CN108811480A - SMT patches carrier and its patch method - Google Patents
SMT patches carrier and its patch method Download PDFInfo
- Publication number
- CN108811480A CN108811480A CN201810835991.3A CN201810835991A CN108811480A CN 108811480 A CN108811480 A CN 108811480A CN 201810835991 A CN201810835991 A CN 201810835991A CN 108811480 A CN108811480 A CN 108811480A
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- China
- Prior art keywords
- support plate
- product
- magnetic
- faces
- magnetic support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
Abstract
The invention discloses a kind of SMT patches carrier and its patch methods, including pedestal, magnetic support plate and magnetic closure；The magnetic support plate activity is nested on pedestal, and magnetic closure removable cover is bonded in magnetic support plate top surface and with magnetic support plate magnetic absorption.Since the patch data of the present invention can merge design, tin cream steel mesh can merge design, SMT carriers can merge design, all devices are identical twice, device flies up to share, therefore, in process of production, without constantly switching patch data, tin cream steel mesh, SMT carriers and device are flown up to, switching can be saved towards Operational preparation time about 2.5H/ times, separately, replace the mode for fixed product of taping with magnetic closure, further reduce product time, simultaneously, pedestal, support plate, tablet merges design and forms the SMT carriers that can be shared, the cost of manufacture of carrier can be saved.
Description
Technical field
The present invention relates to patch manufacturing fields, more particularly to a kind of SMT patches carrier and its patch method.
Background technology
One of technological process of production of flexible circuit board is SMT patches, i.e., by element device patch in flexible circuit board,
SMT production technologies are very crucial for the manufacture of flexible circuit board, and used SMT wire bodies equipment price is expensive, flexible wires
Road plate has the faces TOP and the faces BOT, that is, pushes up bottom two sides, and existing conventional SMT patch production methods are to spell flexible circuitry by one
Plate TOP is nested on support plate upwardly after blend compounds band quadrangle is pasted onto on support plate, is put into the production of SMT wire bodies, is waited for card flexibility
After the completion of the TOP face paste parts of wiring board jigsaw, then the product of entire each equipment of SMT wire bodies is replaced towards patch data, mating
Tin cream steel mesh, device fly up to, with after support plate etc., then again be nested with the flexible circuit board BOT of the faces spelling TOP patch upwardly
After blend compounds band quadrangle is pasted onto on support plate on support plate, the production of SMT wire bodies is placed into, until by the top bottom of flexible circuit board jigsaw
Layer two sides patch is completed, in this way, in SMT patch production processes, needs constantly to switch the faces TOP and BOT looks unfamiliar production, diverter surface
To Operational preparation time about 2.5H/ times, and the faces TOP and the faces BOT are respectively necessary for mating SMT carriers.As enterprise development demand expands
Big production capacity, existing SMT wire bodies equipment and SMT carriers need to expand by year-on-year coefficient, and the fund input of enterprise is huge, therefore,
Wish under existing SMT wire bodies appointed condition, it is further effective to promote production capacity.
Do not attain in view of this, the designer is directed in the low structure design with SMT carriers of existing SMT patches method efficiency
Many missings caused by being apt to and inconvenient deeply design, and actively research improvement has a fling at and develops and design the present invention.
Invention content
It is an object of the present invention to provide a kind of efficient SMT patch carriers.
The high efficiency SMT patch methods based on above-mentioned SMT patches carrier that it is another object of the present invention to provide a kind of.
To achieve the above object, technical solution of the invention is：
The present invention is a kind of SMT patches carrier, including pedestal, magnetic support plate and magnetic closure；The magnetic support plate movable sleeve
It sets on pedestal, magnetic closure removable cover is bonded in magnetic support plate top surface and with magnetic support plate magnetic absorption.
The quadrangle of the pedestal is provided with the support plate pilot pin mating with magnetic support plate, and multiple productions are offered in pedestal
Product positioning pinholes install product orientation needle in multiple product orientation pin holes mating with product orientation hole.
The magnetic support plate is a metal plate and forms magnetic support plate in the laminating magnetic material of its bottom, in magnetism
The quadrangle of support plate offers support plate location hole, and the product orientation mating with the product orientation needle of pedestal is offered in magnetic support plate
Needle relief hole offers the product BOT face device mating with the faces each unit product BOT and steps down and leads in the left part position of magnetic support plate
Slot offers the product TOP face device resigning straight slot mating with the faces each unit product TOP in the right part position of magnetic support plate.
The magnetic closure is a metal plate, and cover board location hole is offered in the quadrangle of magnetic closure, is covered in magnetism
The product orientation needle relief hole mating with the product orientation needle of pedestal is offered in plate, the left part position of magnetic closure offer with
The mating faces the product TOP device resigning straight slot in the faces each unit product TOP and product TOP face MARK point resigning straight slots are covered in magnetism
The right part position of plate offers the product BOT face device resigning straight slot mating with the faces each unit product BOT and product BOT face MARK points
Resigning straight slot.
The pedestal is provided with 1 or 2 support plate position-limited needle in one side two corners or quadrangle, and magnetic support plate is facilitated to rely on
Support plate position-limited needle is quickly nested on pedestal.
The pedestal offers support plate position in the left and right sides, and magnetic support plate is facilitated to pick and place on pedestal.
The magnetic support plate offers the product TOP face mating with product or the faces BOT gold face resigning deep gouge, production on it
The faces product TOP or the faces BOT Quick Response Code resigning deep gouge.
The magnetic support plate offers cover board position in the left and right sides, and magnetic closure is facilitated to pick and place on magnetic support plate.
The product TOP face mating with product or the faces BOT Quick Response Code resigning straight slot are offered on the magnetic closure.
Product TOP face MARK point resigning straight slots and the faces product TOP device resigning the straight slot merging of the magnetic closure are set
Meter, correspondingly, merging design when product BOT face MARK point resigning straight slots and the adjacent faces product BOT device resigning straight slot.
The present invention is a kind of patch method of SMT patches carrier, is included the following steps：
Step 1：Magnetic support plate is nested on pedestal；
Step 2：One spelling product TOP is nested in magnetic support plate upper surface left part position upwardly, another spelling product BOT is faced upward
It is nested in magnetic support plate upper surface right part position；
Step 3：Magnetic closure is nested on magnetic support plate and product, product be clamped in magnetic support plate and magnetic closure it
Between；
Step 4：The magnetic support plate for having packaged product and magnetic closure is removed from pedestal, is put into SMT wire body patches；
Step 5：After the completion of two spell each one side patch of product, magnetic closure is removed, takes out product；
Step 6：Magnetic support plate is nested on pedestal；
Step 7：The product TOP of one spelling BOT faces patch is nested in magnetic support plate upper surface left part position, by another spelling upwardly
The faces TOP patch product BOT upwardly be nested in magnetic support plate upper surface right part position；
Step 8：Magnetic closure is nested on magnetic support plate and product, product be clamped in magnetic support plate and magnetic closure it
Between；
Step 9：The magnetic support plate for having packaged product and magnetic closure is removed from pedestal, is put into SMT wire body patches；
Step 10：After the completion of two spell the two sides patch of product, magnetic closure is removed, takes out product；
So far, bout SMT patches production is completed, and is repeated above step 1 to 10 and is constantly produced.
After adopting the above scheme, since magnetic support plate is first nested on pedestal by the present invention, a spelling product TOP is faced upward
It is nested in magnetic support plate upper surface left part position, another spelling product BOT is nested with upwardly in magnetic support plate upper surface right part position, it will
Magnetic closure is nested on magnetic support plate and product, and the magnetic support plate for having packaged product and magnetic closure is removed from pedestal,
It is put into SMT wire body patches；To be produced two when spelling product another side, and the product TOP of spelling BOT faces patch is nested with upwardly
The product BOT of another spelling TOP faces patch is nested with upwardly on the magnetic support plate upper surface right side by magnetic support plate upper surface left part position
Position, then after being nested with magnetic closure, remove SMT carriers and be put into SMT wire body patches, because in operating process twice, a left side for support plate
The faces product TOP at position are to place upwards, and the faces product BOT of the right part position of support plate are to place upwards, the patch in the faces product TOP
The positions such as panel region, the patch region of the faces TOP MARK points and the faces product BOT, the faces BOT MARK points remain unchanged, therefore, patch data
Design can be merged, tin cream steel mesh can merge design, and SMT carriers can merge design, and all devices are identical twice, and device flies up to be total to
With therefore, in process of production, flying up to, can save without constantly switching patch data, tin cream steel mesh, SMT carriers and device
Switching is saved towards Operational preparation time about 2.5H/ time, in addition, replacing the mode for fixed product of taping with magnetic closure, more into one
Step reduces product time, meanwhile, pedestal, support plate, tablet merge design and form the SMT carriers that can be shared, and can save carrier
Cost of manufacture.
The present invention is further illustrated in the following with reference to the drawings and specific embodiments.
Description of the drawings
Fig. 1 a are the faces the TOP schematic diagram of flexible circuit board jigsaw；
Fig. 1 b are the faces the BOT schematic diagram of flexible circuit board jigsaw；
Fig. 2 is the process flow chart of the present invention；
Fig. 3 is the vertical view of SMT carriers of the present invention；
Fig. 4 is the front view of SMT carriers of the present invention；
Fig. 5 is the vertical view of pedestal of the present invention；
Fig. 6 is the front view of pedestal of the present invention；
Fig. 7 is the vertical view of the magnetic support plate of the present invention；
Fig. 8 is the front view of the magnetic support plate of the present invention；
Fig. 9 is the vertical view of magnetic closure of the present invention；
Figure 10 is the front view of magnetic closure of the present invention；
Figure 11 is that the magnetic support plate of the present invention is placed on the combination diagram on pedestal；
Figure 12 is the combination diagram that the present invention two spells that product difference is placed on upwardly magnetic support plate；
Figure 13 is that magnetic closure of the present invention is placed on the combination diagram on product；
Figure 14 is the combination diagram that the present invention removes magnetic support plate and product from pedestal.
Specific implementation mode
As shown in Figure 3, Figure 4, the present invention is a kind of SMT patches carrier, including pedestal 1, magnetic support plate 2 and magnetic closure 3.
2 activity of magnetic support plate is nested on pedestal 1, and 3 removable cover of magnetic closure is in 2 top surface of magnetic support plate and and magnetic
Property 2 magnetic absorption of support plate fitting.
As shown in Figure 5, Figure 6, the quadrangle of the pedestal 1 is provided with the support plate pilot pin 11 mating with magnetic support plate 2,
Multiple product orientation pin holes 12 are offered in pedestal 1, with the mating multiple product orientation pin holes 12 in product orientation hole in installation
Product orientation needle 13.The pedestal 1 is provided with 1 or 2 support plate position-limited needle 14 in one side two corners or quadrangle, facilitates magnetism
Support plate 2 is quickly nested on pedestal 1 by support plate position-limited needle 14.The pedestal 1 offers support plate position 15 in the left and right sides,
Magnetic support plate 2 is facilitated to pick and place on pedestal 1.
As shown in Figure 7, Figure 8, the magnetic support plate 2 is a metal plate and is formed in the laminating magnetic material of its bottom
Magnetic support plate 2 offers support plate location hole 21 in the quadrangle of magnetic support plate 2, the production with pedestal 1 is offered in magnetic support plate 2
The mating product orientation needle relief hole 22 of product pilot pin 13 offers and the faces each unit product BOT in the left part position of magnetic support plate 2
The mating faces product BOT device resigning straight slot 23 offers mating with the faces each unit product TOP in the right part position of magnetic support plate 2
The faces product TOP device resigning straight slot 24.The magnetic support plate 2 offer on it the product TOP face mating with product or
The faces BOT gold face resigning deep gouge 25, the faces product TOP or the faces BOT Quick Response Code resigning deep gouge 26.The magnetic support plate 2 is in left and right two
Side offers cover board position 27, and magnetic closure 3 is facilitated to pick and place on magnetic support plate 2.
As shown in Figure 9, Figure 10, the magnetic closure 3 is a metal plate, and lid is offered in the quadrangle of magnetic closure 3
Plate location hole 31 offers the product orientation needle relief hole 32 mating with the product orientation needle 13 of pedestal 1 in magnetic closure 3,
The product TOP face device resigning straight slot 33 and product mating with the faces each unit product TOP are offered in the left part position of magnetic closure 3
The faces TOP MARK point resignings straight slot 34, the product BOT mating with the faces each unit product BOT is offered in the right part position of magnetic closure 3
Face device resigning straight slot 35 and product BOT face MARK point resignings straight slot 36.It is offered on the magnetic closure 3 mating with product
The faces product TOP or the faces BOT Quick Response Code resigning straight slot 37.It should be noted that：Such as the faces the TOP MARK points and product of fruit product
When the faces TOP device area is adjacent, magnetic closure 3 can step down product TOP face MARK point resignings straight slot 34 and the faces product TOP device
Straight slot 33 merges design, correspondingly, product BOT face MARK point resignings straight slot 36 and the faces product BOT device resigning straight slot 35 are adjacent
When can merge design.
As shown in Fig. 2, the present invention is a kind of patch method of SMT patches carrier, include the following steps：
Step 1：As shown in figure 11, magnetic support plate 2 is nested on pedestal 1；
Step 2：As shown in Figure 12, Fig. 1 a, Fig. 1 b, the faces spelling product TOP 101 are nested with upwards on 2 upper surface of a magnetic support plate left side
The faces another spelling product BOT 102 are nested in magnetic support plate upper surface right part position by position upwards；
Step 3：As shown in figure 13, magnetic closure 3 is nested on magnetic support plate 2 and product, product is clamped in magnetic support plate 2
Between magnetic closure 3；
Step 4：As shown in figure 14, the magnetic support plate 2 for having packaged product and magnetic closure 3 is removed from pedestal 1, is put into SMT
Wire body patch；
Step 5：After the completion of two spell each one side patch of product, magnetic closure 3 is removed, takes out product；
Step 6：Magnetic support plate 2 is nested on pedestal 1；
Step 7：As shown in Figure 1 a, 1 b, by spelling BOT faces 102, the faces product TOP 101 of patch are nested with are carried in magnetism upwards
The faces product BOT 102 of the patch of another spelling TOP faces 101 are nested in 2 upper surface of magnetic support plate by 2 upper surface left part position of plate upwards
Right part position；
Step 8：Magnetic closure 3 is nested on magnetic support plate 2 and product, product is clamped in magnetic support plate 2 and magnetic closure 3
Between；
Step 9：The magnetic support plate 2 for having packaged product and magnetic closure 3 is removed from pedestal 1, is put into SMT wire body patches；
Step 10：After the completion of two spell the two sides patch of product, magnetic closure 3 is removed, takes out product；
So far, bout SMT patches production is completed, and is repeated above step 1 to 10 and is constantly produced.
By taking flexible circuit board jigsaw shown in FIG. 1 as an example：
（1）Original SMT patches production method 1 is that the faces TOP, the faces BOT production time are respectively about 24s/ times, and often card shares 160 and spells
Flexible circuit board jigsaw, often the card production time be,（The faces TOP）24 s * 160 times+switching Operational preparation time 2.5H+
（The faces BOT）24 160 times=278min of s *, the matching used carrier cost of institute：（Pedestal about 300 yuan one+（Carrier+cover board is about）
The * 20 set turnover of 450 yuan/set）*2（The faces TOP, the faces BOT are each a set of）=about 18600 yuan；
（2）The faces TOP and the faces TOP also can be merged design, BOT by original SMT patches production method 2 respectively on the basis of existing
Face and the faces BOT merge design, but the faces TOP be changed to BOT look unfamiliar production when, still to have switching towards Operational preparation time 2.5H/
It is secondary, the faces the TOP faces+TOP, the faces the BOT faces+BOT production time be respectively about 33s/ times, often the card production time be,（The faces TOP+
The faces TOP）33 s * 80 times+switching Operational preparation time 2.5H+（The faces the BOT faces+BOT）33 80 times=238min of s *, institute are mating
The carrier cost used：（Pedestal about 450 yuan one+（Carrier+cover board is about）The * 20 set turnover of 750 yuan/set）*2（The faces TOP, the faces BOT
It is each a set of）=about 30900 yuan；
（3）SMT patches method production using the present invention, the faces the TOP faces+BOT production time are respectively about 33s/ times, often card product
Production time is,（The faces the TOP faces+BOT）33 s * 80 times+（The faces the TOP faces+BOT）33 80 times=88min of s *, are matched
Carrier cost：（Pedestal about 450 yuan one+（Carrier+cover board is about）The * 20 set turnover of 750 yuan/set）*1（The faces TOP, the faces BOT share
It is a set of）=about 15450 yuan；The SMT patches method original SMT patches production method 1 relatively of the present invention, often card product efficiency promotion
68%, each item number SMT carriers cost can about save 3150 yuan, opposite SMT patches production method 2, and often card product efficiency is promoted
63%, each item number SMT carriers cost can about save 15450 yuan.
The above, only present pre-ferred embodiments, therefore cannot be limited the scope of implementation of the present invention with this, i.e., according to
Equivalent changes and modifications made by scope of the present invention patent and description all should still belong to the model that patent of the present invention covers
In enclosing.
Claims (10)
1. a kind of SMT patches carrier, it is characterised in that：Including pedestal, magnetic support plate and magnetic closure；The magnetic support plate is lived
Dynamic to be nested on pedestal, magnetic closure removable cover is bonded in magnetic support plate top surface and with magnetic support plate magnetic absorption.
2. SMT patches carrier according to claim 1, it is characterised in that：The quadrangle of the pedestal is provided with and magnetism
The mating support plate pilot pin of support plate, offers multiple product orientation pin holes in pedestal, with mating multiple in product orientation hole
Product orientation needle is installed in product orientation pin hole.
3. SMT patches carrier according to claim 1, it is characterised in that：The magnetic support plate be a metal plate simultaneously
Magnetic support plate is formed in the laminating magnetic material of its bottom, support plate location hole is offered in the quadrangle of magnetic support plate, is carried in magnetism
The product orientation needle relief hole mating with the product orientation needle of pedestal is offered in plate, the left part position of magnetic support plate offer with
The mating faces the product BOT device resigning straight slot in the faces each unit product BOT is offered in the right part position of magnetic support plate and is produced with each unit
The mating faces the product TOP device resigning straight slot in the faces product TOP.
4. SMT patches carrier according to claim 1, it is characterised in that：The magnetic closure is a metal plate,
The quadrangle of magnetic closure offers cover board location hole, and the product mating with the product orientation needle of pedestal is offered in magnetic closure
Pilot pin relief hole offers the product TOP face device mating with the faces each unit product TOP in the left part position of magnetic closure and steps down
Straight slot and product TOP face MARK point resigning straight slots, offer mating with the faces each unit product BOT in the right part position of magnetic closure
The faces product BOT device resigning straight slot and product BOT face MARK point resigning straight slots.
5. SMT patches carrier according to claim 1, it is characterised in that：The pedestal is in one side two corners or quadrangle
On be provided with 1 or 2 support plate position-limited needle, facilitate magnetic support plate to be quickly nested on pedestal by support plate position-limited needle.
6. SMT patches carrier according to claim 1, it is characterised in that：The pedestal offers load in the left and right sides
Plate facilitates magnetic support plate to pick and place on pedestal position.
7. SMT patches carrier according to claim 1, it is characterised in that：The magnetic support plate offer on it with
The mating faces product TOP of the product or faces BOT gold face resigning deep gouge, the faces the product TOP or faces BOT Quick Response Code resigning deep gouge.
8. SMT patches carrier according to claim 1, it is characterised in that：The magnetic support plate is opened up in the left and right sides
There is cover board position, magnetic closure is facilitated to pick and place on magnetic support plate.
9. SMT patches carrier according to claim 1, it is characterised in that：It is offered on the magnetic closure and product
The mating faces product TOP or the faces BOT Quick Response Code resigning straight slot.
10. a kind of patch method of SMT patches carrier according to claim 1, it is characterised in that：Include the following steps：
Step 1：Magnetic support plate is nested on pedestal；
Step 2：One spelling product TOP is nested in magnetic support plate upper surface left part position upwardly, another spelling product BOT is faced upward
It is nested in magnetic support plate upper surface right part position；
Step 3：Magnetic closure is nested on magnetic support plate and product, product be clamped in magnetic support plate and magnetic closure it
Between；
Step 4：The magnetic support plate for having packaged product and magnetic closure is removed from pedestal, is put into SMT wire body patches；
Step 5：After the completion of two spell each one side patch of product, magnetic closure is removed, takes out product；
Step 6：Magnetic support plate is nested on pedestal；
Step 7：The product TOP of one spelling BOT faces patch is nested in magnetic support plate upper surface left part position, by another spelling upwardly
The faces TOP patch product BOT upwardly be nested in magnetic support plate upper surface right part position；
Step 8：Magnetic closure is nested on magnetic support plate and product, product be clamped in magnetic support plate and magnetic closure it
Between；
Step 9：The magnetic support plate for having packaged product and magnetic closure is removed from pedestal, is put into SMT wire body patches；
Step 10：After the completion of two spell the two sides patch of product, magnetic closure is removed, takes out product；
So far, bout SMT patches production is completed, and is repeated above step 1 to 10 and is constantly produced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810835991.3A CN108811480A (en) | 2018-07-26 | 2018-07-26 | SMT patches carrier and its patch method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810835991.3A CN108811480A (en) | 2018-07-26 | 2018-07-26 | SMT patches carrier and its patch method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108811480A true CN108811480A (en) | 2018-11-13 |
Family
ID=64078395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810835991.3A Pending CN108811480A (en) | 2018-07-26 | 2018-07-26 | SMT patches carrier and its patch method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108811480A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111491450A (en) * | 2020-03-26 | 2020-08-04 | 宁波市富来电子科技有限公司 | Jig for double-sided reinforced FPC flexible board and production method |
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| CN206713168U (en) * | 2017-04-11 | 2017-12-05 | 常州星宇车灯股份有限公司 | One kind crosses furnace carrier cover plate ejection fixture |
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| JP2008016634A (en) * | 2006-07-06 | 2008-01-24 | Shin Etsu Polymer Co Ltd | Thin substrate transfer jig |
| JP2009259948A (en) * | 2008-04-15 | 2009-11-05 | Process Lab Micron:Kk | Positioning tool for carrier board |
| CN101282619A (en) * | 2008-05-21 | 2008-10-08 | 浙江安迪信信息技术有限公司 | Method for producing circuit board with double enter plates |
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Address after: 361000 2nd floor, No.19, Xianghai Road, industrial zone (Xiang'an), torch high tech Zone, Xiamen City, Fujian Province Applicant after: Xiamen Hongxin Electronic Technology Group Co., Ltd Address before: 361000, No. 19, No. 1, building No. 2, Xiang Hai Road, Xiamen torch hi tech Zone (Xiangan) Industrial Zone, Fujian Province Applicant before: XIAMEN HONGXIN ELECTRON-TECH Co.,Ltd. |