CN108730939A - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN108730939A
CN108730939A CN201710239473.0A CN201710239473A CN108730939A CN 108730939 A CN108730939 A CN 108730939A CN 201710239473 A CN201710239473 A CN 201710239473A CN 108730939 A CN108730939 A CN 108730939A
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light
lampshade
emitting device
layer
reflecting layer
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彭耀祈
李柏苍
简铭宏
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Lite On Electronics Guangzhou Co Ltd
Lite On Technology Corp
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Lite On Electronics Guangzhou Co Ltd
Lite On Technology Corp
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Priority to CN201710239473.0A priority Critical patent/CN108730939A/zh
Priority to US15/613,374 priority patent/US10508872B2/en
Publication of CN108730939A publication Critical patent/CN108730939A/zh
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Computer Hardware Design (AREA)
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  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

本发明公开一种发光装置，包括灯罩、透光前罩、发光元件、辐射层及反射层。透光前罩与灯罩结合且两者之间形成腔体。发光元件配置在灯罩上且位于腔体内。发光元件用以朝向透光前罩发射光线。辐射层形成于灯罩上且其上设有反射层。

Description

发光装置
技术领域
本发明涉及一种发光装置，且特别涉及一种具有辐射层的发光装置。
背景技术
传统发光装置在发光的同时不可避免地会产生热量。愈多的发光元件，产生的热量愈多，如此可能导致发光装置超过热负荷而失效。因此，有需要提出一种新的可提升散热效率的发光装置。
发明内容
本发明的目的在于提供一种发光装置，可改善前述问题。
根据本发明的一实施例，提出一种发光装置。发光装置包括一灯罩、一透光前罩、一发光元件、一辐射层及一反射层。透光前罩与灯罩结合且两者之间形成一腔体。发光元件配置在灯罩上且位于腔体内，发光元件用以朝向透光前罩发射光线。辐射层形成于灯罩上且其上设有反射层。
以下结合附图和具体实施例对本发明进行详细描述，但不作为对本发明的限定。
附图说明
图1绘示依照本发明一实施例的发光装置的示意图；
图2绘示图1的发光装置沿方向2-2’的部分剖视图。
其中，附图标记
100：发光装置
120：灯罩
110：透光前罩
120s1：内表面
120s2：外表面
125：电路板
130：发光元件
131：透镜
140：辐射层
150：反射层
H1：热量
L1：光线
R1：腔体
T1、T2、T3：厚度
具体实施方式
下面结合附图对本发明的结构原理和工作原理作具体的描述：
请参照图1及图2，图1绘示依照本发明一实施例的发光装置100的示意图，而图2绘示图1的发光装置100沿方向2-2’的部分剖视图。
发光装置100可应用于路灯或其它需要照明的产品。发光装置100包括透光前罩110、灯罩120、电路板125、至少一发光元件130、辐射层140及反射层150。
透光前罩110与灯罩120结合且两者之间形成一腔体R1。虽然图未绘示，然透光前罩110与灯罩120可通过卡合、锁固或黏合方式彼此固定，使透光前罩110与灯罩120之间的腔体R1如同密闭空间，进而使外界环境因子(如液体、水气、杂质等)不易进入腔体R1内。
电路板125配置在灯罩120上。发光元件130配置在电路板125上，并朝向透镜131及透光前罩110发射光线L1，其中光线L1例如是可见光。透镜131及透光前罩110经过设计，使得光线L1通过透镜131及透光前罩110后产生预定的照明区域。电路板125、发光元件130及透镜131位于腔体R1内，以受到透光前罩110与灯罩120的保护，减少或避免受到外界环境的侵害。灯罩120例如是压铸件。灯罩120的材料例如是金属，如铝或其它散热佳的材料，可将发光元件130产生的热量H1快速地对流或辐射至环境中，以增加散热效果。
辐射层140形成于灯罩120上。例如，辐射层140可采用喷涂方式直接或间接形成在灯罩120的内表面120s1中受到腔体R1覆盖的部分。在另一实施例中，辐射层140可更形成在灯罩120的内表面120s1中受到腔体R1覆盖的部分外，如灯罩120的外表面120s2或灯罩120的整个内外表面。
辐射层140可将腔体R1内的热量H1传导至灯罩120，以提升发光装置100的散热效率。详言之，受到腔体R1的限制，光线L1可能在腔体R1内循环反射，而导致腔体R1内的热量H1累积，造成发光装置100温度上升，但由于本发明实施例的辐射层140的设计，发光元件130所产生的热能通过辐射层140可迅速传导至灯罩120，然后再通过灯罩120辐射至外界环境，其辐射能量包含于光线L1中的可见光或不可见的波长范围，使发光装置100的散热效率得以提升。因此，本发明实施例的辐射层140可做为一热传导层。
由于发光装置100的散热效率提升，因此发光元件130可以配置在密闭的腔体R1内，不需在灯罩120的部位开孔以提升散热效率，或者降低透光前罩110与灯罩120之间的密合性。详言之，发光元件130发出的光线L1虽然无可避免地在腔体R1内循环折射，然由于辐射层140的设计，光线L1的部分辐射热量能迅速通过辐射层140传导至灯罩120，再通过灯罩120辐射至外界环境，因此可降低腔体R1内的温度及压力变动幅度，进而能减少或避免透光前罩110与灯罩120之间的密合性的下降，因为若腔体R1的温度变动幅度增大，则压力变动幅度也会剧烈，必然降低透光前罩110与灯罩120之间的密合性。
在一实施例中，灯罩120的热辐射效率小于辐射层140的热辐射效率。由于辐射层140提供一较高的热辐射效率，因此即使灯罩120的热辐射效率是低的，仅通过辐射层140也能提升发光装置100的整体散热效率。在一实施例中，辐射层140的热辐射效率是大于0.9，而灯罩120的热辐射效率约为0.4。
在一实施例中，辐射层140的厚度T1与反射层150的厚度T2的总厚度可介于60微米与200微米之间。由于本发明实施例的辐射层140能将热量H1迅速传导至灯罩120，相较于无辐射层140及反射层150的设计，虽然本发明实施例的发光装置100的厚度T3因辐射层140及反射层150而增加，但发光装置100的散热效率反而提升。依据实验，本发明实施例的发光装置100的散热效率提升3％。
由于本发明实施例的发光装置100能有效提升散热效率，因此即使发光元件130的数量较多，仍可确保散热效率。在一实施例中，发光元件130的数量例如是12个。
反射层150形成于辐射层140上，其中辐射层140位于反射层150与灯罩120之间。反射层150反射在腔体R1内循环的光线L1，进而能提升发光装置100的出光强度。由于辐射层140的设计，使反射层150可具有一高的反射率。高反射率的反射层150会提升在腔体R1内由发光元件130所发出光线的回收效率，减少热量H1于腔体R1内的累积量，然通过辐射层140的设计，仍可将此些累积的热量H1迅速地传导至灯罩120，然后再通过灯罩120辐射或对流至外界环境。在一实施例中，反射层150的反射率可大于85％。此外，反射层150的材料可包括氧化钛或氧化锌。氧化钛或氧化锌的重量百分比可介于约0.5％至15％之间。
反射层150可采用例如是喷涂方式(如烤漆)直接或间接形成在辐射层140上。由于反射层150与辐射层140是分别形成，因此辐射层140与反射层150为二层不同的结构，二者间具有一明显的分界面。在另一实施例中，视反射层150及辐射层140的材料及/或工艺而定，辐射层140与反射层150之间的分界面也可能不明显或几乎无法分辨。
本发明实施例藉由辐射层140及反射层150的设置，使得光线L1经反射层150的反射后由透光前罩110出光，产生的热量H1可由辐射层140传导至灯罩120，因此发光装置100的整体光学效率可达95％。
当然，本发明还可有其它多种实施例，在不背离本发明精神及其实质的情况下，熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形，但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。

Claims (9)

1.一种发光装置，其特征在于，包括：
一灯罩；
一透光前罩，与该灯罩结合且两者之间形成一腔体；
一发光元件，配置在该灯罩上且位于该腔体内，该发光元件发出的光线通过该透光前罩而出光；
一反射层；以及
一辐射层，形成于该灯罩与该反射层之间。
2.根据权利要求1所述的发光装置，其特征在于，该灯罩的热辐射效率小于该辐射层的热辐射效率。
3.根据权利要求1所述的发光装置，其特征在于，该辐射层的热辐射效率大于0.9。
4.根据权利要求1所述的发光装置，其特征在于，该反射层的反射率大于85％。
5.根据权利要求1所述的发光装置，其特征在于，该反射层的材料包括氧化钛或氧化锌。
6.根据权利要求5所述的发光装置，其特征在于，该氧化钛或氧化锌的重量百分比介于0.5％至15％之间。
7.根据权利要求1所述的发光装置，其特征在于，该辐射层与该反射层之间具有一分界面。
8.根据权利要求1所述的发光装置，其特征在于，该辐射层与该反射层为二层不同的结构。
9.根据权利要求1所述的发光装置，其特征在于，该辐射层的厚度与该反射层的厚度的总和介于60微米与200微米之间。
CN201710239473.0A 2017-04-13 2017-04-13 发光装置 Pending CN108730939A (zh)

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CN201710239473.0A CN108730939A (zh) 2017-04-13 2017-04-13 发光装置
US15/613,374 US10508872B2 (en) 2017-04-13 2017-06-05 Street lamp with enchanced heat dissipation

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