CN109327571A - CCD camera assembly and electronic device - Google Patents
CCD camera assembly and electronic device Download PDFInfo
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- CN109327571A CN109327571A CN201811311112.3A CN201811311112A CN109327571A CN 109327571 A CN109327571 A CN 109327571A CN 201811311112 A CN201811311112 A CN 201811311112A CN 109327571 A CN109327571 A CN 109327571A
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- imaging modules
- ccd camera
- camera assembly
- imaging
- driving
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Studio Devices (AREA)
Abstract
A kind of CCD camera assembly and electronic device comprising be the first imaging modules, the second imaging modules and third imaging modules of tight shot；CCD camera assembly meets the following conditions: f2 < f3 < f1；1 f3/f2≤5 <；5 f1/f2≤10 <；Wherein, f1 is the equivalent focal length of the first imaging modules, and f2 is the equivalent focal length of the second imaging modules, and f3 is the equivalent focal length of third imaging modules.In the CCD camera assembly and electronic device of the application embodiment, the first imaging modules use periscopic imaging modules, so that the first imaging modules and the cooperation of the second imaging modules can obtain the optical zoom effect greater than 5 times.In addition, the second imaging modules and the cooperation of third imaging modules can obtain the optical zoom effect greater than 1 times and less than or equal to 5 times.In this way, the first imaging modules, the second imaging modules and third imaging modules cooperate so that CCD camera assembly may be implemented to realize optical zoom between 1-10 times, the shooting effect of CCD camera assembly is improved.
Description
Technical field
This application involves portable electronic device field more particularly to a kind of CCD camera assemblies and electronic device.
Background technique
In the related art, there are two cameras for mobile phone setting, using two camera cooperation shootings to obtain 2 times of optics
The effect of zoom (2x), to improve the effect of taking pictures of mobile phone.However, the thickness due to mobile phone limits, for mobile phone
Therefore the size of camera is also restricted, correspondingly limit the size of the photosensitive element of camera and the ruler of imaging len
It is very little, so that the zoom magnification of camera is also restrained.Therefore, in the case where not increasing mobile phone thickness, how mobile phone is improved
The optical zoom multiple of shooting becomes difficult point.
Summary of the invention
In view of this, the application provides a kind of CCD camera assembly and electronic device.
A kind of CCD camera assembly comprising be tight shot the first imaging modules, the second imaging modules and third at
As mould group, first imaging modules include shell and the reflecting element and imaging sensor that are arranged in the shell, institute
Shell is stated with light inlet, the reflecting element is for reaching described image after turning to from the incident light of the light inlet incidence
Sensor is so that described image sensor senses the incident light outside first imaging modules；
The CCD camera assembly meets the following conditions:
F2 < f3 < f1；
1 f3/f2≤5 <；
5 f1/f2≤10 <；
Wherein, the f1 be first imaging modules equivalent focal length, the f2 be second imaging modules etc.
Focal length is imitated, the f3 is the equivalent focal length of the third imaging modules.
The electronic device of the application embodiment includes the CCD camera assembly of battery and above embodiment, the camera
Component is electrically connected with the battery.
In the CCD camera assembly and electronic device of the application embodiment, mould is imaged using periscopic in the first imaging modules
Group, so that the first imaging modules and the cooperation of the second imaging modules can obtain the optical zoom effect greater than 5 times.In addition, second
Imaging modules and the cooperation of third imaging modules can obtain the optical zoom effect greater than 1 times and less than or equal to 5 times.In this way, the
One imaging modules, the second imaging modules and third imaging modules cooperate so that CCD camera assembly may be implemented between 1-10 times in fact
Existing optical zoom, improves the shooting effect of CCD camera assembly.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the status diagram of the electronic device of the application embodiment；
Fig. 2 is another status diagram of the electronic device of the application embodiment；
Fig. 3 is the stereoscopic schematic diagram of the CCD camera assembly of the application embodiment；
Fig. 4 is the stereoscopic schematic diagram of the first imaging modules of the application embodiment；
Fig. 5 is the decomposition diagram of the first imaging modules of the application embodiment；
Fig. 6 is the diagrammatic cross-section of the first imaging modules of the application embodiment；
Fig. 7 is the partial cutaway schematic view of the first imaging modules of the application embodiment；
Fig. 8 is the diagrammatic cross-section of the first imaging modules of another embodiment of the application；
Fig. 9 is the stereoscopic schematic diagram of the reflecting element of the application embodiment.
Figure 10 is the light catoptric imaging schematic diagram of imaging modules in the related technology；
Figure 11 is the light catoptric imaging schematic diagram of the first imaging modules of the application embodiment；
Figure 12 is the structural schematic diagram of imaging modules in the related technology；
Figure 13 is the structural schematic diagram of the first imaging modules of the application embodiment；
Figure 14 is the diagrammatic cross-section of the second imaging modules of the application embodiment.
Main element symbol description:
Electronic device 1000, ontology 110, sliding block 200, gyroscope 120；
CCD camera assembly 100, the first imaging modules 20, shell 21, light inlet 211, groove 212, roof 213, side wall
214, avoid holes 215, reflecting element 22, incidence surface 222, shady face 224, incidence surface 226, light-emitting surface 228, mounting base 23, arc
Shape face 231, the first Lens assembly 24, eyeglass 241, motor element 25, intermediate plate 222, the first imaging sensor 26, driving mechanism
27, driving device 28, arc-shaped guide rail 281, central axis 282, chip circuit plate 201, mounting portion 2011, interconnecting piece 2022, drive
Dynamic chip 202, sensor circuit board 203, shielding case 204, the second imaging modules 30, the second Lens assembly 31, the second image pass
Sensor 32, third imaging modules 40, bracket 50.
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, term " first ", " second " are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic.The feature of " first ", " second " is defined as a result,
It can explicitly or implicitly include one or more feature.In the description of the present application, the meaning of " plurality " is
Two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
When periscopic camera falls, reflecting element is easy to be sent out reflecting element in periscopic camera
Raw positional shift, reflecting element can not cause imaging sensor can not be accurately accurately by turn light rays to imaging sensor
The subject image outside periscopic camera is sensed, it can not normal use.
Fig. 1 and Fig. 2 is please referred to, the electronic device 1000 of the application embodiment includes ontology 110 and sliding block 200.
Sliding block 200 is used to slide in the first position being contained in ontology 110 and between the second position that ontology 110 exposes,
CCD camera assembly 100 and gyroscope 120 are provided in sliding block 200, CCD camera assembly 100 and gyroscope 120 are separately positioned.
Electronic device 1000 can be used for controlling the work of CCD camera assembly 100 according to the feedback data of gyroscope 120 to realize optical anti-vibration
Shooting.
In above-mentioned electronic device, CCD camera assembly 100 and gyroscope 120 are separately positioned, reduce in CCD camera assembly 100
Device, so as to reduce the volume of CCD camera assembly 100.In addition, CCD camera assembly 100 and gyroscope 120 are arranged at
In sliding block 200, so that gyroscope 120, relatively close to CCD camera assembly 100, gyroscope 120 can accurately detect camera shooting
The jitter conditions of head assembly 100 improve the anti-shake effect of CCD camera assembly 100.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 1.Specifically, electronic device 1000 can be with
For mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device
(such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), knee
Laptop, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such as
Wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 100 can also be other wearable devices (for example, all
As electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, the headset equipment of electronic equipment or smartwatch
(HMD))。
Electronic device 1000 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to
Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound
Happy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, can
Program remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant
(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play
Device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 1000 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 1000 can be such as cellular phone, media play
The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
Gyroscope 120 is used as a kind of typical sensor, can be used for the axial line movement of detection electronic installation 1000, energy
Measurement is made to the movement of rotation and deflection.For example, gyroscope 120 can detecte electronic device 1000 be vertically arranged or the shape of traverse
State, and then display picture rotation can be controlled according to the detection data of acquisition by the central processing unit of electronic device 1000.
In the present embodiment, gyroscope 120 can be used for detecting the jitter conditions of the sliding block 200 and feed back phase
The data answered.When CCD camera assembly 100 is imaged, CCD camera assembly 100 is detected using the gyroscope 120 of electronic device 1000
The fine jitter of generation, the shake data that gyroscope 120 will test, such as incline caused by CCD camera assembly 100 is shaken
Rake angle, the offset generated by inclination are sent to the processing chip of electronic device 1000, and processing chip is, for example, described below
Driving chip.Processing chip is according to the component in the feedback data of the gyroscope 120 received control imaging modules relative to taking the photograph
As head assembly 100 makes a relative move to realize stabilization.
It is appreciated that the other positions other than CCD camera assembly 100 are arranged in the gyroscope 120 of electronic device 1000, from
And save the space that independent gyroscope is set in CCD camera assembly 100.In this way, the size of CCD camera assembly 100 with commonly take the photograph
Picture head assembly is close, and realizes optical anti-vibration using the gyroscope of electronic device 1,000 120, while retaining stabilization function
Effectively reduce the size of CCD camera assembly 100.
Specifically, Fig. 1 and Fig. 2 is please referred to, ontology 110 further includes top end face 1002 and is disposed opposite to each other with top end face 1002
Bottom face 1003.In general, top end face 1002 and bottom face 1003 can extend along the width direction of ontology 110.Namely top end face
1002 and bottom face 1003 be electronic device 1000 short side.Bottom face 1003 be used for arrange electronic device 1000 connector,
Microphone, loudspeaker etc..
Holding tank 1004 is offered on the top of ontology 110, holding tank 1004 is from the top of ontology 110 into ontology 110
Portion's recess.Holding tank 1004 can run through the side of ontology 110.Sliding block 200 slides in holding tank 1004 with ontology 110
Connection.In other words, sliding block 200 is slidably connected ontology 110, to stretch out or retract holding tank 1004.
Sliding block 200 includes top surface 2003, and when sliding block 200 is located at first position, top surface and top end face 1002 are big
It causes concordant.Sliding block 200 can be connect with screw body, screw body sliding block 200 can be driven in first position and
It is slided between the second position.
It is appreciated that CCD camera assembly 100 exposes outside ontology 110 when sliding block 200 stretches out holding tank 1004, this
When, CCD camera assembly 100 can be with normal photographing.
It is appreciated that electronic device 1000 includes battery (not shown), battery is electrically connected with CCD camera assembly 100.
Incorporated by reference to Fig. 3, CCD camera assembly 100 includes the first imaging modules 20, the second imaging modules 30, third imaging modules
40 and bracket 50.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged in bracket 50 and and bracket
50 are fixedly connected.Bracket 50 can reduce what the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 were subject to
Impact improves the first imaging modules 20,40 service life of the second imaging modules 30 and third imaging modules.
In present embodiment, the field angle FOV3 of third imaging modules 40 is greater than the field angle FOV1 of the first imaging modules 20
And less than the field angle FOV2 of the second imaging modules 30, in other words, FOV1 < FOV3 < FOV2.In this way, different field angles
Three imaging modules make CCD camera assembly 100 can satisfy the shooting demand under different scenes.
In one example, the field angle FOV1 of the first imaging modules 20 is 10-30 degree, the visual field of the second imaging modules 30
Angle FOV2 is 110-130 degree, and the field angle FOV3 of third imaging modules 40 is 80-110 degree.
For example, 20 field angle FOV1 of the first imaging modules be 10 degree, 12 degree, 15 degree, 20 degree, 26 degree or 30 degree angularly.
Second imaging modules, 30 field angle FOV2 be 110 degree, 112 degree, 118 degree, 120 degree, 125 degree or 130 degree angularly.Third imaging
40 field angle FOV3 of mould group be 80 degree, 85 degree, 90 degree, 100 degree, 105 degree or 110 degree angularly.
Since the field angle FOV1 of the first imaging modules 20 is smaller, it will be understood that the focal length of the first imaging modules 20 is larger,
Therefore, the first imaging modules 20 can be used for shooting shooting distant view, to obtain distant view clearly image.Second imaging modules 30
Field angle FOV2 it is larger, it will be understood that the focal length of the second imaging modules 30 is shorter, and therefore, the second imaging modules 30 can be used
In shooting close shot, to obtain the close up fragmentary image of object.Third imaging modules 40 can be used for normal photographing object.
In this way, passing through the combination of the first imaging modules 20, the second imaging modules 30 and third imaging modules 40, can obtain
The image effects such as background blurring, picture part sharpening.
40 laid out in parallel of first imaging modules 20, the second imaging modules 30 and third imaging modules.In present embodiment, the
One imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged in "-" type.Further, the second imaging modules
30 between the first imaging modules 20 and third imaging modules 40.
Due to the field angle factor of the first imaging modules 20 and third imaging modules 40, in order to enable the first imaging modules 20
The preferable image of quality is obtained with third imaging modules 40, the first imaging modules 20 and third imaging modules 40 can be configured with light
Learn anti-shake apparatus, and optical anti-vibration device is typically arranged with more magnetic element, therefore, the first imaging modules 20 and third at
As mould group 40 can produce magnetic field.
In present embodiment, by the second imaging modules 30 between the first imaging modules 20 and third imaging modules 40,
So that the first imaging modules 20 and third imaging modules 40 may be located remotely from, the magnetic field for preventing the first imaging modules 20 from being formed and third
The magnetic field that imaging modules 40 are formed interferes with each other and influences the normal use of the first imaging modules 20 and third imaging modules 40.
In other embodiments, the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 can arrange
Column l-shaped.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 can be spaced setting, and adjacent two
Imaging modules can also be abutted against each other together.
In the first imaging modules 20, the second imaging modules 30 and third imaging modules 30, any one imaging modules can
Think black and white camera, RGB camera or infrared camera.
The processing chip of electronic device 1000 is used for according to the feedback data of the gyroscope 120 control first imaging
The work of mould group 20 is to realize that optical anti-vibration is shot.
Please refer to Fig. 4-6, in present embodiment, the first imaging modules 20 include shell 21, reflecting element 22, mounting base
23, the first Lens assembly 24, motor element 25, the first imaging sensor 26 and driving mechanism 27.
Reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25 are arranged in shell 21.Reflective member
Part 22 is arranged in mounting base 23, and the first Lens assembly 24 is fixed on motor element 25.Motor element 25 is arranged in the first figure
As 26 side of sensor.Further, motor element 25 is located between reflecting element 22 and the first imaging sensor 26.
Driving mechanism 27 connects motor element 25 and shell 21.After incident light enters shell 21, by 22 turns of reflecting element
To then through the first Lens assembly 24 the first imaging sensor 26 of arrival, so that the first imaging sensor 26 obtains outside
Boundary's image.Driving mechanism 27 is for driving motor element 25 to move along the optical axis of the first Lens assembly 24.
Shell 21 is generally square shaped, and shell 21 has light inlet 211, and incident light enters the first imaging from light inlet 211
In mould group 20.That is, after reflecting element 22 is used to turn to from the incident incident light of light inlet 211 and through the first lens set
The first imaging sensor 26 is reached after part 24 so that the first imaging sensor 26 senses the incident light outside the first imaging modules 20.
It will therefore be appreciated that the first imaging modules 20 are periscope type lens mould group, compared to vertical lens module, periscopic
The height of lens module is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical lens module refers to camera lens
The optical axis of mould group is straight line, and in other words, incident light is conducted along the direction of a straight optical axis to the photoreceptor of lens module
On part.
It is appreciated that light inlet 211 by through-hole 11 expose so that ambient after through-hole 11 from light inlet 211 into
Enter in the first imaging modules 20.
Specifically, Fig. 5 please be join, shell 21 includes roof 213 and side wall 214.Side wall 214 is from the side of roof 213 2131
It extends to form.Roof 213 includes two opposite sides 2131, and the quantity of side wall 214 is two, and each side wall 214 is certainly corresponding
A side 2131 extend, in other words, side wall 214 is separately connected the opposite two sides of roof 213.Light inlet 211 is formed in top
Wall 213.
Reflecting element 22 is prism or plane mirror.In one example, when reflecting element 22 is prism, prism can be
Triangular prism, the section of prism are right angled triangle, wherein light is incident from one of right-angle side in right angled triangle,
To which another right-angle side is emitted after the reflection of bevel edge.It is appreciated that certainly, incident light can go out after refraction by prism
It penetrates, and without reflection.Prism can be made of relatively good materials of translucency such as glass, plastics.In an embodiment
In, it can be in reflectorized materials such as one of surface silver coatings of prism to reflect incident light.
It is appreciated that the reflection of generation incident light is realized that incident light is turned to by plane mirror when reflecting element 22 is plane mirror.
More, Fig. 6 and Fig. 9 are please referred to, reflecting element 22 has incidence surface 222, shady face 224, reflective surface 226 and goes out
Smooth surface 228.Incidence surface 222 close to and towards light inlet 211.Shady face 224 is far from light inlet 211 and opposite with incidence surface 222.
Reflective surface 226 connects incidence surface 222 and shady face 224.Light-emitting surface 228 connects incidence surface 222 and shady face 224.Light-emitting surface 228
Towards the first imaging sensor 26.Reflective surface 226 is obliquely installed relative to incidence surface 222.Light-emitting surface 228 and 226 phase of reflective surface
Back setting.
Specifically, light passes through light inlet 211 and enters reflecting element 22 by incidence surface 222 in the conversion process of light
In, then via the reflection of reflective surface 226, reflecting element 22 finally is reflected from light-emitting surface 228, the process of light conversion is completed, and
Shady face 224 and mounting base 23 are fixedly installed, so that reflecting element 22 is keeping stablizing.
As shown in Figure 10, in the related art, due to the needs of reflection incident ray, the reflective surface of reflecting element 22a
226a is tilted relative to horizontal direction, and reflecting element 22a is unsymmetric structure, thus reflective member on the reflection direction of light
The lower section of part 22a is smaller with respect to the practical optical area above reflecting element 22a, it can be understood as, the part far from light inlet
Reflective surface 226a is less or can not reflection light.
Therefore, Figure 11 please be join, the reflecting element 22 of the application embodiment is relative to reflecting element 22a in the related technology
The corner angle far from light inlet have been cut off, have not only been also reduced anti-without the effect of the reflection light of influence reflecting element 22 in this way
The integral thickness of optical element 22.
Referring to Fig. 6, in some embodiments, reflective surface 226 is tilted relative to the angle [alpha] of incidence surface 222 in 45 degree.
In this way, incident light is made preferably to reflect and convert, has preferable light conversion effect.
Reflecting element 22 can be made of relatively good materials of translucency such as glass, plastics.In one embodiment,
It can be in reflectorized materials such as one of surface silver coatings of reflecting element 22 to reflect incident light.
In some embodiments, incidence surface 222 is arranged in parallel with shady face 224.
In this way, 22 held stationary of reflecting element, incidence surface 222 can be made when shady face 224 and mounting base 23 are fixedly installed
Also it is rendered as plane, incident light imitates the conversion of light in the optical path of the conversion process also formation rule of reflecting element 22
Rate is preferable.Specifically, the section of reflecting element 22 is substantially trapezoidal along the light direction that enters of light inlet 211, and in other words, reflective member
The substantially trapezoidal body of part 22.
In some embodiments, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.
In this way, more regular reflecting element 22 can be formed, keep the optical path of incident ray more straight, improves turning for light
Change efficiency.
In some embodiments, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.
Specifically, the distance between incidence surface 222 and shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..Or
It says, the distance range of incidence surface 222 and shady face 224 is it is to be understood that the height of reflecting element 22 is 4.8-5.0mm.More than
It is moderate that the incidence surface 222 of distance range and shady face 224 are formed by 22 volume of reflecting element, can preferably suit into the first one-tenth
The first imaging modules 20, CCD camera assembly 100 and electronic device 1000 as in mould group 20, forming more compact property and miniaturization,
Meet the more demands of consumer.
In some embodiments, incidence surface 222, shady face 224, reflective surface 226 and the equal cure process shape of light-emitting surface 228
At there is hardened layer.
When reflecting element 22 is made of materials such as glass, the material of reflecting element 22 itself is more crisp, in order to improve reflective member
The intensity of part 22 can be done at hardening in incidence surface 222, shady face 224, reflective surface 226 and the light-emitting surface 228 to reflecting element 22
Reason, more, can do cure process to all surface of reflecting element, to further increase the intensity of reflecting element.At hardening
Reason such as penetrate into lithium ion, do not influence reflecting element 22 convert light under the premise of to above each film on surface.
In one example, the angle turned to from the incident incident light of light inlet 211 is 90 degree by reflecting element 22.Example
Such as, incidence angle of the incident light on the surface of emission of reflecting element 22 is 45 degree, and angle of reflection is also 45 degree.Certainly, reflecting element 22
By incident light turn to angle can also be other angles, for example, 80 degree, 100 degree etc., as long as being reached after incident light capable of being turned to
First imaging sensor 26.
In present embodiment, the quantity of reflecting element 22 is one, at this point, incident light reaches first after once turning to
Imaging sensor 26.In other embodiments, the quantity of reflecting element 22 is multiple, at this point, incident light is by least twice
The first imaging sensor 26 is reached after steering.
Mounting base 23 is for installing reflecting element 22, and in other words, mounting base 23 is the carrier of reflecting element 22, reflecting element
22 are fixed in mounting base 23.Make the position of reflecting element 22 in this way it was determined that being conducive to the reflection of reflecting element 22 or folding
Penetrate incident light.Reflecting element 22 can use viscose glue to be adhesively fixed in mounting base 23 to realize and be fixedly connected with mounting base 23.
Specifically, in present embodiment, mounting base 23 is provided with position limiting structure 232, and position limiting structure 232 connects reflecting element
22 to limit position of the reflecting element 22 in mounting base 23.
In this way, position limiting structure 232 limits position of the reflecting element 22 in mounting base 23 so that reflecting element 22 by
Positional shift will not occur in the case where shock, be conducive to 20 normal use of the first imaging modules.
It is appreciated that in one example, reflecting element 22 is fixed in mounting base 23 by way of bonding, if saved
Slightly position limiting structure 232, then, when the first imaging modules 20 are impacted, if between reflecting element 2222 and mounting base 23
Bonding force is insufficient, and reflecting element 22 is easy to fall off from mounting base 23.
In present embodiment, mounting base 23 is formed with mounting groove 233, and reflecting element 22 is arranged in mounting groove 233, limit
Structure 232 is arranged in the edge of mounting groove 233 and against reflecting element 22.
In this way, mounting groove 233 can make reflecting element 22 be easily mounted in mounting base 23.Position limiting structure 232 is arranged
Mounting groove 233 edge and against the edge of reflecting element 22, the position of reflecting element 22 not only can be limited, also not
Reflecting element 22 can be interfered incident light emitting to the first imaging sensor 26.
Further, position limiting structure 232 includes the protrusion 234 of the edge protrusion of self installation slot 233, and protrusion 234 is against out
The edge of smooth surface 228.Since reflecting element 22 is mounted in mounting base 23 by reflective surface 226, and light-emitting surface 228 and reflective surface
226 are disposed opposite to each other.Therefore, reflecting element 22 is more easier that position occurs towards the side of light-emitting surface 228 when being impacted.And
In present embodiment, in this way, position limiting structure 232 not only can prevent reflecting element 22 to light out against the edge of light-emitting surface 228
228 side of face displacement, it can also be ensured that light normally goes out light from light-emitting surface 228.
Certainly, in other embodiments, position limiting structure 232 may include other structures, as long as reflective member can be limited
The position of part 22.For example, position limiting structure 232 is formed with card slot, reflecting element 22 is formed with limited post, the limited post card
Close the position that reflecting element 22 is limited in card slot.
In some embodiments, protrusion 234 is in a strip shape and extends along the edge of light-emitting surface 228.In this way, protrusion 234 with
The contact area at the edge of light-emitting surface 228 is big, and reflecting element 22 is allowed more to be seated firmly on mounting base 23.
Certainly, in other embodiments, protrusion 234 can also be in other structures such as bulks.
It please join referring again to Fig. 5, in one example, mounting base 23 is movable to be arranged in shell 21,23 energy of mounting base
It is enough to rotate relative to shell 21 to adjust the direction that reflecting element 22 turns to incident light.
Mounting base 23 can drive reflecting element 22 to rotate together towards the opposite direction of the shake of the first imaging modules 20, from
And the incident deviation of the incident light of light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in motor element 25, and further, the first Lens assembly 24 is arranged in reflective member
Between part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26
On.The first imaging sensor 26 is allowed to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when moving integrally along its optical axis on the first imaging sensor 26, thus real
Existing first imaging modules 20 focusing.More, driving mechanism 27 drives motor element 25 to move in shell 21 to reach focusing
Purpose.
In the example of fig. 6, in some embodiments, motor element 25 is cylindrical in shape, more in the first Lens assembly 24
A eyeglass 241 is fixed in motor element 25 along the axially spaced-apart of motor element 25.As Fig. 8 example in, motor element 25 wrap
Two intermediate plates 252 are included, eyeglass 241 is folded between two intermediate plates 252 by two intermediate plates 252.
It is appreciated that since motor element 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required motor element 25
Very little larger, motor element 25 can have the shape of more certain cavity for cylindrical shape, square tube shape etc., and such motor element 25 is in cylinder
Multiple eyeglasses 241 can be preferably arranged in dress, and can preferably protect eyeglass 241 in cavity, making eyeglass 241 be not susceptible to shake
It is dynamic.
In addition, in the example of fig. 8, multiple eyeglasses 241 are held between two intermediate plates 252 by motor element 25, both had
Standby certain stability, can also reduce the weight of motor element 25, can reduce driving mechanism 27 and drive needed for motor element 25
Power, and the design difficulty of motor element 25 is relatively low, and eyeglass 241 is also easier to be set on motor element 25.
Certainly, motor element 25 is not limited to tubular and two intermediate plates 252 mentioned above, in other implementations,
Motor element 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this way
More simple structure；Or has cavity for cuboid, round etc. to accommodate the various regular or irregular of eyeglass 241
Shape.Under the premise of guaranteeing 10 normal imaging of imaging modules and operation, specific choice.
First imaging sensor 26 can use complementary metal oxide semiconductor (CMOS, Complementary Metal
Oxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) photosensitive member
Part.
In some embodiments, driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy driving
Mechanism.
It specifically, include magnetic field and conductor in electromagnetic drive mechanism, if magnetic field in the conductor can relative to conductor motion
Induced current is generated, induced current makes effect of the conductor by Ampere force, and Ampere force makes conductor motion, and conductor herein is
The part for driving motor element 25 mobile in electromagnetic drive mechanism；Drive mechanism, the inverse piezoelectricity based on piezoceramic material
Effect: if applying voltage to piezoelectric material, mechanical stress is generated, i.e., is changed between electric energy and mechanical energy, control is passed through
Make its mechanically deform generate rotation or linear motion, have the advantages that structure simply, low speed.
Characteristic of the driving of memorial alloy driving mechanism based on marmem: marmem is a kind of special
Alloy, once it is made to have remembered any shape, even if being deformed, but when being heated to a certain proper temperature, it can restore
Shape before to deformation achievees the purpose that driving with this, has the characteristics that displacement is rapid, direction is free.
Referring to Fig. 6, further, the first imaging modules 20 further include driving device 28, and driving device 28 is used for
Mounting base 23 of the driving with reflecting element 22 is rotated around pivot center 29.Driving device 28 is for drive installation seat 23 along rotation
The axial movement of axis 29.Pivot center 29 perpendicular to the optical axis of light inlet 211 and the photosensitive direction of the first imaging sensor 26,
So that the first imaging modules 20 realize the optical anti-vibration in the optical axis of light inlet 211 and the axial direction of pivot center 29.
In this way, 28 drive installation seat 23 of driving device is two sides since the volume of reflecting element 22 is smaller compared with lens barrel
It moves upwards, the first imaging modules 20 not only may be implemented in the optical anti-vibration effect of both direction, it is also possible that the first one-tenth
As the small volume of mould group 20.
It please join Fig. 5-Fig. 6, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to short transverse
It is defined as Y-direction, length direction is defined as Z-direction.As a result, the optical axis of light inlet 211 be Y-direction, the first imaging sensor 26 it is photosensitive
Direction is Z-direction, the axial direction of pivot center 29 be X to.
The rotation of 28 drive installation seat 23 of driving device so that reflecting element 22 around X to rotation so that the first imaging mould
Group 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along pivot center 29,
So that the first imaging modules 20 realize effect of the X to optical anti-vibration.In addition, the first Lens assembly 24 can along Z-direction with
Realize that the first Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, around X to when rotation, the light that reflecting element 22 reflects moves reflecting element 22 in Y-direction, so that
First imaging sensor 26 forms different images in Y-direction to realize the anti-shake effect of Y-direction.Reflecting element 22 is along X to shifting
When dynamic, the light that reflecting element 22 reflects is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in X
Image with realize X to anti-shake effect.
In some embodiments, driving device 28 is formed with arc-shaped guide rail 281, and driving device 28 is used for drive installation seat
23 along arc-shaped guide rail 281 around arc-shaped guide rail 281 central axis 282 rotation and along central axis 282 axial movement, in
Mandrel line 2282 is overlapped with pivot center 29.
It is appreciated that driving device 28 is used for drive installation seat 23 along arc-shaped guide rail 281 around the center of arc-shaped guide rail 281
The rotation of axis 282 and the axial movement along central axis 282.
In this way, since driving device 28 drives the mounting base 23 with reflecting element 22 by the way of arc-shaped guide rail 281
It rotates together, so that friction is small between driving device 28 and mounting base 23, is conducive to 23 stability of rotation of mounting base, improve
The optical anti-vibration effects of first imaging modules 20.
Specifically, Figure 12 please be join, in the related art, mounting base (not shown) and shaft 23a are rotatablely connected, mounting base around
Shaft 23a rotation to drive reflecting element 22a to rotate together.It is assumed that frictional force is f1, shaft 23a radius is R1, and thrust is
F1, radius of gyration R1.So friction-torque and thrust torque ratio K1 are K1=f1R1/F1A1.Due to reflecting element 22a
Fine rotation is only needed, therefore F1 cannot be excessive；And imaging modules itself need light and short to cause reflecting element 22a size cannot
Too big, the space that becomes larger of A is also limited, can not further eliminate so as to cause the influence of frictional force.
It please join Figure 13, and in the application, mounting base 23 is rotated along arc-shaped guide rail 281, and the radius of arc-shaped guide rail 281 is
R2.At this point, the ratio K2 of friction-torque and rotational torque is K2=f2R2/F2A, do not significantlyd change in f2, R2, F2
In the case where, due to being rotated using the swing mode of rail mounted, corresponding thrust torque becomes R2, and R2 can not be by anti-
The limitation of 22 size of optical element, or even accomplish the several times of R1 or more.Therefore in this case, frictional force rotates reflecting element 22
Influence the size of K2 (reduce) can be greatly reduced, so as to improve the rotation precision of reflecting element 22, so that the first imaging
The optical anti-vibration effect of mould group 20 is preferable.
It please join Fig. 6, in some embodiments, mounting base 23 includes arcwall face 231, arcwall face 231 and arc-shaped guide rail 281
It is arranged concentrically and cooperates with arc-shaped guide rail 281.In other words, the center of arcwall face 231 is overlapped with the center of arc-shaped guide rail 281.This
It is more compact that sample cooperates mounting base 23 with driving device 28.
In some embodiments, central axis 282 is located at outside the first imaging modules 20.In this way, the half of arc-shaped guide rail 281
Diameter R2 is larger, can reduce the adverse effect that frictional force rotates mounting base 23 in this way.
In some embodiments, driving device 28 is located at the bottom of shell 21.In other words, driving device 28 and shell 21
It is structure as a whole.In this way, the structure of the first imaging modules 20 is more compact.
In some embodiments, the drive installation seat 23 by way of electromagnetism of driving device 28 rotates.In an example
In, driving device 28 is provided with coil, is fixed with electromagnetic plate in mounting base 23, and after coil energization, coil can produce magnetic field
To drive electromagnetic plate to move, so that mounting base 23 and reflecting element be driven to rotate together.
Certainly, in other embodiments, driving device 28 can by way of Piezoelectric Driving or memorial alloy driving
Mode drive installation seat 23 move.The mode of Piezoelectric Driving and memory alloy driven mode please join foregoing description, herein not
It repeats again.
Referring to Fig. 4-Fig. 7, the first imaging modules 20 further include chip circuit plate 201 and driving chip 202, chip
Circuit board 201 is fixed on the side of driving mechanism 27, and driving chip 202 is fixed on chip circuit plate 201 and 27 phase of driving mechanism
The one side of back, driving chip 202 are electrically connected by chip circuit plate 201 and driving mechanism 27.
In this way, driving chip 202 is fixed on the side of driving mechanism 27 by chip circuit plate 201, and pass through chip
Circuit board 201 and driving mechanism 27 are electrically connected, so that the structure between driving chip 202 and driving mechanism 27 is more stepped up
It gathers, advantageously reduces the volume of the first imaging modules 20.
Specifically, driving chip 202 drives motor element 25 along the first Lens assembly 24 for controlling driving mechanism 27
Optical axis is mobile, the imaging so that the first Lens assembly 24 is focused on the first imaging sensor 26.Driving chip 202 is used for according to institute
Mounting base 23 of the feedback data control driving of driving device 28 with reflecting element 22 of gyroscope 120 is stated around 29 turns of pivot center
It is dynamic.Driving chip 202 be also used to according to the feedback data of the gyroscope 120 control 28 drive installation seat 23 of driving device along turn
The axial movement of shaft line 29.
Driving chip 202 is also used to control 28 drive installation seat of driving device according to the feedback data of the gyroscope 120
23 along arc-shaped guide rail 281 around arc-shaped guide rail 281 central axis 282 rotation and along central axis 282 axial movement.
In some embodiments, the first imaging modules 20 include sensor circuit board 203, and the first imaging sensor 26 is solid
It is scheduled on sensor circuit board 203, chip circuit plate 201 includes mounting portion 2011 and interconnecting piece 2022, and mounting portion 2011 is fixed on
The side of driving mechanism 27, driving chip 202 are fixed on mounting portion 2011, and interconnecting piece 2022 connects mounting portion 2011 and sensor
Circuit board 203.
In this way, driving chip 202 can be electrically connected by sensor circuit board 203 and the first imaging sensor 26.Tool
Body, interconnecting piece 2022 can be fixedly connected with sensor circuit board 203 by welding.
In one example, when assembling the first imaging modules 20, driving chip 202 first can be fixed on chip circuit
On plate 201, then the chip circuit plate 201 with driving chip 202 is connected by welding with sensor circuit board 203
It connects, the chip circuit plate 201 with driving chip 202 is finally fixed on to the side of driving mechanism 27.
Chip circuit plate 201 can be fixedly connected by the modes such as welding, being bonded with driving mechanism 27.
It should be pointed out that the side that chip circuit plate 201 is fixed on driving mechanism 27 can refer to chip circuit plate 201 with
The side of driving mechanism 27, which contacts, to be fixed, and can also refer to that chip circuit plate 201 passes through the side of other elements and driving mechanism 27
It is fixedly connected.
In present embodiment, mounting portion 2011 is rigid circuit board, and interconnecting piece 2022 is flexible circuit board, mounting portion 2011
It is fitted in the side of driving mechanism 27.
In this way, mounting portion 2011 is that rigid circuit board makes mounting portion 2011 have preferable rigidity, it is unlikely to deform, favorably
It is fixedly connected in mounting portion 2011 with the side of driving mechanism 27.Mounting portion 2011 can be fitted in driving by way of bonding
The side of mechanism 27.In addition, interconnecting piece 2022 is that flexible circuit board is easily deformed chip circuit plate 201, so that chip is electric
Road plate 201 is easily mounted on the side of driving mechanism 27.
Certainly, in other embodiments, mounting portion 2011 or flexible circuit board.
In some embodiments, shell 21 is formed with avoid holes 215, and driving chip 202 is at least partially disposed at avoid holes
In 215, to be exposed to shell 21.Make between driving chip 202 and shell 21 in this way, driving chip 202 wears shell 21
There are the parts of overlapping, so that the structure between driving chip 202 and shell 21 is more compact, can further decrease
The volume of one imaging modules 20.
It is appreciated that 202 part of driving chip is located at when having gap between the side of driving mechanism 27 and shell 21
In avoid holes 215.
Preferably, the shape of avoid holes 215, size respectively with the shape of driving chip 202, dimensional fits.For example, evacuation
The size in hole 215 is slightly larger than the size of driving chip 202, and the shape of avoid holes 215 is identical as the shape of driving chip 202.
In present embodiment, avoid holes 215 are formed in the side wall 214 of shell 21.It is appreciated that avoid holes 215 run through side
The interior outside of wall 214.Certainly, in other embodiments, avoid holes 215 can also be formed in the roof 213 of shell 21.
In one embodiment, the first imaging modules 20 further include shielding case 204, and shielding case 204 is fixed on chip electricity
Road plate 201 and it is provide with driving chip 202.In this way, shielding case 204 can protect driving chip 202, prevent driving chip 202 by
To physical impact.In addition, shielding case 204 can also reduce the electromagnetic effect that driving chip 202 is subject to.
Shielding case 204 can be made of metal material.For example, the material of shielding case 204 is stainless steel.Present embodiment
In, chip circuit plate 201 is fixed on mounting portion 2011, at this point, mounting portion 2011 is preferably rigid circuit board or is flexible electrical
Plate of the road plate in conjunction with stiffening plate.
Please refer to Figure 14, in present embodiment, the second imaging modules 30 are vertical lens module, certainly, in other implementations
In mode, the second imaging modules 30 can also be with periscope type lens mould group.
Second imaging modules 30 include the second Lens assembly 31 and the second imaging sensor 32, and the second Lens assembly 31 is used for
Light is imaged on the second imaging sensor 32, the optical axis of the incident light axis of the second imaging modules 30 and the second Lens assembly 31
It is overlapped.
In present embodiment, the second imaging modules 30 can be tight shot mould group, therefore, the mirror of the second Lens assembly 31
Piece 241 is less, so that 30 height of the second imaging modules is lower, is conducive to the thickness for reducing electronic device 1000.
The type of second imaging sensor 32 can be as the type of the first imaging sensor 26, and details are not described herein.
The structure of third imaging modules 40 is similar with the structure of the second imaging modules 30, for example, third imaging modules 40
For vertical lens module.Therefore, the feature of third imaging modules 40 please refers to the feature of the second imaging modules 40, herein not superfluous
It states.
In some embodiments, the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 are fixed
Zoom lens, in other words, the effective focal length of the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 are solid
Fixed, the first imaging modules 20, the second imaging modules 30 and the respective focal length of third imaging modules 40 are non-adjustable.
CCD camera assembly 100 meets the following conditions:
F2 < f3 < f1；
1 f3/f2≤5 <；
5 f1/f2≤10 <；
Wherein, f1 is the equivalent focal length of the first imaging modules 20, and f2 is the equivalent focal length of the second imaging modules 30, f3 the
The equivalent focal length of three imaging modules 40.
In this way, the first imaging modules 20 use periscopic imaging modules, so that the first imaging modules 20 and the second imaging mould
30 cooperation of group can obtain the optical zoom effect greater than 5 times.In addition, the second imaging modules 30 and third imaging modules 40 cooperate
It can obtain greater than 1 times and be less than or equal to 5 times of optical zoom effect.In this way, the first imaging modules 20, the second imaging modules 30
And third imaging modules 40 cooperate so that CCD camera assembly 100 may be implemented to realize optical zoom between 1-10 times, improve
The shooting effect of CCD camera assembly 100.
In general, industry gets used to the visual angle that will be imaged on different size photosensitive elements, it is converted into 135 film cameras (135
The photosurface of film camera is fixed and invariable, 35mm film size) on lens focus corresponding to same imaged viewing angle, this
Focal length after conversion is exactly the equivalent focal length of 135 film cameras, i.e. equivalent focal length.Digital camera because of its photosensitive element (CCD or
CMOS size) is the difference with camera and difference (if any 1/2.5 inch, 1/1.8 inch etc.), so the camera lens of same focal length
On the digital camera of different size photosensitive elements, the visual angle of imaging is also different.But for a user, really it is significant just
It is the coverage (visual angle size) of camera, i.e., what people were more concerned about is equivalent focal length rather than real focal length.
In one example, the numerical value such as f3/f2 1.5,2,2.5,3,4 or 5.In other words, 30 He of the second imaging modules
1.5 times, 2 times, 2.5 times, 3 times, 4 times or 5 Zoom Lens may be implemented in the cooperation of third imaging modules 40.Preferably, at one
In example, 1 f3/f2≤3 <.F1/f2 can be the specific values such as 6,7,8,9 or 10.In other words, the first imaging modules 20 and
The cooperation of two imaging modules 30 may be implemented 6 times, 7 times, 8 times, 9 times or 10 times.
When f1/f2 is greater than 10, at this point, the effective focal length f1 of the first imaging modules 20 is larger, this is again such that the first figure
It as the size of sensor is also larger, causes the size of the first imaging modules 20 larger, is unfavorable for that electronic device 1000 is lightening to be set
Meter.Therefore, the optical zoom multiple of CCD camera assembly 100 is controlled within 10 times, not only can satisfy taking pictures for user needs
It asks, it can also be ensured that electronic device 1000 is lightening.
In one embodiment, camera is shot based on the second imaging modules 30.In other words, in the case of generally taking pictures,
Second imaging modules 30 are opened to be shot.First imaging modules 20 and third imaging modules 40 can be used as secondary camera,
When user needs enlarged drawing to shoot, the first imaging modules 20 or third imaging modules 40 are opened.
In one example, f3/f2=2, f1/f2=10.At this point, CCD camera assembly 100 may be implemented 1 times, 2 times or 10
Zoom Lens effect.When user opens the shooting function of electronic device 1000, the second imaging modules 30 are opened pre- to obtain
Photographed；When user selects 2 times of amplification effects in pre- photographed, the second imaging modules 30 are closed, and third is imaged
Mould group 40 is opened, so that the photographed of available 2 times of the amplification of third imaging modules 40；When user selects in pre- photographed
When selecting 10 times of amplification effects, the second imaging modules 30 are closed, and the first imaging modules 20 are opened, so that the first imaging modules 20 can
To obtain the photographed for amplifying 10 times.So, it will be understood that since the image amplification of pre- photographed is become by optics
Coke obtains, therefore, the image of the preferably pre- photographed of the available quality of CCD camera assembly 100.
In one embodiment, the first imaging modules 20, the second imaging modules 30 and third of CCD camera assembly 100 at
As the combination of mould group 40 is as shown in following table one:
Table one:
In present embodiment, light no-load voltage ratio refers to the equivalent of the equivalent focal lengths of other imaging modules and the second imaging modules 30
The ratio of focal length.
In another embodiment, the first imaging modules 20, the second imaging modules 30 and third of CCD camera assembly 100
The combination of imaging modules 40 is as shown in following table two:
Table two:
In yet another embodiment, the first imaging modules 20, the second imaging modules 30 and third of CCD camera assembly 100
The combination of imaging modules 40 is as shown in following table three:
Table three:
It should be pointed out that the quantity of third imaging modules 40 can be to be multiple, such as institute in the above table one, table two and table three
Show, multiple third imaging modules 40 make the second imaging modules 30 that more zooms may be implemented with the cooperation of third imaging modules 40
Multiple is conducive to the shooting effect for improving electronic device 1000.
In some embodiments, the quantity of the first imaging modules 20 be it is multiple, multiple first imaging modules 20 it is equivalent
Focal length is different.In other words, the quantity of the imaging modules of CCD camera assembly 100 can be greater than 3.In this way, CCD camera assembly
100 can realize the multiple of multiple optical zooms between 5-10 times.
In one example, the quantity of the first imaging modules 20 is 3, respectively the first imaging modules I, the first imaging mould
Group II and the first imaging modules III, wherein the equivalent focal length of the equivalent focal length of the first imaging modules I and the second imaging modules 30
The ratio equivalent focal length for being the 7 or so, first imaging modules II and the second imaging modules 30 equivalent focal length ratio be 9 a left side
The ratio of the right, equivalent focal length of the first imaging modules III and the equivalent focal length of the second imaging modules 30 is 10 or so.In other words,
First imaging modules I and the second imaging modules 30 cooperate so that CCD camera assembly 100 realizes 7 Zoom Lens.First imaging mould
Group II and the second imaging modules 30 cooperate so that CCD camera assembly 100 realizes 9 Zoom Lens.First imaging modules III and
Two imaging modules 30 cooperate so that CCD camera assembly 100 realizes 10 Zoom Lens.
In one embodiment, the first imaging modules 20, the second imaging modules 30 and third of CCD camera assembly 100 at
As the combination of mould group 40 is as shown in following table four:
Table four:
In some embodiments, the resolution ratio of the first imaging modules 20 is identical as the resolution ratio of the second imaging modules 30.
In this way, the optical zoom greater than 5 times is realized in the first imaging modules 20 and the cooperation of the second imaging modules 30 under same resolution ratio,
So that the image quality of amplified pre- photographed is preferable.
In one example, the resolution ratio of the resolution ratio of the first imaging modules 20 and the second imaging modules 30 is 8M.
Certainly, in other embodiments, the resolution ratio of the resolution ratio of the first imaging modules 20 and the second imaging modules 30
It can not also be identical.For example, the resolution ratio of the first imaging modules 20 is 12M, and the resolution ratio of the second imaging modules 30 is 8M.
In some embodiments, the resolution ratio of third imaging modules 40 is greater than or equal to 8M.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle and objective of the application and become
Type, scope of the present application are defined by the claims and their equivalents.
Claims (14)
1. a kind of CCD camera assembly, which is characterized in that including be the first imaging modules of tight shot, the second imaging modules and
Third imaging modules, first imaging modules include shell and the reflecting element and image sensing that are arranged in the shell
Device, the shell have light inlet, and the reflecting element is for reaching institute after turning to from the incident light of the light inlet incidence
Imaging sensor is stated so that described image sensor senses the incident light outside first imaging modules；
The CCD camera assembly meets the following conditions:
F2 < f3 < f1；
1 f3/f2≤5 <；
5 f1/f2≤10 <；
Wherein, the f1 is the equivalent focal length of first imaging modules, and the f2 is the equivalent coke of second imaging modules
Away from the f3 is the equivalent focal length of the third imaging modules.
2. CCD camera assembly as described in claim 1, which is characterized in that 1 f3/f2≤3 <.
3. CCD camera assembly as described in claim 1, which is characterized in that the quantity of first imaging modules be it is multiple, it is more
The equivalent focal length of a first imaging modules is different.
4. CCD camera assembly as described in claim 1, which is characterized in that the resolution ratio of first imaging modules and described the
The resolution ratio of two imaging modules is identical.
5. CCD camera assembly as claimed in claim 4, which is characterized in that the resolution ratio of first imaging modules and described the
The resolution ratio of two imaging modules is 8M.
6. CCD camera assembly as described in claim 1, which is characterized in that first imaging modules include mounting base and driving
Device, the reflecting element are fixed in the mounting base, and the driving device is used to drive the institute with the reflecting element
Mounting base is stated around pivot axis, optical axis of the pivot center perpendicular to the light inlet.
7. CCD camera assembly as claimed in claim 6, which is characterized in that the driving device is formed with arc-shaped guide rail, described
Driving device for driving center axis thereof of the mounting base along the arc-shaped guide rail around the arc-shaped guide rail, it is described in
Mandrel line is overlapped with the pivot center.
8. CCD camera assembly as claimed in claim 7, which is characterized in that the mounting base includes concentric with the arc-shaped guide rail
The arcwall face for being arranged and cooperating with the arc-shaped guide rail.
9. CCD camera assembly as described in claim 1, which is characterized in that first imaging modules further include:
Motor element that is that described image sensor side is set and being contained in the shell；
The Lens assembly being fixed on the motor element；With
The driving mechanism of the shell and the motor element is connected, the driving mechanism is for driving the motor element along institute
State the mobile imaging so that the Lens assembly is focused in described image sensor of optical axis of Lens assembly.
10. CCD camera assembly as claimed in claim 9, which is characterized in that the imaging modules further include chip circuit plate and
Driving chip, the chip circuit plate are fixed on the side of the driving mechanism, and the driving chip is fixed on the chip electricity
The road plate one side opposite with the driving mechanism, the driving chip are electrical by the chip circuit plate and the driving mechanism
Connection.
11. CCD camera assembly as claimed in claim 10, which is characterized in that the imaging modules include sensor circuit board,
Described image sensor is fixed on the sensor circuit board, and the chip circuit plate includes mounting portion and interconnecting piece, the peace
Dress portion is fixed on the side of the driving mechanism, and the driving chip is fixed on the mounting portion, described in the interconnecting piece connection
Mounting portion and the sensor circuit board.
12. CCD camera assembly as claimed in claim 10, which is characterized in that the imaging modules further include being fixed on the core
Piece circuit board and the shielding case for being provide with the driving chip.
13. a kind of electronic device characterized by comprising
Battery；With
The described in any item CCD camera assemblies of claim 1-12, the CCD camera assembly are electrically connected with the battery.
14. electronic device as claimed in claim 13 characterized by comprising
Ontology；
Sliding block, the sliding block are used in for being contained in the intrinsic first position and exposing from the ontology
It is slided between two positions, the CCD camera assembly is provided in the sliding block.
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| CN113467036A (en) * | 2020-03-13 | 2021-10-01 | 华为技术有限公司 | Zoom lens, camera module, electronic equipment and focusing method thereof |
| CN112379512A (en) * | 2020-11-13 | 2021-02-19 | 宁波永新光学股份有限公司 | Optical system of full-automatic digital slice scanner |
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