CN108723528A - electrolytic polishing device - Google Patents
electrolytic polishing device Download PDFInfo
- Publication number
- CN108723528A CN108723528A CN201810343062.0A CN201810343062A CN108723528A CN 108723528 A CN108723528 A CN 108723528A CN 201810343062 A CN201810343062 A CN 201810343062A CN 108723528 A CN108723528 A CN 108723528A
- Authority
- CN
- China
- Prior art keywords
- electrolytic polishing
- cathode
- negative plate
- polishing object
- grate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
Embodiment is related to electrolytic polishing device.The electrolytic polishing device of embodiment may include：Electrolytic cell, in inside equipped with the accommodation space for accommodating electrolytic polishing object and electrolyte；Cathode places fixed frame, is installed in the grind section in the one side formation of the electrolytic polishing object；Negative plate is dipped in the electrolyte, is installed in the grind section of electrolytic polishing object；Fixture is installed on the cathode and places fixed frame, fixed negative plate；And rectifier, it is electrically connected in the electrolytic polishing object and negative plate respectively, anode is accessed to electrolytic polishing object, cathode is accessed to negative plate.The negative plate may include：First cathode grate, is formed in the form of belt, is vertically configured at the grind section of electrolytic polishing object；And the second cathode grate, it is configured at the grind section of the electrolytic polishing object in the horizontal direction, the first negative plate is assembled in lattice shape, negative plate is made to realize modularization.
Description
Technical field
Embodiment is related to electrolytic polishing device.More specifically, embodiment is related to a kind of for being accessed to anode and cathode
Electric current, using electrolyte as medium, metallic surface cause to be electrolysed and the electrolytic polishing device that is ground.
Background technology
Electrolytic polishing (Electrolytic Polishing) is a kind of to be dissolved in the metal of electrolyte as anode
(Anode), cathode (Cathode) will be used as by insoluble metal in the electrolytic solution, voltage is accessed to anode and cathode, thus with
The electrolyte is medium, in the method that metallic surface causes electrolysis and is ground.
In order to which using this electrolytic polishing, come abrasive metal, the filling electrolyte in electrolytic cell, the metal that will be ground is pacified
Dress is anode, and after being installed as cathode insoluble in the metal of electrolyte, direct current is accessed to anode and cathode.
On the other hand, after carrying out electrolytic polishing, a large amount of high viscosity liquid layer packets containing the metal ion from anode dissolving
Enclose anode.In the liquid level of metal ion saturation, metal is not redissolved, and forms high anodic potentials, thus is actively tied with oxygen
It closes and forms oxide pellicle.
At this point, the metal ion of dissolving mainly accumulates the sunk part in metal surface, in sunk part, metal ion
Mobile and diffusion is few, and electrically by unsmooth, thus metal is insoluble.
On the contrary, the protrusion part in metal surface, metal ion is formed thin, thus current convergence, easily makes gold
Metal surface dissolves, and makes metallic surface smoother on the whole.
Wherein, this electrolytic polishing is implemented by electrolytic polishing device, and the electrolytic polishing device of conventional art is special
It discloses in sharp document 1, with reference to attached drawing, it is described as follows.
Fig. 1 is the stereogram for the electrolytic polishing device for showing conventional art on the whole.That is, as shown in Figure 1, conventional art
Electrolytic polishing device is ground in the electrolysis that the installation of the inside for the electrolytic cell 110 for accommodating electrolyte 112 includes chamber, slot, piping etc.
Grind subject parts 102.Then, multiple cathode are installed additional in the grind section 104 of the electrolytic polishing subject parts 120 and places fixed frame
It is solid using C-type clamp 140 in the state of being positioned over negative plate 130 between the multiple cathode placement fixed frame 120 after 120
It is fixed, form quadrangle cathode basic framework.
In addition, between cathode basic framework, negative plate 130 is configured by predetermined distance, is assembled with C-type clamp 140.So exist
The grind section 104 of electrolytic polishing subject parts 102 completes cathode.
Moreover, also constituted in the same manner in the remaining face of the electrolytic polishing subject parts 102, and using negative between face and face
Pole plate 130 and C-type clamp 140 form construction, carry out firm fixation.
Therefore, the electrolytic polishing device of conventional art can place fixed frame 120 and C-type clamp 140 by cathode, be electrolysed
The grind section 104 of grinding object component 102 installs multiple negative plates 130 by uniform interval, can be easy in entire interior outside
Grind bigger machining object in ground.
But the electrolytic polishing device of conventional art is as previously mentioned, the grinding in electrolytic polishing subject parts 102 need to be utilized
Portion 104 installs cathode and places fixed frame 120, carried out come the method for individually installing negative plate 130 by C-type clamp 140, thus deposits
The problem of 130 set-up time of the negative plate needed for electrolytic polishing, time-consuming.
Existing technical literature
Patent document
(patent document 000) Republic of Korea registered patent bulletin the 10-1183218th
Invention content
Technical problems to be solved
Embodiment is designed to provide a kind of electrolytic polishing device, and by the specification of electrolytic polishing object, pre-production is negative
Pole plate simultaneously realizes modularization, is enable to be easily installed the negative plate needed for the electrolytic polishing of electrolytic polishing object.
The means solved the problems, such as
In order to solve the problem, the electrolytic polishing device of embodiment may include：Electrolytic cell (Electrolytic
Cell), in inside equipped with the accommodation space for accommodating electrolytic polishing object and electrolyte；Cathode places fixed frame, installs additional
In the grind section of the one side formation in the electrolytic polishing object；Negative plate is installed in the grinding of the electrolytic polishing object
Portion；C-type clamp (C-type Clamp) is installed on the cathode and places fixed frame, fixed negative plate；And rectifier, difference
It is electrically connected in the electrolytic polishing object and negative plate, positive (+) is accessed to electrolytic polishing object, cathode is accessed to negative plate
(-)。
The negative plate is formed in the form of belt (Strip), so as to according to with polygon or cylindrical shape formation
The specification that the grind section of electrolytic polishing object is consistent realizes that module (Module) is changed, and may include：First cathode grate, edge
Vertical direction is arranged in the grind section；And the second cathode grate, it is configured at the electrolytic polishing in the horizontal direction
The grind section of object arranges while forming placement space along the crisscross of the first cathode grate, is assembled into grid
Shape.
For the electrolytic polishing device of embodiment, the first cathode grate and the second cathode grate can be with tools
There are " one " word, the linear of " ┓ " word or " mouth " word cross section or round formation.
For the electrolytic polishing device of embodiment, the first cathode grate and the second cathode grate can use riveting
Nail (Rivet) combines and realizes integration.
In addition, for the electrolytic polishing device of embodiment, the first cathode grate can arrange in the horizontal direction,
Along the crisscross of the first cathode grate, the second cathode grate arranges while forming placement space.
In addition, for the electrolytic polishing device of embodiment, the electrolytic polishing object can be with polygon or cylindrical shape
It is formed, grind section is respectively formed in internal and outside.
In addition, for the electrolytic polishing device of embodiment, in the inside and outside grinding of the electrolytic polishing object
The negative plate that portion is respectively configured can be electrically connected to each other.
In addition, for the electrolytic polishing device of embodiment, it may include quadrilateral shape that the cathode, which places fixed frame,
Plate, be connected to the plate one side binder bolt, screw togather the fixing nut for being linked to the binder bolt.
In addition, for the electrolytic polishing device of embodiment, it may include insulation board that the cathode, which places fixed frame, described
Insulation board is attached respectively to the two sides of the plate of quadrilateral shape, by certain one in rubber, polyurethane, PVC or bakelite (Bakelite)
It constitutes.
By the particular content for carrying out an invention below based on attached drawing, this solution will be apparent from.
Before this it is to be understood that the word used in present specification and claims shall not be construed as it is common
Meaning on dictionary, inventor can suitably define the concept of term to illustrate the invention of its own with the best approach, stand
It is enough to this principle, only should be interpreted that meaning and concept that the technological thought with the present invention is consistent.
The effect of invention
According to embodiment, according to the specification of polygon or the electrolytic polishing object of cylindrical shape formation, pre-production cathode
Plate can shorten the set-up time of the cathode needed for the electrolytic polishing of electrolytic polishing object, can easily implement to have
The technique effect of electrolytic polishing.
Description of the drawings
Fig. 1 is the stereogram of the whole electrolytic polishing device for showing conventional art.
Fig. 2 is the stereogram for the electrolytic polishing device for showing embodiment.
Fig. 3 is to show that the cathode of embodiment places the stereogram of fixed frame.
Fig. 4 is the stereogram of the installation condition for the electrolytic polishing device for showing embodiment.
Fig. 5 to 6 is the stereogram for the electrolytic polishing device for showing embodiment.
Specific implementation mode
By with the relevant content in detail below of attached drawing and one embodiment, the unique insight of embodiment, specific technology
Feature will be apparent from.It should be noted that in the present specification, in terms of assigning reference numeral to the inscape of each figure,
For identical inscape, even if as far as possible with same tag if being shown on different attached drawings.
In terms of the inscape for illustrating embodiment, the terms such as first, second, A, B, (a), (b) can be used.This art
Language is served only for distinguishing this composition element and other inscapes, essence or order of corresponding inscape or sequence etc. not by
The term is limited.When recording certain inscape " connection ", " in conjunction with ", " connecting " in another inscape, it is thus understood that
This composition element can be directly connected to or be connected in its another inscape, but can also be between each integral part also " even
Connect ", " in conjunction with " or " connecting " have another inscape.
Below according to attached drawing, by following specific illustrative embodiment.
As figures 2-6, the electrolytic polishing device of embodiment include electrolytic cell 20 (with reference to Fig. 6) filled with electrolyte,
Cathode places fixed frame 30, C-type clamp 50, rectifier 60 and checker board negative plate 40.
If with reference to Fig. 6, the electrolytic cell 20, equipped with accommodation space 21, electricity is filled in the accommodation space 21 in inside
Solve liquid.The electrolytic polishing object 10 is contained in accommodation space 21, is dipped in electrolyte, as shown in Fig. 2, being used for being formed on one side
The grind section 11 of electrolytic polishing.
For example, the electrolytic polishing object 10 can be the chamber (Chamber) or columnar slot (Tank) of polygon.
But, this is an example, it is not necessary to which electrolytic polishing object 10 is defined in this.
In addition, the grind section 11 can be formed in the outside or inside of electrolytic polishing object 10, it can also be in the electricity
It is completely formed inside and out solution grinding object 10.
This electrolytic polishing object 10 can add before being contained in electrolytic cell 20 in the grind section 11 for being formed in inside and outside
It fills cathode and places fixed frame 30.That is, installing cathode additional in the grind section 11 places fixed frame 30, fixed frame is placed in the cathode
30 installs fixtures 50, such as C-type clamp 50 so that checker board negative plate 40 is fixed.
If with reference to Fig. 3, it for example includes the quadrilateral shape manufactured with stainless steel material that the cathode, which places fixed frame 30,
Plate 31 can connect the binder bolt 32 of rod shape in the one side of the plate 31 and constitute.The cathode places fixed frame 30
After the binder bolt 32 is installed in the grind section 11 of electrolytic polishing object 10 spiral shell can be carried out using fixing nut 33
It closes and links and fix.
It can adhere to by rubber, polyurethane, PVC or bakelite on the two sides of plate 31 in addition, the cathode places fixed frame 30
(Bakelite) in certain one constitute insulation board 34 and insulate.
Above and below in the figure for the grind section 11 that this cathode placement fixed frame 30 is installed on electrolytic polishing object 10 and left and right, with
C-type clamp 50 fixes checker board negative plate 40 together so that during electrolytic polishing, the checker board negative plate 40 not from
Electrolytic polishing object 10 detaches.
On the other hand, if with reference to Fig. 2, the checker board negative plate 40 of embodiment may include 41 He of the first cathode grate
Second cathode grate 42, the first cathode grate 41 and the second cathode grate 42 are using for example including copper, aluminium, stainless
The outstanding material of the electric conductivity of steel etc., is formed in the form of elongated belt (Strip).
The first cathode grate 41 can be according to the shape of electrolytic polishing object 10, to have " one " word, " ┓ " word
Or linear or the round formation of " mouth " word cross section.The first cathode grate 41 vertically can be arranged and be configured
In grind section 11.
The second cathode grate 42 in order to be configured at the grind section 11 of the electrolytic polishing object 10 in the horizontal direction,
It can be configured and assembled by linear or circular arrangement along the crisscross of the first cathode grate 41.
For example, the first and second cathode grate 41,42 is by including rivet (Rivet), bolt (Bolt) or welding etc.
Assembling means mutually assemble and realize integration, so as to realize modularization.But, below in an example, explanation
By rivet 43 in conjunction with by realize integrated situation, but be not limited to this.
In addition, when the first cathode grate 41 vertically arranges, the second cathode grate 42 along handing over therewith
The horizontal direction of fork forms placement space 44 and simultaneously arranges, by rivet 43 in conjunction with by realize integration.
That is, according to the substantially consistent specification of the grind section 11 with electrolytic polishing object 10, using to the first and second cathode lattice
Daughter board 41,42 carry out rivet 43 in conjunction with and realize integrated method, with pre-production checker board negative plate 40 and can realize mould
Block.
In addition, be installed in the grind section 11 cathode place fixed frame 30, using placement space 44 and with grinding
Portion 11 is arranged in the state of predetermined distance placement, and C-type clamp 50 can be installed on to the cathode placement fixed frame 30 and be fixed.
Wherein, the interval of the placement space 44 can be according to the size or type or grind section 11 of electrolytic polishing object 10
Position etc. and constriction or widen to be formed.
The C-type clamp 50 can for example be formed by the outstanding stainless steel material of acid resistance.The C-type clamp 50 is by being located at figure
In above and below fixed part 51, be installed on cathode and place fixed frame 30, it is possible thereby to which it is negative easily to fix checker board in grind section 11
Pole plate 40.
As shown in Fig. 2, the electrolytic polishing object 10 of embodiment is formed with polygon, grind section 11 can be located at this polygon
Inside and out shape electrolytic polishing object 10a.
According to embodiment, modularization will be realized in conjunction with the first and second cathode grate 41,42 of linear using rivet 43
Checker board negative plate 40, the inside of the electrolytic polishing object 10 is configured at first, then in the outer of electrolytic polishing object 10
Portion configures the checker board negative plate 40, can prepare electrolytic polishing in this way.
For example, for the method in the exterior arrangement checker board negative plate 40 of the polygon electrolytic polishing object 10a,
First, by by the checker board negative plate 40 of the specification pre-production substantially consistent with grind section 11, pacified using placement space 44
After being put in cathode placement fixed frame 30, C-type clamp 50 is installed on the cathode and places fixed frame 30, completes negative plate basic framework
40a。
The checker board negative plate 40 is shape corresponding with grind section 11 or area, it is not necessary to is limited to consistent
Specification.
Wherein, if the specification checker board negative plate 40 substantially consistent with grind section 11 is not ready to, at the scene by two
A above checker board negative plate 40 by C-type clamp 50 in conjunction with by combine, to complete negative plate basic framework 40a.So
Afterwards, for remaining grind section 11 the final frame (Fig. 6 of negative plate is completed also using identical method installation checker board negative plate 40
40b).
On the other hand, if referring to Fig.1 and Fig. 6, inside and outside in the electrolytic polishing object 10 is respectively configured
Negative plate basic framework 40a is electrically connected to each other, and accesses cathode by rectifier 60 with can making it easy to.Therefore, no matter
In which negative plate basic framework 40a access cathode (-), electrolytic polishing is easily implemented.
In the following, as shown in Figure 4 and Figure 5, the electrolytic polishing object 10b of embodiment is formed with cylindrical shape, in this cylindrical shape
The outside of electrolytic polishing object 10b could be formed with grind section 11.
At this point, according to embodiment, circular the will be combined using rivet 43 on the first cathode grate 41 of linear
Two cathode grates 42 and realize modular checker board negative plate 40, be positioned over and installed outside the electrolytic polishing object 10
Cathode place fixed frame after, C-type clamp is installed on the cathode and places fixed frame, completes the final frame 40b of negative plate.
Wherein, it in order to which this checker board negative plate 40 easily fixes, is not only cathode above-mentioned and places fixed frame and c-type
Folder, such as circular frame or quadrilateral frame or multilateral framework shape can also be installed on the top of cylindrical shape electrolytic polishing object 10b
The device for fixing screen on headrest 45 of shape simultaneously uses.
In addition, the device for fixing screen on headrest 45 and checker board negative plate 40 can be electrically connected to each other, it can be solid by assisting
Determine frame 45, the installation checker board negative plate 40 in the inside of cylindrical shape electrolytic polishing object 10b.
Then, as shown in fig. 6, the electrolytic polishing device of embodiment is in the electrolysis for making to be equipped with the final frame 40b of negative plate
Grinding object 10 is contained in the state of the accommodation space 21 of the electrolytic cell 20 filled with electrolyte, bys electric wire etc. and rectification
Device 60 is electrically connected, to carry out electrolytic polishing.
Wherein, when the electrolytic polishing object 10 is large-scale, due to the installation of weight itself and checker board negative plate 40,
Weight is quite big, thus, for example in the state of using promotions such as cranes, is contained in the accommodation space 21 of electrolytic cell 20.
Then, if by rectifier 60, positive (+) is accessed to electrolytic polishing object 10, to the final frame 40b of negative plate
Cathode (-) is accessed, then is electrolysed by medium of electrolyte, electrolytic polishing is carried out to the grind section 11 of electrolytic polishing object 10.
Therefore, according to embodiment, by using negative with the checker board of 10 specification of electrolytic polishing object accordingly pre-production
Pole plate and the final frame 40b of negative plate completed realize the electrolytic polishing of electrolytic polishing object 10, so as to effectively shorten into
Therefore the set-up time of cathode needed for row electrolytic polishing can shorten the time of whole electrolytic polishing process.
It is described in detail above by embodiment, but this is for illustrating application invention, the electricity of embodiment
Solution grinding device is not limited to this.Moreover, the terms such as the " comprising " recorded above, " composition " or " having ", as long as no special
The record of opposition then means include corresponding inscape, thus and other non-excluded inscapes, should be interpreted that can be with
Further include other inscapes.
Embodiment is not for limiting but for the technological thought for illustrating application invention, not applies for that the technology of invention is thought
The range thought is limited by this embodiment.
Reference numeral
10 electrolytic polishing object 10a polygon electrolytic polishing object 10b cylindrical shape electrolytic polishing objects
11 grind section, 20 electrolytic cell, 21 accommodation space
30 cathode place 31 plate of fixed frame, 32 binder bolt, 33 fixing nut
34 insulation board, the 40 final frame of negative plate 40a negative plate basic framework 40b negative plates
41 first 42 second cathode grate of cathode grate, 43 rivet, 44 placement space
45 device for fixing screen on headrest 50C types press from both sides 51 fixed part, 60 rectifier
Claims (10)
1. a kind of electrolytic polishing device, including：
Electrolytic cell, in inside equipped with the accommodation space for accommodating electrolytic polishing object and electrolyte；
Cathode places fixed frame, is installed in the grind section in the one side formation of the electrolytic polishing object；
Negative plate is installed in the grind section of the electrolytic polishing object；
Fixture is installed on the cathode and places fixed frame, fixed negative plate；And
Rectifier is electrically connected in the electrolytic polishing object and the negative plate respectively, is connect to the electrolytic polishing object
Enter anode, cathode is accessed to the negative plate；
The grind section of the negative plate and the electrolytic polishing object accordingly realizes modularization.
2. electrolytic polishing device according to claim 1, wherein
The grind section of the electrolytic polishing object is formed with polygon or cylindrical shape,
The negative plate is formed in the form of belt, so as to according to specification corresponding with the grind section of electrolytic polishing object
Realize modularization.
3. electrolytic polishing device according to claim 2, wherein
The negative plate includes：
First cathode grate, is vertically arranged in the grind section；And
Second cathode grate is configured at the grind section of the electrolytic polishing object in the horizontal direction, along with the first cathode
Grate it is crisscross, arranged while forming placement space, checker board be assembled into the first cathode grate.
4. electrolytic polishing device according to claim 1, wherein
The electrolytic polishing object is formed with cylindrical shape, includes grind section in the outside of the cylindrical shape electrolytic polishing object,
The negative plate be include the first cathode grate of linear, be incorporated into circular the of the first cathode grate
Two cathode grates and modular checker board negative plate.
5. electrolytic polishing device according to claim 4, wherein
The auxiliary of circular frame, quadrilateral frame or multilateral framework shape is installed on the top of the cylindrical shape electrolytic polishing object
Fixed frame.
6. electrolytic polishing device according to claim 1, wherein
The first cathode grate and the second cathode grate are with linear or round formation.
7. electrolytic polishing device according to claim 6, wherein
The first cathode grate and the second cathode grate utilize a certain knot in rivet Rivet, bolt B olt or welding
Merge and realizes modularization.
8. electrolytic polishing device according to claim 1, wherein
The electrolytic polishing object is respectively formed with grind section in internal and outside.
9. electrolytic polishing device according to claim 8, wherein
It is electrically connected to each other in the negative plate that the inside and outside grind section of the electrolytic polishing object is respectively configured.
10. electrolytic polishing device according to claim 1, which is characterized in that
The cathode is placed fixed frame and is attached with：
Plate；And
Insulation board is made of on the two sides of the plate certain one in rubber, polyurethane, PVC or bakelite Bakelite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011267720.6A CN112496479B (en) | 2017-04-24 | 2018-04-17 | Electrolytic polishing device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0052341 | 2017-04-24 | ||
| KR1020170052341A KR101769924B1 (en) | 2017-04-24 | 2017-04-24 | Electrolytic polishing apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011267720.6A Division CN112496479B (en) | 2017-04-24 | 2018-04-17 | Electrolytic polishing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108723528A true CN108723528A (en) | 2018-11-02 |
| CN108723528B CN108723528B (en) | 2020-11-24 |
Family
ID=59757436
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011267720.6A Active CN112496479B (en) | 2017-04-24 | 2018-04-17 | Electrolytic polishing device |
| CN201810343062.0A Active CN108723528B (en) | 2017-04-24 | 2018-04-17 | Electrolytic grinding device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011267720.6A Active CN112496479B (en) | 2017-04-24 | 2018-04-17 | Electrolytic polishing device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101769924B1 (en) |
| CN (2) | CN112496479B (en) |
| TW (2) | TWI772771B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465722A (en) * | 2017-09-28 | 2020-07-28 | 南韩商奥森里德股份有限公司 | Electrode frame for electrolytic polishing, variable electrode frame for electrolytic polishing, and electrolytic polishing apparatus including same |
| CN112404621A (en) * | 2020-11-06 | 2021-02-26 | 扬州大学 | Electrolytic grinding processing method for honeycomb part filler |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101848264B1 (en) * | 2017-09-28 | 2018-04-13 | 황재상 | Electrode frame having electrode separating member for electro polishing and electro polishing apparatus including the same |
| KR101848266B1 (en) * | 2017-09-28 | 2018-04-13 | 황재상 | Variable electrode frame for electro polishing, fixing member of electrode frame for electro polishing and electro polishing apparatus including the same |
| KR101848251B1 (en) * | 2017-09-28 | 2018-04-12 | 황재상 | Electrode frame having electrode supporting member for electro polishing and electro polishing apparatus including the same |
| WO2019066584A1 (en) * | 2017-09-28 | 2019-04-04 | 주식회사 어썸리드 | Electrode frame for electropolishing and electropolishing apparatus comprising same |
| KR101848257B1 (en) * | 2017-09-28 | 2018-04-13 | 황재상 | Electrode frame having electrode combining member for electro polishing and electro polishing apparatus including the same |
| KR102205852B1 (en) * | 2018-03-29 | 2021-01-20 | 황재상 | Electrode frame having electrode supporting member for electro polishing and electro polishing apparatus including the same |
| KR102250005B1 (en) * | 2018-03-29 | 2021-05-07 | 황재상 | Variable electrode frame for electro polishing, fixing member of electrode frame for electro polishing and electro polishing apparatus including the same |
| KR102226831B1 (en) * | 2018-03-29 | 2021-03-11 | 황재상 | Electrode frame having electrode separating member for electro polishing and electro polishing apparatus including the same |
| CN113106534B (en) * | 2021-04-13 | 2022-07-05 | 山西百一机械设备制造有限公司 | Lead alloy electrode plate, preparation method and anode plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201581151U (en) * | 2009-12-01 | 2010-09-15 | 广州中国科学院工业技术研究院 | Electrochemical polishing treatment device for internal surface and external surface of metal workpiece |
| KR101183218B1 (en) * | 2011-08-30 | 2012-09-14 | (주)한국마루이 | Electrolytic polishing apparatus |
| CN204298503U (en) * | 2014-12-04 | 2015-04-29 | 朱晓飞 | For the electrochemical polish apparatus of metal substrate |
| CN105386117A (en) * | 2015-11-24 | 2016-03-09 | 常州乐奥医疗科技有限公司 | Electrochemical polishing device and method for support |
| CN105714367A (en) * | 2016-04-27 | 2016-06-29 | 上海纽脉医疗科技有限公司 | Electrolytic polishing device |
| CN205398767U (en) * | 2016-03-03 | 2016-07-27 | 天津市众宇鑫精密模具有限公司 | Novel electric chemical polishing of mould processing device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB676546A (en) * | 1949-12-23 | 1952-07-30 | Rolls Royce | Anodic electro polishing and surface metal removal of metal parts |
| CN2190116Y (en) * | 1994-06-04 | 1995-02-22 | 葛淑英 | Electrochemically decomposer for composite metal fibers bunch |
| WO1996030561A1 (en) * | 1995-03-24 | 1996-10-03 | Alltrista Corporation | Jacketed sacrificial anode cathodic protection system |
| JPH1150299A (en) * | 1997-08-05 | 1999-02-23 | Olympus Optical Co Ltd | Method and apparatus for ultrasonic electrolytic cleaning |
| JP2002144152A (en) * | 2000-11-14 | 2002-05-21 | Mitsubishi Heavy Ind Ltd | Device and method for electrolytic polishing of round bar specimen |
| US6679980B1 (en) * | 2001-06-13 | 2004-01-20 | Advanced Cardiovascular Systems, Inc. | Apparatus for electropolishing a stent |
| JP2004162149A (en) * | 2002-11-15 | 2004-06-10 | Jfe Steel Kk | Device for electrolyzing metallic sample |
| KR20100003821A (en) * | 2008-07-02 | 2010-01-12 | (주)한국마루이 | Electro polishing apparatus and method using half immersion |
| KR101523085B1 (en) * | 2013-06-13 | 2015-05-27 | 전남대학교산학협력단 | apparatus and method of processing surface of shape memory alloy |
| KR101478770B1 (en) | 2014-05-29 | 2015-01-05 | 박진성 | Assembly discharge electrode for electrostatic precipitator |
| US9382631B1 (en) * | 2015-07-07 | 2016-07-05 | Christian Villegas | Multi use cathodic protection system for steel and reinforced concrete and method of use |
| KR101696144B1 (en) | 2016-04-29 | 2017-01-16 | 인하대학교 산학협력단 | Electropolishing device of micro metal sheet |
| KR101720480B1 (en) | 2017-01-23 | 2017-03-27 | 정현석 | Electrolytic Polishing Apparatus for Polishing Object of Rotor Shape with Convex Central Part and Upper Opening |
-
2017
- 2017-04-24 KR KR1020170052341A patent/KR101769924B1/en active IP Right Review Request
-
2018
- 2018-04-17 CN CN202011267720.6A patent/CN112496479B/en active Active
- 2018-04-17 CN CN201810343062.0A patent/CN108723528B/en active Active
- 2018-04-23 TW TW109111084A patent/TWI772771B/en active
- 2018-04-23 TW TW107113761A patent/TWI692556B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201581151U (en) * | 2009-12-01 | 2010-09-15 | 广州中国科学院工业技术研究院 | Electrochemical polishing treatment device for internal surface and external surface of metal workpiece |
| KR101183218B1 (en) * | 2011-08-30 | 2012-09-14 | (주)한국마루이 | Electrolytic polishing apparatus |
| CN204298503U (en) * | 2014-12-04 | 2015-04-29 | 朱晓飞 | For the electrochemical polish apparatus of metal substrate |
| CN105386117A (en) * | 2015-11-24 | 2016-03-09 | 常州乐奥医疗科技有限公司 | Electrochemical polishing device and method for support |
| CN205398767U (en) * | 2016-03-03 | 2016-07-27 | 天津市众宇鑫精密模具有限公司 | Novel electric chemical polishing of mould processing device |
| CN105714367A (en) * | 2016-04-27 | 2016-06-29 | 上海纽脉医疗科技有限公司 | Electrolytic polishing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111465722A (en) * | 2017-09-28 | 2020-07-28 | 南韩商奥森里德股份有限公司 | Electrode frame for electrolytic polishing, variable electrode frame for electrolytic polishing, and electrolytic polishing apparatus including same |
| CN111465722B (en) * | 2017-09-28 | 2022-07-12 | 南韩商奥森里德股份有限公司 | Electrode frame for electrolytic polishing, variable electrode frame for electrolytic polishing, and electrolytic polishing apparatus including same |
| CN112404621A (en) * | 2020-11-06 | 2021-02-26 | 扬州大学 | Electrolytic grinding processing method for honeycomb part filler |
| CN112404621B (en) * | 2020-11-06 | 2022-06-24 | 扬州大学 | Electrolytic grinding processing method for honeycomb part filler |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201839185A (en) | 2018-11-01 |
| TW202026468A (en) | 2020-07-16 |
| TWI692556B (en) | 2020-05-01 |
| CN112496479A (en) | 2021-03-16 |
| CN108723528B (en) | 2020-11-24 |
| CN112496479B (en) | 2024-09-06 |
| TWI772771B (en) | 2022-08-01 |
| KR101769924B1 (en) | 2017-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108723528A (en) | electrolytic polishing device | |
| KR101183218B1 (en) | Electrolytic polishing apparatus | |
| US20200152991A1 (en) | Lead/Acid Batteries | |
| CN102337578B (en) | Double-sided plating tank, sheet and plating method | |
| CN1609282A (en) | Partial plating method and its apparatus | |
| CN104641023B (en) | Using internal anode to treatment article electroplating layer | |
| CN108396368A (en) | A kind of electrolytic polishing method of metalwork | |
| EA201791832A1 (en) | ANODE INTENDED FOR THE USE IN THE PROCESS OF ELECTROLYSIS FOR THE PRODUCTION OF ALUMINUM IN HALL-ERU CELLS AND A METHOD OF ITS MANUFACTURE | |
| CN104099658A (en) | Auxiliary anode for use in acid zinc-nickel alloy electroplating | |
| MX2010003358A (en) | System and method of plating metal alloys by using galvanic technology. | |
| JP2022536258A (en) | Electrode assembly for electrochemical processes | |
| CN111699285B (en) | Electrode frame for electrolytic polishing and electrolytic polishing device comprising same | |
| CN204867691U (en) | Tool electrode subassembly for spark -erosion machining | |
| KR101848264B1 (en) | Electrode frame having electrode separating member for electro polishing and electro polishing apparatus including the same | |
| KR100984074B1 (en) | Apparatus for electroplating to parts with center hole and method for the same | |
| RU2566120C1 (en) | Aluminium electrolyser busbar | |
| MY183698A (en) | Aluminium smelter and method to compensate for a magnetic field created by the circulation of the electrolysis current of said aluminium smelter | |
| KR101848257B1 (en) | Electrode frame having electrode combining member for electro polishing and electro polishing apparatus including the same | |
| KR102205852B1 (en) | Electrode frame having electrode supporting member for electro polishing and electro polishing apparatus including the same | |
| WO2021106291A1 (en) | Method for suppressing increase in zinc concentration in plating solution, and method for producing zinc-based plating member | |
| CN211814681U (en) | Electrodeposition apparatus | |
| WO2005110623A3 (en) | Method of making an electrolytic cell | |
| CN106663921A (en) | Ion generation component, and ion generation device provided with ion generation component | |
| JP2015101774A (en) | Method for producing special shape electrodeposition | |
| CN110112339A (en) | A kind of startup power supply power supply box, startup power supply and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |