CN108600599A - Imaging modules, CCD camera assembly and electronic device - Google Patents

Imaging modules, CCD camera assembly and electronic device Download PDF

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Publication number
CN108600599A
CN108600599A CN201810829417.7A CN201810829417A CN108600599A CN 108600599 A CN108600599 A CN 108600599A CN 201810829417 A CN201810829417 A CN 201810829417A CN 108600599 A CN108600599 A CN 108600599A
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CN
China
Prior art keywords
imaging modules
light inlet
mounting base
imaging
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810829417.7A
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Chinese (zh)
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CN108600599B (en
Inventor
张弓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810829417.7A priority Critical patent/CN108600599B/en
Publication of CN108600599A publication Critical patent/CN108600599A/en
Priority to PCT/CN2019/087759 priority patent/WO2020019838A1/en
Application granted granted Critical
Publication of CN108600599B publication Critical patent/CN108600599B/en
Active legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/51Housings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Studio Devices (AREA)

Abstract

A kind of imaging modules of the application offer, CCD camera assembly and electronic device.Imaging modules include offering the shell of light inlet and being respectively provided with reflecting element, mounting base and imaging sensor inside the shell.Reflecting element is fixed in mounting base, reflecting element is used to after turning to reach imaging sensor the incident light so that outside imaging sensor sensing imaging modules from the incident light of light inlet incidence, mounting base can rotate around the axis relative to shell, the optical axis for being axially perpendicular to light inlet of shaft.Imaging modules further include driving device, and driving device is used to apply the driving force for deviateing shaft to mounting base, and drive force mounting base rotates around the axis, so that imaging modules realize the optical anti-vibration on the optical axis direction of light inlet.Above-mentioned imaging modules, CCD camera assembly and electronic device deviate the driving force of shaft since driving device applies to mounting base, to make imaging modules realize the optical anti-vibration on light inlet optical axis direction and can improve the precision of stabilization.

Description

Imaging modules, CCD camera assembly and electronic device
Technical field
This application involves a kind of field of electronic devices more particularly to imaging modules, CCD camera assembly and electronic devices.
Background technology
In the related art, in order to improve the effect of taking pictures of mobile phone, the camera of mobile phone uses periscope type lens, periscopic Camera can for example carry out three times optical focal length to obtain quality more preferably image.Periscopic camera includes one reflective yuan Part, reflecting element is for conduction after being incident to the turn light rays in periscope type lens to imaging sensor so that imaging sensor Obtain the image outside periscope type lens.How reflecting element movement is driven to realize that periscope type lens realize that optical anti-vibration becomes Technical problem to be solved.
Invention content
A kind of imaging modules of the application offer, CCD camera assembly and electronic device.
The imaging modules of the application embodiment include offering the shell of light inlet and being arranged in the shell Reflecting element, mounting base and imaging sensor.The reflecting element is fixed in the mounting base, and the reflecting element is used for Described image sensor is reached after being turned to from the incident light of light inlet incidence so that described in described image sensor sensing The incident light outside imaging modules, the mounting base can rotate around the axis relative to the shell, the axis of the shaft To the optical axis perpendicular to the light inlet.The imaging modules further include driving device, and the driving device is used for the peace It filling seat and applies the driving force for deviateing the shaft, mounting base is rotated around the shaft described in the drive force, so that The imaging modules realize the optical anti-vibration on the optical axis direction of the light inlet.
The CCD camera assembly of the application embodiment includes the imaging modules of decoration and embodiment of above, the decoration Part is located above the light inlet of the imaging modules.
The electronic device of the application embodiment includes casing and the CCD camera assembly of embodiment of above, the camera Component is arranged on the housing.
In above-mentioned imaging modules, CCD camera assembly and electronic device, driving device applies the drive for deviateing shaft to mounting base Power, to make imaging modules realize the optical anti-vibration on light inlet optical axis direction and the precision of stabilization can be improved.
The additional aspect and advantage of the application will be set forth in part in the description, and will partly become from the following description It obtains obviously, or recognized by the practice of the application.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the application is from combining in description of the following accompanying drawings to embodiment by change It obtains obviously and is readily appreciated that, wherein:
Fig. 1 is the floor map of the electronic device of the application embodiment;
Fig. 2 is the stereoscopic schematic diagram of the CCD camera assembly of the application embodiment;
Fig. 3 is the decomposition diagram of the CCD camera assembly of the application embodiment;
Fig. 4 is the stereoscopic schematic diagram of the decoration of the application embodiment;
Fig. 5 is the decomposition diagram of the first imaging modules of the application embodiment;
Fig. 6 is the diagrammatic cross-section of the first imaging modules of the application embodiment;
Fig. 7 is the diagrammatic cross-section of the first imaging modules of another embodiment of the application;
Fig. 8 be the CCD camera assembly of Fig. 2 A-A to schematic cross-section;
Fig. 9 is the diagrammatic cross-section of the second imaging modules of the application embodiment;
Figure 10 is the imaging modules of some embodiments and the structural schematic diagram of ornamental piece;
Figure 11 is schematic cross-section of the electronic device along B-B direction of Fig. 1;
Figure 12 is the stereoscopic schematic diagram of the reflecting element of the application embodiment.
Figure 13 is the light catoptric imaging schematic diagram of the first imaging modules in the related technology;
Figure 14 is the light catoptric imaging schematic diagram of the first imaging modules of the application embodiment;
Figure 15 is the structural schematic diagram of the imaging modules of the application embodiment;
Figure 16 is the structural schematic diagram of the imaging modules of another embodiment of the application.
Main element symbol description:
Electronic device 1000, casing 102, CCD camera assembly 100, decoration 10, through-hole 11, first the 111, second son of sub-aperture Hole 112, case ring 12, chimb 13, the first imaging modules 20, shell 21, light inlet 211, groove 212, roof 213, side wall 214, reflecting element 22, incidence surface 222, shady face 224, reflective surface 226, light-emitting surface 228, mounting base 23, the first Lens assembly 24, eyeglass 241, motor element 25, intermediate plate 222, the first imaging sensor 26, driving mechanism 27, driving device 28, magnetic element 282, coil 284, piezoelectric element 286, spring 287, shaft 29, the second imaging modules 30, the second Lens assembly 31, the second image Sensor 32, holder 40.
Specific implementation mode
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term "center", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of It describes the application and simplifies to describe, do not indicate or imply the indicated device or element must have a particular orientation, with spy Fixed azimuth configuration and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature. In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can Can also be to be electrically connected or can mutually communicate to be mechanical connection;It can be directly connected, it can also be by between intermediary It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the electronic device 1000 of the application embodiment includes casing 102 and CCD camera assembly 100.Camera shooting Head assembly 100 is arranged on casing 102.Electronic device 1000 can be mobile phone, tablet computer, laptop, Intelligent bracelet, Smartwatch, intelligent helmet, intelligent glasses etc..The application embodiment is illustrated so that electronic device 1000 is mobile phone as an example, It is appreciated that the concrete form of electronic device 1000 can be other, this is not restricted.
Specifically, casing 102 is the exterior components of electronic device 1000, plays the interior of protection electronic device 1000 The effect of portion's part.Casing 102 can be the rear cover of electronic device 1000, zero, battery of overlay electronic device 1000 etc. Part.In present embodiment, 100 postposition of CCD camera assembly, in other words, the back of the body in electronic device 1000 is arranged in CCD camera assembly 100 Face is so that electronic device 1000 can carry out postposition camera shooting.As Fig. 1 example in, CCD camera assembly 100 be arranged in casing 102 Upper left corner portions.It will be appreciated, of course, that upper position or upper right position can be arranged in casing 102 in CCD camera assembly 100 The other positions such as set.CCD camera assembly 100 is arranged is not limited to the example of the application in the position of casing 102.
Fig. 2 and Fig. 3 is please referred to, CCD camera assembly 100 includes decoration 10, the first imaging modules 20, the second imaging modules 30 and holder 40.Decoration 10 is arranged on casing 102, and protrudes from the surface of casing 102.First imaging modules 20 and second Imaging modules 30 are arranged inside casing 102.First imaging modules 20 and the second imaging modules 30 are close to decoration 10 and set It sets.First imaging modules 20 and the second imaging modules 30 are arranged in holder 40 and are fixedly connected with holder 40.
Decoration 10 is arranged in the top of holder 40, and specifically, decoration 10 can be resisted against on holder 40, can also be with The setting of the interval of holder 10.The impact that holder 40 can reduce by the first imaging modules 20, the second imaging modules 30 are subject to improves first 30 service life of imaging modules 20 and the second imaging modules.
Decoration 10 may be used metal material and be made, such as the material of decoration 10 is stainless steel, and decoration 10 can be with It is handled by polishing process to form bright surface, so that decoration 10 is more beautiful.
Incorporated by reference to Fig. 4, decoration 10 is formed with through-hole 11, and the first imaging modules 20 and the second imaging modules 30 are from through-hole 11 are exposed to decoration 10, and in other words, the first imaging modules 20 and the second imaging modules 30 acquire extraneous figure by through-hole 11 Picture.Specifically, in present embodiment, through-hole 11 includes the first sub-aperture 111 and the second sub-aperture 112, and the first sub-aperture 111 and second is sub The setting of the interval of hole 112.In other words, the first sub-aperture 111 and the second sub-aperture 112 are disconnected.
Certainly, in other embodiments, the first sub-aperture 111 can be connected to the second sub-aperture 112 and form an entirety Hole.First imaging modules 20 acquire external image by the first sub-aperture 111, and the second imaging modules 30 are adopted by the second sub-aperture 112 Collect external image.In present embodiment, the first sub-aperture 111 is round hole, and the second sub-aperture 112 is square hole.
In other embodiments, the shape of the first sub-aperture 111 and the second sub-aperture 112 is not limited to the shape in diagram.Example Such as, the first sub-aperture 111 and the second sub-aperture 112 are round hole;For another example, the first sub-aperture 111 and the second sub-aperture 112 are rectangular Hole.
Decoration 10 includes case ring 12 and chimb 13, and the bottom of 13 self-chambering decorative circle 12 of chimb is to the side far from case ring 12 To extension.Through-hole 11 is formed in case ring 12, and runs through case ring 12 and chimb 13, and case ring 12 is mounted on casing 102, convex Side 13 is resisted against on casing 102, as shown in figure 11.In this way, chimb 13 can limit the position of dress decoration 10, decoration is prevented 10 move to outside casing 102.
In one example, when installing decoration 10, decoration 10 inserts outward from the inside of casing 102, in chimb 13 against casing 102 inner surface when, decoration 10 is installed to precalculated position.Decoration 10 can be fixed on casing using viscose glue On 102, decoration 10 can also be made to be interference fitted with casing 102, so that decoration 10 is not easy to fall off from casing 102.
Decoration 10 can be the integrated formed structure that case ring 12 is formed with chimb 13, be cut for example, decoration 10 uses The mode for cutting processing manufactures to be formed.In addition, case ring 12 and chimb 13 or separate structure, in other words, case ring 12 with Chimb 13 is initially formed two independent elements, then fits together to form decoration 10 by techniques such as welding.
It should be pointed out that in other embodiments, chimb 13 can be omitted, that is to say, that in this embodiment, Decoration 10 only includes the structure of case ring 12.
30 laid out in parallel of first imaging modules 20 and the second imaging modules, in other words, the setting of the second imaging modules 30 exist First imaging modules, 20 side.In present embodiment, the first imaging modules 20 and the second imaging modules 30 are arranged in "-" type, or Person says that the first imaging modules 20 and the second imaging modules 30 are arranged along same straight line.In other embodiments, the first imaging mould Group 20 and the second imaging modules 30 can arrange l-shaped.First imaging modules 20 and the second imaging modules 30 can be spaced setting, It can also be abutted against each other together.
In present embodiment, the first imaging modules 20 are located at the right side of the second imaging modules 30, in other words, the first imaging mould Group 20 is compared to the second imaging modules 30 closer to the centre position of electronic device 1000.It will be appreciated, of course, that in other realities It applies in mode, the position of the first imaging modules 20 and the second imaging modules 30 can be interchanged, in other words, the first imaging modules 20 In the left side of the second imaging modules 30.
In the first imaging modules 20 and the second imaging modules 30, one of imaging modules can be black and white camera, Another imaging modules is RGB cameras;Or an imaging modules are infrared camera, another imaging modules is RGB cameras;Or an imaging modules are RGB cameras, another imaging modules is also RGB cameras;Or one Imaging modules are wide-angle camera, another imaging modules is focal length camera etc..
In other embodiments, the second imaging modules 30 can be omitted or electronic device 1000 may include three Above imaging modules.
Please refer to Fig. 5-7, in present embodiment, the first imaging modules 20 include shell 21, reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25, the first imaging sensor 26 and driving mechanism 27.
Reflecting element 22, mounting base 23, the first Lens assembly 24, motor element 25, the first imaging sensor 26 and driving Mechanism 27 is arranged in shell 21.Reflecting element 22 is arranged in mounting base 23, and the first Lens assembly 24 is contained in movement member In part 25.Motor element 25 is arranged in 26 side of the first imaging sensor.
Driving mechanism 27 connects motor element 25 and shell 21.After incident light enters shell 21, by 22 turns of reflecting element To then through the first Lens assembly 24 the first imaging sensor 26 of arrival, so that the first imaging sensor 26 obtains outside Boundary's image.And 27 drive motion element 25 of driving mechanism makes the first imaging modules 20 to drive the movement of the first Lens assembly 24 Achieve the effect that focusing.
Shell 21 is generally square shaped, and shell 21 offers light inlet 211, incident light from light inlet 211 enter first at As in module 20.That is, reflecting element 22 is used to reach the first image after turning to from the incident incident light of light inlet 211 Sensor 26.It will therefore be appreciated that the first imaging modules 20 are periscope type lens module, compared to vertical mirror head mould group, dive and hope The height of formula camera lens module is smaller, so as to reduce the integral thickness of electronic device 1000.Vertical mirror head mould group refers to mirror The optical axis of head mould group is straight line, and in other words, incident light conducts photosensitive to camera lens module along the direction of a straight optical axis On device.
It is appreciated that light inlet 211 exposed by through-hole 11 so that ambient after through-hole 11 from light inlet 211 into Enter in the first imaging modules 20.
Incorporated by reference to Fig. 8, in present embodiment, in the width direction of the first imaging modules 20, shell 21 is in light inlet 211 Side form fluted 212, decoration 10 is located at 211 top of light inlet and is partly caught in groove 212.
Referring to Fig. 10, if omitting groove, in order to enable the integral thickness of electronic device is relatively thin, periscopic imaging modules 20a is partly stretched into decoration 10a in the direction of the width, due to periscopic imaging modules 20a width compared to it is vertical at As the width of module is big, then at this point, the size of decoration 10a is then larger, it is unfavorable for electronic device beauty, but also electronics fills It sets not compact enough.
Referring to Fig. 5 and Fig. 8, and in present embodiment, groove 212 is formed in the side of light inlet 211, decoration 10 are located at 211 top of light inlet and are partly caught in groove 212, not only so that the width dimensions of decoration 10 are smaller, also The overall height dimension of CCD camera assembly 100 can be made to reduce, be conducive to CCD camera assembly 100 it is compact-sized, miniaturization.
Specifically, shell 21 includes roof 213 and side wall 214.Side wall 214 is extended to form from the side of roof 213 2131. Roof 213 includes two sides 2131 opposite to each other, and the quantity of side wall 214 is two, 214 self-corresponding sides of each side wall 2131 extend, and in other words, side wall 214 is separately connected the opposite both sides of roof 213.Light inlet 211 is formed in roof 213, groove 212 are formed in the junction of roof 213 and side wall 214, and decoration 10 is resisted against on roof 213.In this way, groove 212 is easy shape At, be conducive to shell 21 manufacture.In one example, groove 212 is the die mould of shell 21, that is, groove 212 can pass through punching press Mode formed.
In one example, the section bottom of case ring 12 is contained in groove 212, and 12 part of case ring is resisted against roof On 213.In other words, case ring 12 forms complementary structure with shell 21, and case ring 12 is mutually chimeric with shell 21, so that decoration Part 10 and the fit structure of shell 21 are compacter.
In present embodiment, each side wall 214 and the junction of roof 213 are each formed with groove 212.In other words, groove 212 quantity is two.Certainly, in embodiments thereof, the quantity of groove 212 is alternatively individually, i other words, one of side Wall 214 and the junction of roof 213 form fluted 212.
In present embodiment, groove 212 is in strip, and groove 212 extends along the length direction of the first imaging modules 20.Such as This, groove 212 coordinates compacter with decoration 10.In some embodiments, groove 212 can be arc-shaped, arc it is recessed Slot 212 surrounds light inlet 211.Certainly, in other embodiments, the structure and shape of groove 212 are not limited to above-mentioned example, As long as so that decoration 10 and the first imaging modules 20 form complementary structure to reduce the size of decoration 10.
Reflecting element 22 is prism or plane mirror.In one example, when reflecting element 22 is prism, prism can be The section of triangular prism, prism is right angled triangle, wherein light right-angle side one of from right angled triangle is incident, To which another right-angle side is emitted after the reflection of bevel edge.It is appreciated that certain, incident light can go out after refraction by prism It penetrates, and without reflection.Prism may be used the relatively good material of the translucency such as glass, plastics and be made.In an embodiment In, it can be in reflectorized materials such as one of prism surface silver coatings to reflect incident light.
It is appreciated that when reflecting element 22 is plane mirror, the reflection of generation incident light is realized that incident light turns to by plane mirror.
More, Fig. 6 and Figure 12 are please referred to, reflecting element 22 has incidence surface 222, shady face 224, reflective surface 226, goes out Smooth surface 228.Incidence surface 222 close to and towards light inlet 211, shady face 224 far from light inlet 211 and opposite with incidence surface 222, Reflective surface 226 connects incidence surface 222 and shady face 224, and light-emitting surface 228 connects incidence surface 222 and shady face 224, reflective surface 226 It is obliquely installed relative to incidence surface 222, light-emitting surface 228 is disposed opposite to each other with reflective surface 226.
Specifically, in the transfer process of light, light passes through light inlet 211 and enters reflecting element 22 by incidence surface 222 In, then via the reflection of reflective surface 226, reflecting element 22 finally is reflected from light-emitting surface 228, the process of light conversion is completed, and Shady face 224 is fixedly installed with mounting base 23, so that reflecting element 22 is keeping stablizing.
As shown in figure 13, in the related art, due to the needs of reflection incident ray, the reflective surface of reflecting element 22a 226a is tilted relative to horizontal direction, and reflecting element 22a is unsymmetric structure, thus reflective member on the reflection direction of light The lower section of part 22a is smaller with respect to the practical optical area above reflecting element 22a, it can be understood as, the part far from light inlet Reflective surface 226a is less or can not reflection light.
Therefore, Figure 14 please be join, the reflecting element 22 of the application embodiment is relative to reflecting element 22a in the related technology The corner angle far from light inlet have been cut off, have not only been also reduced anti-without the effect for the reflection light for influencing reflecting element 22 in this way The integral thickness of optical element 22.
In some embodiments, reflective surface 226 is tilted relative to the angle [alpha] of incidence surface 222 in 45 degree.
In this way, making incident light preferably reflection and conversion, has preferable light conversion effect.
Reflecting element 22 may be used the relatively good material of the translucency such as glass, plastics and be made.In one embodiment, It can be in reflectorized materials such as one of reflecting element 22 surface silver coatings to reflect incident light.
In some embodiments, incidence surface 222 is arranged in parallel with shady face 224.
In this way, when shady face 224 and mounting base 23 are fixedly installed, 22 held stationary of reflecting element, incidence surface 222 can be made Also it is rendered as plane, incident light makes the conversion of light imitate in the light path of the transfer process also formation rule of reflecting element 22 Rate is preferable.Specifically, along the light direction that enters of light inlet 211, the section of reflecting element 22 is substantially trapezoidal, in other words, reflective member The substantially trapezoidal body of part 22.
In some embodiments, incidence surface 222 and shady face 224 are each perpendicular to light-emitting surface 228.
In this way, more regular reflecting element 22 can be formed, keep the light path of incident ray more straight, improves turning for light Change efficiency.
In some embodiments, the distance range of incidence surface 222 and shady face 224 is 4.8-5.0mm.
Specifically, the distance between incidence surface 222 and shady face 224 can be 4.85mm, 4.9mm, 4.95mm etc..Or It says, the distance range of incidence surface 222 and shady face 224 is it is to be understood that the height of reflecting element 22 is 4.8-5.0mm.More than It is moderate that the incidence surface 222 of distance range and shady face 224 are formed by 22 volume of reflecting element, can preferably suit into the first one-tenth The first imaging modules 20, CCD camera assembly 100 and electronic device 1000 as in module 20, forming more compact property and miniaturization, Meet the more demands of consumer.
In some embodiments, incidence surface 222,228 equal cure process shape of shady face 224, reflective surface 226 and light-emitting surface At there is hardened layer.
When reflecting element 22 is made of materials such as glass, the material of reflecting element 22 itself is more crisp, in order to improve reflective member The intensity of part 22 can be done to the incidence surface 222 of reflecting element 22, shady face 224, reflective surface 226 and light-emitting surface 228 at hardening Reason, more, can do cure process, to further increase the intensity of reflecting element to all surface of reflecting element.At hardening Reason such as penetrate into lithium ion, do not influence reflecting element 22 convert light under the premise of to above each film on surface.
In one example, the angle turned to from the incident incident light of light inlet 211 is 90 degree by reflecting element 22.Example Such as, incidence angle of the incident light on the surface of emission of reflecting element 22 is 45 degree, and angle of reflection is also 45 degree.Certainly, reflecting element 22 The angle that incident light turns to is alternatively other angles, for example, 80 degree, 100 degree etc., as long as being reached after incident light capable of being turned to First imaging sensor 26.
In present embodiment, the quantity of reflecting element 22 is one, at this point, incident light reaches first after once turning to Imaging sensor 26.In other embodiments, the quantity of reflecting element 22 is multiple, at this point, incident light is by least twice The first imaging sensor 26 is reached after steering.
Mounting base 23 is for installing reflecting element 22, and in other words, mounting base 23 is the carrier of reflecting element 22, reflecting element 22 are fixed in mounting base 23.In this way so that the position of reflecting element 22 is it was determined that be conducive to the reflection of reflecting element 22 or folding Penetrate incident light.Reflecting element 22 may be used viscose glue be adhesively fixed in mounting base 23 with realize be fixedly connected with mounting base 23.
It please join referring again to Fig. 6, in one example, mounting base 23 is movable to be arranged in shell 21,23 energy of mounting base It is enough to be rotated relative to shell 21 to adjust the direction that reflecting element 22 turns to incident light.
Mounting base 23 can drive reflecting element 22 to be rotated together towards the negative direction of the shake of the first imaging modules 20, from And the incident deviation of the incident light of light inlet 211 is compensated, realize the effect of optical anti-vibration.
First Lens assembly 24 is contained in motor element 25, and further, the first Lens assembly 24 is arranged in reflective member Between part 22 and the first imaging sensor 26.First Lens assembly 24 is used for image incoming light in the first imaging sensor 26 On.The first imaging sensor 26 is allow to obtain the preferable image of quality in this way.
First Lens assembly 24 can be imaged when being moved integrally along its optical axis on the first imaging sensor 26, to real Existing first imaging modules 20 focusing.First Lens assembly 24 includes multiple eyeglasses 241, when at least one eyeglass 241 moves, the The whole focal length of one Lens assembly 24 changes, to realize the function of 20 zoom of the first imaging modules, more, by driving mechanism 27 drive motion elements 25 move in shell 21 to reach zoom purpose.
In the example of fig. 6, in some embodiments, motor element 25 is cylindrical in shape, more in the first Lens assembly 24 A eyeglass 241 is fixed on along the axially spaced-apart of motor element 25 in motor element 25;Or such as Fig. 7, motor element 25 include two Eyeglass 241 is folded between two intermediate plates 252 by intermediate plate 252, two intermediate plates 252.
It is appreciated that since motor element 25 is for being fixedly installed multiple eyeglasses 241, the length ruler of required motor element 25 Very little larger, motor element 25 can be the shape that cylindrical shape, square tube shape etc. have more certain cavity, and such motor element 25 is in cylinder Multiple eyeglasses 241 can be preferably arranged in dress, and can preferably protect eyeglass 241 in cavity, making eyeglass 241 be not susceptible to shake It is dynamic.
In addition, in the example in figure 7, between multiple eyeglasses 241 are held on two intermediate plates 252 by motor element 25, both had Standby certain stability, can also reduce the weight of motor element 25, can reduce needed for 27 drive motion element 25 of driving mechanism Power, and the design difficulty of motor element 25 is relatively low, and eyeglass 241 is also easier to be set on motor element 25.
Certainly, motor element 25 is not limited to tubular mentioned above and two intermediate plates 252, in other implementations, Motor element 25 such as may include that three pieces, four more intermediate plates 252 form more firm structure or a piece of intermediate plate 252 in this way More simple structure;Or has cavity for cuboid, round etc. to house the various regular or irregular of eyeglass 241 Shape.Under the premise of ensureing 10 normal imaging of imaging modules and operation, specific choice.
Complementary metal oxide semiconductor (CMOS, Complementary Metal may be used in first imaging sensor 26 Oxide Semiconductor) photosensitive element or charge coupled cell (CCD, Charge-coupled Device) photosensitive member Part.
In some embodiments, driving mechanism 27 is electromagnetic drive mechanism, drive mechanism or memorial alloy driving Mechanism.
Specifically, electromagnetic drive mechanism includes magnetic field and conductor, if magnetic field in the conductor can relative to conductor motion Induced current is generated, induced current makes conductor be acted on by Ampere force, and Ampere force makes conductor motion, and conductor herein is The part for driving motor element 25 to move in electromagnetic drive mechanism;Drive mechanism, the inverse piezoelectricity based on piezoceramic material Effect:If applying voltage to piezoelectric material, mechanical stress is generated, i.e., is changed between electric energy and mechanical energy, control is passed through It makes its mechanically deform and generates rotation or linear motion, have the advantages that simple in structure, low speed.
Characteristic of the driving of memorial alloy driving mechanism based on marmem:Marmem is a kind of special Alloy, once so that it has been remembered any shape, though it is deformed, but when being heated to a certain proper temperature, it can restore Shape before to deformation achievees the purpose that driving with this, has the characteristics that displacement is rapid, direction is free.
Referring to Fig. 6, further, the first imaging modules 20 further include driving device 28, and driving device 28 is used for Apply the driving force for deviateing shaft 29,29 rotation around the shaft of drive force mounting base 23, so that first to mounting base 23 Imaging modules 20 realize the optical anti-vibration on the optical axis direction of light inlet 211.
In this way, since driving device 28 is to the driving force of the application deviation shaft 29 of mounting base 23, to make the first imaging mould Group 20 realizes the optical anti-vibration on 211 optical axis direction of light inlet and can improve the precision of stabilization.
It please join Fig. 5 and Fig. 6, for the convenience of description, the width direction of the first imaging modules 20 is defined as X to height side To Y-direction is defined as, length direction is defined as Z-direction.The optical axis of light inlet 211 is Y-direction, the sense of the first imaging sensor 26 as a result, Light direction is Z-direction, the axial direction of shaft 29 be X to.
28 drive installation seat 23 of driving device rotates so that reflecting element 22 around X to rotation so that the first imaging mould Group 20 realizes the effect of Y-direction optical anti-vibration.In addition, axial movement of 28 drive installation seat 23 of driving device along shaft 29, to So that the first imaging modules 20 realize effects of the X to optical anti-vibration.In addition, the first Lens assembly 24 can be along Z-direction to realize First Lens assembly 24 is focused on the first imaging sensor 26.
Specifically, around X to when rotation, the light that reflecting element 22 reflects moves reflecting element 22 in Y-direction, so that First imaging sensor 26 forms different images to realize the stabilization effect of Y-direction in Y-direction.Reflecting element 22 is along X to shifting When dynamic, the light that reflecting element 22 reflects is moved up in X, so that the first imaging sensor 26 is upwardly formed difference in X Image with realize X to stabilization effect.
In some embodiments, the direction of driving force is the tangential of shaft 29.In this way, driving force can make mounting base 23 29 movements around the shaft, to drive 29 rotation around the shaft of reflecting element 22.
Referring to Fig. 6, in some embodiments, driving device 28 includes magnetic element 282 and coil 284.Magnetic Property element 282 be arranged in mounting base 23, coil 284 relative to magnetic element 282 be arranged in shell 21.Coil 284 is for applying It is acted on magnetic element 282 after making alive and generates driving force.In this way, the drive installation seat by way of electromagnetism of driving device 28 23 rotations.
In the example of fig. 6, driving device 28 is provided with coil 284 in the bottom of shell 21, is fixed in mounting base 23 Corresponding electromagnetic plate 282.The side wall of shell 21 is also equipped with coil 284, and corresponding electricity is fixed in mounting base 23 Magnetic sheet 282.After the energization of coil 284, coil 284 can generate magnetic field to drive electromagnetic plate 282 to move, to drive mounting base 23 and reflecting element 22 rotate together.
Referring to Fig. 7, in some embodiments, driving device 28 includes the piezoelectric element of connection mounting base 23 286, piezoelectric element 286 after applying voltage for generating driving force.In this way, driving device 28 can be by way of Piezoelectric Driving Drive installation seat 23 moves.
In addition, driving device 28 can also be moved by memory alloy driven mode drive installation seat 23.Piezoelectric Driving Mode and memory alloy driven mode please join foregoing description, details are not described herein.
5 are please referred to Fig.1, in some embodiments, the quantity of driving force is two, and the direction of one of driving force is The optical axis direction of light inlet 211, the optical axis direction of the direction of another driving force perpendicular to light inlet 211.As shown in fig. 6, its In the direction of a driving force be Y-direction, the direction of another driving force is Z-direction.
Specifically, the size of two driving forces can be equal, can not also be equal.Two driving forces can be by above-mentioned The mode of electromagnetic drive, the mode of Piezoelectric Driving, memory alloy driven mode or other modes generate.It is appreciated that peace Influence of the seat 23 due to being driven power is filled, 29 can be rotated around the shaft, the mounting base 23 for being applied with driving force is stablizing it Afterwards, 23 stress balance of mounting base, the angle stabilization that reflecting element 22 deflects.
When there are two driving force, one in two driving forces can be regard as power, so that reflecting element 22 rotates Stabilization is realized to preset position, and using another in two driving forces as restoring force, so that the reflecting element 22 of deflection Go back to original position.
In one example, as shown in figure 15, there are two driving forces, i.e. F1 and F2 for the application of reflecting element 22, when reflective member It, can be using F1 as power, using F2 as restoring force when part 22 needs to rotate counterclockwise;When reflecting element 22 needs to revolve clockwise It, can be using F2 as power, using F1 as restoring force when turning.
6 are please referred to Fig.1, when driving force is single, the elastic force that 287 deformation of spring generates can be used as restoring force. In the example shown in Figure 16, for reflecting element 22 at home position, the state of spring 287 is original state, in other words, reflective At home position, spring 287 is not both stretched or is not compressed element 22, without deformation also without elastic force.
When reflecting element 22 needs to rotate counterclockwise, apply power F3 on reflecting element 22, reflecting element 22 rotates Simultaneously compressed spring 287 can remove F3 when reflecting element 22 needs to be returned to home position axis 29 for rotation counterclockwise, and The spring 287 of compression generates elastic force to push reflecting element 22 29 to be rotated clockwise to home position around the shaft.Certainly, at other Embodiment in, reflecting element 22 at home position, spring 287 may be at compressive state can also be in stretch shape State.
Referring to Fig. 9, in present embodiment, the second imaging modules 30 are vertical mirror head mould group, certainly, in other embodiment party In formula, the second imaging modules 30 can also periscope type lens module.Second imaging modules 30 include the second Lens assembly 31 and the Two imaging sensors 32, the second Lens assembly 31 is for light to be imaged on the second imaging sensor 32, the second imaging modules The optical axis coincidence of 30 incident light axis and the second Lens assembly 31.
In present embodiment, the second imaging modules 30 are tight shot module, therefore, the eyeglass of the second Lens assembly 31 241 is less, so that 30 height of the second imaging modules is relatively low, is conducive to the thickness for reducing electronic device 1000.
The type of second imaging sensor 32 can be as the type of the first imaging sensor 26, and details are not described herein.
In summary, the first imaging modules 20 of the application embodiment include offer the shell 21 of light inlet 211 with And it is arranged at reflecting element 22, mounting base 23 and the first imaging sensor 26 in shell 21.Reflecting element 22 is fixed on peace Fill on seat 23, reflecting element 22 for reached after being turned to from the incident incident light of light inlet 211 first imaging sensor 26 with The first imaging sensor 26 is set to sense the incident light outside the first imaging modules 20, mounting base 23 can rotate relative to shell 21 Axis 29 rotates, the optical axis for being axially perpendicular to light inlet 211 of shaft 29.First imaging modules 20 further include driving device 28, are driven Dynamic device 28 is used to apply to mounting base 23 driving force for deviateing shaft 29, and drive force mounting base 23 29 rotates around the shaft, So that the first imaging modules 20 realize the optical anti-vibration on 29 direction of optical axis of light inlet 211.
In this way, since driving device 28 is to the driving force of the application deviation shaft 29 of mounting base 23, to make the first imaging mould Group 20 realizes the optical anti-vibration on 211 optical axis direction of light inlet and can improve the precision of stabilization.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While there has been shown and described that presently filed embodiment, it will be understood by those skilled in the art that: Can these embodiments be carried out with a variety of variations in the case of not departing from the principle and objective of the application, modification, replace and become Type, scope of the present application are limited by claim and its equivalent.

Claims (14)

1. a kind of imaging modules, which is characterized in that including:
Shell, the shell offer light inlet;With
Reflecting element, mounting base and the imaging sensor being arranged in the shell, the reflecting element are fixed on the peace Fill on seat, the reflecting element for reaching described image sensor after being turned to from the incident light of light inlet incidence so that Described image sensor senses the incident light outside the imaging modules, the mounting base can relative to the shell around Shaft rotates, the optical axis for being axially perpendicular to the light inlet of the shaft;
The imaging modules further include driving device, and the driving device, which is used to apply to the mounting base, deviates the shaft Driving force, mounting base described in the drive force are rotated around the shaft so that the imaging modules realize it is described into Optical anti-vibration on the optical axis direction of optical port.
2. imaging modules as described in claim 1, which is characterized in that the driving device includes connecting the pressure of the mounting base Electric device, the piezoelectric element after applying voltage for generating the driving force.
3. imaging modules as described in claim 1, which is characterized in that the driving device includes:
Magnetic element in the mounting base is set;With
Relative to the magnetic element, the coil in the shell is set, the coil for apply after voltage with the magnetic member Part acts on and generates the driving force.
4. imaging modules as described in claim 1, which is characterized in that the direction of the driving force is the tangential of the shaft.
5. imaging modules as claimed in claim 4, which is characterized in that the quantity of the driving force is two, one of institute The direction for stating driving force is the optical axis direction of the light inlet, and the direction of another driving force is perpendicular to the light inlet Optical axis direction.
6. imaging modules as described in claim 1, which is characterized in that the reflecting element has:
Close to and towards the incidence surface of the light inlet;
Far from the light inlet and the shady face opposite with the incidence surface;
The reflective surface of the incidence surface and the shady face is connected, the reflective surface is obliquely installed relative to the incidence surface;With
The light-emitting surface of the incidence surface and the shady face is connected, the light-emitting surface is disposed opposite to each other with the reflective surface.
7. imaging modules as claimed in claim 6, which is characterized in that the incidence surface is arranged in parallel with the shady face.
8. imaging modules as described in claim 1, which is characterized in that the imaging modules further include:
Motor element that is in described image sensor side and being contained in the shell is set;
The Lens assembly being fixed on the motor element;With
The driving mechanism of the shell and the motor element is connected, the driving mechanism is for driving the motor element along institute State the mobile imaging so that the Lens assembly is focused in described image sensor of optical axis of Lens assembly.
9. imaging modules as claimed in claim 8, which is characterized in that the motor element is cylindrical in shape, in the Lens assembly Multiple eyeglasses be fixed in the motor element along the axially spaced-apart of the motor element;Or
The motor element includes two intermediate plates, and the Lens assembly is folded between described two intermediate plates.
10. a kind of CCD camera assembly, which is characterized in that including:
Claim 1-9 any one of them imaging modules;With
Decoration, the decoration are located above the light inlet of the imaging modules.
11. CCD camera assembly as claimed in claim 10, which is characterized in that in the width direction of the imaging modules, institute It states shell and is formed in the side of the light inlet fluted, the decoration is partly caught in the groove, the decoration It is formed with through-hole, the light inlet is exposed by the through-hole, and the imaging modules acquire external image by the through-hole.
12. CCD camera assembly as claimed in claim 11, which is characterized in that the shell includes roof and from the roof The side wall that extends to form of side, the light inlet is formed in the roof, and the groove is formed in the roof and the side The junction of wall, the decoration are resisted against on the roof.
13. CCD camera assembly as claimed in claim 12, which is characterized in that the quantity of the side wall is two, the roof Including two opposite sides, each self-corresponding one of side wall side extends, each side wall and institute The junction for stating roof is each formed with the groove.
14. a kind of electronic device, which is characterized in that including:
Casing;With
Claim 10-13 any one of them CCD camera assemblies, the CCD camera assembly setting is on the housing.
CN201810829417.7A 2018-07-25 2018-07-25 Imaging module, camera assembly and electronic device Active CN108600599B (en)

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