DE1821048U - DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH. - Google Patents

DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH.

Info

Publication number
DE1821048U
DE1821048U DES27477U DES0027477U DE1821048U DE 1821048 U DE1821048 U DE 1821048U DE S27477 U DES27477 U DE S27477U DE S0027477 U DES0027477 U DE S0027477U DE 1821048 U DE1821048 U DE 1821048U
Authority
DE
Germany
Prior art keywords
bath
monitoring
composition
plumbing
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DES27477U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DES27477U priority Critical patent/DE1821048U/en
Publication of DE1821048U publication Critical patent/DE1821048U/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003Apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Vorrichtung zur Überwachung der metallischen Zu- sammensetzung eines Tauchlötbades. ------------------------- Neuerung Vorrichtung Die Si&a bezieht sich auf einSXsxfsES zur Überwachung Die B besieht ælch a der metallischen Zusammensetzung eines Standtauchlötbades. Eine solche Überwachung ist erforderlich, da Standlötbäder, die längere Zeit zum Löten benutzt wurden trotz öfteren Umrührens ihre Zusammensetzung ändern. contraption for monitoring the metallic supply composition of a dip solder bath. ------------------------- Innovation device The Si & a refers to an SXsxfsES for monitoring The B sees ælch a the metallic composition of a standing immersion solder bath. One Such monitoring is necessary because standing solder baths that have been used for a long time for soldering change their composition despite frequent stirring.

Das Lot wird nämlich praktisch bei Standlötbädern nur von der Badoberfläche entnommen und die Zusammensetzung des Lots an der Bandoberfläche ist in der Regel etwas anders als in der BAdtiefe; insbesondere entmischen sich im Laufe der Zeit Lötbäder, die aus Blei-Zinn-Legierungen bestehen und gegebenenfalls Zusätze von Silber ? Wismuth oder andere Zusätze enthalten. Eine laufende chemische Analyse ist zeitraubend und für einen Fertigungsbe- Neuerung trieb umständlich. Es ist Aufgabe der Ss : 6m ein einfaches Mittel für eine Pauschalanalyse anzugeben, die für praktische Zr ; ecke ausreicht. Neuerung Die ZM-W4UUWg geht davon aus ? daß Tauchlötbäder in der Regel in der einem Fertigungsbetrieb verwendet werden, 2m durch Pausen wird (Wathtpausens Peiertagspausen) untertrochen 7 in denen das Lötbad abgekühlt wird. Neuerung in SRtXtsgemäß sc&s/die Abkühlungakurve des Lötbades in einer <ist vorgesehen7 misst FertigungspauseisdxixeineT selbsttätige'Vorrichtung gemessen und und aufgezeichnet. Aus der AbkUhlungskurve läßt sich die chemische Zusammensetzung des Lötbgdes in einfacher Weise ermitteln, wenn man die Zusammensetzung des Bades grob kennt. Durch einfaches Probieren gewinnt mäh auch Erfahrungen aus den Meßkurven, die näheren Aufschluß über die infragestehende chemische Zusammen- setzunggeben. dieneuerungs. Vorrichtung 1 Besonders empfindlich ist EXgaxemäße BxiTR. wenn das Lötbad aus einer nahezu eutektischen Legierung besteht, weil sich Abweichungen von der eutektiachen Zusammensetzung in der Abkühlungskurve besonders stark bemerkbar machen die Im Rahmen der Verlötung von gedruckten Schaltungen hat sich neuerungs Torriohtung insbesondere bei Verwendung eines Lötbades aus Blei und Zinn mit Zusätzen aus Silber und/oder Wismuth bewährt. Ebenso wie die chemische Zusammensetzung sich in der Abkühlungskurve kundgibt, kennen auch Verunreinigungen qualitativ anhand der Abkühlungskurven ermittelt werden.The solder is practically only taken from the bath surface in standing solder baths and the composition of the solder on the strip surface is usually somewhat different than in the bath depth; in particular, solder baths that segregate over time consist of lead-tin alloys and, if necessary, additives of silver? Contains bismuth or other additives. An ongoing one chemical analysis is time consuming and for a manufacturing innovation drove awkward. It is an easy task for the Ss: 6m To indicate means for a general analysis, for practical Zr; corner is sufficient. innovation The ZM-W4UUWg assumes? that dip solder baths are usually in the used in a manufacturing company, 2m through breaks will (Wathtpausens Peiertagpausen) interrupted 7 in those the solder bath is cooled down. Innovation in SRtXts according to sc & s / the cooling curve of the solder bath in one <is provided7 measures Production pause is measured by an automatic device and recorded. The chemical temperature can be derived from the cooling curve Determine the composition of the soldering element in a simple manner, if one roughly knows the composition of the bath. By simple Trying out also gains experience from the measurement curves more detailed information about the chemical interrelationships in question setting. renewal. Device 1 EXgaxe BxiTR is particularly sensitive. if the solder bath consists of an almost eutectic alloy because There are deviations from the eutectic composition in the Make the cooling curve particularly noticeable the In the context of soldering printed circuits innovation Torriohtung especially when using a Solder bath made of lead and tin with additions of silver and / or Bismuth proven. Just like the chemical composition itself indicates in the cooling curve, impurities also know qualitatively based on the cooling curve.

Die Figur zeigt 6 Abkühlungskurven von Blei-Zinn-und Blei-Zinn-Silberlegierungen. Neben jeder Kurve ist die Legierungszusammensetzung in Gewichts% angegeben.The figure shows 6 cooling curves for lead-tin and lead-tin-silver alloys. The alloy composition is given in weight percent next to each curve.

Kurve 1 zeigt die Abkühlungskurve einer genauen eutektischen Legierung. Die gemeinsame Ausscheidung von Blei und Zinn tritt bei der Erstarrungstemperatur von 183,3°C ein. Bei dieser Temperatur kühlt sich die Legierung längere Zeit nicht weiter ab, weil die Erstarrungswärme frei wird. Die Abkühlungskurven von Zusammensetzungen mit höherem und .} niedrigerem Bleigehalt als der eutektischen Legierung entspricht zeigen die Kurven 2 und 3. Die Erstarrungstemperatur bleibt er- halten1 woraus man ablesen kann, daß keine Fremdbestandteile, die mit Blei oder Zinn Legierungen eingehen, im Bad enthaltensind. Bei höheren Temperaturen zeigen sich Knicke in den oberen Teilen der Kurven, die charakteristisch für den Bleigehalt sind.Curve 1 shows the cooling curve of a precise eutectic alloy. The joint precipitation of lead and tin occurs at the solidification temperature of 183.3 ° C. At this temperature the alloy does not cool any further for a long time because the solidification heat is released. The cooling curves of compositions with higher and .} lower lead content than the eutectic alloy show curves 2 and 3. The solidification temperature remains hold1 from which one can see that there are no foreign constituents in the bath that go into alloys with lead or tin. At higher temperatures, kinks appear in the upper parts of the curves, which are characteristic of the lead content.

Kurve 4 zeigt die Abkühlungskurve einer eutektischen Legierung aus Blei, Zinn und Silber. Die Erstarrungstemperatur liegt bei 17100 Abweichungen von der eutektischen Zusammensetzung dieser Legierung zeigen sich in den Abkühlungskurven 5 und 6. Die Knicke in den Kurven oberhalb der eutektischen Temperatur zeigen sich wiederum als charakteristisch für den Bleigehalt bzw. für das Verhältnis zwischen dem Bleianteil und dem Zinnanteil. Bei sehr geringen Silbermengen (Kurve 5) ist die Haltezeit bei der Erstarrungstemperatur 17100 geringer und es tritt die Erstarrungstemperatur der eutektischen Legierung von Blei und Zinn allein stärker hervor.Curve 4 shows the cooling curve of a eutectic alloy from Lead, tin and silver. The solidification temperature is 17100 Deviations of the eutectic composition of this alloy can be seen in the cooling curves 5 and 6. The kinks in the curves above the eutectic temperature appear again as characteristic of the lead content or the ratio between the lead content and the tin content. In the case of very small amounts of silver (curve 5) the holding time at the solidification temperature 17100 is shorter and the solidification temperature occurs the eutectic alloy of lead and tin alone is more prominent.

Als Verunreinigung komt in erster Linie Kupfer in Betracht, da in der Regel kupferhaltige Teile verlötet werden. Verunreini- gungen durch Kupfer machen sich ebenfalls in den Abkühlung- kurvenbemerkbar 1Schutzanspruch i 1Kurvenzeichnung The main contamination is copper, since parts containing copper are usually soldered. Impurity Congestions caused by copper are also reflected in the cooling noticeable in curves 1 claim for protection i 1 curve drawing

Claims (1)

Neuer Schutzanspruch -----------
Vorrichtung zur Überwachung der metallischen Zusammensetzungen eines Standtauchlötbades in einem Fertigung. betrieb, der durch Pausen unterbrochen wird, in denen sich das Lötbad abkühlt, gekennzeichnet durch ein Messgerät, das die Abkühlungskurven des Lötbades misst und auszeichnet
New right to protection -----------
Device for monitoring the metallic composition of a vertical solder bath in a production facility. operation that is interrupted by pauses in which the solder bath cools down, characterized by a measuring device that measures and characterizes the cooling curves of the solder bath
DES27477U 1958-06-30 1958-06-30 DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH. Expired DE1821048U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DES27477U DE1821048U (en) 1958-06-30 1958-06-30 DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES27477U DE1821048U (en) 1958-06-30 1958-06-30 DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH.

Publications (1)

Publication Number Publication Date
DE1821048U true DE1821048U (en) 1960-11-03

Family

ID=32943380

Family Applications (1)

Application Number Title Priority Date Filing Date
DES27477U Expired DE1821048U (en) 1958-06-30 1958-06-30 DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH.

Country Status (1)

Country Link
DE (1) DE1821048U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016105182A1 (en) * 2016-03-21 2017-09-21 Endress + Hauser Gmbh + Co. Kg Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016105182A1 (en) * 2016-03-21 2017-09-21 Endress + Hauser Gmbh + Co. Kg Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering machine

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