CN108778593A - Detect the diagnosis lead frame and method of the impurity in the solder bath of welding equipment - Google Patents
Detect the diagnosis lead frame and method of the impurity in the solder bath of welding equipment Download PDFInfo
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- CN108778593A CN108778593A CN201780017489.5A CN201780017489A CN108778593A CN 108778593 A CN108778593 A CN 108778593A CN 201780017489 A CN201780017489 A CN 201780017489A CN 108778593 A CN108778593 A CN 108778593A
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- solder
- lead frame
- container
- temperature
- welding equipment
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 196
- 238000003466 welding Methods 0.000 title claims abstract description 107
- 238000003745 diagnosis Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000012535 impurity Substances 0.000 title claims description 57
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims description 14
- 230000008859 change Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 6
- 230000009466 transformation Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004886 process control Methods 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 241000208340 Araliaceae Species 0.000 claims description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 2
- 239000004809 Teflon Substances 0.000 claims description 2
- 229920006362 Teflon® Polymers 0.000 claims description 2
- 235000008434 ginseng Nutrition 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 239000003344 environmental pollutant Substances 0.000 abstract description 4
- 231100000719 pollutant Toxicity 0.000 abstract description 4
- 239000000126 substance Substances 0.000 description 14
- 238000005476 soldering Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000009614 chemical analysis method Methods 0.000 description 3
- 230000036541 health Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012369 In process control Methods 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
- G01N25/04—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering of melting point; of freezing point; of softening point
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Quality & Reliability (AREA)
- Health & Medical Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
Abstract
The diagnosis lead frame (1) of pollutant in the solder bath (3) that the present invention relates to a kind of for detecting welding equipment, diagnosis lead frame (1) are implemented in this way：I.e. it can be mobile by the welding equipment by means of the Transmission system (6) of welding equipment, and diagnoses lead frame (1) and include at least container (8), the first temperature sensor (10) and assessment unit (14) at least first opening (9) and the second opening (11).Container (8) arranges in this way, i.e., its when it is mobile pass through welding equipment when, can the solder (3b) of predetermined amount solder bath (3) is passed out by the first opening (9) and enters container (8).Temperature sensor (10) the second opening (11) of container (8) be projected into container (8) and by with can predetermined amount solder (3b) thermally contact in a manner of arrange, and be used at least in the form of temperature curve (Ti (t)) sensing temperature at any time.Then, assessment unit (14) at least obtains the conclusion about the pollutant in solder bath (3,3b) from temperature curve (Ti (t)).In addition, the present invention relates to the method for the pollutant in the welding equipment with diagnosis lead frame (1) according to the present invention, the solder bath (3) for detecting welding equipment, and the method for operating welding equipment.
Description
Technical field
The diagnosis lead frame of impurity in the solder bath that the present invention relates to a kind of for detecting welding equipment, wherein impurity
Concentration can the welding of welding equipment operation in increase.In addition, the present invention relates to a kind of diagnosis welding with the present invention
The welding equipment of frame, a kind of method for checked for impurities and a kind of method for operating welding equipment.
Background technology
Welding is the hot method of the material adhesive joint of two components, is essentially to establish surface alloy.In such case
Under, welding point is usually manufactured by connecting material or solder, usually in the form of the meltable metal alloy being melted.This
Outside, the application of solder flux is common, is used to reduce involved surface during welding, and is accordingly used in improving solder
Flowing and wetting property and the surface tension for reducing the liquid solder on involved surface.
It is especially widely used in electronics and electronic technology field and known welding in more publications of comforming in principle
Method includes such as reflow soldering, wave crest slot or wave soldering, or even Selective Soldering, is essentially the change of wave soldering
Type.Although using so-called soldering paste in the case of reflow soldering, solder is used in the case of wave crest slot or wave soldering
Slot (solder bath).
The present invention relates to welding equipments and welding method, use solder bath in this case.
In the case of wave soldering (wave soldering), for example, being equipped with electronics on electronic building brick such as circuit board
Component simultaneously moves on weld ripples.By pumping liquid solder by slot from solder bath or by one or more holes of porous plate
To generate weld ripples.On the contrary, in the case of Selective Soldering, the only characterizing portion and solder contact of component, this is because example
If weld ripples is pumped by small nozzle, the size of small nozzle and the size on surface to be welded match.
In the case of application solder bath, basically there exist the danger gathered in the impurity solder pure when starting.Hair
The reason of raw such case, is for example in such as component that a small amount of substance for including is absorbed by liquid solder in the welding process.?
In this case, possible impurity source is such as parts metals and pre-welding circuit board.It can be led a small amount of impurity
It causes the physics and chemical property of solder and lead to change, and normally results in the quality being welded to connect that available solder obtains
Deteriorate.
In addition, impurity may relate to health or the harmful impurity of environment.The RoHS guides 2011/65/EU of European Union
(Restriction of Certain Hazardous Substances (limitations of certain harmful substances)) limits electronics work
The use of certain dangerous substances in industry, such as heavy metals such as lead, mercury, cadmium or chromate；Various fire retardants and plasticizer, and
And in each case, the limiting value for the concentration being kept substantially for each potential danger substance is provided.
However, especially with regard to solder bath, the potential danger material form of concentration increase with time cannot be excluded completely
Impurity because these substances in component to be welded containing a certain amount of, and for example with the ongoing operation of welding equipment
Time increases and is absorbed by liquid solder, and therefore, their concentration in solder bath increase.
For example, in the case of application lead-free solder, as welding equipment is continuously grasped with identical solder bath
The time of work increases, and lead can gather in solder bath.Possible reason includes the leaded metallization on component.In general, component
Type is standardized and can obtain short notice from different manufacturers, therefore always cannot definitely be excluded leaded
The presence of metallization.Theoretically, tin/lead prewelding circuit board may be the possible cause that lead gathers in original lead-free solder.
However, since circuit board is essentially to be specifically manufactured for specific application, can be excluded in the case of appropriate attention
These circuit boards gather the reason of lead in solder bath.
The impurity in solder bath is gathered more particularly to health and/or the harmful substance of environment in order to prevent, and is
Ensure that the quality being welded to connect carried out using this slot is as constant as possible, it will usually regularly replace the solder in welding equipment
Slot.It is required for considerable time and cost however, replacing every time.In this respect, the problem is that certain substance is in solder
The rate gathered in slot may strong variations.This particularly depends on the components especially used.Accordingly, it is necessary to fairly frequently more
The quality being welded to connect must be endured and be reduced with the increase of impurity in solder bath by changing solder bath or solder bath.The latter can
It can mean that under specific circumstances, especially in the case of impurity unexpectedly rapid accumulation, the quality meeting that is welded to connect
It substantially reduces.
Impurity in order to determine in solder bath is more than that scheduled limiting value and can need replacing time of solder bath
Point can determine the chemical composition of solder using various chemical analysis methods.However, these methods are usually required to sample and be transported
It is sent to laboratory.Correspondingly, there may be several days between sampling and obtaining result, this feature this alreading exceed or will
More than its concentration of certain substance in solder bath predetermined limit value when be particularly critical.
In order to solve this series of problems, EP2221136A1 discloses a kind of welding equipment, a kind of for detecting solder bath
The method of middle impurity and a kind of method for operating welding equipment, can be in time and near the scene with simple using it
Mode checked for impurities.Temperature in use sensor determines the change of the temperature curve of the solder during cooling or heating at any time
Change, the phase transformation or vice versa that it includes solders from solid to liquid, and by the curve and corresponding to free from admixture solder
The reference curve of temperature-time curve is compared.Then the difference that may occur provides the information about impurity levels.So
And in order to carry out this analysis, it is necessary to complicated equipment is provided, the temperature of solder bath can be recorded by the equipment, alternatively,
Such as in the case of chemical analysis method it may first have to can make a reservation for from solder bath and therefore from ongoing remove in the process
The solder of amount.In both cases, actual welding process generally has to interrupt in a short time.Further, it is necessary into enforcement
With can predetermined amount solder or solder bath cooled down or melted, so as to record the relation curve of temperature and time.Therefore,
The disclosure of EP2221136A1 is related to many work steps, therefore, as the case where established chemical analysis method,
Its is relative complex.
Invention content
Therefore, the purpose of the present invention is to provide a kind of equipment and a kind of method, can be by spy by the device and method
Not simple mode determines the presence of impurity in solder bath.This purpose is by diagnosing lead frame, being set by being used to detect welding
The method of impurity in standby solder bath and by being realized for operating the method for welding equipment.
About diagnosis lead frame, the purpose of the present invention passes through the impurity in a kind of solder bath for detecting welding equipment
Diagnosis lead frame realize,
The diagnosis lead frame is implemented in this way, i.e., it can be by means of the Transmission system of the welding equipment
Movement passes through the welding equipment, and
The diagnosis lead frame includes at least
There is at least first opening and the second open container,
- the first temperature sensor, and
Assessment unit,
The wherein described container is arranged in this way, i.e., when its movement is by the welding equipment, comes from the weldering
Hopper can predetermined amount solder by it is described first opening enter the container,
The wherein described temperature sensor is projected inwardly by second opening of the container in the container, and
By with it is described can predetermined amount solder thermally contact in a manner of arrange,
The wherein described temperature sensor is at least used to record the temperature changed over time in the form of temperature curve, and
The wherein described assessment unit at least obtains the information of the impurity in relation to the solder bath from the temperature curve.
Advantageously, during the ongoing operation of welding equipment, diagnosis lead frame that can be through the invention is miscellaneous to determine
The presence of matter.Diagnosis lead frame suitable for certain welding equipment is provided, it can be logical in its movement by the lead frame
Temperature curve is recorded when crossing welding equipment.Then temperature curve is compared with reference curve, the reference curve corresponds to
Solder free from foreign meter, i.e., pure solder.
In this case, diagnosis lead frame can have such as memory cell, wherein the memory cell is used
In the relation curve of storage temperature and time.Memory cell at least connect with the first temperature sensor and assessment unit or can connect
It connects.This memory cell be correspondingly preferably rested in diagnosis lead frame at or thereon.
Substantially, it may be considered that two options arrange assessment unit.On the one hand, assessment unit can be with diagnosis soldering frame
Frame is arranged apart so that assessment unit is not advanced through welding equipment with together with diagnosis lead frame.In this case, it measures
Temperature curve be for example temporarily stored in above-mentioned memory cell, the memory cell is directly connected to after be advanced through
To assessment unit.On the other hand, assessment unit can also be arranged in diagnosis lead frame at or thereon.This modification the case where
Under, similarly, such as in battery forms energy supply may be mounted at diagnosis lead frame at or thereon.
The information of relative substance especially impurity content be more than can predetermined limit value therefore should replace the information of solder bath.?
In the case of being arranged in the assessment unit at lead frame or in lead frame, this can for example be shown at least one display member
On part, such as acoustics or optical display element, preferably LED, the display element is equally arranged at diagnosis lead frame or it
On.In the case of assessment unit and diagnosis lead frame arranged apart, assessment unit and suitable aobvious in a given case
Showing element again can be integrated in the existing electronic unit of welding equipment or be arranged together with such electronic unit.
In a preferred embodiment, the assessment unit of diagnosis lead frame of the invention is implemented as,
Determine at least one local extremum from the temperature curve, the extreme value correspond essentially to it is described can predetermined amount
Solder enter the container start time point,
Diagnostic Time interval is determined since the start time point, occurs institute wherein in the Diagnostic Time interval
The cooling or heating that the solder occurs within the temperature range of the phase transformation of solder are stated, wherein the solder in the container is determined
Amount largest portion at least cures or melts, and
According at least during the part at the Diagnostic Time interval the temperature curve and/or be derived there
Temperature of the characteristic variable with recording under the same conditions and corresponding to period is heated or cooled in the temperature range with reference to solder
Write music line reference curve or fixed reference feature variable comparison determine it is existing poor in a given case, and when the difference is more than
The solder can be identified as being contaminated when predetermined limit value.
It is preferably solder identical with the solder of solder bath with reference to solder；However, it is preferably free from foreign meter with reference to solder, because
This is pure solder.However, it can also be the solder of intentionally one or more impurity containing known quantity.
In the embodiment of the diagnosis lead frame of the present invention,
The characteristic variable is temperature, and the temperature curve has platform tee section in this case,
The fixed reference feature variable is the fusion temperature with reference to solder, and
The difference is the difference between the characteristic variable and the fixed reference feature variable.
Another embodiment of the diagnosis lead frame of the present invention includes lid, and the lid is implemented as releasedly closing
Second opening of the container, and wherein described first temperature sensor is guided through the lid.
Container is preferably supported in the hole of diagnosis lead frame and is releasably fixed at there so that logical advancing
Receptacle is in the side towards solder bath of diagnosis lead frame in the case of crossing welding equipment.The case where using lid
Under, the second opening of such closing container with closure, second opening is positioned at diagnosis lead frame away from the side of solder bath.
In embodiment, container is formed in this way, i.e., the surface area of container is as big as possible relative to its volume,
Middle container is preferably tank shape, cone or hemispherical.The big surface area relative to volume of container, especially relative to
The surface area of volume maximization in the case of geometrical boundary condition, enabling during what is depended on the circumstances is heated or cooled to the greatest extent
May evenly and uniformly melt or cure in container can predetermined amount solder.
It should further be appreciated that container is preferably to be not adhere to tank made of material thereon solder, it is especially such as stainless
The material of steel or teflon.It, can be by after being advanced through welding equipment and obtaining information about the impurity in solder bath
Simple mode from container with solid state remove can predetermined amount solder.
Diagnosis lead frame preferred embodiment in, can predetermined amount solder by its entrance first opening be arranged in
In the region of the side wall of container and/or it is flute profile, ellipse or circle.When diagnosis lead frame reaches the position in welding equipment
When, can the solder of predetermined amount subsequently enter container, wherein diagnosis lead frame or container are substantially contacted with weld ripples first.At this time
Between point corresponding to assessment unit start time point.
Can predetermined amount solder on the one hand is determined by the size of weld ripples, on the other hand depending on welding equipment type by opening
The size of mouth and jet stream determines.In addition, the transmission speed of diagnosis lead frame and the second opening and the size of container rise and determine
Property effect.Based on these sizes, some welding equipment can the solder of predetermined amount substantially can be set as steady state value.
Advantageously, diagnosis lead frame includes second temperature sensor, and diagnosis lead frame is fixed in external container
On.Preferably, second temperature sensor is arranged in this way, i.e., its can measure diagnosis lead frame towards solder bath
Side temperature, especially relative to diagnosis lead frame direction of travel directly before container.In this case,
The start time point of assessment unit can be determined addedly or instead of the first temperature sensor by means of second temperature sensor.
Since compared with the first temperature sensor, second temperature sensor is arranged in external container, therefore it has more temperature change
Fast, particularly instantaneous reaction, especially to the temperature change caused by being contacted with weld ripples.On the contrary, the first temperature sensing
Device only indirectly by container and enter container can predetermined amount solder by contact with weld ripples, therefore react slower.
In addition, the purpose of the present invention is realized by a kind of welding equipment, the welding equipment includes
Solder bath contains liquid solder in welding operates, and the liquid solder may contain impurity, the impurity
Concentration increases in initial pure solder in welding operates,
Transmission system, by means of the Transmission system, lead frame can transport through the welding equipment, and
Diagnosis lead frame according at least one of preceding claims.
In addition, the purpose of the present invention is the methods by the impurity in a kind of solder bath for detecting welding equipment come real
It is existing,
The movement of diagnosis lead frame is wherein set to pass through the welding equipment,
The temperature changed over time is wherein recorded in the form of temperature curve in the container of the diagnosis lead frame,
Can predetermined amount solder from the solder bath enter the container, and
The information of the impurity in relation to the solder bath is wherein at least obtained from the temperature curve.
Advantageously, it is obtained while diagnosing lead frame movement and passing through welding equipment and assesses temperature curve.As a result, can
To automatically obtain diagnosis and the therefore information about the impurity of solder bath during the whole operation of welding equipment.
Advantageously, in the method for the invention,
Wherein determine at least one local extremum from the temperature curve, the extreme value correspond essentially to it is described can be pre-
Quantitative solder enters the start time point of the container,
Diagnostic Time interval is determined wherein since the start time point, is occurred wherein in Diagnostic Time interval
The cooling or heating of the solder occur within the temperature range of the phase transformation of the solder, in said case the institute in the container
The quantitative largest portion for stating solder at least cures or melts, and
Wherein according at least during the part at the Diagnostic Time interval the temperature curve and/or thus lead
The characteristic variable that goes out and obtain under the same conditions and corresponding to the phase is heated or cooled in the temperature range with reference to solder
Between the comparison of the reference curve or fixed reference feature variable of temperature that changes over time, it is existing poor in a given case to determine, and
And when the difference is more than by the solder to be identified as being contaminated when predetermined limit value.
In the movement of diagnosis lead frame by some time point of welding equipment, at least the first temperature sensor is sudden and violent for the first time
It is exposed to weld ripples.This event substantially defines the start time point at determining Diagnostic Time interval.The temperature curve of measurement rises at this
Time point begin with peak value, i.e. local maximum, is followed by local minimum.At least one of the two peak values can be advantageous
Ground is used for by specifying suitable shift time section come initial diagnostic time interval.In this case, shift time section is held
The selection of continuous time depends on specific solder on the one hand.Moreover, diagnosis transmission speed of the lead frame by welding equipment
It can work.
In addition, the preferred embodiment of the method for checked for impurities includes
The characteristic variable is temperature, and the temperature curve has platform tee section in this case,
The wherein described fixed reference feature variable is the fusion temperature with reference to solder, and
The wherein described difference is the difference between the characteristic variable and the fixed reference feature variable.
Finally, the purpose of the present invention is realized by a kind of method for operating welding equipment,
The wherein described welding equipment is used refer to fill solder on startup,
The diagnosis lead frame movement is wherein set to pass through the welding equipment,
The temperature changed over time is wherein recorded in the form of reference curve in the container of the diagnosis lead frame,
Can predetermined amount solder from the solder bath enter the container, and
The wherein described reference curve and/or be provided at can be by institute for fixed reference feature variable derived from the reference curve
Commentary is estimated in the memory cell of unit access and/or is entered in process control card.
It is preferably solder identical with the solder of solder bath with reference to solder；However, it is preferably free from foreign meter with reference to solder, because
This is pure solder.However, it can also be the solder of intentionally one or more impurity containing known quantity.Ginseng is wherein provided
The memory cell for examining curve and/or fixed reference feature variable is for example above-mentioned memory cell or individual memory cell again,
For example, memory cell associated with the electronic unit of welding equipment.
For the method for the present invention for operating welding equipment, advantageously,
With can predetermined time interval execute diagnostic measurement,
The diagnosis lead frame movement is wherein set to pass through the welding equipment,
The temperature changed over time is wherein recorded in the form of temperature curve in the container of the diagnosis lead frame,
Can predetermined amount solder from the solder bath enter the container, and
Wherein by the temperature curve and/or by its derived characteristic variable and reference curve, fixed reference feature variable and/
Or the temperature curve determined in prior point or associated characteristic variable compare, and
Wherein when the reference curve, previous temperature curve, fixed reference feature variable and/or previous characteristic variable with
Difference between Current Temperatures curve and/or characteristic variable be more than can predetermined limit value when, identify the pollution of the solder.
The various descriptions of method for checked for impurities can mutatis mutandis be applied to being welded for operating for the present invention
The method of equipment.
For example, diagnostic measurement can be repeated in each startup, every workday or the other periodic intervals of welding equipment.
In this case, these time intervals can match with application.The operating personnel of welding equipment, which only need to ensure that, makes this hair
Bright lead frame movement passes through the welding equipment according at least one described embodiment and the corresponding assessment of execution.It is no
Then, embodiment is depended on, operating personnel do not need additional method and step to determine the presence of impurity.
Advantageously, each temperature curve and/or characteristic variable and the time point that they are recorded are stored in memory
In unit and/or it is input into process control card.Then display diagnostic data can be for example changed over time especially to measure
Temperature curve and reference curve difference.It could therefore be concluded that going out the rate that impurity gathers in solder bath and predicting most
When should carry out solder bath replacement late.
Therefore, the present invention allows to detect the impurity contained in solder bath during ongoing operation.It therefore, can be by about miscellaneous
Any time table of matter degree is diagnosed, wherein only following lead frame in the sequence of welding equipment by diagnosing lead frame
Between traveling come postpone welding operation.This both can save the plenty of time, can also save cost, and may be implemented reachable
At the apparent quality improvement being welded to connect.Moreover, can recognize that if even if these impurity are without reducing the quality being welded to connect
Impurity.This is for impairing one's health and/or environmentally harmful substance is especially advantageous.
Description of the drawings
Invention will now be explained in more detail based on the drawings, and attached drawing is shown below：
Fig. 1 is the schematic diagram of the frame of the diagnosis welding of the present invention in welding equipment；
Fig. 2 is measuring temperature curve and reference curve；And
Fig. 3 is the flow chart for the embodiment for illustrating the method for the present invention for operating welding equipment.
Specific implementation mode
The diagnosis when its movement is by welding equipment with solder bath that Fig. 1 schematically shows the present invention is welded
Frame.For purposes of clarity, the component of welding equipment related to the present invention is illustrated only.Welding equipment includes solder bath 2,
It contains liquid solder 3 during welding operation.Liquid solder 3 is pumped out by solder guiding piece 4, in the current situation, solder
Guiding piece is, for example, nozzle, is at least partially protruding in liquid solder 3, the liquid for the liquid solder 3 in solder bath 2
Weld ripples 5 is generated above face.Certainly, it is suitable for other welding equipments with solder bath 2, are especially in slot or porous
The solder guiding piece 4 of the form in the hole of plate.
For welding, the lead frame (not separately shown) with component in place is by means of such as conveyer belt etc.
The Transmission system 6 (shown by dashed lines, to indicate transmission direction) of welding equipment is mobile by welding equipment, especially in weld ripples 5
On.
In order to detect the impurity in solder bath 2 increase with time, diagnosis lead frame 1 used according to the invention.This
In the case of, diagnosis lead frame 1 is matched with given welding equipment so that it can be moved by means of the Transmission system 6 of welding equipment
It is dynamic to pass through welding equipment.Diagnose lead frame include container 8, when container 8 moves on weld ripples 5, can predetermined amount solder 3b
Enter container 8 when its movement passes through welding equipment.In the example of embodiment illustrated herein, the setting of container 8 is welded in diagnosis
It connects in the hole of frame 1 and fixed.In this case, container 8 on the side towards solder bath of diagnosis lead frame from examining
The wall of disconnected lead frame 1 protrudes.It is of course also possible to select other geometries for container 8 diagnosis lead frame 1 at or its
On arrangement.Container 8 includes the first opening 9 and the second opening 11.When the diagnosis movement of lead frame 1 passes through welding equipment, one
Denier diagnosis lead frame substantially contacted first with weld ripples 5, can predetermined amount solder 3b just pass through first opening 9 enter.First
The embodiment of opening 9 must assure that when diagnosing the movement of lead frame 1 and passing through welding equipment, can the solder 3b of predetermined amount can be into
Enter container 8.Thus, it may be considered that various arrangements and geometry.In the embodiment shown in fig. 1, the first opening 9
It is realized such as in the form of slot, the longitudinal axis that diagnosis lead frame 1 is parallel to its longitudinal axis is extended and with correspondence
In the length of the substantially half of container perimeter.
Second opening 11 of the pot container 8 for Fig. 1 embodiments is substantially with lead frame main body 7 away from solder bath
3 surface overlaps and is sealed by lid 11.Be conducted through lid is the first temperature sensor 10, in this way
Arrangement so that it after entering container 8 with can the solder 8 of predetermined amount thermally contact.However, it should be noted that lid 11 is for this
The selectable unit (SU) of the diagnosis lead frame 1 of invention.Another selectable unit (SU) is second temperature sensor 12, is arranged in lead frame
It is equally connect in the region of the side towards solder bath 3 of main body 7 and with weld ripples when lead frame is advanced through welding equipment
It touches.
In the case of two 10,12 embodiments shown in Fig. 1 of temperature sensor by way of example with memory
Unit 13 connects, and memory cell 13 is arranged in lead frame main body 7 and is commented with the outside with optical display element 15
Estimate the connection of unit 14.Other possible variants mentioned above.
The application of the diagnosis lead frame 1 of the present invention allows the temperature curve that assessment is recorded automatically and automatically generates related
The information of impurity.In order to explain this automatic assessment, Fig. 2 shows can predetermined amount solder 3b enter it is cold after container 8
But during, in the case that with impurity one kind and without in the other case of impurity, for the measuring temperature of same solder
Curve Ti(t) and reference curve Tref(t)。
When initially contacting weld ripples, temperature curve reaches maximum of Tmax(tmax), it is followed by local minimum.Any extreme value
It is suitable for defining start time point t0；However, for the embodiment of Fig. 2, local minimum defines start time point t0.From
Begin time point t0Start, specifies suitable shift time section Δ tos, the selection of the shift time section depend on particular solder and
The conveying speed of the transport system 6 of welding equipment.In shift time section Δ tosLater, Diagnostic Time interval of delta tDStart, uses
In temperature curve Ti(t) actual assessment.For the embodiment of Fig. 2, Diagnostic Time interval of delta t is selectedDDuration, make it
Correspond essentially to temperature curve Ti(t) mesa-shaped part.This part corresponds to cold within the temperature range of undergoing phase transition
But the phase transformation of solder 3 during, the in this case quantitative largest portion solidification of the solder 3 in container 8.
Temperature curve T shown in Fig. 2i(t) and Tref(t) correspond to such situation, wherein certain pollution essentially results in
The fusion temperature of solder increases with the variation of impurity concentration.It then, in this case, for example, can be by mesa-shaped part
In measuring temperature average value be considered as characteristic variable TmOr fixed reference feature variable Tref.If characteristic variable and fixed reference feature variable
Between poor Δ T=Ti- Tref be more than can scheduled limiting value, then solder be identified as being contaminated.In solder 3 caused by impurity
Fusion temperature reduce in the case of apply equivalent method.
It fundamentally utilizes, time T of the period with solder 3 is being heated or cooled comprising phase transformationi(t) temperature changed
Degree sensitively depends on its chemical composition.Even if such as the pollutant of the micro-concentrations of 0.1 atom % usually can all lead to temperature
Curve Ti(t) the significant variation of process.This be not only suitable for be not solder metal alloy composition foreign substance pollution, also fit
Fluctuation for solder composition.
Temperature curve T shown in Fig. 2i(t) and Tref(t) it only indicates and corresponding reference curve Tref(t) it compares, impurity
Accumulation how to influence temperature curve Ti(t) one kind in many situations of process.Reference with solder free from foreign meter is bent
Line Tref(t) the temperature curve T comparedi(t) change in process depends sensitively on both the type of impurity and the amount of impurity,
Therefore for the expection impurity of a certain solder 3, it is necessary to select more each temperature curve T appropriatei(t) and Tref(t) mode.
About impurity to measuring temperature curve Ti(t) explanation of influence, referring especially to the description of EP2221136A1 and its Fig. 3, with
The mode of reference is incorporated herein.
For temperature curve Ti(t) and Tref(t) many different assessment algorithms of the difference between can be single in assessment
It provides in the addressable memory cell of member, and automatically or by operating personnel selects.
Flow chart based on Fig. 3 is discussed to the diagnosis lead frame 1 that can use the present invention in an illustrative manner now
The operation of welding equipment.Preferably, starting welding equipment and/or directly filling welding equipment with solder bath free from foreign meter
Afterwards, reference measure is carried out first.Make the movement of diagnosis lead frame 1 by welding equipment, and in order to carry out reference measure, by
In the first temperature sensor to include the reference curve T within the temperature range of phase transformationref(t) what form record changed over time
Temperature.It is then possible to from reference curve Tref(t) such as fixed reference feature variable T is determinedref.Reference curve Tref(t) it and refers to
Characteristic variable TrefIt may be stored in memory cell.It is furthermore possible to also provide process control card, and will at least refer to spy
Levy variable TrefInput, such as ablation process control card.
Then, diagnostic measurement can executed in scheduled time interval.In this case, make diagnosis soldering frame
Frame 1 re-moves through welding equipment and records temperature curve Ti(t), and in a given case, it is derived from characteristic variable
Tm.Then, it is determined that fixed reference feature variable TrefWith characteristic variable TiBetween poor Δ T=Tref-Tm.If poor Δ T can more than poor
Predetermined limit value Δ Tlim, then the repetition of diagnostic measurement is executed, or display must replace solder bath.In a given situation, certainly
The dynamic operation for interrupting welding equipment.On the contrary, if poor Δ T can predetermined limit value Δ T no more than poorlim, then allow the process
Continue, such as passes through the appropriate signaling instruction by means of display element 15.The temperature curve T that i is measured at some time pointi(t)
And relevant characteristic variable T in a given caseiEqually it can provide and/or input in a memory cell, for example be written
Process control card.In addition, if being recorded with short and regular time interval and recording corresponding temperature curve TiIt (t), then can be with
Determine the rate of accumulation of impurities.This provides more times to plan possible solder bath more for the operator of welding equipment
It changes.
In addition, in order to determine the increased rate of impurity, many reference curves can be generated, in this case, solder has
The material contamination of the different known quantity in meaning ground.It is then possible to execute the reference for measuring rate and being determined from different reference curves
The comparison of rate.Even if this when in the case of a small amount of impurity impurity also result in when the quality being welded to connect substantially reduces especially
It is significant.
The execution of duplicate measurements ensures that redundancy determines the presence of impurity.This works as temperature curve Ti(t) measured value is born
It is particularly advantageous when error.However, it should be noted that compared with known method, the application of diagnosis lead frame of the invention ensures spy
Not high reproducibility measures, because always removing same amount of solder from solder bath in an identical manner.Accordingly it is possible to prevent
The error of measured value caused by being measured by the removal of specific type or the temperature of specific type.This represent another of the present invention
Advantage.
Reference label and symbol
1 diagnosis lead frame
The container of the solder bath of 2 welding equipments
3 solder baths
In 3b containers can predetermined amount solder
4 solder guiding pieces
5 weld ripples
6 Transmission systems
7 lead frame main bodys
8 containers
The first opening in 9 containers
10 first temperature sensors
The second opening in 11 containers
11b lids
12 second temperature sensors
13 memory cells
14 assessment units
15 display units
T temperature
The t times
Ti(t) in the temperature curve of time point i
TiCharacteristic variable
Tref(t) reference curve
TrefFixed reference feature variable
TmaxMaximum temperature
t0Sart point in time
ΔtosShift time section
ΔtDDiagnostic Time interval
Difference between Δ T fixed reference features variable and characteristic variable
Δ T difference can scheduled limiting value
Claims (15)
1. a kind of diagnosis lead frame (1) of the impurity in solder bath (3) for detecting welding equipment,
The diagnosis lead frame (1) is implemented in this way, i.e., the described diagnosis lead frame (1) can be by means of the weldering
The Transmission system (6) for connecing equipment is mobile by the welding equipment, and
The diagnosis lead frame (1) includes at least
Container (8) at least first opening (9) and the second opening (11),
- the first temperature sensor (10), and
Assessment unit (14),
The wherein described container (8) is arranged in this way, i.e., when the container (8) is mobile passes through the welding equipment, comes
From the solder bath (3) can predetermined amount solder (3b) by it is described first be open (9) enter described container (8),
The wherein described temperature sensor (10) projects inwardly into the container by second opening (11) of the container (8)
(8) in, and by with it is described can predetermined amount solder (3b) thermally contact in a manner of arrange,
The wherein described temperature sensor (10) is at least used for temperature curve (Ti(t)) form records the temperature changed over time,
And
The wherein described assessment unit (14) is at least from the temperature curve (Ti(t)) it obtains in relation to the miscellaneous of the solder bath (3,3b)
The information of matter.
2. diagnosis lead frame (1) according to claim 1,
The wherein described assessment unit (14) is implemented as,
From the temperature curve Ti(t) determine at least one local extremum, the extreme value correspond essentially to it is described can predetermined amount
Solder (3b) enter the container (8) start time point (t0),
From the start time point (t0) start to determine Diagnostic Time interval (Δ tD), in Diagnostic Time interval (the Δ tD) in
The cooling or heating that the solder (3b) occurs within the temperature range of the phase transformation of the appearance solder (3b), wherein the container
(8) the quantitative largest portion of the solder (3b) at least cures or melts, and
According at least in Diagnostic Time interval (the Δ tD) a part during the temperature curve Ti(t) and/or thus
Derived characteristic variable (Ti) with record under the same conditions and corresponding to being heated in the temperature range with reference to solder or cold
But reference curve (the T of the temperature changed over time duringrefOr fixed reference feature variable (T (t))ref) comparison, determine given
In the case of existing poor (Δ T), and when poor (the Δ T) is more than can predetermined limit value (Δ Tlim) when by the solder (3,
It 3b) is identified as being contaminated.
3. diagnosis lead frame (1) according to claim 2,
Wherein
Characteristic variable (the Ti) it is temperature, the temperature curve has platform tee section in this case,
Fixed reference feature variable (the Tref) it is the fusion temperature with reference to solder, and
Poor (the Δ T) is the characteristic variable (Ti) and the fixed reference feature variable (Tref) between difference.
4. the diagnosis lead frame (1) according at least one of preceding claims,
Further comprise that lid (11b), the lid (11b) are implemented as releasedly closing described the of the container (8)
Two openings (11), and wherein described first temperature sensor (10) is guided through the lid (11b).
5. the diagnosis lead frame (1) according at least one of preceding claims,
The wherein described container (8) is implemented in this way, i.e., the surface area of the described container (8) is as big as possible, wherein the appearance
Device (8) is preferably implemented as tank shape, cone or hemispherical.
6. the diagnosis lead frame (1) according at least one of preceding claims,
The wherein described container (8) is tank, and the tank is preferably not adhere to material thereon by the solder and is made, and the material is outstanding
It is stainless steel or teflon.
7. the diagnosis lead frame (1) according at least one of preceding claims,
Wherein it is described can the solder (3b) of predetermined amount the container (8) is arranged in by first opening (9) of its entrance
In the region of side wall and/or it is flute profile, ellipse or circle.
8. the diagnosis lead frame (1) according at least one of preceding claims,
Further comprise that second temperature sensor (12), the second temperature sensor (12) are solid in the outside of the container (8)
It is scheduled on the diagnosis lead frame (1).
9. a kind of welding equipment, including
Solder bath (3), the solder bath (3) contain liquid solder in welding operates, and the liquid solder can contain miscellaneous
Matter, concentration increases the impurity in initial pure solder in welding operates,
Transmission system (6), by means of the Transmission system (6), lead frame can be transmitted through the welding equipment, and
Diagnosis lead frame (1) according at least one of preceding claims.
10. miscellaneous in a kind of solder bath (2) for detecting the welding equipment according at least one of preceding claims
The method of matter,
Wherein make diagnosis lead frame (1) is mobile to pass through the welding equipment,
Wherein with temperature curve (T in the container (8) of the diagnosis lead frame (1)i(t)) form record changes over time
Temperature, can predetermined amount solder (3b) from the solder bath (3) enter the container (8), and
Wherein at least from the temperature curve (Ti(t)) information of the impurity in relation to the solder bath (3,3b) is obtained.
11. according to the method described in claim 10,
Wherein from the temperature curve Ti(t) determine at least one local extremum, the extreme value correspond essentially to it is described can be pre-
Quantitative solder (3b) enters the start time point (t of the container (8)0),
Wherein from the start time point (t0) start to determine Diagnostic Time interval (Δ tD), in the Diagnostic Time interval (Δ
tD) in occurring that the cooling or heating of the solder (3b) occur within the temperature range of the phase transformation of the solder (3b), in the feelings
The quantitative largest portion of the solder (3b) under condition in the container (8) at least cures or melts, and
Wherein according at least in Diagnostic Time interval (the Δ tD) a part during the temperature curve Ti(t) and/or
Characteristic variable (the T being derived therei) with it is obtaining under the same conditions and corresponding to adding in the temperature range with reference to solder
Reference curve (the T for the temperature that heat or cooling period change over timerefOr fixed reference feature variable (T (t))ref) comparison, determine
Existing poor (Δ T) in a given case, and when poor (the Δ T) is more than can predetermined limit value (Δ Tlim) when by the weldering
Material (3,3b) is identified as being contaminated.
12. the method according to claim 10 or 11,
The wherein described characteristic variable (Ti) it is temperature, the temperature curve has platform tee section in this case,
The wherein described fixed reference feature variable (Tref) it is the fusion temperature with reference to solder, and
Wherein described poor (Δ T) is the characteristic variable (Ti) and the fixed reference feature variable (Tref) between difference.
13. a kind of method for operating the welding equipment according at least one of preceding claims,
The wherein described welding equipment is used refer to fill solder on startup,
Wherein make the diagnosis lead frame (1) is mobile to pass through the welding equipment,
Wherein with reference curve (T in the container (8) of the diagnosis lead frame (1)ref(t)) form record becomes at any time
The temperature of change, can predetermined amount solder (3b) from the solder bath (2) enter the container (8), and
The wherein described reference curve (Tref(t)) and/or from the reference curve (Tref(t)) fixed reference feature variable derived from
(Tref) be provided in the memory cell (13) that can be accessed by the assessment unit (14) and/or be entered excessively program-controlled
In fabrication.
14. according to the method for claim 13,
Wherein with can predetermined time interval execute diagnostic measurement,
Wherein make the diagnosis lead frame (1) is mobile to pass through the welding equipment,
Wherein with temperature curve (T in the container (8) of the diagnosis lead frame (1)i(t)) form record changes over time
Temperature, can predetermined amount solder (3b) from the solder bath (2) enter the container (8), and
Wherein by the temperature curve (Ti(t)) and/or by the temperature curve (Ti(t)) characteristic variable (T derived fromi) and ginseng
Examine curve (Tref(t)), fixed reference feature variable (Tref) and/or prior point determine temperature curve (Tj(t)) or it is related
Characteristic variable (the T of connectionj) compare, and
Wherein as the reference curve (Tref(t)), previous temperature curve (Tj(t)), fixed reference feature variable (Tref) and/or first
Preceding characteristic variable (Tj) and Current Temperatures curve (TiAnd/or characteristic variable (T (t))i) between difference (Δ T) be more than can make a reservation for
Limiting value (Δ Tlim) when, identify the pollution of the solder (3,3b).
15. according to the method for claim 13,
Wherein each temperature curve (Ti(t)、TjAnd/or characteristic variable (T (t))i、Tj) and its time point (i, j) for being recorded
It is provided in the memory cell (13) and/or is entered in the process control card.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016105182.9A DE102016105182A1 (en) | 2016-03-21 | 2016-03-21 | Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering machine |
| DE102016105182.9 | 2016-03-21 | ||
| PCT/EP2017/055976 WO2017162481A1 (en) | 2016-03-21 | 2017-03-14 | Diagnostic solder frame and method for detecting contaminants in a solder bath of a soldering installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108778593A true CN108778593A (en) | 2018-11-09 |
| CN108778593B CN108778593B (en) | 2021-05-28 |
Family
ID=58314201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780017489.5A Expired - Fee Related CN108778593B (en) | 2016-03-21 | 2017-03-14 | Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering apparatus |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3433045A1 (en) |
| CN (1) | CN108778593B (en) |
| DE (1) | DE102016105182A1 (en) |
| WO (1) | WO2017162481A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7276021B2 (en) * | 2019-09-06 | 2023-05-18 | オムロン株式会社 | Detection device, detection method and program |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665632A (en) * | 2002-05-24 | 2005-09-07 | 维特罗尼克斯索尔特克公司 | Reflow oven gas management system and method |
| DE102007050688A1 (en) * | 2007-10-22 | 2009-04-30 | Endress + Hauser Gmbh + Co. Kg | Soldering plant for the recognition of impurities contained in solder for soldering electronic components, comprises soldering bath containing liquid solder, device for recognizing the impurities, temperature sensor, and evaluation unit |
| EP2221136A1 (en) * | 2009-02-20 | 2010-08-25 | Endress+Hauser GmbH+Co. KG | Soldering assembly and method for recognising impurities contained in a solder |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1821048U (en) * | 1958-06-30 | 1960-11-03 | Siemens Ag | DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH. |
| US4180199A (en) * | 1978-02-27 | 1979-12-25 | Hollis Engineering, Inc. | Mass soldering control system |
| DE4035768A1 (en) * | 1990-11-07 | 1992-05-14 | Univ Berlin Humboldt | Measuring amt. of contamination in soft solder bath - by converting sonic pulses produced in metal probe dipped into bath into electrical pulses and plotting curve of phase summation against time |
| IL100838A (en) * | 1992-01-31 | 1995-06-29 | Sasson Shay | Solder wave parameters analyzer |
| US5767424A (en) * | 1996-12-23 | 1998-06-16 | Electronic Controls Design, Inc. | Wave solder analyzer |
| EP1162021B1 (en) * | 2000-06-06 | 2005-02-02 | Matsushita Electric Industrial Co., Ltd. | Method for estimating quality of lead-free solder material and process for flow soldering |
| DE102008050328A1 (en) * | 2008-10-07 | 2010-04-08 | Endress + Hauser Gmbh + Co. Kg | Determining a solder volume contained in a solder bath, comprises performing a reference measurement, filling the solder bath with a known initial liquid reference solder volume, and cooling the solder under reproducible given conditions |
| DE202013012057U1 (en) * | 2013-06-21 | 2015-03-05 | Siemens Aktiengesellschaft | Test plate for checking wave soldering processes |
-
2016
- 2016-03-21 DE DE102016105182.9A patent/DE102016105182A1/en not_active Withdrawn
-
2017
- 2017-03-14 EP EP17710885.9A patent/EP3433045A1/en not_active Withdrawn
- 2017-03-14 WO PCT/EP2017/055976 patent/WO2017162481A1/en active Application Filing
- 2017-03-14 CN CN201780017489.5A patent/CN108778593B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665632A (en) * | 2002-05-24 | 2005-09-07 | 维特罗尼克斯索尔特克公司 | Reflow oven gas management system and method |
| DE102007050688A1 (en) * | 2007-10-22 | 2009-04-30 | Endress + Hauser Gmbh + Co. Kg | Soldering plant for the recognition of impurities contained in solder for soldering electronic components, comprises soldering bath containing liquid solder, device for recognizing the impurities, temperature sensor, and evaluation unit |
| EP2221136A1 (en) * | 2009-02-20 | 2010-08-25 | Endress+Hauser GmbH+Co. KG | Soldering assembly and method for recognising impurities contained in a solder |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3433045A1 (en) | 2019-01-30 |
| WO2017162481A1 (en) | 2017-09-28 |
| CN108778593B (en) | 2021-05-28 |
| DE102016105182A1 (en) | 2017-09-21 |
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