CN108776423B - Manufacturing method and device of touch layer - Google Patents
Manufacturing method and device of touch layer Download PDFInfo
- Publication number
- CN108776423B CN108776423B CN201810689115.4A CN201810689115A CN108776423B CN 108776423 B CN108776423 B CN 108776423B CN 201810689115 A CN201810689115 A CN 201810689115A CN 108776423 B CN108776423 B CN 108776423B
- Authority
- CN
- China
- Prior art keywords
- layer
- light
- film layer
- photoresist layer
- transmitting film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Position Input By Displaying (AREA)
- Materials For Photolithography (AREA)
Abstract
The embodiment of the invention discloses a method and equipment for manufacturing a touch layer, which comprises the steps of sputtering a light-transmitting film layer on a photoresist layer; exposing the photoresist layer by adopting an exposure light source through the chromium plate film surface and the light-transmitting film layer to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the film surface of the chromium plate is directly contacted with the light-transmitting film layer; and removing the chromium plate from the light-transmitting film layer, and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern. Therefore, the embodiment of the invention avoids the direct contact between the chromium plate and the photoresist layer in the process of exposing the photoresist layer, thereby avoiding the occurrence of pattern disconnection after the exposure of the optical adhesive layer, ensuring the exposure precision and improving the manufacturing yield of the touch layer.
Description
Technical Field
The embodiment of the invention relates to the technical field of electronic product manufacturing, in particular to a manufacturing method and equipment of a touch layer.
Background
With the development of science and technology, electronic products with touch functions are more and more widely applied in life. At present, a yellow light process is generally adopted for manufacturing a touch layer with a glass structure, and exposure is carried out in a non-contact exposure mode. Namely, a certain gap exists between the film surface of the chromium plate and the photoresist layer, and due to scattering of light, the actual light receiving area during exposure is larger than the design area due to the existence of the gap, so that the requirement of the touch layer on the fine line width is greatly influenced. For example, the wire rod requirement of metalmesh and the like in the current market is below 5um or even 4um, if non-contact exposure is adopted, the requirement on an exposure machine is high, and the equipment is extremely expensive, so that the requirement is difficult to be met by a common non-contact exposure machine. However, when the touch layer is manufactured by adopting contact exposure, the photoresist is easily bonded with the chromium plate, so that the pattern on the photoresist is broken, and the manufacturing yield of the touch layer is reduced.
Therefore, how to provide a method and an apparatus for manufacturing a touch layer to solve the above technical problems is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The embodiment of the invention aims to provide a method and equipment for manufacturing a touch layer, which can avoid the occurrence of pattern disconnection after exposure of an optical adhesive layer in the using process, ensure the exposure precision and improve the manufacturing yield of the touch layer.
In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a touch layer, including:
sputtering a light-transmitting film layer on the photoresist layer;
exposing the photoresist layer by adopting an exposure light source through the chromium plate film surface and the light-transmitting film layer to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the chromium plate film surface is directly contacted with the light-transmitting film layer;
and removing the chromium plate from the light-transmitting film layer, and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern.
Optionally, the process of removing the light-transmitting film layer on the exposed photoresist layer includes:
and etching the light-transmitting film layer on the exposed photoresist layer by adopting a chemical etching method to remove the light-transmitting film layer.
Optionally, the process of sputtering the transparent film layer on the photoresist layer includes:
and sputtering an indium tin oxide film layer on the photoresist layer.
Optionally, the etching treatment of the light-transmitting film layer on the exposed photoresist layer by using a chemical etching method to remove the light-transmitting film layer comprises:
and etching the indium tin oxide film layer on the exposed photoresist layer by adopting an acid etching mode to remove the indium tin oxide film layer.
Optionally, the process of sputtering the indium tin oxide film layer on the photoresist layer includes:
and sputtering indium tin oxide on the surface of the photoresist layer by adopting a magnetron sputtering mode to form an indium tin oxide film layer.
Optionally, the process of sputtering indium tin oxide onto the surface of the photoresist layer by using a magnetron sputtering method to form an indium tin oxide film layer includes:
and sputtering indium tin oxide on the surface of the photoresist layer by adopting a magnetron sputtering mode through an indium tin oxide target containing niobium to form an indium tin oxide film layer.
Optionally, the method further includes performing an etching process on the metal layer located below the photoresist layer by an acid etching method, so that the metal layer forms a metal electrode having the image.
An embodiment of the present invention further provides a device for manufacturing a touch layer, including:
the sputtering device is used for sputtering the light-transmitting film layer on the photoresist layer;
the exposure device is used for carrying out exposure treatment on the photoresist layer through the chromium plate film surface and the light-transmitting film layer by adopting an exposure light source so as to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the chromium plate film surface is directly contacted with the light-transmitting film layer;
and the cleaning device is used for removing the chromium plate from the light-transmitting film layer and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern.
The embodiment of the invention provides a manufacturing method and equipment of a touch layer, which comprises the steps of sputtering a light-transmitting film layer on a photoresist layer; exposing the photoresist layer by adopting an exposure light source through the chromium plate film surface and the light-transmitting film layer to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the film surface of the chromium plate is directly contacted with the light-transmitting film layer; and removing the chromium plate from the light-transmitting film layer, and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern.
Therefore, in the process of manufacturing the touch layer, the chromium plate is directly contacted with the light-transmitting film layer sputtered on the photoresist layer, the photoresist layer is exposed through the light-transmitting film layer, the pattern on the chromium plate is transferred to the photoresist layer in an exposure mode, the chromium plate is removed from the light-transmitting film layer after the exposure is finished, and the photoresist layer with the complete pattern can be obtained by removing the light-transmitting film layer. The direct contact of chromium board and photoresist layer has been avoided at the exposure in-process to this application to avoid the optical cement layer to appear the emergence of pattern broken string phenomenon after the exposure, improved the preparation yield on touch-control layer when guaranteeing the exposure precision.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a touch layer according to an embodiment of the present invention;
fig. 2 is a schematic flow chart illustrating a manufacturing method of another touch layer according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of a device for manufacturing a touch layer according to an embodiment of the present invention.
Detailed Description
The embodiment of the invention provides a manufacturing method and equipment of a touch layer, which can avoid the occurrence of pattern disconnection after exposure of an optical adhesive layer in the using process, ensure the exposure precision and improve the manufacturing yield of the touch layer.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a method for manufacturing a touch layer according to an embodiment of the invention.
The method comprises the following steps:
s11: sputtering a light-transmitting film layer on the photoresist layer;
s12: exposing the photoresist layer by adopting an exposure light source through the chromium plate film surface and the light-transmitting film layer to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the film surface of the chromium plate is directly contacted with the light-transmitting film layer;
s13: and removing the chromium plate from the light-transmitting film layer, and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern.
It should be noted that the touch layer sequentially includes, from bottom to top, a glass substrate, a first metal electrode layer, an insulating layer, and a second metal electrode layer, and when the touch layer is manufactured, the metal electrode layer located at the top needs to be manufactured through a photoresist layer, so that exposure of the photoresist layer is an important link for manufacturing the touch layer.
Specifically, in the embodiment of the invention, when the photoresist layer is exposed, the film surface of the chromium plate is not required to be directly contacted with the photoresist layer, but a transparent film layer is sputtered on the photoresist layer, so that the film surface of the chromium plate is directly contacted with the transparent film layer, the exposure light source is adopted to expose the photoresist layer through the chromium plate and the transparent film layer, and the transparent film layer is very thin (specifically, the transparent film layer can be a nanoscale transparent film layer), so that the exposure precision is greatly improved compared with non-contact exposure. And because the light-transmitting film layer is arranged between the chromium plate and the photoresist layer, the chromium plate can not be adhered to the photoresist layer when the chromium plate is taken down after exposure is finished, the phenomenon of line breakage of the exposed pattern on the photoresist layer can not occur, the exposed photoresist layer with the preset pattern can be obtained only by removing the light-transmitting film layer positioned above the photoresist layer, namely the pattern on the exposed photoresist layer is complete and is not damaged, and then the subsequent touch control layer manufacturing process can be carried out according to the pattern on the photoresist layer, wherein the preset pattern is the pattern on the chromium plate. Therefore, in the process of manufacturing the touch layer, the chromium plate is directly contacted with the light-transmitting film layer sputtered on the photoresist layer, the photoresist layer is exposed through the light-transmitting film layer, the pattern on the chromium plate is transferred to the photoresist layer in an exposure mode, the chromium plate is moved away from the light-transmitting film layer after the exposure is finished, and the photoresist layer with the complete pattern can be obtained by removing the light-transmitting film layer. The direct contact of chromium board and photoresist layer has been avoided at the exposure in-process to this application to avoid the optical cement layer to appear the emergence of pattern broken string phenomenon after the exposure, improved the preparation yield on touch-control layer when guaranteeing the exposure precision.
Referring to fig. 2, an embodiment of the present invention discloses a method for manufacturing a touch layer, and the present embodiment further describes and optimizes the technical solution relative to the previous embodiment. Specifically, the method comprises the following steps:
s11: sputtering a light-transmitting film layer on the photoresist layer;
s12: exposing the photoresist layer by adopting an exposure light source through the chromium plate film surface and the light-transmitting film layer to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the film surface of the chromium plate is directly contacted with the light-transmitting film layer;
s13: removing the chromium plate from the light-transmitting film layer, and removing the light-transmitting film layer on the exposed photoresist layer to obtain a photoresist layer with patterns;
further, the process of removing the light-transmitting film layer on the exposed photoresist layer in S13 may specifically be:
and etching the light-transmitting film layer on the exposed photoresist layer by adopting a chemical etching method to remove the light-transmitting film layer.
Specifically, after the photoresist layer is exposed, the light-transmitting film layer on the photoresist layer may be etched away by using a chemical etching method. Of course, other methods may be adopted to remove the light-transmitting film layer, specifically which method is adopted, and the purpose of the present application can be achieved without special limitation.
Further, the step of sputtering the transparent film layer on the photoresist layer in S11 may specifically be:
sputtering an indium tin oxide film layer on the photoresist layer.
Since a film layer formed of Indium Tin Oxide (ITO) has high density and a certain surface hardness, the ITO film layer is preferably used as the light-transmitting film layer in the present application. Of course, besides the ITO film layer, other transparent metal or polymer material may be used, and the specific limitation is not particularly limited.
Further, the above-mentioned process of etching the light-transmitting film layer on the exposed photoresist layer by using a chemical etching method to remove the light-transmitting film layer may specifically be:
and etching the indium tin oxide film layer on the exposed photoresist layer by adopting an acid etching mode to remove the indium tin oxide film layer.
It should be noted that, when the light-transmitting film layer in the present application is an ITO film layer, preferably, an acid etching method is used to perform etching treatment on the ITO film layer to remove the ITO film layer located above the exposed photoresist layer.
Further, the process of sputtering the indium tin oxide film layer on the photoresist layer may specifically be:
and sputtering indium tin oxide on the surface of the photoresist layer by adopting a magnetron sputtering mode to form an indium tin oxide film layer.
In order to better plate the ITO on the photoresist layer, the ITO is preferably sputtered by magnetron sputtering. Of course, other modes can be selected in practical application, and the purpose of the present application can be achieved without special limitation in this respect. Furthermore, the process of sputtering indium tin oxide on the surface of the photoresist layer by magnetron sputtering to form the indium tin oxide film layer comprises the following steps:
and sputtering indium tin oxide on the surface of the photoresist layer by adopting a magnetron sputtering mode through an indium tin oxide target containing niobium to form an indium tin oxide film layer.
Specifically, ITO may be sputtered onto the photoresist layer by magnetron sputtering to form an ITO film, and an Nb (niobium) -doped indium tin oxide target may be used in the sputtering process, niobium may generate niobium oxide in an oxygen atmosphere, and the niobium oxide is transparent in the ultraviolet to infrared light, and the exposure light source is generally ultraviolet light, so that the niobium does not affect exposure. The film layer coated on the surface of the photoresist layer is a mixture of ITO and niobium oxide due to the action of niobium, and the refractive index of the niobium oxide is 2.2-2.5, the refractive index of the ITO is generally 1.48-1.50, and the refractive index of the photoresist is 1.64-1.69, so the refractive index of the coated ITO film layer can be adjusted to be within the range of 1.64-1.69 through the mixture of the niobium oxide and the ITO, namely the refractive index of the coated ITO film layer is consistent with the refractive index of the photoresist layer, and the exposure precision is ensured.
Specifically, during the sputtering process, the flow rate of oxygen can be controlled at 50sccm, the flow rate of argon can be controlled at 150sccm, and the power can be set at 4KW, so as to adjust the refractive index of the ITO film layer to be plated to be in the range of 1.64-1.69.
Further, the method further comprises:
s14: and etching the metal layer below the photoresist layer by an acid etching method so that the metal layer forms a metal electrode with an image.
It should be noted that, in the present application, after the photoresist layer with the preset pattern is obtained, the metal layer disposed below the photoresist layer may be etched by using an acid etching method, so as to obtain the metal electrode layer with the preset pattern, and a subsequent touch layer is manufactured according to the metal electrode layer, where the subsequent manufacturing method is a mature method in the prior art, and the present application is not repeated here.
Referring to fig. 3, on the basis of the foregoing embodiment, an embodiment of the present invention further provides a manufacturing apparatus of a touch layer, including:
the sputtering device 1 is used for sputtering a light-transmitting film layer on the photoresist layer;
the exposure device 2 is used for carrying out exposure treatment on the photoresist layer through the chromium plate film surface and the light-transmitting film layer by adopting an exposure light source so as to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the film surface of the chromium plate is directly contacted with the light-transmitting film layer;
and the cleaning device 3 is used for removing the chromium plate from the light-transmitting film layer and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern.
It should be noted that the manufacturing apparatus of the touch layer in the embodiment of the present invention has the same beneficial effects as those in the above embodiment. In addition, for a specific description of the method for manufacturing the touch layer according to the embodiment of the present invention, please refer to the above method embodiment, which is not described herein again.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
1. A method for manufacturing a touch layer is characterized by comprising the following steps:
sputtering a light-transmitting film layer on the photoresist layer;
exposing the photoresist layer by adopting an exposure light source through the chromium plate film surface and the light-transmitting film layer to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the chromium plate film surface is directly contacted with the light-transmitting film layer;
removing the chromium plate from the light-transmitting film layer, and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern;
the process of removing the light-transmitting film layer on the exposed photoresist layer comprises the following steps:
etching the light-transmitting film layer on the exposed photoresist layer by adopting a chemical etching method to remove the light-transmitting film layer;
the process of sputtering the light-transmitting film layer on the photoresist layer comprises the following steps:
sputtering indium tin oxide on the surface of the photoresist layer by adopting a magnetron sputtering mode through an indium tin oxide target containing niobium to form an indium tin oxide film layer;
in the sputtering process, niobium can generate niobium oxide in the oxygen atmosphere, the film layer plated on the surface of the photoresist layer is a mixture of ITO and niobium oxide due to the action of niobium, and the refractive index of the plated ITO film layer can be adjusted to be in the range of 1.64-1.69 by the mixture of niobium oxide and ITO, even if the refractive index of the plated ITO film layer is consistent with that of the photoresist layer.
2. The method for manufacturing the touch layer according to claim 1, wherein the step of etching the light-transmitting film layer on the exposed photoresist layer by using a chemical etching method to remove the light-transmitting film layer comprises:
and etching the indium tin oxide film layer on the exposed photoresist layer by adopting an acid etching mode to remove the indium tin oxide film layer.
3. The method for manufacturing the touch layer according to any one of claims 1-2, further comprising etching the metal layer under the photoresist layer by an acid etching method so that the metal layer forms a metal electrode having the pattern.
4. A manufacturing apparatus of a touch layer for implementing the manufacturing method of a touch layer according to claim 1, comprising:
the sputtering device is used for sputtering the light-transmitting film layer on the photoresist layer;
the exposure device is used for carrying out exposure treatment on the photoresist layer through the chromium plate film surface and the light-transmitting film layer by adopting an exposure light source so as to transfer the pattern on the chromium plate film surface to the photoresist layer; wherein the chromium plate film surface is directly contacted with the light-transmitting film layer;
the cleaning device is used for removing the chromium plate from the light-transmitting film layer and removing the light-transmitting film layer on the exposed photoresist layer to obtain the photoresist layer with the pattern;
wherein, the process that the cleaning device removes the light-transmitting film layer on the exposed photoresist layer comprises the following steps:
and etching the light-transmitting film layer on the exposed photoresist layer by adopting a chemical etching method to remove the light-transmitting film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810689115.4A CN108776423B (en) | 2018-06-28 | 2018-06-28 | Manufacturing method and device of touch layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810689115.4A CN108776423B (en) | 2018-06-28 | 2018-06-28 | Manufacturing method and device of touch layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108776423A CN108776423A (en) | 2018-11-09 |
| CN108776423B true CN108776423B (en) | 2020-10-30 |
Family
ID=64030585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810689115.4A Active CN108776423B (en) | 2018-06-28 | 2018-06-28 | Manufacturing method and device of touch layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108776423B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958207B1 (en) * | 2002-12-07 | 2005-10-25 | Niyaz Khusnatdinov | Method for producing large area antireflective microtextured surfaces |
| CN104246613A (en) * | 2012-02-27 | 2014-12-24 | 传导喷墨技术有限公司 | Method of processing a photosensitive structure |
| CN106959585A (en) * | 2015-12-21 | 2017-07-18 | 富士胶片株式会社 | The manufacture method of positive light sensitivity transfer materials and wiring |
| CN107210097A (en) * | 2014-12-26 | 2017-09-26 | 日本科技先进有限公司 | There is the manufacture method and the manufacture method of wire netting substrate of the multilayer board of the electroconductive polymer layer of patterning on the transparent substrate |
-
2018
- 2018-06-28 CN CN201810689115.4A patent/CN108776423B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958207B1 (en) * | 2002-12-07 | 2005-10-25 | Niyaz Khusnatdinov | Method for producing large area antireflective microtextured surfaces |
| CN104246613A (en) * | 2012-02-27 | 2014-12-24 | 传导喷墨技术有限公司 | Method of processing a photosensitive structure |
| CN107210097A (en) * | 2014-12-26 | 2017-09-26 | 日本科技先进有限公司 | There is the manufacture method and the manufacture method of wire netting substrate of the multilayer board of the electroconductive polymer layer of patterning on the transparent substrate |
| CN106959585A (en) * | 2015-12-21 | 2017-07-18 | 富士胶片株式会社 | The manufacture method of positive light sensitivity transfer materials and wiring |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108776423A (en) | 2018-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2016026180A1 (en) | Touch panel manufacturing method | |
| CN103972075A (en) | Etching method and array substrate | |
| CN104536614B (en) | Graphene sensor, manufacturing method thereof and touch display device | |
| CN102541368A (en) | Capacitive touch panel and manufacturing method thereof | |
| CN104407734B (en) | The manufacture method and touch screen of touch screen | |
| CN104459865A (en) | Wire grid polarizer, manufacturing method of wire grid polarizer and display device | |
| CN105359069A (en) | Touch sensor for touch screen panel, manufacturing method thereof, and touch screen panel including same | |
| CN106371294B (en) | A kind of production method of display base plate, display base plate and display device | |
| CN103425372A (en) | Metal etching process of capacitive touch screens | |
| CN108776423B (en) | Manufacturing method and device of touch layer | |
| CN104777930A (en) | OGS (One Glass Solution) touch screen and manufacturing method thereof, OGS touch device | |
| KR20170112310A (en) | Transparent electrode structure and method for manufacturing thereof | |
| KR20130055831A (en) | Method of forming electrode of touch screen panel | |
| TWI605361B (en) | Electrode substrate and touch panel | |
| KR20100035247A (en) | Method for patterning transparent electrodes and forming signal lines of a touch panel | |
| CN108449927B (en) | Metal film and manufacturing method thereof | |
| CN107797396B (en) | Method for manufacturing alignment mark of conductive film | |
| KR20020041871A (en) | Manufacturing method of transparent conductive layer of touch panel | |
| KR20200045776A (en) | Method for Manufacturing Touch Panel | |
| JP2012103767A (en) | Method of manufacturing touch sensor pattern and signal conductor | |
| CN110149765B (en) | Method for manufacturing protective film on circuit substrate | |
| KR101506734B1 (en) | Device and method for ito patterning | |
| KR20160006893A (en) | Method of manufacturing a touch panel | |
| CN103383925A (en) | Display device, signal substrate of naked eye 3D function panel and manufacturing method of signal substrate | |
| CN110167280B (en) | Method for manufacturing protective film on circuit substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |