CN108748748B - Semiconductor diode forming system - Google Patents
Semiconductor diode forming system Download PDFInfo
- Publication number
- CN108748748B CN108748748B CN201810534865.4A CN201810534865A CN108748748B CN 108748748 B CN108748748 B CN 108748748B CN 201810534865 A CN201810534865 A CN 201810534865A CN 108748748 B CN108748748 B CN 108748748B
- Authority
- CN
- China
- Prior art keywords
- plate
- block
- bottom plate
- semiconductor diode
- shearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
- B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention belongs to the technical field of semiconductor diode production, and particularly relates to a semiconductor diode molding system which comprises a rack, a first plate, a clamping module, a shearing module, a blade grinding block and a position control unit, wherein the first plate is arranged on the rack; the fixing bolt is loosened and moved up and down to move the fourth plate to a proper position, the fixing bolt is screwed again, the rotation amplitude of the annular rack is adjusted by changing the extension length of the fourth plate, the rotation amplitude of the annular rack is changed, and correspondingly, the sliding distance of the annular block in the fourth sliding groove is changed, so that semiconductor diode leads with different thicknesses are clamped; then, through the motion track of the second sliding block in the first rotating wheel, the forming cutter in the second plate performs three effects of pre-shearing, opening and shearing on the semiconductor diode lead, and meanwhile, the blade grinding block sharpens the forming cutter, so that the cutting edge of the forming cutter is sharp, and the shearing efficiency and effect of the semiconductor diode lead are improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor diode production, and particularly relates to a semiconductor diode forming system.
Background
Diodes are also known as crystal diodes, abbreviated as diodes, and in addition, early vacuum electronic diodes; it is an electronic component with unidirectional conduction of current. In an electronic component, a device having two electrodes allows current to flow in only a single direction. The most common function of a diode is to allow current to pass in a single direction (referred to as forward biasing) and to block current in the reverse direction (referred to as reverse biasing). Thus, the diode can be thought of as an electronic version of the check valve.
Some technical solutions of diode forming devices also exist in the prior art, for example, a chinese patent with an application number of 201120381398.X discloses a diode forming device in the field of semiconductor diodes, which includes a base, a U-shaped clamping groove, a pressing block, a spring, a forming knife, a knife head, a transmission device and a mold, wherein the U-shaped clamping groove is installed on the base, and the mold is installed inside the U-shaped clamping groove; a spring is arranged on the inner side of the lower end of the cutter head, and a pressing block is connected below the spring; the outer side of the lower end of the cutter head is provided with a forming cutter close to the spring; the upper end of the cutter head is connected with a power source through a transmission device.
The technical scheme has the advantages that the device is high in adjustability, capable of simultaneously completing preforming of multiple diodes, high in forming precision and simple in operation, and the working efficiency can be greatly improved. However, the technical solution cannot be used for diodes of different sizes and the diodes cannot be pre-clamped during clamping of the diodes; meanwhile, the diode can not be pre-cut in the cutting process of the diode, and the cutting edge sharpness of the forming cutter is not improved. Therefore, this solution is limited.
Disclosure of Invention
In order to make up for the defects of the prior art, the semiconductor diode forming system provided by the invention has the advantages that the fixing bolt is loosened, the fourth plate is moved to a proper position by moving up and down, the fixing bolt is screwed again, the rotation amplitude of the annular rack is adjusted by changing the extending length of the fourth plate, the rotation amplitude of the annular rack is changed, the sliding distance of the annular block in the fourth sliding groove is correspondingly changed, and the semiconductor diodes with different thicknesses are clamped; then, through the motion track of the second sliding block in the first rotating wheel, the forming cutter in the second plate performs three effects of pre-shearing, opening and shearing on the semiconductor diode, and meanwhile, the blade grinding block sharpens the forming cutter, so that the cutting edge of the forming cutter is sharp, and the shearing efficiency and effect of the semiconductor diode are improved.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention discloses a semiconductor diode forming system which comprises a rack, a first plate, a clamping module, a shearing module and a cutter grinding block, wherein the first plate is fixed on the rack; the first motor is arranged on the first plate; a first rotating wheel is fixedly connected to the first motor rotating shaft; a first sliding block is slidably mounted on the upright column on the right side of the rack; one end of the first sliding block is hinged with a first fixing rod; one end of the first fixing rod is fixedly connected with a second sliding block; the second sliding block slides on the outer ring of the first rotating wheel; one end of the shearing module is hinged with the first sliding block, the other end of the shearing module is hinged with the rack, the shearing module is four second plates, each second plate is hinged into a parallelogram in pairs, and a forming cutter is fixedly mounted at the shearing position on each second plate; the forming cutter divides the second plate into a shearing area and a non-shearing area; the clamping module comprises a first pneumatic cylinder, an upper bottom plate and a lower bottom plate; a first pneumatic cylinder is fixedly arranged in the middle of the top of the frame, and a lower bottom plate is fixedly arranged in the middle of the bottom of the frame; the middle position of the upper surface of the lower bottom plate is provided with a half circle; an upper bottom plate is fixedly arranged at the bottom of the first pneumatic cylinder; a half circle is arranged in the middle of the lower surface of the upper bottom plate; the upper bottom plate is matched with the lower bottom plate for use; when the semiconductor diode clamping device works, the semiconductor diode is placed in a half circle of the lower bottom plate, the first pneumatic cylinder is adjusted, the upper bottom plate fixedly installed at the bottom of the first pneumatic cylinder moves downwards, and the half circle of the lower surface of the upper bottom plate and the half circle of the lower bottom plate are matched with each other to clamp the semiconductor diode; at the moment, a first motor switch is turned on, a first motor drives a first rotating wheel to rotate, a second sliding block in the first rotating wheel drives a first sliding block to move through a first fixing rod, and the first sliding block enables a forming cutter in a shearing module hinged with the first sliding block to shear the clamped semiconductor diode in the outward moving process.
Preferably, the first rotating wheel outer ring consists of two sections of symmetrical first arcs, two sections of symmetrical second arcs, two sections of symmetrical third arcs and two sections of symmetrical fourth arcs; one side of the third arc is adjacent to the second arc, and the other side of the third arc is adjacent to the fourth arc; the first arc is positioned between the second arc and the fourth arc; a second sliding groove is formed in the side edge of the first rotating wheel, and the second sliding block slides in the second sliding groove; the motion track of the second sliding block in the second sliding groove produces different effects; firstly, when the second sliding block is located at the first arc position, the second plate is completely opened, the forming cutter in the second plate does not produce shearing action on the semiconductor diode, when the second sliding block moves to the second arc position, the second plate is slowly closed, the forming cutter in the second plate pre-shears the semiconductor diode, then when the second sliding block moves to the third arc position, the second plate is slightly opened, the forming cutter in the second plate is far away from the semiconductor diode, and finally when the second sliding block moves to the fourth arc position, the second plate is completely closed, and the forming cutter in the second plate shears the semiconductor diode.
Preferably, one end of the edge grinding block is hinged to the rack through a second fixing rod, the edge grinding block is slidably mounted on a second plate, and the formed cutter is ground through the sliding of the edge grinding block on the second plate; when the second plate is opened, the sharpening block moves to one side of the shearing area, the edge grinding block sharpens the forming cutter, when the second plate is closed, the sharpening block moves to one side of the non-shearing area, and the edge grinding block does not sharpen the forming cutter; the forming cutter is sharpened through the blade grinding block, so that the sharpness of the cutting edge of the forming cutter is improved, and the efficiency of shearing the semiconductor diode by the forming cutter is improved.
Preferably, a fourth sliding groove and a fifth sliding groove are formed in the lower bottom plate; the fourth sliding groove is a semicircular annular groove; the number of the fifth sliding grooves is three, and the fifth sliding grooves are matched with the fourth sliding grooves to form semi-circular arrangement; an annular rack and a first spring are arranged in the fourth sliding chute, the annular rack slides in the fourth sliding chute, one end of the annular rack is fixedly connected with the lower bottom plate through the first spring, and a rolling ball is fixedly arranged at the other end of the annular rack; a first gear and a screw rod are arranged in the fifth sliding chute; an annular block is arranged in a half circle in the lower bottom plate; one end of the screw rod is fixedly connected with the first gear, and the other end of the screw rod is in threaded connection with the annular block; the first gear is in meshed transmission with the annular rack; the screw rod rotates to drive the annular block to slide in the fifth sliding groove; when the upper bottom plate is contacted with the lower bottom plate, the rolling balls are stressed, the rolling balls push the annular rack to slide in the fourth sliding groove, the annular rack enables the meshed first gear to rotate, the screw rod enables the annular block to be pushed upwards, so that the annular block pre-clamps the semiconductor diode to prevent displacement, and then the rolling balls are not stressed by the first spring to rebound, so that the tooth-shaped strips are restored to the original positions, and the annular block correspondingly returns to the original positions; when the rolling ball is stressed again, the annular rack is continuously meshed with the first gear, the screw rod pushes the annular block to clamp the semiconductor diode, the rolling ball is kept continuously stressed, and the annular block firmly clamps the semiconductor diode; after the semiconductor diode is cut off, the first pneumatic cylinder drives the upper bottom plate to move upwards, the fourth plate is separated from the rolling ball, the first spring enables the annular rack to be bounced to the original position, and the annular block stretches out and draws back.
Preferably, a position control unit is arranged above the rolling ball and is arranged on one side of the upper bottom plate; the position control unit comprises a third plate, a fourth plate, a second spring and a fixing bolt; the number of the third plate is two, and one side of the third plate is wavy; the two sides of the fourth plate are wavy; the fourth plate is positioned between the two third plates, and the third plate and the fourth plate are matched with each other; the third plate is fixedly connected to the side edge of the upper bottom plate through a second spring; when semiconductor diodes with different thicknesses are required to be cut, the fixing bolts are loosened and move up and down to move the fourth plate to a proper position, the fixing bolts are screwed again, the extending length of the fourth plate is changed to adjust the rotating amplitude of the annular rack, the rotating amplitude of the annular rack is changed, the sliding distance of the annular block in the fourth sliding groove is correspondingly changed, and therefore the semiconductor diodes with different thicknesses are clamped.
The invention has the following beneficial effects:
1. according to the semiconductor diode forming system, the shearing module, the first rotating wheel, the first sliding block, the second sliding block and the first fixing rod are matched with each other, and the movement track of the second sliding block in the first rotating wheel enables the shearing module to generate three shearing effects in the shearing process of a semiconductor diode, namely micro shearing, micro opening and shearing, so that burrs are prevented from being generated on the surface of the semiconductor diode in the shearing process, and the shearing effect of the semiconductor diode is improved.
2. According to the semiconductor diode forming system, the four plates collide with the rolling balls, so that the annular rack is meshed with the first gear and pushes the annular block to pre-clamp the semiconductor diode, the semiconductor diode is prevented from shifting, and then the four plates are fixed, so that the annular block firmly clamps the semiconductor diode, the clamping effect is improved, and the shearing effect is further improved.
3. According to the semiconductor diode forming system, the forming cutter in the second plate is sharpened by the edge grinding block, so that the cutting edge of the forming cutter is sharp, and the efficiency of shearing a semiconductor diode by the forming cutter is improved.
4. According to the semiconductor diode forming system, the contact between the four-number plate and the rolling ball is adjusted aiming at the semiconductor diodes with different sizes through the adjusting position control unit, so that the annular plate clamps the semiconductor diodes, and the clamping applicability is improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a front view of the present invention;
FIG. 2 is a cross-sectional view A-A of FIG. 1;
FIG. 3 is a cross-sectional view B-B of FIG. 2;
FIG. 4 is a cross-sectional view of C-C of FIG. 1;
FIG. 5 is an enlarged view of a portion D of FIG. 3;
in the figure: the cutting device comprises a frame 1, a first plate 11, a clamping module 2, a shearing module 3, a sharpening block 4, a first rotating wheel 13, a first sliding block 15, a first fixing rod 16, a second sliding block 17, a second plate 31, a forming knife 32, a shearing area 33, a non-shearing area 34, a first pneumatic cylinder 21, an upper base plate 22, a lower base plate 23, a first arc 14, a second arc 18, a third arc 19, a fourth arc 20, a fourth sliding groove 231, a fifth sliding groove 232, an annular rack 233, a first spring 234, a rolling ball 235, a first gear 236, a screw rod 237, an annular block 238, a position control unit 5, a third plate 51, a fourth plate 52, a second spring 53 and a fixing bolt 54.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 4, the semiconductor diode molding system of the present invention comprises a frame 1, a plate 11, a clamping module 2, a shearing module 3 and a sharpening block 4; a first motor is arranged on the first plate 11; a first rotating wheel 13 is fixedly connected to the first motor rotating shaft; a first sliding block 15 is slidably mounted on the upright column on the right side of the rack 1; one end of the first sliding block 15 is hinged with a first fixing rod 16; one end of the first fixing rod 16 is fixedly connected with a second sliding block 17; the second sliding block 17 slides on the outer ring of the first rotating wheel 13; one end of the shearing module 3 is hinged with the first sliding block 15, the other end of the shearing module 3 is hinged with the rack 1, the shearing module 3 is provided with four second plates 31, each second plate 31 is hinged into a parallelogram in pairs, and a shearing position on each second plate 31 is fixedly provided with a forming cutter 32; the forming knife 32 divides the second plate 31 into a shearing area 33 and a non-shearing area 34; the clamping module 2 comprises a first pneumatic cylinder 21, an upper bottom plate 22 and a lower bottom plate 23; a first pneumatic cylinder 21 is fixedly arranged in the middle of the top of the frame 1, and a lower bottom plate 23 is fixedly arranged in the middle of the bottom of the frame 1; a half circle is arranged in the middle of the upper surface of the lower bottom plate 23; the bottom of the first pneumatic cylinder 21 is fixedly provided with an upper bottom plate 22; a half circle is arranged in the middle of the lower surface of the upper bottom plate 22; the upper bottom plate 22 is matched with the lower bottom plate 23 for use; when the semiconductor diode clamping device works, a semiconductor diode is placed in a half circle of the lower bottom plate 23, the first pneumatic cylinder 21 is adjusted, the upper bottom plate 22 fixedly installed at the bottom of the first pneumatic cylinder 21 moves downwards, and the half circle of the lower surface of the upper bottom plate 22 and the half circle of the lower bottom plate 23 are matched with each other to clamp the semiconductor diode; at the moment, a first motor switch is turned on, the first motor drives the first rotating wheel 13 to rotate, the second sliding block 17 in the first rotating wheel 13 drives the first sliding block 15 to move through the first fixing rod 16, and the first sliding block 15 enables the forming knife 32 in the shearing module 3 hinged with the first sliding block 15 to shear the clamped semiconductor diode in the outward moving process.
As an embodiment of the invention, the outer ring of the first rotating wheel 13 is composed of two symmetrical first arcs 14, two symmetrical second arcs 18, two symmetrical third arcs 19 and two symmetrical fourth arcs 20; one side of the third arc 19 is adjacent to the second arc 18, and the other side of the third arc 19 is adjacent to the fourth arc 20; the first arc 14 is positioned between the second arc 18 and the fourth arc 20; a second sliding groove is formed in the side edge of the first rotating wheel 13, and the second sliding block 17 slides in the second sliding groove; the motion track of the second sliding block 17 in the second sliding groove produces different effects; firstly, when the second slide block 17 is at the first arc position 14, the second plate 31 is completely opened, the forming cutter 32 in the second plate 31 does not produce shearing action on the semiconductor diode, when the second slide block 17 moves to the second arc 18 position, the second plate 31 is slowly closed, the forming cutter 32 in the second plate 31 performs pre-shearing on the semiconductor diode, then when the second slide block 17 moves to the third arc 19 position, the second plate 31 is slightly opened, the forming cutter 32 in the second plate 31 is far away from the semiconductor diode, and finally when the second slide block 17 moves to the fourth arc 20 position, the second plate 31 is completely closed, and the forming cutter 32 in the second plate 31 cuts the semiconductor diode.
As an embodiment of the invention, one end of the edge grinding block 4 is hinged on the frame 1 through a second fixing rod, the edge grinding block 4 is slidably mounted on a second plate 31, and the forming knife 32 is ground through the sliding of the edge grinding block 4 on the second plate 31; when the second plate 31 is unfolded, the sharpening block 4 moves towards one side of the shearing area 33, the sharpening block 4 sharpens the forming knife 32, when the second plate 31 is closed, the sharpening block 4 moves towards one side of the non-shearing area 34, and the sharpening block 4 does not sharpen the forming knife 32; the forming cutter 32 is sharpened through the blade grinding block 4, so that the sharpness of the cutting edge of the forming cutter 32 is improved, and the efficiency of shearing the semiconductor diode by the forming cutter 32 is improved.
As an embodiment of the present invention, a fourth sliding groove 231 and a fifth sliding groove 232 are formed in the lower bottom plate 23; the fourth sliding groove 231 is a semicircular annular groove; the number of the fifth sliding grooves 232 is three, and the fifth sliding grooves 232 are matched with the fourth sliding grooves 231 to form semi-circle arrangement; an annular rack 233 and a first spring 234 are arranged in the fourth sliding chute 231, the annular rack 233 slides in the fourth sliding chute 231, one end of the annular rack 233 is fixedly connected with the lower bottom plate 23 through the first spring 234, and a rolling ball 235 is fixedly arranged at the other end of the annular rack 233; a first gear 236 and a screw rod 237 are arranged in the fifth sliding groove 232; a ring-shaped block 238 is arranged in a half circle in the lower bottom plate 23; one end of the screw rod 237 is fixedly connected with the first gear 236, and the other end of the screw rod 237 is in threaded connection with the annular block 238; the first gear 236 is in meshed transmission with the annular rack 233; the screw shaft 237 is rotated to drive the annular block 238 to slide in the No. five sliding groove 232; when the upper bottom plate 22 is contacted with the lower bottom plate 23, the rolling balls 235 are stressed, the rolling balls 235 push the annular rack 233 to slide in the fourth sliding groove 231, the annular rack 233 rotates the meshed first gear 236, the screw rod 237 pushes the annular block 238 upwards, so that the annular block 238 pre-clamps the semiconductor diode to prevent displacement, and then the rolling balls 235 are not stressed by the first spring 234 to rebound to restore the toothed strip to the original position, and the annular block 238 correspondingly returns to the original position; when the rolling ball 235 is stressed again, the annular rack 233 is continuously meshed with the first gear 236, the screw rod 237 pushes the annular block 238 to clamp the semiconductor diode, the rolling ball 235 is kept stressed continuously, and the annular block 238 firmly clamps the semiconductor diode; after the semiconductor diode is cut off, the first pneumatic cylinder 21 drives the upper bottom plate 22 to move upwards, the fourth plate 52 is separated from the rolling balls 235, the first spring 234 springs the annular rack 233 to the original position, and the annular block 238 stretches.
As an embodiment of the invention, a position control unit 5 is arranged above the rolling ball 235, and the position control unit 5 is installed on one side of the upper bottom plate 22; the position control unit 5 comprises a third plate 51, a fourth plate 52, a second spring 53 and a fixing bolt 54; the number of the third plates 51 is two, and one side of each third plate 51 is wavy; the two sides of the fourth plate 52 are wavy; the fourth plate 52 is positioned between the two third plates 51, and the third plates 51 and the fourth plate 52 are matched with each other; the third plate 51 is fixedly connected to the side edge of the upper bottom plate 22 through a second spring 53; when semiconductor diodes with different thicknesses need to be cut, the fixing bolt 54 is loosened, the fourth plate 52 is moved to a proper position by moving up and down, the fixing bolt 54 is screwed again, the rotation amplitude of the annular rack 233 is adjusted by changing the extension length of the fourth plate 52, the rotation amplitude of the annular rack 233 is changed, and accordingly the sliding distance of the annular block 238 in the fourth sliding groove 231 is changed, so that the semiconductor diodes with different thicknesses are clamped.
When the semiconductor diode clamping device works, firstly, the semiconductor diode is placed in a half circle in the upper surface of the lower base plate 23, the pneumatic cylinder is adjusted, so that the upper base plate 22 moves downwards, the fixing bolt 54 is loosened, the four-size plate 52 moves up and down to a proper position, the fixing bolt 54 is screwed again, the rotation amplitude of the annular rack 233 is adjusted through the change of the extending length of the four-size plate 52, the rotation amplitude of the annular rack 233 changes, and correspondingly, the sliding distance of the annular block 238 in the four-size sliding groove 231 changes, so that the semiconductor diodes with different thicknesses are clamped; at the moment, the first motor is started, the first motor drives the first rotating wheel 13 to rotate, the forming cutter 32 is correspondingly driven to cut, when the second sliding block 17 is located at the first arc position 14, the forming cutter 32 does not produce a cutting effect on the semiconductor diode, when the second sliding block 17 moves to the second arc 18 position, the forming cutter 32 pre-cuts the semiconductor diode, then when the second sliding block 17 moves to the third arc 19 position, the forming cutter 32 is far away from the semiconductor diode, and finally when the second sliding block 17 moves to the fourth arc 20 position, the forming cutter 32 cuts the semiconductor diode, when the forming cutter 32 cuts, the cutter edge grinding block 4 slides away from the forming cutter 32, and when the forming cutter 32 does not cut, the cutter edge grinding block 4 carries out cutter edge grinding on the forming cutter 32; after the semiconductor diode is cut off, when the second sliding block 17 is located at the first arc position 14, the second plate 31 is opened, the first motor is turned off, the first pneumatic cylinder 21 is adjusted to drive the upper base plate 22 to be far away from the lower base plate 23, and the cut semiconductor diode is taken out of the rack 1 from the lower base plate 23.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A semiconductor diode molding system comprising a frame (1), characterized in that: the cutting device also comprises a first plate (11), a clamping module (2), a shearing module (3) and a blade grinding block (4); a first motor is arranged on the first plate (11); a first rotating wheel (13) is fixedly connected to the first motor rotating shaft; a first sliding block (15) is slidably mounted on the upright column on the right side of the rack (1); one end of the first sliding block (15) is hinged with a first fixing rod (16); one end of the first fixing rod (16) is fixedly connected with a second sliding block (17); the second sliding block (17) slides on the outer ring of the first rotating wheel (13); one end of the shearing module (3) is hinged with the first sliding block (15), the other end of the shearing module (3) is hinged with the rack (1), the shearing module (3) is provided with four second plates (31), each two second plates (31) are hinged into a parallelogram, and a forming cutter (32) is fixedly installed at the shearing position on each second plate (31); the forming knife (32) divides the second plate (31) into a shearing area (33) and a non-shearing area (34); the clamping module (2) comprises a first pneumatic cylinder (21), an upper bottom plate (22) and a lower bottom plate (23); a first pneumatic cylinder (21) is fixedly arranged in the middle of the top of the frame (1), and a lower bottom plate (23) is fixedly arranged in the middle of the bottom of the frame (1); the middle position of the upper surface of the lower bottom plate (23) is provided with a half circle; an upper bottom plate (22) is fixedly arranged at the bottom of the first pneumatic cylinder (21); the middle position of the lower surface of the upper bottom plate (22) is provided with a half circle; the upper bottom plate (22) is matched with the lower bottom plate (23) for use;
the outer ring of the first rotating wheel (13) consists of two sections of symmetrical first arcs (14), two sections of symmetrical second arcs (18), two sections of symmetrical third arcs (19) and two sections of symmetrical fourth arcs (20); one side of the third arc (19) is adjacent to the second arc (18), and the other side of the third arc (19) is adjacent to the fourth arc (20); the first arc (14) is positioned between the second arc (18) and the fourth arc (20); a second sliding groove is formed in the side edge of the first rotating wheel (13), and the second sliding block (17) slides in the second sliding groove.
2. The semiconductor diode molding system of claim 1, wherein: one end of the blade grinding block (4) is hinged to the rack (1) through a second fixing rod, the blade grinding block (4) is slidably mounted on a second plate (31), and the forming knife (32) is sharpened through the sliding of the blade grinding block (4) on the second plate (31).
3. The semiconductor diode molding system of claim 1, wherein: a fourth sliding groove (231) and a fifth sliding groove (232) are formed in the lower bottom plate (23); the fourth sliding groove (231) is a semicircular annular groove; the number of the fifth sliding grooves (232) is three, and the fifth sliding grooves (232) are matched with the fourth sliding grooves (231) to form semi-circular arrangement; an annular rack (233) and a first spring (234) are arranged in the fourth sliding groove (231), the annular rack (233) slides in the fourth sliding groove (231), one end of the annular rack (233) is fixedly connected with the lower bottom plate (23) through the first spring (234), and the other end of the annular rack (233) is fixedly provided with a rolling ball (235); a first gear (236) and a screw rod (237) are arranged in the fifth sliding groove (232); an annular block (238) is arranged in a half circle in the lower bottom plate (23); one end of the screw rod (237) is fixedly connected with the first gear (236), and the other end of the screw rod (237) is in threaded connection with the annular block (238); the first gear (236) is in meshed transmission with the annular rack (233); the screw rod (237) rotates to drive the annular block (238) to slide in the No. five sliding groove (232).
4. A semiconductor diode molding system as claimed in claim 3, wherein: a position control unit (5) is arranged above the rolling ball (235), and the position control unit (5) is arranged on one side of the upper bottom plate (22); the position control unit (5) comprises a third plate (51), a fourth plate (52), a second spring (53) and a fixing bolt (54); the number of the third plates (51) is two, and one side of each third plate (51) is wavy; the two sides of the fourth plate (52) are wavy; the fourth plate (52) is positioned between the two third plates (51) and the fourth plates (52) are matched with each other; the third plate (51) is fixedly connected to the side edge of the upper bottom plate (22) through a second spring (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810534865.4A CN108748748B (en) | 2018-05-29 | 2018-05-29 | Semiconductor diode forming system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810534865.4A CN108748748B (en) | 2018-05-29 | 2018-05-29 | Semiconductor diode forming system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108748748A CN108748748A (en) | 2018-11-06 |
| CN108748748B true CN108748748B (en) | 2020-09-04 |
Family
ID=64003763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810534865.4A Active CN108748748B (en) | 2018-05-29 | 2018-05-29 | Semiconductor diode forming system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108748748B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413887B (en) * | 2018-12-05 | 2021-04-02 | 江苏春都钢结构工程有限公司 | SMT steel mesh frame with replaceable steel sheets |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224296A (en) * | 1993-01-27 | 1994-08-12 | Sumitomo Electric Ind Ltd | Method and apparatus for dicing semiconductor wafer |
| CN2181189Y (en) * | 1993-12-01 | 1994-11-02 | 文登市黄海包装机械厂 | Shaping device for edible ball shaper |
| CN103962477A (en) * | 2014-05-28 | 2014-08-06 | 阿博建材（昆山）有限公司 | Pin cutting machine |
| CN104289636A (en) * | 2013-07-19 | 2015-01-21 | 兴勤（宜昌）电子有限公司 | Electronic element pin cutting-off device |
| CN204524112U (en) * | 2015-04-17 | 2015-08-05 | 乐清市浙佳电子科技有限公司 | Intelligence cutter |
| CN206126444U (en) * | 2016-11-07 | 2017-04-26 | 杭州新余宏机械有限公司 | Multireel automatic cutting winding mechanism |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080251557A1 (en) * | 2007-04-12 | 2008-10-16 | Sang-Kil Kim | Scribing unit and apparatus for scribing panel with the scribing unit, and scribing method and method for manufacutring substrate |
-
2018
- 2018-05-29 CN CN201810534865.4A patent/CN108748748B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06224296A (en) * | 1993-01-27 | 1994-08-12 | Sumitomo Electric Ind Ltd | Method and apparatus for dicing semiconductor wafer |
| CN2181189Y (en) * | 1993-12-01 | 1994-11-02 | 文登市黄海包装机械厂 | Shaping device for edible ball shaper |
| CN104289636A (en) * | 2013-07-19 | 2015-01-21 | 兴勤（宜昌）电子有限公司 | Electronic element pin cutting-off device |
| CN103962477A (en) * | 2014-05-28 | 2014-08-06 | 阿博建材（昆山）有限公司 | Pin cutting machine |
| CN204524112U (en) * | 2015-04-17 | 2015-08-05 | 乐清市浙佳电子科技有限公司 | Intelligence cutter |
| CN206126444U (en) * | 2016-11-07 | 2017-04-26 | 杭州新余宏机械有限公司 | Multireel automatic cutting winding mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108748748A (en) | 2018-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108748748B (en) | Semiconductor diode forming system | |
| CN104723180A (en) | Cutting edge grinding mechanism for automatic grinding device of surgical blade cutting edge and grinding device | |
| CN111085907B (en) | Scalpel equipment of polishing | |
| CN108179691B (en) | Broken all-in-one of road cutting | |
| US20170106460A1 (en) | Blade Sharpening and Setting System | |
| CN203875919U (en) | Device for cutting meat and vegetables | |
| CN209699234U (en) | A kind of automatic notch cutter | |
| CN109105443B (en) | Automatic chop cutting device of whetting a knife | |
| CN111531216A (en) | Flange gasket cutting device | |
| CN114406357B (en) | Cutting process device that machine part processing was used | |
| CN203600315U (en) | Flexible pipe cutting device | |
| CN108630553B (en) | A kind of semiconductor diode production technology | |
| CN102251383A (en) | Fabric cutting device | |
| CN211247905U (en) | Part punching and shearing device | |
| CN209936501U (en) | Grinding device for processing longitudinal shearing blade | |
| CN210877862U (en) | Saw blade gear grinding equipment for steel pipe cold saw | |
| US2870837A (en) | High speed pivoted cutting machine | |
| CN211054127U (en) | Perforating device of diamond cutting piece | |
| US1527295A (en) | Wheel-trimming device | |
| CN218802413U (en) | Rubber product overlap punching device | |
| CN212443425U (en) | Flange gasket cutting device | |
| CN104723153A (en) | Tool feed device | |
| CN211591471U (en) | Perforating device is used in carton production | |
| CN111267149B (en) | Novel scissors | |
| CN202007352U (en) | Fabric cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200731 Address after: 234200 Anhui Suzhou Lingbi county first middle school dormitory Applicant after: Lingbi branch of Anhui Yinuo Youth Industrial Design Co., Ltd Address before: 310018 Hangzhou University of Electronic Science and Technology, No. 1158, No. 2 Main Street, Baiyang Street, Jingkai District, Hangzhou City, Zhejiang Province Applicant before: Chen Xinjie |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220321 Address after: 213000 No. 11 Qingyang North Road, Tianning District, Changzhou City, Jiangsu Province Patentee after: Jiangsu xingeno Electronic Technology Co.,Ltd. Address before: 234200 Anhui Lingbi Suzhou County No. 1 middle school dormitory Patentee before: Lingbi branch of Anhui Yinuo Youth Industrial Design Co.,Ltd. |
|
| TR01 | Transfer of patent right |