CN108710225A - A kind of bound device and its control method - Google Patents
A kind of bound device and its control method Download PDFInfo
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- CN108710225A CN108710225A CN201810510428.9A CN201810510428A CN108710225A CN 108710225 A CN108710225 A CN 108710225A CN 201810510428 A CN201810510428 A CN 201810510428A CN 108710225 A CN108710225 A CN 108710225A
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- electrode
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- bound
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
Abstract
The invention discloses a kind of bound device and its control methods, it is related to bound device technical field, for solving existing to solve the problem of that existing bound device is bound during bound device is tied to display panel between the conducting terminal and the conducting terminal of display panel of device and misplace and invent.The bound device, including panel microscope carrier and rack, rack is equipped with binding pressure head, it further include processing unit, processing unit is used to control the shift offset for binding pressure head relative first position in the horizontal direction, so that it is just opposite to be bound the conducting terminal that device is bound after the changing of the relative positions opposite with panel generation on the conducting terminal and panel on device under the action of binding pressure in binding procedure, first position is before binding pressure head is to being bound device application binding pressure, it is bound the position at the conducting terminal positive clock synchronization binding pressure head on the conducting terminal and panel on device.The present invention can be used in the binding of the devices such as face chip on board.
Description
Technical field
The present invention relates to bound device technical field more particularly to a kind of bound devices and its control method.
Background technology
In the manufacturing process of display device, for example, liquid crystal display array substrate and color membrane substrates to box complete with
Afterwards, it needs the devices such as chip being tied to on the display panel after box, showing and driving with the picture to display panel.And
The binding of the devices such as chip is completed in bound device, and whether the structure design of bound device is rationally directly related to chip
The binding quality of equal devices, and then affect the display quality of the picture of display device.
A kind of existing bound device, including binding pressure head, the binding pressure head are being bound for carrying bound chip 01
When, as shown in Figure 1, binding pressure head by the conducting terminal 021 on the conducting terminal 011 of chip 01 and 02 binding region of display panel
It is just opposite, it then binds pressure head pushing and is tied to chip 01 in the binding region of display panel 02, to realize display panel 02
It is electrically connected with chip 01.
Existing this bound device is during the binding of chip, if the binding region of display panel 02 is uneven
Whole, then under the action of binding pressure, the stress in the binding region of out-of-flatness of chip 01 will appear imbalance, to lead
The opposite generation changing of the relative positions of display panel 02 (as shown in Figure 1) of cause chip 01, and the changing of the relative positions occurred between chip 01 and display panel 02
Conducting terminal 011 and the conducting terminal 021 of binding region on chip 01 can be made to misplace, so as to cause chip 01 and display
It is bad to occur conduction between panel 02, makes the pixel electrode undercharge of display panel 02, and then display device is caused to show
When be susceptible to concealed wire, different aobvious etc. bad, be unfavorable for improving the yields of display device.
Invention content
A kind of bound device of the embodiment of the present invention offer and its control method are being incited somebody to action for solving existing bound device
During bound device is tied to display panel, it is bound between the conducting terminal and the conducting terminal of display panel of device
The problem of misplacing.
In order to achieve the above objectives, in a first aspect, an embodiment of the present invention provides a kind of bound device, including panel microscope carrier and
Rack, the rack are equipped with binding pressure head, can be in vertical direction and water between the binding pressure head and the panel microscope carrier
It square relatively moves upwards, the binding pressure head can be located at the top of the panel microscope carrier, and the binding pressure head be used to hold
The binding region for being bound device and bound device being tied to the panel is carried, further includes processing unit, the place
Reason device is used to control the shift offset of the binding pressure head relative first position in the horizontal direction, so that binding
The bound device after the opposite changing of the relative positions occurs under the action of binding pressure with the panel for the bound device in the process
On conducting terminal and the conducting terminal on the panel it is just opposite, the first position be in the binding pressure head to the quilt
Before binding the device application binding pressure, when the conducting terminal on the bound device and the conducting terminal on the panel
Positive clock synchronization, the position bound at pressure head.
Further, further include measurer for thickness, the measurer for thickness reflects the binding region for obtaining
Thickness characterization value at different location, and the acquired thickness characterization value is reached into the processing unit；The processing dress
It sets for according to the thickness characterization value received, calculating the thickness value at the binding region different location, to obtain
The thickness distribution of the binding region.
Further, the processing unit is additionally operable to the thickness distribution according to the binding region, determines the binding
The shift offset of the pressure head relatively described first position in the horizontal direction, so as to be bound device described in binding procedure
Part occur with the panel under the action of binding pressure conducting terminal after the opposite changing of the relative positions on the bound device with it is described
Conducting terminal on panel is just opposite.
Further, the measurer for thickness includes first electrode and second electrode, and the second electrode is set to
On the panel microscope carrier, for placing the panel in the second electrode；The first electrode can be located at the second electrode
Top；One in the first electrode, the second electrode is plate-like electrode, the first electrode, described second
Another in electrode includes multiple conductive sheets each parallel to the plate-like electrode, and multiple conductive sheets are in described
The opposite equal flush in surface of the electrode of plate, and it is separated by setting between the two neighboring conductive sheet；The thickness measure
Device further includes capacitance measurement unit, and the capacitance measurement unit is for measuring multiple conductive sheets and the plate-like electricity
Capacitance between pole, and using the capacitance between measured multiple conductive sheets and the plate-like electrode as institute
It states thickness characterization value and reaches the processing unit.
Further, it can be relatively moved in the horizontal direction between the first electrode and the panel microscope carrier.
Further, the measurer for thickness further includes fixed plate, multiple conductive sheets with the fixed plate
It is fixedly connected, the capacitance measurement unit is set in the fixed plate.
Second aspect, an embodiment of the present invention provides a kind of control method of bound device, the bound device includes face
Onboard, when panel fixed placement is after on the panel microscope carrier, include the following steps：Control is bound device in the water
Square upwards relative second position shift offset so that described in binding procedure be bound device binding pressure work
The conducting terminal being bound on device after the opposite changing of the relative positions and the conducting terminal positive on the panel occurs with the panel with lower
Right, the second position is before applying the binding pressure, when on the conducting terminal and the panel being bound on device
Conducting terminal face when the bound device at position.
Further, the shift offset for being bound the device relatively described second position in the horizontal direction is controlled,
It is tied up so as to be bound described in binding procedure after under the action of binding pressure with the panel the opposite changing of the relative positions occurs for device
The conducting terminal determined on device is just specifically including relatively with the conducting terminal on the panel：Obtain the binding for reflecting the panel
Thickness characterization value at the different location of region；According to the thickness characterization value at the binding region different location, calculate described
Thickness value at binding region different location, to obtain the thickness distribution of the binding region.
Further, further comprising the steps of after the thickness distribution for obtaining the binding region：It is tied up according to described
The thickness distribution for determining region determines the displacement bias of the bound device relatively described second position in the horizontal direction
Amount, so that be bound device described in binding procedure occurs quilt after the opposite changing of the relative positions under the action of binding pressure with the panel
It binds the conducting terminal on device and the conducting terminal on the panel is just opposite.
Further, include measurer for thickness in the bound device, the measurer for thickness includes the first electricity
Pole and second electrode, the second electrode are set on the panel microscope carrier, for placing the panel in the second electrode；
The first electrode can be located at the top of the second electrode；One in the first electrode, the second electrode is in plate
The electrode of shape, another electrode in the first electrode, the second electrode include multiple each parallel to described plate-like
The conductive sheet of electrode, multiple conductive sheets surface equal flush opposite with the plate-like electrode, and it is two neighboring
Be separated by setting between the conductive sheet, the panel be positioned over the second electrode it is upper in the case of, obtain and reflect the face
Thickness characterization value at the binding region different location of plate includes：Obtain multiple conductive sheets and the plate-like electrode it
Between capacitance.
Bound device and its control method provided in an embodiment of the present invention, due to further including processing unit, processing unit use
In the shift offset of control binding pressure head relative first position in the horizontal direction, so as to be bound device in binding procedure
The conducting end on conducting terminal and panel under the action of binding pressure after the changing of the relative positions opposite with panel generation on bound device
Son is just opposite, and in this way in binding procedure, processing unit is by adjusting in binding pressure head relative first position in the horizontal direction
Shift offset, so that it may to offset the changing of the relative positions amount for being bound device opposite panel under the action of binding pressure, to make to be tied up
Determine to be bound on the conducting terminal and panel on device after under the action of binding pressure the opposite changing of the relative positions occurs with panel for device
Conducting terminal is just opposite, accordingly, it is possible to avoid being bound between device and panel caused by the two conducting terminal misplaces
It is conductive bad, occur concealed wire, the different undesirable probability such as aobvious so that display device can be substantially reduced in display, to advantageous
In the yields for improving display device, display device is reduced because of the conducting terminal on the conducting terminal and panel on bound device
The reparation amount for misplacing and needing.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of existing process schematic of bound device binding chip；
Fig. 2 is the front view of the bound device of the embodiment of the present invention；
Fig. 3 is the left view of the bound device of the embodiment of the present invention；
Fig. 4 is that the bound device binding of the embodiment of the present invention is bound the process schematic of device；
Fig. 5 is the structural schematic diagram of the measurer for thickness of the bound device of the embodiment of the present invention；
Fig. 6 is the upward view of first electrode in Fig. 5；
Fig. 7 is the schematic diagram that the measurer for thickness of the bound device of the embodiment of the present invention measures；
Fig. 8 is the structural schematic diagram of transmission device during the measurer for thickness of the embodiment of the present invention measures；
Fig. 9 is the flow chart of the control method of the bound device of the embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term "center", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on ... shown in the drawings
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, do not indicate or imply the indicated device or
Element must have a particular orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It is right
For those skilled in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Term " first ", " second " are used for description purposes only, be not understood to indicate or imply relative importance or
Implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or imply
Ground includes one or more this feature.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or
It is more than two.
In a first aspect, an embodiment of the present invention provides a kind of bound devices, as shown in Figures 2 and 3, including panel microscope carrier 1
With rack 2, rack 2 is equipped with binding pressure head 3, and binding can be in vertical direction and horizontal direction between pressure head 3 and panel microscope carrier 1
Upper to relatively move, binding pressure head 3 can be located at the top of panel microscope carrier 1, and binding pressure head 3 is for carrying bound device 100
And bound device 100 can be tied to the binding region 200 of panel, which further includes processing unit 4, such as Fig. 3
Shown in Fig. 4, processing unit 4 is used to control the shift offset for binding the relative first position in the horizontal direction of pressure head 3, so that
It is bound in binding procedure after under the action of binding pressure with panel the opposite changing of the relative positions occurs for device 100 and is bound device 100
On conducting terminal 110 and panel on conducting terminal 210 it is just opposite, first position is in binding pressure head 3 to being bound device
Before 100 apply binding pressure, it is bound the conducting terminal 110 on device 100 and the 210 positive clock synchronization of conducting terminal on panel,
Bind the position at pressure head 3.
Wherein, it can be chip to be bound device 100, can also be flexible PCB, be not specifically limited herein；It is tied up
The conducting terminal 110 and " just opposite " of the 210 positive centering of conducting terminal on panel determined on device 100 specifically refer to be bound
Conducting terminal 110 on device 100 is vertically formed by projection in binding region 200, is led in binding region 200
The area of electric terminal lap is maximum；It can be sent out on vertical direction and horizontal direction between binding pressure head 3 and panel microscope carrier 1
Raw relative movement can be that panel microscope carrier 1 is fixed with respect to 2 position of rack, 3 opposite face of binding pressure head onboard 1 vertical direction with
And (such as shown in Fig. 2 and Fig. 3) is moved in horizontal direction, can also be that binding pressure head 3 is fixed with respect to 2 position of rack, panel carries
Platform 1 is moved relative to binding pressure head 3 on vertical direction and horizontal direction.
Bound device provided in an embodiment of the present invention, due to further including processing unit 4, processing unit 4 is for controlling binding
The shift offset of the relative first position in the horizontal direction of pressure head 3 is being bound so as to be bound device 100 in binding procedure
The conducting terminal 110 being bound on device 100 after the opposite changing of the relative positions with panel generation under the action of pressure and the conducting end on panel
Son 210 is just opposite, and in this way in binding procedure, processing unit 4 is by adjusting in binding pressure head 3 in the horizontal direction opposite first
Position displacement offset, so that it may to offset the changing of the relative positions amount for being bound opposite panel under the action of binding pressure of device 100, to
Make to be bound the conducting end that device 100 is bound under the action of binding pressure with panel generation after the opposite changing of the relative positions on device 100
Son 110 is just opposite with the conducting terminal 210 on panel, accordingly, it is possible to avoid being bound between device 100 and panel because of the two
The caused conduction of conducting terminal dislocation is bad, occurs concealed wire, different aobvious to can substantially reduce display device in display
Etc. undesirable probability, to be conducive to improve the yields of display device, display device is reduced because being bound leading on device 100
Electric terminal 110 misplaces with the conducting terminal 210 on panel and the reparation amount of needs.
In the above-described embodiments, the size of relative first position shift offset obtains binding pressure head 3 in the horizontal direction
It takes mode not unique, for example the size of shift offset can be obtained by the thickness distribution of binding region 200, specifically such as
Under：As shown in Figures 2 and 3, which further includes measurer for thickness 5, and measurer for thickness 5 is for obtaining reflection binding
Thickness characterization value at 200 different location of region, and acquired thickness characterization value is reached into processing unit 4；Processing unit 4 is used
According to the thickness characterization value received, the thickness value at 200 different location of binding region is calculated, to obtain binding region
Then 200 thickness distribution can obtain bound device 100 in binding procedure according to the thickness distribution of binding region 200
In stressing conditions, can be in the hope of binding pressure head 3 opposite in the horizontal direction the according to the stressing conditions of bound device 100
The size of one position displacement offset.In addition, the size of shift offset can also be set according to actual conditions operator, than
As in practice, panel is typically to produce in batches, that is to say, that the thickness distribution of binding region 200 is typically more similar, needle
To the panel of same batch production, one shift offset of setting can meet the batch panel and bound device 100 compared with
It binds well.Compared to the embodiment that the size of shift offset is set by operator according to actual conditions, bound device includes
The embodiment (such as Fig. 2 and embodiment shown in Fig. 3) of measurer for thickness 5, the size for moving offset is by processing unit 4
The thickness distribution of acquired binding region 200 acquires, and the shift offset obtained in this way is more accurate, so that being bound
The bit errors smaller of device 100 and panel.
In the embodiment that bound device includes measurer for thickness 5, processing unit 4 is in the thickness for obtaining binding region 200
After degree distribution, the executive agent of the binding pressure head 3 shift offset size of relative first position in the horizontal direction is determined
It is not unique, for example executive agent can be processing unit 4, it is specific as follows：Processing unit 4 is additionally operable to according to binding region 200
Thickness distribution determines the shift offset of binding pressure head 3 relative first position in the horizontal direction, so that the quilt in binding procedure
Bind the conducting terminal 110 that device 100 is bound under the action of binding pressure with panel generation after the opposite changing of the relative positions on device 100
It is just opposite with the conducting terminal 210 on panel.In addition, executive agent can also be people, processing unit 4 is obtaining binding region
After 200 thickness distribution, people can calculate binding pressure according to oneself experience and the thickness distribution of binding region 200
The shift offset of first 3 relative first positions in the horizontal direction.Compared to the embodiment that executive agent is people, executive agent is place
In the embodiment for managing device 4, the shift offset of binding pressure head 3 relative first position in the horizontal direction is by processing unit 4
Gained is calculated, the calculating for being substantially shorter the required time for calculating shift offset in this way and improving shift offset is accurate
Degree.
Determining that the executive agent of the shift offset size of relative first position is to locate to binding pressure head 3 in the horizontal direction
In the embodiment for managing device 4, processing unit 4 can determine shift offset in the following manner：Processor is for obtaining
After the thickness distribution of binding region 200, according to the thickness distribution of binding region 200, calculates in different shift offsets, tied up
Determine device 100 and the position after the opposite changing of the relative positions occurs with panel under the action of binding pressure；When bound device 100 is pressed in binding
When the position after the opposite changing of the relative positions occur with panel under force effect coinciding with first position, determine bound device 100 with face
The shift offset of relative first position is required shift offset before the opposite changing of the relative positions of plate generation.
In bound device provided in an embodiment of the present invention, as shown in Figures 2 and 3, processing unit 4 may include computer,
After the thickness characterization value that measurer for thickness 5 obtains at reflection 200 different location of binding region, measurer for thickness 5 will
Acquired thickness characterization value reaches computer；Computer is used to, according to the thickness characterization value received, calculate binding region
Thickness value at 200 different locations, to obtain the thickness distribution of binding region 200；Computer is additionally operable to according to binding region 200
Thickness distribution, determine the shift offset of binding pressure head 3 relative first position in the horizontal direction.
Wherein, computer determines the specific step of binding pressure head 3 shift offset of relative first position in the horizontal direction
It is rapid as follows：The threedimensional model of panel binding region 200 is established according to the thickness distribution of binding region 200, while also being established and being tied up
Determine the threedimensional model of device 100, the conducting resinl applied in binding region 200, then determines binding region 200, is bound device
100, each property parameters, such as material, size etc. of conducting resinl；It determines that binding pressure etc. binds technological parameter with practical, connects
, computer by calculating in the case where bind pressure, bound device 100 binding region 200 stress size, come calculate by
It binds device 100 and the position after the changing of the relative positions occurs with panel, finally determine binding pressure head 3 in level side according to the position after the changing of the relative positions
The shift offset of upward relative first position.The above-mentioned calculating process of computer can be in machinery system dynamics analysis software
It is calculated in (such as ADAMS softwares), corresponding Lagrange's equation can be calculated by the solver of the software, the glug is bright
Day equation is sought to be bound device 100 and be pressed in binding for binding pressure head 3 in relative first position difference shift offset
The position that opposite changing of the relative positions stopping occurs under force effect with panel, is bound gravity, panel suffered by device 100 at this location
Holding power and frictional force three force balance with conducting resinl.
In bound device provided in an embodiment of the present invention, the type of measurer for thickness 5 is not also unique, such as thickness measure
Device 5 can be capacitance gauge measuring device, and as shown in Figure 3 and Figure 5, measurer for thickness 5 includes first electrode 51 and second
Electrode 52, second electrode 52 are set on panel microscope carrier 1, and plate placement is used in second electrode 52；First electrode 51 can be located at
The top of second electrode 52；Second electrode 52 is plate-like, and first electrode 51 includes multiple conductions each parallel to second electrode 52
Piece 511, the equal flush in the surface opposite with second electrode 52 of multiple conductive sheets 511, and phase between two neighboring conductive sheet 511
Every setting；Measurer for thickness 5 further includes capacitance measurement unit (not shown), and capacitance measurement unit is for measuring multiple lead
Capacitance between electric piece 511 and second electrode 52, and by the electricity between measured multiple conductive sheets 511 and second electrode 52
Capacitance reaches processing unit 4 as thickness characterization value.Processing unit 4 is used for according to the multiple conductive sheets 511 and second received
Capacitance between electrode 52 calculates the thickness value at 200 different location of the binding region, to obtain the binding region
200 thickness distribution.
Wherein, as shown in fig. 6, multiple conductive sheets 511 can be in array distribution；As shown in figure 3, the figure show capacitance survey
The situation in fixed plate 53 is arranged in amount unit, and capacitance measurement unit can be connected by signal wire 8 with processing unit 4, with
Facilitate the signal transmission between capacitance measurement unit and processing unit 4.
In addition, measurer for thickness 5 can be laser thickness measuring device, which includes Laser emission
Device and CCD linear cameras；When measuring the thickness of binding region 200, laser emitter will be seen that red laser is penetrated by camera lens
To the first surface of binding region 200, the laser through the reflection of 200 first surface of binding region is internal by receiver camera lens
CCD linear cameras receive.According to different distances, CCD linear cameras " can see " this luminous point under a different angle,
The thickness transducer can be transmitted to processing unit 4 using this angle as thickness characterization value, processing unit 4 according to this angle and
The distance between known laser emitter and CCD linear cameras, so that it may to calculate laser emitter and binding region 200
The distance between first surface relative position, then according to laser emitter at a distance from the second surface of binding region 200, just
The thickness of binding region 200 can be calculated, second surface is opposite with first surface.
In the embodiment that measurer for thickness 5 is capacitance gauge measuring device, first electrode 51 and second electrode 52
Position can also be exchanged, that is, first electrode 51 be plate-like electrode, second electrode 52 be include multiple conductive sheets 511
Electrode.But it is plate-like electrode compared to first electrode 51, second electrode 52 is the electrode for including multiple conductive sheets 511, when the
One electrode 51 is the electrode for including multiple conductive sheets 511, when second electrode 52 is plate-like electrode, due to including multiple conductions
The potential of piece 511 in the top of panel, in this way can to avoid panel in placement process to caused by multiple conductive sheets 511
Influence, thereby may be ensured that multiple conductive sheets 511 measured by measurer for thickness 5 and capacitance between plate-like electrode
Accuracy.
In the embodiment that measurer for thickness 5 is capacitance gauge measuring device 5, due to measuring 200 thickness of binding region
When spending, first electrode 51 is needed positioned at the top of second electrode 52, and first electrode 51 is to binding pressure head 3 in this way in binding procedure
Pushing cause movement interference, for the ease of eliminating this first electrode 51 to the movement interference caused by binding pressure head 3, such as scheme
Shown in 3, it can be relatively moved in the horizontal direction between first electrode 51 and panel microscope carrier 1.In this way in measurer for thickness 5
After measurement finishes, first electrode 51 can in the horizontal direction relatively move between panel microscope carrier 1, so that the first electricity
Pole 51 avoids binding pressure head 3, and first electrode 51 is with regard to without being avoided by removing, not only ensureing binding pressure head 3
Smoothly bound device 100 is tied on panel, but also facilitates evacuation of the first electrode 51 to binding pressure head 3.
Wherein, it can be the first electricity that relative movement can occur between first electrode 51 and panel microscope carrier 1 in the horizontal direction
Pole 51 is fixed with respect to 2 position of rack, panel microscope carrier 1 can opposite first pole 51 move in the horizontal direction, can also be panel
Microscope carrier 1 is fixed with respect to 2 position of rack, first electrode 51 can opposite face move (such as Fig. 3 institutes for onboard 1 in the horizontal direction
Show).As shown in figures 3 and 8, first electrode 51 can realize that opposite face moves up for onboard 1 in the horizontal direction by transmission device 6
Dynamic, transmission device 6 includes that the gear 61 being meshed and rack 62, rack 62 are fixedly connected with first electrode 51, gear 61 and drive
Dynamic motor drive connection；The transmission device 6 further includes supporting rod 63, and supporting rod 63 is fixedly connected with rack 2, can on supporting rod 63
Rotation is equipped with pulley 64, and pulley 64 is in contact with rack 62, to be oriented to rack 62.
As shown in figure 3, first electrode 51 is electrically connected by conducting wire 7 with power supply 9 with second electrode 52, such power supply 9 can
To charge to first electrode 51, second electrode 52, so as to form capacitance between first electrode 51 and second electrode 52.
In the embodiment that measurer for thickness 5 is capacitance gauge measuring device, the shape of conductive sheet 511 is not also unique,
For example, as shown in fig. 6, conductive sheet 511 can be circle；In addition, conductive sheet 511 may be rectangular.It is circular compared to rectangular
Conductive sheet 511 is more conducive to charge and is uniformly distributed (rectangular conductive sheet on conductive sheet 511 in this way due to not having corner
511, charge is easily accumulated in edge, to cause distribution of charges uneven), so ensure measured conductive sheet 511 with
Capacitance is more accurate between opposite plate-like electrode.
For the ease of the installation of multiple conductive sheets 511, as shown in figure 5, measurer for thickness 5 further includes fixed plate 53, it is more
A conductive sheet 511 is fixedly connected with fixed plate 53, and such fixed plate 53 is equivalent to an immobilization carrier, so that it is guaranteed that multiple lead
Electric piece 511 is parallel to plate-like electrode (second electrode 52 shown in Fig. 5).
Wherein, the size of fixed plate 53 can be 100 × 100mm, and conductive sheet 511 can be the circular piece of a diameter of 1mm,
Spacing between 511 central point of two neighboring conductive sheet can be 1.5mm, and second electrode 52 can be the metallic plate of 1 × 1m.
In measurer for thickness, the installation position of capacitance measurement unit is not also unique, for example capacitance measurement unit can be with
It is set in fixed plate 53；In addition, capacitance measurement unit can also be arranged in rack 2.Compared to setting in rack 2, capacitance
Measuring unit is set in fixed plate 53, and the structure of measurer for thickness 5 can be made compacter, multiple conductive sheets 511 and electricity
Hold measuring unit be in fixed plate 53, between more convenient in this way measurement multiple conductive sheets 511 and plate-like electrode
Capacitance.
In the embodiment that measurer for thickness 5 is capacitance gauge measuring device 5, processing unit 4 is more according to what is received
Capacitance between a conductive sheet 511 and second electrode 52 calculates the thickness value at 200 different location of the binding region,
Its concrete principle is as follows：
For the capacitance between each conductive sheet 511 and plate-like electrode (second electrode 52 namely shown in fig. 5)
Relationship between value C and the distance between conductive sheet 511 and plate-like electrode D is as follows：C=ε0εγS/D (1)；
Wherein, ε0For permittivity of vacuum；εγFor relative dielectric constant；S is between conductive sheet 511 and plate-like electrode
It is formed by the effective area of plate condenser, that is, the area of conductive sheet 511.
As shown in fig. 7, the figure is shown when panel is positioned on second electrode 52,200 thickness of binding region and electricity
Formula (1) is applied in the model, can obtain by the illustraton of model between appearance：
CIt surveys=CAir+CPlate+CGlue=ε0εAirS/DAir+ε0εPlateS/DPlate+ε0εGlueS/DGlue(2)；
Wherein, CIt surveysFor the capacitance between measured conductive sheet 511 and second electrode 52；CAirIt is conductive sheet 511 to tying up
Determine the capacitance of air between the conducting resinl 300 on region 200；CPlateFor the capacitance of panel binding region 200；CGlueTo bind area
The capacitance of conducting resinl 300 on domain 200；εAirFor conductive sheet 511 to the dielectric of air between 200 conducting resinl 300 of binding region
Constant is approximately 1；εPlateFor the dielectric constant of panel binding region 200, can be checked according to design manual；εGlueFor binding region 200
On conducting resinl 300 dielectric constant, can be checked according to design manual；DAirConduction on conductive sheet 511 to binding region 200
The distance between glue 300；DPlateFor the thickness of panel binding region 200；DGlueFor the thickness of the conducting resinl 300 in binding region 200,
According to knowhow, the thickness fluctuation very little of conducting resinl 300 can be approximately definite value.
Again because of DAir=D-DGlue-DPlate(3)；
Bringing formula (3) into formula (2) arrangement can obtain：
(ε0εGlueS/DGlue-CIt surveys)DPlate 2+[CIt surveys(D-DGlue)-ε0εGlueS(D-DGlue)/DGlue-εAirε0S+ε0·
εPlateS]DPlate-ε0εPlate(D-DGlue)=0 (4)；
Pass through the capacitance C between the conductive sheet 511 and second electrode 52 of surveyIt surveysWith distance D, you can obtain one about DPlate's
One quadratic equation with one unknown, as shown in formula (4), processing unit 4 gives up extraneous root by the solution equation according to actual process,
The thickness that can be obtained the binding region 200 corresponding to each conductive sheet 511 can be obtained by entire binding region by arranging
200 thickness distribution.
As shown in Figures 2 and 3, it binds on pressure head 3 and is additionally provided with the first shooting device 31, such as camera, the first device for shooting
Part 31 is used to monitor the alignment situation of the conducting terminal of conducting terminal 110 and binding region 200 on bound device 100.Such as
Shown in Fig. 2 and Fig. 3, the second shooting device 11, such as camera are additionally provided on panel microscope carrier 1, the second shooting device 11 is also used for
Monitoring is bound the alignment situation of the conducting terminal of conducting terminal 110 and binding region 200 on device 100.Pass through setting the
One shooting device 31 and second shoots device 11 can monitor conducting terminal 110 on bound device 100 and tie up in all directions
Determine the alignment situation of the conducting terminal in region 200.
Wherein, in the case where second electrode 52 is transparent electrode, as shown in Figures 2 and 3, the second shooting device 11 can be with
It is set to the lower section of second electrode 52.
For the ease of the plate placement in second electrode 52, second electrode 52 is equipped with position mark, such as can be the
The periphery of two electrodes 52 is nested non-metal kind scale, can thus place panel according to position mark come plate placement
In correct position, to which bound device 100 is tied to binding region 200 by convenient follow-up binding pressure head 3.
Second aspect, the embodiment of the present invention additionally provide a kind of control method of bound device, and bound device includes panel
Microscope carrier 1 includes the following steps when panel fixed placement is after on panel microscope carrier 1：
Control is bound the shift offset of the relative second position in the horizontal direction of device 100, so that in binding procedure
In be bound device 100 conducting end after the opposite changing of the relative positions on bound device 100 occur with panel under the action of bind pressure
Son 110 is just opposite with the conducting terminal 210 on panel, and the second position is to be bound on device 100 before pressure is bound in application
Conducting terminal 110 and panel on 210 face of conducting terminal when be bound position at device 100.
Wherein, the main body for executing above-mentioned steps can be processing unit 4；Above-mentioned bound device 100 can be pressed by binding
First 3 are carried, and the position of pressure head 3 can be bound by control to control bound device 100 in the horizontal direction with respect to second
The shift offset of position.
The beneficial effect of the technical issues of control method of bound device provided in an embodiment of the present invention is solved and generation
Fruit is identical as the bound device provided in first aspect, and details are not described herein.
In the control method of above-mentioned bound device, controls and be bound the relative second position in the horizontal direction of device 100
Shift offset so that be bound device 100 in binding procedure occurs mistake relatively under the action of bind pressure with panel
The conducting terminal 110 being bound on device 100 after dynamic is just specifically including following steps relatively with the conducting terminal 210 on panel：
As shown in figure 9,
S1, acquisition reflect the thickness characterization value at 200 different location of binding region of panel；
Wherein, the main body for executing the step can be measurer for thickness 5.
S2, according to the thickness characterization value at 200 different location of binding region, calculate at 200 different location of binding region
Thickness value, to obtain the thickness distribution of binding region 200；
Wherein, processing unit 4, such as computer can be made by executing the main body of the step.
Further include following after the thickness distribution for obtaining binding region 200 in the control method of above-mentioned bound device
Step：
S3, according to the thickness distribution of binding region 200, determine bound device 100 in the horizontal direction with respect to second
The shift offset set occurs relatively under the action of binding pressure with panel so as to be bound device 100 in binding procedure
It is just opposite with the conducting terminal 210 on panel that the conducting terminal 110 on device 100 is bound after the changing of the relative positions.
Wherein, the main body for executing the step can be processing unit 4, such as computer；Can also be people, people is according to binding
The thickness distribution in region 200 determines the relative second position in the horizontal direction of bound device 100 by experience or calculating
Shift offset.
Include measurer for thickness 5 in bound device, as shown in figure 3, thickness in the control method of above-mentioned bound device
Measuring device 5 includes first electrode 51 and second electrode 52, and second electrode 52 is set on panel microscope carrier 1, in second electrode 52
For plate placement；First electrode 51 can be located at the top of second electrode 52；One in first electrode 51, second electrode 52 is
Plate-like electrode, another electrode in first electrode 51, second electrode 52 include multiple each parallel to plate-like electrode
Conductive sheet 511, the equal flush in the surface opposite with plate-like electrode of multiple conductive sheets 511, and two neighboring conductive sheet
Be separated by setting between 511, panel be positioned over second electrode 52 it is upper in the case of,
Obtaining the thickness characterization value at 200 different location of binding region of reflection panel includes：Obtain multiple conductive sheets 511
With the capacitance between plate-like electrode.
Then according to the capacitance between the multiple conductive sheets 511 received and plate-like electrode, binding area is calculated
Thickness value at 200 different location of domain, to obtain the thickness distribution of binding region 200.
Phase in the product embodiments with above-mentioned bound device appeared in the control method embodiment of the bound device
Same or similar feature, specifically can refer to the description in the product embodiments of above-mentioned bound device, details are not described herein.
More than, specific implementation mode only of the invention, but scope of protection of the present invention is not limited thereto, and it is any to be familiar with
Those skilled in the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of bound device, including panel microscope carrier and rack, the rack is equipped with binding pressure head, the binding pressure head and institute
Stating can relatively move on vertical direction and horizontal direction between panel microscope carrier, and the binding pressure head can be located at the face
Onboard top, the binding pressure head is for carrying bound device and can bound device be tied to the panel
Binding region, which is characterized in that further include processing unit, the processing unit is for controlling the binding pressure head in the level
The shift offset of relative first position on direction, so as to be bound effect of the device in binding pressure described in binding procedure
Conducting terminal after the lower changing of the relative positions opposite with panel generation on the bound device and the conducting terminal on the panel are just
Relatively, the first position is before the binding pressure head applies the binding pressure to the bound device, when the quilt
Bind the conducting terminal on device and the conducting terminal positive clock synchronization on the panel, the position at the binding pressure head.
2. bound device according to claim 1, which is characterized in that further include measurer for thickness, the thickness measure
Device is used to obtain the thickness characterization value at the reflection binding region different location, and by the acquired thickness characterization value
Reach the processing unit；The processing unit is used to, according to the thickness characterization value received, calculate the binding area
Thickness value at the different location of domain, to obtain the thickness distribution of the binding region.
3. bound device according to claim 2, which is characterized in that the processing unit is additionally operable to according to the binding area
The thickness distribution in domain determines the shift offset of the binding pressure head relatively described first position in the horizontal direction, with
Make the bound device described in binding procedure that the quilt after the opposite changing of the relative positions occur with the panel under the action of binding pressure
It binds the conducting terminal on device and the conducting terminal on the panel is just opposite.
4. bound device according to claim 2 or 3, which is characterized in that the measurer for thickness includes first electrode
And second electrode, the second electrode are set on the panel microscope carrier, for placing the panel in the second electrode；Institute
The top of the second electrode can be located at by stating first electrode；One in the first electrode, the second electrode is plate-like
Electrode, another in the first electrode, the second electrode includes multiple each parallel to the plate-like electrode
Conductive sheet, multiple conductive sheets surface equal flush opposite with the plate-like electrode, and two neighboring described lead
It is separated by setting between electric piece；The measurer for thickness further includes capacitance measurement unit, and the capacitance measurement unit is for measuring
Capacitance between multiple conductive sheets and the plate-like electrode, and by measured multiple conductive sheets with it is described
Capacitance between plate-like electrode reaches the processing unit as the thickness characterization value.
5. bound device according to claim 4, which is characterized in that can between the first electrode and the panel microscope carrier
It relatively moves in the horizontal direction.
6. bound device according to claim 4, which is characterized in that the measurer for thickness further includes fixed plate, more
A conductive sheet is fixedly connected with the fixed plate, and the capacitance measurement unit is set in the fixed plate.
7. a kind of control method of bound device, the bound device includes panel microscope carrier, which is characterized in that when panel fixation is put
After being placed on the panel microscope carrier, include the following steps：
Control is bound the shift offset of device relative second position in the horizontal direction, so that the institute in binding procedure
State the conducting terminal that bound device is bound under the action of binding pressure with panel generation after the opposite changing of the relative positions on device
Just opposite with the conducting terminal on the panel, the second position is before applying the binding pressure, when bound device
Conducting terminal on part and the position at bound device when conducting terminal face on the panel.
8. the control method of bound device according to claim 7, which is characterized in that control is bound device in the water
Square upwards the relatively described second position shift offset so that described in binding procedure be bound device binding pressure
Under the action of with the panel conducting terminal being bound on device after the opposite changing of the relative positions and the conducting terminal on the panel occurs
It is just opposite to specifically include：
Obtain the thickness characterization value at the binding region different location for reflecting the panel；
According to the thickness characterization value at the binding region different location, the thickness at the binding region different location is calculated
Value, to obtain the thickness distribution of the binding region.
9. the control method of bound device according to claim 8, which is characterized in that in the thickness for obtaining the binding region
It is further comprising the steps of after degree distribution：
According to the thickness distribution of the binding region, the bound device in the horizontal direction relatively described second is determined
The shift offset of position is sent out under the action of binding pressure with the panel so as to be bound device described in binding procedure
It is bound the conducting terminal on device after the raw opposite changing of the relative positions and the conducting terminal on the panel is just opposite.
10. the control method of bound device according to claim 8 or claim 9, which is characterized in that include in the bound device
Measurer for thickness, the measurer for thickness include first electrode and second electrode, and the second electrode is set to the face
On onboard platform, for placing the panel in the second electrode；The first electrode can be located at the top of the second electrode；
One in the first electrode, the second electrode is plate-like electrode, in the first electrode, the second electrode
Another electrode includes multiple conductive sheets each parallel to the plate-like electrode, multiple conductive sheets with it is described plate-like
The opposite equal flush in surface of electrode, and be separated by setting between the two neighboring conductive sheet, the panel is positioned over institute
State second electrode it is upper in the case of,
Obtaining the thickness characterization value at the binding region different location for reflecting the panel includes：Obtain multiple conductive sheets with
Capacitance between the plate-like electrode.
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| CN112654229A (en) * | 2020-12-22 | 2021-04-13 | 合肥欣奕华智能机器有限公司 | Binding equipment and control method thereof |
| CN114497317A (en) * | 2020-11-11 | 2022-05-13 | 合肥欣奕华智能机器股份有限公司 | Method, device, equipment and storage medium for determining binding position of substrate |
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| CN108710225B (en) | 2021-01-26 |
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