CN108690945A - 具有薄而致密的柱状tbc层的热障系统及其形成方法 - Google Patents

具有薄而致密的柱状tbc层的热障系统及其形成方法 Download PDF

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CN108690945A
CN108690945A CN201810304747.4A CN201810304747A CN108690945A CN 108690945 A CN108690945 A CN 108690945A CN 201810304747 A CN201810304747 A CN 201810304747A CN 108690945 A CN108690945 A CN 108690945A
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China
Prior art keywords
tbc layer
oxide
column
close
fine
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M.D.克拉克
D.G.科尼策尔
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General Electric Co
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General Electric Co
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    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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Abstract

本发明提供了设置在基材的表面上的涂层体系。涂层体系可包括在基材的表面上的粘结涂层、在粘结涂层上的致密TBC层和在致密TBC层上的柱状TBC层，其中柱状TBC层限定多个细长表面连接的空隙。致密TBC层一般包括陶瓷材料并且具有约15％或更小的孔隙度。本发明还提供了用于在基材的表面上形成涂层体系的方法。

Description

具有薄而致密的柱状TBC层的热障系统及其形成方法
技术领域
本公开内容一般涉及采用热致密TBC层的制品。更具体而言，本公开内容涉及采用涂层的制品，所述涂层能够抵抗由于与粉尘材料的高温相互作用的降解。
背景技术
热障涂层通常用于在高温下操作或暴露于高温的制品。例如，航空涡轮机和陆基涡轮机可包括由热障涂层保护的一个或多个部件。在正常的操作条件下，涂层部件可能易受各种类型损害的影响，所述损害包括侵蚀、氧化和来自环境污染物的攻击。
对于涡轮机部件，特别关注的环境污染物组合物是含有钙、镁、铝、硅的氧化物及其混合物的那些；例如，由燃气涡轮发动机吸入的灰尘、灰和粉尘通常由这样的化合物构成。这些氧化物经常结合以形成包含混合的钙-镁-铝-硅-氧化物体系(Ca-Mg-A1-Si-O)的污染物组合物，以下称为“CMAS”。在高涡轮机操作温度下，这些环境污染物可粘附至热的热障涂层表面，并且因此引起对热障涂层的损害。例如，CMAS可形成在涡轮机的操作温度下为液体或熔融的组合物。熔融的CMAS组合物可溶解热障涂层，或者可通过渗透涂层中的孔、通道、裂缝或其他空腔来填充其多孔结构。冷却后，渗透的CMAS组合物固化并降低涂层应变耐受性，因此引发且传播可引起涂层材料分层和剥落的裂缝。这还可导致对零件或部件的下层金属基材提供的热保护的部分或完全丧失。此外，热障涂层的剥落可在金属基材中产生热点，导致过早的部件失效。过早的部件失效可导致计划外维护和零件更换，导致降低的性能以及增加的操作和维护成本。
因此，需要改进的涂层体系，当在高温下操作或暴露于高温时，所述涂层体系对热障涂层提供免于环境污染物的不利效应的保护。具体地，需要改进的涂层体系和制备这种涂层的方法，所述涂层提供免于沉积CMAS的不利效应的保护。
发明内容
本发明的各方面和优势将部分地在以下描述中阐述，或可从所述描述显而易见，或可通过本发明的实践而得知。
一般提供了设置在基材的表面上的涂层体系。在一个实施例中，涂层体系包括在基材的表面上的粘结涂层、在粘结涂层上的致密TBC层和在致密TBC层上的柱状TBC层，其中所述柱状TBC层限定多个细长表面连接的空隙。致密TBC层一般包括陶瓷材料并且具有约15％或更小的孔隙度。
可选地，所述陶瓷材料包含氧化铪、氧化锆或其混合物。可选地，所述陶瓷材料包含稳定的氧化铪、稳定的氧化锆或其混合物。可选地，其中所述陶瓷材料包含氧化钇稳定的氧化锆、氧化铈稳定的氧化锆、氧化钙稳定的氧化锆、氧化钪稳定的氧化锆、氧化镁稳定的氧化锆、氧化铟稳定的氧化锆、氧化镱稳定的氧化锆、氧化镧稳定的氧化锆、氧化钆稳定的氧化锆或其混合物。可选地，柱状TBC层具有约25微米至约2000微米的厚度。所述致密TBC层具有的厚度约为所述柱状TBC层的厚度的一半或更小。所述致密TBC层具有的厚度为所述柱状TBC层的厚度的约1/4至约1/8。可选地，其中所述致密TBC层具有约0.1％至约10％的孔隙度。可选地，所述涂层体系还包括在所述粘结涂层上的热生长的氧化物，其中所述热生长的氧化物位于所述粘结涂层和所述致密TBC层之间。可选地，所述涂层体系还包括：位于所述致密TBC层和所述柱状TBC层之间的中间致密层。可选地，所述中间致密层是含钆中间致密层。可选地，中间致密层具有约15％或更小的孔隙度。可选地，中间致密层具有的厚度约为所述柱状TBC层的厚度的一半或更小。可选地，中间致密层具有的厚度为所述柱状TBC层的厚度的约1/4至约1/8。可选地，中间致密层具有约0.1％至约10％的孔隙度。可选地，所述涂层体系还包括：在所述柱状TBC层上的外部致密TBC层；和在所述外部致密TBC层上的外部柱状TBC层。
一般还提供了用于在基材的表面上形成涂层体系的方法。在一个实施例中，该方法包括在上覆基材的粘结涂层上形成(例如，陶瓷材料的)致密TBC层至约15％或更小的孔隙度，然后在致密TBC层上施加柱状TBC层，使得柱状TBC层限定多个细长表面连接的空隙。
可选地，上述方法中形成所述致密TBC层包括：将所述陶瓷材料施加到所述粘结涂层上，以具有初始孔隙度；和回填施加在所述粘结涂层上的陶瓷材料以增加密度，以形成所述致密TBC层。可选地，所述方法还包括：在形成所述柱状TBC层之前在所述致密TBC层上形成中间致密层。其中所述中间致密层是含钆中间致密层。
参考以下描述和所附权利要求书，本发明的这些和其它特征、方面及优点将变得更好理解。并入于本说明书中且构成本说明书的一部分的附图说明本发明的实施例，且连同所述描述一起用于解释本发明的原理。
附图说明
针对所属领域的技术人员，本发明的完整且启发性公开内容，包括其最佳模式，在参考附图的说明书中被阐述，在所述附图中：
图1是示出了本发明的一个实施例的示意性横截面；
图2是示出了本发明的另一个实施例的示意性横截面；和
图3是示出了本发明的又一个实施例的示意性横截面。
在本说明书和附图中参考标号的重复使用意图表示本发明的相同或相似特征或元件。
具体实施方式
现将详细参考本发明的实施例，在图中说明本发明的实施例的一个或多个实例。每个实例是为了解释本发明而非限制本发明而提供。实际上，所属领域的技术人员将清楚，在不脱离本发明的范围或精神的情况下可在本发明中进行各种修改和变化。举例来说，说明或描述为一个实施例的部分的特征可与另一实施例一起使用以产生又一实施例。因此，希望本发明涵盖此类属于所附权利要求书和其等效物的范围内的修改和变化。
如本文中所使用，术语“第一”、“第二”和“第三”可互换使用以区分一个部件与另一部件，且并不在于表示个别部件的位置或重要性。
术语“上游”和“下游”是指相对于流体路径中的流体流的相对方向。举例来说，“上游”是指流体流出的方向，而“下游”是指流体流向的方向。
如本文使用的，术语“涂层”指以连续或不连续方式设置在下表面的至少一部分上的材料。此外，术语“涂层”不一定意指所设置材料的均匀厚度，并且所设置材料可具有均匀或可变的厚度。术语“涂层”可指涂层材料的单层或可指多层涂层材料。涂层材料在多个层中可相同或不同。
在本发明中，当层描述为在另一层或基材“上”或“上面”时，应理解，除非明确说明相反情况，否则所述层可彼此直接接触或在所述层之间具有另一层或特征。因此，这些术语仅描述所述层彼此的相对位置，而不必意味着“顶部上”，这是因为上方或下方的相对位置取决于装置对观察者的取向。
在本发明中使用例如通常在元素周期表上发现的常见化学名称缩写来论述化学元素。举例来说，氢由其常见化学名称缩写H表示；氦由其常见化学名称缩写He表示；等等。
一般提供涂层体系以保护下面的材料(例如下面的涂层和/或表面)免于不希望有的化学和/或热相互作用。涂层体系一般包括粘结涂层和柱状热障涂层(“柱状TBC层”)之间的致密热障涂层(“致密TBC层”)。致密TBC层意欲保护下面的粘结涂层，且特别是在粘结涂层上的任何热生长的氧化物免于CMAS攻击、反应性粒子攻击或反应层攻击。致密TBC层在包括柱状TBC层的涂层体系内特别有用，所述柱状TBC层限定多个细长表面连接的空隙，例如允许环境污染物进入涂层内部的裂缝和孔隙，这提供了用于CMAS攻击、反应性粒子攻击或反应层攻击的路径。另外或可替代地，即使在冲击事件(例如摩擦事件)释放柱状TBC之后，致密TBC层可继续提供热保护和/或免于CMAS攻击的保护。
参考图1，一般显示了制品100，所述制品100包括设置在基材120的表面115上的涂层体系102。涂层体系102一般包括在基材120的表面115上的粘结涂层140、在粘结涂层140上的致密TBC层145以及在致密TBC层145上的柱状TBC层110。柱状TBC层110一般限定多个细长表面连接的空隙130。在图1的实施例中，柱状TBC层110限定了涂层体系102的外表面132。下文更详细地讨论这些层中的每一个。
如图1所示，粘结涂层140设置在涂层110和基材120之间。粘结涂层140提供与常规应用中一般提供的涂层类似的功能性(例如粘附促进和抗氧化性)。在一些实施例中，粘结涂层140包含铝化物，例如铝化镍、铝化铂或本领域众所周知的MCrAlY型涂层。这些粘结涂层在应用于金属基材120(例如超合金)时可能是尤其有用的。这些涂层140可使用本领域已知的各种涂布技术中的任一种来施加，所述涂布技术例如等离子喷涂、热喷涂、化学气相沉积、离子等离子沉积、气相铝化物或物理气相沉积。
粘结涂层140可具有约2.5μm至约400μm的厚度，并且可作为添加剂层施加于基材120或可扩散至基材中，产生被改造为具有性质上的梯度的不均匀组合物。然而，注意到涂层体系102内的所有涂层可取决于在零件上的位置而改变厚度。
在粘结涂层140上显示了热生长的氧化物层142。一般地，热生长的氧化物层142包括粘结涂层140的材料的氧化物。例如，当粘结涂层140在其构造中包括铝时，热生长的氧化物(TGO)层142可包括氧化铝(例如Al2O、AlO、Al2O3等或其混合物)。
在某些实施例中，热生长的氧化物层142一般具有高达约20μm(例如，约.01μm至约6μm)的厚度，并且可为在后续层的加工期间热暴露的天然产物，或可通过热处理部件而设计得更厚。取决于下面的粘结涂层140、加工方法和暴露条件，TGO层可能不均匀。
致密TBC层145一般具有约15％或更小(例如约0.1％至约15％)，例如约10％或更小(例如约0.1％至约10％)的孔隙度。在某些实施例中，致密TBC层145一般具有约5％或更少(例如约0.1％至约5％)，例如约1％至约5％的孔隙度。
在特定实施例中，致密TBC层145具有穿过其厚度的孔隙度梯度。即，致密TBC层145的孔隙度在粘结涂层140处可不同于在柱状TBC层110处。例如，致密TBC层145可具有接近粘结涂层140较少的孔隙度(即，更致密)，随着它从基材穿过其厚度移动到上覆柱状TBC层110而变得较不致密。这样的梯度可对接近粘结涂层140的CMAS提供更多的保护。然而，根据需要，其他密度梯度也可用于致密TBC层145中。
类似地，致密TBC层145可具有穿过其厚度的组成梯度。即，致密TBC层145的组成在粘结涂层140处可不同于在柱状TBC层110处。例如，致密TBC层145可具有接近粘结涂层140的第一组成，随着它从基材穿过其厚度移动到上覆柱状TBC层110，所述第一组成改变。这种组成梯度可用于对CMAS提供保护，例如通过在厚度的外部部分处(接近柱状TBC层110)具有CMAS反应性材料，而接近粘结涂层140具有更稳定的非反应性材料，以便不与粘结涂层140和/或TGO层142反应。然而，其他组成梯度也可根据需要用于致密TBC层145中。
在特定实施例中，致密TBC层145的结构使污染物通过任何垂直裂缝或连通孔隙度的进入最小化，使得涂层体系102充当渗透通过更多孔的柱状TBC层110的屏障。在一个实施例中，如上文讨论的，屏障层145用这样的工艺制造，所述工艺产生等轴孔以具有小于15％的孔隙度，以便降低连通孔隙度。例如，致密TBC层可具有约1g/cm3至约5g/cm3的密度。加工溶液的粘度可决定致密TBC层的密度/孔隙度要求。
致密TBC层145的厚度可取决于其上沉积的基材120和/或由制品100形成的部件的类型。在特定实施例中，致密TBC层145的厚度可取决于上覆柱状TBC层110的厚度，但通常小于涂层体系102的总厚度的一半。在一些实施例中，柱状TBC层110比致密TBC层145厚约4倍至约8倍(即，致密TBC层145具有的厚度为柱状TBC层110的厚度的约1/4至约1/8)，以对其上的特定柱状TBC层110提供足够的阻挡。例如，对于具有约25微米至约2000微米厚度的柱状TBC层110，致密TBC层145可具有约4微米至约335微米的厚度。
致密TBC层145可使用本领域已知的各种涂布技术中的任一种来施加，以实现所需孔隙度，所述涂布技术例如等离子喷涂、热喷涂、化学气相沉积或物理气相沉积。在一个实施例中，致密TBC层145通过两步沉积工艺形成，所述工艺回填第一沉积工艺的初始孔隙度，以便增加所得到的TBC层145的密度(即，通过用另外的材料填充孔来降低初始孔隙度)。例如，TBC层145可通过浆料沉积和熔体渗透来形成。
致密TBC层145一般包括陶瓷热障材料或陶瓷热障材料的组合。即，可将两种或更多种陶瓷热障材料共喷涂到基材102上，以形成致密TBC层145。所选择的致密TBC层145的组成可取决于一种或多种因素，包括相邻粘结涂层140的组成、致密TBC层145所需的热膨胀系数(CTE)特性、以及致密TBC层145所需的热障性质。
例如，用于致密TBC层145的材料包括各种类型的氧化物，例如氧化铪(hafniumoxide)(“氧化铪(hafnia)”)或氧化锆(zirconium oxide)(“氧化锆(zirconia)”)，特别是稳定的氧化铪或稳定的氧化锆，以及包括这些之一或两者的共混物。稳定的氧化锆的例子包括但不限于氧化钇稳定的氧化锆、氧化铈稳定的氧化锆、氧化钙稳定的氧化锆、氧化钪稳定的氧化锆、氧化镁稳定的氧化锆、氧化铟稳定的氧化锆、氧化镱稳定的氧化锆、氧化镧稳定的氧化锆、氧化钆稳定的氧化锆、以及这种稳定氧化锆的混合物。类似的稳定的氧化铪组合物是本领域已知的，并且适用于本文所述的实施例。
在某些实施例中，致密TBC层145包括氧化钇稳定的氧化锆。合适的氧化钇稳定的氧化锆可包括约1重量百分比至约20重量百分比的氧化钇(基于氧化钇和氧化锆的组合重量)，并且更通常包括约3重量百分比至约10重量百分比的氧化钇。示例性氧化钇稳定的氧化锆柱状TBC层包括约7％的氧化钇和约93％的氧化锆。这些类型的氧化锆还可包括一种或多种第二金属(例如镧系元素或锕系元素)氧化物，例如氧化镝、氧化饵、氧化铕、氧化钆、氧化钕、氧化镨、氧化铀和氧化铪，以进一步降低致密TBC层145材料的导热性。在一些实施例中，致密TBC层145材料还可包括另外的金属氧化物，例如氧化钛。
合适的陶瓷致密TBC层145材料还可包括通式A2B2O7的烧绿石，其中A是具有3+或2+效价的金属(例如钆、铝、铈、镧或钇)，并且B是具有4+或5+效价的金属(例如铪、钛、铈或锆)，其中A和B效价的总和为7。这种类型的代表性材料包括锆酸钆、钛酸镧、锆酸镧、锆酸钇、铪酸镧、铪酸铈和铈酸镧。
致密TBC层145可包括高达100重量百分比的量的陶瓷柱状TBC层材料。在一些实施例中，致密TBC层145包括在约95重量百分比至约100重量百分比，且更特别是约98重量百分比至约100重量百分比范围内的陶瓷柱状TBC层材料。
再次参考图1，柱状TBC层110设置在粘结涂层110和基材120之上的致密TBC层145上。柱状TBC层110包括表面连接的空隙130，例如允许柱状TBC层110的热膨胀和收缩的裂缝和孔隙度，以保护涂层体系102不受极端的热变化。然而，如上文讨论的，柱状TBC层130的表面连接的空隙130还允许环境污染物进入涂层110的内部，可能到达下面的致密TBC层145。通常，空隙130延伸穿过柱状TBC层130的厚度。即，空隙130具有高于1的纵横比，并且通常被定向成使得进入空隙130的污染物可被导入涂层110的横截面厚度内。在一些实施例中，空隙130包括晶粒或其他微结构特征的基本上垂直取向的(从如图1中的横截面视图的视角)裂缝和/或边界。这些空隙130可能由于用于沉积涂层110的沉积工艺的固有特性而存在；由于在操作期间的正常磨损和撕裂，在沉积之后也可形成一些空隙130。
柱状TBC层110可通过适合于给定应用的任何技术来施加。例如通过空气等离子喷涂技术沉积的涂层可在涂层的至少表面上导致具有开孔的海绵状多孔结构。在某些沉积条件下，通过等离子喷涂柱状TBC层材料也形成扩展良好、垂直取向的(相对于基材/涂层界面的平面)裂缝。类似地，通过物理或化学气相沉积技术沉积的柱状TBC层可导致在涂层的至少表面包括一系列柱状凹槽、裂隙或通道的结构。多孔结构，尤其是(尽管非唯一地)掺入如上所述的垂直取向和/或柱状特征的结构可为在热循环期间提供柱状TBC层的应力耐受性的因素之一。此外，由于涂层的热膨胀系数(CTE)和下面的粘结涂层/基材的CTE之间的差异，多孔结构可提供应力减小。
柱状TBC层110一般包括陶瓷热障材料，其可独立地选自致密TBC层145的陶瓷材料。即，在某些实施例中，致密TBC层145和柱状TBC层110的陶瓷材料就化学组成而言基本上相同。然而，在其他实施例中，致密TBC层145和柱状TBC层110的陶瓷材料在化学组成方面不同。合适的陶瓷柱状TBC层110材料包括各种类型的氧化物，例如氧化铪(hafnium oxide)(“氧化铪(hafnia)”)或氧化锆(zirconium oxide)(“氧化锆(zirconia)”)，特别是稳定的氧化铪或稳定的氧化锆，以及包括这些之一或两者的共混物。稳定的氧化锆的例子包括但不限于氧化钇稳定的氧化锆、氧化铈稳定的氧化锆、氧化钙稳定的氧化锆、氧化钪稳定的氧化锆、氧化镁稳定的氧化锆、氧化铟稳定的氧化锆、氧化镱稳定的氧化锆、氧化镧稳定的氧化锆、氧化钆稳定的氧化锆、以及这种稳定氧化锆的混合物。类似的稳定的氧化铪组合物是本领域已知的，并且适用于本文所述的实施例。
在某些实施例中，柱状TBC层110包括氧化钇稳定的氧化锆。合适的氧化钇稳定的氧化锆可包括约1重量百分比至约20重量百分比的氧化钇(基于氧化钇和氧化锆的组合重量)，并且更通常包括约3重量百分比至约10重量百分比的氧化钇。示例性氧化钇稳定的氧化锆柱状TBC层包括约7％的氧化钇和约93％的氧化锆。这些类型的氧化锆还可包括一种或多种第二金属(例如镧系元素或锕系元素)氧化物，例如氧化镝、氧化饵、氧化铕、氧化钆、氧化钕、氧化镨、氧化铀和氧化铪，以进一步降低柱状TBC层材料的导热性。在一些实施例中，柱状TBC层材料还可包括另外的金属氧化物，例如氧化钛。
合适的陶瓷柱状TBC层材料还可包括通式A2B2O7的烧绿石，其中A是具有3+或2+效价的金属(例如钆、铝、铈、镧或钇)，并且B是具有4+或5+效价的金属(例如铪、钛、铈或锆)，其中A和B效价的总和为7。这种类型的代表性材料包括锆酸钆、钛酸镧、锆酸镧、锆酸钇、铪酸镧、铪酸铈和铈酸镧。
柱状TBC层110可包括高达100重量百分比的量的陶瓷柱状TBC层材料。在一些实施例中，柱状TBC层110包括在约95重量百分比至约100重量百分比，且更特别是约98重量百分比至约100重量百分比范围内的陶瓷柱状TBC层材料。所选择的涂层110的组成可取决于一种或多种因素，包括任选的邻近致密TBC层145的组成、涂层110所需的热膨胀系数(CTE)特性、以及涂层110所需的热障性质。
柱状TBC层110的厚度可取决于它设置在其上的基材或部件。在一些实施例中，柱状TBC层110具有的厚度大于致密TBC层145的厚度。例如，柱状TBC层110可具有在约25微米至约2000微米的范围内的厚度。在一些实施例中，涂层110具有在约25微米至约1500微米范围内的厚度。在一些实施例中，厚度在约25微米至约1000微米的范围内。
在某些实施例中，多个致密TBC层和多个柱状TBC层可存在于涂层体系102内。在这样的实施例中，涂层体系可允许对下面的基材102的另外CMAS保护。另外，在对外部涂层的损害的情况下(例如，在摩擦事件之后)，具有多个层的涂层体系可保护下面的层。例如，涂层体系102可包括以交替布置的至少两个致密TBC层和两个柱状TBC层。参考图2，涂层体系102类似于图2的涂层体系，其中添加了外部致密TBC层150和外部柱状TBC层152，其限定了涂层体系102的外表面154。
在再进一步的实施例中，例如图3所示，中间致密层160可存在于致密TBC层145和柱状TBC层110之间。中间致密层160具有约15％或更小(例如约0.1％至约15％)，例如约10％或更小(例如约0.1％至约10％)的孔隙度。在某些实施例中，致密TBC层145一般具有约5％或更少(例如约0.1％至约5％)，例如约1％至约5％的孔隙度。
中间致密层160一般包括陶瓷热障材料，所述陶瓷热障材料可独立地选自致密TBC层145和/或柱状TBC层110的陶瓷材料。即，在某些实施例中，中间致密层160、致密TBC层145和/或柱状TBC层110的陶瓷材料在化学组成方面基本上相同。然而，在其他实施例中，中间致密层160的陶瓷材料在化学组成方面与致密TBC层145和柱状TBC层110中的任一者或两者不同。
在一个特定实施例中，中间致密层160包括例如以氧化钆稳定的氧化锆(例如锆酸钆)，A2B2O7形式的钆，其中A是具有3+或2+效价的钆，B是具有4+或5+效价的金属(例如铪、钛、铈或锆)，其中A和B效价的总和为7。这种含钆的中间致密层160对于涂层体系102提供良好的CMAS保护，但与下面的粘结涂层140反应。因此，致密TBC层145保护粘结涂层140免受在中间致密层160中包括的钆影响。
中间致密层160的厚度可取决于在其上沉积的基材120和/或由制品100形成的部件的类型。在特定实施例中，中间致密层160的厚度可取决于上覆柱状TBC层110的厚度，但通常小于涂层体系102的总厚度的一半。在一些实施例中，柱状TBC层110比中间致密层160厚约4倍至约8倍(即，中间致密层160具有的厚度为柱状TBC层110的厚度的约1/4至约1/8)，以对其上的特定柱状TBC层110提供足够的阻挡。例如，对于具有约25微米至约2000微米厚度的柱状TBC层110，中间致密层160可具有约4微米至约335微米的厚度。
中间致密层160可使用本领域已知的各种涂布技术中的任一种来施加，以实现所需孔隙度，所述涂布技术例如等离子喷涂、热喷涂、化学气相沉积或物理气相沉积。在一个实施例中，中间致密层160通过两步沉积工艺形成，所述工艺回填第一沉积工艺的初始孔隙度，以便增加所得到的中间致密层160密度(即，通过用另外的材料填充孔来降低初始孔隙度)。
一般还提供了用于在基材的表面上形成涂层体系以制造制品例如上述制品100的方法。如先前所述，可通过几种不同的涂布技术中的任一种在粘结涂层上形成致密TBC层142，所述技术例如等离子喷涂技术(例如使用干燥或液体原料材料的空气等离子喷涂)、化学蒸汽沉积、物理气相沉积(例如电子束物理气相沉积或蒸发)、浆料沉积、溶胶-凝胶技术和其他涂布方法。同样如上文讨论的，这样的致密TBC层142可通过下述形成：首先将陶瓷材料施加到粘结涂层上以具有初始孔隙度，然后回填在粘结涂层上施加的陶瓷材料以增加密度，以形成致密TBC层。在某些实施例中，如上所述，该方法还可包括在形成柱状TBC层之前，在致密TBC层上形成中间致密层，例如含钆中间致密层。
涂层体系102一般设置在基材120的表面115上，以形成制品100。在特定实施例中，制品100可为遭受在高温环境下的服务的任何部件，例如燃气涡轮机组件的部件(例如，在a内)。这样的部件的例子包括但不限于包括涡轮翼片例如叶片和刀片的部件，以及燃烧部件例如衬垫和过渡片。那么，基材120可为适用于这种应用的任何材料；例如，例子包括镍基高温合金、钴基高温合金和陶瓷基质复合材料。
此书面描述使用实例来公开本发明，包括最佳模式，并且还使所属领域的技术人员能够实践本发明，包括制造和使用任何装置或系统以及执行任何所并入的方法。本发明的可获专利的范围由权利要求书界定，且可包括所属领域的技术人员所想到的其它实例。如果此类其它实例包括并非不同于权利要求书的字面语言的结构要素，或如果它们包括与权利要求书的字面语言无实质差异的等效结构要素，那么它们既定在权利要求范围内。

Claims (10)

1.一种设置在基材的表面上的涂层体系，所述涂层体系包括：
在所述基材的表面上的粘结涂层；
在所述粘结涂层上的致密TBC层，其中所述致密TBC层包含陶瓷材料，并且其中所述致密TBC层具有约15％或更小的孔隙度；和
在所述致密TBC层上的柱状TBC层，其中所述柱状TBC层限定多个细长表面连接的空隙。
2.根据权利要求1所述的涂层体系，其中所述陶瓷材料包含氧化铪、氧化锆或其混合物。
3.根据权利要求1所述的涂层体系，其中所述陶瓷材料包含稳定的氧化铪、稳定的氧化锆或其混合物。
4.根据权利要求1所述的涂层体系，其中所述陶瓷材料包含氧化钇稳定的氧化锆、氧化铈稳定的氧化锆、氧化钙稳定的氧化锆、氧化钪稳定的氧化锆、氧化镁稳定的氧化锆、氧化铟稳定的氧化锆、氧化镱稳定的氧化锆、氧化镧稳定的氧化锆、氧化钆稳定的氧化锆或其混合物。
5.根据权利要求1所述的涂层体系，其中所述柱状TBC层具有约25微米至约2000微米的厚度。
6.根据权利要求5所述的涂层体系，其中所述致密TBC层具有的厚度约为所述柱状TBC层的厚度的一半或更小。
7.根据权利要求5所述的涂层体系，其中所述致密TBC层具有的厚度为所述柱状TBC层的厚度的约1/4至约1/8。
8.根据权利要求1所述的涂层体系，其中所述致密TBC层具有约0.1％至约10％的孔隙度。
9.根据权利要求1所述的涂层体系，所述涂层体系还包括：
在所述粘结涂层上的热生长的氧化物，其中所述热生长的氧化物位于所述粘结涂层和所述致密TBC层之间。
10.一种在基材的表面上形成涂层体系的方法，所述方法包括：
在上覆基材的粘结涂层上形成致密TBC层，其中所述致密TBC层包含陶瓷材料，并且其中所述致密TBC层形成为约15％或更小的孔隙度；和
在所述致密TBC层上施加柱状TBC层，使得所述柱状TBC层限定多个细长表面连接的空隙。
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