CN200991679Y - Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus - Google Patents
Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus Download PDFInfo
- Publication number
- CN200991679Y CN200991679Y CN 200620168334 CN200620168334U CN200991679Y CN 200991679 Y CN200991679 Y CN 200991679Y CN 200620168334 CN200620168334 CN 200620168334 CN 200620168334 U CN200620168334 U CN 200620168334U CN 200991679 Y CN200991679 Y CN 200991679Y
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- glue
- wafer
- floating plate
- magnet
- utility
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Abstract
The utility model relates to a glue evening technique of wafer in the semiconductor wafer processing, in particular to an upper cover structure of the glue evening unit of the glue evening equipment. The utility model comprises an upper floating tray which is arranged on the wafer and a rotating axis is arranged in the middle part; the tray is provided with an upper floating tray magnet. The utility model also comprises an upper cover which is connected with a cylinder and articulated with the rotating axis of the upper floating tray. The output axis of a rotating motor is provided with a sucking disc which matches with the wafer above the sucking disc; the sucking disc is provided with a sucking disc magnet which is at the same radius place of the upper floating tray magnet, and the polarities are opposite. The utility model can satisfy the requirement of the control of the film thickness leveling and the light carving glue dosage in the semiconductor wafer processing.
Description
Technical field
The utility model relates to the technology of in the semiconductor wafer process wafer being spared glue, a kind of superstructure of even glue unit of equipment for evenly dividing glue specifically.
Background technology
Sparing glue is an important technical process in semiconductor production process, and even glue is exactly on wafer or other carriers, is coated with last layer and adheres to well, suitable, the uniform photoresist film of thickness.Even glue generally adopts spin-coating method.It is to utilize under the surface tension acting in conjunction of centrifugal force and glue, and the photoresist of coating is formed the uniform glued membrane of thickness.The uniformity of film thickness is to estimate a major criterion of even glue and equipment for evenly dividing glue quality, and is even more good more.Forming the required photoresist amount of same glued membrane also is a major criterion estimating even glue and equipment for evenly dividing glue quality, and the photoresist consumption is few more good more.The parameter that influences film thickness uniformity and photoresist consumption is a lot, as: the air-flow around reaching on wafer or other carriers is a significant effects parameter.Wherein: nearly all do not use lid when sparing glue in semiconductor production process, or only use common flat board to cover on the anti-splash cup (CUP), the film thickness uniformity is bad, and the photoresist consumption is also more.
The utility model content
In order to overcome above-mentioned deficiency, the purpose of this utility model provides and a kind ofly satisfies semiconductor wafer processing to film thickness uniformity and the control of photoresist consumption superstructure of the even glue unit of the equipment for evenly dividing glue of reasonable servo-actuated all.
To achieve these goals, technical solutions of the utility model: comprise floating plate, revolve and put on wafer that a rotating shaft is established at the middle part; Floating plate magnet is installed on the dish; Loam cake links to each other with cylinder, and articulates by the rotating shaft of bearing and last floating plate; The electric rotating machine output shaft is equipped with a sucker, and sucker cooperates with the wafer absorption of its top; Suction magnet is installed on the sucker, with the last floating plate magnet of installing on the last floating plate in same radius, polarity is relative.
The present invention has following advantage:
The present invention adds a lid of rotation synchronously on rotating wafer or other carriers, improve on wafer or other carriers and the distribution of air-flow on every side, thereby use photoresist still less still can obtain film thickness uniformity preferably.Lid of the present invention is wafer or the rotation of other bearer synchronization with sucker, and does not need extra power.
Description of drawings
Accompanying drawing 1 is a structural representation of the present utility model.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described.
As shown in Figure 1, the utility model is to add a cap structure of the servo-actuated of rotation synchronously on rotating wafer or other carriers.Concrete embodiment is: going up on the floating plate 16 has a rotating shaft 13, and be fixed screw 6 and hold-down screw 10 are fixed on the bearing 8 of loam cake 1, and last floating plate 16 (revolve and put on wafer 15) and rotating shaft 13 can rotate freely around bearing 8.Electric rotating machine 14 output shafts are equipped with a sucker 12,15 rotations (wafer 15 revolves and puts on sucker 12) of sucker 12 absorption wafers.Wherein on the sucker 12 suction magnet 3 is installed, on the last floating plate 16 floating plate magnet 2 is installed, suction magnet 3 and last floating plate magnet 2 are in same radius, and polarity is relative.Loam cake 1 links to each other with cylinder 9, moves up and down under the drive of cylinder 9.After photoresist being coated onto on the wafer 15, by cylinder 9 loam cake 1 is fallen and to cover on the wafer 15, because the magnet heteropole is to suction, when sucker 12 and wafer 15 rotations, last floating plate 16 also can together rotate in company with sucker 12 and wafer 15, make air in the middle of wafer 15 and the last floating plate 16 also in company with rotation, so just can obtain good film thickness and uniform thickness, and the photoresist consumption is also fewer.
Wherein can adjust the distance and the depth of parallelism that goes up floating plate 16 and wafer 15 by levelling bolt 7 and levelling bolt 10.The utility model does not use motor-driven, and does not contact with wafer 15 with sucker 12, only by magnetic force absorption floating plate 16 is together rotated with the wafer 15 of sucker 12 and top thereof.Adopt such lid that rotates synchronously just, improved on wafer or other carriers and the distribution of air-flow on every side, thereby realize that use photoresist still less still can obtain film thickness uniformity preferably.
Claims (2)
1. the superstructure of the even glue unit of an equipment for evenly dividing glue is characterized in that: be follower structure, comprise:
Last floating plate (16) revolves and puts on wafer (15), and a rotating shaft (13) is established at the middle part; Floating plate magnet (2) is installed on the dish;
Loam cake (1) links to each other with cylinder (9), and articulates by the rotating shaft (13) of bearing (8) with last floating plate (16);
Electric rotating machine (14) output shaft is equipped with a sucker (12), and sucker (12) cooperates with wafer (15) absorption of its top;
The last last floating plate magnet of installing (2) of suction magnet (3) and last floating plate (16) is installed in same radius on the sucker (12), polarity is relative.
2. press the superstructure of the even glue unit of the described equipment for evenly dividing glue of claim 1, it is characterized in that: wherein levelling device is installed between floating plate (16) and the loam cake (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620168334 CN200991679Y (en) | 2006-12-20 | 2006-12-20 | Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620168334 CN200991679Y (en) | 2006-12-20 | 2006-12-20 | Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200991679Y true CN200991679Y (en) | 2007-12-19 |
Family
ID=38944754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620168334 Expired - Fee Related CN200991679Y (en) | 2006-12-20 | 2006-12-20 | Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200991679Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766868A (en) * | 2018-05-29 | 2018-11-06 | 兰凤 | A kind of semiconductor silicon wafer spin coating system |
| CN108766867A (en) * | 2018-05-29 | 2018-11-06 | 兰凤 | A kind of semiconductor chip production technology |
-
2006
- 2006-12-20 CN CN 200620168334 patent/CN200991679Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766868A (en) * | 2018-05-29 | 2018-11-06 | 兰凤 | A kind of semiconductor silicon wafer spin coating system |
| CN108766867A (en) * | 2018-05-29 | 2018-11-06 | 兰凤 | A kind of semiconductor chip production technology |
| CN108766868B (en) * | 2018-05-29 | 2020-10-27 | 江苏爱矽半导体科技有限公司 | Semiconductor silicon wafer glue homogenizing device |
| CN108766867B (en) * | 2018-05-29 | 2021-01-15 | 深圳市动能世纪科技有限公司 | Semiconductor chip production process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071219 Termination date: 20151220 |
|
| EXPY | Termination of patent right or utility model |