CN209105287U - Imaging modules, CCD camera assembly and electronic device - Google Patents

Imaging modules, CCD camera assembly and electronic device Download PDF

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Publication number
CN209105287U
CN209105287U CN201821821704.5U CN201821821704U CN209105287U CN 209105287 U CN209105287 U CN 209105287U CN 201821821704 U CN201821821704 U CN 201821821704U CN 209105287 U CN209105287 U CN 209105287U
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Prior art keywords
imaging modules
shell
motor element
imaging
driving
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CN201821821704.5U
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Chinese (zh)
Inventor
张弓
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Abstract

The application provides a kind of imaging modules, CCD camera assembly and electronic device.Imaging modules include shell;Be respectively provided with reflecting element, imaging sensor, Lens assembly, motor element and driving mechanism inside the shell, between reflecting element and imaging sensor, Lens assembly is fixed on motor element motor element;Imaging modules further include the buffer structure being fixed between shell and motor element, and buffer structure is less than shell in the size of width direction in the size of width direction.The application between shell and motor element by being arranged buffer structure, and buffer structure is less than shell in the size of width direction in the size of width direction, to when electronic device falls or collides, it can be contacted by buffer structure between shell and motor element, the contact area for directly contacting or reducing shell and motor element between shell and motor element is prevented, causes imaging modules that can not focus so that motor element is not easy not moving because of the deformation of shell.

Description

Imaging modules, CCD camera assembly and electronic device
Technical field
This application involves field of electronic devices more particularly to a kind of imaging modules, CCD camera assembly and electronic device.
Background technique
In the related art, in order to improve the effect of taking pictures of mobile phone, the camera of mobile phone uses periscope type lens, periscopic Camera can for example carry out three times optical focal length to obtain quality more image.Periscopic camera includes one turn of light member Part, conduction is to imaging sensor so that imaging sensor after turning turn light rays of the optical element for that will be incident in periscope type lens Obtain the image outside periscope type lens.However when colliding, the shell of periscopic camera may bend to It is come into contact in a large area with eyeglass and associated component, so that periscopic camera module can not focus.
Utility model content
In view of this, the application provides a kind of imaging modules, CCD camera assembly and electronic device.
The imaging modules of the application embodiment, comprising:
Shell;With
Reflecting element, imaging sensor, Lens assembly, motor element and the driving mechanism being arranged in the shell, For the motor element between the reflecting element and described image sensor, the Lens assembly is fixed on the movement member On part;
The shell has light inlet, and the reflecting element is for will turn to and pass through from the incident light of the light inlet incidence Described image sensor is reached after crossing the Lens assembly so that described image sensor senses the institute outside the imaging modules State incident light;
The driving mechanism is for driving the motor element to move along the optical axis of the Lens assembly so that the eyeglass Component is focused imaging in described image sensor;
The imaging modules further include the buffer structure being fixed between the shell and motor element, the buffer structure It is less than the shell in the size of width direction in the size of width direction.
The CCD camera assembly of the application embodiment includes that mould is imaged in the first imaging modules, the second imaging modules and third Group, first imaging modules are above-described imaging modules, and the field angle of the third imaging modules is greater than described first The field angle of imaging modules and the field angle for being less than second imaging modules.
The electronic device of the application embodiment includes ontology and sliding block, and the sliding block is used for being contained in It states intrinsic first position and is slided between the second position that the ontology exposes, is provided in the sliding block above The CCD camera assembly.
In the imaging modules of the application embodiment, CCD camera assembly and electronic device, by shell and motor element Between buffer structure is set, and buffer structure is less than shell in the size of width direction in the size of width direction, thus It when electronic device falls or collides, can be contacted by buffer structure between shell and motor element, prevent shell and fortune The contact area of dynamic interelement directly contacted or reduce shell and motor element, so that motor element is not easy the deformation because of shell And can not move causes imaging modules that can not focus.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the status diagram of the electronic device of the application embodiment;
Fig. 2 is another status diagram of the electronic device of the application embodiment;
Fig. 3 is the stereoscopic schematic diagram of the CCD camera assembly of the application embodiment;
Fig. 4 is the stereoscopic schematic diagram of the first imaging modules of the application embodiment;
Fig. 5 is the decomposition diagram of the first imaging modules of the application embodiment;
Fig. 6 is the diagrammatic cross-section of the first imaging modules of the application embodiment;
Fig. 7 is the partial cutaway schematic view of the first imaging modules of the application embodiment;
Fig. 8 (a) is the floor map of the first imaging modules of the application embodiment;
Fig. 8 (b) is the floor map of the first imaging modules of another embodiment of the application;
Fig. 9 is the stereoscopic schematic diagram of the reflecting element of the application embodiment;
Figure 10 is the light catoptric imaging schematic diagram of imaging modules in the related technology;
Figure 11 is the light catoptric imaging schematic diagram of the first imaging modules of the application embodiment;
Figure 12 (a) and Figure 12 (b) is the structural schematic diagram of imaging modules in the related technology;
Figure 13 (a) and Figure 13 (b) is the structural schematic diagram of the first imaging modules of the application embodiment;
Figure 14 is the diagrammatic cross-section of the second imaging modules of the application embodiment.
Main element symbol description:
Electronic device 1000, ontology 110, sliding block 200, gyroscope 120;
It is CCD camera assembly 100, the first imaging modules 20, shell 21, light inlet 211, groove 212, housing top 213, outer Shell side wall 214, avoid holes 215, reflecting element 22, incidence surface 222, shady face 224, incidence surface 226, light-emitting surface 228, mounting base 23, arcwall face 231, the first Lens assembly 24, eyeglass 241, motor element 25, motor element roof 251, motor element side wall 252, intermediate plate 222, the first imaging sensor 26, driving mechanism 27, driving device 28, arc-shaped guide rail 281, central axis 282, Chip circuit plate 201, interconnecting piece 2022, driving chip 202, sensor circuit board 203, shielding case 204, delays mounting portion 2011 Rush structure 205, the second imaging modules 30, the second Lens assembly 31, the second imaging sensor 32, third imaging modules 40, bracket 50。
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of It describes the application and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy Fixed orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.? In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected or can mutually communicate;It can be directly connected, it can also be by between intermediary It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
Individual camera gyroscope will be usually arranged, for detecting in existing optical anti-vibration method in imaging modules The shake of camera, meanwhile, it include the PCB circuit board of setting driving chip in imaging modules, in this way, causing with optical anti-vibration The sizes of imaging modules be greater than common imaging modules, and can not reduce.
Fig. 1 and Fig. 2 is please referred to, the electronic device 1000 of the application embodiment includes ontology 110 and sliding block 200. Sliding block 200 is used to slide in the first position being contained in ontology 110 and between the second position that ontology 110 exposes, CCD camera assembly 100 and gyroscope 120 are provided in sliding block 200, CCD camera assembly 100 and the separation of gyroscope 120 are set It sets.Electronic device 1000 can be used for controlling the work of CCD camera assembly 100 according to the feedback data of gyroscope 120 to realize that optics is anti- Tremble shooting.
In above-mentioned electronic device, CCD camera assembly 100 and gyroscope 120 are separately positioned, reduce CCD camera assembly 100 Interior device, so as to reduce the volume of CCD camera assembly 100.In addition, CCD camera assembly 100 and gyroscope 120 are respectively provided with In sliding block 200, so that gyroscope 120, relatively close to CCD camera assembly 100, gyroscope 120 can be detected accurately and be taken the photograph As the jitter conditions of head assembly 100, the anti-shake effect of CCD camera assembly 100 is improved.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communication Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 1.Specifically, electronic device 1000 can Think mobile phone or smart phone (for example, based on iPhone TM, the phone based on Android TM), portable game is set Standby (such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), Laptop computer, PDA, portable Internet appliance, music player and data storage device, other handheld devices and all Such as wrist-watch, In-Ear Headphones, pendant, headphone, electronic device 100 can also for other wearable devices (for example, Such as electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics tatoo, the wear-type of electronic equipment or smartwatch is set Standby (HMD)).
Electronic device 1000 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound Happy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, can Program remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant (PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play Device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 1000 can execute multiple functions and (for example, playing music, show video, storage Picture and send and receive call).If desired, electronic device 1000 can be such as cellular phone, media play The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
Gyroscope 120 is used as a kind of typical sensor, can be used for the axial line movement of detection electronic installation 1000, energy Measurement is made to the movement of rotation and deflection.For example, gyroscope 120 can detecte electronic device 1000 be vertically arranged or the shape of traverse State, and then display picture rotation can be controlled according to the detection data of acquisition by the central processing unit of electronic device 1000.
In the present embodiment, in imaging, CCD camera assembly is detected using the gyroscope 120 of electronic device 1000 100 fine jitters generated, the shake data that gyroscope 120 will test, such as caused by CCD camera assembly 100 is shaken Tilt angle, the offset generated by inclination are sent to the processing chip of electronic device 1000, and processing chip is for example, described below Driving chip.Handle chip according to the feedback data of the gyroscope 120 received control imaging modules in component relative to The component that CCD camera assembly 100 generates makes a relative move to realize stabilization.
It is appreciated that the gyroscope 120 of electronic device 1000 is arranged at the other positions other than CCD camera assembly 100, To save the space of setting independent gyroscope and driving chip in CCD camera assembly 100.In this way, CCD camera assembly 100 Size is close with common camera component, and realizes optical anti-vibration using the gyroscope of electronic device 1,000 120, anti-retaining The size of CCD camera assembly 100 is effectively reduced while trembling function.
Specifically, Fig. 1 and Fig. 2 is please referred to, ontology 110 further includes top end face 1002 and is disposed opposite to each other with top end face 1002 Bottom face 1003.In general, top end face 1002 and bottom face 1003 can extend along the width direction of ontology 110.Namely top end face 1002 and bottom face 1003 be electronic device 1000 short side.Bottom face 1003 be used for arrange electronic device 1000 connector, Microphone, loudspeaker etc..
Holding tank 1004 is offered on the top of ontology 110, holding tank 1004 is from the top of ontology 110 into ontology 110 Portion's recess.Holding tank 1004 can run through the side of ontology 110.Sliding block 200 slides in holding tank 1004 with ontology 110 Connection.In other words, sliding block 200 is slidably connected ontology 110, to stretch out or retract holding tank 1004.
Sliding block 200 includes top surface 2003, and when sliding block 200 is located at first position, top surface and top end face 1002 are big It causes concordant.Sliding block 200 can be connect with screw body, screw body sliding block 200 can be driven in first position and It is slided between the second position.
It is appreciated that CCD camera assembly 100 exposes outside ontology 110 when sliding block 200 stretches out holding tank 1004, this When, CCD camera assembly 100 can be with normal photographing.
Incorporated by reference to Fig. 3, CCD camera assembly 100 includes the first imaging modules 20, the second imaging modules 30, third imaging modules 40 and bracket 50.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged in bracket 50 and and bracket 50 are fixedly connected.Bracket 50 can reduce what the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 were subject to Impact improves the first imaging modules 20,40 service life of the second imaging modules 30 and third imaging modules.
In present embodiment, the field angle FOV3 of third imaging modules 40 is greater than the field angle FOV1 of the first imaging modules 20 And less than the field angle FOV2 of the second imaging modules 30, in other words, FOV1 < FOV3 < FOV2.In this way, different field angles Three imaging modules make CCD camera assembly 100 can satisfy the shooting demand under different scenes.
In one example, the field angle FOV1 of the first imaging modules 20 is 10-30 degree, the visual field of the second imaging modules 30 Angle FOV2 is 110-130 degree, and the field angle FOV3 of third imaging modules 40 is 80-110 degree.
For example, 20 field angle FOV1 of the first imaging modules be 10 degree, 12 degree, 15 degree, 20 degree, 26 degree or 30 degree angularly. Second imaging modules, 30 field angle FOV2 be 110 degree, 112 degree, 118 degree, 120 degree, 125 degree or 130 degree angularly.Third at As 40 field angle FOV3 of mould group be 80 degree, 85 degree, 90 degree, 100 degree, 105 degree or 110 degree angularly.
Since the field angle FOV1 of the first imaging modules 20 is smaller, it will be understood that the focal length of the first imaging modules 20 is larger, Therefore, the first imaging modules 20 can be used for shooting shooting distant view, to obtain distant view clearly image.Second imaging modules 30 Field angle FOV2 it is larger, it will be understood that the focal length of the second imaging modules 30 is shorter, and therefore, the second imaging modules 30 can be used In shooting close shot, to obtain the close up fragmentary image of object.Third imaging modules 40 can be used for normal photographing object.
In this way, passing through the combination of the first imaging modules 20, the second imaging modules 30 and third imaging modules 40, can obtain The image effects such as background blurring, picture part sharpening.
40 laid out in parallel of first imaging modules 20, the second imaging modules 30 and third imaging modules.In present embodiment, the One imaging modules 20, the second imaging modules 30 and third imaging modules 40 are arranged in "-" type.Further, the second imaging modules 30 between the first imaging modules 20 and third imaging modules 40.
Due to the field angle factor of the first imaging modules 20 and third imaging modules 40, in order to enable the first imaging modules 20 The preferable image of quality is obtained with third imaging modules 40, the first imaging modules 20 and third imaging modules 40 can be configured with light Anti-shake apparatus is learned, and optical anti-vibration device is typically arranged with more magnetic element, therefore, the first imaging modules 20 and third Imaging modules 40 can produce magnetic field.
In present embodiment, by the second imaging modules 30 between the first imaging modules 20 and third imaging modules 40, So that the first imaging modules 20 and third imaging modules 40 may be located remotely from, the magnetic field for preventing the first imaging modules 20 from being formed and third The magnetic field that imaging modules 40 are formed interferes with each other and influences the normal use of the first imaging modules 20 and third imaging modules 40.
In other embodiments, the first imaging modules 20, the second imaging modules 30 and third imaging modules 40 can arrange Column l-shaped.
First imaging modules 20, the second imaging modules 30 and third imaging modules 40 can be spaced setting, and adjacent two Imaging modules can also be abutted against each other together.
In the first imaging modules 20, the second imaging modules 30 and third imaging modules 30, any one imaging modules can Think black and white camera, RGB camera or infrared camera.
The processing chip of electronic device 1000 is used for according to the feedback data of the gyroscope 120 control first imaging The work of mould group 20 is to realize that optical anti-vibration is shot.
Please refer to Fig. 4-6, in present embodiment, the first imaging modules 20 include shell 21, reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25, the first imaging sensor 26 and driving mechanism 27.
Reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25 are arranged in shell 21.Reflective member Part 22 is arranged in mounting base 23, and the first Lens assembly 24 is fixed on motor element 25.Motor element 25 is arranged in the first figure As 26 side of sensor.Further, motor element 25 is located between reflecting element 22 and the first imaging sensor 26.
Driving mechanism 27 connects motor element 25 and shell 21.After incident light enters shell 21, by 22 turns of reflecting element To then through the first Lens assembly 24 the first imaging sensor 26 of arrival, so that the first imaging sensor 26 obtains outside Boundary's image.Driving mechanism 27 is for driving motor element 25 to move along the optical axis of the first Lens assembly 24.
Shell 21 is generally square shaped, and shell 21 has light inlet 211, and incident light enters the first imaging from light inlet 211 In mould group 20.That is, after reflecting element 22 is used to turn to from the incident incident light of light inlet 211 and through the first lens set The first imaging sensor 26 is reached after part 24 so that the first imaging sensor 26 senses the incidence outside the first imaging modules 20 Light.
It will therefore be appreciated that the first imaging modules 20 are periscope type lens mould group, compared to vertical lens module, periscopic The height of lens module is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical lens module refers to camera lens The optical axis of mould group is straight line, and in other words, incident light is conducted along the direction of a straight optical axis to the photoreceptor of lens module On part.
It is appreciated that light inlet 211 by through-hole 11 expose so that ambient after through-hole 11 from light inlet 211 Into in the first imaging modules 20.
Specifically, Fig. 5 please be join, shell 21 includes housing top 213 and side wall of outer shell 214.Side wall of outer shell 214 is from shell top The side 2131 of wall 213 extends to form.Housing top 213 includes two opposite sides 2131, the quantity of side wall of outer shell 214 It is two, 214 self-corresponding sides 2131 of each side wall of outer shell extend, and in other words, side wall of outer shell 214 is separately connected outer The opposite two sides of shell roof 213.Light inlet 211 is formed in housing top 213.
Reflecting element 22 is prism or plane mirror.In one example, when reflecting element 22 is prism, prism can be Triangular prism, the section of prism are right angled triangle, wherein light is incident from one of right-angle side in right angled triangle, To which another right-angle side is emitted after the reflection of bevel edge.It is appreciated that certainly, incident light can go out after refraction by prism It penetrates, and without reflection.Prism can be made of relatively good materials of translucency such as glass, plastics.In an embodiment In, it can be in reflectorized materials such as one of surface silver coatings of prism to reflect incident light.
It is appreciated that the reflection of generation incident light is realized that incident light is turned to by plane mirror when reflecting element 22 is plane mirror.
More, Fig. 6 and Fig. 9 are please referred to, reflecting element 22 has incidence surface 222, shady face 224,226 and of reflective surface Light-emitting surface 228.Incidence surface 222 close to and towards light inlet 211.Shady face 224 far from light inlet 211 and with 222 phase of incidence surface Back.Reflective surface 226 connects incidence surface 222 and shady face 224.Light-emitting surface 228 connects incidence surface 222 and shady face 224.It is reflective Face 226 is obliquely installed relative to incidence surface 222.Light-emitting surface 228 is disposed opposite to each other with reflective surface 226.
Specifically, light passes through light inlet 211 and enters reflecting element 22 by incidence surface 222 in the conversion process of light In, then via the reflection of reflective surface 226, reflecting element 22 finally is reflected from light-emitting surface 228, the process of light conversion is completed, and Shady face 224 and mounting base 23 are fixedly installed, so that reflecting element 22 is keeping stablizing.
As shown in Figure 10, in the related art, due to the needs of reflection incident ray, the reflective surface of reflecting element 22a 226a is tilted relative to horizontal direction, and reflecting element 22a is unsymmetric structure, thus reflective member on the reflection direction of light The lower section of part 22a is smaller with respect to the practical optical area above reflecting element 22a, it can be understood as, the part far from light inlet Reflective surface 226a is less or can not reflection light.
Therefore, Figure 11 please be join, the reflecting element 22 of the application embodiment is relative to reflecting element 22a in the related technology The corner angle far from light inlet have been cut off, have not only been also reduced anti-without the effect of the reflection light of influence reflecting element 22 in this way The integral thickness of optical element 22.
Referring to Fig. 6, in some embodiments, reflective surface 226 is tilted relative to the angle [alpha] of incidence surface 222 in 45 degree.
In this way, incident light is made preferably to reflect and convert, has preferable light conversion effect.
Reflecting element 22 can be made of relatively good materials of translucency such as glass, plastics.In one embodiment, It can be in reflectorized materials such as one of surface silver coatings of reflecting element 22 to reflect incident light.
In some embodiments, incidence surface 222 is arranged in parallel with shady face 224.
In this way, 22 held stationary of reflecting element, incidence surface can be made when shady face 224 and mounting base 23 are fixedly installed 222 are also rendered as plane, and incident light makes the conversion of light in the optical path of the conversion process also formation rule of reflecting element 22 Efficiency is preferable.Specifically, the section of reflecting element 22 is substantially trapezoidal along the light direction that enters of light inlet 211, it is in other words, reflective The substantially trapezoidal body of element 22.
In some embodiments, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.
In this way, more regular reflecting element 22 can be formed, keep the optical path of incident ray more straight, improves turning for light Change efficiency.
In some embodiments, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.
Specifically, the distance between incidence surface 222 and shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..Or It says, the distance range of incidence surface 222 and shady face 224 is it is to be understood that the height of reflecting element 22 is 4.8-5.0mm.More than It is moderate that the incidence surface 222 of distance range and shady face 224 are formed by 22 volume of reflecting element, can preferably suit into the first one-tenth The first imaging modules 20, CCD camera assembly 100 and electronic device 1000 as in mould group 20, forming more compact property and miniaturization, Meet the more demands of consumer.
In some embodiments, incidence surface 222, shady face 224, reflective surface 226 and the equal cure process shape of light-emitting surface 228 At there is hardened layer.
When reflecting element 22 is made of materials such as glass, the material of reflecting element 22 itself is more crisp, in order to improve reflective member The intensity of part 22 can be hardened in incidence surface 222, shady face 224, reflective surface 226 and the light-emitting surface 228 to reflecting element 22 Processing, more, can do cure process to all surface of reflecting element, to further increase the intensity of reflecting element.Hardening Processing such as penetrate into lithium ion, do not influence reflecting element 22 convert light under the premise of to above each film on surface.
In one example, the angle turned to from the incident incident light of light inlet 211 is 90 degree by reflecting element 22.Example Such as, incidence angle of the incident light on the surface of emission of reflecting element 22 is 45 degree, and angle of reflection is also 45 degree.Certainly, reflecting element 22 By incident light turn to angle can also be other angles, for example, 80 degree, 100 degree etc., as long as being reached after incident light capable of being turned to First imaging sensor 26.
In present embodiment, the quantity of reflecting element 22 is one, at this point, incident light reaches first after once turning to Imaging sensor 26.In other embodiments, the quantity of reflecting element 22 is multiple, at this point, incident light is by least twice The first imaging sensor 26 is reached after steering.
Mounting base 23 is for installing reflecting element 22, and in other words, mounting base 23 is the carrier of reflecting element 22, reflecting element 22 are fixed in mounting base 23.Make the position of reflecting element 22 in this way it was determined that being conducive to the reflection of reflecting element 22 or folding Penetrate incident light.Reflecting element 22 can use viscose glue to be adhesively fixed in mounting base 23 to realize and be fixedly connected with mounting base 23.
It please join referring again to Fig. 5, in one example, mounting base 23 is movable to be arranged in shell 21,23 energy of mounting base It is enough to rotate relative to shell 21 to adjust the direction that reflecting element 22 turns to incident light.
Mounting base 23 can drive reflecting element 22 to rotate together towards the opposite direction of the shake of the first imaging modules 20, from And the incident deviation of the incident light of light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in motor element 25, and further, the first Lens assembly 24 is arranged in reflective member Between part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26 On.The first imaging sensor 26 is allowed to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when moving integrally along its optical axis on the first imaging sensor 26, thus real Existing first imaging modules 20 focusing.First Lens assembly 24 includes multiple eyeglasses 241, when at least one eyeglass 241 is mobile, the The whole focal length of one Lens assembly 24 changes, so that the function of 20 zoom of the first imaging modules is realized, more, by driving mechanism 27 driving motor elements 25 move in shell 21 to reach zoom purpose.
In the example of fig. 6, in some embodiments, motor element 25 is cylindrical in shape, more in the first Lens assembly 24 A eyeglass 241 is fixed in motor element 25 along the axially spaced-apart of motor element 25.In other examples, motor element 25 is wrapped Two intermediate plates 252 are included, eyeglass 241 is folded between two intermediate plates 252 by two intermediate plates 252.
It is appreciated that since motor element 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required motor element 25 Very little larger, motor element 25 can have the shape of more certain cavity for cylindrical shape, square tube shape etc., and such motor element 25 is in cylinder Multiple eyeglasses 241 can be preferably arranged in dress, and can preferably protect eyeglass 241 in being not susceptible to, eyeglass 241 in cavity It shakes.
In addition, multiple eyeglasses 241 are held between two intermediate plates 252 by motor element 25, both had certain stability, The weight of motor element 25 can also be reduced, power needed for driving mechanism 27 drives motor element 25 can be reduced, and move The design difficulty of element 25 is relatively low, and eyeglass 241 is also easier to be set on motor element 25.
Certainly, motor element 25 is not limited to tubular and two intermediate plates 252 mentioned above, in other implementations, Motor element 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this way More simple structure;Or has cavity for cuboid, round etc. to accommodate the various regular or irregular of eyeglass 241 Shape.Under the premise of guaranteeing 10 normal imaging of imaging modules and operation, specific choice.
First imaging sensor 26 can use complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) it is photosensitive Element.
In some embodiments, driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy driving Mechanism.
It specifically, include magnetic field and conductor in electromagnetic drive mechanism, if magnetic field in the conductor can relative to conductor motion Induced current is generated, induced current makes effect of the conductor by Ampere force, and Ampere force makes conductor motion, and conductor herein is The part for driving motor element 25 mobile in electromagnetic drive mechanism;Drive mechanism, the inverse piezoelectricity based on piezoceramic material Effect: if applying voltage to piezoelectric material, mechanical stress is generated, i.e., is changed between electric energy and mechanical energy, control is passed through Make its mechanically deform generate rotation or linear motion, have the advantages that structure simply, low speed.
Characteristic of the driving of memorial alloy driving mechanism based on marmem: marmem is a kind of special Alloy, once it is made to have remembered any shape, even if being deformed, but when being heated to a certain proper temperature, it can restore Shape before to deformation achievees the purpose that driving with this, has the characteristics that displacement is rapid, direction is free.
Referring to Fig. 6, further, the first imaging modules 20 further include driving device 28, and driving device 28 is used for Mounting base 23 of the driving with reflecting element 22 is rotated around pivot center 29.Driving device 28 for drive installation seat 23 along turn The axial movement of shaft line 29.Pivot center 29 is perpendicular to the optical axis of light inlet 211 and the photosensitive side of the first imaging sensor 26 To so that the first imaging modules 20 realize the optical anti-vibration in the optical axis of light inlet 211 and the axial direction of pivot center 29.
In this way, 28 drive installation seat 23 of driving device is two sides since the volume of reflecting element 22 is smaller compared with lens barrel It moves upwards, the first imaging modules 20 not only may be implemented in the optical anti-vibration effect of both direction, it is also possible that the first one-tenth As the small volume of mould group 20.
It please join Fig. 5-Fig. 6, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to short transverse It is defined as Y-direction, length direction is defined as Z-direction.As a result, the optical axis of light inlet 211 be Y-direction, the first imaging sensor 26 it is photosensitive Direction is Z-direction, the axial direction of pivot center 29 be X to.
The rotation of 28 drive installation seat 23 of driving device so that reflecting element 22 around X to rotation so that the first imaging mould Group 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along pivot center 29, So that the first imaging modules 20 realize effect of the X to optical anti-vibration.In addition, the first Lens assembly 24 can along Z-direction with Realize that the first Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, around X to when rotation, the light that reflecting element 22 reflects moves reflecting element 22 in Y-direction, so that First imaging sensor 26 forms different images in Y-direction to realize the anti-shake effect of Y-direction.Reflecting element 22 is along X to shifting When dynamic, the light that reflecting element 22 reflects is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in X Image with realize X to anti-shake effect.
In some embodiments, driving device 28 is formed with arc-shaped guide rail 281, and driving device 28 is used for drive installation seat 23 along arc-shaped guide rail 281 around arc-shaped guide rail 281 central axis 282 rotation and along central axis 282 axial movement, in Mandrel line 2282 is overlapped with pivot center 29.
It is appreciated that driving device 28 is used for drive installation seat 23 along arc-shaped guide rail 281 around the center of arc-shaped guide rail 281 The rotation of axis 282 and the axial movement along central axis 282.
In this way, since driving device 28 drives the mounting base 23 with reflecting element 22 by the way of arc-shaped guide rail 281 It rotates together, so that friction is small between driving device 28 and mounting base 23, is conducive to 23 stability of rotation of mounting base, improve The optical anti-vibration effects of first imaging modules 20.
Specifically, Figure 12 (a) and 12 (b) please be join, in the related art, mounting base (not shown) and shaft 23a rotation connect It connects, mounting base is rotated around shaft 23a to drive reflecting element 22a to rotate together.It is assumed that frictional force is f1, shaft 23a radius For R1, thrust F1, radius of gyration R1.So friction-torque and thrust torque ratio K1 are K1=f1R1/F1A1.By Fine rotation is only needed in reflecting element 22a, therefore F1 cannot be excessive;And imaging modules itself need light and short to lead to reflective member Part 22a size cannot be too big, and the space that becomes larger of A is also limited, can not further eliminate so as to cause the influence of frictional force.
It please join Figure 13 (a) and Figure 13 (b), and in the application, mounting base 23 is rotated along arc-shaped guide rail 281, arc-shaped guide rail 281 radius is R2.At this point, the ratio K2 of friction-torque and rotational torque be K2=f2R2/F2A, f2, R2, F2 not In the case where significantling change, due to being rotated using the swing mode of rail mounted, corresponding thrust torque becomes R2, and R2 can not be limited by 22 size of reflecting element, or even accomplish the several times of R1 or more.Therefore in this case, frictional force is to anti- The size of K2 (reduce) can be greatly reduced in the influence that optical element 22 rotates, so as to improve the rotation precision of reflecting element 22, So that the optical anti-vibration effect of the first imaging modules 20 is preferable.
It please join Fig. 6, in some embodiments, mounting base 23 includes arcwall face 231, arcwall face 231 and arc-shaped guide rail 281 are arranged concentrically and cooperate with arc-shaped guide rail 281.In other words, the center of arcwall face 231 is overlapped with the center of arc-shaped guide rail 281. Cooperate mounting base 23 with driving device 28 more compact.
In some embodiments, central axis 282 is located at outside the first imaging modules 20.In this way, arc-shaped guide rail 281 Radius R2 is larger, can reduce the adverse effect that frictional force rotates mounting base 23 in this way.
In some embodiments, driving device 28 is located at the bottom of shell 21.In other words, driving device 28 and shell 21 It is structure as a whole.In this way, the structure of the first imaging modules 20 is more compact.
In some embodiments, the drive installation seat 23 by way of electromagnetism of driving device 28 rotates.In an example In, driving device 28 is provided with coil, is fixed with electromagnetic plate in mounting base 23, and after coil energization, coil can produce magnetic field To drive electromagnetic plate to move, so that mounting base 23 and reflecting element be driven to rotate together.
Certainly, in other embodiments, driving device 28 can by way of Piezoelectric Driving or memorial alloy driving Mode drive installation seat 23 move.The mode of Piezoelectric Driving and memory alloy driven mode please join foregoing description, herein not It repeats again.
Referring to Fig. 4-Fig. 8 (b), the first imaging modules 20 further include buffer structure 205, and buffer structure 205 is fixed Between shell 21 and motor element 25, buffer structure 205 is less than shell 21 in the ruler of width direction in the size of width direction It is very little.
It is to be appreciated that deformation occurs for housing top 213 when the first imaging modules 20 collide, to motor element 25 Recess, the deformation quantity of middle section are greater than the deformation quantity of two sides.When deformation occurs, housing top 213 and setting are in shell 21 It is contacted with the buffer structure 205 of 25 gap of motor element, the area for the middle section that deformation occurs reduces, and deformation quantity also becomes It is small, in this way, the contact directly contacted or reduce shell 21 with motor element 25 between shell 21 and motor element 25 can be prevented Area causes the first imaging modules 20 that can not focus so that motor element 25 is not easy not moving because of the deformation of shell 21.
Buffer structure 205 the size of width direction can be shell 21 width direction size 1/5.In this way, slow One layer of plate structure will not be formed since width dimensions are excessive to cause to buffer when deformation occurs in shell 21 by rushing structure 205 Structure 205 and 25 contact area of motor element are excessive and block motor element, will not due to undersized and to no effect.
It should be noted that buffer structure 205 is only to schematically illustrate in the dimension scale of width direction with shell 21.
In the present embodiment, shell 21 includes housing top 213 and side wall of outer shell 214, and motor element 25 is cylindrical in shape simultaneously Including motor element roof 251 and motor element side wall 252, motor element roof 251 and housing top 213 are opposite, movement member Part side wall 252 and side wall of outer shell 214 are opposite.
Gap is formed between motor element roof 251 and housing top 214, buffer structure 205 is fixed in gap, buffering knot Structure 205 is less than gap in the size of short transverse in the size of short transverse, in this way, preventing buffer structure 205 from blocking movement member Part 25 and cause move 25 elements can not move.
It should be understood that 21 pairs of shell are arranged in internal element and play the role of supporting protection, motor element 25 is driven The driving of motivation structure 27 can be moved along the optical axis of the first Lens assembly 24.Therefore, between motor element 25 and shell 21 there are Prior to motor element 25 and shell 21 after gap, buffer structure 205 are arranged in gap location, and deformation occurs in housing top 213 Be in contact, can prevent it is excessive with 251 roof contact area of motor element roof after 213 deformation of housing top and by motor element 25 block and cause motor element 25 that can not move.
In some embodiments, buffer structure 205 includes bulge-structure, and bulge-structure and shell 21 are integrally formed, and Protrusion is formed from 213 orientation movements element roof 251 of housing top.
Specifically, bulge-structure can be stamped and formed out by housing top 213, in this way, technique is relatively simple.Certainly, at it In his embodiment, bulge-structure can also molding seperated with housing top 213, and be fixed on by the modes such as being bonded or welded On housing top 213.
In the present embodiment, bulge-structure includes two, and two bulge-structures are symmetrically formed in 213 edge of housing top At the both sides of the edge of length direction.
Bulge-structure is formed in the two sides of housing top 213, forms symmetrical structure, when deformation occurs for housing top 213, Using closer two bulge-structure of relative distance as endpoint, deformation quantity can be effectively reduced, to reduce housing top 213 and movement The contact area of element roof 251.In this way, motor element 25 is made to be not easy not moving because of the deformation of shell 21 and lead to first Imaging modules 20 can not focus.
In some embodiments, buffer structure 205 include bulge-structure, bulge-structure and the one of motor element 25 at Type, and autokinesis element roof 251 forms protrusion towards housing top 213.
Specifically, bulge-structure can be formed by 25 integrated injection molding of motor element, in this way, technique is relatively simple.Certainly, exist In other embodiments, bulge-structure seperated with motor element 25 can also be formed, and be fixed on movement by modes such as bondings On element roof 251.
In the present embodiment, bulge-structure includes two, and two bulge-structures are symmetrically formed in 213 edge of housing top At the both sides of the edge of length direction.
Bulge-structure is formed in the two sides of motor element roof 251, forms symmetrical structure, when shape occurs for housing top 213 When change, housing top 213 is first in contact with two bulge-structures, and two bulge-structures reduce housing top 213 as two supporting points Deformation quantity, to reduce the contact area of housing top 213 Yu motor element roof 251.In this way, being not easy motor element 25 Can not move because of the deformation of shell causes the first imaging modules 20 that can not focus.
In some embodiments, the first imaging modules 20 further include chip circuit plate 201 and driving chip 202, chip Circuit board 201 is fixed on the side of driving mechanism 27, and driving chip 202 is fixed on chip circuit plate 201 and 27 phase of driving mechanism The one side of back, driving chip 202 are electrically connected by chip circuit plate 201 and the first imaging sensor 26.
In this way, driving chip 202 is fixed on the side of driving mechanism 27 by chip circuit plate 201, and pass through chip Circuit board 201 and the first imaging sensor 26 are electrically connected, so that the structure between driving chip 202 and driving mechanism 27 It is more compact, advantageously reduce the volume of the first imaging modules 20.
Specifically, driving chip 10 is used to control the light that driving mechanism 27 drives motor element 25 along the first Lens assembly 24 Axis is mobile, the imaging so that the first Lens assembly 24 is focused on the first imaging sensor 26.Driving chip 10 is used for according to Mounting base 23 of the feedback data control driving of driving device 28 with reflecting element 22 of gyroscope 120 is around 29 turns of pivot center It is dynamic.Driving chip 10 be also used to according to the feedback data of the gyroscope 120 control 28 drive installation seat 23 of driving device along turn The axial movement of shaft line 29.
Driving chip 10 is also used to control 28 drive installation seat 23 of driving device according to the feedback data of the gyroscope 120 Along arc-shaped guide rail 281 around the rotation of central axis 282 of arc-shaped guide rail 281 and along the axial movement of central axis 282.
In some embodiments, the first imaging modules 20 include sensor circuit board 203, the first imaging sensor 26 It is fixed on sensor circuit board 203, chip circuit plate 201 includes mounting portion 2011 and interconnecting piece 2022, and mounting portion 2011 is fixed In the side of driving mechanism 27, driving chip 202 is fixed on mounting portion 2011, and interconnecting piece 2022 connects mounting portion 2011 and passes Sensor circuit board 203.
In this way, driving chip 202 can be electrically connected by sensor circuit board 203 and the first imaging sensor 26.Tool Body, interconnecting piece 2022 can be fixedly connected with sensor circuit board 203 by welding.
In one example, when assembling the first imaging modules 20, driving chip 202 first can be fixed on chip circuit On plate 201, then the chip circuit plate 201 with driving chip 202 is connected by welding with sensor circuit board 203 It connects, the chip circuit plate 201 with driving chip 202 is finally fixed on to the side of driving mechanism 27.
Chip circuit plate 201 can be fixedly connected by the modes such as welding, being bonded with driving mechanism 27.
It should be pointed out that the side that chip circuit plate 201 is fixed on driving mechanism 27 can refer to chip circuit plate 201 Fixation is contacted with the side of driving mechanism 27, can also refer to that chip circuit plate 201 passes through the side of other elements and driving mechanism 27 Face is fixedly connected.
In present embodiment, mounting portion 2011 is rigid circuit board, and interconnecting piece 2022 is flexible circuit board, mounting portion 2011 It is fitted in the side of driving mechanism 27.
In this way, mounting portion 2011 is that rigid circuit board makes mounting portion 2011 have preferable rigidity, it is unlikely to deform, favorably It is fixedly connected in mounting portion 2011 with the side of driving mechanism 27.Mounting portion 2011 can be fitted in driving by way of bonding The side of mechanism 27.In addition, interconnecting piece 2022 is that flexible circuit board is easily deformed chip circuit plate 201, so that chip is electric Road plate 201 is easily mounted on the side of driving mechanism 27.
Certainly, in other embodiments, mounting portion 2011 or flexible circuit board.
In some embodiments, shell 21 is formed with avoid holes 215, and driving chip 202 is at least partially disposed at avoid holes In 215, to be exposed to shell 21.Make between driving chip 202 and shell 21 in this way, driving chip 202 wears shell 21 There are the parts of overlapping, so that the structure between driving chip 202 and shell 21 is more compact, can further decrease The volume of one imaging modules 20.
It is appreciated that 202 part of driving chip is located at when having gap between the side of driving mechanism 27 and shell 21 In avoid holes 215.
Preferably, the shape of avoid holes 215, size respectively with the shape of driving chip 202, dimensional fits.For example, evacuation The size in hole 215 is slightly larger than the size of driving chip 202, and the shape of avoid holes 215 is identical as the shape of driving chip 202.
In present embodiment, avoid holes 215 are formed in the side wall of outer shell 214 of shell 21.It is appreciated that avoid holes 215 are passed through Wear the interior outside of side wall of outer shell 214.Certainly, in other embodiments, avoid holes 215 can also be formed in the outer of shell 21 Shell roof 213.
In one embodiment, the first imaging modules 20 further include shielding case 204, and shielding case 204 is fixed on chip electricity Road plate 201 and it is provide with driving chip 202.In this way, shielding case 204 can protect driving chip 202, prevent driving chip 202 by To physical impact.In addition, shielding case 204 can also reduce the electromagnetic effect that driving chip 202 is subject to.
Shielding case 204 can be made of metal material.For example, the material of shielding case 204 is stainless steel.Present embodiment In, chip circuit plate 201 is fixed on mounting portion 2011, at this point, mounting portion 2011 is preferably rigid circuit board or is flexible electrical Plate of the road plate in conjunction with stiffening plate.
Please refer to Figure 14, in present embodiment, the second imaging modules 30 are vertical lens module, certainly, in other implementations In mode, the second imaging modules 30 can also be with periscope type lens mould group.
Second imaging modules 30 include the second Lens assembly 31 and the second imaging sensor 32, and the second Lens assembly 31 is used for Light is imaged on the second imaging sensor 32, the light of the incident light axis of the second imaging modules 30 and the second Lens assembly 31 Overlapping of axles.
In present embodiment, the second imaging modules 30 can be tight shot mould group, therefore, the mirror of the second Lens assembly 31 Piece 241 is less, so that 30 height of the second imaging modules is lower, is conducive to the thickness for reducing electronic device 1000.
The type of second imaging sensor 32 can be as the type of the first imaging sensor 26, and details are not described herein.
The structure of third imaging modules 40 is similar with the structure of the second imaging modules 30, for example, third imaging modules 40 For vertical lens module.Therefore, the feature of third imaging modules 40 please refers to the feature of the second imaging modules 40, herein not superfluous It states.
To sum up, the first imaging modules 20 include shell 21, reflecting element 22, the first Lens assembly 24, motor element 25, First imaging sensor 26 and driving mechanism 27.Reflecting element 22, the first Lens assembly 24, motor element 25, the first image pass Sensor 26 and driving mechanism 27 are arranged in shell 21.Motor element 25 is located at reflecting element 22 and the first imaging sensor Between 26.First Lens assembly 24 is fixed on motor element 25.
Shell 21 has light inlet 211.After reflecting element 22 is used to turn to from the incident incident light of light inlet 211 and pass through The first imaging sensor 26 is reached after first Lens assembly 24 so that the first imaging sensor 26 senses outside the first imaging modules 20 The incident light in portion.
First imaging modules 20 further include buffer structure 205, and buffer structure 205 is fixed on shell 21 and motor element 25 Between, buffer structure 205 is less than shell 21 in the size of width direction in the size of width direction.
In the imaging modules of the application, by the way that buffer structure, and buffer structure are arranged between shell and motor element It is less than shell in the size of width direction in the size of width direction, thus when electronic device falls or collides, shell Can be contacted by buffer structure between motor element, prevent between shell and motor element directly contact or reduce shell and The contact area of motor element causes imaging modules right so that motor element is not easy not moving because of the deformation of shell It is burnt.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that: These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principle and objective of the application and become Type, scope of the present application are defined by the claims and their equivalents.

Claims (15)

1. a kind of imaging modules characterized by comprising
Shell;With
Reflecting element, imaging sensor, Lens assembly, motor element and the driving mechanism being arranged in the shell, it is described For motor element between the reflecting element and described image sensor, the Lens assembly is fixed on the motor element On;
The shell has light inlet, and the reflecting element from the incident light of the light inlet incidence for will turn to and pass through institute Reach described image sensor after stating Lens assembly so that described image sensor sense outside the imaging modules it is described enter Penetrate light;
The driving mechanism is for driving the motor element to move along the optical axis of the Lens assembly so that the Lens assembly It focuses and is imaged in described image sensor;
The imaging modules further include the buffer structure being fixed between the shell and motor element, and the buffer structure is in width The size for spending direction is less than the shell in the size of width direction.
2. imaging modules as described in claim 1, which is characterized in that the shell includes housing top and side wall of outer shell, institute It states motor element to be cylindrical in shape and including motor element roof and motor element side wall, multiple eyeglasses in the Lens assembly are along institute The axially spaced-apart for stating motor element is fixed in the motor element, is formed between the motor element roof and the housing top Gap, the buffer structure are fixed in the gap.
3. imaging modules as claimed in claim 2, which is characterized in that the buffer structure includes bulge-structure, the protrusion Structure and the shell are integrally formed, and form protrusion from the housing top towards the motor element roof.
4. imaging modules as claimed in claim 3, which is characterized in that the bulge-structure includes two, described two protrusions Symmetrical configuration is formed at the both sides of the edge of the housing top along its length.
5. imaging modules as claimed in claim 2, which is characterized in that the buffer structure includes bulge-structure, the protrusion Structure and the motor element are integrally formed, and form the protrusion from the motor element roof towards the housing top.
6. imaging modules as claimed in claim 5, which is characterized in that the bulge-structure includes two, described two protrusions Symmetrical configuration is formed at the both sides of the edge of the motor element roof along its length.
7. imaging modules as claimed in claim 2, which is characterized in that the buffer structure is less than institute in the size of short transverse Gap is stated in the size of short transverse.
8. a kind of CCD camera assembly, which is characterized in that including the first imaging modules, the second imaging modules and third imaging modules, First imaging modules are the described in any item imaging modules of claim 1-7, and the field angle of the third imaging modules is big Field angle in first imaging modules and the field angle less than second imaging modules.
9. CCD camera assembly as claimed in claim 8, which is characterized in that first imaging modules, the second imaging mould In "-" type arrangement, second imaging modules are located at first imaging modules and described for group and the third imaging modules Between three imaging modules.
10. a kind of electronic device characterized by comprising
Ontology;
Sliding block, the sliding block are used in for being contained in the intrinsic first position and exposing from the ontology It is slided between two positions, CCD camera assembly described in claim 8 or 9 is provided in the sliding block.
11. electronic device as claimed in claim 10, which is characterized in that gyroscope is provided in the sliding block, it is described CCD camera assembly and the gyroscope are separately positioned;The imaging modules further include driving chip;
The driving chip is used to control the CCD camera assembly work according to the feedback data of the gyroscope to realize optics Stabilization shooting, the driving chip are used to control the first imaging modules work according to the feedback data of the gyroscope with reality Existing optical anti-vibration shooting.
12. electronic device as claimed in claim 11, which is characterized in that first imaging modules further include mounting base and drive Dynamic device, the reflecting element are fixed in the mounting base, and the driving chip is used for the feedback coefficient according to the gyroscope Drive the mounting base with the reflecting element around pivot axis according to the driving device is controlled, to realize described Optical anti-vibration on the optical axis direction of light inlet, optical axis of the pivot center perpendicular to the light inlet.
13. electronic device as claimed in claim 12, which is characterized in that the driving device is formed with arc-shaped guide rail, described Driving chip is used to control the driving device for driving the mounting base along institute according to the feedback data of the gyroscope Arc-shaped guide rail is stated around the center axis thereof of the arc-shaped guide rail, the central axis is overlapped with the pivot center.
14. electronic device as claimed in claim 13, which is characterized in that the driving chip is for controlling the driving device Drive the mounting base along the axial movement of the central axis, so that first imaging modules realize the central axis Optical anti-vibration on direction.
15. electronic device as claimed in claim 13, which is characterized in that the mounting base includes concentric with the arc-shaped guide rail The arcwall face for being arranged and cooperating with the arc-shaped guide rail.
CN201821821704.5U 2018-11-06 2018-11-06 Imaging modules, CCD camera assembly and electronic device Active CN209105287U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109218590A (en) * 2018-11-06 2019-01-15 Oppo广东移动通信有限公司 Imaging modules, CCD camera assembly and electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109218590A (en) * 2018-11-06 2019-01-15 Oppo广东移动通信有限公司 Imaging modules, CCD camera assembly and electronic device
CN109218590B (en) * 2018-11-06 2024-04-16 Oppo广东移动通信有限公司 Imaging module, camera assembly and electronic device

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