CN108766867B - Semiconductor chip production process - Google Patents
Semiconductor chip production process Download PDFInfo
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- CN108766867B CN108766867B CN201810532937.1A CN201810532937A CN108766867B CN 108766867 B CN108766867 B CN 108766867B CN 201810532937 A CN201810532937 A CN 201810532937A CN 108766867 B CN108766867 B CN 108766867B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Abstract
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor chip production process, which comprises the following steps: putting the wafer on a grinding machine and grinding the wafer into a mirror surface; sending the wafer into a high-temperature diffusion furnace for oxidation treatment; sending the wafer into a photoresist homogenizing device and coating photoresist; sending the wafer into a photoetching machine for exposure and development; sending the wafer into an etching machine for plasma etching; feeding the wafer into a high-temperature furnace for doping; according to the glue homogenizing device, the glue homogenizing plate is arranged above the workbench, the first motor drives the glue homogenizing plate to stably rotate, the first motor and the glue homogenizing plate are driven by the electric cylinder to move downwards at a constant speed, and the glue homogenizing plate uniformly spreads glue on the surface of a wafer, so that uniform and stable glue homogenizing is realized; through the mutual cooperation of a sliding block and the air blowing pipe, the dust on the surface of the workbench is blown to the periphery, and then is carried out by upward air flow jetted by the air blowing groove.
Description
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor chip production process.
Background
Wafers refer to silicon chips used in the fabrication of silicon semiconductor integrated circuits, wafers are carriers used in the production of integrated circuits, and in general, wafers refer to monocrystalline silicon wafers, which are the most commonly used semiconductor materials. The photoetching process comprises the steps of wafer photoresist homogenizing, prebaking, exposure, developing, film hardening, corrosion, photoresist removing and the like, wherein the photoresist is homogenized in order to ensure that the photoresist distributed on the wafer is uniformly distributed and can reach a certain thickness, so that the photoresist on the surface of the wafer can obtain proper light sensitivity during exposure; wherein usually, the motor is adopted to drive the wafer adsorbed on the vacuum chuck to rotate during glue homogenizing, so that the glue is uniformly distributed on the wafer under the action of centrifugal force, and the coating thickness of the glue film can be controlled according to the speed of a rotating shaft of the motor. However, since the worktable may not be in a horizontal state during installation, and thus the vacuum chuck is not in a horizontal state, when the motor rotates, the centrifugal force generated by the chuck is not in a horizontal plane direction, so that the distribution of the coating adhesive is not uniform, which results in non-uniform thickness of the adhesive layer on the wafer, thereby greatly affecting the subsequent photolithography process, and thus an alternative method for realizing the adhesive leveling scheme is urgently needed.
Some technical schemes for manufacturing semiconductor silicon wafers also appear in the prior art, for example, a chinese patent with application number 201721240564.8 discloses a wafer spin coater for a lithography machine, which comprises a worktable, a motor fixedly connected to the worktable, a vacuum chuck horizontally arranged on a main shaft of the motor, and an L-shaped supporting plate; the front side of the workbench is provided with a horizontal ruler; the left side surface of the workbench is rotatably connected to the inner side surface of the vertical plate part of the supporting plate through a hinge shaft; the inner side surface of the vertical plate part of the supporting plate is also provided with two horizontally arranged guide rails and a threaded rod which is positioned between the two guide rails and is horizontally arranged, wherein one end of the threaded rod is rotatably connected to the inner side surface of the vertical plate part of the supporting plate through a bearing;
according to the glue homogenizing process in the technical scheme, the whole workbench is in a horizontal state by adjusting the threaded rod, so that the uniform thickness of the coating glue is ensured, but the motor above the workbench in the scheme can vibrate due to rotation, so that the sucking discs above the workbench shake, and the uniformity of a glue homogenizing layer is influenced; the fan arranged above the wafer can only ensure that the air above the wafer flows, and dust is not blocked outside from the source; the glue is homogenized in a centrifugal mode, the glue solution is thrown away by using centrifugal force, the surface of the homogenized glue cannot be guaranteed to be a smooth plane, and the quality of the wafer cannot be guaranteed.
Disclosure of Invention
In order to make up for the defects of the prior art, the glue homogenizing device used in the process is provided with the glue homogenizing plate above the workbench, the first motor drives the glue homogenizing plate to stably rotate, the electric cylinder drives the first motor and the glue homogenizing plate to uniformly move downwards, and the glue homogenizing plate uniformly spreads glue on the surface of a wafer, so that uniform and stable glue homogenizing is realized; the air blowing grooves are formed in the edges of the top plate of the workbench, and high-pressure air flow blown out from the air blowing grooves is sprayed onto the pneumatic expansion plate, so that a closed space formed by air flow is formed above the workbench, and dust is prevented from entering the workbench in the glue homogenizing process; through mutually supporting of a slider and gas blow pipe, realized blowing the dust on workstation surface to all around, and then the realization is blown the dust of the air current that jets to the gas blow tank and is taken out by ascending air current, blows to the dust of backup pad riser and blows to in the air along the dust board.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a semiconductor chip production process, which comprises the following steps:
the method comprises the following steps: putting the wafer on a grinding machine and grinding the wafer into a mirror surface;
step two: sending the wafer in the step one into a high-temperature diffusion furnace for oxidation treatment;
step three: sending the wafer in the second step into a photoresist homogenizing device and coating photoresist;
step four: sending the wafer in the third step into a photoetching machine for exposure and development;
step five: sending the wafer in the fourth step into an etching machine for plasma etching;
step six: feeding the wafer in the fifth step into a high-temperature furnace for doping;
the glue homogenizing device in the third step comprises a supporting plate, a dust blocking module, an electric cylinder, a first motor, a rotating rod, a glue homogenizing plate, a workbench and a vacuum generator, wherein a base of the electric cylinder is fixedly connected below a top plate of the supporting plate; the end of the cylinder rod of the electric cylinder is fixedly connected with the non-output end of the first motor; the end of the rotating shaft of the first motor is fixedly connected with one end of a rotating rod; the rotating rod is hinged to one end of the glue homogenizing plate, and a torsional spring is arranged at the hinged position; the other end of the glue homogenizing plate is provided with an arc surface; a workbench is arranged below the glue homogenizing plate; the left side surface of the workbench is fixedly connected to the vertical plate of the supporting plate; the workbench is a cuboid, a cavity is formed in the workbench, and a top plate of the workbench is provided with a group of air outlet holes; a vacuum generator is arranged below the middle part of the bottom plate of the workbench, and a check valve is arranged below the right side of the bottom plate of the workbench; a dust blocking module is arranged between the workbench and the top plate of the supporting plate; the dust blocking module is used for preventing surrounding dust from entering between the manual workbench and the top plate of the supporting plate; placing the wafer on a workbench, starting a switch communicated with a vacuum generator, and adsorbing the wafer on the upper surface of the workbench; the first motor drives the rotating rod to rotate, the rotating rod drives the glue homogenizing plate to rotate, the glue homogenizing plate swings upwards while rotating, and when the rotating speed of the first motor is stable, the glue homogenizing plate is also stable in a fixed plane; the electric cylinder drives the first motor and the glue homogenizing plate to move downwards, and when the glue homogenizing plate contacts the glue solution on the upper surface of the wafer, the glue homogenizing plate uniformly spreads the glue solution on the surface of the wafer.
The dust blocking module comprises an air blowing groove, a pneumatic telescopic plate and a dust blocking plate, wherein the air blowing groove is formed in the edge of a top plate of the workbench, and the air blowing groove is not formed in the edge of the left side of the workbench; the suspended side wall of the top plate of the supporting plate is fixedly connected with a pneumatic expansion plate; the pneumatic expansion plate is a multi-section ejection plate, and the pneumatic expansion plate is obliquely ejected upwards; a rectangular hole is formed in the position, close to the workbench, of the vertical plate of the supporting plate, and a dust baffle plate is hinged in the rectangular hole; the dust baffle plate is used for removing dust blown to the vertical plate of the supporting plate from the gluing surface; high-pressure compressed air is introduced into the air blowing groove, and a closed space formed by air flow is formed above the workbench to prevent dust from entering in the glue homogenizing process; the pneumatic expansion plate is characterized in that air flow with dust is upwards sprayed onto the pneumatic expansion plate and outwards sprayed out after being blocked by the pneumatic expansion plate which is obliquely arranged, the air flow is blocked for a long time to cause dust to be gathered on the surface of the pneumatic expansion plate, when glue spreading is stopped, the pneumatic expansion plate shrinks, the inner surface and the outer surface of each section of the pneumatic expansion plate can mutually scrape the dust on the surface, and the pneumatic expansion plate is quickly cleaned; one side of the vertical plate of the supporting plate is not provided with a pneumatic expansion plate and an air blowing groove, and the dust blocking plate is arranged to remove dust blown to the vertical plate of the supporting plate from the gluing surface.
A cavity is arranged in the glue homogenizing plate, a group of through holes are arranged on the surface of one glue homogenizing side of the glue homogenizing plate, and the through holes are horizontally arranged; the air guide plate is hinged at the position, close to the through hole, of the glue homogenizing plate, and a torsion spring is arranged at the hinged position; compressed air is introduced into the cavity inside the glue homogenizing plate, and air is blown through the horizontally arranged air holes to blow away dust above the wafer while the glue is homogenized by the glue homogenizing plate, so that the cleanness of the glue is ensured; the air guide plate can change the direction and the size of the air flow.
A hole in the center of the top plate of the workbench is a first-number through hole; the first through hole is used for blowing air to the upper surface of the workbench; the first through hole is internally and fixedly connected with a gas blowing cylinder; a first cylindrical cavity is formed in the lower end of the air blowing cylinder, and a first sliding block is installed in the first cylindrical cavity in a sliding mode; a spring is arranged below the first sliding block; the lower end of the air blowing cylinder is provided with a through hole, the upper end surface of the air blowing cylinder is provided with a first blind hole, and an air blowing pipe is arranged in the first blind hole in a sliding manner; a spring is arranged below the air blowing pipe; a cavity is arranged in the air blowing pipe, the lower end of the air blowing pipe is opened, and a group of through holes are formed in the cylindrical surface of the air blowing pipe; a connecting air hole is formed in the right side above the first cylindrical cavity and communicated with the middle of the first blind hole; the outer wall of the air blowing cylinder, which is close to the right side above the first cylindrical cavity, is provided with a one-way valve; one end of the one-way valve is communicated with the connecting air hole above the first cylindrical cavity, and the other end of the one-way valve is connected to the outside air through an air pipe; the wafer is placed on the workbench, the wafer presses the upper end of the air blowing pipe, and the air blowing pipe compresses the spring to move downwards; the upper end of the first sliding block is communicated with the external air through a one-way valve, a switch communicated with a vacuum generator is started, and the first sliding block compresses a spring to move downwards; after glue homogenizing is finished, a switch of a vacuum generator is closed, a wafer is taken down, an air blowing pipe moves upwards under the action of spring force, a connecting air hole is opened when the air blowing pipe moves to the uppermost end, a first sliding block moves upwards under the extrusion of the spring, air above the first sliding block is pressed into a first blind hole through an upper connecting air hole and is ejected through an air blowing opening on the cylindrical surface of the air blowing pipe, and the ejected air flow blows dust on the surface of a workbench to the periphery; the dust blown to the airflow jetted by the air blowing groove is carried out by the upward airflow, and the dust blown to the vertical plate of the supporting plate is blown to the air along the dust blocking plate.
All holes outside the first through hole on the top plate of the workbench are second through holes; the second through hole is used for adsorbing the wafer; a cylinder sleeve is fixedly connected below the second through hole; the cylinder sleeve is cylindrical, a second cylindrical cavity is arranged in the cylinder sleeve, a through hole is formed below the second cylindrical cavity, and a first exhaust hole is formed in the middle of the right side of the second cylindrical cavity; a conical sliding block is arranged in the second cylindrical cavity in a sliding manner; a spring is arranged below the conical sliding block; a second blind hole is formed in the upper plane of the conical sliding block, and an air hole is formed below the second blind hole and communicated with the second cylindrical cavity; a brush rod is arranged in the second blind hole; the brush rod is connected with the second blind hole through a ball screw, and a spring is arranged below the brush rod; a group of hairbrushes are arranged on the cylindrical surface at the upper end of the hairbrush rod; the wafer is placed on the workbench, a switch communicated with a vacuum generator is started, and the brush rod rotates along the ball screw and simultaneously compresses the spring to move downwards; the conical sliding block compresses the spring to move downwards, when a cavity above the conical sliding block is communicated with the interior of the workbench through a first exhaust hole, the conical sliding block moves upwards under the action of the spring force, the brush rod rotates to move upwards, the gap disappears, when the pressure above the conical sliding block is lost, the brush rod rotates to move downwards, the conical sliding block moves downwards again, the gap between the conical surface of the conical sliding block and the first exhaust hole is opened again, and the conical sliding block and the brush rod realize vertical reciprocating motion; after the glue is homogenized, a switch of the vacuum generator is closed, the wafer is taken down, the brush rod rotates and moves upwards under the action of the spring force, the conical sliding block moves upwards under the action of the spring force, dust in the second through hole is brushed and then is taken out of the through hole, and then air flow blown out by the air blowing pipe is sent to the air.
The invention has the following beneficial effects:
1. according to the semiconductor chip production process, the glue homogenizing device used in the process is provided with the glue homogenizing plate above the workbench, the first motor drives the glue homogenizing plate to stably rotate, the first motor and the glue homogenizing plate are driven by the electric cylinder to move downwards at a constant speed, and the glue homogenizing plate uniformly spreads glue liquid on the surface of a wafer, so that uniform and stable glue homogenizing is realized.
2. According to the semiconductor chip production process, the air blowing grooves are formed in the edge of the top plate of the workbench, and high-pressure air flow blown out from the air blowing grooves is sprayed onto the pneumatic expansion plate, so that a closed space formed by air flow is formed above the workbench, and dust is prevented from entering the workbench in the glue homogenizing process.
3. According to the semiconductor chip production process, the glue homogenizing device used in the process blows off dust above the wafer through the horizontal air holes formed in the glue homogenizing side of the glue homogenizing plate, so that the surface of the wafer is cleaned during glue homogenizing.
4. According to the semiconductor chip production process, the glue homogenizing device used in the process is provided with the air blowing cylinder in the through hole, the first sliding block and the air blowing pipe are arranged in the air blowing cylinder, and the first sliding block and the air blowing pipe are matched with each other, so that dust on the surface of the workbench is blown to the periphery, the dust blown to the air blowing groove and sprayed out of air flow is brought out by upward air flow, and the dust blown to the vertical plate of the supporting plate is blown to the air along the dust blocking plate.
5. According to the semiconductor chip production process, the brush rod is arranged in the second through hole, the conical sliding block is arranged below the second through hole, and the conical sliding block and the brush rod are matched with each other, so that dust in the second through hole is brushed and then brought out of the through hole, and airflow blown out by the air blowing pipe is sent to high-speed airflow blown out by the peripheral air blowing grooves and then brought out.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a front view of the glue spreading device of the present invention;
FIG. 3 is an enlarged view at A in FIG. 2;
FIG. 4 is an enlarged view at B in FIG. 2;
FIG. 5 is an enlarged view at C in FIG. 2;
in the figure: the device comprises a supporting plate 1, a dust blocking module 2, an air blowing groove 21, a pneumatic expansion plate 22, a dust blocking plate 23, an electric cylinder 3, a first motor 4, a rotating rod 5, a glue homogenizing plate 6, an air guide plate 61, a workbench 7, a first through hole 71, an air blowing cylinder 72, a first cylindrical cavity 721, a first blind hole 722, a connecting air hole 723, a first sliding block 73, an air blowing pipe 74, a second through hole 75, a cylinder sleeve 76, a second cylindrical cavity 761, a first exhaust hole 762, a conical sliding block 77, a second blind hole 771, a hairbrush rod 78, a hairbrush 781 and a vacuum generator 8.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 5, a semiconductor chip manufacturing process according to the present invention includes the following steps:
the method comprises the following steps: putting the wafer on a grinding machine and grinding the wafer into a mirror surface;
step two: sending the wafer in the step one into a high-temperature diffusion furnace for oxidation treatment;
step three: sending the wafer in the second step into a photoresist homogenizing device and coating photoresist;
step four: sending the wafer in the third step into a photoetching machine for exposure and development;
step five: sending the wafer in the fourth step into an etching machine for plasma etching;
step six: feeding the wafer in the fifth step into a high-temperature furnace for doping;
the glue homogenizing device in the third step comprises a supporting plate 1, a dust blocking module 2, an electric cylinder 3, a first motor 4, a rotating rod 5, a glue homogenizing plate 6, a workbench 7 and a vacuum generator 8, wherein a base of the electric cylinder 3 is fixedly connected below a top plate of the supporting plate 1; the end of the cylinder rod of the electric cylinder 3 is fixedly connected with the non-output end of the first motor 4; the end of the rotating shaft of the first motor 4 is fixedly connected with one end of a rotating rod 5; the rotating rod 5 is hinged to one end of the glue homogenizing plate 6, and a torsional spring is arranged at the hinged position; the other end of the glue homogenizing plate 6 is provided with an arc surface; a workbench 7 is arranged below the glue homogenizing plate 6; the left side surface of the workbench 7 is fixedly connected to a vertical plate of the supporting plate 1; the workbench 7 is a cuboid, a cavity is arranged in the workbench 7, a top plate of the workbench 7 is provided with a group of air outlet holes, and the through holes are arranged in a circular area; a vacuum generator 8 is arranged below the middle part of the bottom plate of the workbench 7, and a check valve is arranged below the right side of the bottom plate of the workbench 7; a dust blocking module 2 is arranged between the workbench 7 and the top plate of the supporting plate 1; the dust blocking module 2 is used for preventing surrounding dust from entering between the worktable 7 and the top plate of the supporting plate 1; placing the wafer on the workbench 7, starting a switch communicated with the vacuum generator 8, and adsorbing the wafer on the upper surface of the workbench 7; the first motor 4 drives the rotating rod 5 to rotate, the rotating rod 5 drives the glue homogenizing plate 6 to rotate, the glue homogenizing plate 6 swings upwards while rotating, and when the rotating speed of the first motor 4 is stable, the glue homogenizing plate 6 is also stable in a fixed plane; the electric cylinder 3 drives the first motor 4 and the glue homogenizing plate 6 to move downwards, and when the glue homogenizing plate 6 contacts the glue solution on the upper surface of the wafer, the glue homogenizing plate 6 uniformly spreads the glue solution on the surface of the wafer.
As an embodiment of the invention, the dust-blocking module 2 comprises an air blowing groove 21, a pneumatic telescopic plate 22 and a dust-blocking plate 23, wherein the air blowing groove 21 is arranged at the edge of the top plate of the workbench 7, and the air blowing groove 21 is not arranged at the edge of the left side of the workbench 7; the suspended side wall of the top plate of the supporting plate 1 is fixedly connected with a pneumatic expansion plate 22; the pneumatic expansion plate 22 is a multi-section ejection plate, and the pneumatic expansion plate 22 is obliquely ejected upwards; a rectangular hole is formed in the position, close to the workbench 7, of the vertical plate of the supporting plate 1, and a dust baffle plate 23 is hinged in the rectangular hole; the dust baffle plate 23 is used for removing dust blown to the vertical plate of the supporting plate 1 from the gluing surface; high-pressure compressed air is introduced into the air blowing groove 21, and a closed space formed by air flow is formed above the workbench 7, so that dust is prevented from entering in the glue homogenizing process; the air flow with dust is upwards sprayed onto the pneumatic expansion plate 22, and is sprayed outwards after being blocked by the pneumatic expansion plate 22 which is obliquely arranged, so that the dust is gathered on the surface of the pneumatic expansion plate 22 due to the long-term blocking of the air flow, when the glue spreading is stopped, the pneumatic expansion plate 22 contracts, and the inner surface and the outer surface of each section of the pneumatic expansion plate 22 can mutually scrape the dust on the surface, so that the pneumatic expansion plate 22 can be quickly cleaned; the pneumatic expansion plate 22 and the air blowing groove 21 are not arranged on one side of the vertical plate of the supporting plate 1, and the dust blocking plate 23 is arranged to remove dust blown to the vertical plate of the supporting plate 1 from the gluing surface.
As an embodiment of the invention, a cavity is arranged in the glue homogenizing plate 6, a group of through holes are arranged on the surface of one glue homogenizing side of the glue homogenizing plate 6, and the through holes are horizontally arranged; the air guide plate 61 is hinged at the position of the glue homogenizing plate 6 close to the through hole, and a torsion spring is arranged at the hinged position; compressed air is introduced into the cavity inside the glue homogenizing plate 6, and air is blown through the horizontally arranged air holes to blow away dust above the wafer while the glue homogenizing plate 6 homogenizes the glue, so that the cleanness during glue homogenizing is ensured; the air guide plate 61 can realize changing the direction and the size of the air flow.
As an embodiment of the present invention, the hole at the center of the top plate of the working table 7 is a one-number through hole 71; the first through hole 71 is used for blowing air to the upper surface of the workbench 7; the first through hole 71 is internally and fixedly connected with a gas blowing cylinder 72; a first cylindrical cavity 721 is formed in the lower end of the air blowing cylinder 72, and a first sliding block 73 is slidably mounted in the first cylindrical cavity 721; a spring is arranged below the first sliding block 73; the lower end of the air blowing cylinder 72 is provided with a through hole, the upper end surface of the air blowing cylinder 72 is provided with a first blind hole 722, and the air blowing pipe 74 is arranged in the first blind hole 722 in a sliding way; a spring is arranged below the air blowing pipe 74; a cavity is arranged in the air blowing pipe 74, the lower end of the air blowing pipe 74 is opened, and a group of through holes are formed in the cylindrical surface of the air blowing pipe 74; a connecting air hole 723 is arranged on the right side above the first cylindrical cavity 721 and communicated with the middle of the first blind hole 722; the outer wall of the air blowing cylinder 72, which is close to the right side above the first cylindrical cavity 721, is provided with a one-way valve; one end of the one-way valve is communicated with a connecting air hole 723 above the first cylindrical cavity 721, and the other end of the one-way valve is connected to the outside air through an air pipe; the wafer is placed on the workbench 7, the wafer presses the upper end of the air blowing pipe 74, and the air blowing pipe 74 compresses the spring to move downwards; the upper end of the first sliding block 73 is communicated with the outside air through a one-way valve, a switch communicated with the vacuum generator 8 is started, and the first sliding block 73 compresses a spring to move downwards; after the glue homogenizing is finished, a switch of the vacuum generator 8 is closed, the wafer is taken down, the air blowing pipe 74 moves upwards under the action of spring force, the connecting air hole 723 is opened when the air blowing pipe moves to the uppermost end, the first sliding block 73 moves upwards under the extrusion of the spring, air above the first sliding block 73 is pressed into the first blind hole 722 through the upper connecting air hole 723 and is ejected through an air blowing opening in the cylindrical surface of the air blowing pipe 74, and the ejected air flow blows dust on the surface of the workbench 7 to the periphery; the dust of the air current blown to the air blowing grooves 21 is carried out by the upward air current, and the dust blown to the vertical plate of the supporting plate 1 is blown to the air along the dust blocking plate 23.
As an embodiment of the invention, all holes outside the first through hole (71) on the top plate of the workbench 7 are second through holes 75; the second through hole 75 is used for adsorbing a wafer; a cylinder sleeve 76 is fixedly connected below the second through hole 75; the cylinder sleeve 76 is cylindrical, a second cylindrical cavity 761 is arranged in the cylinder sleeve 76, a through hole is formed below the second cylindrical cavity 761, and a first exhaust hole 762 is formed in the middle of the right side of the second cylindrical cavity 761; a conical sliding block 77 is arranged in the second cylindrical cavity 761 in a sliding manner; a spring is arranged below the conical sliding block 77; a second blind hole 771 is formed in the upper plane of the conical sliding block 77, and an air hole is formed below the second blind hole 771 and communicated with the second cylindrical cavity 761; a brush rod 78 is arranged in the second blind hole 771; the brush rod 78 is connected with the second blind hole 771 through a ball screw, and a spring is arranged below the brush rod 78; a group of brushes 781 are arranged on the cylindrical surface at the upper end of the brush rod 78; the wafer is placed on the worktable 7, the switch communicated with the vacuum generator 8 is turned on, and the brush rod 78 rotates along the ball screw and simultaneously the compression spring moves downwards; the conical slide block 77 compresses the spring to move downwards, when a cavity above the conical slide block 77 is communicated with the inside of the workbench through the first exhaust hole 762, the conical slide block 77 moves upwards under the action of the spring force, the brush rod 78 rotates to move upwards, the gap disappears, when the pressure above the conical slide block 77 is lost, the brush rod 78 rotates to move downwards, the conical slide block 77 moves downwards again, the gap between the conical surface of the conical slide block 77 and the first exhaust hole 762 is opened again, and the conical slide block 77 and the brush rod 78 realize the up-and-down reciprocating motion; after the glue is homogenized, the switch of the vacuum generator 8 is closed, the wafer is taken down, the brush rod 78 rotates and moves upwards under the action of the spring force, the conical slide block 77 moves upwards under the action of the spring force, the dust in the second through hole 75 is brushed and then taken out of the hole, and then the air flow blown out by the air blowing pipe 74 is sent to the air.
When the vacuum cleaning device works, a wafer is placed on the workbench 7, glue solution is sprayed on the upper surface of the wafer, a switch communicated with the vacuum generator 8 is turned on, and the brush rod 78 rotates along the ball screw and meanwhile compresses the spring to move downwards; the conical slide block 77 compresses the spring to move downwards, when a cavity above the conical slide block 77 is communicated with the inside of the workbench through the first exhaust hole 762, the conical slide block 77 moves upwards under the action of the spring force, the brush rod 78 rotates to move upwards, the gap disappears, when the pressure above the conical slide block 77 is lost, the brush rod 78 rotates to move downwards, the conical slide block 77 moves downwards again, the gap between the conical surface of the conical slide block 77 and the first exhaust hole 762 is opened again, and the conical slide block 77 and the brush rod 78 realize the up-and-down reciprocating motion; when the wafer is placed on the worktable 7, the wafer presses the blow pipe 74, and the blow pipe 74 compresses the spring to move downwards; the upper end of the first sliding block 73 is communicated with the outside air through a one-way valve, and when a switch communicated with the vacuum generator 8 is started, the first sliding block 73 compresses a spring to move downwards; the first motor 4 drives the rotating rod 5 to rotate, the rotating rod 5 drives the glue homogenizing plate 6 to rotate, the glue homogenizing plate 6 swings upwards while rotating, and when the rotating speed of the first motor 4 is stable, the glue homogenizing plate 6 is also stable in a fixed plane; the electric cylinder 3 drives the first motor 4 and the glue homogenizing plate 6 to move downwards, and when the glue homogenizing plate 6 contacts the glue solution on the upper surface of the wafer, the glue homogenizing plate 6 uniformly spreads the glue solution on the surface of the wafer; compressed air is introduced into the cavity inside the glue homogenizing plate 6, and air is blown through the horizontally arranged air holes to blow away dust above the wafer while the glue homogenizing plate 6 homogenizes the glue, so that the cleanness during glue homogenizing is ensured; the air guide plate 61 can change the direction and the size of the air flow; after the glue is homogenized, a switch of the vacuum generator 8 is closed, the wafer is taken down, the brush rod 78 rotates and moves upwards under the action of spring force, the conical slide block 77 moves upwards under the action of spring force, the dust in the second through hole 75 is brushed and then taken out of the hole, and then the air flow blown out by the air blowing pipe 74 is sent to the air; the air blowing pipe 74 moves upwards under the action of spring force, the connecting air hole 723 is opened when the air blowing pipe 74 moves to the uppermost end, the first sliding block 73 is extruded by the spring to move upwards, air above the first sliding block 73 is pressed into the first blind hole 722 through the upper connecting air hole 723 and is ejected through an air blowing opening in the cylindrical surface of the air blowing pipe 74, and the ejected air flow blows dust on the surface of the workbench 7 to the periphery; the dust blown to the airflow jetted out from the air blowing groove 21 is carried out by the upward airflow, and the dust blown to the vertical plate of the supporting plate 1 is blown to the air along the dust blocking plate 23; the air current that has the dust upwards sprays pneumatic expansion plate 22 on, the pneumatic expansion plate 22 that sets up through the slope blocks to outwards spraying away, blocks for a long time that the air current leads to pneumatic expansion plate 22 surface gathering dust, when stopping even gluing, and pneumatic expansion plate 22 contracts, and the inside and outside surface of each section of pneumatic expansion plate 22 can strike off the dust on surface each other, has realized quick clean pneumatic expansion plate 22.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A semiconductor chip production process is characterized in that: the process comprises the following steps:
the method comprises the following steps: putting the wafer on a grinding machine and grinding the wafer into a mirror surface;
step two: sending the wafer in the step one into a high-temperature diffusion furnace for oxidation treatment;
step three: sending the wafer in the second step into a photoresist homogenizing device and coating photoresist;
step four: sending the wafer in the third step into a photoetching machine for exposure and development;
step five: sending the wafer in the fourth step into an etching machine for plasma etching;
step six: feeding the wafer in the fifth step into a high-temperature furnace for doping;
the glue homogenizing device in the third step comprises a supporting plate (1), a dust blocking module (2), an electric cylinder (3), a first motor (4), a rotating rod (5), a glue homogenizing plate (6), a workbench (7) and a vacuum generator (8), wherein a base of the electric cylinder (3) is fixedly connected below a top plate of the supporting plate (1); the end of the cylinder rod of the electric cylinder (3) is fixedly connected with the non-output end of the first motor (4); the rotating shaft end of the first motor (4) is fixedly connected with one end of a rotating rod (5); the rotating rod (5) is hinged to one end of the glue homogenizing plate (6), and a torsional spring is arranged at the hinged position; the other end of the glue homogenizing plate (6) is provided with an arc surface; a workbench (7) is arranged below the glue homogenizing plate (6); the left side surface of the workbench (7) is fixedly connected to a vertical plate of the support plate (1); the workbench (7) is a cuboid, a cavity is arranged in the workbench (7), and a top plate of the workbench (7) is provided with a group of air outlet holes; a vacuum generator (8) is arranged below the middle part of the bottom plate of the workbench (7), and a check valve is arranged below the right side of the bottom plate of the workbench (7); a dust blocking module (2) is arranged between the workbench (7) and the top plate of the support plate (1); the dust blocking module (2) is used for preventing surrounding dust from entering between the manual workbench (7) and the top plate of the supporting plate (1); a cavity is arranged in the glue homogenizing plate (6), a group of through holes are arranged on the surface of one glue homogenizing side of the glue homogenizing plate (6), and the through holes are horizontally arranged; the air guide plate (61) is hinged to the position, close to the through hole, of the glue homogenizing plate (6), and a torsion spring is arranged at the hinged position.
2. A semiconductor chip production process according to claim 1, characterized in that: the dust blocking module (2) comprises an air blowing groove (21), a pneumatic telescopic plate (22) and a dust blocking plate (23), wherein the air blowing groove (21) is arranged at the edge of a top plate of the workbench (7), and the air blowing groove (21) is not arranged at the left edge of the workbench (7); a pneumatic expansion plate (22) is fixedly connected to the suspended side wall of the top plate of the support plate (1); the pneumatic expansion plate (22) is a multi-section ejection plate, and the pneumatic expansion plate (22) is obliquely ejected upwards; a rectangular hole is formed in the position, close to the workbench (7), of the vertical plate of the supporting plate (1), and a dust baffle plate (23) is hinged in the rectangular hole; the dust blocking plate (23) is used for removing dust blown to the vertical plate of the supporting plate (1) from the gluing surface.
3. A semiconductor chip production process according to claim 1, characterized in that: a hole in the center of the top plate of the workbench (7) is a one-number through hole (71); the first through hole (71) is used for blowing air to the upper surface of the workbench (7); the first through hole (71) is internally and fixedly connected with a gas blowing cylinder (72); a first cylindrical cavity (721) is formed in the lower end of the air blowing cylinder (72), and a first sliding block (73) is arranged in the first cylindrical cavity (721) in a sliding manner; a spring is arranged below the first sliding block (73); the lower end of the air blowing cylinder (72) is provided with a through hole, the upper end surface of the air blowing cylinder (72) is provided with a first blind hole (722), and an air blowing pipe (74) is arranged in the first blind hole (722) in a sliding way; a spring is arranged below the air blowing pipe (74); a cavity is arranged in the air blowing pipe (74), the lower end of the air blowing pipe (74) is opened, and a group of through holes are formed in the cylindrical surface of the air blowing pipe (74); a connecting air hole (723) is formed in the right side above the first cylindrical cavity (721) and communicated with the middle of the first blind hole (722); the outer wall of the air blowing cylinder (72) close to the right side above the first cylindrical cavity (721) is provided with a one-way valve; the one-way valve is communicated with a connecting air hole (723) above the first cylindrical cavity (721), and the other end of the one-way valve is connected to the outside air through an air pipe.
4. A semiconductor chip production process according to claim 1, characterized in that: all holes on the outer side of the first through hole (71) on the top plate of the workbench (7) are second through holes (75); the second through hole (75) is used for adsorbing the wafer; a cylinder sleeve (76) is fixedly connected below the second through hole (75); the cylinder sleeve (76) is cylindrical, a second cylindrical cavity (761) is arranged in the cylinder sleeve (76), a through hole is formed below the second cylindrical cavity (761), and a first exhaust hole (762) is formed in the middle of the right side of the second cylindrical cavity (761); a conical sliding block (77) is arranged in the second cylindrical cavity (761) in a sliding manner; a spring is arranged below the conical sliding block (77); a second blind hole (771) is formed in the upper plane of the conical sliding block (77), and an air hole communicated with the second cylindrical cavity (761) is formed below the second blind hole (771); a brush rod (78) is arranged in the second blind hole (771); the brush rod (78) is connected with the second blind hole (771) through a ball screw, and a spring is arranged below the brush rod (78); a group of brushes (781) are arranged on the cylindrical surface at the upper end of the brush rod (78).
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| CN200991679Y (en) * | 2006-12-20 | 2007-12-19 | 沈阳芯源先进半导体技术有限公司 | Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus |
| CN102569610B (en) * | 2011-12-31 | 2015-05-27 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
| JP2015213111A (en) * | 2014-05-01 | 2015-11-26 | スリーエム イノベイティブ プロパティズ カンパニー | Sheet sticking method, sheet sticking device and wafer processing method |
| CN205238418U (en) * | 2015-11-07 | 2016-05-18 | 廖振连 | LED liquid silica gel packaging forming machine |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200991679Y (en) * | 2006-12-20 | 2007-12-19 | 沈阳芯源先进半导体技术有限公司 | Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus |
| CN102569610B (en) * | 2011-12-31 | 2015-05-27 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
| JP2015213111A (en) * | 2014-05-01 | 2015-11-26 | スリーエム イノベイティブ プロパティズ カンパニー | Sheet sticking method, sheet sticking device and wafer processing method |
| CN205238418U (en) * | 2015-11-07 | 2016-05-18 | 廖振连 | LED liquid silica gel packaging forming machine |
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