CN108748748A

CN108748748A - A kind of semiconductor diode formation system

Info

Publication number: CN108748748A
Application number: CN201810534865.4A
Authority: CN
Inventors: 陈欣洁; 张家俊
Original assignee: Individual
Current assignee: Jiangsu Xingeno Electronic Technology Co ltd
Priority date: 2018-05-29
Filing date: 2018-05-29
Publication date: 2018-11-06
Anticipated expiration: 2038-05-29
Also published as: CN108748748B

Abstract

The invention belongs to semiconductor diode production technical field, specifically a kind of semiconductor diode formation system, including rack, No.1 plate, self-clamping module, shear module, sharpening block and position control unit；By unscrewing fixing bolt, and it moves up and down and No. four plates is moved into suitable position, be tightened bolt again, the rotation amplitude of annular rack is adjusted by changing the extension elongation of No. four plates, annular rack rotation amplitude generates variation, accordingly so that sliding distance of the ring block in No. four sliding slots changes, to be clamped to the semiconductor diode lead of different thicknesses；Then, pass through movement locus of No. two sliding blocks in No.1 rotating wheel, forming cutter in No. two plates carries out preshearing to semiconductor diode lead, opening, cuts three kinds of effects, sharpen sharpening of the block to forming cutter simultaneously, keep the cutting edge of forming cutter sharp, to improve the shear efficiency and effect of semiconductor diode lead.

Description

A kind of semiconductor diode formation system

Technical field

The invention belongs to semiconductor diode production technical fields, specifically a kind of semiconductor diode molding system System.

Background technology

Diode is also known as crystal diode, abbreviation diode, in addition, the also vacuum electronic diode of early stage；It is one Kind has the electronic component of unidirectional conduction electric current.In electronic component, there are two the devices of electrode for a kind of tool, only allow electric current It is flowed through by single direction.The most common function of diode is exactly only to allow electric current by single direction by (be known as forward bias voltage drop), It is blocked when reversed and (is known as reverse bias).Therefore, diode can be thought of as the non-return valve of electronic edition.

Also occurs the technical solution of some diode forming devices in the prior art, such as application No. is 2010381398.X A Chinese patent disclose the diode forming device in semiconductor diode field, including pedestal, U-shaped card slot, briquetting, Spring, forming cutter, cutter head, transmission device and mold are equipped with U-shaped card slot on the pedestal, mould are equipped with inside U-shaped card slot Tool；The cutter head lower end inside is equipped with spring, and briquetting is connected under spring；Cutter head lower end outside is equipped with molding against spring Knife；The cutter head upper end connects power source by transmission device.

The technical solution device controllability is strong, and device can be completed at the same time the preforming of more than one piece diode, formed precision is high, It is easy to operate, working efficiency can be increased substantially.But the technical solution cannot be directed to different size of diode and in two poles Diode cannot be clamped in advance in the clamping of pipe；Diode cannot equally be carried out in the shear history of diode simultaneously The sharp situation of the cutting edge of preshearing and forming cutter does not improve.Therefore, which is restricted.

Invention content

In order to make up for the deficiencies of the prior art, a kind of semiconductor diode formation system proposed by the present invention, by unscrewing Fixing bolt, and move up and down and No. four plates are moved into suitable position, be tightened bolt again, and the stretching by changing No. four plates is grown The rotation amplitude of annular rack is spent and then adjusts, annular rack rotation amplitude generates variation, accordingly so that ring block is at No. four Sliding distance in sliding slot changes, to be clamped to the semiconductor diode of different thicknesses；Then, pass through No. two cunnings Movement locus of the block in No.1 rotating wheel, the forming cutter in No. two plates carry out preshearing to semiconductor diode, opening, cut three Kind effect, while sharpening of the block to forming cutter is sharpened, keep the cutting edge of forming cutter sharp, to improve cutting for semiconductor diode Cut efficiency and effect.

The technical solution adopted by the present invention to solve the technical problems is：A kind of semiconductor diode of the present invention at Type system, including rack further include No.1 plate, self-clamping module, shear module and sharpening block；The No.1 plate is equipped with the first electricity Machine；It is fixedly connected with No.1 rotating wheel in the first motor shaft；The No.1 that is slidably installed on the rack right side uprights is slided Block；The articulated No.1 fixed link in No.1 sliding block one end；No.1 fixed link one end is fixedly connected with No. two sliding blocks；It is described No. two sliding blocks are slided in No.1 rotating wheel outer ring；Described shear module one end and No.1 sliding block are hinged, the shear module other end with Rack is hinged, and shear module is four No. two plates, and each No. two plates are hinged into two-by-two on parallelogram and each No. two plates Clipped position be installed with forming cutter；No. two plates are divided into shear zone and non-shear area by the forming cutter；The clamping Module includes No.1 pneumatic cylinder, upper plate and lower plate；The frame top centre position is installed with No.1 pneumatic cylinder, machine Frame bottom centre position is installed with lower plate；Justify equipped with half in lower plate upper surface centre position；Described one Number pneumatic cylinder bottom is installed with upper plate；Justify equipped with half in upper plate lower surface centre position；The upper bottom Plate is used cooperatively with lower plate；When work, semiconductor diode is put into the half circle of lower plate, then adjust No.1 Pneumatic cylinder so that the upper plate that No.1 pneumatic cylinder bottom is fixedly mounted moves downward, the half of upper plate lower surface circle with The half circle of lower plate, which cooperates, clamps semiconductor diode；At this point, opening first motor switch, first motor band Dynamic No.1 rotating wheel rotation so that No. two sliding blocks in No.1 rotating wheel drive No.1 slide block movement by No.1 fixed link, and one Number sliding block is during moving out so that the semiconductor of forming cutter with No.1 sliding block in hinged shear module to clamping Diode is sheared.

Preferably, No.1 rotating wheel outer ring by two sections of symmetrical No.1 arcs, two sections of symmetrical No. two circular arcs, two sections it is right No. three arcs claimed and two sections of symmetrical No. four circular arcs compositions；No. three arc sides are adjacent with No. two circular arcs, No. three arc other sides It is adjacent with No. four circular arcs；The No.1 arc is between No. two circular arcs and No. four circular arcs；No.1 rotating wheel side is equipped with two Number sliding slot, No. two sliding blocks slide in No. two sliding slots；Movement locus of No. two sliding blocks in No. two sliding slots generates different Effect；First, when No. two sliding blocks are in No.1 arc position, No. two plates at this time open completely, the forming cutter pair in No. two plates Semiconductor diode does not generate shear action, and when No. two slide block movements are to No. two arc positions, No. two plates are slowly closed, No. two Forming cutter in plate carries out preshearing to semiconductor diode, and when subsequent No. two slide block movements are to No. three arc positions, No. two plates are pico- It opens, the forming cutter in No. two plates is far from semiconductor diode, when last No. two slide block movements are to No. four arc positions, No. two plates It is closed completely, the forming cutter in No. two plates cuts semiconductor diode.

Preferably, described sharpening block one end is hinged on by No. two fixed links in rack, and sharpening block is slidably mounted on No. two On plate, forming cutter is sharpened by sharpening sliding of the block on No. two plates；When No. two plates open, block is sharpened to shear zone Side moves, and sharpening block sharpens forming cutter, and in No. two plate closings, sharpening block is moved to non-shear area side, is sharpened Block is to forming cutter without sharpening；Forming cutter is sharpened by sharpening block, to improve the sharpness of forming cutter cutting edge, And then improve the efficiency of forming cutter shearing semiconductor diode.

Preferably, No. four sliding slots and No. five sliding slots are offered in the lower plate；No. four sliding slots are semicircular ring Shape slot；No. five sliding slots are straight trough, and the number of No. five sliding slots is three and No. four sliding slots of cooperation are arranged at semi-circumference；Described four Annular rack and No.1 spring are equipped in number sliding slot, the annular rack slides in No. four sliding slots, and annular rack one end passes through No.1 spring is fixedly connected with lower plate, and spin is fixedly mounted in the annular rack other end；No.1 is equipped in No. five sliding slots Gear and lead screw；It is equipped with ring block in half circle in the lower plate；Described lead screw one end is fixed with No.1 gear to be connected It connects, the lead screw other end is threadedly coupled with ring block；The No.1 gear and annular rack engaged transmission；The lead screw rotation is used for Driving ring block slides in No. four sliding slots；When upper plate is contacted with lower plate, spin is pushed annular rack to exist by power, spin Sliding is transported in No. four sliding slots, annular rack makes the No.1 gear of engagement rotate, and lead screw makes ring block push up so that ring block Semiconductor diode is clamped in advance, with anti-displacement, then, the non-stress No.1 recoil of spring of spin makes tooth form item be restored to original Position, ring block accordingly return to original position；Spin again stress when, annular rack continue engage No.1 gear, lead screw push ring block Semiconductor diode is clamped, keeps spin to continue for stress, ring block firmly clamps semiconductor diode；? After semiconductor diode is cut, No.1 pneumatic cylinder drives upper plate to move upwards, and No. four plates are detached from spin, and No.1 spring will be annular Rack is bound to original position, and ring block is flexible.

Preferably, position control unit is equipped with above the spin, position control unit is mounted on upper plate side；It is described Position control unit includes No. three plates, No. four plates, No. two springs and fixing bolt；No. three plate quantity is two pieces, No. three plates one Side is wavy；No. four plate both sides are wavy；No. four plates are located between two No. three plates and No. three plates and No. four Plate cooperates；No. three plates are fixedly connected on by No.1 spring on upper plate side；When needing half to different thicknesses When conductor diode is sheared, by unscrewing fixing bolt, and moves up and down and No. four plates are moved into suitable position, screw again Fixing bolt adjusts the rotation amplitude of annular rack, the production of annular rack rotation amplitude by changing the extension elongation of No. four plates Changing, accordingly so that sliding distance of the ring block in No. four sliding slots changes, to the semiconductor to different thicknesses Diode is clamped.

Beneficial effects of the present invention are as follows：

1. a kind of semiconductor diode formation system of the present invention is slided by shear module, No.1 rotating wheel, No.1 Mutual cooperation between block, No. two sliding blocks and No.1 fixed link, movement locus of No. two sliding blocks in No.1 rotating wheel so that shearing Module generates three kinds of shear effects in the shear history of semiconductor diode, micro- to cut, open and cut, to prevent two pole of semiconductor Pipe surface in shear history generates burr, to improve semiconductor diode shear effect.

2. a kind of semiconductor diode formation system of the present invention collides spin by No. four plates, makes annular rack It engages with No.1 gear and pushes ring block that semiconductor diode to be clamped in advance, shifting is produced to prevent semiconductor diode Position, then fixes No. four plates so that ring block firmly clamps semiconductor diode, to improve clamping effect, in turn Improve shear effect.

3. a kind of semiconductor diode formation system of the present invention sharpens the molding in No. two plates of block pair by adjusting Knife is sharpened so that forming cutter cutting edge is sharp, to improve the efficiency that forming cutter shears semiconductor diode.

4. a kind of semiconductor diode formation system of the present invention, by adjusting position control unit, for difference The semiconductor diode of size adjusts contact of No. four plates with spin so that and annular slab is clamped semiconductor diode, from And improve the applicability of clamping.

Description of the drawings

The invention will be further described below in conjunction with the accompanying drawings.

Fig. 1 is the front view of the present invention；

Fig. 2 is the sectional view of A-A in Fig. 1；

Fig. 3 is the sectional view of B-B in Fig. 2；

Fig. 4 is the sectional view of C-C in Fig. 1；

Fig. 5 is the partial enlarged view of D in Fig. 3；

In figure：Rack 1, No.1 plate 11, self-clamping module 2, shear module 3, sharpening block 4, No.1 rotating wheel 13, No.1 sliding block 15, the sliding block 17, two of No.1 fixed link 16, two plate 31, forming cutter 32, shear zone 33, non-shear area 34, No.1 pneumatic cylinder 21, upper plate 22, lower plate 23, the fixed link 33, four of circular arc 20, two of arc 19, four of circular arc 18, three of No.1 arc 14, two Number sliding slot 231, No. five sliding slots 232, annular rack 233, No.1 spring 234, spin 235, No.1 gear 236, lead screw 237, rings Shape block 238, position control unit 5, three plate 51, four plate 52, No. two springs 53, fixing bolts 54.

Specific implementation mode

In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below Specific implementation mode is closed, the present invention is further explained.

As shown in Figures 1 to 4, a kind of semiconductor diode formation system of the present invention, including rack 1 further include No.1 plate 11, self-clamping module 2, shear module 3 and sharpening block 4；The No.1 plate 11 is equipped with first motor；The first motor No.1 rotating wheel 13 is fixedly connected in shaft；Be slidably installed No.1 sliding block 15 on 1 right side uprights of the rack；The No.1 The articulated No.1 fixed link in 15 one end of sliding block 16；Described 16 one end of No.1 fixed link is fixedly connected with No. two sliding blocks 17；Described two Number sliding block 17 is slided in 13 outer ring of No.1 rotating wheel；3 one end of the shear module is hinged with No.1 sliding block 15, and shear module 3 is another One end and rack 1 are hinged, and shear module 3 is four No. two plates 31, each No. two plates 31 be hinged into two-by-two parallelogram and Clipped position on each No. two plates 31 is installed with forming cutter 32；The forming cutter 32 divides No. two plates 31 for shear zone 33 and non-shear area 34；The self-clamping module 2 includes No.1 pneumatic cylinder 21, upper plate 22 and lower plate 23；1 top of the rack Centre position is installed with No.1 pneumatic cylinder 21, and 1 bottom centre position of rack is installed with lower plate 23；The lower plate Justify equipped with half 23 upper surfaces centre position；21 bottom of No.1 pneumatic cylinder is installed with upper plate 22；On described Justify equipped with half in 22 lower surface centre position of bottom plate；The upper plate 22 is used cooperatively with lower plate 23；It, will be partly when work Conductor diode is put into the half circle of lower plate 23, then adjusts No.1 pneumatic cylinder 21 so that 21 bottom of No.1 pneumatic cylinder The upper plate 22 that portion is fixedly mounted moves downward, and the half circle and the half of lower plate 23 of 22 lower surface of upper plate are justified Mutual cooperation clamps semiconductor diode；At this point, opening first motor switch, first motor drives 13 turns of No.1 rotating wheel It is dynamic so that No. two sliding blocks 17 in No.1 rotating wheel 13 drive No.1 sliding block 15 to move by No.1 fixed link 16, No.1 sliding block 15 during moving out so that partly the leading to clamping of forming cutter 32 in the shear module 3 hinged with No.1 sliding block 15 Body diode is sheared.

As one embodiment of the present invention, 13 outer ring of No.1 rotating wheel is by two sections of symmetrical No.1 arcs 14, two Symmetrical No. three arcs 19 of symmetrical 18, two sections of No. two circular arcs of section and two sections of symmetrical No. four circular arcs 20 compositions；No. three arcs 19 Side is adjacent with No. two circular arcs 18, and No. three 19 other sides of arc are adjacent with No. four circular arcs 20；The No.1 arc 14 is in No. two circular arcs Between 18 and No. four circular arcs 20；13 side of No.1 rotating wheel is equipped with No. two sliding slots, and No. two sliding blocks 17 are in No. two sliding slots Middle sliding；Movement locus of No. two sliding blocks 17 in No. two sliding slots generates different effects；First, when No. two sliding blocks 17 are in one When number arc position 14, No. two plates 31 at this time open completely, and the forming cutter 32 in No. two plates 31 does not generate semiconductor diode Shear action, when No. two sliding blocks 17 move to No. two 18 positions of circular arc, No. two plates 31 are slowly closed, the molding in No. two plates 31 Knife 32 carries out preshearing to semiconductor diode, and when subsequent No. two sliding blocks 17 move to No. three 19 positions of arc, No. two plates 31 are opened slightly It opens, the forming cutter 32 in No. two plates 31 is far from semiconductor diode, when last No. two sliding blocks 17 move to No. four 20 positions of circular arc, No. two plates 31 are closed completely, and the forming cutter 32 in No. two plates 31 cuts semiconductor diode.

As one embodiment of the present invention, described 4 one end of sharpening block is hinged on rack 1 by No. two fixed links 33 On, sharpening block 4 is slidably mounted on No. two plates 31, and sword is carried out to forming cutter 32 by sharpening sliding of the block 4 on No. two plates 31 Mill；When No. two plates 31 open, sharpening block 4 is moved to 33 side of shear zone, and sharpening block 4 sharpens forming cutter 32, two When number plate 31 is closed, sharpening block 4 move to 34 side of non-shear area, and sharpening block 4 is to forming cutter 32 without sharpening；Pass through sharpening Block 4 sharpens forming cutter 32, to improve the sharpness of 32 cutting edge of forming cutter, and then improves the shearing of forming cutter 32 half The efficiency of conductor diode.

As one embodiment of the present invention, No. four sliding slots 231 and No. five sliding slots are offered in the lower plate 23 232；No. four sliding slots 231 are semicircular annular groove；No. five sliding slots 232 are straight trough, and the number of No. five sliding slots 232 is Three and cooperation No. four sliding slots 231 arranged at semi-circumference；Annular rack 233 and No.1 spring are equipped in No. four sliding slots 231 234, the annular rack 233 slides in No. four sliding slots 231, and 233 one end of annular rack passes through No.1 spring 234 and lower plate 23 are fixedly connected, and spin 235 is fixedly mounted in 233 other end of annular rack；No.1 gear is equipped in No. five sliding slots 232 236 and lead screw 237；It is equipped with ring block 238 in half circle in the lower plate 23；237 one end of the lead screw and No.1 Gear 236 is fixedly connected, and 237 other end of lead screw is threadedly coupled with ring block 238；The No.1 gear 236 and annular rack 233 Engaged transmission；The lead screw 237 is rotated for driving ring block 238 to be slided in No. four sliding slots 231；Upper plate 22 and lower plate When 23 contact, spin 235 is pushed annular rack 233 to transport sliding, annular rack in No. four sliding slots 231 by power, spin 235 233 make the No.1 gear 236 of engagement rotate, and lead screw 237 makes ring block 238 push up so that ring block 238 is to semiconductor two Pole pipe is clamped in advance, and with anti-displacement, then, the rebound of 235 non-stress No.1 spring 234 of spin makes tooth form item be restored to original position, Ring block 238 accordingly returns to original position；Spin 235 again stress when, annular rack 233 continues to engage No.1 gear 236, lead screw 237 promotion ring blocks 238 are clamped semiconductor diode, keep spin 235 to continue for stress, ring block 238 is firmly Semiconductor diode is clamped；After semiconductor diode cutting, No.1 pneumatic cylinder 21 drives upper plate 22 to move upwards, and four Number plate 52 is detached from spin 235, and annular rack 233 is bound to original position by No.1 spring 234, and ring block 238 is flexible.

As one embodiment of the present invention, 235 top of the spin is equipped with position control unit 5, and position control is single Member 5 is mounted on 22 side of upper plate；The position control unit 5 includes No. three springs 53 of plate 52, two of plate 51, four and fixes Bolt 54；51 quantity of No. three plates is two pieces, and No. three 51 sides of plate are wavy；52 both sides of No. four plates are wavy；Institute No. four plates 52 are stated between two No. three plates 51 and No. three plates 51 and No. four plates 52 cooperate；No. three plates 51 pass through one Number spring 234 is fixedly connected on 22 side of upper plate；When needing the semiconductor diode to different thicknesses to shear, lead to It crosses and unscrews fixing bolt 54, and move up and down and No. four plates 52 are moved into suitable position, be tightened bolt 54 again, by changing four The extension elongation of number plate 52 and then the rotation amplitude for adjusting annular rack 233,233 rotation amplitude of annular rack generate variation, phase That answers makes sliding distance of the ring block 238 in No. four sliding slots 231 change, to two pole of semiconductor to different thicknesses Pipe is clamped.

When work, first, semiconductor diode is placed in the circle of the half in 23 upper surface of lower plate, air pressure is adjusted Cylinder so that upper plate 22 moves downward, and unscrews fixing bolt 54, moves up and down No. four plates 52 to suitable position, and screws again solid Determine bolt 54, passes through the rotation amplitude for adjusting annular rack 233 by change of No. four 52 extension elongations of plate, 233 turns of annular rack Dynamic amplitude generates variation, accordingly so that sliding distance of the ring block 238 in No. four sliding slots 231 changes, to not Semiconductor diode with thickness is clamped；At this point, opening first motor, first motor drives No.1 rotating wheel 13 to rotate, Corresponding that forming cutter 32 is driven to be sheared, when No. two sliding blocks 17 are in No.1 arc position 14, forming cutter 32 is to semiconductor two Pole pipe does not generate shear action, and when No. two sliding blocks 17 move to No. two 18 positions of circular arc, forming cutter 32 is to semiconductor diode Preshearing is carried out, when subsequent No. two sliding blocks 17 move to No. three 19 positions of arc, forming cutter 32 is far from semiconductor diode, last No. two When sliding block 17 moves to No. four 20 positions of circular arc, forming cutter 32 cuts semiconductor diode, when forming cutter 32 is sheared, sharpening Block 4 slides away from forming cutter 32, and when forming cutter 32 is not sheared, sharpening block 4 sharpens forming cutter 32；Semiconductor diode is cut It has no progeny, No. two plates 31 open when No. two sliding blocks 17 are in No.1 arc position 14, close first motor, while adjusting No.1 pneumatic cylinder 21 drive upper plate 22 far from lower plate 23, and the semiconductor diode after cutting is taken frame 1 of disembarking from lower plate 23.

The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe the originals of the present invention Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle It is fixed.

Claims

1. a kind of semiconductor diode formation system, including rack (1), it is characterised in that：Further include No.1 plate (11), clamping mould Block (2), shear module (3) and sharpening block (4)；The No.1 plate (11) is equipped with first motor；In the first motor shaft It is fixedly connected with No.1 rotating wheel (13)；Be slidably installed No.1 sliding block (15) on rack (1) right side uprights；The No.1 The articulated No.1 fixed link (16) in sliding block (15) one end；Described No.1 fixed link (16) one end is fixedly connected with No. two sliding blocks (17)；No. two sliding blocks (17) are slided in No.1 rotating wheel (13) outer ring；Described shear module (3) one end and No.1 sliding block (15) hinged, shear module (3) other end is hinged with rack (1), and shear module (3) is four No. two plates (31), each No. two The clipped position that plate (31) is hinged into two-by-two on parallelogram and each No. two plates (31) is installed with forming cutter (32)；No. two plates (31) are divided into shear zone (33) and non-shear area (34) by the forming cutter (32)；Self-clamping module (2) packet Include No.1 pneumatic cylinder (21), upper plate (22) and lower plate (23)；Rack (1) the top center position is installed with No.1 Pneumatic cylinder (21), rack (1) bottom centre position are installed with lower plate (23)；Lower plate (23) upper surface interposition Half circle is installed；No.1 pneumatic cylinder (21) bottom is installed with upper plate (22)；Under the upper plate (22) Justify equipped with half in surface centre position；The upper plate (22) is used cooperatively with lower plate (23).

2. a kind of semiconductor diode formation system according to claim 1, it is characterised in that：The No.1 rotating wheel (13) outer ring by two sections of symmetrical No.1 arcs (14), two sections of symmetrical No. two circular arcs (18), two sections of symmetrical No. three arcs (19) and Two sections of symmetrical No. four circular arcs (20) compositions；No. three arcs (19) side is adjacent with No. two circular arcs (18), and No. three arcs (19) are another Side is adjacent with No. four circular arcs (20)；The No.1 arc (14) is between No. two circular arcs (18) and No. four circular arcs (20)；It is described No.1 rotating wheel (13) side is equipped with No. two sliding slots, and No. two sliding blocks (17) are slided in No. two sliding slots.

3. a kind of semiconductor diode formation system according to claim 1, it is characterised in that：The sharpening block (4) one End is hinged on by No. two fixed links (33) in rack (1), and sharpening block (4) is slidably mounted on No. two plates (31), passes through sharpening Sliding of the block (4) on No. two plates (31) sharpens forming cutter (32).

4. a kind of semiconductor diode formation system according to claim 1, it is characterised in that：In the lower plate (23) Offer No. four sliding slots (231) and No. five sliding slots (232)；No. four sliding slots (231) are semicircular annular groove；Described No. five Sliding slot (232) is straight trough, and the number of No. five sliding slots (232) is three and No. four sliding slots (231) of cooperation arrange at semi-circumference；It is described Annular rack (233) and No.1 spring (234) are equipped in No. four sliding slots (231), the annular rack (233) is in No. four sliding slots (231) sliding, annular rack (233) one end are fixedly connected by No.1 spring (234) with lower plate (23) in, annular rack (233) spin (235) is fixedly mounted in the other end；No.1 gear (236) and lead screw are equipped in No. five sliding slots (232) (237)；It is equipped with ring block (238) in half circle in the lower plate (23)；Described lead screw (237) one end and No.1 tooth Wheel (236) is fixedly connected, and lead screw (237) other end is threadedly coupled with ring block (238)；The No.1 gear (236) and annular Rack (233) engaged transmission；Lead screw (237) rotation is for driving ring block (238) sliding in No. four sliding slots (231).

5. a kind of semiconductor diode formation system according to claim 4, it is characterised in that：On the spin (235) Side is equipped with position control unit (5), and position control unit (5) is mounted on upper plate (22) side；The position control unit (5) Including No. three plates (51), No. four plates (52), No. two springs (53) and fixing bolt (54)；No. three plates (51) quantity is two pieces, No. three plate (51) sides are wavy；No. four plates (52) both sides are wavy；No. four plates (52) are located at two No. three Between plate (51) and No. three plates (51) and No. four plates (52) cooperate；No. three plates (51) are solid by No.1 spring (234) Surely it is connected on upper plate (22) side.