CN108831764B - Preparation method of low-noise film capacitor - Google Patents
Preparation method of low-noise film capacitor Download PDFInfo
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- CN108831764B CN108831764B CN201810522226.6A CN201810522226A CN108831764B CN 108831764 B CN108831764 B CN 108831764B CN 201810522226 A CN201810522226 A CN 201810522226A CN 108831764 B CN108831764 B CN 108831764B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 75
- 239000011104 metalized film Substances 0.000 claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 14
- 150000008064 anhydrides Chemical class 0.000 claims description 13
- 238000007731 hot pressing Methods 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000010409 ironing Methods 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000013101 initial test Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/04—Drying; Impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention belongs to the technical field of metallized capacitor production, and particularly relates to a preparation method of a low-noise film capacitor. According to the preparation method of the low-noise film capacitor, the prepared low-noise film capacitor keeps the original electrical characteristics, and meanwhile, the decibel of a noise test is less than 25dB, so that the noise decibel requirement of smart homes is met.
Description
Technical Field
The invention belongs to the technical field of metallized capacitor production, and particularly relates to a preparation method of a low-noise film capacitor.
Background
Along with the continuous development of intelligent house illumination, the requirement of market to the dimming lamp silence is more and more high, and the dimming lamp is especially when using at night, and the problem of noise is changeed prominently and is shown, consequently has proposed the demand of ultralow noise to the LED dimming lamp that intelligent house used. The noise requirement of the existing intelligent home on the lighting lamp is less than or equal to 30dB, and the requirement can not meet the market requirement at present, so that the LED dimming lamp provides the 25dB ultra-low noise requirement, and the noise decibel of the LED dimming lamp is directly influenced by the film capacitors of PFC and DC-LINK in the circuit of the LED dimming lamp. However, the noise of the capacitor in the existing LED dimming lamp circuit often exceeds 25dB and is close to 30dB, and the noise requirement of the intelligent home on the lighting lamp is difficult to meet.
Disclosure of Invention
The invention aims to: aiming at the existing problems, the preparation method of the low-noise film capacitor is provided, the prepared low-noise film capacitor keeps the original electrical characteristics, and meanwhile, the decibel of a noise test is less than 25dB, so that the noise decibel requirement of the smart home is met.
In order to achieve the purpose, the invention adopts the technical scheme that: the invention discloses a preparation method of a low-noise film capacitor, which comprises the following steps:
s1), winding two sheets of metallized film to form a film roll;
s2), hot-pressing the film roll, wherein the hot-pressing temperature is 135 ℃, and the hot-pressing time is 270 and 600S; carrying out heat treatment on the hot-pressed film roll, wherein the heat treatment temperature is 140 ℃, and the heat treatment time is 8.5 h; naturally cooling the film roll after heat treatment to normal temperature;
s3), spraying gold on both ends of the film roll obtained after the processing of the step S2) respectively;
s4), deburring the two ends of the film roll obtained after the processing of the step S3), and welding leads at the two ends of the film roll respectively;
s5), ironing the side surface of the outermost layer of the film roll obtained after the treatment of the step S4);
s6), coating silicone oil on the lead wire of the film roll obtained after the treatment of the step S5); soaking the film roll in the modified anhydride epoxy resin and then curing, wherein the vacuum degree of the film roll is less than or equal to-0.092 MPa;
s7), coating a layer of flexible epoxy powder on the surface of the modified anhydride epoxy resin cured in the step S6), and then mechanically repairing and curing to obtain the product.
Further, both sides of the metallized film are subjected to plasma treatment before step S1).
Further, the thickness of the coated epoxy powder in step S7) is greater than or equal to 0.5 mm.
Due to the adoption of the technical scheme, the invention has the beneficial effects that:
the preparation method of the low-noise film capacitor adopts the hot-pressing temperature of 135 ℃ to ensure that two metallized films of a film roll are jointed; carrying out heat treatment on the film coil subjected to hot pressing at the temperature of 140 ℃ for 8.5h, and then naturally cooling the film coil subjected to heat treatment to normal temperature, so that the stress of the film coil subjected to hot pressing can be eliminated, and the film coil is slowly cooled to ensure that the shape of the film coil is stable; the noise of the prepared low-noise film capacitor is reduced when the film capacitor works. When the film roll is soaked in the modified anhydride epoxy resin, the vacuum degree of the film roll is less than or equal to-0.092 MPa, air in the film roll is removed as much as possible, the epoxy resin is fully filled, and the air gap of the film layer is reduced. The surface of the cured modified anhydride epoxy resin is coated with a layer of flexible epoxy powder, so that the effect of absorbing noise is achieved. Finally, when the low-noise film capacitor prepared by the preparation method of the low-noise film capacitor takes the sine waveform peak position as the initial test point, the noise is less than 25dB, and the voltage change at the position is fastest, and the amplitude is most obvious, so that the prepared low-noise film capacitor meets the requirement of a capacitor in an LED dimming lamp circuit on the noise.
Drawings
FIG. 1 is a flow chart of a method of making a low noise film capacitor of the present invention;
FIG. 2 is a schematic structural diagram of a low noise film capacitor prepared according to the present invention;
FIG. 3 is a sectional view taken along the line A-A of a low noise film capacitor according to the present invention;
FIG. 4 is a schematic view of a two-sheet metallized film cross-laminated structure of the present invention;
reference numerals:
10-epoxy powder outer layer, 11-lead, 12-modified anhydride epoxy resin layer, 13-film roll, 130-conductive metal layer, 131 b-first metallized film, 131 c-second metallized film.
Detailed Description
The present invention is further described in detail below with reference to the attached drawings so that those skilled in the art can implement the invention by referring to the description text.
As shown in fig. 1, the present invention provides a method for manufacturing a low noise film capacitor, comprising the steps of:
s0), carrying out double-sided plasma treatment on the metallized film, wherein on one hand, salient points on two sides of the metallized film are knocked off, and on the other hand, the two sides of the metallized film are not too smooth, so that two films in the low-noise film capacitor can be fully adhered, and the noise decibel of the low-noise film capacitor is reduced; the junction insulating film of the metallized film is a polyester film;
s1), performing offset stacking of the first metallized film 131b and the second metallized film 131c as shown in fig. 4, and winding the offset stacked first metallized film 131b and second metallized film 131c to form the film roll 13, wherein the protruding end of the first metallized film 131b serves as a first lead end of the film roll 13, and the protruding end of the second metallized film 131c serves as a second lead end of the film roll 13;
s2), hot-pressing the film roll 13 at 135 ℃ for 600S to attach the first metallized film 131b and the second metallized film 131 c; carrying out heat treatment on the hot-pressed film roll 13, wherein the heat treatment temperature is 140 ℃, and the heat treatment time is 8.5 h; naturally cooling the film roll 13 after heat treatment to normal temperature, fully eliminating stress after hot pressing, and slowly cooling to ensure that the shape is stable; and then masking the first lead terminal and the second lead terminal of the film roll 13 after natural cooling, so as to prevent dust in a production workshop from attaching to the first lead terminal or the second lead terminal.
S3), respectively spraying gold on the first lead end and the second lead end of the film roll 13 obtained after the processing of the step S2) and forming conductive metal layers;
s4), deburring the film roll 13 and the conductive metal layer thereof obtained after the processing of the step S3), and welding the leads 11 on the conductive metal layers at the two ends of the film roll 13 respectively, wherein the leads 11 are made of tin-plated copper-clad steel;
s5), ironing and flying the side surface of the outermost layer of the film roll 13 obtained after the treatment of the step S4) so as to level the wrinkles or the irregularities on the polyester film of the outermost layer of the film roll 13;
s6), coating silicone oil on the lead 11 of the film roll 13 obtained after the processing of the step S5), namely, a silicone coating process; dipping the film roll 13 in the modified anhydride epoxy resin and then curing, wherein the vacuum degree of dipping the film roll 13 is less than or equal to-0.092 MPa; when the film roll 13 is soaked in the modified anhydride epoxy resin, the vacuum degree of the soaking of the film roll 13 is less than or equal to-0.092 MPa, a modified anhydride epoxy resin layer 12 is formed, air in the film roll 13 is removed as much as possible, the epoxy resin is fully filled, and an air gap of a film layer is reduced; the type of the modified anhydride epoxy resin is FC-505A-2/FC-505B-2(HF) epoxy resin produced by Dongguan blisk electronic technology Co., Ltd;
s7), coating a layer of flexible epoxy powder on the surface of the modified anhydride epoxy resin cured in the step S6) to form an outer epoxy powder layer 10, wherein in the embodiment, the cured modified anhydride epoxy resin can be in a shape of a cuboid ring, and the outer epoxy powder layer is also in a shape of a cuboid ring; the thickness of the coated epoxy powder is greater than or equal to 0.5mm, so that the appearance and the insulating property of the capacitor are well ensured, and meanwhile, the flexible material can play a very good vibration buffering role; then, mechanically repairing and curing, namely polishing the outer wall of the capacitor to obtain a product;
s8), printing characters on the surface of the product, performing external inspection, tearing, sorting, collecting, packaging and the like to form the final product.
The product is detected, and the withstand voltage test is more than 1.4 UR; the durability is measured at 85 ℃, the working voltage is 1.25UR, the lamp can continuously work for 1000h, and the capacitance attenuation is less than 10 percent of the lamp energy; when the noise is tested by taking the peak position of the sine waveform as the initial point of the test, the noise is less than 25 dB. UR is the rated voltage.
While embodiments of the invention have been described above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (3)
1. A preparation method of a low-noise film capacitor is characterized by comprising the following steps:
s1), winding two sheets of metallized film to form a film roll;
s2), hot-pressing the film roll, wherein the hot-pressing temperature is 135 ℃, and the hot-pressing time is 270 and 600S; carrying out heat treatment on the hot-pressed film roll, wherein the heat treatment temperature is 140 ℃, and the heat treatment time is 8.5 h; naturally cooling the film roll after heat treatment to normal temperature;
s3), spraying gold on both ends of the film roll obtained after the processing of the step S2) respectively;
s4), deburring the two ends of the film roll obtained after the processing of the step S3), and welding leads at the two ends of the film roll respectively;
s5), ironing the side surface of the outermost layer of the film roll obtained after the treatment of the step S4);
s6), coating silicone oil on the lead wire of the film roll obtained after the treatment of the step S5); soaking the film roll in the modified anhydride epoxy resin and then curing, wherein the vacuum degree of the film roll is less than or equal to-0.092 MPa;
s7), coating a layer of flexible epoxy powder on the surface of the modified anhydride epoxy resin cured in the step S6), and then mechanically repairing and curing to obtain the product.
2. The method of manufacturing a low-noise film capacitor as claimed in claim 1, wherein both sides of the metallized film are plasma-treated before step S1).
3. The method of manufacturing a low noise film capacitor as claimed in claim 1, wherein the thickness of the coated epoxy powder in the step S7) is 0.5mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810522226.6A CN108831764B (en) | 2018-05-28 | 2018-05-28 | Preparation method of low-noise film capacitor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810522226.6A CN108831764B (en) | 2018-05-28 | 2018-05-28 | Preparation method of low-noise film capacitor |
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| CN108831764A CN108831764A (en) | 2018-11-16 |
| CN108831764B true CN108831764B (en) | 2020-03-24 |
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| CN114121488B (en) * | 2021-10-29 | 2024-04-05 | 安徽赛福电容有限公司 | Metallized film, method and apparatus for manufacturing the same, and capacitor |
| CN115616295B (en) * | 2022-12-15 | 2023-03-21 | 四川中星电子有限责任公司 | Capacitor capacity detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101399118B (en) * | 2007-09-30 | 2010-12-08 | 扬州高强电子有限公司 | Technique for processing non-inductive organic film capacitor |
| CN102938317B (en) * | 2011-08-16 | 2016-03-30 | 深圳塑镕电容器有限公司 | The manufacture method of low-noise capacitor and low-noise capacitor |
| CN102426919A (en) * | 2011-08-17 | 2012-04-25 | 六和电子（江西）有限公司 | Production process for low-noise metallic film capacitor |
| CN204991479U (en) * | 2015-09-30 | 2016-01-20 | 四川中星电子有限责任公司 | Coiling formula SMD metallization polyester film condenser |
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