CN108731827A - A kind of chip surface temperature measurement system and method - Google Patents
A kind of chip surface temperature measurement system and method Download PDFInfo
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- CN108731827A CN108731827A CN201710257415.0A CN201710257415A CN108731827A CN 108731827 A CN108731827 A CN 108731827A CN 201710257415 A CN201710257415 A CN 201710257415A CN 108731827 A CN108731827 A CN 108731827A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
Abstract
The invention discloses a kind of chip surface temperature measurement system and method, the system comprises：Programmable logic array module, for configuring chip operation state by dynamic analog, and for receiving the chip surface temperature value for measuring and obtaining；Chip carrier socket module, for placing chip to be measured, the chip carrier socket module is connect with the programmable logic array module by the link block with a variety of sockets；Temperature sensing module is sent to the programmable logic array module for measuring the chip surface temperature to be measured under each working condition, and by the chip surface temperature value obtained is measured；Power supply module, it is connect respectively with the programmable logic array module and chip carrier socket module, power supply is provided for circuit, the power supply module supports pulse width modulating technology, for when chip surface temperature to be measured is higher than preset value, controlling power supply module reduction power consumption by programmable logic array module to reduce chip temperature to be measured.
Description
Technical field
The present invention relates to chip makes physical feature measurement field more particularly to a kind of chip surface temperature measurement system and sides
Method.
Background technology
In the modern life electronic equipment oneself through having penetrated into the various aspects such as civilian, industrial, military.Electronic equipment operation
Reliability plays increasingly consequence for people's life；It is especially true in terms of military equipment, any one small element
Damage be likely to cause an immeasurable loss.The main failure forms of electronic equipment are thermal failures.With the increasing of temperature
Add, crash rate is exponentially increased trend.In electronics industry, when device environment temperature often increases 10 degree, often its crash rate
Increase an order of magnitude, here it is so-called " 10 degree of rules ".It is recorded according to pertinent literature, the crash rate of electronic equipment has 55%
It is that therefore, for electronic equipment, even reducing l degree, will also make the crash rate of equipment caused by temperature is more than defined value
A considerable magnitude is reduced, this is particularly important for the high electronic system of reliability requirement.For example, the electronic equipment of civil aviaton is every
1 degree is reduced, its crash rate will decline 4% under certain temperature.Therefore, obtain chip becomes in the surface temperature of various working conditions
Extremely important, reliable chip surface temperature measurement system researches and develops chip, verifies, and manufacture, detection is all very important.
Modern large scale integrated chip either number or simulation, radio frequency, are all to walk modular Integrated direction
Development, the operating mode of chip is very more, if each operating mode will do one piece of printed circuit board, burning program, then
Chip surface temperature is measured, takes time and effort, is unpractical in the R & D design stage of chip.Therefore, how to chip surface
Temperature measures, improve measurement efficiency, ensure measure everything goes well with your work carry out, become technical staff's problem needed to be considered.
Invention content
It is the general introduction of the theme to being described in detail herein below.This general introduction is not to limit the protection model of claim
It encloses.
An embodiment of the present invention provides a kind of chip surface temperature measurement system and methods, can realize to chip surface temperature
Degree measures, and improves measurement efficiency.
To achieve the goals above, an embodiment of the present invention provides a kind of chip surface temperature measurement systems, including：
Programmable logic array module for configuring chip operation state by dynamic analog, and is obtained for receiving to measure
The chip surface temperature value obtained；
Chip carrier socket module, for placing chip to be measured, the chip carrier socket module and the programmable logic array mould
Block is connected by the link block with a variety of sockets；
Temperature sensing module for measuring the chip surface temperature to be measured under each working condition, and will measure acquisition
Chip surface temperature value is sent to the programmable logic array module；
Power supply module connect with the programmable logic array module and chip carrier socket module, is provided for circuit respectively
Power supply, the power supply module support pulse width modulating technology, for when chip surface temperature to be measured is higher than preset value, passing through
Programmable logic array module control power supply module reduces power consumption to reduce chip temperature to be measured.
To achieve the goals above, the embodiment of the present invention additionally provides a kind of chip surface thermometry, including：
Obtain chip type to be measured；
The simulation operating mode parameter to prestore is obtained according to the chip type to be measured；
The simulation operating mode parameter is sent to chip to be measured；
Obtain chip to be measured various operating modes temperature data.
The embodiment of the present invention also provides a kind of computer readable storage medium, is stored with computer executable instructions, described
Computer executable instructions are performed the realization above method.
Compared with prior art, chip surface temperature measurement system and method provided in an embodiment of the present invention are realized in core
Piece designs or screening stage, carries out automatic measurement to chip surface temperature to be measured, obtains the physical characteristic of chip to be measured, from
And provide strong reference for chip design.Chip carrier socket module provided in an embodiment of the present invention can place a variety of cores to be measured
Piece, programmable logic array module provided in an embodiment of the present invention can configure various chip operation states with dynamic analog, and match
It closes the realization of the bus link block with multiple interfaces and various working status parameters is sent to chip to be measured, and then obtain to be measured
Temperature data of the chip under various working conditions.To which the embodiment of the present invention is compared to the prior art, may be implemented to more
The measurement of kind chip to be measured, improves work efficiency, and chip designer is facilitated to assess chip temperature characteristic.In order to protect test
Chip, the embodiment of the present invention also provide three kinds of feedbacks (rotation speed of the fan drops in drop voltage, frequency reducing rate) and adjust chip operating temperature,
To ensure that smooth, the reliable progress of test job, the consequence that chip will not be caused to be damaged because temperature is excessively high.
After reading and understanding attached drawing and detailed description, it can be appreciated that other aspects.
Description of the drawings
Attached drawing is used for providing further understanding technical scheme, and a part for constitution instruction, with this
The embodiment of application is used to explain the technical solution of the application together, does not constitute the limitation to technical scheme.Attached
In figure：
Fig. 1 is the structural schematic diagram of chip surface temperature measurement system provided in an embodiment of the present invention.
Fig. 2 is the application scenarios schematic diagram that the first application example chip to be measured of the invention is audio and video SOC (system on chip).
Fig. 3 is the application scenarios schematic diagram that the second application example chip to be measured of the invention is hybrid digital analog circuit.
Fig. 4 is the application scenarios schematic diagram that third application example chip to be measured of the present invention is protocol interface circuitry.
Fig. 5 is in the embodiment of the present invention after the completion of programmable logic array module measurement chip surface temperature, by data intelligence
The table schematic diagram that can be organized into.
The embodiments will be further described with reference to the accompanying drawings for realization, functional characteristics and the advantage of the application purpose.
Specific implementation mode
It should be appreciated that specific embodiment described herein is only used to explain the application, it is not used to limit the application.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually arbitrary combination.
It is the structural schematic diagram of chip surface temperature measurement system provided in an embodiment of the present invention shown in referring to Fig.1.This reality
The chip surface temperature measurement system of example is applied, including：
Programmable logic array module 01 for configuring chip operation state by dynamic analog, and is measured for receiving
The chip surface temperature value of acquisition；
Chip carrier socket module 02 is more by having with the programmable logic array module 01 for placing chip to be measured
The link block 10 of kind socket connects；
Temperature sensing module 03, for measuring the chip surface temperature to be measured under each working condition, and the temperature that will be measured
Number of degrees value is sent to the programmable logic array module 01；
Power supply module 04 is connect with the programmable logic array module 01 and chip carrier socket module 02 respectively, for electricity
Road provides power supply, and the power supply module 04 supports pulse width modulating technology, default for being higher than in chip surface temperature to be measured
When value chip temperature to be measured is reduced by lowering power consumption；
In view of the model of chip to be measured is abundant as far as possible, it includes logic to select the basic index of programmable logic chip
Unit number (equivalent logic gate number), available I/O number of pins, on-chip memory resource (embedded stone block RAM and distribution
RAM), Clock Managing Unit (PLL and DCM), high-speed i/o interface module (MGT), embedded stone adder and multiplier (DSP sections of members), insertion
Formula stone CPU etc..
In the present embodiment, the chip carrier socket module 02 can be docked with various chips, to be using the present invention
System can carry out temperature test to various chips.In view of modern chips industrial development is swift and violent, each class wrapper all obtains considerable
Using and development, single chip carrier socket can not accomplish unified various chips, it is therefore desirable to the characteristics of according to various chips, such as
The application manual of various chips carrys out custom made chip socket.
The temperature sensor may be used Huygens's bridge circuit based on PT100 and change come temperature sensor, using mould
Temperature data is transferred to programmable logic array module 01 to handle by number converter, and certainly, the temperature sensor can also
Using other types, the embodiment of the present invention is not limited this.
The power supply module 04, the function in addition to providing power supply are also adjusted by PWM (pulse width modulation) technology and are powered
Voltage, when chip temperature to be measured higher than chip manufacturer calibration maximum value when, programmable logic array module turns down PWM's
Frequency realizes the purpose of cooling, to protect chip from damage.
In the present embodiment, the chip surface temperature measurement system further includes：
Clock module 05 is connect respectively with the programmable logic array module 01 and chip carrier socket module 02, for working as
Chip to be measured is digital circuit, provides clock reference for the digital circuit, and in chip surface temperature to be measured higher than default
Chip temperature to be measured is reduced by reducing clock frequency, wherein the frequency cooling-down effect for especially reducing master clock is non-when value
Chang Mingxian；The clock module 05 can be integrated clock chip or discrete phase-locked loop circuit,
In the present embodiment, the chip surface temperature measurement system further includes：
Speed-regulating fan module 06 is connect with the programmable logic array module 01 and chip carrier socket module 02 respectively, is used
In when chip surface temperature to be measured is higher than preset value, adjusted by negative-feedback temperature by the programmable logic array module 01
The rotating speed for controlling speed-regulating fan, to reduce temperature.
If chip collocation fan to be measured uses, can in the future be actually used by the data of rotation speed of the fan to provide
Suggestion.
In the present embodiment, the chip surface temperature measurement system further includes：
Memory module 07 and/or display module 08, the memory module 07 connect with the programmable logic array module 01
It connects, for storing the chip temperature data to be measured for measuring and obtaining；The display module 08, with the programmable logic array module
01 connection, shows for carrying out output to chip temperature data to be measured.
The memory module 07 and may include at least one type storage medium, the storage medium include flash memory,
Hard disk, multimedia card, random access storage device (RAM), may be programmed only insert card type memory (such as SD, TF memory etc.)
Read memory (PROM), static random-access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), read-only
Memory (ROM) etc..
The display module 08 may include liquid crystal display (LCD), thin film transistor (TFT) LCD (TFT-LCD), organic light emission
At least one of diode (OLED) display, flexible display etc..According to specific embodiment, display module 08 can
To include two or more display units, display module 08 may include touch screen, for detecting touch operation.
In the present embodiment, the chip surface temperature measurement system further includes：
Alarm device 09 is connect with the programmable logic array module 01, for being higher than preset value in chip temperature to be measured,
Send out warning information.Can be loud speaker, buzzer or LED flashing lamps etc..
In the present embodiment, the link block 10 is the bus structures for including multiple interfaces, is patrolled for realizing programmable
Collect the physical connection of array and chip to be measured.
The embodiment of the present invention is the digital display circuit based on programmable logic array.No matter is modern large scale integrated chip
It is number or simulation, radio frequency is all to walk modular Integrated direction to develop, and the operating mode of chip is very more, if each
Kind operating mode will do one piece of printed circuit board, burning program, then measuring temperature, take time and effort, in the R & D design of chip
Stage is unpractical.No matter 01 logic of programmable logic array module provided in an embodiment of the present invention, peripheral hardware or I/O resource
It is all very abundant, it can be very good to solve the problems, such as this.
In the embodiment of the present invention, programmable logic array module 01 passes through more fresh code, you can real-time update Digital Logic
Circuit.Tester is write a series of automatic test cases and is prestored by the function handbook of access chip to be measured.It is surveying
When examination, docked with chip to be measured by high-speed chip socket 02, update Digital Logic code by the bus of link block 10 come
The pressure test before the operating mode of chip to be measured, including conventional design work state and chip manufacture is configured, is then passed through
The mode that the analog signal for measuring acquisition is converted to digital signal in the temperature sensor 03 that chip carrier socket 02 is installed, obtains
The temperature of chip to be measured passes programmable logic array module 01 back.
In temperature taking process, 01 logical resource of programmable logic array module is abundant, for realizing chip surface temperature
Spend negative feedback control.The measuring system of the present invention can be realized by 3 kinds of modules to chip temperature negative-feedback regu- lation, be ensured
Chip is not damaged in measurement process.First, programmable logic array module 01 controls the power supply module 04 of circuit under test, passes through
PWM (pulse width modulation) technology adjusts the voltage of power supply, when maximum value of the temperature higher than chip manufacturer's calibration, may be programmed
Logic array module 01 turns down the frequency of PWM；Second, programmable logic array module 01 controls the clock module of circuit under test
05, by control word come the frequency of configurable clock generator, when temperature is higher than preset maximum value, programmable logic array module 01 reduces
The frequency cooling-down effect of the frequency of clock, especially master clock is clearly；Third, the control peace of programmable logic array module 01
The rotating speed of speed-regulating fan 06 on chip carrier socket 02, when temperature is higher than preset maximum value, programmable logic array module
01 increases the rotating speed of fan.If three kinds of methods were all attempted, temperature is still higher than the maximum value of chip manufacturer's calibration, can compile
Journey logic array module 01 disconnects the power supply module 04 of chip to be measured, and alarm is sent out by alarm device 09, reaches protection test core
The purpose of piece.
After the completion of programmable logic array module 01 measures chip surface temperature, data intelligence is organized into such as 5 institute of attached drawing
The format shown shown by the liquid crystal display of the display module 08 of system, and is stored in memory module 07, such as erasable
Except in memory, facilitating chip designer to check summary, the temperature physical characteristic of chip is assessed.
Technical solution of the present invention is illustrated below by the example in concrete application.
It should be noted that in three application examples below, programmable logic array module is illustrated only in attached drawing
With different types of chip to be measured, illustrate programmable logic array and chip to be measured by connecting mould in each application example
Block be attached after the course of work, and other modules about the embodiment of the present invention are all consistent with the description of above-described embodiment.
After programmable logic array module is connected by link block with chip carrier socket to be measured, work is configured by programmable logic array module
Operation mode, by temperature sensor measurement, and by programmable logic array module memorization COMS clip surface temperature.
Example one：
With reference to shown in Fig. 2,2 be the application that the first application example chip to be measured of the invention is audio and video SOC (system on chip)
Schematic diagram of a scenario.
In this application example, chip to be measured is a kind of audio and video on-chip system chip, and peripheral resources are compared with horn of plenty, market
The application scenarios of upper common audio and video system on chip are very various, and chip pin quantity is very more.Due to the embodiment of the present invention
The peripheral hardware type of the programmable logic array of offer is more, and number of pins is the limiting condition that encapsulation is supported, it is possible to fully and be waited for
Survey chip docking.
Audio-video document 01 is the file that the audio and video system on chip of programmable logic array storage can be read.Configuration connects
Mouthful 02 is UART, JTAG, I2C, SPI etc. of audio and video system on chip, in this application example, according to chip handbook to be measured can
Programmed logic array (PLA) module writes logical code, realizes that control audio-video document 01 is downloaded into audio and video piece by configuring interface 02
Upper system is run.And it is DDR (Double Data Rate synchronous DRAM) controller that Peripheral Interface, which may be implemented, is deposited
Store up controller, ethernet network transceiver etc..Sound is set to regard so as to simulate various application scenarios by programmable logic array
All modules of frequency system on chip can be fully-operational, and then obtain chip according to whole application scenarios that chip designs
Surface temperature data.
As it can be seen that in this application example, since the logic of programmable logic array, IO, peripheral resources are all very abundant, sound
All modules of video system on chip can be fully-operational, and chip surface temperature data can design complete according to chip
Portion's application scenarios obtain.
Example two：
It is the application scenarios that the second application example chip to be measured of the invention is hybrid digital analog circuit with reference to shown in Fig. 3
Schematic diagram.
In this application example, chip to be measured is a kind of hybrid digital analog circuit chip, programmable logic array module
By the peripheral hardware of analog circuit go hair analog signal 01 give hybrid circuit, otherwise can also send out digital signaling zero 2 give hybrid circuit,
Hybrid circuit is allowed to work together under different operative scenarios, 2 signal of digital signaling zero and analog signal through hybrid circuit conversion
After 04 can be acquired by programmable logic array module, whether worked normally according to collected signal evaluation chip, then by temperature
Sensor acquisition chip surface temperature is spent, to obtain temperature of the chip under various working conditions.
Example three：
With reference to shown in Fig. 4, third application example chip to be measured of the present invention is the application scenarios schematic diagram of protocol interface circuitry.
In this application example, chip to be measured is a kind of interface protocol conversion circuit chip, programmable logic array module
It sends the first protocol data 01 and arrives protocol interface circuitry, forward second protocol data 02 to give programmable logic battle array after chip processing
Row can form a datacycle and generate the circuit for sending, receiving.Temperature sensor collecting temperature is sent to programmable patrol
It collects array circuit to handle in real time, the work correctness of protocol interface circuitry is confirmed by the check code word of agreement.
The embodiment of the present invention additionally provides a kind of chip surface thermometry, the method includes：
Obtain chip type to be measured；
The simulation operating mode parameter to prestore is obtained according to the chip type to be measured；
The simulation operating mode parameter is sent to chip to be measured；
Obtain chip to be measured various operating modes temperature data.
Wherein, the acquisition chip type to be measured can be to be obtained by chip pin number, can also pass through and receive user
The parameter of input is identified.
It is described to obtain chip to be measured in the temperature data of various operating modes, it is obtained by temperature sensor.
In addition, the embodiment of the present invention also provides a kind of computer readable storage medium, computer executable instructions are stored with,
The computer executable instructions, which are performed, realizes above-mentioned method.
Above computer readable storage medium storing program for executing, including some instructions are used so that a computer installation (can be personal
Computer, server or network equipment etc.) or processor (Processor) execution each embodiment the method for the disclosure
Part steps.And the computer readable storage medium includes：USB flash disk, mobile hard disk, read-only memory (ReadOnly
Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disc or CD etc. are various to deposit
Store up the medium of program code.
It should be noted that herein, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that process, method, article or device including a series of elements include not only those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including this
There is also other identical elements in the process of element, method, article or device.
The embodiments of the present invention are for illustration only, can not represent the quality of embodiment.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on this understanding, technical scheme of the present invention substantially in other words does the prior art
Going out the part of contribution can be expressed in the form of software products, which is stored in a storage medium
In (such as ROM/RAM, magnetic disc, CD), including some instructions are used so that a station terminal equipment (can be mobile phone, computer, clothes
Be engaged in device, air conditioner or the network equipment etc.) execute method described in each embodiment of the present invention.
It these are only the preferred embodiment of the present invention, be not intended to limit the scope of the invention, it is every to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of chip surface temperature measurement system, which is characterized in that including：
Programmable logic array module for configuring chip operation state by dynamic analog, and measures acquisition for receiving
Chip surface temperature value；
Chip carrier socket module, for placing chip to be measured, the chip carrier socket module is logical with the programmable logic array module
The link block with a variety of sockets is crossed to connect；
Temperature sensing module for measuring the chip surface temperature to be measured under each working condition, and will measure the chip obtained
Surface temperature numerical value is sent to the programmable logic array module；
Power supply module, connect with the programmable logic array module and chip carrier socket module respectively, and power supply is provided for circuit,
The power supply module supports pulse width modulating technology, is used for when chip surface temperature to be measured is higher than preset value, by that can compile
Journey logic array module control power supply module reduces power consumption to reduce chip temperature to be measured.
2. system according to claim 1, which is characterized in that the chip surface temperature measurement system further includes：
Clock module is connect with the programmable logic array module and chip carrier socket module respectively, is for working as chip to be measured
Digital circuit provides clock reference for the digital circuit, and when chip surface temperature to be measured is higher than preset value, by can
The control of programmed logic array (PLA) module reduces clock frequency to reduce chip temperature to be measured.
3. system according to claim 1, which is characterized in that the chip surface temperature measurement system further includes：
Speed-regulating fan module is connect with the programmable logic array module and chip carrier socket module respectively, for working as core to be measured
When piece surface temperature is higher than preset value, negative-feedback temperature adjusting control speed-regulating fan is passed through by the programmable logic array module
Rotating speed reduce chip temperature to be measured.
4. system according to claim 1, which is characterized in that the chip surface temperature measurement system further includes：
Memory module and/or display module, the memory module are connect with the programmable logic array module, are surveyed for storing
Measure the chip temperature data to be measured obtained；The display module is connect with the programmable logic array module, for to be measured
Chip temperature data carry out output and show.
5. system according to claim 1, which is characterized in that the chip surface temperature measurement system further includes：
Alarm device is connect with the programmable logic array module, for being higher than preset value in chip temperature to be measured, sends out alarm
Information.
6. system according to claim 1, which is characterized in that
When the chip to be measured that the chip carrier socket module is placed is audio and video on-chip system chip, the programmable logic array mould
Block, which controls audio-video document and is downloaded into audio and video system on chip by configuring interface, to be run.
7. system according to claim 1, which is characterized in that
When the chip to be measured that the chip carrier socket module is placed is hybrid digital analog circuit, programmable logic array module passes through
The peripheral hardware hair analog signal of analog circuit gives the hybrid digital analog circuit, and/or hair digital signal to give the digital simulation
Hybrid circuit, digital signal and analog signal through hybrid digital analog circuit conversion are adopted by programmable logic array module
Collection.
8. system according to claim 1, which is characterized in that
When the chip to be measured that the chip carrier socket module is placed is protocol interface circuitry, programmable logic array module sends first
Protocol data forwards second protocol data to give programmable logic array mould to protocol interface circuitry after protocol interface circuitry is handled
Block, composition data cycle generate the circuit for sending, receiving.
9. system according to claim 8, which is characterized in that
The programmable logic array module confirms the work correctness of protocol interface circuitry by the check code word of agreement.
10. a kind of chip surface thermometry, which is characterized in that including：
Obtain chip type to be measured；
The simulation operating mode parameter to prestore is obtained according to the chip type to be measured；
The simulation operating mode parameter is sent to chip to be measured；
Obtain chip to be measured various operating modes temperature data.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710257415.0A CN108731827A (en) | 2017-04-19 | 2017-04-19 | A kind of chip surface temperature measurement system and method |
| PCT/CN2017/103639 WO2018192182A1 (en) | 2017-04-19 | 2017-09-27 | Chip surface temperature measuring system and method, and computer storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710257415.0A CN108731827A (en) | 2017-04-19 | 2017-04-19 | A kind of chip surface temperature measurement system and method |
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| CN108731827A true CN108731827A (en) | 2018-11-02 |
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| WO (1) | WO2018192182A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110297171A (en) * | 2019-06-14 | 2019-10-01 | 合肥格易集成电路有限公司 | A kind of the power consumption test system and equipment of chip |
| CN110687952A (en) * | 2019-10-24 | 2020-01-14 | 广东美的白色家电技术创新中心有限公司 | Voltage regulating circuit, voltage regulating method and storage medium |
| CN111208349A (en) * | 2019-12-31 | 2020-05-29 | 深圳市芯天下技术有限公司 | Nor Flash chip power consumption testing device and method based on FPGA development board |
| CN114325291A (en) * | 2020-09-29 | 2022-04-12 | 圣邦微电子（北京）股份有限公司 | Temperature monitoring device and monitoring method for chip test |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1704737A (en) * | 2004-05-26 | 2005-12-07 | 鸿富锦精密工业（深圳）有限公司 | Chip temperature measurement device and method |
| CN101303608A (en) * | 2008-06-12 | 2008-11-12 | 黄竞 | Multiplex temperature detect controller |
| CN102042882A (en) * | 2009-10-02 | 2011-05-04 | 意法半导体(胡希)公司 | Device for the detection of temperature variations in a chip |
| CN105911451A (en) * | 2016-04-05 | 2016-08-31 | 硅谷数模半导体（北京）有限公司 | Chip test method and chip test device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5639163A (en) * | 1994-11-14 | 1997-06-17 | International Business Machines Corporation | On-chip temperature sensing system |
| CN101452048B (en) * | 2007-11-30 | 2011-08-24 | 上海华虹Nec电子有限公司 | Integrated circuit chip temperature test device and method |
| CN102123574A (en) * | 2010-01-11 | 2011-07-13 | 纬创资通股份有限公司 | Electronic device and method for detecting radiator fan of electronic device |
| CN105589504A (en) * | 2014-10-22 | 2016-05-18 | 中兴通讯股份有限公司 | Method and device for adjusting chip core voltage |
| CN105823971B (en) * | 2015-01-09 | 2018-11-16 | 中芯国际集成电路制造(上海)有限公司 | Chip operating state monitoring system and monitoring method |
| CN106017727B (en) * | 2016-05-16 | 2018-11-06 | 合肥市芯海电子科技有限公司 | A kind of multi-chip temperature test and calibration system and method |
| CN205982552U (en) * | 2016-09-09 | 2017-02-22 | 杭州万高科技股份有限公司 | IC testing arrangement |
-
2017
- 2017-04-19 CN CN201710257415.0A patent/CN108731827A/en not_active Withdrawn
- 2017-09-27 WO PCT/CN2017/103639 patent/WO2018192182A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1704737A (en) * | 2004-05-26 | 2005-12-07 | 鸿富锦精密工业（深圳）有限公司 | Chip temperature measurement device and method |
| CN101303608A (en) * | 2008-06-12 | 2008-11-12 | 黄竞 | Multiplex temperature detect controller |
| CN102042882A (en) * | 2009-10-02 | 2011-05-04 | 意法半导体(胡希)公司 | Device for the detection of temperature variations in a chip |
| CN105911451A (en) * | 2016-04-05 | 2016-08-31 | 硅谷数模半导体（北京）有限公司 | Chip test method and chip test device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110297171A (en) * | 2019-06-14 | 2019-10-01 | 合肥格易集成电路有限公司 | A kind of the power consumption test system and equipment of chip |
| CN110297171B (en) * | 2019-06-14 | 2021-10-01 | 苏州福瑞思信息科技有限公司 | Power consumption test system and equipment of chip |
| CN110687952A (en) * | 2019-10-24 | 2020-01-14 | 广东美的白色家电技术创新中心有限公司 | Voltage regulating circuit, voltage regulating method and storage medium |
| CN111208349A (en) * | 2019-12-31 | 2020-05-29 | 深圳市芯天下技术有限公司 | Nor Flash chip power consumption testing device and method based on FPGA development board |
| CN114325291A (en) * | 2020-09-29 | 2022-04-12 | 圣邦微电子（北京）股份有限公司 | Temperature monitoring device and monitoring method for chip test |
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| Publication number | Publication date |
|---|---|
| WO2018192182A1 (en) | 2018-10-25 |
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Application publication date: 20181102 |