive.For example, MEMS microphone can be applied to intelligence
In the electronic equipment of all polymorphic types such as mobile phone, IPAD, laptop and smartwatch.
For the prior art, traditional MEMS microphone and soft board connecting portion be typically designed product the face top or
On the face person bottom.Specifically: usually microphone route being conducted on soft board by tin cream welding procedure.In fact,
In order to realize the conducting of route, it usually needs a series of process such as tin, attachment, reflux in process, and reflux course therein
It needs to carry out at high temperature, and high temperature can adversely affect the performance of MEMS microphone.Also, in the prior art usually
Also need to open up the acoustic aperture structure for microphone chip on soft board, and this can increase answering for processing technology to a certain extent
Miscellaneous journey.In addition, when being assembled into electronic equipment, welding to be formed based on tin cream for traditional MEMS microphone
Height and soft board itself the factors such as height, will cause electronic equipment can not be thinned in thickness direction.The electricity formed in this way
Sub- equipment does not meet people's requirement lightening for electronic equipment.
It can be seen that it is necessary to a kind of new solution of the electric connection structure of sensor is proposed, to solve existing skill
At least one problem present in art.
Summary of the invention
It is an object of the present invention to provide a kind of new solutions of the electric connection structure of sensor.
According to the first aspect of the invention, a kind of electric connection structure of sensor is provided, comprising:
Sensor-packaging structure, the sensor-packaging structure include the external structure surrounded by circuit board and shell, institute
It states and contains sensor chip in external structure；Being located at the position on the outside of external structure on the circuit board has for external weldering
Disk；
Electrical connector, the electrical connector includes main part, the supporting part that extends outward from main part, and is hinged on master
Nip portion in body portion；The nip portion is configured as deflecting toward the direction of supporting part, to form grasping part with supporting part；Institute
State the conductive part for being provided on supporting part and exposing grasping part；The conductive part is connected with the pad of sensor-packaging structure one
It rises.
Optionally, the supporting part, nip portion are located at the same side of main part, and the two is oppositely arranged.
Optionally, the conductive part extends in main part from supporting part；It is additionally provided on the main part by part
The notch that conductive part exposes；The conductive part is from the part that notch exposes together with the pad solder.
Optionally, the electrical connector further includes the framework for being fixed on main part and being located at nip portion periphery；The pressure
Conjunction portion is configured as when it is in stitching state, and the end face outside of the nip portion is flushed with the end face outside of the framework,
Or the end face outside lower than the framework.
Optionally, the nip portion is configured as when in stitching state, the free end of nip portion and the inside of framework
Wall tightly fits in together.
Optionally, the nip portion is provided with flange adjacent to the side of the conductive part.
Optionally, the sensor chip is the microphone chip of installation on circuit boards；It further include being mounted on circuit board
On asic chip；The microphone chip, asic chip are connected with circuit board；It is provided with described in connection in the external structure
The acoustic aperture of microphone chip.
Optionally, the acoustic aperture is arranged on circuit boards, and electrical connector setting is identical as shell on circuit boards
Side.
According to the second aspect of the invention, a kind of electronic equipment, including mainboard and any of the above-described kind of biography are provided
The electric connection structure of sensor；Inserted terminal on the mainboard is clamped in grasping part by nip portion, and is connected with conductive part.
Optionally, the mainboard is FPCB plate.
The electric connection structure of sensor provided in an embodiment of the present invention changes the original binding that is electrically connected of sensor chip
Structure welds during electrical connection without tin cream, it is convenient to omit reflux assembling process, so as to reduce reflow process high temperature
Influence to the performance of sensor chip.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
The attached drawing for constituting part of specification describes the embodiment of the present invention, and together with the description for solving
Release the principle of the present invention.
Fig. 1 is the structural schematic diagram of the electric connection structure of sensor provided in an embodiment of the present invention.
Fig. 2 is the top view of the electric connection structure of sensor provided in an embodiment of the present invention.
Fig. 3 is the structural schematic diagram of electrical connector provided in an embodiment of the present invention.
Fig. 4 is the structural schematic diagram of mainboard provided in an embodiment of the present invention.
Fig. 5 is the electric connection structure of sensor provided in an embodiment of the present invention and the structural schematic diagram of mainboard connecting portion.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology and equipment known to person of ordinary skill in the relevant may be not discussed in detail, but in appropriate situation
Under, the technology and equipment should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
With reference to Fig. 1, the present invention provides a kind of electric connection structures of sensor comprising sensor-packaging structure.The biography
Sensor encapsulating structure includes: circuit board 1, shell 2 and sensor chip, wherein sensor chip is located at by circuit board 1, outside
In the inner cavity that shell 2 surrounds.
Wherein, sensor of the invention chip can be microphone chip 3, preferably MEMS microphone chip.Certainly,
It can be MEMS environmental sensor chip, such as: mems accelerometer chip, MEMS gyroscope chip, MEMS pressure sensor
Chip etc., the present invention are without limitation.
For ease of description, below by taking the electric connection structure of MEMS microphone as an example, technology contents of the invention are carried out
Description in detail.
Shell 2 and circuit board 1 of the invention mounts together, forms the external structure with inner cavity.Optionally, shell
2 pass through together with conductive adhesive between circuit board 1；Either, using the side of tin cream welding between shell 2 and circuit board 1
Formula is combined together.Certainly, the combination of shell 2 and circuit board 1 can also use other connection types well known in the art,
Such as: shell 2 and circuit board 1 can be combined together using fastener, the present invention is without limitation.
Wherein, with reference to Fig. 1, shell 2 may include the top opposite with circuit board 1, and from top edge and phase
Sidewall portion vertically extending for top.Sidewall portion and top define semi-surrounding structure, and circuit board 1 is fixed on opening for shell 2
Mouth end position, the two together form the external structure with inner cavity.
The electric connection structure of sensor of the invention, with reference to Fig. 1, be provided on the circuit card 1 microphone chip 3 and
Asic chip 4.Wherein, microphone chip 3, asic chip 4 and circuit board 1 are connected.It is outer being formed by shell 2 and circuit board 1
The acoustic aperture 7 of connection microphone chip 3 is provided in portion's structure.Such as the position of microphone chip 3 can be corresponded on the circuit card 1
It is provided with acoustic aperture 7, so as to sound entrance.Wherein, microphone chip 3 is the transducer part for converting voice signal to electric signal,
The microphone chip 3 is made using MEMS (MEMS) technique.Microphone chip 3 links together with asic chip 4, makes
The electric signal that exports of microphone chip 3 can be for transmission in asic chip 4, and by the processing of asic chip 4, output.
Wherein, it can be connected by gold thread between microphone chip 3 and asic chip 4, it can also be by circuit board 1
Circuit layout conducting, this belongs to the common knowledge of those skilled in the art, no longer illustrates herein.
The electric connection structure of sensor of the invention is located at outside external structure on its circuit board 1 with reference to Fig. 1 and Fig. 2
The position of side has for external pad 8.Wherein, pad 8 can be set one, also can be set multiple.In fact, weldering
The quantity of disk 8 flexible setting, the present invention can be not specifically limited this according to actual needs.
Also, the electric connection structure of sensor of the invention further includes electrical connector 5.With reference to Fig. 1 and Fig. 3, this is electrically connected
The structure of fitting 5 are as follows: including main part 50, the supporting part 52 extended outward from main part 50, and be hinged on main part 50
Nip portion 51.Wherein, nip portion 51 is configured as: be capable of toward supporting part 52 direction generate deflection, with 52 shape of supporting part
At grasping part 55.The conductive part 53 for exposing grasping part 55 is provided on supporting part 52.Conductive part 53 and sensor encapsulate
The conducting of pad 8 of structure is together.That is: the pad 8 being arranged on the circuit card 1 can be used for external electrical connector 5.Specifically
For: the electrical connector 5 of special construction is used in the present invention to realize the conducting of route.Compared with traditional tin cream welding,
The electric connection structure of sensor of the invention changes traditional electric connection mode.Due to there is no to weld this side using tin cream
Formula can save reflow process, avoid influence of the reflux high temperature to the performance of sensor chip, be conducive to protection sensor core
Piece.
With reference to Fig. 1, electrical connector 5 of the invention, supporting part 52 therein, nip portion 51 are located at the same of main part 50
Side, and the two is in be oppositely arranged.Wherein, nip portion 51 can generate deflection to the direction of supporting part 52, can thus make
Grasping part 55 is formed between nip portion 51 and supporting part 52.This is designed to facilitate assembles sensing of the invention in the electronic device
The electric connection structure of device.
With reference to Fig. 3, electrical connector of the invention, specifically: conductive part 53 extends in main part 50 from supporting part 52,
And the notch 57 for exposing partially electronically conductive portion 53 is additionally provided on main part 50.Conductive part 53 from the part that notch 57 exposes with
Pad 8 on circuit board 1 welds together.To realize the conducting of route.Wherein, notch 57 mainly for make conductive part 53 reveal
Out, in order to which conductive part 53 and pad 8 weld.Wherein, notch 57 can be set one, and works as and be provided with a notch 57
When, it can be by the larger of the size design of the notch 57, in order to the welding of multiple pads 8 and multiple conductive parts 53.Notch
57 also can be set multiple, and each pad 8 passes through a notch 57 and the welding of conductive part 53.Certainly, the shape of notch 57
Shape, quantity etc. can be adjusted according to the actual conditions of pad 8 on circuit board 1, and the present invention is without limitation.
Electrical connector 5 of the invention further includes being fixed on main part 50 and being located at 51 periphery of nip portion with reference to Fig. 3
Framework 54.Nip portion 51 is configured as: when nip portion 51 is in stitching state, end face outside and the framework 54 of nip portion 51
End face outside flushes, or lower than the end face outside of framework 54.
Further, above-mentioned nip portion 51 is configured as: when nip portion 51 is in stitching state, the freedom of nip portion 51
It holds and is tightly fitted in together with the inner sidewall of framework 54.Framework 54 is combined together with nip portion 51, for that will protrude into grasping part
Object in 55 clamps.
Also, Fig. 3 is referred to, electrical connector 5 of the invention is provided in its nip portion 51 adjacent to the side of conductive part 53 convex
Edge 56.Optionally, flange 56 can be arc-shaped, prismatic table shape or other shapes well known in the art, the present invention do not do this
Limitation.
The electric connection structure of sensor of the invention, with reference to Fig. 1 and Fig. 5, on the circuit card 1 by the setting of electrical connector 5
Side identical with shell 2.The design may be implemented that electrical connector 5 can also be mounted, very while mounting shell 2
It is convenient.Moreover, pad 8 is located at the upside of circuit board 1, and acoustic aperture 7 is then towards the lower side of circuit board 1 with reference to the view direction of Fig. 1
To.The structure can form a kind of design of Top type.The design structure of this Top type compared with traditional Top type structure,
Considerably increase the back chamber volume of MEMS microphone.Wherein, the vibrating diaphragm of microphone to the region of enclosure space is MEMS Mike
The back chamber of wind.The design in the present invention effectively raises the acoustical behavior of MEMS microphone.
The electric connection structure of sensor provided by the invention can be applied to smart phone, smartwatch, IPAD, notebook
In the various electronic well known in the art such as computer, the present invention is without limitation.By the electrical connection of sensor of the invention
When Standard is in electronic equipment, it is simple, quick to have the advantages that assembly method, and does not interfere with the performance of itself.
On the other hand, the embodiment of the invention also provides a kind of electronic equipment, with reference to Fig. 4 and Fig. 5, including mainboard 6, with
And the electric connection structure of any of the above-described kind of sensor.
Wherein, with reference to Fig. 4, inserted terminal 9 is provided on mainboard 6.When by mainboard 6 in conjunction with the electric connection structure of sensor,
Concrete mode are as follows: the inserted terminal 9 on mainboard 6 is clamped in grasping part 55 by nip portion 51, and is connected with conductive part 53.This sets
The connection of the inserting between mainboard 6 and the electric connection structure of sensor may be implemented in meter.That is, not having in the present invention using traditional tin
Cream welding manner can save the reflux assembling process of microphone, so as to so that assembled microphone has good sound
Learn performance.
With reference to Fig. 5, the electric connection structure of mainboard 6 of the invention and sensor is arranged in the horizontal direction.This design can
Effectively to lower the height of product, conducive to the lightening of product is realized.
In addition, mainboard 6 of the invention can use FPCB plate.It is of course also possible to use other flexibilities well known in the art
Circuit board, the present invention are without limitation.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that above example merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (10)
1. a kind of electric connection structure of sensor characterized by comprising
Sensor-packaging structure, the sensor-packaging structure include the external structure surrounded by circuit board and shell, described outer
Sensor chip is contained in portion's structure；Being located at the position on the outside of external structure on the circuit board has for external pad；
Electrical connector, the electrical connector includes main part, the supporting part that extends outward from main part, and is hinged on main part
On nip portion；The nip portion is configured as deflecting toward the direction of supporting part, to form grasping part with supporting part；It is described to hold
The conductive part for exposing grasping part is provided in load portion；The conductive part is connected together with the pad of sensor-packaging structure.
2. the electric connection structure of sensor according to claim 1, which is characterized in that the supporting part, nip portion difference
Positioned at the same side of main part, and the two is oppositely arranged.
3. the electric connection structure of sensor according to claim 1, which is characterized in that the conductive part extends from supporting part
Into main part；The notch for exposing partially electronically conductive portion is additionally provided on the main part；The conductive part exposes from notch
Part together with the pad solder.
4. the electric connection structure of sensor according to claim 1, which is characterized in that the electrical connector further includes fixing
Framework on main part and positioned at nip portion periphery；The nip portion is configured as when it is in stitching state, the pressure
The end face outside in conjunction portion is flushed with the end face outside of the framework, or lower than the end face outside of the framework.
5. the electric connection structure of sensor according to claim 4, which is characterized in that the nip portion is configured as when place
When stitching state, the free end of nip portion and the inner sidewall of framework are tightly fitted in together.
6. the electric connection structure of sensor according to claim 1, which is characterized in that the nip portion is adjacent to the conduction
The side in portion is provided with flange.
7. the electric connection structure of sensor according to claim 1, which is characterized in that the sensor chip is to be mounted on
Microphone chip on circuit board；It further include the asic chip of installation on circuit boards；The microphone chip, asic chip with
Circuit board conducting；The acoustic aperture for being connected to the microphone chip is provided in the external structure.
8. the electric connection structure of sensor according to claim 7, which is characterized in that the acoustic aperture is arranged in circuit board
On, and side identical with shell on circuit boards is arranged in the electrical connector.
9. a kind of electronic equipment, which is characterized in that the electricity of sensor including mainboard and as described in any one of claim 1 to 8
Connection structure；Inserted terminal on the mainboard is clamped in grasping part by nip portion, and is connected with conductive part.
10. electronic equipment according to claim 9, which is characterized in that the mainboard is FPCB plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822167468.6U CN209057366U (en) | 2018-12-21 | 2018-12-21 | A kind of electric connection structure and electronic equipment of sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822167468.6U CN209057366U (en) | 2018-12-21 | 2018-12-21 | A kind of electric connection structure and electronic equipment of sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209057366U true CN209057366U (en) | 2019-07-02 |
Family
ID=67055273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822167468.6U Withdrawn - After Issue CN209057366U (en) | 2018-12-21 | 2018-12-21 | A kind of electric connection structure and electronic equipment of sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209057366U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462807A (en) * | 2018-12-21 | 2019-03-12 | 歌尔股份有限公司 | A kind of electric connection structure and electronic equipment of sensor |
-
2018
- 2018-12-21 CN CN201822167468.6U patent/CN209057366U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462807A (en) * | 2018-12-21 | 2019-03-12 | 歌尔股份有限公司 | A kind of electric connection structure and electronic equipment of sensor |
| CN109462807B (en) * | 2018-12-21 | 2024-03-15 | 潍坊歌尔微电子有限公司 | Electric connection structure and electronic equipment of sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190335257A1 (en) | Speaker module | |
| CN210781318U (en) | Sound generator | |
| CN113411731A (en) | Bone voiceprint sensor and electronic equipment | |
| US20180098157A1 (en) | Speaker device | |
| CN111988711B (en) | Speaker monomer and electronic terminal | |
| CN209057366U (en) | A kind of electric connection structure and electronic equipment of sensor | |
| CN208462041U (en) | Sounding device and electronic equipment | |
| CN209526835U (en) | A kind of encapsulating structure of microphone and environmental sensor | |
| WO2019000579A1 (en) | Microspeaker and method for assembling same | |
| CN108882129B (en) | Circuit board, loudspeaker, electronic equipment and polarization compensation method | |
| CN109462807A (en) | A kind of electric connection structure and electronic equipment of sensor | |
| CN206948600U (en) | A kind of electroacoustic transducer and electronic equipment | |
| WO2024061027A1 (en) | Transducer and electronic device | |
| CN101227766B (en) | Moving-coil type electro-acoustic conversing device | |
| CN210093521U (en) | Loudspeaker box | |
| CN209057367U (en) | A kind of encapsulating structure and electronic equipment of sensor chip | |
| CN109068250B (en) | Microphone and electronic equipment | |
| CN209017321U (en) | MEMS microphone and electronic equipment | |
| CN108024183B (en) | Elastic sheet pin device and sound production device | |
| CN207283808U (en) | A kind of highly sensitive silicon microphone | |
| CN114268888B (en) | Sound producing device and electronic equipment | |
| CN201204675Y (en) | FPC connection type electro-acoustic transducer | |
| CN205754730U (en) | A kind of encapsulating structure of mike | |
| CN209882095U (en) | Testing device for screening whether silicon microphone is waterproof or not | |
| CN210807650U (en) | Waterproof dustproof antivibration silicon material microphone |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200619 Address after: 261031 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Patentee after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190702 Effective date of abandoning: 20240315 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20190702 Effective date of abandoning: 20240315 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |