CN108811351B - A kind of technique etched on high-order high-density circuit board - Google Patents
A kind of technique etched on high-order high-density circuit board Download PDFInfo
- Publication number
- CN108811351B CN108811351B CN201810866100.0A CN201810866100A CN108811351B CN 108811351 B CN108811351 B CN 108811351B CN 201810866100 A CN201810866100 A CN 201810866100A CN 108811351 B CN108811351 B CN 108811351B
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- Prior art keywords
- etching
- adhesive tape
- substrate
- plummer
- welded
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The technique that the invention discloses a kind of finely efficiently to etch on high-order high-density circuit board, it is the following steps are included: S1, in the top and bottom of substrate weld copper sheet, the equal adhesive tape in the top of copper sheet and the bottom of lower layer's copper sheet on upper layer, ensure that the shape of adhesive tape is consistent with the shape of required line layer, simultaneously in the contact position adhesive seal item of adhesive tape and substrate, the copper product below adhesive tape is eroded to avoid etching solution, achievees the purpose that accurately to etch；S2, manufacture etching machine: in the two sides of etching groove rotation installation shaft, handwheel is installed on one end of shaft, plummer is welded in shaft, two blind holes are opened up at the top of plummer, extension spring is welded in blind hole, pressing plate is welded at the top of spring, and is connected with escape pipe at the gas outlet of air compressor machine, to produce etching machine.The beneficial effects of the present invention are: etching cost can be saved, inorganic acid is recycled, is easy to operate.
Description
Technical field
The present invention relates to a kind of techniques etched on high-order high-density circuit board.
Background technique
High-order high-density circuit board is by multiple substrates for forming route and bonding material layer are alternately laminated and hot pressing
At the processing procedure to metallize in recycling drilling and hole, to reach the connection conducting function between each sandwich circuit.Wherein on substrate
Line layer be by etching solution etching get, before etching, will not need etching part tape-stripping, then by circuit
Plate is placed in the groove body for be loaded with etching solution and is etched, and etching solution erodes the copper product not covered by adhesive tape, when tearing
Required line layer can be obtained after lower adhesive tape.However, when the operation that worker salvages circuit board from groove body, circuit
Be attached with etching solution on the surface of plate, and etching solution as circuit board transports to subsequent cleaning process, lead to etching in groove body
The liquid level of liquid declines, and requires supplementation with new etching solution again at this time, causes increased costs.
Summary of the invention
The purpose of the present invention is to overcome the shortcomings of the existing technology, and etching cost can be saved, recycle by providing one kind
Inorganic acid, the technique easy to operate etched on high-order high-density circuit board.
The purpose of the present invention is achieved through the following technical solutions: a kind of work etched on high-order high-density circuit board
Skill, it the following steps are included:
S1, copper sheet is welded in the top and bottom of substrate, the top of copper sheet and the bottom of lower layer's copper sheet are equal on upper layer
Adhesive tape, it is ensured that the shape of adhesive tape is consistent with the shape of required line layer, while close in the stickup of the contact position of adhesive tape and substrate
Strip of paper used for sealing erodes the copper product below adhesive tape to avoid etching solution, achievees the purpose that accurately to etch；
S2, manufacture etching machine: in the two sides of etching groove rotation installation shaft, handwheel is installed on one end of shaft, is being turned
Plummer is welded on axis, two blind holes are opened up at the top of plummer, extension spring is welded in blind hole, is welded at the top of spring
Connect pressing plate, it is ensured that pressing plate presses on the top of plummer under the pulling force effect of spring；Finally installed on the side wall of etching groove
There is air compressor machine, and be connected with escape pipe at the gas outlet of air compressor machine, to produce etching machine；
S3, worker are lifted up two pressing plates, and then one end of substrate to be etched is placed therein under a pressing plate
Side, while its other end being placed in below another pressing plate, then unclamp two pressing plates, restoring force of the pressing plate in extension spring
Effect is lower to be resetted, and substrate presses between plummer and pressing plate at this time, to realize the Rapid tooling of substrate；
S4, worker rotate handwheel, so that shaft is rotated 180 ° around bearing block, so that circuit board is immersed in the intracorporal etching of slot
In liquid, etching solution is to the copper, Cu corrosion for being not covered with adhesive tape to obtain line layer；
S5, after etching a period of time, worker operation handwheel rotates backward 180 °, and plummer resets, and opens pneumatics at this time
The high pressure gas of machine, air compressor machine output blows down the moisture on substrate surface, blows down rear etching solution and comes back in etching groove.
The invention has the following advantages that the present invention can save etching cost, recycle inorganic acid, be easy to operate.
Specific embodiment
The present invention will be further described below, and protection scope of the present invention is not limited to as described below:
A kind of technique etched on high-order high-density circuit board, it the following steps are included:
S1, copper sheet is welded in the top and bottom of substrate, the top of copper sheet and the bottom of lower layer's copper sheet are equal on upper layer
Adhesive tape, it is ensured that the shape of adhesive tape is consistent with the shape of required line layer, while close in the stickup of the contact position of adhesive tape and substrate
Strip of paper used for sealing erodes the copper product below adhesive tape to avoid etching solution, achievees the purpose that accurately to etch；
S2, manufacture etching machine: in the two sides of etching groove rotation installation shaft, handwheel is installed on one end of shaft, is being turned
Plummer is welded on axis, two blind holes are opened up at the top of plummer, extension spring is welded in blind hole, is welded at the top of spring
Connect pressing plate, it is ensured that pressing plate presses on the top of plummer under the pulling force effect of spring；Finally installed on the side wall of etching groove
There is air compressor machine, and be connected with escape pipe at the gas outlet of air compressor machine, to produce etching machine；
S3, worker are lifted up two pressing plates, and then one end of substrate to be etched is placed therein under a pressing plate
Side, while its other end being placed in below another pressing plate, then unclamp two pressing plates, restoring force of the pressing plate in extension spring
Effect is lower to be resetted, and substrate presses between plummer and pressing plate at this time, to realize the Rapid tooling of substrate；
S4, worker rotate handwheel, so that shaft is rotated 180 ° around bearing block, so that circuit board is immersed in the intracorporal etching of slot
In liquid, etching solution is to the copper, Cu corrosion for being not covered with adhesive tape to obtain line layer；
S5, after etching a period of time, worker operation handwheel rotates backward 180 °, and plummer resets, and opens pneumatics at this time
The high pressure gas of machine, air compressor machine output blows down the moisture on substrate surface, blows down rear etching solution and comes back in etching groove, because
This can re-use etching solution again, avoid supplementing new etching solution into etching groove, to save etching cost.
The above is only a preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein
Form should not be regarded as an exclusion of other examples, and can be used for other combinations, modifications, and environments, and can be at this
In the text contemplated scope, modifications can be made through the above teachings or related fields of technology or knowledge.And those skilled in the art institute into
Capable modifications and changes do not depart from the spirit and scope of the present invention, then all should be in the protection scope of appended claims of the present invention
It is interior.
Claims (1)
1. a kind of technique etched on high-order high-density circuit board, it is characterised in that: it the following steps are included:
S1, copper sheet is welded in the top and bottom of substrate, the top of copper sheet and the bottom of lower layer's copper sheet bond on upper layer
Adhesive tape, it is ensured that the shape of adhesive tape is consistent with the shape of required line layer, while in the contact position adhesive seal item of adhesive tape and substrate,
The copper product below adhesive tape is eroded to avoid etching solution, achievees the purpose that accurately to etch；
S2, manufacture etching machine: in the two sides of etching groove rotation installation shaft, handwheel is installed on one end of shaft, in shaft
Plummer is welded, two blind holes are opened up at the top of plummer, extension spring is welded in blind hole, welds pressure at the top of spring
Plate, it is ensured that pressing plate presses on the top of plummer under the pulling force effect of spring；It is finally installed on the side wall of etching groove free
Press, and it is connected with escape pipe at the gas outlet of air compressor machine, to produce etching machine；
S3, worker are lifted up two pressing plates, then one end of substrate to be etched are placed therein below a pressing plate, together
When its other end is placed in below another pressing plate, then unclamp two pressing plates, pressing plate is acted in the restoring force of extension spring
Lower reset, substrate presses between plummer and pressing plate at this time, to realize the Rapid tooling of substrate；
S4, worker rotate handwheel, so that shaft is rotated 180 ° around bearing block, so that circuit board is immersed in the intracorporal etching solution of slot
In, etching solution is to the copper, Cu corrosion for being not covered with adhesive tape to obtain line layer；
S5, after etching a period of time, worker operation handwheel rotates backward 180 °, and plummer resets, and opens air compressor machine at this time, empty
The high pressure gas of press output blows down the moisture on substrate surface, blows down rear etching solution and comes back in etching groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810866100.0A CN108811351B (en) | 2018-08-01 | 2018-08-01 | A kind of technique etched on high-order high-density circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810866100.0A CN108811351B (en) | 2018-08-01 | 2018-08-01 | A kind of technique etched on high-order high-density circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108811351A CN108811351A (en) | 2018-11-13 |
| CN108811351B true CN108811351B (en) | 2019-07-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810866100.0A Active CN108811351B (en) | 2018-08-01 | 2018-08-01 | A kind of technique etched on high-order high-density circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN108811351B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111601463B (en) * | 2020-07-02 | 2022-06-24 | 遂宁市海翔电子科技有限公司 | Precise manufacturing method of heat dissipation composite type high-strength 5G circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204948517U (en) * | 2015-07-14 | 2016-01-06 | 郭永胜 | The Etaching device of printed circuit board (PCB) |
| CN105555048B (en) * | 2016-02-22 | 2018-05-11 | 苏州市亿利华电子有限公司 | A kind of pcb board automatic etching device |
| CN207612475U (en) * | 2017-12-21 | 2018-07-13 | 惠州大亚湾双益达电路板科技有限公司 | A kind of PCB circuit board wet etching machine |
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- 2018-08-01 CN CN201810866100.0A patent/CN108811351B/en active Active
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| Publication number | Publication date |
|---|---|
| CN108811351A (en) | 2018-11-13 |
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