CN109413315A - Electronic device - Google Patents
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- CN109413315A CN109413315A CN201811467162.0A CN201811467162A CN109413315A CN 109413315 A CN109413315 A CN 109413315A CN 201811467162 A CN201811467162 A CN 201811467162A CN 109413315 A CN109413315 A CN 109413315A
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- imaging modules
- hole
- light inlet
- reflecting element
- electronic device
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/0065—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element having a beam-folding prism or mirror
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
Abstract
The application provides a kind of electronic device.Electronic device includes casing and the camera module that is arranged in casing, and camera module includes the first imaging modules, the second imaging modules, flash lamp and decoration.First imaging modules are periscopic camera, and are formed with the first light inlet, and the first imaging modules acquire external image by the first light inlet.Second imaging modules are arranged in the first imaging modules side.Second imaging modules have the second light inlet, and the second imaging modules acquire external image by the second light inlet.Decoration is arranged on casing.Decoration has spaced three through-holes, and three through-holes are arranged along a straight line, and the area of three through-holes is sequentially reduced, and the first light inlet, the second light inlet and flash lamp pass through a corresponding through-hole respectively and expose.Exposed by the way that the first light inlet, the second light inlet and flash lamp are passed through a corresponding through-hole respectively, so that the structure between CCD camera assembly and decoration is more compact.
Description
Technical field
This application involves field of electronic devices more particularly to a kind of electronic devices.
Background technique
In the related art, in order to improve the effect of taking pictures of mobile phone, the camera of mobile phone uses periscopic camera, dives and hope
Formula camera can for example carry out three times optical focal length to obtain quality more image.Periscopic camera includes one turn of light member
Part turns optical element for conduction after being incident to the turn light rays in periscopic camera to imaging sensor so that image sensing
Device obtains the image outside periscope type lens.
However, the space that periscopic camera occupies electronic device is larger, therefore, how reasonably arranging electronic device
Each components become focus of attention so that the structure of electronic device is more compact.
Summary of the invention
In view of this, the application provides a kind of electronic device.
The electronic device of the application embodiment characterized by comprising
Casing；
CCD camera assembly in the casing is set, and the CCD camera assembly includes:
First imaging modules, first imaging modules are periscopic camera, and are formed with the first light inlet, described the
One imaging modules acquire external image by first light inlet；
Second imaging modules of first imaging modules side are set, and second imaging modules have the second entering light
Mouthful, second imaging modules are used to acquire external image by second light inlet；
Flash lamp；With
Decoration on the housing is set, and the decoration has spaced three through-holes, and described three logical
Hole is arranged along a straight line, and the area of three through-holes is sequentially reduced, first light inlet, second light inlet and described
Flash lamp passes through a corresponding through-hole respectively and exposes.
In the electronic device of the application embodiment, by the way that the first light inlet, the second light inlet and flash lamp peak are distinguished
Exposed by a corresponding through-hole, so that the structure between CCD camera assembly and decoration is more compact, space hold is smaller,
The cost for reducing CCD camera assembly is conducive to the large-scale production of CCD camera assembly.In addition, the area of three through-holes successively subtracts
The small appearance for making electronic device is more beautiful.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the floor map of the electronic device of the application embodiment；
Fig. 2 is the partial structure diagram of the electronic device of the application embodiment；
Fig. 3 is the floor map of the CCD camera assembly of the application embodiment；；
Fig. 4 is the another partial structure diagram of the electronic device of the application embodiment；
Fig. 5 is the another floor map of the CCD camera assembly of the application embodiment；
Fig. 6 is the another floor map of the CCD camera assembly of the application embodiment；
Fig. 7 is another floor map of the CCD camera assembly of the application embodiment；
Fig. 8 is the floor map of the decoration of the application embodiment；
Fig. 9 is the stereoscopic schematic diagram of the first imaging modules of the application embodiment；
Figure 10 is the decomposition diagram of the first imaging modules of the application embodiment；
Figure 11 is the diagrammatic cross-section of the first imaging modules of the application embodiment；
Figure 12 is the partial cutaway schematic view of the first imaging modules of the application embodiment；
Figure 13 is the diagrammatic cross-section of the first imaging modules of another embodiment of the application；
Figure 14 is the stereoscopic schematic diagram of the reflecting element of the application embodiment.
Figure 15 is the light catoptric imaging schematic diagram of imaging modules in the related technology；
Figure 16 is the light catoptric imaging schematic diagram of the first imaging modules of the application embodiment；
Figure 17 is the structural schematic diagram of imaging modules in the related technology；
Figure 18 is the structural schematic diagram of the first imaging modules of the application embodiment；
Figure 19 is the diagrammatic cross-section of the second imaging modules of the application embodiment.
Main element symbol description:
Electronic device 1000, mainboard 110, the first mounting hole 112, casing 102, the second mounting hole 114, mould-group circuit-board
205, flash lamp 140, connector 150；Flash lamp circuit plate 151；Reinforced element 152；Second light inlet 153, first through hole
154, the second through-hole 155, third through-hole 156, decoration 157
CCD camera assembly 100, the first imaging modules 20, shell 21, the first light inlet 211, groove 212, roof 213, side
Wall 214, avoid holes 215, reflecting element 22, incidence surface 222, shady face 224, incidence surface 226, light-emitting surface 228, mounting base 23,
Arcwall face 231, the first Lens assembly 24, eyeglass 241, motor element 25, intermediate plate 222, the first imaging sensor 26, driving mechanism
27, driving device 28, arc-shaped guide rail 281, central axis 282, chip circuit plate 201, mounting portion 2011, interconnecting piece 2022, drive
Dynamic chip 202, sensor circuit board 203, the second imaging modules 30, the second Lens assembly 31, the second imaging sensor 32.
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
It describes the application and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.?
In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the electronic device 1000 of the application embodiment includes casing 102 and CCD camera assembly 100.Camera shooting
Head assembly 100 is exposed by casing 102.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 1.Specifically, electronic device 1000 can be with
For mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device
(such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), knee
Laptop, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such as
Wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 100 can also be other wearable devices (for example, all
As electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, the headset equipment of electronic equipment or smartwatch
(HMD))。
Electronic device 1000 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to
Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound
Happy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, can
Program remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant
(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play
Device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 1000 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 1000 can be such as cellular phone, media play
The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
In present embodiment, 100 postposition of CCD camera assembly, in other words, CCD camera assembly 100 are arranged in electronic device 1000
The back side so that electronic device 1000 can carry out postposition camera shooting.As Fig. 1 example in, CCD camera assembly 100 be arranged in machine
The upper left corner portions of shell 102.It will be appreciated, of course, that CCD camera assembly 100 can be set in casing 102 position or
The other positions such as upper-right position.The position that casing 102 is arranged in CCD camera assembly 100 is not limited to the example of the application.
Further, it please refers to Fig.1 to Fig.3, electronic device 1000 further includes mainboard 110, mainboard 110 and CCD camera assembly
100 connections.Mainboard 110 is the main circuit board of electronic device 1000, is the control unit of electronic device 1000.
Fig. 2 to Fig. 5 is please referred to, the CCD camera assembly 100 of the application embodiment includes the first imaging modules 20, the second one-tenth
As mould group 30 and flash lamp 140.First imaging modules 20 are located at the side of the second imaging modules 30 and 20 He of the first imaging modules
Second imaging modules 30 are laterally arranged on electronic device 1000.Flash lamp 140 is located at the side of the second imaging modules 30 and sudden strain of a muscle
Light lamp 140, the first imaging modules 20 and the second imaging modules 30 are laterally arranged on electronic device 1000, and flash lamp 140 with
First imaging modules 20 are located at the two sides of the second imaging modules 30.
Wherein, first imaging modules 20 are periscopic camera, and are formed with the first light inlet 211, described first
Imaging modules 20 are used to acquire external image by first light inlet 211.First imaging modules 20 are rectangle structure,
In one example, the first imaging modules 20 can be laterally positioned in the side of the second imaging modules 30.In another example, first
Imaging modules 20 can be vertically positioned at the side of the second imaging modules 30.
Fig. 3 and Fig. 5 are please referred to, in some embodiments, CCD camera assembly 100 includes flash lamp circuit plate 151, flash of light
Lamp 140 is arranged on flash lamp circuit plate 151, and the first imaging modules 20 are connected with mould-group circuit-board 205, mould-group circuit-board 205
It is connect with flash lamp circuit plate 151, mould-group circuit-board 205 is structure as a whole with flash lamp circuit plate 151.
Mould-group circuit-board 205 and flash lamp circuit plate 151 are structure as a whole so that the first imaging modules 20 and flash lamp 140
Assemble more convenient, and mould-group circuit-board 205 and flash lamp circuit plate 151 are structure as a whole and enable to mould-group circuit-board
205 manufacture more convenient, the manufacture effect of promotion mould-group circuit-board 205 and flash lamp circuit plate 151 with flash lamp circuit plate 151
Rate is conducive to the large-scale production of CCD camera assembly 100.
Specifically, in the example of Fig. 3 and Fig. 5, the quantity of flash lamp 140 is two.It is appreciated that implementing in others
In mode, the quantity of flash lamp 140 can be 1,3 or 4.The quantity of flash lamp 140 is not defined herein.
In addition, may be provided with connector 150 on mould-group circuit-board 205, connector 150 is, for example, board to board connector
(Board-to-board Connectors), CCD camera assembly 100 can be connected to mainboard 110 by connector 150.Connection
150 transmittability of device is strong, it is ensured that the reliability that CCD camera assembly 100 is connect with mainboard 110.
In some embodiments, the second imaging modules 30 are electrically connected with mould-group circuit-board 205.
So set, controlling the second imaging modules 30 and the first imaging modules 20 simultaneously by mould-group circuit-board 205, make
The working efficiency for obtaining the second imaging modules 30 and the first imaging modules 20 is more increased.
Wherein, above-mentioned electrical connection refers to that the second imaging modules 30 can be with mould-group circuit-board 205 and is indirectly connected with, such as
Second imaging modules 30 can be connect by conductor wire with mould-group circuit-board 205 or the second imaging modules 30 directly and mould
Group circuit board 205 is directly connected to.
Please refer to Fig. 6 and Fig. 7, in present embodiment, the second imaging modules 30 are directly connected to mould-group circuit-board 205, example
As mould-group circuit-board 205 around the first imaging modules 20 side extend to the second imaging modules 30 and with the second imaging modules 30
Side connection.
In some embodiments, CCD camera assembly 100 includes reinforced element 152, and reinforced element 152 is fixed on flash lamp
The side opposite with flash lamp 140 of circuit board 151.In other words flash lamp circuit plate 151 is located on reinforced element 152, flash of light
Lamp 140 is located at the side that flash lamp circuit plate 151 deviates from reinforced element 152.
The setting of reinforced element 152 enables to be promoted the height of flash lamp 140, so that flash lamp circuit plate 151 and mould
It connects more stable between group circuit board 205, is not in be formed between flash lamp circuit plate 151 and mould-group circuit-board 205
Big bending leads to the damage of flash lamp circuit plate 151 and mould-group circuit-board 205.And reinforced element 152 can support flash of light
Lamp circuit board 151 is prevented since the bending of flash lamp circuit plate 151 leads to the damage of flash lamp circuit plate 151.
Further, mould-group circuit-board 205 from the side of the second imaging modules 30 towards reinforced element 152 extend and with
Flash lamp circuit plate 151 connects.
Specifically, flash lamp circuit plate 151 and mould-group circuit-board 205 can be flexible circuit board, flexible circuit board wiring
Density is high, light-weight, thickness is thin, bending is good, can mitigate the overall weight of CCD camera assembly 100 and save CCD camera assembly
100 inner space.Certainly, flash lamp circuit plate 151 and mould-group circuit-board 205 are also possible to printed circuit board or soft or hard combination
Other circuit boards such as plate, are not defined the concrete form of flash lamp circuit plate 151 and mould-group circuit-board 205 herein.
Further referring to Fig. 2 and Fig. 4, mainboard 110 is formed with the first mounting hole 112 and the second mounting hole 114, and the first one-tenth
Picture mould group 20 is located in the first mounting hole 112, and flash lamp 140 is located in the second mounting hole 114, in this way, can reduce electronics dress
1000 thickness is set, so that the structure of electronic device 1000 is more compact.
In addition, the first mounting hole 112 and the second mounting hole 114 be there are also the effect of limit, by 20 He of the first imaging modules
When second imaging modules 30 are installed on mainboard 110, the efficiency of installation can be improved.First mounting hole 112 and the second connecting hole
114 can be connected to.
Further, Fig. 4 to Fig. 8 is please referred to, the second imaging modules 30 have the second light inlet 153, the second imaging modules
30 for acquiring external image by the second light inlet 153.Decoration 157 is provided on casing 102, between decoration 157 has
Every three through-holes of setting, three through-holes are arranged along a straight line.In addition, the area of three through-holes is sequentially reduced.Certainly, at one
In example, the area of three through-holes can be sequentially reduced from left to right, be in other words the area of three through-holes from right to left
It is sequentially increased.
In another example, the area of three through-holes can be sequentially increased from left to right, in other words, three through-holes
Area is sequentially reduced from right to left.And the shape of three through-holes is identical, and three through-holes can be round or rectangular.Herein not
The shape of three through-holes is limited.
It should be pointed out that three through-holes are arranged along a straight line refers to that the center of three through-holes is located along the same line.
Specifically, decoration 157 can be rectangle, it is to be understood that decoration 157 not only can be rectangle, can be with
Different shapes is selected according to different situations.For example, decoration 157 can be circle.
Further, the identical manufacture that can facilitate decoration 157 of three shape of through holes, is conducive to the amount of decoration 157
It produces.In present embodiment, three through-holes are circle.
Wherein, the first light inlet 211, the second light inlet 153 and flash lamp 140 are revealed by a corresponding through-hole respectively
Out.
By the way that the first light inlet 211, the second light inlet 153 and flash lamp 140 are revealed by a corresponding through-hole respectively
Out, so that the structure between CCD camera assembly 100 and decoration 157 is more compact, space hold is smaller, reduces camera group
The cost of part 100 is conducive to the large-scale production of CCD camera assembly 100.In addition, the area of three through-holes is sequentially reduced so that electricity
The appearance of sub-device 1000 is more beautiful.
Specifically, further referring to Fig. 4 to Fig. 8, three through-holes are respectively first through hole 154, the second through-hole 155 and
Three through-holes 156, the second through-hole 155 is between first through hole 154 and third through-hole 156, first through hole 154, the second through-hole 155
And the area of third through-hole 156 is sequentially reduced, the first light inlet 211 is exposed by first through hole 154, and the second light inlet 153 is logical
The exposing of the second through-hole 155 is crossed, flash lamp 140 is exposed by third through-hole 156.
Wherein, the area of the first light inlet 211 will affect light enter the first imaging modules 20 imaging precision, first into
The area of optical port 211 enables to greatly light to enter the first imaging modules 20 more sufficiently, so as to promote the first imaging mould
The imaging precision of group 20, therefore the area of the first light inlet 211 is bigger, 154 area of first through hole can facilitate greatly the first entering light
The installation of mouth 211.
Further, first through hole 154, the second through-hole 155 and third through-hole 156 are arranged along the transverse direction of casing 102, in machine
In the transverse direction of shell 102, third through-hole 156 is arranged close to the edge of casing 102, interposition of the first through hole 154 close to casing 102
It installs.It is arranged so that 102 appearance of casing is more beautiful.
Please refer to Fig. 9 to Figure 11, in present embodiment, the first imaging modules 20 include shell 21, reflecting element 22, installation
The 23, first Lens assembly 24 of seat, motor element 25, the first imaging sensor 26 and driving mechanism 27.
Reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25 are arranged in shell 21.Reflective member
Part 22 is arranged in mounting base 23, and the first Lens assembly 24 is fixed on motor element 25.Motor element 25 is arranged in the first figure
As 26 side of sensor.Further, motor element 25 is located between reflecting element 22 and the first imaging sensor 26.
Driving mechanism 27 connects motor element 25 and shell 21.After incident light enters shell 21, by 22 turns of reflecting element
To then through the first Lens assembly 24 the first imaging sensor 26 of arrival, so that the first imaging sensor 26 obtains outside
Boundary's image.Driving mechanism 27 is for driving motor element 25 to move along the optical axis of the first Lens assembly 24.
Shell 21 is generally square shaped, and shell 21 has the first light inlet 211, and incident light enters from the first light inlet 211
In first imaging modules 20.That is, reflecting element 22 for after being turned to from the incident incident light of the first light inlet 211 simultaneously
The first imaging sensor 26 is reached after the first Lens assembly 24 so that the first imaging sensor 26 senses the first imaging modules 20
External incident light.
It will therefore be appreciated that the first imaging modules 20 are periscope type lens mould group, compared to vertical imaging modules, periscopic
The height of lens module is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical imaging modules refer to camera lens
The optical axis of mould group is straight line, and in other words, incident light is conducted along the direction of a straight optical axis to the photoreceptor of lens module
On part.
In some embodiments, further referring to Fig. 9 to Figure 11, shell 21 includes roof 213 and side wall 214.Side
Wall 214 is extended to form from the side of roof 213 2131.Roof 213 includes two opposite sides 2131, the quantity of side wall 214
It is two, 214 self-corresponding sides 2131 of each side wall extend, and in other words, it is opposite that side wall 214 is separately connected roof 213
Two sides.First light inlet 211 is formed in roof 213.
Reflecting element 22 is prism or plane mirror.In one example, when reflecting element 22 is prism, prism can be
Triangular prism, the section of prism are right angled triangle, wherein light is incident from one of right-angle side in right angled triangle,
To which another right-angle side is emitted after the reflection of bevel edge.It is appreciated that certainly, incident light can go out after refraction by prism
It penetrates, and without reflection.Prism can be made of relatively good materials of translucency such as glass, plastics.In an embodiment
In, it can be in reflectorized materials such as one of surface silver coatings of prism to reflect incident light.
It is appreciated that the reflection of generation incident light is realized that incident light is turned to by plane mirror when reflecting element 22 is plane mirror.
More, Figure 11 and Figure 14 are please referred to, reflecting element 22 has incidence surface 222, shady face 224,226 and of reflective surface
Light-emitting surface 228.Incidence surface 222 close to and towards the first light inlet 211.Shady face 224 far from the first light inlet 211 and with enter light
Face 222 is opposite.Reflective surface 226 connects incidence surface 222 and shady face 224.Light-emitting surface 228 connects incidence surface 222 and shady face
224.Light-emitting surface 228 is towards the first imaging sensor 26.Reflective surface 226 is obliquely installed relative to incidence surface 222.Light-emitting surface 228
It is disposed opposite to each other with reflective surface 226.
Specifically, light passes through the first light inlet 211 and enters reflective member by incidence surface 222 in the conversion process of light
In part 22, then via the reflection of reflective surface 226, reflecting element 22 finally is reflected from light-emitting surface 228, completes the mistake of light conversion
Journey, and shady face 224 and mounting base 23 are fixedly installed, so that reflecting element 22 is keeping stablizing.
As shown in figure 15, in the related art, due to the needs of reflection incident ray, the reflective surface of reflecting element 22a
226a is tilted relative to horizontal direction, and reflecting element 22a is unsymmetric structure, thus reflective member on the reflection direction of light
The lower section of part 22a is smaller with respect to the practical optical area above reflecting element 22a, it can be understood as, far from the first light inlet 211
Part reflective surface 226a it is less or can not reflection light.
Therefore, Figure 16 please be join, the reflecting element 22 of the application embodiment is relative to reflecting element 22a in the related technology
The corner angle far from the first light inlet 211 have been cut off, have not only also been dropped without the effect of the reflection light of influence reflecting element 22 in this way
The low integral thickness of reflecting element 22.
Figure 11 is please referred to, in some embodiments, reflective surface 226 inclines relative to the angle [alpha] of incidence surface 222 in 45 degree
Tiltedly.
In this way, incident light is made preferably to reflect and convert, has preferable light conversion effect.
Reflecting element 22 can be made of relatively good materials of translucency such as glass, plastics.In one embodiment,
It can be in reflectorized materials such as one of surface silver coatings of reflecting element 22 to reflect incident light.
In some embodiments, incidence surface 222 is arranged in parallel with shady face 224.
In this way, 22 held stationary of reflecting element, incidence surface 222 can be made when shady face 224 and mounting base 23 are fixedly installed
Also it is rendered as plane, incident light imitates the conversion of light in the optical path of the conversion process also formation rule of reflecting element 22
Rate is preferable.Specifically, the section of reflecting element 22 is substantially trapezoidal, in other words, instead along the light direction that enters of the first light inlet 211
The substantially trapezoidal body of optical element 22.
In some embodiments, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.
In this way, more regular reflecting element 22 can be formed, keep the optical path of incident ray more straight, improves turning for light
Change efficiency.
In some embodiments, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.
Specifically, the distance between incidence surface 222 and shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..Or
It says, the distance range of incidence surface 222 and shady face 224 is it is to be understood that the height of reflecting element 22 is 4.8-5.0mm.More than
It is moderate that the incidence surface 222 of distance range and shady face 224 are formed by 22 volume of reflecting element, can preferably suit into the first one-tenth
The first imaging modules 20, CCD camera assembly 100 and electronic device 1000 as in mould group 20, forming more compact property and miniaturization,
Meet the more demands of consumer.
In some embodiments, incidence surface 222, shady face 224, reflective surface 226 and the equal cure process shape of light-emitting surface 228
At there is hardened layer.
When reflecting element 22 is made of materials such as glass, the material of reflecting element 22 itself is more crisp, in order to improve reflective member
The intensity of part 22 can be done at hardening in incidence surface 222, shady face 224, reflective surface 226 and the light-emitting surface 228 to reflecting element 22
Reason, more, can do cure process to all surface of reflecting element, to further increase the intensity of reflecting element.At hardening
Reason such as penetrate into lithium ion, do not influence reflecting element 22 convert light under the premise of to above each film on surface.
In one example, the angle turned to from the incident incident light of the first light inlet 211 is 90 degree by reflecting element 22.
For example, incidence angle of the incident light on the surface of emission of reflecting element 22 is 45 degree, angle of reflection is also 45 degree.Certainly, reflecting element
22 angles for turning to incident light can also be other angles, for example, 80 degree, 100 degree etc., as long as can by incident light turn back to
Up to the first imaging sensor 26.
In present embodiment, the quantity of reflecting element 22 is one, at this point, incident light reaches first after once turning to
Imaging sensor 26.In other embodiments, the quantity of reflecting element 22 is multiple, at this point, incident light is by least twice
The first imaging sensor 26 is reached after steering.
Mounting base 23 is for installing reflecting element 22, and in other words, mounting base 23 is the carrier of reflecting element 22, reflecting element
22 are fixed in mounting base 23.Make the position of reflecting element 22 in this way it was determined that being conducive to the reflection of reflecting element 22 or folding
Penetrate incident light.Reflecting element 22 can use viscose glue to be adhesively fixed in mounting base 23 to realize and be fixedly connected with mounting base 23.
Specifically, in present embodiment, mounting base 23 is provided with position limiting structure 232, and position limiting structure 232 connects reflecting element
22 to limit position of the reflecting element 22 in mounting base 23.
In this way, position limiting structure 232 limits position of the reflecting element 22 in mounting base 23 so that reflecting element 22 by
Positional shift will not occur in the case where shock, be conducive to 20 normal use of the first imaging modules.
It is appreciated that in one example, reflecting element 22 is fixed in mounting base 23 by way of bonding, if saved
Slightly position limiting structure 232, then, when the first imaging modules 20 are impacted, if between reflecting element 2222 and mounting base 23
Bonding force is insufficient, and reflecting element 22 is easy to fall off from mounting base 23.
In present embodiment, mounting base 23 is formed with mounting groove 233, and reflecting element 22 is arranged in mounting groove 233, limit
Structure 232 is arranged in the edge of mounting groove 233 and against reflecting element 22.
In this way, mounting groove 233 can make reflecting element 22 be easily mounted in mounting base 23.Position limiting structure 232 is arranged
Mounting groove 233 edge and against the edge of reflecting element 22, the position of reflecting element 22 not only can be limited, also not
Reflecting element 22 can be interfered incident light emitting to the first imaging sensor 26.
Further, position limiting structure 232 includes the protrusion 234 of the edge protrusion of self installation slot 233, and protrusion 234 is against out
The edge of smooth surface 228.Since reflecting element 22 is mounted in mounting base 23 by reflective surface 226, and light-emitting surface 228 and reflective surface
226 are disposed opposite to each other.Therefore, reflecting element 22 is more easier that position occurs towards the side of light-emitting surface 228 when being impacted.And
In present embodiment, in this way, position limiting structure 232 not only can prevent reflecting element 22 to light out against the edge of light-emitting surface 228
228 side of face displacement, it can also be ensured that light normally goes out light from light-emitting surface 228.
Certainly, in other embodiments, position limiting structure 232 may include other structures, as long as reflective member can be limited
The position of part 22.For example, position limiting structure 232 is formed with card slot, reflecting element 22 is formed with limited post, and limited post is fastened on
The position of reflecting element 22 is limited in card slot.
In some embodiments, protrusion 234 is in a strip shape and extends along the edge of light-emitting surface 228.In this way, protrusion 234 with
The contact area at the edge of light-emitting surface 228 is big, and reflecting element 22 is allowed more to be seated firmly on mounting base 23.
Certainly, in other embodiments, protrusion 234 can also be in other structures such as bulks.
It please join referring again to Figure 10, in one example, mounting base 23 is movable to be arranged in shell 21,23 energy of mounting base
It is enough to rotate relative to shell 21 to adjust the direction that reflecting element 22 turns to incident light.
Mounting base 23 can drive reflecting element 22 to rotate together towards the opposite direction of the shake of the first imaging modules 20, from
And the incident deviation of the incident light of the first light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in motor element 25, and further, the first Lens assembly 24 is arranged in reflective member
Between part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26
On.The first imaging sensor 26 is allowed to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when moving integrally along its optical axis on the first imaging sensor 26, thus real
Existing first imaging modules 20 focusing.First Lens assembly 24 includes multiple eyeglasses 241, when at least one eyeglass 241 is mobile, the
The whole focal length of one Lens assembly 24 changes, so that the function of 20 zoom of the first imaging modules is realized, more, by driving mechanism
27 driving motor elements 25 move in shell 21 to reach zoom purpose.
Specifically, the reflecting element 22 in periscopic camera is when periscopic camera falls, reflecting element
22 are easy by positional shift occurs, and reflecting element 22 can not cause accurately by turn light rays to the first imaging sensor 26
First imaging sensor 26 can not accurately sense the subject image outside periscopic camera, can not normal use.
In the example of fig. 11, in some embodiments, motor element 25 is cylindrical in shape, more in the first Lens assembly 24
A eyeglass 241 is fixed in motor element 25 along the axially spaced-apart of motor element 25.As Fig. 8 example in, motor element 25 wrap
Two intermediate plates 252 are included, eyeglass 241 is folded between two intermediate plates 252 by two intermediate plates 252.
It is appreciated that since motor element 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required motor element 25
Very little larger, motor element 25 can have the shape of more certain cavity for cylindrical shape, square tube shape etc., and such motor element 25 is in cylinder
Multiple eyeglasses 241 can be preferably arranged in dress, and can preferably protect eyeglass 241 in cavity, making eyeglass 241 be not susceptible to shake
It is dynamic.
In addition, in the example in figure 13, multiple eyeglasses 241 are held between two intermediate plates 252 by motor element 25, both had
Standby certain stability, can also reduce the weight of motor element 25, can reduce driving mechanism 27 and drive needed for motor element 25
Power, and the design difficulty of motor element 25 is relatively low, and eyeglass 241 is also easier to be set on motor element 25.
Certainly, motor element 25 is not limited to tubular and two intermediate plates 252 mentioned above, in other implementations,
Motor element 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this way
More simple structure；Or has cavity for cuboid, round etc. to accommodate the various regular or irregular of eyeglass 241
Shape.Under the premise of guaranteeing 10 normal imaging of imaging modules and operation, specific choice.
First imaging sensor 26 can use complementary metal oxide semiconductor (CMOS, Complementary Metal
Oxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) photosensitive member
Part.
In some embodiments, driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy driving
Mechanism.
It specifically, include magnetic field and conductor in electromagnetic drive mechanism, if magnetic field in the conductor can relative to conductor motion
Induced current is generated, induced current makes effect of the conductor by Ampere force, and Ampere force makes conductor motion, and conductor herein is
The part for driving motor element 25 mobile in electromagnetic drive mechanism；Drive mechanism, the inverse piezoelectricity based on piezoceramic material
Effect: if applying voltage to piezoelectric material, mechanical stress is generated, i.e., is changed between electric energy and mechanical energy, control is passed through
Make its mechanically deform generate rotation or linear motion, have the advantages that structure simply, low speed.
Characteristic of the driving of memorial alloy driving mechanism based on marmem: marmem is a kind of special
Alloy, once it is made to have remembered any shape, even if being deformed, but when being heated to a certain proper temperature, it can restore
Shape before to deformation achievees the purpose that driving with this, has the characteristics that displacement is rapid, direction is free.
Referring to Figure 11, further, the first imaging modules 20 further include driving device 28, and driving device 28 is used for
Mounting base 23 of the driving with reflecting element 22 is rotated around pivot center 29.Driving device 28 is for drive installation seat 23 along rotation
The axial movement of axis 29.Pivot center 29 perpendicular to the first light inlet 211 optical axis and the first imaging sensor 26 it is photosensitive
Direction, so that the first imaging modules 20 realize the optics in the optical axis of the first light inlet 211 and the axial direction of pivot center 29
Stabilization.
In this way, 28 drive installation seat 23 of driving device moves in two directions due to the small volume of reflecting element 22,
The first imaging modules 20 not only may be implemented in the optical anti-vibration effect of both direction, it is also possible that the first imaging modules 20
Small volume.
It please join Figure 10 to Figure 11, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to height
Direction definition is Y-direction, and length direction is defined as Z-direction.The optical axis of the first light inlet 211 is Y-direction, the first imaging sensor as a result,
26 photosensitive direction is Z-direction, the axial direction of pivot center 29 be X to.
The rotation of 28 drive installation seat 23 of driving device so that reflecting element 22 around X to rotation so that the first imaging mould
Group 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along pivot center 29,
So that the first imaging modules 20 realize effect of the X to optical anti-vibration.In addition, the first Lens assembly 24 can along Z-direction with
Realize that the first Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, around X to when rotation, the light that reflecting element 22 reflects moves reflecting element 22 in Y-direction, so that
First imaging sensor 26 forms different images in Y-direction to realize the anti-shake effect of Y-direction.Reflecting element 22 is along X to shifting
When dynamic, the light that reflecting element 22 reflects is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in X
Image with realize X to anti-shake effect.
In some embodiments, driving device 28 is formed with arc-shaped guide rail 281, and driving device 28 is used for drive installation seat
23 along arc-shaped guide rail 281 around arc-shaped guide rail 281 central axis 282 rotation and along central axis 282 axial movement, in
Mandrel line 2282 is overlapped with pivot center 29.
It is appreciated that driving device 28 is used for drive installation seat 23 along arc-shaped guide rail 281 around the center of arc-shaped guide rail 281
The rotation of axis 282 and the axial movement along central axis 282.
In this way, since driving device 28 drives the mounting base 23 with reflecting element 22 by the way of arc-shaped guide rail 281
It rotates together, so that friction is small between driving device 28 and mounting base 23, is conducive to 23 stability of rotation of mounting base, improve
The optical anti-vibration effects of first imaging modules 20.
Specifically, Figure 17 please be join, in the related art, mounting base (not shown) and shaft 23a are rotatablely connected, mounting base around
Shaft 23a rotation to drive reflecting element 22a to rotate together.It is assumed that frictional force is f1, shaft 23a radius is R1, and thrust is
F1, radius of gyration R1.So friction-torque and thrust torque ratio K1 are K1=f1R1/F1A1.Due to reflecting element 22a
Fine rotation is only needed, therefore F1 cannot be excessive；And imaging modules itself need light and short to cause reflecting element 22a size cannot
Too big, the space that becomes larger of A is also limited, can not further eliminate so as to cause the influence of frictional force.
It please join Figure 18, and in the application, mounting base 23 is rotated along arc-shaped guide rail 281, and the radius of arc-shaped guide rail 281 is
R2.At this point, the ratio K2 of friction-torque and rotational torque is K2=f2R2/F2A, do not significantlyd change in f2, R2, F2
In the case where, due to being rotated using the swing mode of rail mounted, corresponding thrust torque becomes R2, and R2 can not be by anti-
The limitation of 22 size of optical element, or even accomplish the several times of R1 or more.Therefore in this case, frictional force rotates reflecting element 22
Influence the size of K2 (reduce) can be greatly reduced, so as to improve the rotation precision of reflecting element 22, so that the first imaging
The optical anti-vibration effect of mould group 20 is preferable.
It please join Figure 11, in some embodiments, mounting base 23 includes arcwall face 231, arcwall face 231 and arc-shaped guide rail
281 are arranged concentrically and cooperate with arc-shaped guide rail 281.In other words, the center of arcwall face 231 is overlapped with the center of arc-shaped guide rail 281.
Cooperate mounting base 23 with driving device 28 more compact.
In some embodiments, central axis 282 is located at outside the first imaging modules 20.In this way, the half of arc-shaped guide rail 281
Diameter R2 is larger, can reduce the adverse effect that frictional force rotates mounting base 23 in this way.
In some embodiments, driving device 28 is located at the bottom of shell 21.In other words, driving device 28 and shell 21
It is structure as a whole.In this way, the structure of the first imaging modules 20 is more compact.
In some embodiments, the drive installation seat 23 by way of electromagnetism of driving device 28 rotates.In an example
In, driving device 28 is provided with coil, is fixed with electromagnetic plate in mounting base 23, and after coil energization, coil can produce magnetic field
To drive electromagnetic plate to move, so that mounting base 23 and reflecting element be driven to rotate together.
Certainly, in other embodiments, driving device 28 can by way of Piezoelectric Driving or memorial alloy driving
Mode drive installation seat 23 move.The mode of Piezoelectric Driving and memory alloy driven mode please join foregoing description, herein not
It repeats again.
Referring to Fig. 9-Figure 12, the first imaging modules 20 further include chip circuit plate 201 and driving chip 202, core
Piece circuit board 201 is fixed on the side of driving mechanism 27, and driving chip 202 is fixed on chip circuit plate 201 and driving mechanism 27
Opposite one side, driving chip 202 are electrically connected by chip circuit plate 201 and driving mechanism 27.
In this way, driving chip 202 is fixed on the side of driving mechanism 27 by chip circuit plate 201, and pass through chip
Circuit board 201 and driving mechanism 27 are electrically connected, so that the structure between driving chip 202 and driving mechanism 27 is more stepped up
It gathers, advantageously reduces the volume of the first imaging modules 20.
Specifically, driving chip 202 drives motor element 25 along the first Lens assembly 24 for controlling driving mechanism 27
Optical axis is mobile, the imaging so that the first Lens assembly 24 is focused on the first imaging sensor 26.Driving chip 202 is used for according to top
Mounting base 23 of the feedback data control driving of driving device 28 with reflecting element 22 of spiral shell instrument is rotated around pivot center 29.Driving
Chip 202 is also used to control 28 drive installation seat 23 of driving device along the axial direction of pivot center 29 according to the feedback data of gyroscope
It is mobile.
Driving chip 202 is also used to control 28 drive installation seat 23 of driving device along arc according to the feedback data of gyroscope
Shape guide rail 281 is around the rotation of central axis 282 of arc-shaped guide rail 281 and along the axial movement of central axis 282.
In some embodiments, the first imaging modules 20 include sensor circuit board 203, and the first imaging sensor 26 is solid
It is scheduled on sensor circuit board 203, chip circuit plate 201 includes mounting portion 2011 and interconnecting piece 2022, and mounting portion 2011 is fixed on
The side of driving mechanism 27, driving chip 202 are fixed on mounting portion 2011, and interconnecting piece 2022 connects mounting portion 2011 and sensor
Circuit board 203.
In this way, driving chip 202 can be electrically connected by sensor circuit board 203 and the first imaging sensor 26.Tool
Body, interconnecting piece 2022 can be fixedly connected with sensor circuit board 203 by welding.
In one example, when assembling the first imaging modules 20, driving chip 202 first can be fixed on chip circuit
On plate 201, then the chip circuit plate 201 with driving chip 202 is connected by welding with sensor circuit board 203
It connects, the chip circuit plate 201 with driving chip 202 is finally fixed on to the side of driving mechanism 27.
Chip circuit plate 201 can be fixedly connected by the modes such as welding, being bonded with driving mechanism 27.
It should be pointed out that the side that chip circuit plate 201 is fixed on driving mechanism 27 can refer to chip circuit plate 201 with
The side of driving mechanism 27, which contacts, to be fixed, and can also refer to that chip circuit plate 201 passes through the side of other elements and driving mechanism 27
It is fixedly connected.
In present embodiment, mounting portion 2011 is rigid circuit board, and interconnecting piece 2022 is flexible circuit board, mounting portion 2011
It is fitted in the side of driving mechanism 27.
In this way, mounting portion 2011 is that rigid circuit board makes mounting portion 2011 have preferable rigidity, it is unlikely to deform, favorably
It is fixedly connected in mounting portion 2011 with the side of driving mechanism 27.Mounting portion 2011 can be fitted in driving by way of bonding
The side of mechanism 27.In addition, interconnecting piece 2022 is that flexible circuit board is easily deformed chip circuit plate 201, so that chip is electric
Road plate 201 is easily mounted on the side of driving mechanism 27.
Certainly, in other embodiments, mounting portion 2011 or flexible circuit board.
In some embodiments, shell 21 is formed with avoid holes 215, and driving chip 202 is at least partially disposed at avoid holes
In 215, to be exposed to shell 21.Make between driving chip 202 and shell 21 in this way, driving chip 202 wears shell 21
There are the parts of overlapping, so that the structure between driving chip 202 and shell 21 is more compact, can further decrease
The volume of one imaging modules 20.
It is appreciated that 202 part of driving chip is located at when having gap between the side of driving mechanism 27 and shell 21
In avoid holes 215.
Preferably, the shape of avoid holes 215, size respectively with the shape of driving chip 202, dimensional fits.For example, evacuation
The size in hole 215 is slightly larger than the size of driving chip 202, and the shape of avoid holes 215 is identical as the shape of driving chip 202.
In present embodiment, avoid holes 215 are formed in the side wall 214 of shell 21.It is appreciated that avoid holes 215 run through side
The interior outside of wall 214.Certainly, in other embodiments, avoid holes 215 can also be formed in the roof 213 of shell 21.
Please referring to Fig. 3, Fig. 5 and Figure 19, in present embodiment, the second imaging modules 30 are vertical imaging modules, certainly,
In other embodiments, the second imaging modules 30 can also be with periscope type lens mould group.
Second imaging modules 30 include the second Lens assembly 31 and the second imaging sensor 32, and the second Lens assembly 31 is used for
Light is imaged on the second imaging sensor 32, the optical axis of the incident light axis of the second imaging modules 30 and the second Lens assembly 31
It is overlapped.
The type of second imaging sensor 32 can be as the type of the first imaging sensor 26, and details are not described herein.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle and objective of the application and become
Type, scope of the present application are defined by the claims and their equivalents.
Claims (11)
1. a kind of electronic device characterized by comprising
Casing；
CCD camera assembly in the casing is set, and the CCD camera assembly includes:
First imaging modules, first imaging modules are periscopic camera, and are formed with the first light inlet, the first one-tenth described
As mould group acquires external image by first light inlet；
Second imaging modules of first imaging modules side are set, second imaging modules have the second light inlet,
Second imaging modules are used to acquire external image by second light inlet；
Flash lamp；With
Decoration on the housing is set, and the decoration has spaced three through-holes, three through-hole edges
The arrangement of one straight line, the area of three through-holes are sequentially reduced, first light inlet, second light inlet and the flash of light
Lamp passes through a corresponding through-hole respectively and exposes.
2. electronic device as described in claim 1, which is characterized in that the shape of three through-holes is all the same.
3. electronic device as claimed in claim 2, which is characterized in that three through-holes are respectively first through hole, second logical
Hole and third through-hole, second through-hole are the first through hole, described between the first through hole and the third through-hole
The area of second through-hole and the third through-hole is sequentially reduced, and first light inlet is exposed by the first through hole, described
Second light inlet is exposed by second through-hole, and the flash lamp is exposed by the third through-hole.
4. electronic device as claimed in claim 3, which is characterized in that the first through hole, second through-hole and described
Three through-holes are along the transverse direction arrangement of the casing, and in the transverse direction of the casing, the third through-hole is close to the edge of the casing
Setting, the first through hole are arranged close to the middle position of the casing.
5. electronic device as described in claim 1, which is characterized in that first imaging modules include:
Shell, the shell have first light inlet；
The reflecting element and the first imaging sensor being arranged in the shell, the reflecting element is used for will be from described first
The incident light of light inlet incidence reaches the first image sensor after turning to so that described in the first image sensor sensing
The incident light outside first imaging modules.
6. CCD camera assembly as claimed in claim 5, which is characterized in that first imaging modules include setting described outer
Mounting base in shell, the reflecting element are arranged in the mounting base, and first imaging modules include setting described outer
Driving device in shell, the driving device are used to that the mounting base with the reflecting element to be driven to turn around pivot center
It is dynamic, to realize the optical anti-vibration on the optical axis direction of the light inlet, light of the pivot center perpendicular to the light inlet
Axis.
7. electronic device as claimed in claim 6, which is characterized in that the mounting base is provided with position limiting structure, the limit
Structure connects the reflecting element to limit position of the reflecting element in the mounting base；
The mounting base is formed with mounting groove, and the reflecting element is arranged in the mounting groove, and the position limiting structure setting exists
The edge of the mounting groove and against the edge of the reflecting element.
8. electronic device as claimed in claim 6, which is characterized in that the driving device is formed with arc-shaped guide rail, the drive
Dynamic device is for driving center axis thereof of the mounting base along the arc-shaped guide rail around the arc-shaped guide rail, the center
Axis is overlapped with the pivot center.
9. electronic device as claimed in claim 5, which is characterized in that first imaging modules include being arranged at outside described
Lens assembly, motor element and driving mechanism in shell, the motor element are located at the reflecting element and the first image
Between sensor, the Lens assembly is fixed on the motor element, and the driving mechanism is for driving the motor element
Optical axis along the Lens assembly moves the imaging so that the Lens assembly is focused on the first image sensor.
10. electronic device as claimed in claim 9, which is characterized in that first imaging modules further include chip circuit plate
And driving chip, the chip circuit plate are fixed on the side of the driving mechanism, the driving chip is fixed on the chip
The circuit board one side opposite with the driving mechanism, the driving chip pass through the chip circuit plate and driving mechanism electricity
Property connection.
11. electronic device as claimed in claim 10, which is characterized in that first imaging modules include sensor circuit
Plate, the first image sensor are fixed on the sensor circuit board, and the chip circuit plate includes mounting portion and interconnecting piece,
The mounting portion is fixed on the side of the driving mechanism, and the driving chip is fixed on the mounting portion, and the interconnecting piece connects
Connect the mounting portion and the sensor circuit board.
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| CN109981852A (en) * | 2019-04-09 | 2019-07-05 | Oppo广东移动通信有限公司 | CCD camera assembly and electronic device |
| CN109981852B (en) * | 2019-04-09 | 2024-06-07 | Oppo广东移动通信有限公司 | Camera assembly and electronic device |
| CN110602362A (en) * | 2019-09-18 | 2019-12-20 | Oppo广东移动通信有限公司 | Electronic device |
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