CN108736844A - 一种准单片集成氮化镓高功率放大器及组装方法 - Google Patents
一种准单片集成氮化镓高功率放大器及组装方法 Download PDFInfo
- Publication number
- CN108736844A CN108736844A CN201810939733.XA CN201810939733A CN108736844A CN 108736844 A CN108736844 A CN 108736844A CN 201810939733 A CN201810939733 A CN 201810939733A CN 108736844 A CN108736844 A CN 108736844A
- Authority
- CN
- China
- Prior art keywords
- chip
- gallium nitride
- gaas
- power amplifier
- quasi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 63
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000010354 integration Effects 0.000 title claims abstract description 22
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract description 38
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 18
- 238000003786 synthesis reaction Methods 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 230000005496 eutectics Effects 0.000 claims description 10
- 238000004088 simulation Methods 0.000 claims description 9
- 238000005245 sintering Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- 229910052733 gallium Inorganic materials 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 229910001182 Mo alloy Inorganic materials 0.000 description 3
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000024241 parasitism Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2113/00—Details relating to the application field
- G06F2113/20—Packaging, e.g. boxes or containers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Amplifiers (AREA)
- Microwave Amplifiers (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810939733.XA CN108736844A (zh) | 2018-08-17 | 2018-08-17 | 一种准单片集成氮化镓高功率放大器及组装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810939733.XA CN108736844A (zh) | 2018-08-17 | 2018-08-17 | 一种准单片集成氮化镓高功率放大器及组装方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108736844A true CN108736844A (zh) | 2018-11-02 |
Family
ID=63941555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810939733.XA Pending CN108736844A (zh) | 2018-08-17 | 2018-08-17 | 一种准单片集成氮化镓高功率放大器及组装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108736844A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109638495A (zh) * | 2018-11-28 | 2019-04-16 | 北京遥测技术研究所 | 一种柔性连接电路接口及高可靠柔性电路连接装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009239882A (ja) * | 2008-03-04 | 2009-10-15 | Japan Radio Co Ltd | 高周波電力増幅器 |
CN102522378A (zh) * | 2011-11-29 | 2012-06-27 | 中国电子科技集团公司第五十五研究所 | 分散式镜像高功率管芯 |
CN105846784A (zh) * | 2016-03-21 | 2016-08-10 | 天津大学 | GaN HEMT多级射频功率放大器设计方法及放大器 |
CN106067771A (zh) * | 2016-07-05 | 2016-11-02 | 成都泰格微电子研究所有限责任公司 | 4.0‑5.0 GHz 8W GaN单片功率放大器及设计方法 |
CN207442799U (zh) * | 2017-12-05 | 2018-06-01 | 成都镓谷半导体有限公司 | 一种砷化镓多路功率合成放大器 |
CN208572044U (zh) * | 2018-08-17 | 2019-03-01 | 成都航天科工微电子系统研究院有限公司 | 一种准单片集成氮化镓高功率放大器 |
-
2018
- 2018-08-17 CN CN201810939733.XA patent/CN108736844A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009239882A (ja) * | 2008-03-04 | 2009-10-15 | Japan Radio Co Ltd | 高周波電力増幅器 |
CN102522378A (zh) * | 2011-11-29 | 2012-06-27 | 中国电子科技集团公司第五十五研究所 | 分散式镜像高功率管芯 |
CN105846784A (zh) * | 2016-03-21 | 2016-08-10 | 天津大学 | GaN HEMT多级射频功率放大器设计方法及放大器 |
CN106067771A (zh) * | 2016-07-05 | 2016-11-02 | 成都泰格微电子研究所有限责任公司 | 4.0‑5.0 GHz 8W GaN单片功率放大器及设计方法 |
CN207442799U (zh) * | 2017-12-05 | 2018-06-01 | 成都镓谷半导体有限公司 | 一种砷化镓多路功率合成放大器 |
CN208572044U (zh) * | 2018-08-17 | 2019-03-01 | 成都航天科工微电子系统研究院有限公司 | 一种准单片集成氮化镓高功率放大器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109638495A (zh) * | 2018-11-28 | 2019-04-16 | 北京遥测技术研究所 | 一种柔性连接电路接口及高可靠柔性电路连接装置 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3331161A1 (en) | Amplifier die with elongated side pads, and amplifier modules that incorporate such amplifier die | |
Jen et al. | Design and analysis of a 55–71-GHz compact and broadband distributed active transformer power amplifier in 90-nm CMOS process | |
Heinrich | The flip-chip approach for millimeter wave packaging | |
KR101948383B1 (ko) | 단일 금속 플랜지를 갖는 멀티 캐비티 패키지 | |
CN108233876A (zh) | 具有并联电感电路的多尔蒂放大器及放大器模块 | |
EP1145314B1 (en) | High frequency power transistor device | |
CN208572044U (zh) | 一种准单片集成氮化镓高功率放大器 | |
US7432778B2 (en) | Arrangement and method impedance matching | |
CN102709264B (zh) | 一种射频收发前端模块及其制备方法 | |
CN101436581A (zh) | 微波低波段超微型混合集成电路及其制备工艺 | |
CN108736844A (zh) | 一种准单片集成氮化镓高功率放大器及组装方法 | |
EP3627697A1 (en) | Systems and methods for fast switching time division duplex operation of power amplifiers | |
CN204836090U (zh) | 一种基于BT基板的GaAs和LDMOS/GaN混合集成微波功率放大器 | |
CN108631036A (zh) | 单芯片正交3dB定向耦合器 | |
JPH113916A (ja) | 高周波半導体装置及びその製造方法 | |
EP2509105A1 (en) | Semiconductor device having improved performance for high RF output powers | |
US8766714B2 (en) | Amplifier component comprising a compensation element | |
CN106129546B (zh) | 一种c波段数字移相滤波器 | |
EP2854291A1 (en) | Amplifier circuit with cross wiring of direct-current signals and microwave signals | |
US8698302B2 (en) | Power switching assembly having a robust gate connection | |
CN204669313U (zh) | 一种基于PCB工艺的GaAs和LDMOS/GaN混合集成微波放大器 | |
CN202586959U (zh) | 一种射频收发前端模块 | |
Jin et al. | A 1-V 45-GHz Balanced Amplifier With 21.5-dB Gain Using 0.18-$\mu {\hbox {m}} $ CMOS Technology | |
CN104883133A (zh) | 一种基于PCB工艺的GaAs和LDMOS/GaN混合集成微波放大器 | |
CN104810341A (zh) | 一种低寄生感抗的高频互连结构及其应用 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: No. 269, North Hupan Road, zone B, Tianfu New Economic Industrial Park, Tianfu new area, China (Sichuan) pilot Free Trade Zone, Chengdu, Sichuan Applicant after: Aerospace Science, engineering, Microelectronics System Research Institute Co., Ltd Applicant after: NANJING MILEWEI Corp. Address before: 610000 Sichuan city of Chengdu province Tianfu Tianfu Avenue South Huayang Street No. 846 Applicant before: CHENGDU AEROSPACE SCIENCE AND TECHNOLOGY MICROELECTRONICS SYSTEM RESEARCH INSTITUTE Co.,Ltd. Applicant before: NANJING MILEWEI Corp. |