CN113114823B

CN113114823B - Imaging module, camera assembly and electronic device

Info

Publication number: CN113114823B
Application number: CN202110510087.7A
Authority: CN
Inventors: 薛兵; 李龙佳; 马美雪; 陈伟
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-04-08
Filing date: 2019-04-08
Publication date: 2023-02-24
Anticipated expiration: 2039-04-08
Also published as: CN113114823A; CN110062070A; CN110062070B

Abstract

The application provides an imaging module, camera subassembly and electron device. The imaging module includes: the device comprises a shell, a light conversion element, an image sensor and a lens assembly. The shell is provided with a light inlet. The light conversion element is arranged in the shell. The image sensor is arranged on one side of the light conversion element and used for sensing light passing through the light inlet through the light conversion element. The lens assembly is arranged between the light conversion element and the image sensor and is used for imaging the image sensor according to the light emitted by the light conversion element. The inner surface of the housing is provided with a first light absorbing layer to prevent the housing from reflecting light to the image sensor. So, through the light-absorbing layer of setting at the shell internal surface, can avoid the shell with light reflection to image sensor, prevent that imaging module's light path from receiving the interference to improve the quality of the image that imaging module shot.

Description

Imaging module, camera assembly and electronic device

The application is a division of application number 2019, 08/04/2019, application number 201910277086.5 and application name "imaging module, camera assembly and electronic device".

Technical Field

The application relates to the field of electronic devices, in particular to an imaging module, a camera assembly and an electronic device.

Background

In the related art, in order to improve the photographing effect of the mobile phone, a periscopic lens with a long focal length is adopted for a camera of the mobile phone. The optical path of the periscopic camera is easy to interfere due to the long optical path of the periscopic camera, so that the periscopic camera cannot form high-quality images.

Disclosure of Invention

In view of the above, the present application provides an imaging module, a camera assembly and an electronic device.

The imaging module of this application embodiment includes:

the shell is provided with a light inlet;

a light conversion element disposed within the housing;

the image sensor is arranged on one side of the light conversion element and used for sensing the light rays passing through the light inlet through the light conversion element;

the lens assembly is arranged between the light conversion element and the image sensor and is used for imaging on the image sensor according to the light rays emitted by the light conversion element;

the inner surface of the housing is provided with a first light absorbing layer to prevent the housing from reflecting light to the image sensor, the first light absorbing layer being located between the image sensor and the lens assembly.

The camera assembly of the embodiment of the application comprises a first imaging module and a second imaging module, wherein the first imaging module is the imaging module. The second imaging module is arranged in parallel with the first imaging module, and the field angle of the second imaging module is larger than that of the first imaging module.

The electronic device of the embodiment of the application comprises a machine shell and the camera assembly, wherein the camera assembly is exposed out of the machine shell.

The imaging module, the camera assembly and the electronic device of the embodiment can avoid the shell from reflecting light to the image sensor through the first light absorption layer arranged on the inner surface of the shell, prevent the light path of the imaging module from being interfered, and further improve the quality of images shot by the imaging module.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic plan view of an electronic device according to an embodiment of the present application;

FIG. 2 is a perspective schematic view of a camera head assembly according to an embodiment of the present application;

FIG. 3 is a schematic perspective view of a first imaging module according to an embodiment of the present disclosure;

FIG. 4 is an exploded view of a first imaging module according to an embodiment of the present disclosure;

FIG. 5 is a schematic cross-sectional view of a first imaging module according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view of a first imaging module according to another embodiment of the present disclosure;

FIG. 7 is a schematic perspective view of a light conversion element according to an embodiment of the present application;

FIG. 8 is a schematic diagram of a light reflection imaging module in the related art;

FIG. 9 is a schematic view of a light reflection imaging of a first imaging module according to an embodiment of the present disclosure;

FIG. 10 is a schematic structural diagram of an imaging module according to the related art;

FIG. 11 is a schematic view of a first imaging module according to an embodiment of the present disclosure;

FIG. 12 is a schematic plan view of a first imaging module of an embodiment of the present application;

FIG. 13 is a schematic plan view of a first imaging module according to another embodiment of the present application;

FIG. 14 is a schematic plan view of a top wall of a first imaging module of an embodiment of the present application;

fig. 15 is a schematic cross-sectional view of a second imaging module according to an embodiment of the present disclosure.

Description of the main element symbols:

the electronic device 1000, the body 110, the sliding module 200, and the gyroscope 120;

the camera module 100, the first imaging module 20, the housing 21, the light inlet 211, a long side 2111 of the light inlet 211, a short side 2112 of the light inlet 211, a short side 2113 of the light inlet 211, the groove 212, the housing top wall 213, a long side 2132 of the housing top wall 213, housing side walls 214, an inner surface 216, the light diverting element 22, the light incident surface 222, the backlight surface 224, the light incident surface 226, the light emitting surface 228, the mounting base 23, the first lens assembly 24, the lens 241, the loading element 25, the clip 222, the first image sensor 26, the driving mechanism 27, the driving device 28, the rotation axis 29, the buffering structure 205, the edge 2051, the first light absorbing layer 206, a long side 2061 of the first light absorbing layer 206, a short side 2062 of the first light absorbing layer 206, the third light absorbing layer 208, a long side 2081 of the third light absorbing layer 208, a short side 2082 of the third light absorbing layer 208, a short side 2083 of the third light absorbing layer 208, the second light absorbing layer 207, a long side 207 of the second light absorbing layer 207, a long side 1 of the second light absorbing layer, a second imaging module 30, a second imaging module 31, a second light absorbing layer 32, a second imaging module 40, and an imaging module mount 50.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 102 and a camera assembly 100. The camera assembly 100 is exposed through the housing 102.

By way of example, the electronic device 1000 may be any of various types of computer system equipment (only one modality shown in fig. 1 by way of example) that is mobile or portable and that performs wireless communications.

Specifically, the electronic apparatus 1000 may be a mobile phone or a smart phone (e.g., an iPhone system (apple) based phone, an Android system (Android) based phone), a portable game device (e.g., an iPhone (apple phone)), a laptop, a Palmtop (PDA), a portable internet appliance, a music player, and a data storage device, other handheld devices, and devices such as a watch, an in-ear headset, a pendant, a headset, and the like.

The electronic apparatus 100 may also be other wearable devices (e.g., a Head Mounted Display (HMD) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smartwatches).

The housing 102 is an external component of the electronic device 1000, and functions to protect internal components of the electronic device 1000. The housing 102 may be a rear cover of the electronic device 1000, which covers components of the electronic device 1000 such as a battery.

In this embodiment, the camera assembly 100 is disposed at the rear, or the camera assembly 100 is disposed at the rear of the electronic device 1000 so that the electronic device 1000 can perform rear-view imaging. As in the example of fig. 1, the camera assembly 100 is disposed at an upper-middle portion of the housing 102.

Of course, it is understood that the camera assembly 100 may be disposed at other positions, such as an upper left or upper right position of the housing 102. The position where the camera head assembly 100 is provided in the chassis 102 is not limited to the example of the present application.

Referring to fig. 2, the camera head assembly 100 includes a first imaging module 20, a second imaging module 30, a third imaging module 40, and a bracket 50.

The first imaging module 20, the second imaging module 30 and the third imaging module 40 are all disposed in the bracket 50 and are fixedly connected with the bracket 50. The bracket 50 can reduce the impact on the first imaging module 20, the second imaging module 30 and the third imaging module 40, and improve the service life of the first imaging module 20, the second imaging module 30 and the third imaging module 40.

In the present embodiment, the field angle FOV3 of the third imaging module 40 is greater than the field angle FOV1 of the first imaging module 20 and less than the field angle FOV2 of the second imaging module 30, that is, FOV1 < FOV3 < FOV2. Thus, the three imaging modules with different field angles enable the camera assembly 100 to meet the shooting requirements in different scenes.

In one example, the field angle FOV1 of the first imaging module 20 is 10-30 degrees, the field angle FOV2 of the second imaging module 30 is 110-130 degrees, and the field angle FOV3 of the third imaging module 40 is 80-110 degrees.

For example, the field angle FOV1 of the first imaging module 20 is 10 degrees, 12 degrees, 15 degrees, 20 degrees, 26 degrees, or 30 degrees. The second imaging module 30 has a field angle FOV2 of 110, 112, 118, 120, 125 or 130 degrees. The field angle FOV3 of the third imaging module 40 is 80 degrees, 85 degrees, 90 degrees, 100 degrees, 105 degrees or 110 degrees.

Since the field angle FOV1 of the first imaging module 20 is small, it can be understood that the focal length of the first imaging module 20 is large, and therefore, the first imaging module 20 can be used for shooting a long shot, so as to obtain a clear long shot image. The field angle FOV2 of the second imaging module 30 is larger, and it can be understood that the focal length of the second imaging module 30 is shorter, so that the second imaging module 30 can be used to capture a close-up view, thereby obtaining a close-up image of the object. The third imaging module 40 can be used for normally photographing the object.

In this way, by combining the first imaging module 20, the second imaging module 30 and the third imaging module 40, image effects such as background blurring and local sharpening of images can be obtained.

The first imaging module 20, the second imaging module 30 and the third imaging module 40 are arranged in parallel. In the present embodiment, the first imaging module 20, the second imaging module 30 and the third imaging module 40 are arranged along the same straight line. Further, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40.

Due to the field angle of the first imaging module 20 and the third imaging module 40, in order to obtain images with better quality from the first imaging module 20 and the third imaging module 40, the first imaging module 20 and the third imaging module 40 may be configured with an optical anti-shake device, and the optical anti-shake device is generally configured with more magnetic elements, so that the first imaging module 20 and the third imaging module 40 can generate a magnetic field.

In the present embodiment, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40, so that the first imaging module 20 and the third imaging module 40 can be far away from each other, and the magnetic field formed by the first imaging module 20 and the magnetic field formed by the third imaging module 40 are prevented from interfering with each other and affecting the normal use of the first imaging module 20 and the third imaging module 40.

In other embodiments, the first imaging module 20, the second imaging module 30, and the third imaging module 40 may be arranged in an L-shape.

The first imaging module 20, the second imaging module 30 and the third imaging module 40 may be disposed at intervals, and two adjacent imaging modules may abut against each other.

In the first imaging module 20, the second imaging module 30, and the third imaging module 40, any one of the imaging modules may be a black-and-white camera, an RGB camera, or an infrared camera.

Referring to fig. 3-6, in the present embodiment, the first imaging module 20 includes a housing 21, a light conversion element 22, a mounting base 23, a first lens assembly 24, a loading element 25, a first image sensor 26, a driving mechanism 27, a driving device 28, a buffering structure 205, a first light absorption layer 206, a third light absorption layer 208, and a second light absorption layer 207.

The light conversion element 22, the mounting seat 23, the first lens assembly 24 and the loading element 25 are disposed in the housing 21. The light conversion element 22 is disposed on the mounting base 23, and the first lens assembly 24 is fixed on the loading element 25. The loading member 25 is disposed at a side of the first image sensor 26. Further, the loading element 25 is located between the light conversion element 22 and the first image sensor 26.

A drive mechanism 27 connects the loading element 25 with the housing 21. After entering the housing 21, the incident light is turned by the light-turning element 22 and then reaches the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 obtains an external image. The driving mechanism 27 is used for driving the loading element 25 to move along the optical axis of the first lens assembly 24 so as to focus and image the first lens assembly 24 on the first image sensor 26.

The housing 21 has a substantially square shape, and the housing 21 has a light inlet 211, and the incident light enters the first imaging module 20 through the light inlet 211. That is, the light diverting element 22 is used for diverting the incident light entering from the light inlet 211 and passing the diverted incident light to the first image sensor 26 through the first lens assembly 24 so that the first image sensor 26 senses the incident light outside the first imaging module 20.

Therefore, it can be understood that the first imaging module 20 is a periscopic lens module. Compared with the vertical lens module, the periscopic lens module has a smaller height, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module means that the optical axis of the lens module is a straight line. Or, the incident light is transmitted to the photosensitive device of the lens module along a linear optical axis.

It can be understood that the light inlet 211 is exposed through the through hole 11, so that external light enters the first imaging module 20 from the light inlet 211 after passing through the through hole 11.

Specifically, referring to fig. 4, the housing 21 includes a housing top wall 213 and a housing side wall 214. Housing side walls 214 are formed extending from side edges 2131 of housing top wall 213. The housing top wall 213 includes two opposing sides 2131. The number of the housing sidewalls 214 is two, and each housing sidewall 214 extends from a corresponding one of the side edges 2131. Alternatively, the housing sidewall 214 is connected to opposite sides of the housing top wall 213. The light inlet 211 is formed in the housing top wall 213.

The light-converting element 22 is a prism or a flat mirror. In one example, when light-turning element 22 is a prism, the prism may be a triangular prism having a cross-section in the form of a right triangle, wherein light is incident on one of the legs of the right triangle and exits the other leg after being reflected by the hypotenuse.

Of course, the incident light may be refracted by the prism and then exit without being reflected. The prism can be made of glass, plastic and other materials with better light transmittance. In one embodiment, one of the surfaces of the prism may be coated with a light reflecting material such as silver to reflect incident light.

It will be appreciated that when the light-diverting element 22 is a flat mirror, the flat mirror reflects incident light to divert the incident light.

Further, referring to fig. 5 and fig. 7, the light conversion element 22 has a light incident surface 222, a light backlight surface 224, a light conversion surface 226 and a light emitting surface 228. The light incident surface 222 is close to and faces the light inlet 211. The backlight surface 224 is far away from the light inlet 211 and is opposite to the light incident surface 222. The light-turning surface 226 connects the light-incident surface 222 and the light-backlight surface 224. The light-emitting surface 228 connects the light-entering surface 222 and the light-exiting surface 224. The light emitting surface 228 faces the first image sensor 26. The light-turning surface 226 is disposed obliquely to the light-entering surface 222. The light emitting surface 228 is opposite to the light converting surface 226.

Specifically, in the light turning process, the light passes through the light inlet 211, enters the light conversion element 22 through the light incident surface 222, is turned through the light turning surface 226, and finally reflects the light conversion element 22 from the light emitting surface 228, thereby completing the light conversion process. And the backlight surface 224 is fixedly arranged with the mounting seat 23 to keep the light conversion element 22 stable.

As shown in fig. 8, in the related art, the light-converting surface 226a of the light-converting element 22a is inclined with respect to the horizontal direction due to the need to reflect the incident light, and the light-converting element 22a has an asymmetric structure in the reflection direction of the light. Therefore, the actual optical area below the light conversion element 22a is smaller than the actual optical area above the light conversion element 22 a. This is understood to mean that the portion of the light-diverting surface 226a away from the light inlet port reflects little or no light.

Therefore, referring to fig. 9, the light conversion element 22 of the present embodiment cuts off the corner far from the light entrance relative to the light conversion element 22a in the related art, which not only does not affect the effect of the light reflected by the light conversion element 22, but also reduces the overall thickness of the light conversion element 22.

Referring to fig. 5 again, the light-converting surface 226 is inclined at an angle α of 45 degrees with respect to the light-incident surface 222.

Therefore, the incident light rays are better reflected and converted, and a better light ray conversion effect is achieved.

Further, the light conversion element 22 may be made of a material having relatively good light transmittance, such as glass or plastic. In one embodiment, one of the surfaces of the light conversion element 22 may be coated with a light reflecting material such as silver to reflect incident light. Of course, the light diverting element 22 may utilize the principle of total reflection of light to divert incident light. In this case, the light conversion element 22 need not be coated with a light reflecting material.

As in the example of fig. 5, the light incident surface 222 and the light emergent surface 224 are arranged in parallel.

Thus, when the backlight surface 224 and the mounting base 23 are fixedly arranged, the light conversion element 22 can be kept stable, the light incident surface 222 is also a plane, and incident light forms a regular light path in the conversion process of the light conversion element 22, so that the conversion efficiency of light is better. Specifically, the cross section of the light conversion element 22 is substantially trapezoidal along the light incident direction of the light incident port 211, or the light conversion element 22 is substantially trapezoidal.

As in the example of fig. 5, the light incident surface 222 and the light backlight surface 224 are perpendicular to the light emitting surface 228.

Thus, a regular light conversion element 22 can be formed, so that the light path of the incident light is relatively straight, and the light conversion efficiency is improved.

In one example, the distance between the light-in surface 222 and the light-out surface 224 is in the range of 4.8-5.0mm. For example, the distance between the light incident surface 222 and the light backlight surface 224 may be 4.85mm, 4.9mm, 4.95mm, and the like. Alternatively, the distance between the light incident surface 222 and the light emergent surface 224 can be understood as the height of the light conversion element 22 is 4.8-5.0mm.

The light conversion element 22 formed by the light incident surface 222 and the light backlight surface 224 in the above distance range has a moderate volume, and can be better integrated into the first imaging module 20, so as to form a more compact and miniaturized first imaging module 20, camera assembly 100 and electronic device 1000, thereby meeting more requirements of consumers.

Optionally, the light incident surface 222, the light backlight surface 224, the light conversion surface 226 and the light emitting surface 228 are hardened to form a hardened layer.

When the light conversion element 22 is made of glass or the like, the light conversion element 22 itself is brittle, and the light incident surface 222, the back surface 224, the light conversion surface 226 and the light emitting surface 228 of the light conversion element 22 may be hardened to increase the strength of the light conversion element 22. Furthermore, all the surfaces of the light conversion element can be hardened to further improve the strength of the light conversion element.

Further, the hardening treatment may be infiltration of lithium ions, or coating of the above surfaces without affecting the light conversion of the light conversion element 22.

In one example, the light diverting element 22 diverts incident light from the light inlet 211 by an angle of 90 degrees. For example, the incident angle of the incident light on the emitting surface of the light conversion element 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the light diverting element 22 diverts the incident light may be other angles, such as 80 degrees or 100 degrees, as long as the incident light can be diverted to reach the first image sensor 26.

In this embodiment, the number of the light diverting elements 22 is one, and in this case, the incident light is once diverted and then transmitted to the first image sensor 26. In other embodiments, the number of the light diverting elements 22 is multiple, and the incident light is diverted to the first image sensor 26 at least twice.

The mounting 23 is used for mounting the light converting element 22, or the mounting 23 is a carrier of the light converting element 22. The light conversion element 22 is fixed on the mounting base 23. This allows the position of the light-diverting element 22 to be determined, which facilitates the reflection or refraction of the incident light by the light-diverting element 22. Light conversion element 22 can be fixed on mounting base 23 by adhesive bonding to achieve a fixed connection with mounting base 23.

Specifically, in the present embodiment, the mounting base 23 is provided with a limiting structure 232, and the limiting structure 232 is connected to the light conversion element 22 to limit the position of the light conversion element 22 on the mounting base 23.

In this way, the limiting structure 232 limits the position of the light conversion element 22 on the mounting seat 23, so that the light conversion element 22 does not shift when being impacted, which is beneficial to the normal use of the first imaging module 20.

It can be understood that in an example, the light conversion element 22 is fixed on the mounting seat 23 by adhesion, and if the limiting structure 232 is omitted, the light conversion element 22 is easy to fall off from the mounting seat 23 if the adhesion force between the light conversion element 2222 and the mounting seat 23 is insufficient when the first imaging module 20 is impacted.

In the present embodiment, the mounting seat 23 is formed with a mounting groove 233, the light conversion member 22 is disposed in the mounting groove 233, and the limit structure 232 is disposed at an edge of the mounting groove 233 and abuts against the light conversion member 22.

Thus, the mounting groove 233 may allow the light conversion member 22 to be easily mounted on the mounting seat 23. The limiting structure 232 is disposed at the edge of the mounting groove 233 and abuts against the edge of the light conversion element 22, so that the position of the light conversion element 22 can be limited, and the incident light emitted by the light conversion element 22 to the first image sensor 26 is not hindered.

Further, the position limiting structure 232 includes a protrusion 234 protruding from the edge of the mounting groove 233, and the protrusion 234 abuts against the edge of the light emitting surface 228.

Since the light-converting element 22 is mounted on the mounting base 23 through the light-converting surface 226, the light-emitting surface 228 is disposed opposite to the light-converting surface 226. Therefore, the light conversion element 22 is more likely to be positioned toward the light emitting surface 228 when being impacted. In the present embodiment, the position-limiting structure 232 abuts against the edge of the light-emitting surface 228, so that the light-converting element 22 is prevented from moving to the side of the light-emitting surface 228, and the light can be ensured to be emitted from the light-emitting surface 228 normally.

Of course, in other embodiments, the limiting structure 232 may include other structures as long as the position of the light conversion element 22 can be limited. For example, the limiting structure 232 is formed with a slot, and the light conversion element 22 is formed with a limiting post, which is snapped into the slot to limit the position of the light conversion element 22.

In the present embodiment, the protrusion 234 is in a shape of a strip and extends along the edge of the light emitting surface 228. Thus, the contact area between the protrusion 234 and the edge of the light emitting surface 228 is large, so that the light conversion element 22 can be more stably located in the mounting seat 23.

Of course, in other embodiments, the protrusion 234 may have other structures such as a block.

Referring again to fig. 4, in one example, the mounting base 23 is movably disposed within the housing 21. For example, the mount 23 is provided to the housing 21 through a rotation shaft. The mount 23 can be rotated relative to the housing 21 to adjust the direction in which the light conversion member 22 converts the incident light.

The mounting base 23 can drive the light conversion element 22 to rotate together in the direction opposite to the shaking direction of the first imaging module 20, so as to compensate the incident deviation of the incident light of the light inlet 211, and achieve the optical anti-shaking effect.

The first lens assembly 24 is accommodated in the loading element 25, and further, the first lens assembly 24 is disposed between the light conversion element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light onto a first image sensor 26. This allows the first image sensor 26 to obtain a better quality image.

The first lens assembly 24 can form an image on the first image sensor 26 when moving integrally along the optical axis thereof, thereby realizing the focusing of the first imaging module 20. The first lens assembly 24 includes a plurality of lenses 241, when at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, so as to implement the function of zooming the first imaging module 20, and further, the loading element 25 is driven by the driving mechanism 27 to move in the housing 21 for zooming.

In the example of fig. 5, the mounting element 25 is cylindrical, and the plurality of lenses 241 of the first lens assembly 24 are fixed in the mounting element 25 at intervals along the axial direction of the mounting element 25. As in the example of fig. 6, the loading element 25 includes two clips 252, the two clips 252 sandwiching the lens 241 between the two clips 252.

It can be understood that, since the loading element 25 is used for fixing and arranging the plurality of lenses 241, the length of the loading element 25 is required to be large, and the loading element 25 may be a cylindrical structure, a square cylindrical structure, or the like with a cavity. Thus, the loading element 25 is cylindrical, and the loading element 25 can better set a plurality of lenses 241 and better protect the lenses 241 in the cavity, so that the lenses 241 are not easy to shake.

In the example of fig. 6, the loading element 25 has a certain stability, the weight of the loading element 25 can be reduced by clamping the plurality of lenses 241 between the two clamping pieces 252, the power required for the driving mechanism 27 to drive the loading element 25 can be reduced, the design difficulty of the loading element 25 is low, and the lenses 241 can be easily installed on the loading element 25.

Of course, the loading element 25 is not limited to the above-mentioned cylindrical shape and two clips 252, and in other embodiments, the loading element 25 may include three, four, etc. more clips 252 to form a more stable structure, or one clip 252 to form a simpler structure; or a rectangular body, a circular body, etc. having a cavity for accommodating various regular or irregular shapes of the lens 241. On the premise of ensuring normal imaging and operation of the imaging module 10, the specific choice is only needed.

The first image sensor 26 may employ a Complementary Metal Oxide Semiconductor (CMOS) photosensitive element or a Charge-coupled Device (CCD) photosensitive element.

The driving mechanism 27 is an electromagnetic driving mechanism, a piezoelectric driving mechanism, or a memory alloy driving mechanism.

Specifically, in the case where the driving mechanism 27 is an electromagnetic driving mechanism, the driving mechanism 27 includes a magnet for generating a magnetic field and a conductor for moving the loading element 25. When the magnetic field moves relative to the conductor, an induced current is generated in the conductor, causing the conductor to be subjected to an ampere force which drives the loading element 25 in motion.

In the case where the driving mechanism 27 is a piezoelectric driving mechanism, a voltage may be applied to the driving mechanism 27 based on the inverse piezoelectric effect of the piezoelectric ceramic material so that the driving mechanism 27 generates a mechanical stress. That is, the driving mechanism 27 is controlled to be mechanically deformed by the conversion between the electric energy and the mechanical energy, thereby driving the loading element 25 to move.

In the case where the drive mechanism 27 is a memory alloy drive mechanism, the drive mechanism 27 may be made to memorize a preset shape in advance. When it is desired to drive the movement of the loading element 25, the driving mechanism 27 may be heated to a temperature corresponding to the preset shape to restore the driving mechanism 27 to the preset shape, thereby driving the movement of the loading element 25.

Referring again to fig. 5, the first imaging module 20 further includes a driving device 28, and the driving device 28 is used for driving the mounting base 23 with the reflecting element 22 to rotate around a rotation axis 29. The drive means 28 serve to drive the axial displacement of the mounting 23 along the axis of rotation 29. The rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the light sensing direction of the first image sensor 26, so that the first imaging module 20 realizes optical anti-shake of the optical axis of the light inlet 211 and the axial direction of the rotation axis 29.

In this way, since the volume of the reflective element 22 is smaller than that of the lens barrel, the driving device 28 drives the mounting seat 23 to move in two directions, which not only can achieve the optical anti-shake effect of the first imaging module 20 in two directions, but also can make the volume of the first imaging module 20 smaller.

Referring to fig. 4 and 5, for convenience of description, the width direction, the height direction and the length direction of the first imaging module 20 are defined as X, Y and Z directions, respectively. Accordingly, the optical axis of the light inlet 211 is the Y direction, the light receiving direction of the first image sensor 26 is the Z direction, and the axial direction of the rotation axis 29 is the X direction.

The driving device 28 drives the mounting base 23 to rotate, so that the reflecting element 22 rotates around the X direction, and the first imaging module 20 achieves the Y-direction optical anti-shake effect. In addition, the driving device 28 drives the mounting seat 23 to move along the axial direction of the rotation axis 29, so that the first imaging module 20 achieves the effect of optical anti-shake in the X direction. Additionally, the first lens assembly 24 may be along the Z direction to achieve focusing of the first lens assembly 24 on the first image sensor 26.

Specifically, when the reflector 22 rotates in the X direction, the light reflected by the reflector 22 moves in the Y direction, so that the first image sensor 26 forms different images in the Y direction to achieve the Y-direction anti-shake effect. When the reflector 22 moves along the X direction, the light reflected by the reflector 22 moves in the X direction, so that the first image sensor 26 forms different images in the X direction to achieve the anti-shake effect in the X direction.

Further, the driving device 28 is formed with an arc-shaped guide rail 281, and the driving device 28 is used for driving the mounting seat 23 to rotate around a central axis 282 of the arc-shaped guide rail 281 and move axially along the central axis 282 along the arc-shaped guide rail 281, and the central axis 2282 is coincident with the rotation axis 29.

It will be appreciated that the drive means 28 is adapted to drive the mounting base 23 along the arcuate guide 281 in a rotational movement about the central axis 282 of the arcuate guide 281 and in an axial movement along the central axis 282.

In this way, since the driving device 28 drives the mounting seat 23 with the reflective element 22 to rotate together in the manner of the arc-shaped guide rail 281, the friction between the driving device 28 and the mounting seat 23 is small, which is beneficial to smooth rotation of the mounting seat 23 and improves the optical anti-shake effect of the first imaging module 20.

Specifically, referring to fig. 10, in the related art, a mounting base (not shown) is rotatably connected to a rotating shaft 23a, and the mounting base rotates around the rotating shaft 23a to drive the light-converting element 22a to rotate together. Assuming that the friction force is F1, the radius of the rotating shaft 23a is R1, the thrust force is F1, and the rotation radius is R1. The friction torque to thrust torque ratio K1 is then K1= F1R1/F1A1. Since the light conversion element 22a only needs to be slightly rotated, F1 cannot be too large; the imaging module itself needs to be thin, light, short, and small, so that the size of the light conversion element 22a cannot be too large, and the enlarged space of a is limited, so that the influence of friction cannot be further eliminated.

Referring to fig. 11, in the present application, the mounting base 23 rotates along the arc-shaped guide 281, and the radius of the arc-shaped guide 281 is R2. At this time, the ratio K2 of the friction torque to the rotation torque is K2= F2R2/F2A, and when F2, R2, and F2 are not changed greatly, the corresponding thrust torque becomes R2 because the orbital oscillation mode is adopted for rotation, and R2 may not be limited by the size of the reflective element 22, and may even be several times or more of R1. In this case, the influence of the friction on the rotation of the reflective element 22 can be greatly reduced (the size of K2 is reduced), so as to improve the rotation precision of the reflective element 22, and the optical anti-shake effect of the first imaging module 20 is better.

Referring to fig. 5, the mounting seat 23 includes an arc surface 231, and the arc surface 231 is disposed concentrically with the arc guide 281 and is matched with the arc guide 281. Or, the center of the arc-shaped face 231 coincides with the center of the arc-shaped guide 281. This makes the mounting 23 and the drive means 28 co-operating more compact.

Further, the central axis 282 is located outside the first imaging module 20. In this way, the radius R2 of the arc-shaped guide rail 281 is larger, so that the adverse effect of the friction force on the rotation of the mounting seat 23 can be reduced.

In addition, the driving device 28 is located at the bottom of the housing 21. Alternatively, the drive means 28 is of integral construction with the housing 21. In this way, the first imaging module 20 is more compact.

The driving device 28 can drive the mounting seat 23 to rotate in an electromagnetic mode. In one example, the driving device 28 is provided with a coil, and the mounting seat 23 is fixed with an electromagnetic sheet, and after the coil is powered on, the coil can generate a magnetic field to drive the electromagnetic sheet to move, so as to drive the mounting seat 23 and the reflecting element to rotate together.

Of course, the driving device 28 can also drive the mounting seat 23 to move by means of a piezoelectric drive or a memory alloy drive. Please refer to the above description for the piezoelectric driving method and the memory alloy driving method, which are not described herein.

Referring to fig. 3 and 12 again, the first imaging module 20 further includes a buffer structure 205, the buffer structure 205 is fixed between the housing 21 and the loading element 25, and a dimension of the buffer structure 205 in the width direction of the first imaging module 20 is smaller than a dimension of the housing 21 in the width direction of the first imaging module 20.

It will be appreciated that in the event of a crash of the first imaging module 20, the top wall 213 of the housing is deformed, recessed towards the loading element 25, with a greater amount of deformation in the central portion than on the two sides. When the deformation occurs, the top wall 213 of the housing contacts with the buffer structure 205 disposed at the gap between the housing 21 and the loading element 25, the area of the middle portion of the deformation is reduced, and the amount of deformation is also reduced, so that the direct contact between the housing 21 and the loading element 25 can be prevented or the contact area between the housing 21 and the loading element 25 can be reduced, and the loading element 25 is not easy to move due to the deformation of the housing 21, so that the first imaging module 20 cannot focus.

The dimension of the buffer structure 205 in the width direction may be 1/5 of the dimension of the housing 21 in the width direction. In this way, the buffer structure 205 does not form a plate-like structure due to the excessively large width, so that the buffer structure 205 and the loading element 25 are not too large in contact area to catch the loading element when the housing 21 is deformed, and the buffer structure is not too small in size to be effective.

The dimension ratio of the buffer structure 205 to the housing 21 in the width direction is merely illustrative.

In the present embodiment, the housing 21 includes a housing top wall 213 and a housing side wall 214, and the loading member 25 is cylindrical and includes a loading member top wall 251 and a loading member side wall, the loading member top wall 251 being opposite to the housing top wall 213, and the loading member side wall being opposite to the housing side wall 214.

A gap is formed between the top wall 251 of the loading element and the top wall 213 of the housing, the buffer structure 205 is fixed in the gap, and the dimension of the buffer structure 205 in the height direction of the first imaging module 20 is smaller than the dimension of the gap in the height direction of the first imaging module 20, so as to prevent the buffer structure 205 from blocking the loading element 25 and preventing the element of the moving element 25 from moving.

It will be appreciated that the housing 21 provides a back-up protection for the components disposed therein, and the loading member 25 is movable along the optical axis of the first lens assembly 24 by the drive mechanism 27. Therefore, a gap is left between the loading element 25 and the housing 21, the buffer structure 205 is disposed at the gap, and the loading element 25 contacts the housing 21 before the deformation of the housing top wall 213, so as to prevent the loading element 25 from being unable to move due to the too large contact area with the loading element top wall 251 after the deformation of the housing top wall 213.

Referring to fig. 12, the buffer structure 205 includes a protrusion structure integrally formed with the housing 21 and protruding from the housing top wall 213 toward the loading element top wall 251.

In particular, the protruding structure may be stamped and formed from the housing top wall 213, and thus, the process is simple. Of course, in other embodiments, the protrusion structure may be formed separately from the top wall 213 of the housing and fixed to the top wall 213 of the housing by bonding, welding, or the like.

In the present embodiment, the protruding structures include two protruding structures, and the two protruding structures are symmetrically formed at two side edges of the top wall 213 of the housing along the length direction of the first imaging module 20.

The convex structures are formed on two sides of the top wall 213 of the housing to form a symmetrical structure, and when the top wall 213 of the housing is deformed, the two convex structures with a relatively short distance are used as end points, so that the deformation amount can be effectively reduced, and the contact area between the top wall 213 of the housing and the top wall 251 of the loading element is reduced. Thus, the loading element 25 is not easily moved by the deformation of the housing 21, so that the first imaging module 20 cannot be focused.

Of course, referring to fig. 13, the protrusion structure may be formed integrally with the loading element 25 and form a protrusion from the loading element top wall 251 toward the housing top wall 213.

In particular, the protruding structure may be integrally injection-molded with the loading element 25, and thus, the process is simple. Of course, in other embodiments, the raised structure may be formed separately from the carrier member 25 and secured to the carrier member top wall 251 by adhesive or the like.

The protruding structures include two protruding structures, and the two protruding structures are symmetrically formed at two side edges of the top wall 213 of the housing along the length direction.

The convex structures are formed on both sides of the top wall 251 of the loading element 25 to form a symmetrical structure, when the housing top wall 213 is deformed, the housing top wall 213 is firstly contacted with the two convex structures, and the two convex structures serve as two supporting points to reduce the deformation amount of the housing top wall 213, thereby reducing the contact area between the housing top wall 213 and the loading element top wall 251. Thus, the loading element 25 is not easily moved due to the deformation of the housing, so that the first imaging module 20 cannot be focused.

Referring to fig. 5 and 14, the first light absorbing layer 206 is disposed on the inner surface 216 of the housing 21 to prevent the housing 21 from reflecting light to the first image sensor 26, and the first light absorbing layer 206 is disposed between the first image sensor 26 and the first lens assembly 24. Further, the housing top wall 213 of the housing 21 is provided with a first light absorbing layer 206.

In this way, the first light-absorbing layer 206 disposed on the inner surface 216 of the housing 21 can prevent the housing 21 from reflecting light to the first image sensor 26, and prevent the optical path of the first imaging module 20 from being interfered, thereby improving the quality of the image captured by the first imaging module 20.

It is understood that when a scene (e.g., a light) is photographed, a portion of the light passes through the first lens assembly 24 and then is projected onto the housing 21 due to the long optical path of the first imaging module 20. And the housing 21 is generally made of a metal material and easily reflects light. Therefore, the housing 21 reflects the light projected onto the housing 21, for example, to the first image sensor 26, which causes a spot on the image captured by the first imaging module 20, and affects the imaging effect of the first imaging module 20.

In the embodiment of the present application, the first light absorption layer 206 is disposed on the inner surface 216 of the housing 21, so as to absorb the light projected onto the housing 21, and then the light is not reflected onto the first image sensor 26 to affect the image formation, so that the image formation effect of the first image forming module 20 can be improved.

Further, the first light absorbing layer 206 is made of a black material. The first light absorbing layer 206 includes at least one of paint and foam.

The black material has a good light absorption effect, and the first light absorption layer 206 made of the black material can simply and conveniently realize the light absorption effect.

In one example, the first light absorbing layer 206 is paint, and during the manufacturing process, black paint may be coated on the inner surface 216 of the top wall 213 of the housing, and after the paint is dried, the top wall 213 of the housing may be fixed to the housing 21. Further, paint with poor fluidity can be selected, and the paint is prevented from flowing to other areas which do not need light absorption.

In another example, the first light absorbing layer 206 is foam, which may be black during manufacture, and the black foam is attached to the inner surface 216 of the housing top wall 213, and the housing top wall 213 is then secured to the housing 21.

In yet another example, the first light absorbing layer 206 is paint and foam, and if no black foam is present, a conventional foam may be attached to the inner surface 216 of the top wall 213 of the housing and then painted black. Alternatively, the foam is first coated with black paint and, after the paint dries, the foam is attached to the inner surface 216 of the top wall 213 of the housing. This can achieve both the light absorbing effect and provide cushioning and protection for the first imaging module 20.

The first light absorbing layer 206 is rectangular, the long side 2061 of the first light absorbing layer 206 is aligned with the edge 2051 of the buffer structure 205, and the dimension of the first light absorbing layer 206 in the width direction of the first imaging module 20 is smaller than the dimension of the buffer structure 205 in the width direction of the first imaging module 20. The length of the long side 2061 of the first light-absorbing layer 206 ranges from 4.0mm to 5.0mm, and the length of the short side 2062 of the first light-absorbing layer 206 ranges from 1.8mm to 2.2mm.

In this way, the first light absorbing layer 206 and the buffer structure 205 cooperate to ensure that the first light absorbing layer 206 and the buffer structure 205 do not interfere with each other, so that the first imaging module 20 works normally.

In one example, the length of the long side 2061 of the first light absorbing layer 206 is 4.5mm and the length of the short side 2062 of the first light absorbing layer 206 is 2mm.

In another example, the length of the long side 2061 of the first light absorbing layer 206 is 4.0mm and the length of the short side 2062 of the first light absorbing layer 206 is 1.8mm.

In yet another example, the length of the long side 2061 of the first light absorbing layer 206 is 5.0mm, and the length of the short side 2062 of the first light absorbing layer 206 is 2.2mm.

Note that the length of the long side 2061 and the length of the short side 2062 of the first light-absorbing layer 206 may satisfy the above-described range, and specific values of the length of the long side 2061 and the length of the short side 2062 are not limited herein.

The size of the third light absorbing layer 208 is the same as that of the second light absorbing layer 207. The third light absorbing layer 208 is rectangular, the distance a between the long side 2081 of the third light absorbing layer 208 and the long side 2132 of the housing top wall 213 ranges from 0.8mm to 1.2mm, and the short side 2082 of the third light absorbing layer 208 coincides with the long side 2111 of the light inlet 211. The second light absorbing layer 207 has a rectangular shape, and a long side 2071 of the second light absorbing layer 207 coincides with a short side 2112 of the light inlet 211.

In this way, light absorption at the light inlet 211 is realized, and light reflection of the housing 21 at the light inlet 211 is prevented from influencing the imaging of the first imaging module 20.

In one example, the distance A between long edge 2081 of third light absorbing layer 208 and long edge 2132 of housing top wall 213 is 1mm; in another example, the distance A between long edge 2081 of the third light absorbent layer 208 and long edge 2132 of the housing top wall 213 is 0.8mm; in yet another example, the distance A between the long side 2081 of the third light absorbent layer 208 and the long side 2132 of the housing top wall 213 is 1.2mm.

Note that the above examples are merely illustrative, and the distance a between the long side 2081 of the third light absorbing layer 208 and the long side 2132 of the housing top wall 213 may satisfy the above range, and specific values of the distance a between the long side 2081 of the third light absorbing layer 208 and the long side 2132 of the housing top wall 213 are not limited herein.

Further, the third light absorbent layer 208 has a length of a long side 2081 ranging from 5.8mm to 6.2mm, and a length of a short side 2083 of the third light absorbent layer 208 ranging from 0.8mm to 1.2mm.

In one example, the length of the long side 2081 of the third light absorbent layer 208 is 6mm, and the length of the short side 2083 of the third light absorbent layer 208 is 1mm; in another example, the length of the long side 2081 of the third light absorbent layer 208 is 5.8mm, and the length of the short side 2083 of the third light absorbent layer 208 is 0.8mm; in yet another example, the length of the long side 2081 of the third light absorbent layer 208 is 6.2mm, and the length of the short side 2083 of the third light absorbent layer 208 is 1.2mm.

Note that the above example is merely to illustrate that the length of the long side 2081 of the third light absorbing layer 208 and the length of the short side 2083 of the third light absorbing layer 208 satisfy the above-described ranges, and specific values of the length of the long side 2081 of the third light absorbing layer 208 and the length of the short side 2083 of the third light absorbing layer 208 are not limited herein.

The second light absorbing layer 207 and the third light absorbing layer 208 may also be made of a black material, similar to the first light absorbing layer 206. The second light absorbing layer 207 may include at least one of paint and foam. The third light absorbing layer 208 may include at least one of paint and foam. For the explanation and explanation of this part, reference may be made to the aforementioned explanation and explanation of the first light absorbing layer 206, and a detailed explanation thereof is omitted here to avoid redundancy.

Referring to fig. 15, in the present embodiment, the second imaging module 30 is an upright lens module, but in other embodiments, the second imaging module 30 may also be a periscopic lens module.

The second imaging module 30 includes a second lens assembly 31 and a second image sensor 32, the second lens assembly 31 is configured to image light onto the second image sensor 32, and an incident optical axis of the second imaging module 30 coincides with an optical axis of the second lens assembly 31.

In this embodiment, the second imaging module 30 can be a fixed focus lens module, and therefore, the number of lenses 241 of the second lens assembly 31 is small, so that the height of the second imaging module 30 is low, which is beneficial to reducing the thickness of the electronic device 1000.

The type of the second image sensor 32 may be the same as the type of the first image sensor 26 and will not be described in detail herein.

The third imaging module 40 has a structure similar to that of the second imaging module 30, for example, the third imaging module 40 is also an upright lens module. Therefore, the features of the third imaging module 40 refer to the features of the second imaging module 40, which are not described herein.

In summary, the first imaging module 20 includes a housing 21, a light conversion element 22, a first image sensor 26 and a first lens assembly 24. The housing 21 is opened with a light inlet 211. The light conversion element 22 is disposed within the housing 21.

The first image sensor 26 is disposed on one side of the light conversion element 22, and the first image sensor 26 is used for sensing the light passing through the light inlet 211 by the light conversion element 22. The first lens assembly 24 is disposed between the light conversion element 22 and the first image sensor 26, and the first lens assembly 24 is configured to image the first image sensor 26 according to the light emitted from the light conversion element 22. The inner surface 216 of the housing 21 is provided with a first light absorbing layer 206 to prevent the housing 21 from reflecting light to the first image sensor 26, and the first light absorbing layer 206 is positioned between the first image sensor 26 and the first lens assembly 24.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An imaging module, comprising:

the shell is provided with a light inlet;

a light conversion element disposed within the housing;

the inner surface of the shell is provided with a first light absorption layer to prevent the shell from reflecting light to the image sensor;

the imaging module further comprises a buffer structure fixed between the shell and the loading element, and the size of the buffer structure in the width direction of the imaging module is smaller than that of the shell in the width direction of the imaging module;

the first light absorption layer is rectangular, the long edge of the first light absorption layer is aligned with the edge of the buffer structure, and the size of the first light absorption layer in the width direction of the imaging module is smaller than that of the buffer structure in the width direction of the imaging module; the length range of the long side of the first light absorbing layer is 4.0mm-5.0mm, and the length range of the short side of the first light absorbing layer is 1.8mm-2.2mm.

2. The imaging module of claim 1, wherein the housing comprises a housing top wall, the housing top wall is formed with the light inlet, and the housing top wall is provided with the first light absorbing layer.

3. The imaging module of claim 1 wherein the first light absorbing layer is positioned between the image sensor and the lens assembly.

4. The imaging module of claim 1, wherein the first light absorbing layer is made of a black material.

5. The imaging module of claim 4, wherein the first light absorbing layer comprises at least one of paint and foam.

6. The imaging module of claim 1, wherein the housing includes a housing top wall and a housing side wall, the loading element is cylindrical and includes a loading element top wall and a loading element side wall, the plurality of lenses of the lens assembly are fixed in the loading element at intervals along an axial direction of the loading element, a gap is formed between the loading element top wall and the housing top wall, and the buffer structure is fixed in the gap.

7. The imaging module of claim 6, wherein the relief structure comprises a raised structure integrally formed with the housing and forming a protrusion from the housing top wall toward the loading element top wall.

8. The imaging module of claim 7, wherein the protrusion structures comprise two protrusion structures symmetrically formed on two side edges of the top wall of the housing along a length direction of the imaging module.

9. The imaging module of claim 6, wherein the buffer structure comprises a raised structure integrally formed with the loading element and raised from the loading element top wall toward the housing top wall.

10. The imaging module of claim 6, wherein a dimension of the buffer structure in a height direction of the imaging module is smaller than a dimension of the gap in the height direction of the imaging module.

11. The imaging module of claim 1, further comprising:

the lens assembly is fixed on the loading element; and

and the driving mechanism is used for driving the loading element to move along the optical axis of the lens assembly so as to enable the lens assembly to be focused and imaged on the image sensor.

12. The imaging module of claim 11, wherein the mounting element is cylindrical, and a plurality of lenses of the lens assembly are fixed in the mounting element at intervals along an axial direction of the mounting element; or

The loading element comprises two clamping pieces, and the lens assembly is clamped between the two clamping pieces.

13. The imaging module of claim 1, wherein the light conversion element comprises a flat mirror or a prism.

14. The imaging module of claim 1, wherein the imaging module comprises a mounting base, the light conversion element is disposed on the mounting base, and the mounting base is provided with a limiting structure, and the limiting structure is connected with the light conversion element to limit the position of the light conversion element on the mounting base.

15. The imaging module of claim 14, wherein the mounting socket is formed with a mounting slot, the light diverting element is disposed in the mounting slot, and the limiting structure is disposed at an edge of the mounting slot and abuts against an edge of the light diverting element.

16. The imaging module of claim 1, further comprising a second light absorbing layer disposed on an interior surface of the housing and located at an edge of the light inlet.

17. The imaging module of claim 16, further comprising a third light absorbing layer disposed on an inner surface of the housing and located at an edge of the light inlet, the third light absorbing layer and the second light absorbing layer being located on opposite sides of the light inlet.

18. A camera head assembly, comprising:

a first imaging module, said first imaging module being the imaging module of any one of claims 1-17; and

the second imaging module is arranged in parallel with the first imaging module, and the field angle of the second imaging module is larger than that of the first imaging module.

19. The camera assembly of claim 18, wherein the camera assembly includes a third imaging module, the first, second, and third imaging modules being arranged in a common line, the second imaging module being positioned between the first and third imaging modules.

20. An electronic device, comprising:

a housing; and

a camera assembly according to claim 18 or 19, exposed through the housing.