CN105514593B - Antenna structure - Google Patents
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- CN105514593B CN105514593B CN201410495723.3A CN201410495723A CN105514593B CN 105514593 B CN105514593 B CN 105514593B CN 201410495723 A CN201410495723 A CN 201410495723A CN 105514593 B CN105514593 B CN 105514593B
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- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000002596 correlated effect Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Abstract
A kind of antenna structure comprising: a substrate, a metal layer, a feed side conductive layer and a chip-type antenna；Substrate have a chip placement region, one first empty regions and one second empty regions, wherein the first and second empty regions by feed side conductive layer mark off Lai；Metal layer is disposed on the substrate, and wherein chip placement region, the first empty regions and the second empty regions are not exposed by metal layer covering；Feed side conductive layer is disposed on the substrate and is separated from each other with metal layer；Chip-type antenna is arranged on chip placement region, and wherein there are two the ground terminal of metal layer in electrical contact and the signal feed sides of a feed side conductive layer in electrical contact for chip-type antenna tool.One first resonant frequency and one second resonant frequency caused by antenna structure of the invention can be adjusted by means respectively of the size for changing the first empty regions and the second empty regions, so that antenna structure is designed to a single feed-in dual-band antenna or a single feed-in broad-band antenna.
Description
Technical field
The present invention relates to a kind of antenna structures more particularly to one kind to be designed to a single feed-in dual-band antenna or a single feedback
Enter the antenna structure of broad-band antenna.
Background technique
With the fast development of wireless communication industry, each class of electronic devices, such as mobile phone, computer, network etc., mesh
It is preceding all to have had using wireless communication the function of reaching signal transmission.The main transmitting of wireless communication and received equipment are signal
The antenna of transceiver and installing thereon.Therefore be the business opportunity vast in response to future wireless system, antenna will be one can not or
Scarce element, and in order to reduce the cost of manufacture of antenna itself and light, thin, short, small design requirement need to be met, therefore tradition
Antenna (such as flagpole antenna, yagi aerial, disc-shaped antenna), has been unable to meet the demand of new era.Wireless communications products at present
It is strided forward towards the target of microminiaturization, wherein antenna component is a kind of antenna patterns that developed in recent years, is occurred
One great power-assisted is undoubtedly to the development of future wireless system.
But antenna component provisioned in current each electronic product, it needs additionally give its enough clearance zone again mostly
Domain can just make antenna play the function of radiation, and it only possesses single one-segment operational capacity, cause its ability to work by
Limit, can not meet the demand of multi-band operation.
Summary of the invention
Technical problem to be solved by the present invention lies in, a kind of antenna structure is provided in view of the deficiencies of the prior art, it can
It is designed to a single feed-in dual-band antenna or a single feed-in broad-band antenna.
The technical problem to be solved by the present invention is to what is be achieved through the following technical solutions:
A kind of antenna structure comprising: a substrate, a metal layer, a feed side conductive layer and a chip-type antenna；It is described
Substrate has a chip placement region, one first empty regions and one second empty regions；The metal layer is arranged in the base
On plate, wherein the chip placement region, first empty regions and second empty regions not by metal layer cover and
It is exposed；The feed side conductive layer setting is separated from each other on the substrate and with the metal layer；The chip-type antenna is set
Set on the chip placement region, wherein the chip-type antenna tool there are two the metal layer in electrical contact ground terminal and
The signal feed side of the one feed side conductive layer in electrical contact.
Beneficial effects of the present invention can be that antenna structure provided by the present invention can be by the way that " substrate has
One chip placement region, one first empty regions and one second empty regions " and " chip-type antenna is arranged in the chip
Put region on " design so that one first resonant frequency and one second resonant frequency caused by the antenna structure can
It is adjusted by means respectively of the size for changing first empty regions and second empty regions, so that described
Antenna structure is designed to a single feed-in dual-band antenna or a single feed-in broad-band antenna.
To have made to be further understood that feature and technology contents of the invention, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however, the drawings only provide reference and explanation, the person of being not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the decomposition diagram of the antenna structure of the embodiment of the present invention 1；
Fig. 2 is that the metal layer of the embodiment of the present invention 1 is formed in the structural schematic diagram on substrate；
Fig. 3 is that the structural schematic diagram on chip placement region is arranged in the chip-type antenna of the embodiment of the present invention 1；
Fig. 4 is that the antenna structure of the embodiment of the present invention 1 carries out the change of the first empty regions to adjust the first resonant frequency
Antenna performance curve graph；
Fig. 5 is that the antenna structure of the embodiment of the present invention 1 carries out the change of the second empty regions to adjust the second resonant frequency
Antenna performance curve graph；
Fig. 6 is the antenna performance curve graph that the antenna structure of the embodiment of the present invention 1 is designed to a single feed-in dual-band antenna；
Fig. 7 is the antenna performance curve graph that the antenna structure of the embodiment of the present invention 1 is designed to a single feed-in broad-band antenna；
Fig. 8 is that the metal layer of the embodiment of the present invention 2 is formed in the structural schematic diagram on substrate；
Fig. 9 is that the structural schematic diagram on chip placement region is arranged in the chip-type antenna of the embodiment of the present invention 2.
[description of symbols]
Antenna structure S
1 chip placement region 10 of substrate
First empty regions 11
Second empty regions 12
First insulating regions 13
Second insulating regions 14
2 long side 21 of metal layer
Short side 22
Feed side conductive layer 3
4 ground terminal 41 of chip-type antenna
Signal feed side 42
Specific embodiment
It is to be illustrated " to be designed to single feed-in double frequency day recorded in the present invention by means of specific specific example below
The embodiment of the antenna structure of line or a single feed-in broad-band antenna ", those of ordinary skill in the art can be remembered by this specification
The content of load will readily appreciate that advantages of the present invention and effect.The present invention can also be applied by means of other different specific embodiments
Row or application, details in this specification can also be based on different perspectives and applications, without departing from the spirit of the present invention into
The various modifications of row and change.In addition, attached drawing of the invention is only to briefly describe, not describe according to actual size, that is, unreacted
The related actual size constituted out, hereby give notice that.The relevant technologies of the invention will be explained in further detail in the following embodiments and the accompanying drawings
Content, but documented content is not intended to limit the invention claims.
Embodiment 1
Shown in please referring to Fig.1 to Fig.3, the embodiment of the present invention 1 provides a kind of antenna structure S comprising: a substrate 1, a gold medal
Belong to layer 2, a feed side conductive layer 3 and a chip-type antenna 4.
Firstly, substrate 1 has a chip placement region 10, one first empty regions 11 and one shown in cooperation Fig. 1 and Fig. 2
Second empty regions 12, wherein chip placement region 10 can be close between the first empty regions 11 and the second empty regions 12
The position of top, and chip placement region 10 can be connected to the first empty regions 11 and the second empty regions 12.For example,
Substrate 1 can be circuit board, and 11,12 meaning of the first and second empty regions is exactly that will not place any conductive material thereon
Matter, or covered by any conductive material.
Furthermore cooperate Fig. 1 and Fig. 2 shown in, metal layer 2 can by any forming mode to be arranged on substrate 1, and
Chip placement region 10, the first empty regions 11 and 12 three of the second empty regions are not covered by metal layer 2 and present exposed
State (as shown in Figure 2).
For example, metal layer 2 first can be covered completely on substrate 1, then again will be a part of by any mode
Metal layer 2 remove, the removed part of metal layer 2 just will form the core for not covered and being presented naked state by metal layer 2
Piece puts region 10, the first empty regions 11 and the second empty regions 12.It is of course also possible to be pre-designed on substrate 1 and
A chip placement region 10, one first empty regions 11 and one second empty regions 12 are defined, so working as the direct shape of metal layer 2
At on substrate 1 when, chip placement region 10, the first empty regions 11 and the second empty regions 12 will be avoided, so that chip
Putting region 10, the first empty regions 11 and the second empty regions 12 will not be covered by metal layer 2 and exposed state is presented.
In addition, metal layer 2 has a long side 21 and a short side 22, and chip placement region 10 can be connected to the length of metal layer 2
Side 21, with formed one not by metal layer 2 entirely around open region.However, the present invention is not with above-mentioned lifted example
Son is limited.
In addition, shown in cooperation Fig. 1 and Fig. 2, feed side conductive layer 3 be also setting on substrate 1, and feed side conductive layer
3 can be separated from each other with metal layer 2 and state insulated from each other is presented.More specifically, as shown in Fig. 2, substrate 1 has one
The first insulating regions 13 and one between wherein a side and metal layer 2 of feed side conductive layer 3 are located at feed side conductive layer 3
An other opposite lateral side and metal layer 2 between the second insulating regions 14, so feed side conductive layer 3 can pass through first insulation
The isolation design in region 13 and the second insulating regions 14, and it is insulated from each other that feed side conductive layer 3 and metal layer 2 can be presented
State.
Specifically, feed side conductive layer 3 can be designed to be located at the first empty regions 11 and the second empty regions 12 it
Between, and (as shown in Figure 2) can be extended downward, so that the first empty regions 11 and the second empty regions 12 are distinguished into two
A independent empty regions for being separated from each other a preset distance, wherein the finger of so-called first and second empty regions 11,12 is exactly, with
Based on substrate 1, above or below the first and second empty regions 11,12 of substrate 1 (that is, it is net relative to first and second
At the lower section of the bottom surface of the substrate 1 of empty region 11,12), all there cannot be any conductive materials to be placed thereon, or have any
Conductive materials masking to above or below the first and second empty regions 11,12.
In addition, chip-type antenna 4 is arranged on chip placement region 10, wherein chip shown in cooperation Fig. 1, Fig. 2 and Fig. 3
There are two the ground terminal 41 of metal layer 2 in electrical contact and a wherein ends for a feed side conductive layer 3 in electrical contact for the tool of type antenna 4
Signal feed side 42.For example, two ground terminals 41 of chip-type antenna 4 can be located at the two-phase of chip-type antenna 4
It tosses about on end, the signal feed side 42 of chip-type antenna 4 can be located on the bottom end of chip-type antenna 4, and chip-type antenna 4 is set
It sets on the position close to the long side 21 of metal layer 2, however invention is not limited thereto.More specifically, when chip-shaped
Antenna 4 is arranged when on chip placement region 10, since chip placement region 10 can be connected to the first empty regions 11 and second
Empty regions 12, so natural will present of chip-type antenna 4 is connected to the first empty regions 11 and the second empty regions 12
State.
It is noted that one first resonant frequency is (such as Fig. 4 institute caused by antenna structure S shown in cooperation Fig. 4 to Fig. 7
Show) and one second resonant frequency (as shown in Figure 5), it can be respectively by changing the first empty regions 11 and the second empty regions 12
Size be adjusted so that the size of the first empty regions 11 and the second empty regions 12 can present it is different
Situation (or the identical situation of size also can), thus antenna structure S can be designed to a single feed-in dual-band antenna (as schemed
Shown in 6) or a single feed-in broad-band antenna (as shown in Figure 7).
For example, it is assumed that the width of the first empty regions 11 and the second empty regions 12 is fixed item
Under part, when the length of the first empty regions 11 is adjusted to 13mm, 14mm and 15mm respectively, it can be found that the first empty regions
When 11 length is longer, the first resonant frequency that analog quantity measures will be lower, and the length of the first empty regions 11 is more in short-term,
The first resonant frequency that then analog quantity measures will be higher.Therefore, the size of the first empty regions 11 can be with antenna structure S
The size of generated first resonant frequency is negatively correlated (inverse ratio), and when adjusting the first resonant frequency, as shown in figure 4,
Second resonant frequency will not change too much.
For example, as shown in fig. 5, it is assumed that the width of the first empty regions 11 and the second empty regions 12 is fixed item
Under part, when the length of the second empty regions 12 is adjusted to 8mm, 9mm and 10mm respectively, it can be found that the second empty regions 12
Length it is longer when, the second resonant frequency that analog quantity measures will be lower, and the length of the second empty regions 12 more in short-term, then
The second resonant frequency that analog quantity measures will be higher.Therefore, the size with antenna structure S of the second empty regions 12 are produced
The size of the second raw resonant frequency is negatively correlated (inverse ratio), and when adjusting the second resonant frequency, as shown in figure 5, first
Resonant frequency will not change too much.
Embodiment 2
It please refers to shown in Fig. 8 and Fig. 9, the embodiment of the present invention 2 provides a kind of antenna structure S comprising: a substrate 1, a gold medal
Belong to layer 2, a feed side conductive layer 3 and a chip-type antenna 4.In second embodiment of the invention, chip placement region 10 can be with
Be connected to the short side 22 of metal layer 2 instead, with formed one not by metal layer 2 entirely around open region, and core
Chip antenna 4 can be positioned close to instead on the position of short side 22 of metal layer 2.Therefore, chip placement region 10 and core
Chip antenna 4 (can cooperate Fig. 2 and Fig. 3 selectively along the long side of metal layer 2 21 according to different design requirements
It is shown) or it is laid out along the short side 22 (cooperation Fig. 8 and Fig. 9 shown in) of metal layer 2 setting.
In conclusion beneficial effects of the present invention can be, antenna structure S provided by the embodiment of the present invention can
Pass through " substrate 1 has a chip placement region 10, one first empty regions 11 and one second empty regions 12 " and " chip-shaped day
Line 4 is arranged on chip placement region 10 " design so that one first resonant frequency caused by antenna structure S and one the
Two resonant frequencies can be adjusted by means respectively of the size for changing the first empty regions 11 and the second empty regions 12, with
So that the antenna structure S property of can choose is designed to a single feed-in dual-band antenna or a single feed-in broad-band antenna.
The foregoing is merely preferable possible embodiments of the invention, non-therefore limitation the claims in the present invention protection scope,
Therefore all equivalence techniques variations done with description of the invention and accompanying drawing content, it is both contained in the claims in the present invention protection model
In enclosing.
Claims (9)
1. a kind of antenna structure, which is characterized in that the antenna structure includes:
One substrate, the substrate have a chip placement region, one first empty regions and one second empty regions；
One metal layer, the metal layer are arranged on the substrate, wherein the chip placement region, first empty regions
And second empty regions are not exposed by metal layer covering；
One feed side conductive layer, the feed side conductive layer setting are separated from each other on the substrate and with the metal layer；With
And
One chip-type antenna, the chip-type antenna are arranged on the chip placement region, wherein the chip-type antenna has
There are two the ground terminal of the metal layer in electrical contact and the signal feed sides of a feed side conductive layer in electrical contact；
Wherein, one first resonant frequency caused by the antenna structure is big by means of the area for changing first empty regions
Small to be adjusted, one second resonant frequency caused by the antenna structure is by means of changing the areas of second empty regions
Size is adjusted, so that the antenna structure is designed to a single feed-in dual-band antenna or a single feed-in broad-band antenna.
2. antenna structure as described in claim 1, which is characterized in that the chip placement regional connectivity is in first headroom
Region and second empty regions, and the chip-type antenna is connected to first empty regions and second clearance zone
Domain.
3. antenna structure as described in claim 1, which is characterized in that the substrate has one to be located at the feed side conductive layer
Wherein a side and the metal layer between the first insulating regions and one be located at the feed side conductive layer other side
The second insulating regions between side and the metal layer.
4. antenna structure as described in claim 1, which is characterized in that the metal layer has a long side and a short side,
And the chip placement region be connected to the metal layer the long side or the short side, to be formed one not by the gold
Belong to layer entirely around open region.
5. antenna structure as described in claim 1, which is characterized in that the feed side conductive layer is located at first clearance zone
Between domain and second empty regions, so that first empty regions and second empty regions are distinguished into two
It is separated from each other the independent empty regions of a preset distance.
6. antenna structure as described in claim 1, which is characterized in that two ground terminals are located at the chip-shaped day
On two opposite side ends of line, and the signal feed side is located on the bottom end of the chip-type antenna.
7. antenna structure as described in claim 1, which is characterized in that the size and the day of first empty regions
The size of first resonant frequency caused by cable architecture is negatively correlated.
8. antenna structure as described in claim 1, which is characterized in that the size and the day of second empty regions
The size of second resonant frequency caused by cable architecture is negatively correlated.
9. antenna structure as described in claim 1, which is characterized in that first empty regions and second empty regions
Size phase exclusive or it is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410495723.3A CN105514593B (en) | 2014-09-24 | 2014-09-24 | Antenna structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410495723.3A CN105514593B (en) | 2014-09-24 | 2014-09-24 | Antenna structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105514593A CN105514593A (en) | 2016-04-20 |
| CN105514593B true CN105514593B (en) | 2019-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410495723.3A Active CN105514593B (en) | 2014-09-24 | 2014-09-24 | Antenna structure |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106100662B (en) * | 2016-05-27 | 2018-11-09 | 上海传英信息技术有限公司 | Printed circuit board and wireless communication device with printed circuit board |
| CN106061114B (en) * | 2016-06-28 | 2018-09-11 | 广东欧珀移动通信有限公司 | Adjust system, method and the computer equipment in the antenna headroom area of PCB |
| CN110336115B (en) * | 2019-05-24 | 2021-02-23 | 和昊元(北京)科技有限公司 | Antenna capable of simultaneously driving double chips to work |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101330165A (en) * | 2007-06-18 | 2008-12-24 | 耀登科技股份有限公司 | Mini-type antenna |
| CN201383542Y (en) * | 2009-03-05 | 2010-01-13 | 佳邦科技股份有限公司 | Chip-type antenna device |
| CN203103496U (en) * | 2012-12-25 | 2013-07-31 | 昌泽科技有限公司 | High-directivity antenna module |
| TWM463428U (en) * | 2013-03-12 | 2013-10-11 | Wavetake Electronics Co Ltd | Wireless dispatching module |
| CN103928746A (en) * | 2013-01-11 | 2014-07-16 | 禾邦电子(苏州)有限公司 | Chip antenna device and purpose thereof, and electronic product provided with the chip antenna device |
-
2014
- 2014-09-24 CN CN201410495723.3A patent/CN105514593B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101330165A (en) * | 2007-06-18 | 2008-12-24 | 耀登科技股份有限公司 | Mini-type antenna |
| CN201383542Y (en) * | 2009-03-05 | 2010-01-13 | 佳邦科技股份有限公司 | Chip-type antenna device |
| CN203103496U (en) * | 2012-12-25 | 2013-07-31 | 昌泽科技有限公司 | High-directivity antenna module |
| CN103928746A (en) * | 2013-01-11 | 2014-07-16 | 禾邦电子(苏州)有限公司 | Chip antenna device and purpose thereof, and electronic product provided with the chip antenna device |
| TWM463428U (en) * | 2013-03-12 | 2013-10-11 | Wavetake Electronics Co Ltd | Wireless dispatching module |
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| Publication number | Publication date |
|---|---|
| CN105514593A (en) | 2016-04-20 |
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