CN202799365U - Cathode/anode copper foil heavy copper circuit board - Google Patents
Cathode/anode copper foil heavy copper circuit board Download PDFInfo
- Publication number
- CN202799365U CN202799365U CN 201220342202 CN201220342202U CN202799365U CN 202799365 U CN202799365 U CN 202799365U CN 201220342202 CN201220342202 CN 201220342202 CN 201220342202 U CN201220342202 U CN 201220342202U CN 202799365 U CN202799365 U CN 202799365U
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- Prior art keywords
- copper
- copper foil
- circuit board
- clad surface
- circuit
- Prior art date
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Abstract
The utility model is a cathode/anode copper foil heavy copper circuit board, which comprises a base material, a first copper foil surface and a second copper foil surface, wherein the first copper foil surface and the second copper foil surface are attached on two surfaces of the base material. The first copper foil surface and the second copper foil surface are provided with a copper foil circuit obtained after etching. Two sides of the copper foil circuit are provided with pre-compensation areas by performing the pre-compensation treatment on the copper foil circuit on the first copper foil surface and the second copper foil surface. In the etching, upper and lower pressures for spraying an etching solution are kept constant. Two copper foil surfaces are placed without selecting. The operation is simple and convenient.
Description
[technical field]
The utility model relates to circuit board, especially a kind of negative and positive Copper Foil heavy copper circuit board.
[background technology]
When producing circuit board, live width during for the etching of assurance circuit board is controlled in the designing requirement scope, for the thick different circuit board of copper copper at the bottom of the two sides, end copper thickness is larger, the time that need stop in etching solution is also longer, lateral erosion is just larger, during etching, what normally circuit was thin one faces down, and thicker that of circuit faces up, because the thick difference of copper copper at the bottom of the circuit board two sides, etch quantity difference is large, being difficult to control in the production, generally speaking, is by adjusting the upper of etching section in the production, downforce, to satisfy the etch quantity on two sides, make it within the identical time, to reach etched purpose, and when putting plate, be also noted that the face of distinguishing plate is other, troublesome poeration, otherwise circuit board is scrapped.
[utility model content]
The technical problems to be solved in the utility model provides a kind of negative and positive Copper Foil heavy copper circuit board, process by set copper foil circuit on the first copper-clad surface and the second copper-clad surface being done precompensation, namely be provided with the precompensation zone in the copper foil circuit both sides, the upper and lower pressure of spray etching liquid keeps constant when etching, the two sides does not have selectivity when putting plate, and is simple to operation.
For solving the problems of the technologies described above, a kind of negative and positive Copper Foil of the utility model heavy copper circuit board, comprise base material and the first copper-clad surface and the second copper-clad surface that are attached on the base material two sides, described the first copper-clad surface and the second copper-clad surface are provided with the copper foil circuit of gained after the etching, after described copper foil circuit both sides are provided with and make the first copper-clad surface and the second copper-clad surface etching, the precompensation zone that the live width of the copper foil circuit of gained meets design requirement; Described precompensation zone is before etching, processes film circuit gained, in etching process, circuit board is when sending into etching machine and carry out the etching operation, the first copper-clad surface of described circuit board and the second copper-clad surface can not add differentiation face not to be put into, and makes operation simpler, reduces scrapping of circuit board; Simultaneously, the upper downforce of spray etching liquid keeps constant.
A kind of negative and positive Copper Foil of the utility model heavy copper circuit board, after described copper foil circuit both sides are provided with and make the first copper-clad surface and the second copper-clad surface etching, the precompensation zone that the live width of the copper foil circuit of gained meets design requirement, the upper and lower pressure of spray etching liquid keeps constant when etching, it is other, simple to operation to distinguish its face when putting plate.
[description of drawings]
Below in conjunction with accompanying drawing embodiment of the present utility model is described in further detail, wherein:
Fig. 1 is the schematic diagram of a kind of negative and positive Copper Foil of the utility model heavy copper circuit board.
[embodiment]
Below in conjunction with accompanying drawing execution mode of the present utility model is elaborated.
A kind of negative and positive Copper Foil of the utility model heavy copper circuit board, comprise base material 1 and the first copper-clad surface 2 and the second copper-clad surface 3 that are attached on base material 1 two sides, described the first copper-clad surface 2 and the second copper-clad surface 3 are provided with the copper foil circuit 5 of gained after the etching, after described copper foil circuit 5 both sides are provided with and make the first copper-clad surface 2 and 3 etchings of the second copper-clad surface, the precompensation zone 6 that the live width of the copper foil circuit 5 of gained meets design requirement; Described precompensation zone 6 is before etching, processes film circuit gained, in etching process, circuit board is when sending into etching machine and carry out the etching operation, the first copper-clad surface 2 of described circuit board and the second copper-clad surface 2 can not add differentiation face not to be put into, and makes operation simpler, reduces scrapping of circuit board; Simultaneously, the upper downforce of spray etching liquid keeps constant.
Claims (3)
1. negative and positive Copper Foil heavy copper circuit board, it is characterized in that comprising base material (1) and be attached to the first copper-clad surface (2) and the second copper-clad surface (3) on base material (1) two sides, described the first copper-clad surface (2) and the second copper-clad surface (3) are provided with etched copper foil circuit (5), after described copper foil circuit (5) both sides are provided with and make the first copper-clad surface (2) and the second copper-clad surface (3) etching, the precompensation zone (6) that the live width of the copper foil circuit of gained (5) meets design requirement.
2. by the described a kind of negative and positive Copper Foil heavy copper circuit board of claim 1, it is characterized in that the thickness of described the first copper-clad surface (2) Copper Foil is greater than the thickness of the second copper-clad surface (3) Copper Foil.
3. by the described a kind of negative and positive Copper Foil heavy copper circuit board of claim 1, it is characterized in that the thickness of described the second copper-clad surface (3) Copper Foil is greater than the thickness of the first copper-clad surface (2) Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220342202 CN202799365U (en) | 2012-07-16 | 2012-07-16 | Cathode/anode copper foil heavy copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220342202 CN202799365U (en) | 2012-07-16 | 2012-07-16 | Cathode/anode copper foil heavy copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202799365U true CN202799365U (en) | 2013-03-13 |
Family
ID=47826529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220342202 Expired - Fee Related CN202799365U (en) | 2012-07-16 | 2012-07-16 | Cathode/anode copper foil heavy copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202799365U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796437A (en) * | 2014-01-27 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing negative and positive copper foil circuit board |
| CN104254196A (en) * | 2014-09-19 | 2014-12-31 | 江西景旺精密电路有限公司 | Asymmetric copper thickness double-sided aluminum substrate and processing method thereof |
| CN104684264A (en) * | 2015-02-14 | 2015-06-03 | 深圳市五株科技股份有限公司 | Etching method for inner-layer core board of printed circuit board |
| CN104684263A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of female and male thick copper circuit board |
| CN104853517A (en) * | 2014-02-19 | 2015-08-19 | 江苏天楹之光光电科技有限公司 | Circuit board structure |
| CN104977736A (en) * | 2014-04-09 | 2015-10-14 | 群创光电股份有限公司 | Display panel of conductive layer with variable line widths |
| CN105578774A (en) * | 2015-12-25 | 2016-05-11 | 惠州中京电子科技有限公司 | Fabrication method for female and male copper thicknesses of printed circuit board (PCB) |
| CN109862713A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of core material yin-yang copper production method |
-
2012
- 2012-07-16 CN CN 201220342202 patent/CN202799365U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684263A (en) * | 2013-11-29 | 2015-06-03 | 深南电路有限公司 | Processing method of female and male thick copper circuit board |
| CN104684263B (en) * | 2013-11-29 | 2017-12-29 | 深南电路有限公司 | A kind of processing method of negative and positive heavy copper circuit board |
| CN103796437A (en) * | 2014-01-27 | 2014-05-14 | 广州兴森快捷电路科技有限公司 | Method for manufacturing negative and positive copper foil circuit board |
| CN103796437B (en) * | 2014-01-27 | 2016-08-24 | 广州兴森快捷电路科技有限公司 | The manufacture method of cathode/anode aluminum foil circuit boards |
| CN104853517A (en) * | 2014-02-19 | 2015-08-19 | 江苏天楹之光光电科技有限公司 | Circuit board structure |
| CN104977736A (en) * | 2014-04-09 | 2015-10-14 | 群创光电股份有限公司 | Display panel of conductive layer with variable line widths |
| CN104254196A (en) * | 2014-09-19 | 2014-12-31 | 江西景旺精密电路有限公司 | Asymmetric copper thickness double-sided aluminum substrate and processing method thereof |
| CN104684264A (en) * | 2015-02-14 | 2015-06-03 | 深圳市五株科技股份有限公司 | Etching method for inner-layer core board of printed circuit board |
| CN105578774A (en) * | 2015-12-25 | 2016-05-11 | 惠州中京电子科技有限公司 | Fabrication method for female and male copper thicknesses of printed circuit board (PCB) |
| CN109862713A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of core material yin-yang copper production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20150716 |
|
| EXPY | Termination of patent right or utility model |