CN108778593B - Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering apparatus - Google Patents
Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering apparatus Download PDFInfo
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- CN108778593B CN108778593B CN201780017489.5A CN201780017489A CN108778593B CN 108778593 B CN108778593 B CN 108778593B CN 201780017489 A CN201780017489 A CN 201780017489A CN 108778593 B CN108778593 B CN 108778593B
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- 238000000034 method Methods 0.000 title claims abstract description 36
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- 238000003466 welding Methods 0.000 claims abstract description 114
- 238000011156 evaluation Methods 0.000 claims abstract description 28
- 238000011109 contamination Methods 0.000 claims abstract description 7
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- 239000000356 contaminant Substances 0.000 abstract description 2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
- G01N25/04—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering of melting point; of freezing point; of softening point
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Quality & Reliability (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating And Analyzing Materials By Characteristic Methods (AREA)
Abstract
The invention relates to a diagnostic soldering frame (1) for detecting contaminants in a solder bath (3) of a soldering apparatus, the diagnostic soldering frame (1) being implemented in such a way that: i.e. it can be moved through the welding apparatus by means of a transport system (6) of the welding apparatus, and the diagnostic welding frame (1) comprises at least a container (8) with at least a first opening (9) and a second opening (11), a first temperature sensor (10) and an evaluation unit (14). The container (8) is arranged in such a way that, when it is moved through the soldering apparatus, a predetermined amount of solder (3b) can be transferred out of the solder bath (3) through the first opening (9) and into the container (8). The temperature sensor (10) protrudes into the container (8) through a second opening (11) of the container (8) and is arranged in thermal contact with the predeterminable amount of solder (3b) and serves to sense temperature over time at least in the form of a temperature curve (ti (t)). Then, the evaluation unit (14) draws conclusions about the contamination in the solder bath (3, 3b) at least from the temperature curve (ti (t)). Furthermore, the invention relates to a soldering device with a diagnostic soldering frame (1) according to the invention, a method for detecting contamination in a solder bath (3) of a soldering device, and a method for operating a soldering device.
Description
Technical Field
The present invention relates to a diagnostic soldering frame for detecting impurities in a solder bath of a soldering apparatus, wherein the concentration of impurities can be increased in a soldering operation of the soldering apparatus. The invention further relates to a welding device having the diagnostic welding frame according to the invention, to a method for detecting impurities, and to a method for operating a welding device.
Background
Welding is a thermal method of material-bonded joining of two components, in principle by creating a surface alloy. In this case, the solder joints are usually produced by means of a joining material or solder, usually in the form of a fusible melted metal alloy. Furthermore, the application of fluxes is common, which is used to reduce the surfaces involved during soldering, and thus to improve the flow and wetting properties of the solder and to reduce the surface tension of the liquid solder on the surfaces involved.
Soldering methods which are particularly widely used in the field of electronics and which are known in principle from numerous publications include, for example, reflow soldering, wave soldering or wave soldering, or even selective soldering, which is in principle a variant of wave soldering. Although a so-called solder paste is used in the case of reflow soldering, a solder bath (solder bath) is used in the case of wave-bath or wave-soldering.
The present invention relates to a soldering apparatus and a soldering method, in which case a solder bath is used.
In the case of wave soldering (wave soldering), for example, an electronic assembly such as a circuit board carries electronic components and moves over the solder wave. The solder wave is generated by pumping liquid solder from a solder bath through the bath or through one or more holes of a porous plate. In contrast, in the case of selective soldering, only a defined part of the component is in contact with the solder, since, for example, the solder wave is pumped through a small nozzle, the dimensions of which match those of the surfaces to be soldered.
In the case of solder baths, there is essentially a risk of impurities accumulating in the initially pure solder. This occurs, for example, because small amounts of substances contained in the components are absorbed by the liquid solder during soldering. Possible sources of impurities in this case are, for example, component metallization and pre-soldered circuit boards. Even small amounts of impurities can cause changes in the physical and chemical properties of the solder and lead, and often result in a deterioration in the quality of the solder connections that can be obtained with the solder.
Furthermore, impurities may relate to impurities that are harmful to health or the environment. The RoHS directive 2011/65/EU of the European Union (Restriction of Certain Hazardous Substances) limits the use of Certain Hazardous Substances in the electronics industry, such as heavy metals like lead, mercury, cadmium or chromate; various flame retardants and plasticizers and, in each case, limits for the concentration which are substantially maintained for the respective potentially hazardous substance.
However, particularly with regard to solder baths, it is not possible to completely exclude impurities in the form of potentially dangerous substances whose concentration increases with time, since these substances contain a certain amount in the component to be soldered and are absorbed by the liquid solder, for example, as the time of continued operation of the soldering apparatus increases, and therefore their concentration in the solder bath increases.
For example, in the case of lead-free solder application, lead may accumulate in the solder bath as the time for continuous operation of the soldering apparatus with the same solder bath increases. Possible causes include metallization on the part with lead. In general, component types are standardized and can be temporarily informed from different manufacturers, so that the presence of a lead-containing metallization cannot always be ruled out with certainty. Theoretically, tin/lead pre-soldered circuit boards may be a possible cause of lead accumulation in the original lead-free solder. However, since circuit boards are in principle manufactured specifically for a particular application, it is possible to exclude, with due care, the reason why these circuit boards accumulate lead in the solder bath.
In order to prevent the accumulation of impurities in the solder bath, in particular substances that are harmful to health and/or the environment, and to ensure that the quality of the soldered connection made using such a bath is as constant as possible, it is customary to replace the solder bath in the soldering apparatus regularly. However, each replacement requires considerable time and cost. In this respect, there is a problem in that the rate at which a certain substance accumulates in the solder bath may vary strongly. Depending on, inter alia, the particular components used. Accordingly, the solder bath must be replaced very frequently, or the solder bath must tolerate a reduction in the quality of the soldered connection with an increase in impurities in the solder bath. The latter may mean that in certain cases, in particular in the case of an unexpectedly rapid accumulation of impurities, the quality of the welded connection is greatly reduced.
In order to be able to determine the point in time at which the impurities in the solder bath exceed a predeterminable limit value and the solder bath needs to be replaced, various chemical analysis methods can be used to determine the chemical composition of the solder. However, these methods typically require sampling and transport to the laboratory. Accordingly, there may be several days between sampling and obtaining the result, a feature which is particularly critical when a predetermined limit value for the concentration of a substance in the solder bath has been exceeded or is about to be exceeded.
In order to solve this series of problems, EP2221136a1 discloses a soldering apparatus, a method for detecting foreign matter in a solder bath, and a method for operating a soldering apparatus, with which foreign matter can be detected in a simple manner in a timely manner and in the vicinity of the site. A temperature sensor is used to determine the change over time of the temperature profile of the solder during cooling or heating, which involves a phase change of the solder from solid to liquid or vice versa, and the profile is compared with a reference profile corresponding to the temperature-time profile of the contaminant-free solder. The differences that may occur then give information about the degree of impurities. However, in order to carry out such an analysis, it is necessary to provide a complicated device by means of which the temperature of the solder bath can be recorded, or, for example, in the case of chemical analysis methods, a predeterminable amount of solder must first be removed from the solder bath and thus from the ongoing process. In both cases, the actual welding process must usually be interrupted within a short time. Furthermore, cooling or melting using a predeterminable amount of solder or solder bath must be carried out in order to be able to record the temperature versus time curve. Thus, the disclosure of EP2221136a1 involves many working steps and is therefore relatively complex as is the case with established chemical analysis methods.
Disclosure of Invention
It is therefore an object of the present invention to provide an apparatus and a method by means of which the presence of impurities in a solder bath can be determined in a particularly simple manner. This object is achieved by a diagnostic soldering frame, by a method for detecting impurities in a solder bath of a soldering apparatus and by a method for operating a soldering apparatus.
With regard to a diagnostic soldering frame, the object of the invention is achieved by a diagnostic soldering frame for detecting impurities in a solder bath of a soldering apparatus,
the diagnostic welding frame is embodied in such a way that it can be moved through the welding apparatus by means of a transport system of the welding apparatus, and
the diagnostic welding frame at least comprises
A container having at least a first opening and a second opening,
-a first temperature sensor, and
-an evaluation unit for evaluating the state of the device,
wherein the container is arranged in such a way that a predeterminable amount of solder from the solder pot enters the container through the first opening when it is moved through the soldering device,
wherein the temperature sensor protrudes inwardly into the container through the second opening of the container and is arranged in thermal contact with the predeterminable amount of solder,
wherein the temperature sensor is at least used for recording the temperature changing with time in the form of a temperature curve, and
wherein the evaluation unit obtains information on the impurities of the solder bath at least from the temperature profile.
Advantageously, the presence of impurities can be determined by the diagnostic welding framework of the present invention during continuous operation of the welding apparatus. A diagnostic welding frame is provided that is suitable for use with a welding apparatus by which temperature profiles can be recorded as it moves through the welding apparatus. The temperature profile is then compared with a reference profile corresponding to a solder free of impurities, i.e. a clean solder.
In this case, the diagnostic welding frame can have, for example, a memory unit for storing a temperature-time curve. The memory unit is connected or connectable at least to the first temperature sensor and to the evaluation unit. This memory unit is accordingly preferably placed at or on the diagnostic weld frame.
Basically, the evaluation unit may be arranged in consideration of two options. In one aspect, the evaluation unit may be arranged separately from the diagnostic welding frame, such that the evaluation unit does not travel through the welding apparatus with the diagnostic welding frame. In this case, the measured temperature profile is, for example, temporarily stored in the above-mentioned memory unit, which is connected directly to the evaluation unit after the travel through. On the other hand, the evaluation unit can also be arranged at or on the diagnostic welding frame. In the case of this variant, too, an energy supply, for example in the form of a battery, can be mounted at or on the diagnostic welding frame.
Information about impurities, particularly information that the content of impurities exceeds a predeterminable limit value and therefore the solder bath should be replaced. In the case of an evaluation unit arranged at or on the welding frame, this can be displayed, for example, on at least one display element, for example an acoustic or optical display element, preferably an LED, which is likewise arranged at or on the diagnostic welding frame. In the case of an evaluation unit arranged separately from the diagnostic welding frame, the evaluation unit and, in given cases, the appropriate display element can in turn be integrated in an existing electronics unit of the welding apparatus or arranged together with such an electronics unit.
In a preferred embodiment, the evaluation unit of the diagnostic welding frame of the invention is embodied as,
-determining from said temperature profile at least one local extremum, said extremum substantially corresponding to a starting point in time of entry of said predeterminable quantity of solder into said container,
-determining a diagnostic time interval, starting from the starting time point, in which cooling or heating of the solder takes place in a temperature range in which a phase transition of the solder occurs, wherein a quantitative maximum portion of the solder in the container at least solidifies or melts, and
-determining the difference present in a given situation from a comparison of the temperature profile and/or the characteristic variable derived therefrom at least during a part of the diagnostic time interval with a reference profile or reference characteristic variable recorded under the same conditions and corresponding to the temperature profile of a reference solder during heating or cooling in the temperature range, and identifying the solder as contaminated when the difference exceeds a predeterminable limit value.
The reference solder is preferably the same solder as the solder of the solder pot; however, the reference solder is preferably free of impurities and is therefore a pure solder. However, it may also be a solder intentionally containing a known amount of one or more impurities.
In an embodiment of the diagnostic weld frame of the present invention,
the characteristic variable is the temperature, in which case the temperature curve has a plateau-shaped cross section,
-the reference characteristic variable is the melting temperature of the reference solder, and
-the difference is a difference between the characteristic variable and the reference characteristic variable.
Another embodiment of the diagnostic weld frame of the present invention comprises a lid implemented to releasably close the second opening of the container, and wherein the first temperature sensor is directed through the lid.
The container is preferably supported in a bore of the diagnostic soldering frame and releasably fixed there, so that the container is arranged on the side of the diagnostic soldering frame facing the solder bath while travelling through the soldering device. In case a lid is used, such lid closes a second opening of the container, which is located at a side of the diagnostic soldering frame facing away from the solder bath.
In an embodiment, the container is formed in such a way that the surface area of the container is as large as possible relative to its volume, wherein the container is preferably pot-shaped, conical or hemispherical. The large surface area of the container relative to the volume, in particular the surface area maximized relative to the volume in the case of geometrical boundary conditions, makes it possible to melt or solidify the predeterminable amount of solder in the container as uniformly and consistently as possible during the heating or cooling as appropriate.
More advantageously, the container is a tank preferably made of a material to which solder does not adhere, in particular a material such as stainless steel or teflon. After travelling through the soldering apparatus and obtaining information about impurities in the solder bath, a predeterminable amount of solder can be removed in a simple manner from the container in the solidified state.
In a preferred embodiment of the diagnostic soldering frame, the first opening through which a predetermined amount of solder can enter is arranged in the region of a side wall of the container and/or is trough-shaped, oval or circular. When the diagnostic weld frame reaches a position within the welding apparatus, a predetermined amount of solder may then enter the container, wherein the diagnostic weld frame or container is essentially first contacted by the weld wave. This time point corresponds to the starting time point of the evaluation unit.
The predeterminable amount of solder is determined on the one hand by the size of the solder wave and on the other hand by the size of the opening and the jet depending on the type of soldering device. Furthermore, the speed of transport of the diagnostic welding frame and the dimensions of the second opening and the container play a decisive role. Based on these dimensions, the predeterminable amount of solder for a certain soldering apparatus can be set to a substantially constant value.
Advantageously, the diagnostic weld frame comprises a second temperature sensor fixed on the diagnostic weld frame outside the container. Preferably, the second temperature sensor is arranged in such a way that it can measure the temperature of the side of the diagnostic soldering frame facing the solder bath, in particular directly in front of the container with respect to the direction of travel of the diagnostic soldering frame. In this case, the starting point in time of the evaluation unit can be determined by means of the second temperature sensor in addition to or instead of the first temperature sensor. Since the second temperature sensor is arranged outside the container compared to the first temperature sensor, it has a faster, in particular instantaneous, reaction to temperature changes, in particular to temperature changes due to contact with the weld wave. In contrast, the first temperature sensor is only indirectly in contact with the solder wave through the container and the predeterminable amount of solder entering the container, and therefore reacts more slowly.
The object of the invention is also achieved by a welding device comprising
A solder bath containing liquid solder in a soldering operation, the liquid solder possibly containing impurities which increase in concentration in the initially pure solder in the soldering operation,
-a transport system by means of which a welding frame can be conveyed through the welding apparatus, and
-a diagnostic welding frame according to at least one of the preceding claims.
Further, the object of the present invention is achieved by a method for detecting impurities in a solder bath of a soldering apparatus,
-wherein a diagnostic welding frame is moved through the welding device,
-wherein the temperature over time is recorded in the form of a temperature profile in a container of the diagnostic soldering frame, into which container a predeterminable amount of solder can enter from the solder bath, and
-wherein information about impurities of the solder bath is obtained at least from the temperature profile.
Advantageously, the temperature profile is obtained and evaluated while diagnosing movement of the welding frame through the welding apparatus. As a result, the diagnosis and thus the information on the impurities of the solder bath can be automatically obtained during the entire operation of the soldering apparatus.
Advantageously, in the method of the present invention,
-wherein at least one local extreme is determined from the temperature profile, said extreme substantially corresponding to a starting point in time of entry of the predeterminable amount of solder into the container,
-wherein a diagnostic time interval is determined starting from the starting time point, in which diagnostic time interval cooling or heating of the solder takes place in a temperature range in which a phase change of the solder occurs, in which case a quantitative maximum portion of the solder in the container at least solidifies or melts, and
-wherein the difference present in a given situation is determined from a comparison of the temperature profile and/or a characteristic variable derived therefrom at least during a part of the diagnostic time interval with a reference profile or a reference characteristic variable obtained under the same conditions and corresponding to the temperature of a reference solder over time during heating or cooling in the temperature range, and the solder is identified as contaminated when the difference exceeds a predeterminable limit value.
At least a first temperature sensor is exposed to the weld wave for a first time at a point in time when the diagnostic welding frame is moving through the welding apparatus. This event essentially defines the starting point in time for determining the diagnostic time interval. The measured temperature profile has a peak at this starting time point, i.e. a local maximum, followed by a local minimum. At least one of these two peaks can advantageously be used to initiate a diagnostic time interval by specifying a suitable offset time period. In this case, the choice of the duration of the offset period depends on one aspect on the particular solder. Moreover, diagnosing the speed of transport of the welding frame through the welding apparatus can play a role.
Furthermore, a preferred embodiment of the method for detecting impurities comprises
The characteristic variable is the temperature, in which case the temperature curve has a plateau-shaped cross section,
-wherein the reference characteristic variable is the melting temperature of the reference solder, and
-wherein the difference is a difference between the characteristic variable and the reference characteristic variable.
Finally, the object of the invention is achieved by a method for operating a welding apparatus,
-wherein the soldering apparatus is filled with a reference solder at start-up,
-wherein the diagnostic welding frame is moved through the welding device,
-wherein the temperature over time is recorded in the form of a reference curve in a container of the diagnostic soldering frame, into which container a predeterminable amount of solder can enter from the solder bath, and
-wherein the reference curve and/or reference characteristic variables derived from the reference curve are provided in a memory unit accessible by the evaluation unit and/or input in a process control card.
The reference solder is preferably the same solder as the solder of the solder pot; however, the reference solder is preferably free of impurities and is therefore a pure solder. However, it may also be a solder intentionally containing a known amount of one or more impurities. The memory unit in which the reference curve and/or the reference characteristic variable is provided is in turn, for example, the above-mentioned memory unit or a separate memory unit, for example, a memory unit associated with an electronics unit of the welding device.
For the method according to the invention for operating a welding apparatus, it is advantageous,
-performing diagnostic measurements at predeterminable time intervals,
-wherein the diagnostic welding frame is moved through the welding device,
-wherein the temperature over time is recorded in the form of a temperature profile in a container of the diagnostic soldering frame, into which container a predeterminable amount of solder can enter from the solder bath, and
-wherein the temperature profile and/or a characteristic variable derived therefrom is compared with a reference profile, a reference characteristic variable and/or a temperature profile determined at a previous point in time or an associated characteristic variable, and
-wherein contamination of the solder is identified when the difference between the reference curve, the previous temperature curve, the reference characteristic variable and/or the previous characteristic variable and the current temperature curve and/or the characteristic variable exceeds a predeterminable limit value.
Various descriptions of the method for detecting impurities may be applied to the method for operating a welding apparatus of the present invention as applicable.
For example, the diagnostic measurements may be repeated at each start-up of the welding apparatus, each work day, or other periodic interval. In this case, these time intervals may be matched to the application. The operator of the welding apparatus only needs to ensure that the welding frame of the invention is moved through the welding apparatus according to at least one of the described embodiments and that a corresponding evaluation is performed. Otherwise, depending on the embodiment, the operator does not need additional method steps to determine the presence of impurities.
Advantageously, each temperature profile and/or characteristic variable and the point in time at which they are recorded are stored in a memory unit and/or are input into a process control card. The diagnostic data, in particular the difference of the measured temperature curve from the reference curve, can then be displayed, for example, as a function of time. Thus, the rate at which impurities accumulate in the solder bath can be inferred and a prediction can be made as to when a solder bath replacement should be performed at the latest.
Therefore, the present invention allows detection of impurities contained in the solder bath during continuous operation. Thus, the diagnostics can be performed on any schedule regarding the degree of contamination, wherein the welding operation is delayed by only diagnosing the progress of the welding frames between the welding apparatuses following the sequence of welding frames. This saves both considerable time and costs and achieves a significant improvement in the quality of the weld connection that can be achieved. Moreover, even if these impurities do not degrade the quality of the welded connection, the impurities can be identified. This is particularly advantageous for substances which are detrimental to health and/or are harmful to the environment.
Drawings
The invention will now be explained in more detail on the basis of the drawings, which show the following:
FIG. 1 is a schematic view of a diagnostic welding framework of the present invention in a welding apparatus;
FIG. 2 is a measured temperature curve and a reference curve; and
FIG. 3 is a flow chart illustrating an embodiment of the method of the present invention for operating a welding apparatus.
Detailed Description
Fig. 1 schematically illustrates a diagnostic soldering frame of the present invention as it moves through a soldering apparatus having a solder bath. For the sake of simplicity, only the components of the welding apparatus relevant to the present invention are shown. The soldering apparatus comprises a solder bath 2 which contains liquid solder 3 during the soldering operation. The liquid solder 3 is pumped out through a solder guide 4, in the present case a nozzle, for example, which projects at least partially into the liquid solder 3 for generating a solder wave 5 above the liquid level of the liquid solder 3 in the solder bath 2. Of course, the invention is also applicable to other soldering apparatuses having a solder bath 2, in particular a solder guide 4 in the form of a trough or a hole of a perforated plate.
For welding, a welding frame (not shown separately) with parts in place is moved through the welding apparatus, in particular on the welding wave 5, by means of a transport system 6 (shown by dashed lines, which indicate the transport direction) of the welding apparatus, for example a conveyor belt.
In order to detect impurities in the solder bath 2 that increase over time, a diagnostic soldering frame 1 is used according to the invention. In this case, the diagnostic welding frame 1 is matched to a given welding apparatus such that it can be moved through the welding apparatus by means of the transport system 6 of the welding apparatus. The diagnostic soldering frame comprises a container 8 into which a predetermined amount of solder 3b can enter as it moves through the soldering apparatus as the container 8 moves over the solder wave 5. In the example of embodiment shown herein, the container 8 is placed in a hole in the diagnostic weld frame 1 and secured. In this case, the container 8 protrudes from the wall of the diagnostic soldering frame 1 on the side of the diagnostic soldering frame facing the solder bath. Of course, other geometries can also be selected for the arrangement of the container 8 at or on the diagnostic weld frame 1. The container 8 comprises a first opening 9 and a second opening 11. When the diagnostic weld frame 1 is moved through the welding apparatus, a predetermined amount of solder 3b may enter through the first opening 9 once the diagnostic weld frame is substantially first in contact with the weld bead 5. The embodiment of the first opening 9 has to ensure that a predeterminable amount of solder 3b can enter the container 8 when the diagnostic soldering frame 1 is moved through the soldering apparatus. For this purpose, various arrangements and geometries are conceivable. In the embodiment shown in fig. 1, the first opening 9 is realized, for example, in the form of a groove, which extends with its longitudinal axis parallel to the longitudinal axis of the diagnostic weld frame 1 and has a length corresponding to approximately half of the circumference of the container.
The second opening 11 of the pot-shaped container 8 for the embodiment of fig. 1 substantially coincides with the surface of the soldering frame body 7 facing away from the solder pot 3 and is sealed by a lid 11. Guided through the cover is a first temperature sensor 10, which is arranged in such a way that it is in thermal contact with a predeterminable amount of solder 8 after entering the container 8. It should be noted, however, that the cover 11 is an optional component for the diagnostic weld frame 1 of the present invention. Another optional component is a second temperature sensor 12 which is arranged in the region of the side of the soldering frame body 7 facing the solder bath 3 and which is also in contact with the solder wave as the soldering frame travels through the soldering apparatus.
The two temperature sensors 10, 12 are connected by way of example in the case of the exemplary embodiment shown in fig. 1 to a memory unit 13, the memory unit 13 being arranged on the welding frame body 7 and being connected to an external evaluation unit 14 having an optical display element 15. Other possible variations are mentioned above.
The application of the diagnostic welding frame 1 of the invention allows to automatically evaluate the recorded temperature profile and to automatically generate information about the impurities. To explain this automatic evaluation, fig. 2 shows the measured temperature profile T for the same solder during cooling after a predeterminable quantity of solder 3b has entered the container 8, in one case with impurities and in the other case without impuritiesi(T) and a reference curve Tref(t)。
At the time of initial contact welding, the temperature curve reaches a maximum value Tmax(tmax) Followed by a local minimum. Either extreme value is suitable for defining the starting time t0(ii) a However, for the embodiment of fig. 2, the local minimum defines the starting point in time t0. From a starting point in time t0Initially, an appropriate offset time period Δ t is specifiedosThe choice of the offset period depends on the particular solder and the delivery speed of the delivery system 6 of the soldering apparatus. At an offset time period Δ tosThereafter, the diagnosis time interval Δ tDAt the beginning, it is used for the temperature profile Ti(t) actual evaluation. For the embodiment of fig. 2, the diagnostic time interval Δ t is selectedDSo that it substantially corresponds to the temperature curve Ti(t) a platform-shaped portion. This portion corresponds to the phase transformation of the solder 3 during cooling in the temperature range in which the phase transformation occurs, in which case the quantitative maximum portion of the solder 3 in the container 8 solidifies.
Temperature profile T shown in FIG. 2i(T) and Tref(t) corresponds to a case where some contamination basically causes the melting temperature of the solder to increase with a change in the impurity concentration. Then, in this case, for example, the average value of the measured temperatures in the plateau-shaped portion may be regarded as the characteristic variable TmOr a reference characteristic variable Tref. If the difference between the characteristic variable and the reference characteristic variable is TiIf Tref exceeds a predeterminable limit value, the solder is identified as contaminated. The equivalent method is applied in the case where the melting temperature of the solder 3 is lowered due to the impurities.
It is fundamentally utilized that the time T following the solder 3 during heating or cooling including phase changei(t) the temperature of the change sensitively depends on its chemical composition. Even trace concentrations of contaminants, e.g. 0.1 atomic%, will generally lead to a temperature profile Ti(t) significant changes in the course of (t). This applies to both contamination by foreign substances that are not solder metal alloy compositions and to fluctuations in solder composition.
Temperature profile T shown in FIG. 2i(T) and Tref(T) represents the reference curve T onlyref(T) how the accumulation of impurities affects the temperature curve Ti(t) is one of many cases. Reference curve T with solder free of impuritiesrefTemperature profile T of (T) phase ratioiThe process variation of (T) depends sensitively on both the type of impurity and the amount of impurity, so for a certain expected impurity of the solder 3, a suitable comparison of the temperature profiles T has to be choseni(T) and Tref(t) mode. With respect to impurity vs. measured temperature curve Ti(t), reference is made in particular to the description of EP2221136A1 and its FIG. 3, which is incorporated herein by reference.
For determining the temperature profile Ti(T) and Tref(t) a number of different evaluation algorithms for the differences between (t) may be provided in a memory unit accessible to the evaluation unit and selected automatically or by an operator.
The operation of a welding device which may use the diagnostic welding framework 1 of the present invention will now be discussed by way of example based on the flowchart of fig. 3. Preferably, the reference measurement is first carried out after starting up the soldering device and/or directly after filling the soldering device with a solder bath free of impurities. The diagnostic welding frame 1 is moved through the welding apparatus and, for reference measurements, a reference curve T in a temperature range encompassing the phase change is determined by means of a first temperature sensorref(t) the temperature was recorded as a function of time. Then, it is possible to obtain from the reference curve Tref(T) determination of, for example, a reference characteristic variable Tref. Reference curve Tref(T) and a reference characteristic variable TrefMay be stored in the memory unit. Furthermore, a process control card may be provided and at least the characteristic variable T will be referencedrefInput, for example, a write process control card.
Diagnostic measurements can then be performed over a predeterminable time interval. In this case, the diagnostic welding frame 1 is moved again through the welding apparatus and the temperature profile T is recordedi(T) and, in the given case, deriving therefrom a characteristic variable Tm. Then, a reference characteristic variable T is determinedrefAnd a characteristic variable TiDifference therebetween Δ T ═ Tref-Tm. If the difference DeltaT is greater than a predeterminable limit value DeltaT for the differencelimA repeat of the diagnostic measurement is performed or it is indicated that the solder bath has to be replaced. In given cases, the operation of the welding apparatus is automatically interrupted. Conversely, if the difference Δ T does not exceed the predeterminable limit value Δ T of the differencelimThe process is allowed to continue, for example by appropriate signaling indication by means of the display element 15. Temperature profile T measured at a certain time ii(T) and in the given case the relevant characteristic variable TiIt is likewise possible to provide and/or input, for example write process control cards, in the memory unit. In addition, if the corresponding temperature profile T is recorded and recorded at short and regular intervalsi(t), the rate of impurity accumulation can be determined. This provides the operator of the soldering apparatus more time to plan for possible solder bath replacement.
Furthermore, to determine the rate of impurity increase, a number of reference curves may be generated, in which case the solder is intentionally contaminated with different known amounts of material. A comparison of the measured rate with a reference rate determined from a different reference curve may then be performed. This is particularly relevant when the impurities, even in the case of small amounts of impurities, lead to a considerable reduction in the quality of the welded connection.
The performance of repeated measurements ensures redundant determination of the presence of impurities. This is when the temperature curve TiThe measurement of (t) is particularly advantageous when subject to errors. It should be noted, however, that the application of the diagnostic soldering frame of the invention ensures a particularly high reproducibility of the measurement compared to the known methods, since the same amount of solder is always removed from the solder bath in the same way. Thus, errors in the measured values caused by a particular type of removal or a particular type of temperature measurement can be prevented. This represents another advantage of the present invention.
Reference numerals and symbols
1 diagnostic welding frame
2 container of solder pot of soldering apparatus
3 solder bath
3b predetermined amount of solder in container
4 solder guide
5 wave welding
6 transmission system
7 welding the frame body
8 container
9 first opening in the container
10 first temperature sensor
11 second opening in the container
11b cover
12 second temperature sensor
13 memory cell
14 evaluation unit
15 display unit
T temperature
time t
Ti(t) temperature profile at time point i
TiCharacteristic variable
Tref(t) reference curve
TrefReference characteristic variable
TmaxMaximum temperature
t0Starting point in time
ΔtosOffset time period
ΔtDDiagnostic time interval
Difference between Δ T reference characteristic variable and characteristic variable
Predeterminable limit value for the delta T difference
Claims (17)
1. A diagnostic soldering frame (1) for detecting impurities in a solder bath (3) of a soldering apparatus,
the diagnostic welding frame (1) is embodied in such a way that the diagnostic welding frame (1) can be moved through the welding device by means of a transport system (6) of the welding device, and
the diagnostic welding frame (1) at least comprises
-a container (8) having at least a first opening (9) and a second opening (11),
-a first temperature sensor (10), and
an evaluation unit (14),
wherein the container (8) is arranged in such a way that a predeterminable amount of solder (3b) from the solder bath (3) enters the container (8) through the first opening (9) when the container (8) is moved through the soldering device,
wherein the first temperature sensor (10) protrudes inwardly into the container (8) through the second opening (11) of the container (8) and is arranged in thermal contact with the predeterminable amount of solder (3b),
wherein the first temperature sensor (10) is at least used for measuring a temperature curve (T)i(t)) recording the temperature as a function of time, and
wherein the evaluation unit (14) derives at least from the temperature curve (T)i(t)) obtaining information about impurities of the solder bath (3).
2. The diagnostic welding frame (1) according to claim 1,
wherein the evaluation unit (14) is embodied as,
-from said temperature curve (T)i(t)) determining at least one local extremum substantially corresponding to a starting point in time (t) of entry of said predeterminable quantity of solder (3b) into said container (8)0)，
-from said starting point in time (t)0) Start of determination of diagnostic time interval (Δ t)D) At said diagnostic time interval (Δ t)D) Wherein cooling or heating of the solder (3b) takes place in a temperature range in which a phase transition of the solder (3b) occurs, wherein a quantitative maximum portion of the solder (3b) in the container (8) at least solidifies or melts, and
-according to at least said diagnostic time interval (Δ t)D) During a part of (a) of (b)i(T)) and/or characteristic variables (T) derived therefromi) Recorded under the same conditions and corresponding to the reference solderA reference curve (T) of the temperature over time during heating or cooling in the temperature rangeref(T)) or a reference characteristic variable (T)ref) Determines the difference (Δ T) present in a given situation and when said difference (Δ T) exceeds a predeterminable limit value (Δ T)lim) The solder (3b) is identified as contaminated.
3. The diagnostic welding frame (1) according to claim 2,
wherein
-said characteristic variable (T)i) Is the temperature, in this case the temperature profile has a plateau-shaped cross section,
-said reference characteristic variable (T)ref) Is the melting temperature of the reference solder, and
-said difference (Δ T) being said characteristic variable (T)i) And the reference characteristic variable (T)ref) The difference between them.
4. The diagnostic welding frame (1) according to any of claims 1 to 3,
further comprising a lid (11b), the lid (11b) being embodied to releasably close the second opening (11) of the container (8), and wherein the first temperature sensor (10) is guided through the lid (11 b).
5. The diagnostic welding frame (1) according to any of claims 1 to 3,
wherein the container (8) is embodied in the form of a pot, a cone or a hemisphere.
6. The diagnostic welding frame (1) according to any of claims 1 to 3,
wherein the container (8) is a tank.
7. The diagnostic welding frame (1) according to claim 6,
wherein the canister is made of a material to which the solder does not adhere.
8. The diagnostic welding frame (1) according to claim 7,
wherein the material is stainless steel or teflon.
9. The diagnostic welding frame (1) according to any of claims 1 to 3,
wherein the first opening (9) through which the predeterminable quantity of solder (3b) enters is arranged in the region of a side wall of the container (8) and/or is trough-shaped, oval or circular.
10. The diagnostic welding frame (1) according to any of claims 1 to 3,
further comprising a second temperature sensor (12), said second temperature sensor (12) being fixed on said diagnostic welding frame (1) outside said container (8).
11. A welding apparatus comprises
-a solder tank (3), the solder tank (3) containing liquid solder in a soldering operation, the liquid solder being capable of containing impurities which increase in concentration in an initially pure solder in the soldering operation,
-a transport system (6) by means of which transport system (6) diagnostic welding frames can be conveyed through the welding apparatus, and
-a diagnostic welding frame (1) according to any of the claims 1 to 10.
12. A method for detecting impurities in a solder bath (3) of a soldering apparatus according to claim 11,
-wherein a diagnostic welding frame (1) is moved through the welding device,
-wherein a temperature profile (T) is provided in the container (8) of the diagnostic welding frame (1)i(t)) recording the temperature as a function of time, a predeterminable amount of solder (3b) entering the container (8) from the solder bath (3), and
-wherein at least from the temperature curve (T)i(t)) obtaining information about impurities of the solder bath (3).
13. The method of claim 12, wherein the first and second light sources are selected from the group consisting of,
-wherein from the temperature curve (T)i(t)) determining at least one local extremum substantially corresponding to a starting point in time (t) of entry of said predeterminable quantity of solder (3b) into said container (8)0)，
-wherein from the starting point in time (t)0) Start of determination of diagnostic time interval (Δ t)D) At said diagnostic time interval (Δ t)D) In a temperature range in which a phase transition of the solder (3b) occurs, in which case a quantitative maximum portion of the solder (3b) in the container (8) at least solidifies or melts, and
-wherein the time is based on at least the diagnostic time interval (Δ t)D) During a part of (a) of (b)i(T)) and/or characteristic variables (T) derived therefromi) A reference curve (T) obtained under the same conditions and corresponding to the temperature of the reference solder as a function of time during heating or cooling in said temperature rangeref(T)) or a reference characteristic variable (T)ref) Determines the difference (Δ T) present in a given situation and when said difference (Δ T) exceeds a predeterminable limit value (Δ T)lim) The solder (3b) is identified as contaminated.
14. The method of claim 13, wherein the first and second light sources are selected from the group consisting of,
-wherein the characteristic variable (T)i) Is the temperature, in this case the temperature profile has a plateau-shaped cross section,
-wherein the reference characteristic variable (T)ref) Is the melting temperature of the reference solder, and
-wherein the difference (Δ T) is the characteristic variable (T)i) And the reference characteristic variable (T)ref) The difference between them.
15. A method for operating a welding apparatus according to claim 11,
-wherein the soldering apparatus is filled with a reference solder at start-up,
-wherein the diagnostic welding frame (1) is moved through the welding device,
-wherein a reference curve (T) is provided in the container (8) of the diagnostic welding frame (1)ref(t)) recording the temperature as a function of time, a predeterminable amount of solder (3b) entering the container (8) from the solder bath (3), and
-wherein the reference curve (T)ref(T)) and/or from the reference curve (T)ref(T)) derived reference characteristic variables (T)ref) Is provided in a memory unit (13) accessible by the evaluation unit (14) and/or is input in a process control card.
16. The method of claim 15, wherein the first and second light sources are selected from the group consisting of,
-wherein the diagnostic measurements are performed at predeterminable time intervals,
-wherein the diagnostic welding frame (1) is moved through the welding device,
-wherein a temperature profile (T) is provided in the container (8) of the diagnostic welding frame (1)i(t)) recording the temperature as a function of time, a predeterminable amount of solder (3b) entering the container (8) from the solder bath (3), and
-wherein the temperature profile (T) is measuredi(T)) and/or from the temperature profile (T)i(T)) derived characteristic variables (T)i) And reference curve (T)ref(T)), reference characteristic variables (T)ref) And/or a temperature profile (T) determined at a previous point in timej(T)) or associated characteristic variables (T)j) Are compared, and
-wherein when said reference curve (T) is presentref(T)), previous temperature profile (T)j(T)), reference characteristic variables (T)ref) And/or a previous characteristic variable (Tj) versus a current temperature curve (T)i(T)) and/or characteristic variables (T)i) The difference (Delta T) between exceeds a predeterminable limit value (Delta T)lim) Then, contamination of the solder (3b) is identified.
17. The method of claim 15, wherein the first and second light sources are selected from the group consisting of,
wherein each temperature curve (T)i(t)、Tj(T)) and/or characteristic variables (T)i、Tj) And its recorded points in time (i, j) are provided in the memory unit (13) and/or are input into the process control card.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016105182.9A DE102016105182A1 (en) | 2016-03-21 | 2016-03-21 | Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering machine |
| DE102016105182.9 | 2016-03-21 | ||
| PCT/EP2017/055976 WO2017162481A1 (en) | 2016-03-21 | 2017-03-14 | Diagnostic solder frame and method for detecting contaminants in a solder bath of a soldering installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108778593A CN108778593A (en) | 2018-11-09 |
| CN108778593B true CN108778593B (en) | 2021-05-28 |
Family
ID=58314201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780017489.5A Expired - Fee Related CN108778593B (en) | 2016-03-21 | 2017-03-14 | Diagnostic soldering frame and method for detecting impurities in a solder bath of a soldering apparatus |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3433045A1 (en) |
| CN (1) | CN108778593B (en) |
| DE (1) | DE102016105182A1 (en) |
| WO (1) | WO2017162481A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7276021B2 (en) * | 2019-09-06 | 2023-05-18 | オムロン株式会社 | Detection device, detection method and program |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1821048U (en) * | 1958-06-30 | 1960-11-03 | Siemens Ag | DEVICE FOR MONITORING THE METALLIC COMPOSITION OF A PLUMBING BATH. |
| US4180199A (en) * | 1978-02-27 | 1979-12-25 | Hollis Engineering, Inc. | Mass soldering control system |
| DE4035768A1 (en) * | 1990-11-07 | 1992-05-14 | Univ Berlin Humboldt | Measuring amt. of contamination in soft solder bath - by converting sonic pulses produced in metal probe dipped into bath into electrical pulses and plotting curve of phase summation against time |
| IL100838A (en) * | 1992-01-31 | 1995-06-29 | Sasson Shay | Solder wave parameters analyzer |
| US5767424A (en) * | 1996-12-23 | 1998-06-16 | Electronic Controls Design, Inc. | Wave solder analyzer |
| EP1162021B1 (en) * | 2000-06-06 | 2005-02-02 | Matsushita Electric Industrial Co., Ltd. | Method for estimating quality of lead-free solder material and process for flow soldering |
| US6780225B2 (en) * | 2002-05-24 | 2004-08-24 | Vitronics Soltec, Inc. | Reflow oven gas management system and method |
| DE102007050688A1 (en) * | 2007-10-22 | 2009-04-30 | Endress + Hauser Gmbh + Co. Kg | Soldering plant for the recognition of impurities contained in solder for soldering electronic components, comprises soldering bath containing liquid solder, device for recognizing the impurities, temperature sensor, and evaluation unit |
| DE102008050328A1 (en) * | 2008-10-07 | 2010-04-08 | Endress + Hauser Gmbh + Co. Kg | Determining a solder volume contained in a solder bath, comprises performing a reference measurement, filling the solder bath with a known initial liquid reference solder volume, and cooling the solder under reproducible given conditions |
| EP2221136A1 (en) | 2009-02-20 | 2010-08-25 | Endress+Hauser GmbH+Co. KG | Soldering assembly and method for recognising impurities contained in a solder |
| DE202013012057U1 (en) * | 2013-06-21 | 2015-03-05 | Siemens Aktiengesellschaft | Test plate for checking wave soldering processes |
-
2016
- 2016-03-21 DE DE102016105182.9A patent/DE102016105182A1/en not_active Withdrawn
-
2017
- 2017-03-14 WO PCT/EP2017/055976 patent/WO2017162481A1/en active Application Filing
- 2017-03-14 CN CN201780017489.5A patent/CN108778593B/en not_active Expired - Fee Related
- 2017-03-14 EP EP17710885.9A patent/EP3433045A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017162481A1 (en) | 2017-09-28 |
| EP3433045A1 (en) | 2019-01-30 |
| DE102016105182A1 (en) | 2017-09-21 |
| CN108778593A (en) | 2018-11-09 |
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