CN106409507B - A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application - Google Patents
A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application Download PDFInfo
- Publication number
- CN106409507B CN106409507B CN201610911625.2A CN201610911625A CN106409507B CN 106409507 B CN106409507 B CN 106409507B CN 201610911625 A CN201610911625 A CN 201610911625A CN 106409507 B CN106409507 B CN 106409507B
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- Prior art keywords
- thin film
- capacitor
- film capacitor
- humidity
- resisting
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- 239000003990 capacitor Substances 0.000 title claims abstract description 50
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 36
- 230000008569 process Effects 0.000 claims abstract description 19
- 238000005516 engineering process Methods 0.000 claims abstract description 15
- 238000004382 potting Methods 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 230000008020 evaporation Effects 0.000 claims abstract description 8
- 238000001704 evaporation Methods 0.000 claims abstract description 8
- 238000009998 heat setting Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 15
- 229920006644 PBT+PC Polymers 0.000 claims description 6
- 150000008064 anhydrides Chemical group 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 11
- 239000004743 Polypropylene Substances 0.000 abstract description 5
- -1 polypropylene Polymers 0.000 abstract description 5
- 229920001155 polypropylene Polymers 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 238000003475 lamination Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000011104 metalized film Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000003026 anti-oxygenic effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Abstract
The present invention relates to thin film capacitor technologies, the specially a kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application, it enables to thin film capacitor can be under high temperature and humidity using being still able to satisfy long-life and reliability, security and stability is high, processing method includes the following steps evaporation process, heat setting process and dosing technology, thin film capacitor includes capacitor body, potting compound and shell, it is characterized in that, the capacitor body is formed by metallized polypropylene film coiling of the tow sides after plasma processing techniques are processed.
Description
Technical field
The present invention relates to thin film capacitor technology, the thin film capacitor of specially a kind of high-temp resisting high-humidity resisting application and its processing
Method.
Background technique
With the development of power electronics technology, various power converters, AC Drive, accumulation power supply etc. are to large value capacitor
Demand be continuously increased, while requirement of these occasions to high reliability makes metallized film capacitor substitution alminium electrolytic condenser become
Gesture is more and more obvious, especially swift and violent in the application development of energy conservation and new energy field.But simultaneously because the expansion of application field,
The continuous variation of application conditions, the requirement to thin-film capacitor article are also constantly promoted, wherein how to promote the high temperature resistant of product
High humidity application power is the key technology for promoting capacitor product stability and reliability.
Such as DC-Link capacitor is used in middle low power photovoltaic DC-to-AC converter, since photovoltaic inversion working frequency is higher, produce
Raw very big ripple and harmonic current, capacitor fever is serious, while photovoltaic apparatus use environment inclement condition, for a long time in high temperature height
It works in wet situation, the requirement to capacitor is harsher.In another example using the DC-Link capacitor applied in new-energy automobile
Device, since interior space is limited, radiating condition is bad, and long-term operating temperature is higher, while the requirement to reliability is extremely stringent.
Under these use conditions, the operating temperature of 85 DEG C of long-time service is required, use in 93%RH humidity unaffected.
A kind of most selection scheme of people was to use electrolytic capacitor in the past, because electrolytic capacitor has single capacitance
Greatly, advantage small in size.But the advantages of opposite electrolytic capacitor, it the shortcomings that be also it is also significant that, that is, resistance to force down, performance
The unstable and service life is short.In terms of present use experience, electrolytic capacitor is not to select well in fact, so more excellent scheme
It is selection thin-film capacitor, but the thin-film capacitor of normal conventional can not fully meet this harsh application requirement.
Thin-film capacitor is wound using metallized film, it is high pressure resistant, and temperature characterisitic is stablized, and loss angle is small, self-inductance
Small, Surge handling capability is strong, no acid pollution, and the service life is long, and (generally meeting the thin-film capacitors of the application conditions service life at 70 DEG C is 100,000
Hour, it is far longer than the service life of electrolytic capacitor).But for photovoltaic, the thin-film capacitor of automobile-used equal new energy occasion needs to bear
The high-frequency harmonic electric current more much bigger than general occasion, general thin-film capacitor are also unable to satisfy in high temperature (85 ~ 105 DEG C) high humidity (93%
RH it is used for a long time under the conditions of), in persistent fever, capacitance and Dissipation change also can be impacted, service life and reliability
Also it cannot ensure.
Summary of the invention
To solve the above-mentioned problems, the present invention provides a kind of thin film capacitor of high-temp resisting high-humidity resisting application and its processing sides
Method enables to thin film capacitor can be under high temperature and humidity using being still able to satisfy long-life and reliability, security and stability
It is high.
Its technical solution is such that a kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application comprising following
Step evaporation process, heat setting process and dosing technology, which is characterized in that in the evaporation process, thin-film material tow sides
It is all made of plasma processing techniques and changes surface parameter；In the heat setting process, when type-approval process, is vacuumized, and setting temperature is
100 DEG C ~ 120 DEG C, the duration 4 ~ 8 hours, inert gas air-isolation is filled with when heating up and releasing vacuum state；The filling
It seals in technique, at least 70 DEG C is heated to before encapsulating and pre-process within 1 ~ 2 hour, when encapsulating carries out under vacuum conditions.
It is further characterized by using anhydride epoxy hot setting material as potting compound in the dosing technology；
Shell uses PPS or PBT+PC material in the dosing technology.
A kind of thin film capacitor of high-temp resisting high-humidity resisting application comprising capacitor body, potting compound and shell, feature exist
In, the capacitor body by metallized polypropylene film coiling of the tow sides after plasma processing techniques are processed and
At.
It is further characterized by the potting compound is anhydride epoxy hot setting material；
The shell is the plastic shell of PPS or PBT+PC material；
The capacitor body includes upper layer fuse group and lower layer's fuse group, the upper layer fuse group and lower layer's fuse
Group is connected in parallel on lamination copper bar by copper sheet welding respectively, and electrode is arranged on the lamination copper bar；
The shell is square casing or cylindrical housings.
After method and structure of the invention, plasma processing techniques can make metalized film in core in evaporation process
Film layer fitting is closer after son sizing, prevents steam residual from leading to film oxidation, greatly promotes its antioxygenic property, thermal finalization
Technique can make film sufficiently shrink, and encapsulating carries out under vacuum conditions, and so that fuse is effectively completely cut off steam in air influences,
Improve anti-oxidant in the case of its high temperature and humidity, the thin film capacitor finally completed the process is under high temperature and humidity using still meeting
Long-life and reliability, security and stability are improved.
Detailed description of the invention
Fig. 1 is square structure schematic diagram of the present invention；
Fig. 2 is Fig. 1 capacitor body arrangement schematic diagram；
Fig. 3 is Fig. 1 schematic diagram of internal structure；
Fig. 4 is circular configuration schematic diagram of the present invention；
Fig. 5 is Fig. 4 schematic diagram of internal structure.
Specific embodiment
A kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application comprising following steps evaporation process, thermal finalization
Technique and dosing technology, in evaporation process, thin-film material tow sides are all made of plasma processing techniques and change surface parameter, make
Metalized film film layer fitting after fuse sizing is closer, prevents steam residual from leading to film oxidation, keeps its antioxygenic property big
It is big to be promoted；In heat setting process, when type-approval process, is vacuumized, and setting temperature is 100 DEG C ~ 120 DEG C, the duration 4 ~ 8 hours, is made
Film is sufficiently shunk, and is filled with inert gas (such as nitrogen) air-isolation when heating up and releasing vacuum state；In dosing technology, fill
It is heated at least 70 DEG C before envelope pre-process within 1 ~ 2 hour, when encapsulating carries out under vacuum conditions, and fuse is made effectively to completely cut off air
Middle steam influences, and improves the inoxidizability in the case of its high temperature and humidity.It seals in technique, is made using anhydride epoxy hot setting material
For potting compound, make itself and shell better tightness, there is extremely excellent high-low temperature resistant impact capacity, while there is low water absorption
The characteristics of high-termal conductivity.
Following table is improvement verifying, it is seen that work of the capacitor packages to high temperature and humidity after being improved using method of the invention
Make condition with higher stability:
Shell will make shell same using PPS or PBT+PC material other than with good mechanical performance in dosing technology
Epoxy resin adherence and barrier water vapour performance and depositing are achieved.
A kind of thin film capacitor of high-temp resisting high-humidity resisting application comprising capacitor body, potting compound and shell, capacitor core
Son is formed by metallized polypropylene film coiling of the tow sides after plasma processing techniques are processed.Potting compound is anhydride rings
Oxygen hot setting material；Shell is the plastic shell of PPS or PBT+PC material；Capacitor body includes upper layer fuse group and lower layer
Fuse group, upper layer fuse group and lower layer's fuse group are connected in parallel on lamination copper bar by copper sheet welding respectively, are arranged on lamination copper bar
Electrode；Since shell can be one of square casing or cylindrical housings, explanation is enumerated separately below:
See Fig. 1, Fig. 2, shown in Fig. 3, square structure, including shell 1, potting compound 2, fuse group 3, lamination composite copper bar 4, copper
Plate 5；Copper sheet 5 is welded on lamination composite copper bar 4, and connects capacitor body 3, specifically includes upper layer fuse group 31 and lower layer
Fuse group 32；Wherein shell 1 is plastic shell, using special high temperature resistant PPS or PBT+PC material；Potting compound 2 is high TG point acid
Anhydro ring oxygen hot setting material；The two poles of the earth, which are drawn, uses lamination composite copper bar form, and the copper bar bedding is in entire product upper end, then
Copper plate is welded on copper bar to be connected on fuse end face；Capacitor body is two fuse groups；Capacitor body is by the resistance to of specially treated
High temperature metallization polypropylene film is wound, including capacitor plate and polypropylene film medium, and capacitor plate is poly- third
The coating of alkene thin film dielectrics vapor deposition.
See Fig. 4, shown in Fig. 5, circular configuration, inner connecting structure is similar with square structure, and the main distinction is upper layer core
The arrangement of subgroup and lower layer fuse group, shell there are also have any different in the setting of lamination copper bar in shape.
Claims (1)
1. a kind of thin film capacitor processing method of high-temp resisting high-humidity resisting application comprising following steps: evaporation process, thermal finalization
Technique and dosing technology, which is characterized in that in the evaporation process, thin-film material tow sides are all made of plasma processing techniques
Change surface parameter；In the heat setting process, when type-approval process, is vacuumized, and setting temperature is 100 DEG C ~ 120 DEG C, the duration
4 ~ 8 hours, inert gas air-isolation was filled with when heating up and releasing vacuum state；In the dosing technology, heated before encapsulating
Pre-process within 1 ~ 2 hour at least 70 DEG C, when encapsulating carries out under vacuum conditions；In the dosing technology, anhydride rings are used
Oxygen hot setting material is as potting compound；Shell uses PPS or PBT+PC material in the dosing technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610911625.2A CN106409507B (en) | 2016-10-20 | 2016-10-20 | A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610911625.2A CN106409507B (en) | 2016-10-20 | 2016-10-20 | A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application |
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| Publication Number | Publication Date |
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| CN106409507A CN106409507A (en) | 2017-02-15 |
| CN106409507B true CN106409507B (en) | 2019-03-01 |
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| CN201610911625.2A Active CN106409507B (en) | 2016-10-20 | 2016-10-20 | A kind of thin film capacitor and its processing method of high-temp resisting high-humidity resisting application |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109905038A (en) * | 2017-12-11 | 2019-06-18 | 中车永济电机有限公司 | Power conversion unit, locomotive auxiliary power supply convertor circuit and locomotive |
| CN109029755B (en) * | 2018-06-01 | 2020-12-25 | 湖南江麓仪器仪表有限公司 | Method for improving response time of armored platinum resistance thermometer |
| CN110164691A (en) * | 2019-05-06 | 2019-08-23 | 艾华新动力电容(苏州)有限公司 | A kind of high moisture-proof metalizing polypropylene thin film capacitor and its processing method |
| CN114743795B (en) * | 2022-04-18 | 2023-12-05 | 无锡宸瑞新能源科技有限公司 | Alternating current filter film capacitor and production process thereof |
| CN115410825B (en) * | 2022-09-20 | 2023-06-16 | 六和电子（江西）有限公司 | Thin film capacitor thermal polymerization method and device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1154374A (en) * | 1995-11-29 | 1997-07-16 | 东丽株式会社 | Biaxially oriented polypropylene film and capacitor made thereof |
| CN101067195A (en) * | 2006-04-28 | 2007-11-07 | 应用材料公司 | Metallising using thin seed layer deposited using plasma-assisted process |
| CN102324300A (en) * | 2011-07-27 | 2012-01-18 | 佛山市顺德区创格电子实业有限公司 | High-voltage parallel compensation capacitor made of self-healing metallized film |
| CN103915256A (en) * | 2014-03-25 | 2014-07-09 | 无锡宸瑞新能源科技有限公司 | Thin film capacitor for medium-and-low-power photovoltaic inverter |
| CN104479161A (en) * | 2013-11-21 | 2015-04-01 | 东莞市长安东阳光铝业研发有限公司 | Polyvinylidene fluoride/polypropylene composite film for film capacitor and preparation method |
| CN104867674A (en) * | 2015-04-15 | 2015-08-26 | 赫得纳米科技(昆山)有限公司 | Method for preparing metalized thin film of novel thin-film capacitor |
-
2016
- 2016-10-20 CN CN201610911625.2A patent/CN106409507B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1154374A (en) * | 1995-11-29 | 1997-07-16 | 东丽株式会社 | Biaxially oriented polypropylene film and capacitor made thereof |
| CN101067195A (en) * | 2006-04-28 | 2007-11-07 | 应用材料公司 | Metallising using thin seed layer deposited using plasma-assisted process |
| CN102324300A (en) * | 2011-07-27 | 2012-01-18 | 佛山市顺德区创格电子实业有限公司 | High-voltage parallel compensation capacitor made of self-healing metallized film |
| CN104479161A (en) * | 2013-11-21 | 2015-04-01 | 东莞市长安东阳光铝业研发有限公司 | Polyvinylidene fluoride/polypropylene composite film for film capacitor and preparation method |
| CN103915256A (en) * | 2014-03-25 | 2014-07-09 | 无锡宸瑞新能源科技有限公司 | Thin film capacitor for medium-and-low-power photovoltaic inverter |
| CN104867674A (en) * | 2015-04-15 | 2015-08-26 | 赫得纳米科技(昆山)有限公司 | Method for preparing metalized thin film of novel thin-film capacitor |
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| CN106409507A (en) | 2017-02-15 |
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Denomination of invention: A thin film capacitor for high temperature and high humidity application and its processing method Effective date of registration: 20220426 Granted publication date: 20190301 Pledgee: Wuxi Branch of China Everbright Bank Co.,Ltd. Pledgor: WUXI CHENRUI NEW ENERGY TECHNOLOGY Co.,Ltd. Registration number: Y2022320000195 |
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Denomination of invention: A Thin Film Capacitor with High Temperature and Humidity Resistance and Its Processing Method Effective date of registration: 20230424 Granted publication date: 20190301 Pledgee: Wuxi Branch of China Everbright Bank Co.,Ltd. Pledgor: WUXI CHENRUI NEW ENERGY TECHNOLOGY Co.,Ltd. Registration number: Y2023980039043 |