CN108769493A - CCD camera assembly and electronic device - Google Patents
CCD camera assembly and electronic device Download PDFInfo
- Publication number
- CN108769493A CN108769493A CN201810865255.2A CN201810865255A CN108769493A CN 108769493 A CN108769493 A CN 108769493A CN 201810865255 A CN201810865255 A CN 201810865255A CN 108769493 A CN108769493 A CN 108769493A
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- Prior art keywords
- imaging modules
- imaging
- ccd camera
- camera assembly
- reflecting element
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Studio Devices (AREA)
Abstract
A kind of CCD camera assembly of the application offer and electronic device.CCD camera assembly includes the first imaging modules, the second imaging modules, flexible PCB and flash lamp, first imaging modules include reflecting element and the first imaging sensor, and reflecting element is used to reach the first imaging sensor after turning to incident light so that the first imaging sensor senses the light outside the first imaging modules；Flexible PCB includes first connecting portion, second connecting portion and third interconnecting piece, and first connecting portion is connect with the first imaging modules, and second connecting portion is connect with flash lamp, and the third interconnecting piece is connect with second imaging modules.Present invention also provides a kind of electronic devices.In the CCD camera assembly and electronic device of the application embodiment, since the first imaging modules, the second imaging modules and flash lamp share the same flexible PCB, it advantageously reduces the quantity of part and reduces the space of the area and complete machine that occupy host, be conducive to the packaging efficiency for improving part.
Description
Technical field
This application involves field of electronic devices more particularly to a kind of CCD camera assemblies and electronic device.
Background technology
In the related technology, camera module and flash lamp use separate flexible PCB outlet, then by corresponding
Connector connect with mainboard, however in this way, the quantity of flexible PCB and connector is more, occupy a large amount of areas of mainboard and
Complete machine space is unfavorable for assembling.
Invention content
A kind of CCD camera assembly of the application offer and electronic device.
The CCD camera assembly of the application embodiment includes：
First imaging modules, first imaging modules include reflecting element and the first imaging sensor, the reflective member
Part after turning to incident light for reaching described first image sensor so that described first image sensor sensing described first
Light outside imaging modules；
Second imaging modules；
Flash lamp；With
Flexible PCB, the flexible PCB include first connecting portion, second connecting portion and third interconnecting piece, and described
One interconnecting piece is connect with first imaging modules, and the second connecting portion is connect with the flash lamp, the third interconnecting piece
It is connect with second imaging modules.
The electronic device of the application embodiment includes casing and the CCD camera assembly of embodiment of above, the camera
Component is arranged on the housing.
In the CCD camera assembly and electronic device of the application embodiment, due to the first imaging modules, the second imaging modules
The same flexible PCB is shared with flash lamp, advantageously reduce the quantity of part and reduces the area and complete machine for occupying host
Space, be conducive to improve part packaging efficiency.
The additional aspect and advantage of the application will be set forth in part in the description, and will partly become from the following description
It obtains obviously, or recognized by the practice of the application.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the floor map of the electronic device of the application embodiment；
Fig. 2 is the stereoscopic schematic diagram of the CCD camera assembly of the application embodiment；
Fig. 3 is the decomposition diagram of the CCD camera assembly of the application embodiment；
Fig. 4 is the stereoscopic schematic diagram of the decoration of the application embodiment；
Fig. 5 is the part isometric schematic diagram of the CCD camera assembly of the application embodiment；
Fig. 6 is another stereoscopic schematic diagram in part of the CCD camera assembly of the application embodiment；
Fig. 7 is another stereoscopic schematic diagram in part of the CCD camera assembly of the application embodiment；
Fig. 8 is another stereoscopic schematic diagram in part of the CCD camera assembly of the application embodiment；
Fig. 9 is another stereoscopic schematic diagram in part of the CCD camera assembly of the application embodiment；
Figure 10 is another stereoscopic schematic diagram in part of the CCD camera assembly of the application embodiment；
Figure 11 is the another stereoscopic schematic diagram in part of the CCD camera assembly of the application embodiment；
Figure 12 is the another stereoscopic schematic diagram in part of the CCD camera assembly of the application embodiment；
The part isometric schematic diagram of the electronic device of Figure 13 the application embodiments；
Figure 14 is the decomposition diagram of the first imaging modules of the application embodiment；
Figure 15 is the diagrammatic cross-section of the first imaging modules of the application embodiment；
Figure 16 is the diagrammatic cross-section of the first imaging modules of another embodiment of the application；
Figure 17 is schematic cross-section of the CCD camera assembly along line A-A of Fig. 2；
Figure 18 is the imaging modules of some embodiments and the structural schematic diagram of ornamental piece；
Figure 19 is schematic cross-section of the electronic device along line B-B of Fig. 1；
Figure 20 is the stereoscopic schematic diagram of the reflecting element of the application embodiment；
Figure 21 is the light catoptric imaging schematic diagram of the first imaging modules in the related technology；
Figure 22 is the light catoptric imaging schematic diagram of the first imaging modules of the application embodiment；
Figure 23 is the structural schematic diagram of imaging modules in the related technology；
Figure 24 is the structural schematic diagram of the imaging modules of the application embodiment；With
Figure 25 is the diagrammatic cross-section of the second imaging modules of the application embodiment.
Main element symbol description：
Electronic device 1000, casing 101, CCD camera assembly 100, decoration 10, through-hole 11, first the 111, second son of sub-aperture
Hole 112, case ring 12, chimb 13, the first imaging modules 20, the first shell 21, light inlet 211, groove 212, roof 213,
One side wall 214, reflecting element 22, incidence surface 222, shady face 224, incidence surface 226, light-emitting surface 228, mounting base 23, arcwall face
231, the first Lens assembly 24, eyeglass 241, motor element 25, intermediate plate 222, the first imaging sensor 26, driving mechanism 27, drive
Dynamic device 28, arc-shaped guide rail 281, central axis 282, the second imaging modules 30, the second Lens assembly 31, the second imaging sensor
32, second housing 33, second sidewall 331, holder 40, flexible PCB 50, first connecting portion 51, second connecting portion 52, third
Interconnecting piece 53, the 4th interconnecting piece 54, flash lamp 60, mainboard 70.
Specific implementation mode
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term "center", " length ", " width ", " thickness ", "upper",
The orientation or positional relationship of the instructions such as "lower", "front", "rear", "left", "right", "horizontal", "top", "bottom", "inner" is based on attached
Orientation or positional relationship shown in figure is merely for convenience of description the application and simplifies to describe, rather than indicates or imply and is signified
Device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as to the application
Limitation.In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more feature.In the description of the present application, the meaning of " plurality " is two or two with
On, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation " " connects
Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected；It can be machine
Tool connects, and can also be to be electrically connected or can mutually communicate；It can be directly connected, the indirect phase of intermediary can also be passed through
Even, can be the interaction relationship of the connection or two elements inside two elements.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the electronic device 1000 of the application embodiment includes casing 101, CCD camera assembly 100 and mainboard
70 (see Figure 13).CCD camera assembly 100 is arranged on casing 101, and mainboard 70 is located at 100 lower section of CCD camera assembly.Electronic device
1000 can be mobile phone, tablet computer, laptop, Intelligent bracelet, smartwatch, intelligent helmet, intelligent glasses etc..This Shen
Please embodiment illustrated so that electronic device 1000 is mobile phone as an example, it will be understood that the concrete form of electronic device 1000 can
To be other, this is not restricted.
Specifically, casing 101 is the exterior components of electronic device 1000, plays the interior of protection electronic device 1000
The effect of portion's part.Casing 101 can be the rear cover of electronic device 1000, zero, battery of overlay electronic device 1000 etc.
Part.In present embodiment, 100 postposition of CCD camera assembly, in other words, the back of the body in electronic device 1000 is arranged in CCD camera assembly 100
Face is so that electronic device 1000 can carry out postposition camera shooting.As Fig. 1 example in, CCD camera assembly 100 be arranged in casing 101
Upper left corner location.It will be appreciated, of course, that upper position or upper right position can be arranged in casing 101 in CCD camera assembly 100
The other positions such as set.CCD camera assembly 100 is arranged is not limited to the example of the application in the position of casing 101.
Please see Fig. 2 to Fig. 4, CCD camera assembly 100 includes decoration 10, the first imaging modules 20, the second imaging modules
30, holder 40, flexible PCB 50 and flash lamp 60.Decoration 10 is arranged on casing 101, and protrudes from the table of casing 101
Face.First imaging modules 20 and the second imaging modules 30 are arranged at 101 inside of casing and are arranged close to decoration 10.First at
As module 20 and the second imaging modules 30 are arranged in holder 40 and are fixedly connected with holder 40.The connection of flexible PCB 50 the
One imaging modules 20, the second imaging modules 30 and flash lamp 60.
Decoration 10 is arranged in the top of holder 40, and specifically, decoration 10 can be resisted against on holder 40, can also be with
The setting of the interval of holder 40.The impact that holder 40 can reduce by the first imaging modules 20, the second imaging modules 30 are subject to improves first
30 service life of imaging modules 20 and the second imaging modules.
Decoration 10 may be used metal material and be made, such as the material of decoration 10 is stainless steel, and decoration 10 can be with
It is handled by polishing process to form bright surface, so that decoration 10 is more beautiful.
Incorporated by reference to Fig. 1 to Fig. 4, decoration 10 is formed with through-hole 11, and the first imaging modules 20 and the second imaging modules 30 are
It is exposed to decoration 10 from through-hole 11, in other words, the first imaging modules 20 and the second imaging modules 30 are acquired by through-hole 11
External image.Specifically, in present embodiment, through-hole 11 includes the first sub-aperture 111 and the second sub-aperture 112,111 He of the first sub-aperture
The setting of second sub-aperture 112 interval.In other words, the first sub-aperture 111 and the second sub-aperture 112 are disconnected.
Certainly, in other embodiments, the first sub-aperture 111 can be connected to the second sub-aperture 112 and form an entirety
Hole.First imaging modules 20 acquire external image by the first sub-aperture 111, and the second imaging modules 30 are adopted by the second sub-aperture 112
Collect external image.In present embodiment, the first sub-aperture 111 is round hole, and the second sub-aperture 112 is square hole.
In other embodiments, the shape of the first sub-aperture 111 and the second sub-aperture 112 is not limited to the shape in diagram.Example
Such as, the first sub-aperture 111 and the second sub-aperture 112 are round hole；For another example, the first sub-aperture 111 and the second sub-aperture 112 are rectangular
Hole.
Decoration 10 includes case ring 12 and chimb 13, and a part of marginal position of 13 self-chambering decorative circle 12 of chimb is to extension
It stretches.Through-hole 11 is formed in decoration 10, and runs through case ring 12 and chimb 13, and case ring 12 is mounted on casing 101, chimb 13
It is resisted against on casing 101.In this way, chimb 13 can limit the position of decoration 10, prevent decoration 10 from being moved to outside casing 101
It is dynamic.
In one example, when installing decoration 10, decoration 10 inserts outward from the inside of casing 101, in chimb
13 against casing 101 inner surface when, decoration 10 is installed to precalculated position.Decoration 10 can be fixed on casing using viscose glue
On 101, decoration 10 can also be made to be interference fitted with casing 101, so that decoration 10 is not easy to fall off from casing 101.
Decoration 10 can be the integrated formed structure that case ring 12 is formed with chimb 13, be cut for example, decoration 10 uses
The mode for cutting processing manufactures to be formed.In addition, case ring 12 and chimb 13 or separate structure, in other words, case ring 12 with
Chimb 13 is initially formed two independent elements, then fits together to form decoration 10 by techniques such as welding.
It should be pointed out that in other embodiments, chimb 13 can be omitted, that is to say, that in this embodiment,
Decoration 10 only includes the structure of case ring 12.
60 laid out in parallel of first imaging modules 20, the second imaging modules 30 and flash lamp, in other words, along electronic device
1000 width direction, the first imaging modules 20, the second imaging modules 30 and flash lamp 60 can be arranged side by side from left to right
Cloth；Along the length direction of electronic device 1000, the first imaging modules 20, the second imaging modules 30 and flash lamp 60 can be from upper past
Lower carry out laid out in parallel；Along the thickness direction of electronic device 1000, the first imaging modules 20, the second imaging modules 30 and flash lamp
60 can from inside outwards carry out laid out in parallel；In this way, position is arranged in the first imaging modules 20, the second imaging modules 30 and flash lamp 60
The multiple choices set are conducive to improve the utilization rate in the space of electronic device 1000 and be conducive to as in electronic device 100
Other elements provide possible position.It is appreciated that in other embodiments, the first imaging modules 20, the second imaging modules
30 and the arrangement position of flash lamp 60 can be interchanged.
First imaging modules 20 abut setting with flash lamp 60.In this way, being conducive to make the first imaging modules 20 and dodge
The structure of light lamp 60 is compacter, and arrangement is more reasonable.
It is of course also possible to which the second imaging modules 30 is made to abut setting with flash lamp 60.In this way, being conducive to make the second one-tenth
As module 30 and the structure of flash lamp 60 are compacter, arrangement is more reasonable.
Fig. 5 to Fig. 8 is please referred to, in such an embodiment, as 30 row of the first imaging modules 20 and the second imaging modules
When row are in " one " shape, the first imaging modules 20 can abut setting (as shown in Figure 5 and Figure 6), Huo Zhe with flash lamp 60
Two imaging modules 30 can abut setting (as shown in Figure 7 and Figure 8) with flash lamp 60.First imaging modules 20 and the second one-tenth
As module 30 is arranged along same straight line.First imaging modules 20 can be located at the lower position of the second imaging modules 30, in other words,
Second imaging modules 30 are compared to the first imaging modules 20 closer to the top position of electronic device 1000.Of course, it is possible to manage
Solution, in other embodiments, the position of the first imaging modules 20 and the second imaging modules 30 can be interchanged, in other words, first
Imaging modules 20 are located at the top position of the second imaging modules 30.Flash lamp 60 can also simultaneously with the first imaging modules 20 and the
Two imaging modules 30 abut.
Fig. 9 to Figure 12 is please referred to, when the first imaging modules 20 and the second imaging modules 30 arrange L-shaped, the first one-tenth
As module 20 and flash lamp 60 can abut that setting or the second imaging modules 30 can be abutted with flash lamp 60 and be set
It sets.First imaging modules 20 can be located at the second imaging modules 30 right positions, in other words, the first imaging modules 20 compared to
Centre position of second imaging modules 30 closer to electronic device 1000.It will be appreciated, of course, that in other embodiments,
The position of first imaging modules 20 and the second imaging modules 30 can be interchanged, and in other words, the first imaging modules 20 are located at the second one-tenth
As the left side of module 30.Flash lamp 60 can also be abutted with the first imaging modules 20 and the second imaging modules 30 simultaneously.
In the first imaging modules 20 and the second imaging modules 30, one of imaging modules can be black and white camera,
Another imaging modules is RGB cameras；Or an imaging modules are infrared camera, another imaging modules is
RGB cameras；Or an imaging modules are RGB cameras, another imaging modules is also RGB cameras；Or one
Imaging modules are wide-angle camera, another imaging modules is focal length camera etc..
In other embodiments, electronic device 1000 can also include three or more imaging modules.
The CCD camera assembly 100 of the application embodiment includes the first imaging modules 20, the second imaging modules 30, flexible electrical
Road plate 50 and flash lamp 60, the first imaging modules 20 include reflecting element 22 and the first imaging sensor 26, and reflecting element 22 is used
The first imaging sensor 26 is reached after turning to incident light so that the first imaging sensor 26 senses outside the first imaging modules 20
The light in portion, flexible PCB 50 include first connecting portion 51, second connecting portion 52 and third interconnecting piece 53, first connecting portion 51
It is connect with the first imaging modules 20, second connecting portion 52 is connect with flash lamp, and third interconnecting piece 53 and the second imaging modules 30 connect
It connects.
In the related art, camera module and flash lamp use separate flexible PCB outlet, then pass through phase
The connector answered is connect with mainboard, however in this way, the quantity of flexible PCB and connector is more, occupy a large amount of areas of mainboard with
And complete machine space, it is unfavorable for improving packaging efficiency.
The CCD camera assembly 100 of the application embodiment, due to the first imaging modules 20, the second imaging modules 30 and flash of light
Lamp 60 shares the same flexible PCB 50, advantageously reduces the quantity of part and reduces the area and complete machine for occupying host
Space is conducive to the packaging efficiency for improving part.
Referring to Fig. 5, in present embodiment, the first imaging modules 20 include the first shell 21, and the first shell 21 is substantially in
Box-shaped, the first shell 21 include roof 213 and the first side wall 214.The first side wall 214 extends from the side of roof 213 2131
It is formed.Roof 213 includes four sides 2131, and the quantity of the first side wall 214 is four, and each the first side wall 214 is self-corresponding
One side 2131 extends.
In present embodiment, the second imaging modules 30 include second housing 33, and second housing 33 is generally square shaped, and second
Shell 33 includes second sidewall 331.
Please refer to Fig. 5 to Fig. 8, when the first imaging modules 20 and the second imaging modules 30 arrangement in " one " shape when, flexible electrical
Road plate 50 can be arranged on the side wall of the first shell 21 with 33 phase the same side of second housing.In other words, flexible PCB 50
It can be arranged on the right side wall or left side wall of the first imaging modules 20 and the second imaging modules 30 (as shown in Figure 6 and Figure 8).
In this way, be conducive to according to the first imaging modules 20 and the second imaging modules 30 in electronic device 1000 arrangement position selection compared with
Good set-up mode.
Further, in such an embodiment, first connecting portion 51, second connecting portion 52 and third interconnecting piece 53 divide
Do not pass through the first side wall 214 positioned at phase the same side and second sidewall 331 and the first imaging modules 20, flash lamp 60 and the second one-tenth
As module 30 connects.In this way, be conducive to flexible PCB 50 connects the first imaging modules 20,60 and of flash lamp with shorter distance
Second imaging modules 30 reduce the length of flexible PCB 50.
Fig. 9 to Figure 12 is please referred to, when the first imaging modules 20 and the second imaging modules 30 arrange L-shaped, flexible electrical
Road plate 50 is arranged far from the first side wall 214 of 30 side of the second imaging modules.In other words, when the second imaging modules 30 are set
It sets at the left side of the first imaging modules 20, the first side wall 214 on 30 right side of the first imaging modules is arranged in flexible PCB 50
Upper (as shown in Figure 9), or when the second imaging modules 30 are arranged on the right side of the first imaging modules 20, flexible PCB 50 is set
It sets on the first side wall 214 in 30 left side of the first imaging modules (as shown in figure 11).In this way, being conducive to according to the first imaging modules
20 and second arrangement position of the imaging modules 30 in electronic device 1000 select preferable set-up mode.Furthermore, it is possible to soft
Property circuit board 50 installation position increase stiffening plate, the intensity of 50 plugging position of flexible PCB can be improved.
Further, in such an embodiment, first connecting portion 51, second connecting portion 52 and third interconnecting piece 53 divide
It is not connect with the first imaging modules 20, flash lamp 60 and the second imaging modules 30 by the first side wall 214 positioned at phase the same side,
Wherein, third interconnecting piece 53 is connect from the side wall side close to the second imaging modules 30 with the second imaging modules 30.In this way, advantageous
Second imaging modules 30 are connected with shorter distance in the third interconnecting piece 53 of flexible PCB 50, reduce flexible PCB 50
Length.
Figure 13 is please referred to, flexible PCB 50 further includes the 4th interconnecting piece 54, and the 4th interconnecting piece 54 can pass through connection
Device is connect with mainboard 70.
Please refer to Fig.1 4 to Figure 16, in present embodiment, the first imaging modules 20 include reflecting element 22, mounting base 23,
First Lens assembly 24, motor element 25, the first imaging sensor 26 and driving mechanism 27.
Reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25 are arranged in the first shell 21.Instead
Optical element 22 is arranged in mounting base 23, and the first Lens assembly 24 is contained in motor element 25.The setting of motor element 25 is the
One imaging sensor, 26 side.
Driving mechanism 27 connects motor element 25 and the first shell 21.After incident light enters the first shell 21, process is reflective
Element 22 turns to, and then penetrates the first Lens assembly 24 and reaches the first imaging sensor 26, so that the first imaging sensor
26 obtain external image.And 27 drive motion element 25 of driving mechanism makes the first one-tenth to drive the movement of the first Lens assembly 24
As module 20 achievees the effect that focusing.
First shell 21 offers light inlet 211, and incident light enters from light inlet 211 in the first imaging modules 20.Also
It is to say, reflecting element 22 is used to reach the first imaging sensor 26 after turning to from the incident incident light of light inlet 211.Therefore,
It is appreciated that the first imaging modules 20 are periscope type lens module, compared to vertical mirror head mould group, the height of periscope type lens module
Degree is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical mirror head mould group refers to that the optical axis of camera lens module is
Straight line, in other words, incident light are conducted along the direction of a straight optical axis to the sensor devices of camera lens module.It can manage
Solution, light inlet 211 is exposed by through-hole 11 so that ambient enters the first imaging modules after through-hole 11 from light inlet 211
In 20.
Incorporated by reference to Figure 17, in present embodiment, in the width direction of the first imaging modules 20, the first shell 21 is in entering light
The side of mouth 211 forms fluted 212, and decoration 10 is located at 211 top of light inlet and is partly caught in groove 212.
8 are please referred to Fig.1, if omitting groove, in order to enable the integral thickness of electronic device is relatively thin, periscopic imaging modules
20a is partly stretched into decoration 10a in the direction of the width, due to periscopic imaging modules 20a width compared to it is vertical at
As the width of module is big, then at this point, the size of decoration 10a is then larger, it is unfavorable for electronic device beauty, but also electronics fills
It sets not compact enough.
Referring to Figure 14 to Figure 19, and in present embodiment, groove 212 is formed in the side of light inlet 211, decoration
Part 10 is located at 211 top of light inlet and is partly caught in groove 212, not only so that the width dimensions of decoration 10 are smaller,
It is also possible that CCD camera assembly 100 overall height dimension reduce, be conducive to CCD camera assembly 100 it is compact-sized, miniaturization.
Specifically, light inlet 211 is formed in roof 213, and groove 212 is formed in the connection of roof 213 and the first side wall 214
Place, decoration 10 are resisted against on roof 213.In this way, groove 212 is easy to be formed, be conducive to the manufacture of the first shell 21.In an example
In son, groove 212 is the die mould of the first shell 21, that is, groove 212 can be formed by way of punching press.
In one example, the section bottom of case ring 12 is contained in groove 212, and 12 part of case ring is resisted against roof
On 213.In other words, case ring 12 and the first shell 21 form complementary structure, and case ring 12 and the first shell 21 are mutually chimeric,
So that decoration 10 and the fit structure of the first shell 21 are compacter.
In present embodiment, each the first side wall 214 and the junction of roof 213 are each formed with groove 212.In other words,
The quantity of groove 212 is two.Certainly, in embodiments thereof, the quantity of groove 212 is alternatively individually, i other words, wherein one
A the first side wall 214 and the junction of roof 213 form fluted 212.
In present embodiment, groove 212 is in strip, and groove 212 extends along the length direction of the first imaging modules 20.Such as
This, groove 212 coordinates compacter with decoration 10.In some embodiments, groove 212 can be arc-shaped, arc it is recessed
Slot 212 surrounds light inlet 211.Certainly, in other embodiments, the structure and shape of groove 212 are not limited to above-mentioned example,
As long as so that decoration 10 and the first imaging modules 20 form complementary structure to reduce the size of decoration 10.
Reflecting element 22 is prism or plane mirror.In one example, when reflecting element 22 is prism, prism can be
The section of triangular prism, prism is right angled triangle, wherein light right-angle side one of from right angled triangle is incident,
To which another right-angle side is emitted after the reflection of bevel edge.It is appreciated that certain, incident light can go out after refraction by prism
It penetrates, and without reflection.Prism may be used the relatively good material of the translucency such as glass, plastics and be made.In an embodiment
In, it can be in reflectorized materials such as one of prism surface silver coatings to reflect incident light.
It is appreciated that when reflecting element 22 is plane mirror, the reflection of generation incident light is realized that incident light turns to by plane mirror.
More, please refer to Fig.1 5 and Figure 20, reflecting element 22 have incidence surface 222, shady face 224, reflective surface 226,
Light-emitting surface 228.Incidence surface 222 close to and towards light inlet 211, shady face 224 far from light inlet 211 and with 222 phase of incidence surface
The back of the body, reflective surface 226 connect incidence surface 222 and shady face 224, and light-emitting surface 228 connects incidence surface 222 and shady face 224, reflective surface
226 are obliquely installed relative to incidence surface 222, and light-emitting surface 228 is disposed opposite to each other with incidence surface 222.
Specifically, in the transfer process of light, light passes through light inlet 211 and enters reflecting element 22 by incidence surface 222
In, then via the reflection of reflective surface 226, reflecting element 22 finally is reflected from light-emitting surface 228, the process of light conversion is completed, and
Shady face 224 is fixedly installed with mounting base 23, so that reflecting element 22 is keeping stablizing.
As shown in figure 21, in the related art, due to the needs of reflection incident ray, the reflective surface of reflecting element 22a
226a is tilted relative to horizontal direction, and reflecting element 22a is unsymmetric structure, thus reflective member on the reflection direction of light
The lower section of part 22a is smaller with respect to the practical optical area above reflecting element 22a, it can be understood as, the part far from light inlet
Reflective surface 226a is less or can not reflection light.
Therefore, Figure 22 is please referred to, the reflecting element 22 of the application embodiment is relative to reflecting element in the related technology
22a has cut off the corner angle far from light inlet, is not only also reduced in this way without the effect for the reflection light for influencing reflecting element 22
The integral thickness of reflecting element 22.
In some embodiments, reflective surface 226 is tilted relative to the angle [alpha] of incidence surface 222 in 45 degree.In this way, make into
The light penetrated preferably reflection and conversion, has preferable light conversion effect.
Reflecting element 22 may be used the relatively good material of the translucency such as glass, plastics and be made.In one embodiment,
It can be in reflectorized materials such as one of reflecting element 22 surface silver coatings to reflect incident light.
4 to Figure 15 are please referred to Fig.1, in some embodiments, incidence surface 222 is arranged in parallel with shady face 224.In this way,
When shady face 224 and mounting base 23 are fixedly installed, 22 held stationary of reflecting element, incidence surface 222 can be made also to be rendered as plane,
Incident light keeps the transfer efficiency of light preferable in the light path of the transfer process also formation rule of reflecting element 22.Specifically,
Along the light direction that enters of light inlet 211, the section of reflecting element 22 is substantially trapezoidal, and in other words, reflecting element 22 is substantially trapezoidal
Body.
In some embodiments, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.In this way, can be formed compared with
For the reflecting element 22 of rule, keeps the light path of incident ray more straight, improve the transfer efficiency of light.
In some embodiments, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.
Specifically, the distance between incidence surface 222 and shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..Or
It says, the distance range of incidence surface 222 and shady face 224 is it is to be understood that the height of reflecting element 22 is 4.8-5.0mm.More than
It is moderate that the incidence surface 222 of distance range and shady face 224 are formed by 22 volume of reflecting element, can preferably suit into the first one-tenth
The first imaging modules 20, CCD camera assembly 100 and electronic device 1000 as in module 20, forming more compact property and miniaturization,
Meet the more demands of consumer.
In some embodiments, incidence surface 222,228 equal cure process shape of shady face 224, reflective surface 226 and light-emitting surface
At there is hardened layer.When reflecting element 22 is made of materials such as glass, the material of reflecting element 22 itself is more crisp, reflective in order to improve
The intensity of element 22 can be hardened to the incidence surface 222 of reflecting element 22, shady face 224, reflective surface 226 and light-emitting surface 228
Processing, more, can do cure process, to further increase the intensity of reflecting element to all surface of reflecting element.Hardening
Processing such as penetrate into lithium ion, do not influence reflecting element 22 convert light under the premise of to above each film on surface.
In one example, the angle turned to from the incident incident light of light inlet 211 is 90 degree by reflecting element 22.Example
Such as, incidence angle of the incident light on the surface of emission of reflecting element 22 is 45 degree, and angle of reflection is also 45 degree.Certainly, reflecting element 22
The angle that incident light turns to is alternatively other angles, for example, 80 degree, 100 degree etc., as long as being reached after incident light capable of being turned to
First imaging sensor 26.
In present embodiment, the quantity of reflecting element 22 is one, at this point, incident light reaches first after once turning to
Imaging sensor 26.In other embodiments, the quantity of reflecting element 22 is multiple, at this point, incident light is by least twice
The first imaging sensor 26 is reached after steering.
Mounting base 23 is the carrier of reflecting element 22 for installing reflecting element 22, mounting base 23, and reflecting element 22 is fixed
In mounting base 23.In this way so that the position of reflecting element 22 is it was determined that be conducive to the reflection of reflecting element 22 or refraction incidence
Light.Reflecting element 22 may be used viscose glue be adhesively fixed in mounting base 23 with realize be fixedly connected with mounting base 23.
It please join referring again to Figure 15, in one example, mounting base 23 is movable to be arranged in the first shell 21, mounting base
23 can rotate relative to the first shell 21 to adjust the direction that reflecting element 22 turns to incident light.
Mounting base 23 can drive reflecting element 22 to be rotated together towards the negative direction of the shake of the first imaging modules 20, from
And the incident deviation of the incident light of light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in motor element 25, and further, the first Lens assembly 24 is arranged in reflective member
Between part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26
On.The first imaging sensor 26 is allow to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when being moved integrally along its optical axis on the first imaging sensor 26, to real
Existing first imaging modules 20 focusing.First Lens assembly 24 includes multiple eyeglasses 241, when at least one eyeglass 241 moves, the
The whole focal length of one Lens assembly 24 changes, to realize the function of 20 zoom of the first imaging modules, more, by driving mechanism
27 drive motion elements 25 move in the first shell 21 to reach zoom purpose.
In the example of fig. 15, in some embodiments, motor element 25 is cylindrical in shape, more in the first Lens assembly 24
A eyeglass 241 is fixed on along the axially spaced-apart of motor element 25 in motor element 25；Or such as Figure 16, motor element 25 include two
Eyeglass 241 is folded between two intermediate plates 252 by intermediate plate 252, two intermediate plates 252.
It is appreciated that since motor element 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required motor element 25
Very little larger, motor element 25 can be the shape that cylindrical shape, square tube shape etc. have more certain cavity, and such motor element 25 is in cylinder
Multiple eyeglasses 241 can be preferably arranged in dress, and can preferably protect eyeglass 241 in cavity, making eyeglass 241 be not susceptible to shake
It is dynamic.
In addition, in the example of Figure 16, between multiple eyeglasses 241 are held on two intermediate plates 252 by motor element 25, both had
Standby certain stability, can also reduce the weight of motor element 25, can reduce needed for 27 drive motion element 25 of driving mechanism
Power, and the design difficulty of motor element 25 is relatively low, and eyeglass 241 is also easier to be set on motor element 25.
Certainly, motor element 25 is not limited to tubular mentioned above and two intermediate plates 252, in other implementations,
Motor element 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this way
More simple structure；Or has cavity for cuboid, round etc. to house the various regular or irregular of eyeglass 241
Shape.Under the premise of ensureing 10 normal imaging of imaging modules and operation, specific choice.
Complementary metal oxide semiconductor (CMOS, Complementary Metal may be used in first imaging sensor 26
Oxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) photosensitive member
Part.
In some embodiments, driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy driving
Mechanism.
Specifically, electromagnetic drive mechanism includes magnetic field and conductor, if magnetic field in the conductor can relative to conductor motion
Induced current is generated, induced current makes conductor be acted on by Ampere force, and Ampere force makes conductor motion, and conductor herein is
The part for driving motor element 25 to move in electromagnetic drive mechanism；Drive mechanism, the inverse piezoelectricity based on piezoceramic material
Effect：If applying voltage to piezoelectric material, mechanical stress is generated, i.e., is changed between electric energy and mechanical energy, control is passed through
It makes its mechanically deform and generates rotation or linear motion, have the advantages that simple in structure, low speed.
Characteristic of the driving of memorial alloy driving mechanism based on marmem：Marmem is a kind of special
Alloy, once so that it has been remembered any shape, though it is deformed, but when being heated to a certain proper temperature, it can restore
Shape before to deformation achievees the purpose that driving with this, has the characteristics that displacement is rapid, direction is free.
Referring to Figure 15, further, the first imaging modules 20 further include driving device 28, and driving device 28 drives
Around the rotation of pivot center 29 and along the axial movement of pivot center 29, pivot center 29 hangs down mounting base 23 with reflecting element 22
Directly in the photosensitive direction of the optical axis of light inlet 211 and the first imaging sensor 26 so that the first imaging modules 20 realize into
Optical anti-vibration on the optical axis of optical port 211 and the axial direction of pivot center 29.
In this way, the volume due to reflecting element 22 is smaller compared with lens barrel, 28 drive installation seat 23 of driving device is two sides
Move upwards, not only may be implemented the first imaging modules 20 both direction optical anti-vibration effect, it is also possible that the first one-tenth
As the small volume of module 20.
4 are please referred to Fig.1 to Figure 15, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to height
Degree direction is defined as Y-direction, and length direction is defined as Z-direction.The optical axis of light inlet 211 is Y-direction, the first imaging sensor 26 as a result,
Photosensitive direction be Z-direction, the axial direction of pivot center 29 be X to.
28 drive installation seat 23 of driving device rotates so that reflecting element 22 around X to rotation so that the first imaging mould
Group 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along pivot center 29,
So that the first imaging modules 20 realize effects of the X to optical anti-vibration.In addition, the first Lens assembly 24 can along Z-direction with
Realize that the first Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, around X to when rotation, the light that reflecting element 22 reflects moves reflecting element 22 in Y-direction, so that
First imaging sensor 26 forms different images to realize the stabilization effect of Y-direction in Y-direction.Reflecting element 22 is along X to shifting
When dynamic, the light that reflecting element 22 reflects is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in X
Image with realize X to stabilization effect.
In some embodiments, driving device 28 is formed with arc-shaped guide rail 281,28 drive installation seat of driving device, 23 edge
Arc-shaped guide rail 281 around the rotation of central axis 282 of arc-shaped guide rail 281 and along the axial movement of central axis 282, central shaft
Line 2282 is overlapped with pivot center 29.In this way, since driving device 28 is driven by the way of arc-shaped guide rail 281 with reflective member
The mounting base 23 of part 22 rotates together so that friction is small between driving device 28 and mounting base 23, is conducive to mounting base
23 stability of rotation improve the optical anti-vibration effect of the first imaging modules 20.
Specifically, Figure 23 is please referred to, in the related art, mounting base (not shown) is rotatablely connected with shaft 23a, mounting base
Around shaft 23a rotations to drive reflecting element 22a to rotate together.It is assumed that frictional force is f1, shaft 23a radiuses are R1, thrust
For F1, radius of gyration R1.So friction-torque and thrust torque ratio K1 are K1=f1R1/F1A1.Due to reflecting element
22a only needs fine rotation, therefore F1 cannot be excessive；And imaging modules itself need light and short to lead to reflecting element 22a sizes
Cannot be too big, the change large space of A is also limited, can not further be eliminated so as to cause the influence of frictional force.
Figure 24 is please referred to, and in the application, mounting base 23 is rotated along arc-shaped guide rail 281, and the radius of arc-shaped guide rail 281 is
R2.At this point, the ratio K2 of friction-torque and rotational torque is K2=f2R2/F2A, significantly change does not occur in f2, R2, F2
In the case of, due to being rotated using the swing mode of rail mounted, corresponding thrust torque becomes R2, and R2 can not be by anti-
The limitation of 22 size of optical element, or even accomplish the several times of R1 or more.Therefore in this case, frictional force rotates reflecting element 22
Influence can greatly reduce the size of K2 (reduce), so as to improve the rotation precision of reflecting element 22 so that the first imaging
The optical anti-vibration effect of module 20 is preferable.
In some embodiments, mounting base 23 includes arcwall face 231, and arcwall face 231 is arranged concentrically with arc-shaped guide rail 281
And coordinate with arc-shaped guide rail 281.In other words, the center of arcwall face 231 is overlapped with the center of arc-shaped guide rail 281.In this way so that peace
Dress seat 23 coordinates compacter with driving device 28.
In some embodiments, central axis 282 is located at outside the first imaging modules 20.In this way, the half of arc-shaped guide rail 281
Diameter R2 is larger, can reduce the harmful effect that frictional force rotates mounting base 23 in this way.
In some embodiments, driving device 28 is located at the bottom of the first shell 21.In other words, driving device 28 and
One shell 21 is structure as a whole.In this way, the structure of the first imaging modules 20 is compacter.
In some embodiments, the drive installation seat 23 by way of electromagnetism of driving device 28 rotates.In an example
In, driving device 28 is provided with coil, and electromagnetic plate is fixed in mounting base 23, and after coil energization, coil can generate magnetic field
To drive electromagnetic plate to move, to drive mounting base 23 and reflecting element to rotate together.Certainly, in other embodiments, drive
Dynamic device 28 can be by way of Piezoelectric Driving or the movement of memory alloy driven mode drive installation seat 23.Piezoelectric Driving
Mode and memory alloy driven mode please join foregoing description, and details are not described herein.
Please refer to Figure 25, in present embodiment, the second imaging modules 30 are vertical mirror head mould group, therefore, the second lens set
The optical axis of part 31 and the optical axis of the first Lens assembly 24 are mutually perpendicular to.Certainly, in other embodiments, the second imaging modules 30
It can also periscope type lens module.
Second imaging modules 30 include the second Lens assembly 31 and the second imaging sensor 32, and the second Lens assembly 31 is used for
Light is imaged on the second imaging sensor 32, the optical axis of the incident light axis of the second imaging modules 30 and the second Lens assembly 31
It overlaps, second housing 33 surrounds the second Lens assembly 31 and the second imaging sensor 32.
In present embodiment, the second imaging modules 30 are tight shot module, therefore, the eyeglass of the second Lens assembly 31
241 is less, so that 30 height of the second imaging modules is relatively low, is conducive to the thickness for reducing electronic device 1000.
The type of second imaging sensor 32 can be as the type of the first imaging sensor 26, and details are not described herein.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that：?
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle and objective of the application, modification, replace and become
Type, scope of the present application are limited by claim and its equivalent.
Claims (10)
1. a kind of CCD camera assembly, which is characterized in that including：
First imaging modules, first imaging modules include reflecting element and the first imaging sensor, and the reflecting element is used
Described first image sensor is reached after turning to incident light so that first imaging of described first image sensor sensing
Light outside module；
Second imaging modules；
Flash lamp；With
Flexible PCB, the flexible PCB include first connecting portion, second connecting portion and third interconnecting piece, and described first connects
Socket part is connect with first imaging modules, and the second connecting portion is connect with the flash lamp, the third interconnecting piece and institute
State the connection of the second imaging modules.
2. CCD camera assembly as described in claim 1, which is characterized in that first imaging modules further include the first shell,
First shell includes roof and the first side wall that is extended to form from the side of the roof, first imaging modules and institute
The L-shaped arrangement of the second imaging modules is stated, the flexible PCB is located at first imaging modules far from second imaging
On the first side wall of module side.
3. CCD camera assembly as claimed in claim 2, which is characterized in that second imaging modules include second housing, institute
It includes second sidewall to state second housing, and the third interconnecting piece is from close to the second sidewall side and second imaging modules
Connection.
4. CCD camera assembly as described in claim 1, which is characterized in that first imaging modules are focal length imaging modules,
Second imaging modules are wide-angle image module, the optical axis of the optical axis of first imaging modules and second imaging modules
It is mutually perpendicular to.
5. CCD camera assembly as described in claim 1, which is characterized in that first imaging modules further include：
Mounting base, the reflecting element are fixed in the mounting base；With
Driving device, the mounting base of the driving device driving with the reflecting element is around pivot axis and along institute
State the axial movement of pivot center, the pivot center perpendicular to the light inlet of first imaging modules optical axis, to make
It obtains the imaging modules and realizes the optical anti-vibration on the optical axis direction of the light inlet and the axial direction of the pivot center.
6. CCD camera assembly as claimed in claim 5, which is characterized in that the driving device is formed with arc-shaped guide rail, described
Mounting base includes the arcwall face for being arranged concentrically with the arc-shaped guide rail and coordinating with the arc-shaped guide rail, the driving device driving
The mounting base along the arc-shaped guide rail around the center axis thereof of the arc-shaped guide rail and along the central axis axis
To movement, the central axis is overlapped with the pivot center.
7. CCD camera assembly as claimed in claim 5, which is characterized in that first imaging modules further include：
Motor element in described first image sensor side is set；
The first Lens assembly being fixed on the motor element；With
The driving mechanism being connect with the motor element, the driving mechanism is for driving the motor element along first mirror
The mobile imaging so that first Lens assembly is focused on described first image sensor of the optical axis of piece component.
8. CCD camera assembly as claimed in claim 5, which is characterized in that the CCD camera assembly further includes decoration, described
Decoration is located above the light inlet of the imaging modules.
9. a kind of electronic device, which is characterized in that including：
Casing；With
Such as claim 1-8 any one of them CCD camera assemblies, the CCD camera assembly setting is on the housing.
10. electronic device as claimed in claim 9, which is characterized in that the electronic device includes mainboard, the flexible circuit
Plate plate further includes the 4th interconnecting piece, and the CCD camera assembly is connect by the 4th interconnecting piece with the mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810865255.2A CN108769493A (en) | 2018-08-01 | 2018-08-01 | CCD camera assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810865255.2A CN108769493A (en) | 2018-08-01 | 2018-08-01 | CCD camera assembly and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN108769493A true CN108769493A (en) | 2018-11-06 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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