CN108749294A - A kind of transfer device and transfer method - Google Patents
A kind of transfer device and transfer method Download PDFInfo
- Publication number
- CN108749294A CN108749294A CN201810975713.8A CN201810975713A CN108749294A CN 108749294 A CN108749294 A CN 108749294A CN 201810975713 A CN201810975713 A CN 201810975713A CN 108749294 A CN108749294 A CN 108749294A
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- Prior art keywords
- transfer
- film layer
- printing board
- transfer printing
- stripping
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F16/00—Transfer printing apparatus
- B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
- B41F16/0093—Attachments or auxiliary devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F16/00—Transfer printing apparatus
- B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
- B41F16/002—Presses of the rotary type
- B41F16/0026—Presses of the rotary type with means for applying print under heat and pressure, e.g. using heat activable adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F16/00—Transfer printing apparatus
- B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
- B41F16/006—Arrangements for moving, supporting or positioning the printing foil or band
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F16/00—Transfer printing apparatus
- B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
- B41F16/0073—Transfer printing apparatus for printing from an inked or preprinted foil or band with means for printing on specific materials or products
- B41F16/008—Transfer printing apparatus for printing from an inked or preprinted foil or band with means for printing on specific materials or products for printing on three-dimensional articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2219/00—Printing presses using a heated printing foil
- B41P2219/20—Arrangements for moving, supporting or positioning the printing foil
- B41P2219/22—Guiding or tensioning the printing foil
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2219/00—Printing presses using a heated printing foil
- B41P2219/40—Material or products to be decorated or printed
- B41P2219/43—Three-dimensional articles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Decoration By Transfer Pictures (AREA)
Abstract
The present invention provides a kind of transfer device and transfer methods, are related to display technology field.The present invention is removed the transfer film layer being formed on transfer printing board by mechanism for stripping, side of the mechanism for stripping far from transfer means is provided with gas supply mechanism, in the transfer film layer on removing transfer printing board, gas supply mechanism provides strip gas between transfer printing board and transfer film layer, to reduce transfer printing board and transfer the combination energy between film layer, the transfer film layer after stripping is transferred on substrate by transfer means.In the transfer film layer on removing transfer printing board, by gas supply mechanism strip gas is provided between transfer printing board and transfer film layer, to reduce transfer printing board and transfer the combination energy between film layer, required energy when to reduce the stripping transfer film layer from transfer printing board, so that transfer film layer is more easy to remove, when it is organic light emission layer film to transfer film layer, the damage probability of organic light emission layer film can be reduced.
Description
Technical field
The present invention relates to display technology fields, more particularly to a kind of transfer device and transfer method.
Background technology
Currently, transfer printing process can be applied to the making of organic luminescent device, it is first on transfer printing board by being coated with or printing
Method formed organic luminous layer film, then by organic luminous layer film transfer to OLED (Organic Light-
Emitting Diode, Organic Light Emitting Diode) on substrate, the making of different film layers in organic luminescent device can be fully avoided,
Pollution between film layer caused by the factor that can not be overcome due to temperature, environment etc. or destruction.
Organic luminescent device generally is made frequently with dry method transfer printing process, is the formation organic luminous layer film on transfer printing board
Afterwards, in the case of organic luminous layer film drying, the organic light emission layer film on transfer printing board is removed, and will be organic after stripping
The layer film that shines is combined with oled substrate.
But since organic light emission layer film is more fragile, when directly removing organic light emission layer film from transfer printing board,
It is very easy to cause the damage of organic light emission layer film, and then causes organic light emission layer film that can not use.
Invention content
The present invention provides a kind of transfer device and transfer method, to solve existing to remove organic luminous layer from transfer printing board
When film, the problem of easily causing the damage of organic light emission layer film.
To solve the above-mentioned problems, the invention discloses a kind of transfer devices, including：Mechanism for stripping, gas supply mechanism
And transfer means；
The mechanism for stripping, the transfer film layer for being configured as to be formed on transfer printing board are removed；
The gas supply mechanism is arranged in side of the mechanism for stripping far from the transfer means, is configured as
When removing the transfer film layer on the transfer printing board, strip gas is provided between the transfer printing board and the transfer film layer, with drop
Combination energy between the low transfer printing board and the transfer film layer；
The transfer means are configured as the transfer film layer after stripping being transferred on substrate.
Preferably, the mechanism for stripping includes cutter unit and stripper roll；
The cutter unit is configured as forming notch between the transfer printing board and the transfer film layer；
The stripper roll is arranged in the transfer side of the film layer far from the transfer printing board, is configured in the notch
At position, the transfer film layer is adhered to, and the transfer film layer is pulled away from the transfer printing board.
Preferably, the gas supply mechanism includes：Gas generating unit, diffuser and nozzle；
The gas generating unit is configured as supply strip gas；
The diffuser is configured as the strip gas accelerating to pre-set velocity, and controls the strip gas
Exit direction；
The nozzle is configured as between the transfer printing board and the transfer film layer, provides and accelerate to pre-set velocity
Strip gas.
Preferably, the pre-set velocity is 340m/s to 680m/s.
Preferably, the transfer means include pressing film roller, and the press mold roller surface is provided with heating unit；
The pressing film roller, being configured as will be in the transfer film layer hot pressing to the substrate after the stripping.
Preferably, the transfer device further includes transmission mechanism；
The transmission mechanism is configured as adsorbing the substrate, and it is separate that the substrate is placed on the transfer film layer
The side of the transfer printing board.
Preferably, the transfer device further includes positioning mechanism；
The positioning mechanism is configured as aligning the substrate and the transfer printing board.
Preferably, the transfer device further includes heating mechanism；
The heating mechanism is arranged in side of the transfer printing board far from the transfer film layer, is configured as to described turn
Die layer is heated, to improve the interfacial energy of the transfer film layer.
Preferably, the temperature of the heating mechanism is 150 DEG C to 230 DEG C.
To solve the above-mentioned problems, the invention also discloses a kind of transfer methods, are applied to above-mentioned transfer device, described
Method includes：
The transfer film layer being formed on transfer printing board is removed；
In the transfer film layer on removing the transfer printing board, stripping is provided between the transfer printing board and the transfer film layer
Gas, to reduce the combination energy between the transfer printing board and the transfer film layer；
Transfer film layer after stripping is transferred on substrate.
Compared with prior art, the present invention includes following advantages：
The transfer film layer being formed on transfer printing board is removed by mechanism for stripping, in mechanism for stripping far from transfer means
Side be provided with gas supply mechanism, remove transfer printing board on transfer film layer when, gas supply mechanism transfer printing board with turn
Strip gas is provided between die layer, to reduce transfer printing board and transfer the combination energy between film layer, transfer means will be after stripping
Transfer film layer is transferred on substrate.In the transfer film layer on removing transfer printing board, in transfer printing board and turned by gas supply mechanism
Strip gas is provided between die layer, to reduce transfer printing board and transfer the combination energy between film layer, to reduce from transfer printing board
Required energy when stripping transfer film layer so that transfer film layer is more easy to remove, can when it is organic light emission layer film to transfer film layer
Reduce the damage probability of organic light emission layer film.
Description of the drawings
Fig. 1 shows a kind of structural schematic diagram of transfer device of the embodiment of the present invention；
Fig. 2 shows a kind of flow charts of transfer method of the embodiment of the present invention.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is described in further detail.
Embodiment one
Referring to Fig.1, a kind of structural schematic diagram of transfer device of the embodiment of the present invention is shown.
An embodiment of the present invention provides a kind of transfer devices, including mechanism for stripping 11, gas supply mechanism 12 and transfer interpreter
Structure 13；Mechanism for stripping 11, the transfer film layer 22 for being configured as to be formed on transfer printing board 21 are removed；Gas supply mechanism
12, the transfer film layer 22 being configured as in side of the mechanism for stripping 11 far from transfer means 13 on stripping transfer printing board 21 is set
When, strip gas is provided between transfer printing board 21 and transfer film layer 22, to reduce transfer printing board 21 and transfer the knot between film layer 22
Close energy；Transfer means 13 are configured as the transfer film layer 22 after stripping being transferred on substrate 31.
First, transfer film layer 22 is formed using modes such as coating, vapor deposition or printings on transfer printing board 21, and place is dried
Reason.When the material for transferring film layer 22 is low molecule organic matter, the dry method processing procedure such as vapour deposition method can be used, when the material of transfer film layer 22
When material is macromolecule organic, then the wet methods systems such as spin-coating method, scraper type rubbing method, dip coating, spray coating method and print process can be used
Journey.
For example, when using spin-coating method to form transfer film layer 22 on transfer printing board 21, corresponding coating apparatus includes coating
The material of film layer 22 is transferred to the control unit of the coater unit of transfer printing board 21, control coater unit, and measures transfer printing board 21
The Thickness sensitivity unit of 22 thickness of transfer film layer of upper formation；Wherein, coater unit includes the turntable for carrying transfer printing board 21, control
The dropper of the motor of turntable rotation processed and the material of transfer film layer 22 that drips to transfer printing board 21, control unit mainly control painting
Motor in cloth unit works, and certainly, coater unit may also include the sensor for changing application conditions, such as coating speed
Deng the sensor is controlled again by control unit.
The material for transferring film layer 22 is contained in closed space, the rotation of motor control turntable, to drive transfer
Version 21 rotates, and the material of transfer film layer 22 is dripped to by dropper on the transfer printing board 21 of rotation so that the material of transfer film layer 22 is equal
It is even to be diffused on transfer printing board 21, to form transfer film layer 22, processing then is dried to transfer film layer 22.
Then, the transfer film layer 22 being formed on transfer printing board 21 is removed by mechanism for stripping 11, is transferred in stripping
Version 21 on transfer film layer 22 when, by gas supply mechanism 12 transfer printing board 21 and transfer film layer 22 between provide stripping gas
Body, to reduce transfer printing board 21 and transfer the combination energy between film layer 22, to reduce the stripping transfer film layer 22 from transfer printing board 21
The energy of Shi Suoxu so that transfer film layer 22 is more easily peelable, and mechanism for stripping 11 can be by transfer film without using prodigious dynamics
Layer 22 removes the damage probability for successfully reducing transfer film layer 22 from transfer printing board 21.
Wherein, transfer film layer 22 can be organic luminous layer film, since organic light emission layer film is more fragile, using this
The transfer device of invention can reduce the damage of organic light emission layer film when removing organic light emission layer film from transfer printing board 21
Probability.Organic light emission layer film includes blue-light-emitting layer film, emitting red light layer film and green emitting layer film, blue-light-emitting
The material of layer film can be blue light conjugated polymer, such as poly- 9-9 dioctyl fluorenes, the material of emitting red light layer film can be
Red light conjugated polymer, such as poly- (2-methoxyl groups, 5 (2-ethyl hexyl oxy)-Isosorbide-5-Nitrae-phenylene ethylenes) etc., green light emitting layer is thin
The material of film can be green light conjugated polymer, such as poly- (2- (4- (3', 7'- dimethyl-octa oxygroup benzene)-phenylenevinylene) etc.；
The thickness of organic light emission layer film is 45nm to 145nm, it is preferred that the thickness of organic light emission layer film is 85nm.
Finally, after the stripping transfer film layer 22 from transfer printing board 21, by transfer means 13 by the transfer film layer after stripping
22 are transferred on substrate 31, to form complete transfer film layer 22 on the substrate 31.Wherein, substrate 31 can be PET
(Polyethylene Terephthalate, polyethylene terephthalate) substrate.
In embodiments of the present invention, mechanism for stripping 11 includes cutter unit (not shown in FIG. 1) and stripper roll 111；It cuts
Unit is cut, is configured as forming notch between transfer printing board 21 and transfer film layer 22；Stripper roll 111, setting is in transfer film layer 22
Side far from transfer printing board 21, is configured at the position of notch, is adhered to transfer film layer 22, and transfer film layer 22 is drawn
From transfer printing board 21.
Wherein, cutter unit can be air knife or other separating knives, and one is made between transfer printing board 21 and transfer film layer 22
A notch, then stripper roll 111 can at incision site to transfer film layer 22 adhere to, will transfer film layer 22 be pulled away from transfer printing board
21。
In embodiments of the present invention, gas supply mechanism 12 includes：Gas generating unit, diffuser and nozzle；Gas is sent out
Raw unit is configured as supply strip gas；Diffuser is configured as strip gas accelerating to pre-set velocity, and controls stripping
Exit direction from gas；Nozzle is configured as between transfer printing board 21 and transfer film layer 22, provides and accelerate to pre-set velocity
Strip gas.
The course of work of gas supply mechanism 12 includes mainly three phases, i.e., startup stage, normal work stage and stops
Only working stage, in startup stage, gas supply mechanism 12 is initially supplied strip gas, in working stage, gas supply mechanism
12 continue to supply strip gas and be kept for specified time, until stop supply strip gas, in the stage of being stopped, gas supply
Mechanism 12 closes, and stops supply strip gas.
It should be noted that the mark that gas supply mechanism 12 starts is that strip gas is pushed out diffuser exit, therefore,
After the geometric dimension of gas supply mechanism 12 determines, it is desirable that the stagnation pressure of strip gas necessarily is greater than minimum startup pressure；And it shells
Minimum discharge from gas is proportional to minimum startup pressure, and the height of the coefficient of overburden of gas supply mechanism 12 is started by minimum
The influence of pressure.Strip gas forms gas channel in diffuser, and in the case where there is strip gas, diffuser can be according to reality
Border situation adjusts the size of gas channel, saves the flow of strip gas, and ensure gas supply mechanism 12 can effectively start,
And there is higher coefficient of overburden.
In gas supply mechanism 12, gas generating unit supplies strip gas, and diffuser pressurizes to strip gas
To which strip gas is accelerated to pre-set velocity, and the exit direction of strip gas is controlled, finally by nozzle in transfer printing board 21
Between transfer film layer 22, the strip gas for accelerating to pre-set velocity is provided.
Wherein, pre-set velocity is 340m/s to 680m/s, and strip gas can be high-velocity particles, high velocity inert gas or wait
Ionized gas etc..
In embodiments of the present invention, transfer means 13 include pressing film roller 131, and 131 surface of pressing film roller is provided with heating unit；
Pressing film roller 131 is configured as in transfer film layer 22 hot pressing to substrate 31 after removing.
131 surface of pressing film roller is provided with heating unit, hot pressing is carried out on the surface of substrate 31 using pressing film roller 131,
While transfer film layer 22 on transfer printing board 21 is removed, substrate 31 and the transfer film layer 22 after stripping are bonded.Wherein,
The temperature of heating unit is 150 DEG C to 230 DEG C, it is preferred that the temperature of heating unit is 180 DEG C.
In embodiments of the present invention, transfer device further includes transmission mechanism；Transmission mechanism is configured as sorbing substrate 31,
And substrate 31 is placed on side of the transfer film layer 22 far from transfer printing board 21.
Transfer device further includes positioning mechanism；Positioning mechanism is configured as aligning substrate 31 and transfer printing board 21.
Specifically, using transmission mechanism sorbing substrate 31, substrate 31 is placed in transfer film layer 22 far from transfer printing board 21
Side by substrate 31 and is turned using positioning mechanism, such as laser or CCD (Charge-coupled Device, charge coupled cell)
Printing plate 21 carries out exactitude position.Wherein, whether can be aligned by the edge between substrate 31 and transfer printing board 21 accurate right to carry out
Position, mark (label) can also be set on substrate 31 and transfer printing board 21, by the mark on substrate 31 and transfer printing board 21 into
Row contraposition, to realize the exactitude position of substrate 31 and transfer printing board 21.
In embodiments of the present invention, transfer device further includes heating mechanism 14；Heating mechanism, setting are separate in transfer printing board 21
The side for transferring film layer 22 is configured as heating transfer film layer 22, to improve the interfacial energy of transfer film layer 22.
Heating mechanism 14 mainly heats transfer film layer 22, such as using infrared or other heating means to transfer film
Layer 22 is heated, to improve its interfacial energy so that in use mechanism for stripping 11 to the transfer film layer 22 on transfer printing board 21
When being removed, further such that transfer film layer 22 is more easily peelable.Wherein, the temperature of heating mechanism 14 is 150 DEG C to 230 DEG C,
Preferably, the temperature of heating mechanism 14 is 180 DEG C.
Transfer film layer 22 is formed using modes such as coating, vapor deposition or printings on transfer printing board 21, and after being dried,
Using transmission mechanism sorbing substrate 31, substrate 31 is placed in side of the transfer film layer 22 far from transfer printing board 21, aligning machine is utilized
Substrate 31 and transfer printing board 21 are carried out exactitude position by structure, then, using cutter unit between transfer printing board 21 and transfer film layer 22
A notch is made, transfer film layer 22 is adhered at incision site using stripper roll 111, transfer film layer 22 is pulled away from and is turned
Printing plate 21, it is continuous using gas supply mechanism 12 during will transfer pull-off transfer printing board 21 of film layer 22 using stripper roll 111
Between transfer printing board 21 and transfer film layer 22, the strip gas for accelerating to pre-set velocity is provided, finally, is existed using pressing film roller 131
The surface of substrate 31 carries out hot pressing, while being removed the transfer film layer 22 on transfer printing board 21, by substrate 31 and stripping
Transfer film layer 22 afterwards bonds.
It, will also be extra using laser or other separating tools when the transfer film layer 22 being transferred on substrate 31 has extra
Transfer film layer 22 carry out cutting separation.
If it is desired to when transferring multilayer transfer film layer 22 on the substrate 31, then above-mentioned each step is repeated several times.
In embodiments of the present invention, the transfer film layer being formed on transfer printing board is removed by mechanism for stripping, is being shelled
Side of the structure far from transfer means of disembarking is provided with gas supply mechanism, and in the transfer film layer on removing transfer printing board, gas supplies
Strip gas is provided between transfer printing board and transfer film layer to mechanism, to reduce transfer printing board and transfer the combination energy between film layer,
Transfer film layer after stripping is transferred on substrate by transfer means.In the transfer film layer on removing transfer printing board, supplied by gas
Strip gas is provided between transfer printing board and transfer film layer to mechanism, to reduce transfer printing board and transfer the combination energy between film layer,
Required energy when to reduce the stripping transfer film layer from transfer printing board so that transfer film layer is more easy to remove, when transfer film layer is
When organic light emission layer film, the damage probability of organic light emission layer film can be reduced.
Embodiment two
With reference to Fig. 2, a kind of flow chart of transfer method of the embodiment of the present invention is shown, be applied in above-described embodiment one
Transfer device, can specifically include following steps：
Step 201, the transfer film layer being formed on transfer printing board is removed.
In embodiments of the present invention, transfer film layer 22 is formed using modes such as coating, vapor deposition or printings on transfer printing board 21,
And after being dried, the transfer film layer 22 being formed on transfer printing board 21 is removed by mechanism for stripping 11.
Specifically, using transmission mechanism sorbing substrate 31, substrate 31 is placed in transfer film layer 22 far from transfer printing board 21
Substrate 31 and transfer printing board 21 are carried out exactitude position by side using positioning mechanism, then, using cutter unit transfer printing board 21 with
A notch is made between transfer film layer 22, transfer film layer 22 is adhered at incision site using stripper roll 111, will be turned
Die layer 22 is pulled away from transfer printing board 21.
Step 202, in the transfer film layer on removing the transfer printing board, between the transfer printing board and the transfer film layer
Strip gas is provided, to reduce the combination energy between the transfer printing board and the transfer film layer.
In embodiments of the present invention, in the transfer film layer 22 on removing transfer printing board 21, existed by gas supply mechanism 12
Strip gas is provided between transfer printing board 21 and transfer film layer 22, to reduce transfer printing board 21 and transfer the combination energy between film layer 22,
Required energy when to reduce the stripping transfer film layer 22 from transfer printing board 21 so that transfer film layer 22 is more easily peelable, stripping machine
Transfer film layer 22 can be removed the damage for successfully reducing transfer film layer 22 without using prodigious dynamics by structure 11 from transfer printing board 21
Bad probability.
Specifically, during will transfer pull-off transfer printing board 21 of film layer 22 using stripper roll 111, gas is utilized to supply machine
Structure 12 provides the strip gas for accelerating to pre-set velocity constantly between transfer printing board 21 and transfer film layer 22.Wherein, pre-set velocity
For 340m/s to 680m/s, strip gas can be high-velocity particles, high velocity inert gas or plasma gas etc..
Step 203, the transfer film layer after stripping is transferred on substrate.
In embodiments of the present invention, it after the stripping transfer film layer 22 from transfer printing board 21, will be removed by transfer means 13
Transfer film layer 22 afterwards is transferred on substrate 31, to form complete transfer film layer 22 on the substrate 31.
Specifically, after the stripping transfer film layer 22 from transfer printing board 21, carried out on the surface of substrate 31 using pressing film roller 131
Hot pressing glues substrate 31 and the transfer film layer 22 after stripping while being removed the transfer film layer 22 on transfer printing board 21
Knot.
In embodiments of the present invention, the transfer film layer being formed on transfer printing board is removed, on stripping transfer printing board
When transferring film layer, strip gas is provided between transfer printing board and transfer film layer, to reduce transfer printing board and transfer the knot between film layer
Energy is closed, the transfer film layer after stripping is transferred on substrate.In the transfer film layer on removing transfer printing board, machine is supplied by gas
Structure provides strip gas between transfer printing board and transfer film layer, to reduce transfer printing board and transfer the combination energy between film layer, to
Reduce energy required when the stripping transfer film layer from transfer printing board so that transfer film layer is more easy to remove, when transfer film layer is organic
When luminous layer film, the damage probability of organic light emission layer film can be reduced.
For embodiment of the method above-mentioned, for simple description, therefore it is all expressed as a series of combination of actions, still
Those skilled in the art should understand that the present invention is not limited by the described action sequence, because according to the present invention, it is certain
Step can be performed in other orders or simultaneously.Next, those skilled in the art should also know that, it is described in the specification
Embodiment belong to preferred embodiment, involved action and module are not necessarily essential to the invention.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiment, the same or similar parts between the embodiments can be referred to each other.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, commodity or equipment including a series of elements include not only that
A little elements, but also include other elements that are not explicitly listed, or further include for this process, method, commodity or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in process, method, commodity or the equipment including the element.
Above to a kind of transfer device provided by the present invention and transfer method, it is described in detail, it is used herein
Principle and implementation of the present invention are described for specific case, and the explanation of above example is only intended to help to understand
The method and its core concept of the present invention；Meanwhile for those of ordinary skill in the art, according to the thought of the present invention, having
There will be changes in body embodiment and application range, in conclusion the content of the present specification should not be construed as to the present invention
Limitation.
Claims (10)
1. a kind of transfer device, which is characterized in that including：Mechanism for stripping, gas supply mechanism and transfer means；
The mechanism for stripping, the transfer film layer for being configured as to be formed on transfer printing board are removed；
The gas supply mechanism is arranged in side of the mechanism for stripping far from the transfer means, is configured as removing
When transfer film layer on the transfer printing board, strip gas is provided between the transfer printing board and the transfer film layer, to reduce
State the combination energy between transfer printing board and the transfer film layer；
The transfer means are configured as the transfer film layer after stripping being transferred on substrate.
2. transfer device according to claim 1, which is characterized in that the mechanism for stripping includes cutter unit and stripping
Roller；
The cutter unit is configured as forming notch between the transfer printing board and the transfer film layer；
The stripper roll is arranged in the transfer side of the film layer far from the transfer printing board, is configured in the position of the notch
Place, adheres to the transfer film layer, and the transfer film layer is pulled away from the transfer printing board.
3. transfer device according to claim 1, which is characterized in that the gas supply mechanism includes：Gas occurs single
Member, diffuser and nozzle；
The gas generating unit is configured as supply strip gas；
The diffuser is configured as the strip gas accelerating to pre-set velocity, and controls the outgoing of the strip gas
Direction；
The nozzle is configured as between the transfer printing board and the transfer film layer, provides the stripping for accelerating to pre-set velocity
Gas.
4. transfer device according to claim 3, which is characterized in that the pre-set velocity is 340m/s to 680m/s.
5. transfer device according to claim 1, which is characterized in that the transfer means include pressing film roller, the press mold
Roller surface is provided with heating unit；
The pressing film roller, being configured as will be in the transfer film layer hot pressing to the substrate after the stripping.
6. transfer device according to claim 1, which is characterized in that the transfer device further includes transmission mechanism；
The transmission mechanism is configured as adsorbing the substrate, and the substrate is placed on the transfer film layer far from described
The side of transfer printing board.
7. transfer device according to claim 6, which is characterized in that the transfer device further includes positioning mechanism；
The positioning mechanism is configured as aligning the substrate and the transfer printing board.
8. transfer device according to claim 1, which is characterized in that the transfer device further includes heating mechanism；
The heating mechanism is arranged in side of the transfer printing board far from the transfer film layer, is configured as to the transfer film
Layer is heated, to improve the interfacial energy of the transfer film layer.
9. transfer device according to claim 8, which is characterized in that the temperature of the heating mechanism is 150 DEG C to 230
℃。
10. a kind of transfer method, which is characterized in that it is applied to transfer device as claimed in any one of claims 1-9 wherein, it is described
Method includes：
The transfer film layer being formed on transfer printing board is removed；
In the transfer film layer on removing the transfer printing board, stripping gas is provided between the transfer printing board and the transfer film layer
Body, to reduce the combination energy between the transfer printing board and the transfer film layer；
Transfer film layer after stripping is transferred on substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810975713.8A CN108749294B (en) | 2018-08-24 | 2018-08-24 | Transfer printing device and transfer printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810975713.8A CN108749294B (en) | 2018-08-24 | 2018-08-24 | Transfer printing device and transfer printing method |
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| CN108749294A true CN108749294A (en) | 2018-11-06 |
| CN108749294B CN108749294B (en) | 2020-04-24 |
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| CN107728386A (en) * | 2017-10-27 | 2018-02-23 | 合肥京东方光电科技有限公司 | A kind of transfer printing board pretreatment unit and transfer apparatus |
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| CN108749294B (en) | 2020-04-24 |
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