CN108693699A - 光掩模坯料的制造方法 - Google Patents

光掩模坯料的制造方法 Download PDF

Info

Publication number
CN108693699A
CN108693699A CN201810284727.5A CN201810284727A CN108693699A CN 108693699 A CN108693699 A CN 108693699A CN 201810284727 A CN201810284727 A CN 201810284727A CN 108693699 A CN108693699 A CN 108693699A
Authority
CN
China
Prior art keywords
film
hard mask
pattern
photomask blank
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810284727.5A
Other languages
English (en)
Chinese (zh)
Inventor
木下隆裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of CN108693699A publication Critical patent/CN108693699A/zh
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76Patterning of masks by imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/72Repair or correction of mask defects
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80Etching
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Physical Vapour Deposition (AREA)
CN201810284727.5A 2017-04-05 2018-04-02 光掩模坯料的制造方法 Pending CN108693699A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017075122A JP2018180083A (ja) 2017-04-05 2017-04-05 フォトマスクブランクの製造方法
JP2017-075122 2017-04-05

Publications (1)

Publication Number Publication Date
CN108693699A true CN108693699A (zh) 2018-10-23

Family

ID=63844756

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810284727.5A Pending CN108693699A (zh) 2017-04-05 2018-04-02 光掩模坯料的制造方法

Country Status (3)

Country Link
JP (1) JP2018180083A (ko)
KR (1) KR20180113177A (ko)
CN (1) CN108693699A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11619875B2 (en) * 2020-06-29 2023-04-04 Taiwan Semiconductor Manufacturing Co., Ltd. EUV photo masks and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03267362A (ja) * 1990-03-19 1991-11-28 Fujitsu Ltd スパッタリングによる薄膜形成方法
JPH05232683A (ja) * 1992-02-20 1993-09-10 Toppan Printing Co Ltd 位相推移フォトマスクの位相推移体の形成方法
JP2001118440A (ja) * 1999-10-18 2001-04-27 Toyota Motor Corp 透明導電膜の形成方法
JP2006071870A (ja) * 2004-09-01 2006-03-16 Hoya Corp マスクブランクの製造方法、及びマスクの製造方法
JP2006203095A (ja) * 2005-01-24 2006-08-03 Nikon Corp 光学素子の製造方法、並びに、光学素子及び投影露光装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0479218A (ja) * 1990-07-20 1992-03-12 Fujitsu Ltd 半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03267362A (ja) * 1990-03-19 1991-11-28 Fujitsu Ltd スパッタリングによる薄膜形成方法
JPH05232683A (ja) * 1992-02-20 1993-09-10 Toppan Printing Co Ltd 位相推移フォトマスクの位相推移体の形成方法
JP2001118440A (ja) * 1999-10-18 2001-04-27 Toyota Motor Corp 透明導電膜の形成方法
JP2006071870A (ja) * 2004-09-01 2006-03-16 Hoya Corp マスクブランクの製造方法、及びマスクの製造方法
JP2006203095A (ja) * 2005-01-24 2006-08-03 Nikon Corp 光学素子の製造方法、並びに、光学素子及び投影露光装置

Also Published As

Publication number Publication date
JP2018180083A (ja) 2018-11-15
KR20180113177A (ko) 2018-10-15

Similar Documents

Publication Publication Date Title
US10678126B2 (en) Semiconductor mask blanks with a compatible stop layer
CN104635415B (zh) 半色调相移光掩模坯料、半色调相移光掩模和图案曝光方法
TWI684060B (zh) 相位移光罩空白片、相位移光罩及相位移光罩空白片的製造方法
CN105452956A (zh) 掩模坯料、带有负型抗抗蚀膜的掩模坯料、相移掩模及使用其的图案形成体的制造方法
JP2007292824A (ja) フォトマスクブランク
CN108594593A (zh) 光掩模坯料及其制造方法
CN104460224B (zh) 光掩膜坯料的制造方法
CN1320601C (zh) 电子装置的制造方法
CN106997145A (zh) 半色调相移光掩模坯和制造方法
CN102656516A (zh) 光掩模坯料及光掩模的制造方法
JP2016194626A (ja) ハーフトーン位相シフト型フォトマスクブランクの製造方法
CN108693699A (zh) 光掩模坯料的制造方法
US20050048377A1 (en) Mask for improving lithography performance by using multi-transmittance photomask
JPH06308713A (ja) 位相シフトフォトマスク及び位相シフトフォトマスク用ブランクス
US11156912B2 (en) Lithography mask and method for manufacturing the same
JP2009086389A (ja) フォトマスクブランク及びフォトマスクの製造方法
US6279147B1 (en) Use of an existing product map as a background for making test masks
KR20080022893A (ko) 교류형 위상반전 블랭크 마스크 및 포토마스크와 그제조방법
JP2002268201A (ja) 位相シフトフォトマスク及び位相シフトフォトマスク用ブランクスの製造方法
US20070178409A1 (en) Exposure method of forming three-dimensional lithographic pattern
JP2015161834A (ja) フォトマスクの製造方法
CN103885284B (zh) 堆叠掩模
US20040185385A1 (en) Method for fabricating a mold
KR20030049940A (ko) 위상반전 마스크 제작방법
US6797638B2 (en) Plasma-etching process for molybdenum silicon nitride layers on half-tone phase masks based on gas mixtures containing monofluoromethane and oxygen

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20181023