CN106409507A - Thin-film capacitor for high-temperature-resistant and high-humidity-resistant application and processing method thereof - Google Patents
Thin-film capacitor for high-temperature-resistant and high-humidity-resistant application and processing method thereof Download PDFInfo
- Publication number
- CN106409507A CN106409507A CN201610911625.2A CN201610911625A CN106409507A CN 106409507 A CN106409507 A CN 106409507A CN 201610911625 A CN201610911625 A CN 201610911625A CN 106409507 A CN106409507 A CN 106409507A
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- CN
- China
- Prior art keywords
- film capacitor
- capacitor
- thin film
- humidity
- thin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims abstract description 59
- 239000010409 thin film Substances 0.000 title claims abstract description 36
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000005516 engineering process Methods 0.000 claims abstract description 15
- 239000010408 film Substances 0.000 claims abstract description 12
- 238000004382 potting Methods 0.000 claims abstract description 12
- 238000001704 evaporation Methods 0.000 claims abstract description 9
- 230000008020 evaporation Effects 0.000 claims abstract description 9
- 239000004743 Polypropylene Substances 0.000 claims abstract description 8
- -1 polypropylene Polymers 0.000 claims abstract description 8
- 229920001155 polypropylene Polymers 0.000 claims abstract description 8
- 238000009998 heat setting Methods 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229920006644 PBT+PC Polymers 0.000 claims description 7
- 150000008064 anhydrides Chemical class 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000002085 persistent effect Effects 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims description 3
- 229910052756 noble gas Inorganic materials 0.000 claims description 3
- 150000002835 noble gases Chemical class 0.000 claims description 3
- 238000004804 winding Methods 0.000 abstract description 3
- 238000009832 plasma treatment Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000011104 metalized film Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000003026 anti-oxygenic effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Abstract
The invention relates to the technology of the thin-film capacitor, particularly to a thin-film capacitor for high-temperature-resistant and high-humidity-resistant application and a processing method thereof. Therefore, the thin-film capacitor can still be used in a high-temperature and high-humidity environment and requirements of long service life and high reliability are met. And the prepared thin-film capacitor has high security and stability. Besides, the processing method includes an evaporation process, a heat setting process and an embedment process. The thin-film capacitor consists of a capacitor core, a potting material and a shell and is characterized in that the capacitor core is formed by winding of a metalized polypropylene film, wherein the front side and the back side of the metalized polypropylene film are processed by a plasma treatment technology.
Description
Technical field
The present invention relates to thin film capacitor technology, specially a kind of thin film capacitor of high-temp resisting high-humidity resisting application and its processing
Method.
Background technology
With the development of Power Electronic Technique, various power converters, AC Drive, accumulation power supply etc. are to large value capacitor
Demand be continuously increased, the requirement to high reliability for these occasions simultaneously makes metallized film capacitor substitute the becoming of alminium electrolytic condenser
Gesture is more and more obvious, especially swift and violent in the application development of energy-conservation and new energy field.But simultaneously because the expansion of application,
Being continually changing of application conditions, the requirement to thin-film capacitor article is also constantly lifted, and wherein, how improving product is high temperature resistant
High humidity application power, is an up the key technology of capacitor product stability and reliability.
In middle low power photovoltaic DC-to-AC converter, for example use DC-Link capacitor, because photovoltaic inversion operating frequency is higher, produce
The very big ripple of life and harmonic current, electric capacity heating is serious, and photovoltaic apparatus use environment inclement condition simultaneously is high in high temperature for a long time
Work in the case of wet, the requirement to capacitor is harsher.The DC-Link electric capacity that example is applied as used in new-energy automobile again
Device, because interior space is limited, radiating condition is not good, and Long-term service temperature is higher, and the requirement to reliability is extremely strict simultaneously.
Under these use conditions, require the operating temperature of 85 DEG C of life-time service, use in 93%RH humidity unaffected.
A kind of most selection scheme of people was to adopt electrochemical capacitor in the past, because electrochemical capacitor has single capacitance
Greatly, the advantage of small volume.But the advantage of relative electrochemical capacitor, its shortcoming be also it is also significant that, that is, resistance to force down, performance
Unstable and short life.From present use through examining, electrochemical capacitor is not good selection in fact, so more excellent scheme
It is to select thin-film capacitor, but the thin-film capacitor of normal conventional nor fully meet this harsh application requirement.
Thin-film capacitor is formed using metallized film winding, its high pressure, and temperature characterisitic is stable, and loss angle is little, self-inductance
Little, Surge handling capability is strong, no acid pollution, and (conform generally to the thin-film capacitor of the application conditions life-span when 70 DEG C is 100,000 to life-span length
Hour, it is far longer than the life-span of electrochemical capacitor).But for photovoltaic, the automobile-used thin-film capacitor waiting new forms of energy occasion, need to bear
The high-frequency harmonic electric current more much bigger than general occasion, general thin-film capacitor also cannot meet in high temperature（85~105℃）High humidity（93%
RH）Under the conditions of life-time service, in the case of persistent fever, capacitance and Dissipation change also can be impacted, life-span and reliability
Also cannot ensure.
Content of the invention
In order to solve the above problems, the invention provides a kind of thin film capacitor of high-temp resisting high-humidity resisting application and its processing side
Method, it enables to thin film capacitor and can remain to meet long-life and reliability, security and stability in hot and humid lower use
High.
Its technical scheme is such：A kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application, it includes following
Step evaporation process, heat setting process and dosing technology it is characterised in that in described evaporation process, thin-film material tow sides
All change surface parameter using plasma processing techniques；In described heat setting process, evacuation during type-approval process, setting temperature is
100 DEG C ~ 120 DEG C, 4 ~ 8 hours persistent period, it is filled with noble gases air-isolation when heating up and release vacuum state；Described filling
In envelope technique, it is heated at least 70 DEG C before embedding and carries out pretreatment in 1 ~ 2 hour, carry out under vacuum conditions during embedding.
It is further characterized by, and in described dosing technology, anhydride epoxy hot setting material is used as potting compound；
In described dosing technology, shell adopts PPS or PBT+PC material.
A kind of thin film capacitor of high-temp resisting high-humidity resisting application, it includes capacitor body, potting compound and housing, and its feature exists
In, described capacitor body by metallized polypropylene film coiling after plasma processing techniques processing for the tow sides
Become.
It is further characterized by, and described potting compound is anhydride epoxy hot setting material；
Described housing is the cabinet of PPS or PBT+PC material；
Described capacitor body includes upper strata fuse group and lower floor's fuse group, described upper strata fuse group and described lower floor fuse component
It is not connected in parallel on lamination copper bar by copper coin welding, described lamination copper bar arranges electrode；
Described housing is square casing or cylindrical housings.
After the method for the present invention and structure, plasma processing techniques in evaporation process are so that metalized film is in core
After son sizing, film layer laminating is tightr, prevents steam residual from leading to film oxidation so as to antioxygenic property greatly promotes, thermal finalization
So that making thin film fully shrink, embedding is carried out technique under vacuum conditions, makes fuse effectively completely cut off the impact of in the air steam,
Improve its hot and humid in the case of antioxidation, the thin film capacitor finally machining hot and humid lower using still meeting
Long-life and reliability, security and stability is improved.
Brief description
Fig. 1 is square structure schematic diagram of the present invention；
Fig. 2 is Fig. 1 capacitor body arrangement schematic diagram；
Fig. 3 is Fig. 1 internal structure schematic diagram；
Fig. 4 is circular configuration schematic diagram of the present invention；
Fig. 5 is Fig. 4 internal structure schematic diagram.
Specific embodiment
A kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application, it comprises the following steps evaporation process, thermal finalization
Technique and dosing technology, in evaporation process, thin-film material tow sides all change surface parameter using plasma processing techniques, make
Metalized film film layer laminating after fuse sizing is tightr, prevents steam residual from leading to film oxidation so as to antioxygenic property is big
Big lifting；In heat setting process, evacuation during type-approval process, setting temperature is 100 DEG C ~ 120 DEG C, 4 ~ 8 hours persistent period, makes
Thin film fully shrinks, and is filled with noble gases when heating up and release vacuum state（As nitrogen）Air-isolation；In dosing technology, fill
It is heated at least 70 DEG C before envelope and carries out pretreatment in 1 ~ 2 hour, carry out under vacuum conditions during embedding, make fuse effectively completely cut off air
The impact of middle steam, improve its hot and humid in the case of non-oxidizability.In envelope technique, made using anhydride epoxy hot setting material
For potting compound so as to body seal more preferably, there is extremely excellent high-low temperature resistant impact capacity, there is low water absorption simultaneously
The feature of high-termal conductivity.
Following table is for improvement checking it is seen that capacitor packages are to hot and humid work after being improved using the method for the present invention
As condition, there is higher stability：
In dosing technology, shell adopts PPS or PBT+PC material, in addition to having good mechanical performance, will make the same epoxy of shell
Resin adherence and intercept water vapour performance depositing and be achieved.
A kind of thin film capacitor of high-temp resisting high-humidity resisting application, it includes capacitor body, potting compound and housing, capacitor core
By tow sides, the metallized polypropylene film coiling after plasma processing techniques processing forms son.Potting compound is anhydride rings
Oxygen hot setting material；Housing is the cabinet of PPS or PBT+PC material；Capacitor body includes upper strata fuse group and lower floor
Fuse group, upper strata fuse group and lower floor's fuse group are connected in parallel on lamination copper bar by copper coin welding respectively, and lamination copper bar is arranged
Electrode；Because housing can be one of square casing or cylindrical housings, therefore enumerate explanation separately below：
See Fig. 1, shown in Fig. 2, Fig. 3, square structure, including housing 1, potting compound 2, fuse group 3, lamination composite copper bar 4, copper coin 5；
Copper coin 5 is welded on lamination composite copper bar 4, and connects capacitor body 3, specifically includes upper strata fuse group 31 and lower floor's fuse
Group 32；Wherein housing 1 is cabinet, using special high temperature resistant PPS or PBT+PC material；Potting compound 2 is high TG point anhydride rings
Oxygen hot setting material；The two poles of the earth are drawn and are adopted lamination composite copper bar form, and this copper bar bedding is in whole product upper end, then copper bar
Upper weldering copper plate is connected on fuse end face；Capacitor body is two fuse groups；Capacitor body is high temperature resistant by special handling
Metallized polypropylene film winding forms, and including capacitor plate and polypropylene film medium, capacitor plate is that polypropylene is thin
The coating of film medium evaporation.
See Fig. 4, shown in Fig. 5, circular configuration, inner connecting structure is similar with square structure, differs primarily in that upper strata core
Subgroup is had any different with the arrangement of lower floor's fuse group, also having in shape in the setting of lamination copper bar of shell.
Claims (8)
1. a kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application, it comprises the following steps evaporation process, thermal finalization work
Skill and dosing technology are it is characterised in that in described evaporation process, thin-film material tow sides are all changed using plasma processing techniques
Become surface parameter；In described heat setting process, evacuation during type-approval process, setting temperature is 100 DEG C ~ 120 DEG C, persistent period 4 ~
8 hours, it is filled with noble gases air-isolation when heating up and release vacuum state；In described dosing technology, it is heated to before embedding
At least 70 DEG C carry out pretreatment in 1 ~ 2 hour, carry out under vacuum conditions during embedding.
2. a kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application according to claim 1 is it is characterised in that institute
State in dosing technology, anhydride epoxy hot setting material is used as potting compound.
3. a kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application according to claim 1 is it is characterised in that institute
State shell in dosing technology and adopt PPS or PBT+PC material.
4. a kind of thin film capacitor of high-temp resisting high-humidity resisting application, it includes capacitor body, potting compound and housing, and its feature exists
In, described capacitor body by metallized polypropylene film coiling after plasma processing techniques processing for the tow sides
Become.
5. a kind of thin film capacitor of high-temp resisting high-humidity resisting application according to claim 4 is it is characterised in that described potting compound
For anhydride epoxy hot setting material.
6. a kind of thin film capacitor of high-temp resisting high-humidity resisting application according to claim 4 is it is characterised in that described housing is
The cabinet of PPS or PBT+PC material.
7. a kind of thin film capacitor of high-temp resisting high-humidity resisting application according to claim 4 is it is characterised in that described capacitor
Fuse includes upper strata fuse group and lower floor's fuse group, and described upper strata fuse group and described lower floor fuse group are welded by copper coin respectively
It is connected in parallel on lamination copper bar, described lamination copper bar arranges electrode.
8. a kind of thin film capacitor of high-temp resisting high-humidity resisting application according to claim 4 is it is characterised in that described housing is
Square casing or cylindrical housings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610911625.2A CN106409507B (en) | 2016-10-20 | 2016-10-20 | A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610911625.2A CN106409507B (en) | 2016-10-20 | 2016-10-20 | A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106409507A true CN106409507A (en) | 2017-02-15 |
| CN106409507B CN106409507B (en) | 2019-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610911625.2A Active CN106409507B (en) | 2016-10-20 | 2016-10-20 | A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109029755A (en) * | 2018-06-01 | 2018-12-18 | 重庆材料研究院有限公司 | Method for improving the proof armored platinum resistor thermometer response time |
| CN109905038A (en) * | 2017-12-11 | 2019-06-18 | 中车永济电机有限公司 | Power conversion unit, locomotive auxiliary power supply convertor circuit and locomotive |
| CN110164691A (en) * | 2019-05-06 | 2019-08-23 | 艾华新动力电容(苏州)有限公司 | A kind of high moisture-proof metalizing polypropylene thin film capacitor and its processing method |
| CN114743795A (en) * | 2022-04-18 | 2022-07-12 | 无锡宸瑞新能源科技有限公司 | Alternating current filter film capacitor and production process thereof |
| CN115410825A (en) * | 2022-09-20 | 2022-11-29 | 六和电子（江西）有限公司 | Thermal polymerization method and device for thin film capacitor |
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| CN1154374A (en) * | 1995-11-29 | 1997-07-16 | 东丽株式会社 | Biaxially oriented polypropylene film and capacitor made thereof |
| CN101067195A (en) * | 2006-04-28 | 2007-11-07 | 应用材料公司 | Metallising using thin seed layer deposited using plasma-assisted process |
| CN102324300A (en) * | 2011-07-27 | 2012-01-18 | 佛山市顺德区创格电子实业有限公司 | High-voltage parallel compensation capacitor made of self-healing metallized film |
| CN103915256A (en) * | 2014-03-25 | 2014-07-09 | 无锡宸瑞新能源科技有限公司 | Thin film capacitor for medium-and-low-power photovoltaic inverter |
| CN104479161A (en) * | 2013-11-21 | 2015-04-01 | 东莞市长安东阳光铝业研发有限公司 | Polyvinylidene fluoride/polypropylene composite film for film capacitor and preparation method |
| CN104867674A (en) * | 2015-04-15 | 2015-08-26 | 赫得纳米科技(昆山)有限公司 | Method for preparing metalized thin film of novel thin-film capacitor |
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2016
- 2016-10-20 CN CN201610911625.2A patent/CN106409507B/en active Active
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| CN1154374A (en) * | 1995-11-29 | 1997-07-16 | 东丽株式会社 | Biaxially oriented polypropylene film and capacitor made thereof |
| CN101067195A (en) * | 2006-04-28 | 2007-11-07 | 应用材料公司 | Metallising using thin seed layer deposited using plasma-assisted process |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109905038A (en) * | 2017-12-11 | 2019-06-18 | 中车永济电机有限公司 | Power conversion unit, locomotive auxiliary power supply convertor circuit and locomotive |
| CN109029755A (en) * | 2018-06-01 | 2018-12-18 | 重庆材料研究院有限公司 | Method for improving the proof armored platinum resistor thermometer response time |
| CN110164691A (en) * | 2019-05-06 | 2019-08-23 | 艾华新动力电容(苏州)有限公司 | A kind of high moisture-proof metalizing polypropylene thin film capacitor and its processing method |
| CN114743795A (en) * | 2022-04-18 | 2022-07-12 | 无锡宸瑞新能源科技有限公司 | Alternating current filter film capacitor and production process thereof |
| CN114743795B (en) * | 2022-04-18 | 2023-12-05 | 无锡宸瑞新能源科技有限公司 | Alternating current filter film capacitor and production process thereof |
| CN115410825A (en) * | 2022-09-20 | 2022-11-29 | 六和电子（江西）有限公司 | Thermal polymerization method and device for thin film capacitor |
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Denomination of invention: A Thin Film Capacitor with High Temperature and Humidity Resistance and Its Processing Method Effective date of registration: 20230424 Granted publication date: 20190301 Pledgee: Wuxi Branch of China Everbright Bank Co.,Ltd. Pledgor: WUXI CHENRUI NEW ENERGY TECHNOLOGY Co.,Ltd. Registration number: Y2023980039043 |
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