CN108751120B - 一种硅基微针阵列贴片的制备方法 - Google Patents
一种硅基微针阵列贴片的制备方法 Download PDFInfo
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- CN108751120B CN108751120B CN201810332180.1A CN201810332180A CN108751120B CN 108751120 B CN108751120 B CN 108751120B CN 201810332180 A CN201810332180 A CN 201810332180A CN 108751120 B CN108751120 B CN 108751120B
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- silicon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00087—Holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00388—Etch mask forming
- B81C1/00396—Mask characterised by its composition, e.g. multilayer masks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00539—Wet etching
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810332180.1A CN108751120B (zh) | 2018-04-13 | 2018-04-13 | 一种硅基微针阵列贴片的制备方法 |
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CN201810332180.1A CN108751120B (zh) | 2018-04-13 | 2018-04-13 | 一种硅基微针阵列贴片的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN108751120A CN108751120A (zh) | 2018-11-06 |
CN108751120B true CN108751120B (zh) | 2021-03-05 |
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CN201810332180.1A Active CN108751120B (zh) | 2018-04-13 | 2018-04-13 | 一种硅基微针阵列贴片的制备方法 |
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CN (1) | CN108751120B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110862088B (zh) * | 2019-10-30 | 2020-11-13 | 南京大学 | 一种超高深宽比的硅纳米针阵列的制备方法 |
CN112103371B (zh) * | 2020-09-07 | 2022-01-25 | 深圳赛陆医疗科技有限公司 | 一种基于油磁性粒子分离技术的硅片贴片去除方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6962772B2 (en) * | 2002-12-27 | 2005-11-08 | Industrial Technology Research Inst. | Method for manufacturing 3-D high aspect-ratio microneedle array device |
CN1541724A (zh) * | 2003-11-04 | 2004-11-03 | 浙江大学 | 一种用于药物控释的微针阵列 |
EP1713533A4 (en) * | 2003-11-21 | 2008-01-23 | Univ California | METHOD AND / OR DEVICE FOR PUNKING A SURFACE FOR EXTRACTION, IN-SITU ANALYSIS AND / OR SUBSTANCE DELIVERY USING MICRONED NEEDLES |
WO2006022933A2 (en) * | 2004-08-05 | 2006-03-02 | Apogee Technologies, Inc. | System and method for drug delivery and microfluidic applications using microneedles |
US7132054B1 (en) * | 2004-09-08 | 2006-11-07 | Sandia Corporation | Method to fabricate hollow microneedle arrays |
MY157968A (en) * | 2007-11-14 | 2016-08-30 | Mimos Berhad | Method for fabricating microneedled and microneedle fabricated from the same |
CN101332327A (zh) * | 2008-08-06 | 2008-12-31 | 清华大学 | 一种微型空心硅针及其制备方法 |
CN101879336A (zh) * | 2009-05-06 | 2010-11-10 | 中国科学院半导体研究所 | 用于皮下药物注射的基于柔性基底的微针阵列及其制法 |
KR101261466B1 (ko) * | 2009-07-17 | 2013-05-10 | 한국전자통신연구원 | 할로우 마이크로 니들의 제조 방법 |
CN102526870B (zh) * | 2012-01-09 | 2013-08-28 | 上海交通大学 | 基于表面微细加工工艺的异平面空心微针及其制备方法 |
CN102530848A (zh) * | 2012-03-06 | 2012-07-04 | 大连理工大学 | 一种仿蚊子嘴空心微针阵列的制作方法 |
CN104377286A (zh) * | 2013-08-15 | 2015-02-25 | 中国科学院物理研究所 | 三维微米凹球的制备方法 |
CN107297020B (zh) * | 2017-06-06 | 2019-04-26 | 华中科技大学 | 一种空心微针阵列制造方法 |
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Inventor after: Zhang Xuefeng Inventor after: Zhang Jian Inventor after: Deng Mengmeng Inventor before: Zhang Jian Inventor before: Zhang Xuefeng Inventor before: Yao Xiaoli Inventor before: Deng Mengmeng |
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Effective date of registration: 20220713 Address after: 201400 room 1796, building 6, 1150 Lanfeng Road, Fengxian District, Shanghai Patentee after: Shanghai Ranwei Medical Technology Co.,Ltd. Address before: 230000 room 1707, block a, Guoguang Marriott Plaza, Shuanggang street, Luyang District, Hefei City, Anhui Province Patentee before: Hefei shunwu Information Technology Co.,Ltd. Effective date of registration: 20220713 Address after: 230000 room 1707, block a, Guoguang Marriott Plaza, Shuanggang street, Luyang District, Hefei City, Anhui Province Patentee after: Hefei shunwu Information Technology Co.,Ltd. Address before: 310018 Xiasha Higher Education Zone, Hangzhou, Zhejiang, Jianggan District Patentee before: HANGZHOU DIANZI University |