CN108668468A - The processing method and multilayer daughter board in circuit board one-side electroplating hole - Google Patents
The processing method and multilayer daughter board in circuit board one-side electroplating hole Download PDFInfo
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- CN108668468A CN108668468A CN201710207310.4A CN201710207310A CN108668468A CN 108668468 A CN108668468 A CN 108668468A CN 201710207310 A CN201710207310 A CN 201710207310A CN 108668468 A CN108668468 A CN 108668468A
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- daughter board
- hole
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- multilayer daughter
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
The present invention proposes the processing method and multilayer daughter board in a kind of circuit board one-side electroplating hole, and the processing method in circuit board one-side electroplating hole includes：Multilayer daughter board is carried out to machine drilling, PTH electroless copper platings, plating preplating successively；Outer graphics transfer processing is carried out to multilayer daughter board；One-side electroplating plated hole is carried out to multilayer daughter board, the present invention can efficiently control face copper thickness and uniformity by one-side electroplating plated hole, cancel the technological process for subtracting copper after pressing, the quality assurance for making accurate fine rule road product is provided, production efficiency is improved, cost is reduced, promotes rate best in quality.
Description
Technical field
The present invention relates to circuit board technology fields, in particular to a kind of processing method in circuit board one-side electroplating hole
And multilayer daughter board.
Background technology
With the fast development of electronic technology, electronic product becomes smaller and smaller, and function becomes increasingly complex, to electronics member device
Part plays support and the printed circuit board of interconnection develops high multilayer, develops to high precision and high reliability direction, volume is not
Disconnected to reduce, density is exponentially increased.When common high laminate high density of integration product can no longer meet more high-density line in the future
When being required with high-level product limitation, there is the deisgn product that another special N+N folds structure.N+N folds the electricity of structure design
Road plate and a kind of blind hole plate series of products, refer to multiple core plates and PP pressing made of 2 multilayer daughter boards, daughter board need by
Drilling, plating, the processes such as figure, then high-level blind hole plate is formed by the way that two daughter boards are carried out pressing, this similar designs
Product solves current high-level highly integrated control problem, effectively increases the transmission quality of wiring density and signal.
It is electroplated twice since the product daughter board needs of this designs of N+N are done, the thickness and uniformity of PCB surface copper can be influenced,
Working ability and quality requirements are then cannot be satisfied in the product for manufacturing accurate fine rule road and special process, are based on this problem,
Industry uses the technology of plated hole mode at present, subtracts Copper treatment by being laminated to do after conjunction outside after being electroplated one is daughter board whole plate, Fig. 1
In show the daughter board outer layer and inner layer surface whole plate plated hole schematic diagram of whole plate plated hole technique, another is by dry film cover plate
Face, the process of two sides plated hole show the daughter board outer layer of independent plated hole technique and the independent plated hole signal of inner layer surface in Fig. 2
Figure.The production technology of this type product is had the following defects：
1. must increase after pressing after daughter board whole plate electro-coppering and subtract copper flow, filling perforation is discontented with or consent is not full
Hole liquid medicine when subtracting copper can sting borrosion hole copper, while subtracting copper can cause face copper to reveal base material problem；
2. after whole plate copper facing of daughter board, then outer layer electro-coppering is arrived, by the face copper copper thickness that is electroplated twice and uniformly
Property R values it is larger, influence rear process accurate fine rule road make；
3. electro-coppering plated hole technique in two sides is to cover copper face by dry film, only exposes via hole and carries out that a kind of technique is electroplated,
The defective workmanship：
(1) plated hole technique in two sides must assure that the internal layer of daughter board is electroplated onto the copper thickness for meeting client, lead to outer-layer circuit copper
It is thick partially thick；
(2) small by plating area due to hole, it is difficult to control the output size of electric current, causes hole burning or hole copper insufficient；
(3) windowing of traditional plating hole pattern is unreasonable, and aperture, which will produce convex or aperture turning, does not have copper-clad to lead to hole wall
The problem of reliability detaches.
Invention content
The present invention is directed to solve at least one of the technical problems existing in the prior art or related technologies.
For this purpose, an object of the present invention is to provide a kind of processing methods in circuit board one-side electroplating hole.
It is another object of the present invention to propose a kind of multilayer daughter board.
In view of this, a purpose according to the present invention, it is proposed that a kind of processing method in circuit board one-side electroplating hole, packet
It includes：Multilayer daughter board is carried out to machine drilling, PTH electroless copper platings, plating preplating successively；Outer graphics transfer is carried out to multilayer daughter board
Processing；One-side electroplating plated hole is carried out to multilayer daughter board.
The processing method in circuit board one-side electroplating provided by the invention hole, to carrying out PTHization after multilayer daughter board machine drilling
Copper is learned, plate face and the heavy last layer Metal Palladium of hole wall carry out outer layer figure using one layer of thin layers of copper of plate electricity preplating to multilayer daughter board
Shape transfer processing, then one-side electroplating plated hole is carried out to multilayer daughter board, it is thick to efficiently control face copper by one-side electroplating plated hole
Degree and uniformity cancel the technological process for subtracting copper after pressing, and provide the quality assurance for making accurate fine rule road product, improve life
Efficiency is produced, cost is reduced, promotes rate best in quality.
The processing method in foregoing circuit plate one-side electroplating hole according to the present invention can also have following technical characteristic：
In the above-mentioned technical solutions, it is preferable that the outer graphics transfer processing is carried out to multilayer daughter board, is specifically included：
In the upper dry film of outer layer covering of multilayer daughter board；And windowing processing is carried out to the via hole of the outer layer of multilayer daughter board, via hole
It opens a window unilateral than the unilateral big 2mil that drills.Preferably, further include：The internal layer of multilayer daughter board is subjected to whole plate windowing, exposes multilayer
The copper face of the internal layer of daughter board.
In the technical scheme, dry film protection is carried out in the outer layer of multilayer daughter board, to the via hole of the outer layer of multilayer daughter board
Windowing processing is carried out, the windowing of via hole is unilateral to be formed copper-clad shape, increases the binding force of hole wall than the unilateral big 2mil that drills,
Ensure product high reliability, while aligning accuracy is controlled in the windowing of corresponding aperture, aperture generates convex or inclined after solving plated hole
There is the problem of aperture turning reliability separation in position.
In any of the above-described technical solution, it is preferable that carry out the one-side electroplating plated hole to multilayer daughter board, specifically include：
Multilayer daughter board is clipped in anode；The inner layer surface of multilayer daughter board is subjected to hanging plate in the same direction, keeps the inner layer surface of multilayer daughter board defeated
Go out electric current, makes the outer layer surface of multilayer daughter board not output current.
In the technical scheme, multilayer daughter board is clipped in anode, the inner layer surface of multilayer daughter board is hung in the same direction
Plate makes the inner layer surface output current of multilayer daughter board, makes the outer layer surface of multilayer daughter board not output current, is used when by the way that plated hole is electroplated
Unified hanging plate mode in one direction, daughter board inner layer surface single side output current, the processing method of outer layer surface not output current, effectively
Occur burning plate and hole burning problems when controlling plated hole, ensures the uniformity of copper thickness, process makes the product of high-accuracy circuit after realization
Quality, hole burning and it is poorly controlled to burn plate is 0%.
In any of the above-described technical solution, it is preferable that multilayer daughter board is carried out to machine drilling, PTH electroless copper platings, electricity successively
Before plating preplating, further include：Pattern transfer processing is carried out to the internal layer of multilayer daughter board, and daughter board pressure is carried out to multilayer daughter board
It closes.
In the technical scheme, multilayer daughter board is carried out successively going back before machine drilling, PTH electroless copper platings, plating preplating
Including：Pattern transfer processing is carried out to the internal layer of multilayer daughter board, and daughter board pressing is carried out to multilayer daughter board, and then is carried out follow-up
One-side electroplating plated hole, production efficiency, cost-effective can be effectively improved.
In any of the above-described technical solution, it is preferable that plating preplating is that multilayer daughter board is plated thin copper, and the copper thickness of thin copper is 5 μ
M to 10 μm.
In the technical scheme, plating preplating is that multilayer daughter board is plated thin copper, and the copper thickness of thin copper is 5 μm to 10 μm, intermediate value
By 7 μm of management and control.
Another purpose according to the present invention, it is proposed that a kind of multilayer daughter board, including：Utilize such as any of the above-described circuit board
The multilayer daughter board that the processing method in one-side electroplating hole makes.
The processing method in the circuit board one-side electroplating hole of multilayer daughter board provided by the invention through the invention makes, multilayer
PTH chemical coppers, plate face and the heavy last layer Metal Palladium of hole wall are carried out after plate machine drilling, using one layer of thin copper of plate electricity preplating
Layer, multilayer daughter board carries out outer graphics transfer processing, then carries out one-side electroplating plated hole, can be effectively by one-side electroplating plated hole
Control plane copper thickness and uniformity cancel the technological process for subtracting copper after pressing, and provide the quality guarantor for making accurate fine rule road product
Barrier, improves multilayer daughter board production efficiency, reduces cost, promote rate best in quality.
The additional aspect and advantage of the present invention will become apparent in following description section, or practice through the invention
Recognize.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination following accompanying drawings to embodiment
Obviously and it is readily appreciated that, wherein：
The daughter board outer layer and inner layer surface whole plate plated hole schematic diagram of whole plate plated hole technique are shown in Fig. 1；
The daughter board outer layer and the independent plated hole schematic diagram of inner layer surface of independent plated hole technique are shown in Fig. 2；
Fig. 3 shows the flow diagram of the processing method in the circuit board one-side electroplating hole of one embodiment of the present of invention；
Fig. 4 shows daughter board L1 to the L8 plywood schematic diagrames of the specific embodiment of the present invention；
Fig. 5 shows daughter board L9 to the L16 plywood schematic diagrames of the specific embodiment of the present invention；
Fig. 6 a show the schematic diagram of the daughter board drilling and plating preplating cross section of the specific embodiment of the present invention；
Fig. 6 b show the schematic diagram of the daughter board drilling and plating preplating plane of the specific embodiment of the present invention；
Fig. 7 a show the schematic diagram in the daughter board pattern transfer cross section of the specific embodiment of the present invention；
Fig. 7 b show the schematic diagram of the daughter board outer graphics transfer plane of the specific embodiment of the present invention；
Fig. 8 a show the present invention a specific embodiment daughter board single side windowing after cross-sectional；
Fig. 8 b show the present invention a specific embodiment daughter board single side windowing after schematic top plan view；
Fig. 8 c show the cross-sectional after the daughter board single side plated hole of the specific embodiment of the present invention；
Fig. 9 a show the schematic diagram of the daughter board inner layer surface plating plated hole hanging plate mode of the specific embodiment of the present invention；
Fig. 9 b show the schematic diagram of the daughter board outer layer surface plating plated hole hanging plate mode of the specific embodiment of the present invention；
Figure 10 shows the lamination schematic diagram of the motherboard of the specific embodiment of the present invention.
Specific implementation mode
To better understand the objects, features and advantages of the present invention, below in conjunction with the accompanying drawings and specific real
Mode is applied the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also
To be implemented different from other modes described here using other, therefore, protection scope of the present invention is not limited to following public affairs
The limitation for the specific embodiment opened.
The embodiment of first aspect present invention, the processing method for proposing a kind of circuit board one-side electroplating hole, Fig. 3 show this
The flow diagram of the processing method in the circuit board one-side electroplating hole of one embodiment of invention.Wherein, which includes：
Step 304, multilayer daughter board is carried out to machine drilling, PTH electroless copper platings, plating preplating successively；
Step 306, outer graphics transfer processing is carried out to multilayer daughter board；
Step 308, one-side electroplating plated hole is carried out to multilayer daughter board.
The processing method in circuit board one-side electroplating provided by the invention hole, to carrying out PTHization after multilayer daughter board machine drilling
Copper is learned, plate face and the heavy last layer Metal Palladium of hole wall carry out outer layer figure using one layer of thin layers of copper of plate electricity preplating to multilayer daughter board
Shape transfer processing, then one-side electroplating plated hole is carried out to multilayer daughter board, it is thick to efficiently control face copper by one-side electroplating plated hole
Degree and uniformity cancel the technological process for subtracting copper after pressing, and provide the quality assurance for making accurate fine rule road product, improve life
Efficiency is produced, cost is reduced, promotes rate best in quality.
In one embodiment of the invention, it is preferable that step 306, the outer graphics transfer is carried out to multilayer daughter board
Processing, specifically includes：In the upper dry film of outer layer covering of multilayer daughter board；And it opens a window to the via hole of the outer layer of multilayer daughter board
The windowing of processing, via hole is unilateral than the unilateral big 2mil that drills.Preferably, further include：The internal layer of multilayer daughter board is subjected to whole plate
The copper face of the internal layer of multilayer daughter board is exposed in windowing.
In this embodiment, carry out dry film protection in the outer layer of multilayer daughter board, to the via hole of the outer layer of multilayer daughter board into
Row windowing is handled, and the windowing of via hole is unilateral than the unilateral big 2mil that drills, and forms copper-clad shape, increases the binding force of hole wall, really
Product high reliability is protected, while aligning accuracy is controlled in the windowing of corresponding aperture, aperture generates convex or deviation after solving plated hole
There is the problem of aperture turning reliability separation.
In one embodiment of the invention, as shown in Figure 3, it is preferable that the processing method includes：
Step 304, multilayer daughter board is carried out to machine drilling, PTH electroless copper platings, plating preplating successively；
Step 306, outer graphics transfer processing is carried out to multilayer daughter board；
Step 3082, multilayer daughter board is clipped in anode；
Step 3084, the inner layer surface of multilayer daughter board is subjected to hanging plate in the same direction, the inner layer surface of multilayer daughter board is made to export
Electric current makes the outer layer surface of multilayer daughter board not output current.
In this embodiment, multilayer daughter board is clipped in anode, the inner layer surface of multilayer daughter board is subjected to hanging plate in the same direction,
The inner layer surface output current for making multilayer daughter board makes the outer layer surface of multilayer daughter board not output current, using system when by the way that plated hole is electroplated
One hanging plate mode in one direction, daughter board inner layer surface single side output current, the processing method of outer layer surface not output current are effectively controlled
Occur burning plate and hole burning problems when plated hole processed, ensures the uniformity of copper thickness, process makes the product matter of high-accuracy circuit after realization
Amount, hole burning and it is poorly controlled to burn plate is 0%.
In one embodiment of the invention, as shown in Figure 3, it is preferable that the processing method includes：
Step 302, pattern transfer processing is carried out to the internal layer of multilayer daughter board, and daughter board pressing is carried out to multilayer daughter board；
Step 304, multilayer daughter board is carried out to machine drilling, PTH electroless copper platings, plating preplating successively；
Step 306, outer graphics transfer processing is carried out to multilayer daughter board；
Step 3082, multilayer daughter board is clipped in anode；
Step 3084, the inner layer surface of multilayer daughter board is subjected to hanging plate in the same direction, the inner layer surface of multilayer daughter board is made to export
Electric current makes the outer layer surface of multilayer daughter board not output current.
In this embodiment, multilayer daughter board is carried out successively also wrapping before machine drilling, PTH electroless copper platings, plating preplating
It includes：Pattern transfer processing is carried out to the internal layer of multilayer daughter board, and daughter board pressing is carried out to multilayer daughter board, and then is carried out subsequent
One-side electroplating plated hole can effectively improve production efficiency, cost-effective.
In one embodiment of the invention, it is preferable that plating preplating is that multilayer daughter board is plated thin copper, and the copper thickness of thin copper is
5 μm to 10 μm.
In this embodiment, plating preplating is that multilayer daughter board is plated thin copper, and the copper thickness of thin copper is 5 μm to 10 μm, and intermediate value presses 7
μm management and control.
The embodiment of second aspect of the present invention, it is proposed that a kind of multilayer daughter board, including the use of such as any of the above-described circuit board
The multilayer daughter board that the processing method in one-side electroplating hole makes.
The processing method in the circuit board one-side electroplating hole of multilayer daughter board provided by the invention through the invention makes, multilayer
PTH chemical coppers, plate face and the heavy last layer Metal Palladium of hole wall are carried out after plate machine drilling, using one layer of thin copper of plate electricity preplating
Layer, multilayer daughter board carries out outer graphics transfer processing, then carries out one-side electroplating plated hole, can be effectively by one-side electroplating plated hole
Control plane copper thickness and uniformity cancel the technological process for subtracting copper after pressing, and provide the quality guarantor for making accurate fine rule road product
Barrier, improves multilayer daughter board production efficiency, reduces cost, promote rate best in quality.
In one particular embodiment of the present invention, the daughter board of the folded structures of N+N carries out PTH chemical coppers, plate after machine drilling
Face and the heavy last layer Metal Palladium of hole wall, using one layer of thin layers of copper of plate electricity preplating, copper pre-plating is 5 μm to 10 μm thick, and (intermediate value presses 7 μm
Management and control).It is shifted again by outer graphics, the copper face of whole plate is exposed in the core material whole plate windowing of daughter board；And the outer layer of daughter board is big
Copper face is covered using dry film, and via hole does windowing processing, so that rear process via hole is plated layers of copper by liquid medicine penetrability, finally
Single side plated hole technique is formed by way of plated hole is electroplated.This single side plated hole effectively controls the bottom copper thickness of outer layer, while internal layer
Daughter board copper thickness also meet the requirement of client.
Since the big copper face of outer layer uses dry film covering protection, the face copper and hole wall when plated hole only in internal layer plate layers of copper,
It is susceptible to that binding force is bad and reliability lamination problem in dry film covering and hole wall junction.In order to solve intersection separation
Problem is designed the windowing of corresponding via hole in daughter board pattern transfer by unilateral bigger 2mil than boring nozzle, formation copper-clad shape, increase
The binding force of hole wall, it is ensured that product high reliability.
Daughter board is to thicken surface and hole wall after outer layer figure turns using dry film covering outer layer copper face, then by figure electroplating hole side
Layers of copper meets the requirement of client.Need plate being clipped on anode when plated hole, according to the area that is plated and thick copper control require with
And the time carrys out the size of output current.In order to ensure copper facing thickness evenness and avoid controlling because electric current exports, using needing electricity
The one side of plating unified hanging plate towards a direction, single side output current, and in addition one side (outer layer dry film protection face) not output current
Processing method realizes single side plated hole technique, it is ensured that the thickness of outer layer surface copper is also effectively controlled while copper thickness uniformity.
In another specific embodiment of the present invention, N+N is realized by a kind of process of single side plated hole and design
The circuit board of the high-level high-accuracy fine rule road of folded structure：
(1) changing traditional whole plate plated hole and two-sided plated hole method can be controlled using the new technique of single side plated hole technique
Face copper thickness processed and uniformity cancel the technological process for subtracting copper after pressing, and effectively improve production efficiency, cost-effective and offer system
Make accurate fine rule road product quality guarantee, improving productivity 10%, 5% or more cost reduction, quality yield promoted 10% with
On.
(2) by the design method of single side plated hole technique, the internal layer of daughter board is done into whole plate plating and plated hole, in addition one side
The big copper face dry film of (outer layer) is protected, and corresponding via hole windowing is by unilateral bigger 2mil than brill nozzle, while in the windowing of corresponding aperture
Aligning accuracy is controlled, solves the problems, such as that aperture generates convex after plated hole or deviation aperture turning reliability occurs and detaches.
(3) by the way that plated hole is electroplated using unified hanging plate mode in one direction when, daughter board inner layer surface single side output current, outside
The processing method of level not output current occurs burning plate and hole burning problems when effectively controlling plated hole, ensures the uniformity of copper thickness, in fact
Process makes the product quality of high-accuracy circuit after now, hole burning and it is poorly controlled to burn plate is 0%.
In another specific embodiment of the present invention, the plated hole processing flow with a 16 layer printed circuit daughter boards is
Example, L1 to the L8 plywoods schematic diagram of daughter board is as shown in figure 4, daughter board L9 is as shown in Figure 5 to L16 plywood schematic diagrames：
(1) daughter board production process：
Core material sawing sheet, internal layer figure turn, etching, AOI, daughter board pressing, drilling (daughter board blind hole), PTH, plating (in advance
Plating), pattern transfer (dry film protection outer layer copper face), plated hole, move back film, grinding, filling holes with resin, daughter board pattern transfer, Xray bore mark
Target, two pressure of pairing.
Fig. 6 a show that the schematic diagram of daughter board drilling and plating preplating cross section and Fig. 6 b show daughter board drilling and electricity
The schematic diagram of preplating plane is plated, shows that buried via hole 602, above-mentioned flow plating preplating are the plating thin copper of last layer in Fig. 6 a and Fig. 6 b,
Copper is 5 μm to 10 μm thick.Fig. 7 a show that the schematic diagram in daughter board pattern transfer cross section, outer layer are protected by figure using dry film big
Exposed hole is drawn out in copper face, the windowing of corresponding hole, internal layer by big copper face and hole carry out whole plate copper facing, Fig. 7 b are shown outside daughter board
Layer pattern shifts the schematic diagram of plane, and black portions are that dry film protects big copper face, will not plate layers of copper, above-mentioned daughter board pattern transfer
It is that internal layer circuit is made after daughter board plated hole, outer layer does not make circuit.Fig. 8 a show schematic diagram after the windowing of daughter board single side, Fig. 8 b
Show schematic top plan view after the windowing of daughter board single side, the windowing of daughter board plated hole is drawn out unilateral to be shown than the unilateral big 2mil of drilling, Fig. 8 c
The schematic diagram of shape after daughter board single side plated hole, windowing is unilateral bigger 2mil than hole, and bound edge shape is formed with table copper junction after plated hole
Shape enhances the adhesive force of hole copper.Fig. 9 a show the schematic diagram of daughter board inner layer surface plating plated hole hanging plate mode, daughter board inner layer surface system
One hanging plate towards a direction, by electric current thickened surface copper and hole copper thickness, Fig. 9 b show that daughter board outer layer surface plating plated hole is hung for plating
The schematic diagram of plate mode, the unified hanging plate towards a direction of daughter board outer layer surface, dry film protect outer layer copper face, control plane copper thickness only to do
Plated hole.
(2) motherboard blind hole crimps
Daughter board brown, outer layer pressing (two pressure), removal brown film, drilling (through-hole), PTH, plating, outer graphics transfer,
Graphic plating, etching, AOI, welding resistance, word, molding, ET, FQC, drying-plate, packaging, Figure 10 show the lamination schematic diagram of motherboard,
Including blind hole 1002, outer layer through-hole 1004.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the present invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of processing method in circuit board one-side electroplating hole, which is characterized in that including：
Multilayer daughter board is carried out to machine drilling, PTH electroless copper platings, plating preplating successively；
Outer graphics transfer processing is carried out to the multilayer daughter board；
One-side electroplating plated hole is carried out to the multilayer daughter board.
2. the processing method in circuit board one-side electroplating according to claim 1 hole, which is characterized in that described to the multilayer
Daughter board carries out the outer graphics transfer processing, specifically includes：
In the upper dry film of outer layer covering of the multilayer daughter board；And
Windowing processing is carried out to the via hole of the outer layer of the multilayer daughter board.
3. the processing method in circuit board one-side electroplating according to claim 2 hole, which is characterized in that
The windowing of the via hole is unilateral than the unilateral big 2mil that drills.
4. the processing method in circuit board one-side electroplating according to claim 2 hole, which is characterized in that further include：
The internal layer of the multilayer daughter board is subjected to whole plate windowing, exposes the copper face of the internal layer of the multilayer daughter board.
5. the processing method in circuit board one-side electroplating according to claim 1 hole, which is characterized in that described to the multilayer
Daughter board carries out the one-side electroplating plated hole, specifically includes：
The multilayer daughter board is clipped in anode；
The inner layer surface of the multilayer daughter board is subjected to hanging plate in the same direction, makes the inner layer surface output current of the multilayer daughter board.
6. the processing method in circuit board one-side electroplating according to claim 5 hole, which is characterized in that further include：
Make the outer layer surface of the multilayer daughter board not output current.
7. the processing method in circuit board one-side electroplating according to claim 1 hole, which is characterized in that described by the multilayer
Before daughter board carries out the machine drilling, the PTH electroless copper platings, the plating preplating successively, further include：
Pattern transfer processing is carried out to the internal layer of the multilayer daughter board, and daughter board pressing is carried out to the multilayer daughter board.
8. the processing method in circuit board one-side electroplating according to any one of claim 1 to 7 hole, which is characterized in that
The plating preplating is that the multilayer daughter board is plated thin copper.
9. the processing method in circuit board one-side electroplating according to claim 8 hole, which is characterized in that
The copper thickness of the thin copper is 5 μm to 10 μm.
10. a kind of multilayer daughter board, which is characterized in that including：
The multilayer daughter board made using the processing method in circuit board one-side electroplating as claimed in any one of claims 1-9 wherein hole.
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| CN201710207310.4A CN108668468B (en) | 2017-03-31 | 2017-03-31 | Processing method of single-side electroplating hole of circuit board and multilayer daughter board |
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| CN102758240A (en) * | 2012-08-07 | 2012-10-31 | 高德（无锡）电子有限公司 | Double-face rack for vertical electroplating gold thread |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
| CN103225094A (en) * | 2013-05-20 | 2013-07-31 | 深圳市博敏电子有限公司 | Single-sided current protection method for blind hole plate electroplating |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
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