CN109218590B

CN109218590B - Imaging module, camera assembly and electronic device

Info

Publication number: CN109218590B
Application number: CN201811311120.8A
Authority: CN
Inventors: 张弓
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-11-06
Filing date: 2018-11-06
Publication date: 2024-04-16
Anticipated expiration: 2038-11-06
Also published as: CN109218590A

Abstract

The application provides an imaging module, a camera assembly and an electronic device. The imaging module comprises a shell; the lens assembly is fixed on the moving element; the imaging module further includes a buffer structure fixed between the housing and the moving member, the buffer structure having a smaller dimension in the width direction than the housing. This application is through setting up buffer structure between shell and moving element to buffer structure is less than the shell in width direction's size, thereby when electronic device takes place to fall or collide, can prevent direct contact between shell and the moving element or reduce the area of contact of shell and moving element between shell and the moving element through buffer structure contact between shell and the moving element, make the moving element be difficult for unable removal because of the deformation of shell and lead to imaging module unable focusing.

Description

Imaging module, camera assembly and electronic device

Technical Field

The application relates to the field of electronic devices, in particular to an imaging module, a camera assembly and an electronic device.

Background

In the related art, in order to improve the photographing effect of a mobile phone, a periscope lens is adopted by a camera of the mobile phone, and the periscope lens can perform three times of optical focal length to obtain images with higher quality. The periscope type camera comprises a light conversion element, wherein the light conversion element is used for converting light rays incident into the periscope type lens and then transmitting the converted light rays to the image sensor so that the image sensor can acquire images outside the periscope type lens. However, in the event of a collision, the housing of the periscope camera may bend and contact the lens and related components over a large area, so that the periscope camera module cannot focus.

Disclosure of Invention

In view of the above, the present application provides an imaging module, a camera module and an electronic device.

The imaging module of this application embodiment includes:

a housing; and

the lens assembly is fixed on the moving element;

the shell is provided with a light inlet, and the reflecting element is used for turning incident light entering from the light inlet and transmitting the incident light to the image sensor after passing through the lens component so that the image sensor senses the incident light outside the imaging module;

The driving mechanism is used for driving the moving element to move along the optical axis of the lens assembly so as to enable the lens assembly to focus and image on the image sensor;

the imaging module further comprises a buffer structure fixed between the housing and the moving element, wherein the dimension of the buffer structure in the width direction is smaller than that of the housing in the width direction.

The camera module of this application embodiment includes first imaging module, second imaging module and third imaging module, first imaging module is above imaging module, third imaging module's angle of view is greater than first imaging module's angle of view and is less than second imaging module's angle of view.

The electronic device of the embodiment of the application comprises a body and a sliding module, wherein the sliding module is used for sliding between a first position accommodated in the body and a second position exposed from the body, and the camera assembly is arranged in the sliding module.

In imaging module, camera subassembly and the electron device of this embodiment, through set up buffer structure between shell and moving element to buffer structure's size is less than the shell in width direction's size, thereby when electron device takes place to fall or collide, can prevent direct contact between shell and the moving element or reduce the area of contact of shell and moving element between shell and the moving element through buffer structure contact between shell and the moving element, make the moving element be difficult for removing because of the deformation of shell and lead to imaging module unable focusing.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

fig. 1 is a schematic state diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is another state diagram of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic perspective view of a camera assembly according to an embodiment of the present application;

fig. 4 is a schematic perspective view of a first imaging module according to an embodiment of the present application;

FIG. 5 is an exploded view of a first imaging module according to an embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of a first imaging module according to an embodiment of the present application;

FIG. 7 is a schematic partial cross-sectional view of a first imaging module according to an embodiment of the present application;

fig. 8 (a) is a schematic plan view of a first imaging module according to an embodiment of the present application;

fig. 8 (b) is a schematic plan view of a first imaging module according to another embodiment of the present application;

FIG. 9 is a schematic perspective view of a retroreflective element according to an embodiment of the present application;

FIG. 10 is a schematic diagram of a light reflection imaging of an imaging module in the related art;

FIG. 11 is a schematic diagram of a light reflection imaging of a first imaging module according to an embodiment of the present application;

FIG. 12 is a schematic diagram of an imaging module in the related art;

fig. 13 is a schematic structural diagram of a first imaging module according to an embodiment of the present application;

fig. 14 is a schematic cross-sectional view of a second imaging module according to an embodiment of the present application.

Description of main reference numerals:

electronic device 1000, body 110, sliding module 200, gyroscope 120;

the camera assembly 100, the first imaging module 20, the housing 21, the light inlet 211, the groove 212, the housing top wall 213, the housing side wall 214, the avoidance hole 215, the reflective element 22, the light inlet surface 222, the backlight surface 224, the light inlet surface 226, the light outlet surface 228, the mounting base 23, the arc surface 231, the first lens assembly 24, the lens 241, the moving element 25, the moving element top wall 251, the moving element side wall 252, the clip 222, the first image sensor 26, the driving mechanism 27, the driving device 28, the arc guide 281, the central axis 282, the chip circuit board 201, the mounting portion 2011, the connection portion 2022, the driving chip 202, the sensor circuit board 203, the shielding cover 204, the buffer structure 205, the second imaging module 30, the second lens assembly 31, the second image sensor 32, the third imaging module 40, and the bracket 50.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.

The existing optical anti-shake method is generally to set an independent camera gyroscope in an imaging module for detecting shake of a camera, and meanwhile, the imaging module comprises a PCB circuit board provided with a driving chip, so that the size of the imaging module with optical anti-shake is larger than that of an ordinary imaging module and cannot be reduced.

Referring to fig. 1 and 2, an electronic device 1000 according to an embodiment of the disclosure includes a body 110 and a sliding module 200. The sliding module 200 is configured to slide between a first position accommodated in the body 110 and a second position exposed from the body 110, and the camera module 100 and the gyroscope 120 are disposed in the sliding module 200, and the camera module 100 and the gyroscope 120 are separately disposed. The electronic device 1000 may be used to control the camera assembly 100 to operate according to the feedback data of the gyroscope 120 to achieve optical anti-shake shooting.

In the above electronic device, the camera assembly 100 is separated from the gyroscope 120, so that devices in the camera assembly 100 are reduced, and the volume of the camera assembly 100 can be reduced. In addition, the camera module 100 and the gyroscope 120 are both disposed in the sliding module 200, so that the gyroscope 120 is relatively close to the camera module 100, and the gyroscope 120 can accurately detect the shake condition of the camera module 100, thereby improving the anti-shake effect of the camera module 100.

By way of example, the electronic apparatus 1000 may be any of various types of computer system devices that are mobile or portable and that perform wireless communications (only one form of which is shown by way of example in FIG. 1). In particular, the electronic apparatus 1000 may be a mobile phone or a smart phone (e.g., an iPhone-based (TM) -based phone), a Portable game device (e.g., nintendo DS (TM) -based phone, playStation Portable (TM) -Gameboy Advance TM, iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, in-ear headphones, pendants, headsets, etc., and the electronic apparatus 100 may also be other wearable devices (e.g., head-mounted devices (HMDs) such as e-glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).

The electronic apparatus 1000 may also be any of a number of electronic devices including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbooks, personal Digital Assistants (PDAs), portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer 3 (MP 3) players, portable medical devices, and digital cameras, and combinations thereof.

In some cases, the electronic device 1000 may perform a variety of functions (e.g., playing music, displaying video, storing pictures, and receiving and sending phone calls). If desired, the electronic apparatus 1000 may be a portable device such as a cellular telephone, media player, other handheld device, wristwatch device, pendant device, earpiece device, or other compact portable device.

Gyroscope 120, as a typical sensor, may be used to detect linear motion in the axial direction of electronic device 1000, and may be used to measure rotational and yaw motion. For example, the gyroscope 120 may detect a vertical or horizontal state of the electronic device 1000, and then the cpu of the electronic device 1000 may control the rotation of the display screen according to the acquired detection data.

In the present embodiment, the gyroscope 120 of the electronic device 1000 is used to detect the minute shake generated by the camera module 100 during imaging, and the gyroscope 120 transmits the detected shake data, such as the tilt angle due to the shake of the camera module 100, and the offset generated by the tilt to the processing chip of the electronic device 1000, such as the driving chip described below. The processing chip controls the components in the imaging module to move relatively to the components generated by the camera module 100 according to the received feedback data of the gyroscope 120, so as to realize anti-shake.

It can be appreciated that the gyroscopes 120 of the electronic device 1000 are all disposed at other positions outside the camera assembly 100, thereby saving space in the camera assembly 100 for providing independent gyroscopes and driving chips. In this way, the size of the camera module 100 is similar to that of a common camera module, and the gyroscope 120 of the electronic device 1000 can be used to realize optical anti-shake, so that the size of the camera module 100 is effectively reduced while the anti-shake function is maintained.

Specifically, referring to fig. 1 and 2, the body 110 further includes a top end surface 1002 and a bottom end surface 1003 disposed opposite to the top end surface 1002. In general terms, the process of the present invention, the top end face 1002 and the bottom end face 1003 may extend in the width direction of the body 110. I.e. the top 1002 and bottom 1003 surfaces are short sides of the electronic device 1000. The bottom end surface 1003 is used to arrange a connector, microphone, speaker, etc. of the electronic device 1000.

The top of the body 110 is provided with a receiving groove 1004, and the receiving groove 1004 is recessed from the top of the body 110 to the inside of the body 110. The receiving groove 1004 may be penetrated the side of the body 110. The sliding module 200 is slidably connected to the body 110 in the accommodating groove 1004. In other words, the sliding module 200 slides the connection body 110 to extend or retract the receiving groove 1004.

The slide module 200 includes a top surface 2003 that is substantially flush with the top surface 1002 when the slide module 200 is in the first position. The sliding module 200 may be coupled to a screw mechanism that may drive the sliding module 200 to slide between a first position and a second position.

It can be appreciated that when the sliding module 200 extends out of the accommodating groove 1004, the camera module 100 is exposed outside the body 110, and at this time, the camera module 100 can shoot normally.

Referring to fig. 3, the camera module 100 includes a first imaging module 20, a second imaging module 30, a third imaging module 40 and a bracket 50.

The first imaging module 20, the second imaging module 30 and the third imaging module 40 are all disposed in the bracket 50 and fixedly connected with the bracket 50. The bracket 50 can reduce the impact of the first, second and third imaging modules 20, 30 and 40 and increase the life of the first, second and third imaging modules 20, 30 and 40.

In the present embodiment, the field angle FOV3 of the third imaging module 40 is greater than the field angle FOV1 of the first imaging module 20 and less than the field angle FOV2 of the second imaging module 30, that is, FOV1 < FOV3 < FOV2. Thus, the three imaging modules with different angles of view enable the camera assembly 100 to meet shooting requirements in different scenes.

In one example, the FOV1 of the first imaging module 20 is 10-30 degrees, the FOV2 of the second imaging module 30 is 110-130 degrees, and the FOV3 of the third imaging module 40 is 80-110 degrees.

For example, the first imaging module 20 has a field angle FOV1 of 10 degrees, 12 degrees, 15 degrees, 20 degrees, 26 degrees, or 30 degrees. The field angle FOV2 of the second imaging module 30 is 110 degrees, 112 degrees, 118 degrees, 120 degrees, 125 degrees, or 130 degrees. The third imaging module 40 has a field angle FOV3 of 80 degrees, 85 degrees, 90 degrees, 100 degrees, 105 degrees, or 110 degrees.

Since the field angle FOV1 of the first imaging module 20 is smaller, it can be understood that the focal length of the first imaging module 20 is larger, and thus the first imaging module 20 can be used for shooting long-range scenes, so as to obtain images with clear long-range scenes. The field angle FOV2 of the second imaging module 30 is larger, and it will be appreciated that the focal length of the second imaging module 30 is shorter, and therefore, the second imaging module 30 may be used to capture close-up images to obtain a partial close-up image of the object. The third imaging module 40 may be used to normally photograph an object.

In this way, by combining the first imaging module 20, the second imaging module 30 and the third imaging module 40, image effects such as background blurring and local sharpening of the picture can be obtained.

The first imaging module 20, the second imaging module 30 and the third imaging module 40 are arranged in parallel. In this embodiment, the first imaging module 20, the second imaging module 30 and the third imaging module 40 are arranged in a straight line. Further, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40.

Because of the view angle factors of the first imaging module 20 and the third imaging module 40, in order to make the first imaging module 20 and the third imaging module 40 obtain images with better quality, the first imaging module 20 and the third imaging module 40 may be configured with an optical anti-shake device, and the optical anti-shake device is generally configured with more magnetic elements, so that the first imaging module 20 and the third imaging module 40 may generate magnetic fields.

In this embodiment, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40, so that the first imaging module 20 and the third imaging module 40 can be far away, and the interference between the magnetic field formed by the first imaging module 20 and the magnetic field formed by the third imaging module 40 is prevented from affecting the normal use of the first imaging module 20 and the third imaging module 40.

In other embodiments, the first, second and third imaging modules 20, 30 and 40 may be arranged in an L-shape.

The first imaging module 20, the second imaging module 30 and the third imaging module 40 may be disposed at intervals, and two adjacent imaging modules may also abut against each other.

Any one of the first, second and third imaging modules 20, 30 and 30 may be a black and white camera, an RGB camera or an infrared camera.

The processing chip of the electronic device 1000 is configured to control the first imaging module 20 to work according to the feedback data of the gyroscope 120 so as to implement optical anti-shake shooting.

Referring to fig. 4-6, in the present embodiment, the first imaging module 20 includes a housing 21, a reflective element 22, a mounting base 23, a first lens assembly 24, a moving element 25, a first image sensor 26, and a driving mechanism 27.

The reflective element 22, mount 23, first lens assembly 24, and moving element 25 are all disposed within the housing 21. The reflective element 22 is arranged on the mount 23 and the first lens assembly 24 is fixed to the moving element 25. The moving element 25 is provided on the first image sensor 26 side. Further, the moving element 25 is located between the reflective element 22 and the first image sensor 26.

The driving mechanism 27 connects the moving element 25 with the housing 21. After entering the housing 21, the incident light is diverted through the reflective element 22 and then transmitted through the first lens assembly 24 to the first image sensor 26, such that the first image sensor 26 obtains an ambient image. The drive mechanism 27 is used to drive the movement element 25 along the optical axis of the first lens assembly 24.

The housing 21 is substantially square, and the housing 21 has an optical inlet 211, and incident light enters the first imaging module 20 from the optical inlet 211. That is, the reflective element 22 is configured to redirect the incident light entering from the light inlet 211 and transmit the incident light to the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 senses the incident light outside the first imaging module 20.

It can be appreciated that the first imaging module 20 is a periscope type lens module, and the periscope type lens module has a smaller height than the vertical type lens module, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module refers to that the optical axis of the lens module is a straight line, or that the incident light is conducted to the photosensitive device of the lens module along the direction of the optical axis of the straight line.

It can be appreciated that the light inlet 211 is exposed through the through hole 11, so that the external light enters the first imaging module 20 from the light inlet 211 after passing through the through hole 11.

Specifically, referring to fig. 5, the housing 21 includes a housing top wall 213 and a housing side wall 214. The housing side walls 214 are formed extending from the side edges 2131 of the housing top wall 213. The housing top wall 213 includes two opposite sides 2131 and the number of housing side walls 214 is two, each housing side wall 214 extending from a corresponding one of the sides 2131 or the housing side walls 214 respectively connect the opposite sides of the housing top wall 213. Light inlet 211 is formed at the housing top wall 213.

The light reflecting element 22 is a prism or a plane mirror. In one example, when the reflective element 22 is a prism, the prism may be a triangular prism, and the cross-section of the prism is a right triangle, where light is incident from one of the right triangle sides, reflected by the hypotenuse, and exits from the other right triangle side. It will be appreciated that of course, incident light may exit after refraction by the prism without reflection. The prism can be made of materials with good light transmittance such as glass, plastic and the like. In one embodiment, a reflective material such as silver may be coated on one of the surfaces of the prism to reflect incident light.

It will be appreciated that when the reflective element 22 is a flat mirror, the flat mirror reflects incident light to effect the turning of the incident light.

Further, referring to fig. 6 and 9, the reflective element 22 has a light incident surface 222, a backlight surface 224, a reflective surface 226 and a light emergent surface 228. The light incident surface 222 is close to and faces the light inlet 211. The backlight surface 224 is far away from the light inlet 211 and is opposite to the light inlet surface 222. The reflective surface 226 is connected to the light incident surface 222 and the backlight surface 224. The light-emitting surface 228 is connected to the light-entering surface 222 and the backlight surface 224. The reflective surface 226 is disposed obliquely with respect to the light incident surface 222. The light-emitting surface 228 is disposed opposite to the light-reflecting surface 226.

Specifically, in the light conversion process, the light passes through the light inlet 211 and enters the reflective element 22 from the light inlet 222, then is reflected by the reflective surface 226, and finally is reflected from the light outlet 228 to the reflective element 22, so as to complete the light conversion process, and the backlight surface 224 is fixedly arranged with the mounting seat 23, so that the reflective element 22 is kept stable.

As shown in fig. 10, in the related art, due to the need to reflect the incident light, the reflective surface 226a of the reflective element 22a is inclined with respect to the horizontal direction, and the reflective element 22a is of an asymmetric structure in the reflective direction of the light, so the actual optical area below the reflective element 22a is smaller than above the reflective element 22a, and it can be understood that the portion of the reflective surface 226a away from the light inlet is less or unable to reflect the light.

Therefore, referring to fig. 11, the reflecting element 22 according to the embodiment of the present application has the edges and corners away from the light inlet cut away from the reflecting element 22a in the related art, so that the effect of reflecting light by the reflecting element 22 is not affected, and the overall thickness of the reflecting element 22 is reduced.

Referring to fig. 6, in some embodiments, the reflective surface 226 is inclined at 45 degrees with respect to the incident surface 222.

Therefore, the incident light rays are reflected and converted better, and the light ray conversion effect is better.

The reflecting element 22 can be made of glass, plastic or other materials with good light transmission. In one embodiment, one of the surfaces of the reflective element 22 may be coated with a reflective material such as silver to reflect incident light.

In some embodiments, the light incident surface 222 is disposed parallel to the backlight surface 224.

Thus, when the backlight surface 224 and the mounting seat 23 are fixedly arranged, the light reflecting element 22 can be kept stable, the light incident surface 222 is also in a plane, and the incident light forms a regular light path in the conversion process of the light reflecting element 22, so that the conversion efficiency of the light is better. Specifically, the cross section of the reflecting element 22 is substantially trapezoidal along the light incident direction of the light inlet 211, or the reflecting element 22 is substantially trapezoidal.

In some embodiments, the light-in surface 222 and the backlight surface 224 are both perpendicular to the light-out surface 228.

Thus, the regular reflecting element 22 can be formed, so that the light path of the incident light is straight, and the conversion efficiency of the light is improved.

In some embodiments, the distance between the light incident surface 222 and the backlight surface 224 is in the range of 4.8-5.0mm.

Specifically, the distance between the light incident surface 222 and the backlight surface 224 may be 4.85mm, 4.9mm, 4.95mm, etc. Alternatively, the distance between the light incident surface 222 and the backlight surface 224 can be understood as the height of the reflective element 22 is 4.8-5.0mm. The reflective element 22 formed by the light incident surface 222 and the backlight surface 224 within the above distance range has a moderate volume, and can be better combined into the first imaging module 20, so as to form a more compact and miniaturized first imaging module 20, the camera assembly 100 and the electronic device 1000, thereby meeting more demands of consumers.

In some embodiments, the light incident surface 222, the backlight surface 224, the light reflecting surface 226 and the light emergent surface 228 are all hardened to form a hardened layer.

When the light reflecting element 22 is made of glass, the light reflecting element 22 is brittle, so that the light incident surface 222, the backlight surface 224, the light reflecting surface 226 and the light emergent surface 228 of the light reflecting element 22 can be hardened for improving the strength of the light reflecting element 22. The hardening treatment such as lithium ion penetration, lamination of the above surfaces without affecting the light conversion of the light reflecting element 22, and the like.

In one example, the reflective element 22 diverts incident light incident from the light inlet 211 by an angle of 90 degrees. For example, the incident angle of the incident light on the emitting surface of the reflecting element 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the reflective element 22 deflects the incident light may be other angles, such as 80 degrees, 100 degrees, etc., as long as the incident light is deflected and reaches the first image sensor 26.

In the present embodiment, the number of reflective elements 22 is one, and at this time, the incident light is diverted once and then transmitted to the first image sensor 26. In other embodiments, the number of reflective elements 22 is multiple, at which time the incident light is diverted at least twice and passed to the first image sensor 26.

The mounting base 23 is used for mounting the reflecting element 22, or the mounting base 23 is a carrier of the reflecting element 22, and the reflecting element 22 is fixed on the mounting base 23. This allows the position of the retroreflective elements 22 to be determined, which is advantageous for the retroreflective elements 22 to reflect or refract incident light. The reflective element 22 may be fixed to the mounting base 23 by adhesive bonding to achieve a fixed connection with the mounting base 23.

Referring again to fig. 5, in one example, the mounting base 23 is movably disposed in the housing 21, and the mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the reflective element 22 deflects the incident light.

The mounting base 23 can drive the reflective element 22 to rotate along with the reflective element toward the opposite direction of the shake of the first imaging module 20, so as to compensate the incident deviation of the incident light of the light inlet 211, and achieve the optical anti-shake effect.

The first lens assembly 24 is housed within the motion element 25, and further, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light onto the first image sensor 26. This allows the first image sensor 26 to obtain a better quality image.

The first lens assembly 24, when moved entirely along its optical axis, can be imaged onto the first image sensor 26 to effect focusing of the first imaging module 20. The first lens assembly 24 includes a plurality of lenses 241, and when at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, thereby achieving the zooming function of the first imaging module 20, and further, the driving mechanism 27 drives the moving element 25 to move in the housing 21 for zooming purposes.

In the example of fig. 6, in certain embodiments, the motion element 25 is cylindrical and the plurality of lenses 241 in the first lens assembly 24 are secured within the motion element 25 at axial intervals along the motion element 25. In other examples, the motion element 25 includes two clips 252, the two clips 252 sandwiching the lens 241 between the two clips 252.

It can be appreciated that, since the moving element 25 is used for fixedly disposing a plurality of lenses 241, the length of the moving element 25 is larger, the moving element 25 can be cylindrical, square, etc. with a shape having a certain cavity, so that the moving element 25 is cylindrical and can better dispose a plurality of lenses 241, and can better protect the lenses 241 in the cavity, so that the lenses 241 are not easy to shake.

In addition, the moving element 25 clamps the plurality of lenses 241 between the two clamping pieces 252, which not only has a certain stability, but also can reduce the weight of the moving element 25, the power required by the driving mechanism 27 to drive the moving element 25 can be reduced, the design difficulty of the moving element 25 is also lower, and the lens 241 is also easier to be arranged on the moving element 25.

Of course, the moving element 25 is not limited to the cylindrical shape and two clips 252, and in other embodiments, the moving element 25 may comprise three, four, etc. more clips 252 to form a more stable structure, or a simpler structure such as a single clip 252; or a rectangular body, a round body, etc. having a cavity to accommodate various regular or irregular shapes of the lens 241. The specific selection is performed on the premise of ensuring the normal imaging and operation of the imaging module 10.

The first image sensor 26 may employ a complementary metal oxide semiconductor (CMOS, complementary Metal Oxide Semiconductor) photosensitive element or a Charge-coupled Device (CCD) photosensitive element.

In certain embodiments, the drive mechanism 27 is an electromagnetic drive mechanism, a piezoelectric drive mechanism, or a memory alloy drive mechanism.

Specifically, the electromagnetic driving mechanism comprises a magnetic field and a conductor, if the magnetic field moves relative to the conductor, induced current is generated in the conductor, the induced current enables the conductor to be acted by ampere force, the ampere force enables the conductor to move, and the conductor is a part of the electromagnetic driving mechanism which drives the moving element 25 to move; the piezoelectric driving mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if voltage is applied to the piezoelectric material, mechanical stress is generated, namely, electric energy and mechanical energy are converted, and rotation or linear motion is generated by controlling mechanical deformation of the piezoelectric material, so that the piezoelectric material has the advantages of simple structure and low speed.

The actuation of the memory alloy actuation mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy, once it is made to memorize any shape, even if it is deformed, it can be restored to its original shape when heated to a proper temp. so as to attain the goal of driving.

Referring to fig. 6 again, further, the first imaging module 20 further includes a driving device 28, and the driving device 28 is used for driving the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29. The driving device 28 is used for driving the mounting seat 23 to axially move along the rotation axis 29. The rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the photosensitive direction of the first image sensor 26, so that the first imaging module 20 realizes optical anti-shake on the optical axis of the light inlet 211 and the axial direction of the rotation axis 29.

In this way, since the volume of the reflective element 22 is smaller than that of the lens barrel, the driving device 28 drives the mounting seat 23 to move in two directions, so that not only the optical anti-shake effect of the first imaging module 20 in two directions can be achieved, but also the volume of the first imaging module 20 can be made smaller.

Referring to fig. 5 to 6, for convenience of description, the width direction of the first imaging module 20 is defined as the X direction, the height direction is defined as the Y direction, and the length direction is defined as the Z direction. Thus, the optical axis of the light inlet 211 is in the Y direction, the light receiving direction of the first image sensor 26 is in the Z direction, and the axial direction of the rotation axis 29 is in the X direction.

The driving device 28 drives the mounting seat 23 to rotate, so that the reflecting element 22 rotates around the X direction, and the first imaging module 20 realizes the Y-direction optical anti-shake effect. In addition, the driving device 28 drives the mounting base 23 to move along the axial direction of the rotation axis 29, so that the first imaging module 20 achieves the effect of X-direction optical anti-shake. Additionally, the first lens assembly 24 may be along the Z-direction to achieve focusing of the first lens assembly 24 on the first image sensor 26.

Specifically, when the reflective element 22 rotates around the X-direction, the light reflected by the reflective element 22 moves in the Y-direction, so that the first image sensor 26 forms a different image in the Y-direction to achieve the anti-shake effect in the Y-direction. When the reflective element 22 moves along the X-direction, the light reflected by the reflective element 22 moves in the X-direction, so that the first image sensor 26 forms different images in the X-direction to achieve the anti-shake effect in the X-direction.

In some embodiments, the driving device 28 is formed with an arc-shaped guide rail 281, and the driving device 28 is used for driving the mounting seat 23 to rotate along the arc-shaped guide rail 281 around a central axis 282 of the arc-shaped guide rail 281 and axially move along the central axis 282, and the central axis 2282 coincides with the rotation axis 29.

It will be appreciated that the driving device 28 is used to drive the mounting base 23 to rotate along the curved guide 281 about the central axis 282 of the curved guide 281 and to move axially along the central axis 282.

In this way, the driving device 28 drives the mounting seat 23 with the reflective element 22 to rotate together by adopting the arc-shaped guide rail 281, so that the friction between the driving device 28 and the mounting seat 23 is small, which is beneficial to the stable rotation of the mounting seat 23 and improves the optical anti-shake effect of the first imaging module 20.

Specifically, referring to fig. 12, in the related art, a mounting base (not shown) is rotatably connected to the rotating shaft 23a, and the mounting base rotates around the rotating shaft 23a to drive the reflective element 22a to rotate together. Assuming that the friction force is F1, the radius of the rotating shaft 23a is R1, the thrust force is F1, and the rotation radius is R1. The friction torque to thrust torque ratio K1 is k1=f1r1/F1 A1. Since the reflecting element 22a only needs to be slightly rotated, F1 cannot be excessively large; the imaging module itself needs to be thin and small, so that the size of the reflective element 22a cannot be too large, and the enlarged space of a is limited, so that the influence of friction force cannot be further eliminated.

Referring to fig. 13, in this application, the mounting seat 23 rotates along an arc-shaped guide 281, and the radius of the arc-shaped guide 281 is R2. At this time, the ratio K2 of the friction torque to the rotation torque is k2=f2r2/f2a, and when F2, R2, and F2 are not changed significantly, the corresponding thrust torque becomes R2 due to the rotation in the orbital swing manner, and R2 may not be limited by the size of the reflective element 22, and may even be several times or more than R1. Therefore, in this case, the influence of the friction force on the rotation of the reflective element 22 can be greatly reduced (the size of K2 is reduced), so as to improve the rotation accuracy of the reflective element 22, and make the optical anti-shake effect of the first imaging module 20 better.

Referring to fig. 6, in some embodiments, the mounting block 23 includes an arcuate surface 231, the arcuate surface 231 being disposed concentric with the arcuate rail 281 and cooperating with the arcuate rail 281. Alternatively, the center of the arcuate surface 231 coincides with the center of the arcuate guide rail 281. This results in a more compact mating of the mounting block 23 with the drive 28.

In some embodiments, the central axis 282 is located outside the first imaging module 20. In this way, the radius R2 of the arc-shaped guide rail 281 is larger, so that the adverse effect of friction force on the rotation of the mounting seat 23 can be reduced.

In some embodiments, the drive 28 is located at the bottom of the housing 21. Alternatively, the drive means 28 is integrally formed with the housing 21. In this way, the structure of the first imaging module 20 is more compact.

In some embodiments, the drive 28 drives the mount 23 in rotation electromagnetically. In one example, the driving device 28 is provided with a coil, the mounting seat 23 is fixed with an electromagnetic sheet, and after the coil is electrified, the coil can generate a magnetic field to drive the electromagnetic sheet to move, so as to drive the mounting seat 23 and the reflecting element to rotate together.

Of course, in other embodiments, the driving device 28 may drive the mount 23 to move by piezoelectric driving or memory alloy driving. The piezoelectric driving method and the memory alloy driving method are referred to the above description, and will not be repeated here.

Referring to fig. 4-8 (b), the first imaging module 20 further includes a buffer structure 205, the buffer structure 205 is fixed between the housing 21 and the moving element 25, and a dimension of the buffer structure 205 in a width direction is smaller than a dimension of the housing 21 in the width direction.

It will be appreciated that, when the first imaging module 20 collides, the top wall 213 of the housing deforms, so as to be recessed toward the moving member 25, and the deformation amount of the middle portion is larger than that of the two sides. When deformation occurs, the top wall 213 of the housing contacts with the buffer structure 205 disposed at the gap between the housing 21 and the moving element 25, the area of the deformed middle portion is reduced, and the deformation amount is also reduced, so that direct contact between the housing 21 and the moving element 25 can be prevented or the contact area between the housing 21 and the moving element 25 is reduced, so that the moving element 25 is not easy to move due to deformation of the housing 21, and the first imaging module 20 cannot focus.

The dimension of the buffer structure 205 in the width direction may be 1/5 of the dimension of the housing 21 in the width direction. In this way, the buffer structure 205 does not form a plate-like structure due to the excessively large width dimension, which results in an excessively large contact area of the buffer structure 205 with the moving element 25 to seize the moving element when the housing 21 is deformed, nor is it ineffective due to the excessively small size.

The dimensional ratio of the buffer structure 205 to the housing 21 in the width direction is only schematically illustrated.

In the present embodiment, the housing 21 includes a housing top wall 213 and a housing side wall 214, and the moving member 25 is cylindrical and includes a moving member top wall 251 and a moving member side wall 252, the moving member top wall 251 being opposite the housing top wall 213, and the moving member side wall 252 being opposite the housing side wall 214.

A gap is formed between the moving element top wall 251 and the housing top wall 214, and the buffer structure 205 is fixed in the gap, and the dimension of the buffer structure 205 in the height direction is smaller than that of the gap in the height direction, so that the buffer structure 205 is prevented from clamping the moving element 25 and making the moving element 25 unable to move.

It will be appreciated that the housing 21 provides a supportive protection for the internally disposed components, and that the movement element 25 is driven by the drive mechanism 27 to move along the optical axis of the first lens assembly 24. Therefore, a gap is left between the moving element 25 and the housing 21, and the buffer structure 205 is disposed at the gap, and contacts the moving element 25 before the moving element 25 and the housing 21 after the housing top wall 213 is deformed, so as to prevent the moving element 25 from being blocked due to an excessively large contact area between the housing top wall 213 and the moving element top wall 251 after the housing top wall 213 is deformed.

In some embodiments, cushioning structure 205 includes a raised structure integrally formed with housing 21 and raised from housing top wall 213 toward moving element top wall 251.

Specifically, the raised structures may be stamped and formed from the housing top wall 213, and thus, the process is relatively simple. Of course, in other embodiments, the protruding structure may be formed separately from the housing top wall 213 and fixed to the housing top wall 213 by bonding or welding.

In the present embodiment, the protruding structures include two protruding structures symmetrically formed at both side edges of the housing top wall 213 in the length direction.

The protruding structures are formed on two sides of the top wall 213 of the housing to form a symmetrical structure, when the top wall 213 of the housing is deformed, the two protruding structures with relatively close distances are used as endpoints, so that the deformation amount can be effectively reduced, and the contact area between the top wall 213 of the housing and the top wall 251 of the moving element is reduced. In this way, the moving element 25 is not easy to move due to the deformation of the housing 21, so that the first imaging module 20 cannot focus.

In some embodiments, cushioning structure 205 includes a raised structure, integrally formed with motive element 25, and forms a projection from the moving member top wall 251 toward the housing top wall 213.

In particular, the protruding structure may be integrally injection-molded from the moving element 25, so that the process is relatively simple. Of course, in other embodiments, the projection structure may be formed separately from the moving element 25 and fixed to the moving element top wall 251 by bonding or the like.

The protruding structures are formed on both sides of the top wall 251 of the moving element, forming a symmetrical structure, when the top wall 213 of the housing is deformed, the top wall 213 of the housing is contacted with the two protruding structures first, the two raised structures act as two support points to reduce the amount of deformation of the housing top wall 213, thereby reducing the contact area of the housing top wall 213 with the moving element top wall 251. In this way, the moving element 25 is not easy to move due to the deformation of the housing, so that the first imaging module 20 cannot focus.

In some embodiments, the first imaging module 20 further includes a chip circuit board 201 and a driving chip 202, the chip circuit board 201 is fixed on a side of the driving mechanism 27, the driving chip 202 is fixed on a surface of the chip circuit board 201 opposite to the driving mechanism 27, and the driving chip 202 is electrically connected to the first image sensor 26 through the chip circuit board 201.

In this way, the driving chip 202 is fixed on the side of the driving mechanism 27 through the chip circuit board 201, and is electrically connected with the first image sensor 26 through the chip circuit board 201, this makes the structure between the driving chip 202 and the driving mechanism 27 more compact, which is beneficial to reducing the volume of the first imaging module 20.

Specifically, the driving chip 10 is used for controlling the driving mechanism 27 to drive the motion element 25 to move along the optical axis of the first lens assembly 24, so that the first lens assembly 24 focuses and images on the first image sensor 26. The driving chip 10 is used for controlling the driving device 28 to drive the mounting seat 23 with the reflecting element 22 to rotate around the rotation axis 29 according to the feedback data of the gyroscope 120. The driving chip 10 is further used for controlling the driving device 28 to drive the mounting seat 23 to move along the axial direction of the rotation axis 29 according to the feedback data of the gyroscope 120.

The driving chip 10 is further used for controlling the driving device 28 to drive the mounting seat 23 to rotate along the arc-shaped guide rail 281 around the central axis 282 of the arc-shaped guide rail 281 and to move along the axial direction of the central axis 282 according to the feedback data of the gyroscope 120.

In some embodiments, the first imaging module 20 includes a sensor circuit board 203, the first image sensor 26 is fixed on the sensor circuit board 203, the chip circuit board 201 includes a mounting portion 2011 and a connecting portion 2022, the mounting portion 2011 is fixed on a side surface of the driving mechanism 27, the driving chip 202 is fixed on the mounting portion 2011, and the connecting portion 2022 connects the mounting portion 2011 and the sensor circuit board 203.

In this way, the driving chip 202 may be electrically connected to the first image sensor 26 through the sensor circuit board 203. Specifically, the connection portion 2022 may be fixedly connected to the sensor circuit board 203 by means of soldering.

In one example, when the first imaging module 20 is assembled, the driving chip 202 may be fixed on the chip circuit board 201, then the chip circuit board 201 with the driving chip 202 and the sensor circuit board 203 are connected by soldering, and finally the chip circuit board 201 with the driving chip 202 is fixed on the side of the driving mechanism 27.

The chip circuit board 201 may be fixedly connected to the driving mechanism 27 by soldering, bonding, or the like.

It should be noted that, the fixing of the chip circuit board 201 to the side of the driving mechanism 27 may refer to the fixing of the chip circuit board 201 to the side of the driving mechanism 27, or may refer to the fixing of the chip circuit board 201 to the side of the driving mechanism 27 through other components.

In the present embodiment, the mounting portion 2011 is a rigid circuit board, the connecting portion 2022 is a flexible circuit board, and the mounting portion 2011 is attached to a side surface of the driving mechanism 27.

In this way, the mounting portion 2011 is a rigid circuit board, so that the mounting portion 2011 has better rigidity, is not easy to deform, and is beneficial to the side fixed connection of the mounting portion 2011 and the driving mechanism 27. The mounting portion 2011 may be bonded to a side surface of the driving mechanism 27 by adhesion. In addition, the connection portion 2022 is a flexible circuit board so that the chip circuit board 201 is easily deformed, so that the chip circuit board 201 is easily mounted on the side of the driving mechanism 27.

Of course, in other embodiments, the mounting portion 2011 may be a flexible circuit board.

In some embodiments, housing 21 is formed with relief holes 215, and driver chip 202 is at least partially positioned in relief holes 215 so as to be exposed to housing 21. In this way, the driving chip 202 penetrates the housing 21, so that an overlapping portion exists between the driving chip 202 and the housing 21, so that the structure between the driving chip 202 and the housing 21 is more compact, and the volume of the first imaging module 20 can be further reduced.

It will be appreciated that when there is a gap between the side of the drive mechanism 27 and the housing 21, the drive chip 202 is partially located in the relief hole 215.

Preferably, the shape and size of the relief hole 215 are matched with the shape and size of the driving chip 202, respectively. For example, the size of the escape hole 215 is slightly larger than the size of the driving chip 202, and the shape of the escape hole 215 is the same as the shape of the driving chip 202.

In the present embodiment, the escape hole 215 is formed in the housing side wall 214 of the housing 21. It will be appreciated that the relief holes 215 extend through the inner and outer sides of the housing sidewall 214. Of course, in other embodiments, the relief holes 215 may also be formed in the housing top wall 213 of the housing 21.

In one embodiment, the first imaging module 20 further includes a shielding case 204, where the shielding case 204 is fixed on the chip circuit board 201 and houses the driving chip 202. In this manner, the shield 204 may protect the driver chip 202 from physical shock to the driver chip 202. In addition, the shield 204 may also reduce electromagnetic effects experienced by the driver chip 202.

The shield 204 may be made of a metallic material. For example, the material of the shield 204 is stainless steel. In the present embodiment, the chip circuit board 201 is fixed to the mounting portion 2011, and in this case, the mounting portion 2011 is preferably a rigid circuit board or a board formed by combining a flexible circuit board and a reinforcing plate.

Referring to fig. 14, in the present embodiment, the second imaging module 30 is a vertical lens module, however, in other embodiments, the second imaging module 30 may be a periscope lens module.

The second imaging module 30 includes a second lens assembly 31 and a second image sensor 32, the second lens assembly 31 is configured to image light on the second image sensor 32, and an incident optical axis of the second imaging module 30 coincides with an optical axis of the second lens assembly 31.

In this embodiment, the second imaging module 30 may be a fixed focus lens module, so that the second lens assembly 31 has fewer lenses 241, so that the second imaging module 30 has a lower height, which is beneficial to reducing the thickness of the electronic device 1000.

The type of the second image sensor 32 may be the same as the type of the first image sensor 26, and will not be described again.

The third imaging module 40 has a similar structure to the second imaging module 30, for example, the third imaging module 40 is also a vertical lens module. Therefore, the features of the third imaging module 40 refer to the features of the second imaging module 40, and are not described herein.

In summary, the first imaging module 20 includes a housing 21, a reflective element 22, a first lens assembly 24, a motion element 25, a first image sensor 26, and a drive mechanism 27. The retroreflective element 22, the first lens assembly 24, the moving element 25, the first image sensor 26 and the drive mechanism 27 are all disposed within the housing 21. The moving element 25 is located between the light reflecting element 22 and the first image sensor 26. The first lens assembly 24 is fixed to the moving element 25.

The housing 21 has a light inlet 211. The reflective element 22 is used for turning the incident light from the light inlet 211 and passing the incident light to the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 senses the incident light outside the first imaging module 20.

The first imaging module 20 further includes a buffer structure 205, the buffer structure 205 is fixed between the housing 21 and the moving element 25, and a dimension of the buffer structure 205 in the width direction is smaller than a dimension of the housing 21 in the width direction.

In the imaging module of this application, through set up buffer structure between shell and moving element to buffer structure is less than the shell in width direction's size, thereby when electronic device takes place to fall or collide, can contact through buffer structure between shell and the moving element, prevent direct contact between shell and the moving element or reduce the area of contact of shell and moving element, make the moving element be difficult for can't remove because of the deformation of shell and lead to imaging module unable focusing.

In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An imaging module, comprising:

a housing; and

the lens assembly is fixed on the moving element; the reflecting element is a prism or a plane mirror;

The shell is provided with a light inlet, and the reflecting element is used for turning incident light entering from the light inlet and transmitting the incident light to the image sensor after passing through the lens component so that the image sensor senses the incident light outside the imaging module; the shell comprises a shell top wall and a shell side wall, the moving element is cylindrical and comprises a moving element top wall and a moving element side wall, and a plurality of lenses in the lens assembly are fixed in the moving element along the axial interval of the moving element;

the imaging module further includes a buffer structure secured between the housing and the moving element, the size of the buffer structure in the width direction is smaller than that of the shell in the width direction; a gap is formed between the top wall of the moving element and the top wall of the shell, and the buffer structure is fixed in the gap; the buffer structure comprises a bulge structure, wherein the bulge structure is integrally formed with the shell and forms a bulge from the top wall of the shell towards the top wall of the moving element; alternatively, the projection arrangement is integrally formed with the moving member and forms the projection from the moving member top wall toward the housing top wall.

2. The imaging module of claim 1, wherein the raised structures comprise two raised structures symmetrically formed at two lengthwise side edges of the housing top wall.

3. The imaging module of claim 1, wherein the raised structures comprise two raised structures symmetrically formed at two lengthwise side edges of the top wall of the moving element.

4. The imaging module of claim 1, wherein the buffer structure has a height dimension that is less than a height dimension of the gap.

5. A camera module comprising a first imaging module, a second imaging module, and a third imaging module, wherein the first imaging module is the imaging module of any one of claims 1-4, and the third imaging module has a field angle greater than the field angle of the first imaging module and less than the field angle of the second imaging module.

6. The camera assembly of claim 5, wherein the first imaging module, the second imaging module, and the third imaging module are arranged in a line, the second imaging module being located between the first imaging module and the third imaging module.

7. An electronic device, comprising:

a body;

a sliding module for sliding between a first position housed within the body and a second position exposed from the body, the sliding module having the camera assembly of claim 5 or 6 disposed therein.

8. The electronic device of claim 7, wherein a gyroscope is disposed within the sliding module, the camera assembly being separate from the gyroscope; the imaging module further comprises a driving chip;

the driving chip is used for controlling the camera component to work according to feedback data of the gyroscope so as to realize optical anti-shake shooting, and the driving chip is used for controlling the first imaging module to work according to the feedback data of the gyroscope so as to realize optical anti-shake shooting.

9. The electronic device of claim 8, wherein the first imaging module further comprises a mounting base, the reflective element is fixed on the mounting base, and the driving chip is configured to control the driving device to drive the mounting base with the reflective element to rotate around a rotation axis according to feedback data of the gyroscope, so as to realize optical anti-shake in an optical axis direction of the light inlet, and the rotation axis is perpendicular to an optical axis of the light inlet.

10. The electronic device according to claim 9, wherein the driving device is formed with an arc-shaped guide rail, and the driving chip is configured to control the driving device to drive the mount to rotate along the arc-shaped guide rail around a central axis of the arc-shaped guide rail, the central axis coinciding with the rotation axis, according to feedback data of the gyroscope.

11. The electronic device of claim 10, wherein the drive chip is configured to control the drive device to drive the mount to move axially along the central axis, so that the first imaging module realizes optical anti-shake in the central axis direction.

12. The electronic device of claim 10, wherein the mount comprises an arcuate surface disposed concentric with and mated with the arcuate rail.