CN108668425A - Signal transmssion line ontology and preparation method thereof, USBTypeC connectors - Google Patents
Signal transmssion line ontology and preparation method thereof, USBTypeC connectors Download PDFInfo
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- CN108668425A CN108668425A CN201710206455.2A CN201710206455A CN108668425A CN 108668425 A CN108668425 A CN 108668425A CN 201710206455 A CN201710206455 A CN 201710206455A CN 108668425 A CN108668425 A CN 108668425A
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- power cord
- conductive
- conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of signal transmssion line ontology production method, including：Double-sided copper-clad substrate is provided, the double-sided copper-clad substrate includes the first base material layer and is formed in the first copper foil layer of the first base material layer surface and the second copper foil layer, and the first power cord is made in the first copper foil layer；The second substrate layer and third copper foil layer are provided, the second substrate layer, which is pressed together on the first conductive layer surface, forms circuit board；In the precalculated position of the second copper foil layer to opening up to form the first conductive column inside circuit board, opened up into the circuit board towards the second conductive column in the precalculated position of third copper foil layer, the second conductive column faces with the first conductive column and with identical axle center；Second source line and third power cord is respectively prepared in second copper foil layer and third copper foil layer, first power cord, second source line and third power cord are corresponding, and the first power cord, second source line and the first power cord and third power cord are in parallel by the first conductive column and the second conductive column respectively.
Description
Technical field
The present invention relates to circuit board making fields more particularly to a kind of signal transmssion line ontology and preparation method thereof, also relate to
And it is a kind of include the signal transmssion line ontology USB Type C connectors.
Background technology
Signal transmssion line ontology largely uses on the consumption electronic products such as mobile phone, compares past Micro-USB
Etc. schemes, signal transmssion line ontology support high current power supply/charge and positive anti-plug compatibility, have high transfer rate, have data,
A variety of transmittabilities such as video, audio.In the prior art, signal transmssion line ontology fills output power and can reach 100W (20V/
5A), in the case where meeting high current, line width can only be laterally increased, finite resistance is reduced, so as to cause signal transmssion line ontology
Calorific value increases.
Invention content
In view of this, it is necessary to provide a kind of signal transmssion line ontology production method systems that can solve above-mentioned technical problem
Signal transmssion line ontology made of work and it is a kind of include the signal transmssion line ontology USB Type C connectors.
A kind of signal transmssion line ontology production method comprising step：
Double-sided copper-clad substrate is provided, the double-sided copper-clad substrate includes the first base material layer and is formed in the first base material layer surface
The first copper foil layer and the second copper foil layer, the first copper foil layer is made to form the first conductive layer, which includes
One power cord, first power cord have first resistor R1；
Second substrate layer is provided and is formed in the third copper foil layer of the second base material layer surface, by second substrate layer
It is pressed together on first conductive layer surface and forms circuit board；
In the precalculated position of second copper foil layer to opening up to form the first conductive column inside the circuit board, described
One conductive column through first copper foil layer until first power cord, in the precalculated position of the third copper foil layer to described
It opens up to form the second conductive column inside circuit board, second conductive column faces with first conductive column position and had
Identical axle center；
Second copper foil layer and third copper foil layer are made respectively and form the second conductive layer and third conductive layer, second leads
Electric layer includes second source line, and the second source line has second resistance R2, and third conductive layer includes third power cord,
The third power cord has a 3rd resistor R3, first power cord, the second source line and the third power cord
Position is corresponding, the second source line and first power cord it is parallel with one another via first conductive column and have the 4th
Resistance R4, the third power cord and first power cord it is parallel with one another via second conductive column and have the 5th resistance
R5, wherein the 4th resistance R4 is less than the first resistor R1 or described second resistance R2, wherein the 5th resistance R5 is small
In the first resistor R1 or described 3rd resistors R3.
A kind of signal transmssion line ontology comprising：First conductive layer, the second conductive layer, third conductive layer, the first conductive column
And second conductive column, between second conductive layer and the third conductive layer, described first leads first conductive layer
Electric layer includes the first power cord, and first power cord has first resistor R1；Second conductive layer includes the second electricity
Source line, the second source line have second resistance R2；The third conductive layer includes third power cord, the third power supply
Line has 3rd resistor R3；The position of first power cord, the second source line and the third power cord is corresponding, institute
The first conductive column is stated through the second source line until first power cord, second conductive column is through third electricity
Source line is until the second source line, second conductive column face and axis having the same with first conductive column position
The heart, the second source line and the first power cord it is parallel with one another via first conductive column and have the 4th resistance R4, it is described
Third power cord is parallel with one another via second conductive column with first power cord and has the 5th resistance R5, and the described 4th
Resistance R4 is less than the first resistor R1 or described second resistance R2, wherein the 5th resistance R5 is less than the first resistor R1
Or the 3rd resistor R3.
A kind of USB Type C connectors comprising signal transmssion line ontology and shielding casing as described above, it is described
Shielding casing includes a receiving space, and the signal wire transmission ontology is housed in the receiving space.
Compared with prior art, signal transmssion line ontology production method provided by the invention and the signal being thus made
Transmission line ontology, the corresponding power cord in position that different conductive layers include are connected in parallel, increase in the longitudinal direction to be equivalent to
Add copper thick (conductor thickness), so, the line width of power cord is to reduce, in this way, resistance can be reduced, is passed to reduce signal
Temperature when defeated this body running of line；It can certainly be it is understood that the corresponding conductive layer in position for including due to different conductive layers
It is connected in parallel, then second source line all-in resistance R4=(R1*R2)/(R1+R2) in parallel with first power cord, institute
State third power cord all-in resistance R5=(R1*R3)/(R1+R3) in parallel with first power cord, respectively less than single power line
Resistance, then according to Joule's law, calorific value when this body running of signal transmssion line can be reduced.
Description of the drawings
Fig. 1 is the sectional view for the double-sided copper-clad substrate that first embodiment of the invention provides.
Fig. 2 is that the first copper foil layer for including makes the sectional view to form the first conductive layer by the double-sided copper-clad substrate of Fig. 1.
Fig. 3 is in the first conductive layer surface pipe sensitive adhesion piece, the second substrate layer and to be formed in the second base material layer surface
Third copper foil layer to obtain the sectional view of circuit board.
Fig. 4 is the sectional view that the first blind hole, the second blind hole and first through hole are formed in circuit board.
Fig. 5 is to be electroplated the first blind hole, the second blind hole and first through hole to be respectively formed the first conductive column, second
The sectional view of conductive column and third conductive hole.
Fig. 6 is to make the second copper foil layer and third copper foil layer that circuit board includes respectively to form the second conductive layer and the
The sectional view of three conductive layers.
Fig. 7 is the vertical view of the first conductive layer, the second conductive layer and third conductive layer.
Fig. 8 is to be respectively formed cuing open for the first cover film and the second cover film on the surface of the second conductive layer and third conductive layer
Face figure.
Fig. 9 is to be respectively formed the first electro-magnetic screen layer and the second electromagnetic screen on the surface of the first cover film and the second cover film
It covers layer and obtains the sectional view of signal transmssion line ontology.
Figure 10 is a kind of USB Type C connectors that second embodiment of the invention provides.
Main element symbol description
Following specific implementation mode will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
Below in conjunction with accompanying drawings and embodiments, it is made to signal transmssion line ontology production method provided by the invention
Signal transmssion line ontology and it is a kind of include the signal transmssion line ontology USB Type C connectors make it is further detailed
Explanation.
- 9 are please referred to Fig.1, first embodiment of the invention provides a kind of production method of signal transmssion line ontology, step packet
It includes：
The first step is please referred to Fig.1 to Fig. 2, provides double-sided copper-clad substrate 10, and the double-sided copper-clad substrate 10 includes the first base
Material layer 13 and the first copper foil layer 11 and the second copper foil layer 12 for being formed in 13 surface of the first base material layer, the first copper foil layer 11 is made
Form the first conductive layer 110.
The first base material layer 13 can be hard resin layer, such as epoxy resin, glass-fiber-fabric, can also flexible resin layer,
Such as polyimides (PI), polyethylene terephthalate glycol (PET), polytetrafluoroethylene (PTFE) (Teflon), polyamide
(Polyamide), polymethyl methacrylate (PMMA), makrolon or polyimides-polyethylene-terephthaldehyde's ester copolymer
Deng.
First conductive layer 110 is formed by the micro-photographing process of known techniques.First conductive layer 110 includes
First power cord 112 (VBUS 1) of two parallel arrangeds, first power cord have first resistor R1.
Second step：Referring to Fig. 3, providing bonding sheet 21, the second substrate layer 22 and third copper foil layer 23；By the bonding sheet
21 are pressed together on the surface of the first conductive layer 110, and the second substrate layer 22 is pressed together on being led away from described first for the bonding sheet 21
The third copper foil layer 23 is pressed together on the surface of second substrate layer 22 by the surface of electric layer 110, in this way, forming an electricity
Base board 30.The material of second substrate layer 22 can be identical as the first base material layer 13.Second copper foil layer 12 and the third
Copper foil layer 23 is located at opposite two surfaces of the circuit board 30.
In other embodiments, bonding sheet 21 can be omitted, and also can only provide the second substrate layer 22 and a third
Copper foil layer 23, and the second substrate layer 23 is made to be bonding sheet, using second substrate layer 23 (bonding sheet) by the third copper foil
Layer 23 affixes to the surface of first conductive layer 110, and can select dielectric constant DkSmall bonding sheet, for example liquid crystal high score
Sub- material (LCP) makes the bonding sheet formed, so that high frequency signal transmission loss is reduced, in this way, can meet high-frequency signal biography
Defeated demand.
Third walks, and please refers to Fig. 4, Fig. 5, and the is formed to opening up inside the circuit board 30 on 12 surface of the second copper foil layer
One conductive column 31, opened up from the surface of third copper foil layer 23 to the inside of circuit board 30 it is consistent with 31 quantity of the first conductive column
Second conductive column 32 and at least one third conductive hole 33.First conductive column, 31 and second conductive column 32 can be conductive logical
Hole, or conductive blind hole.In the present embodiment, first conductive column, 31 and second conductive column 32 be position face and
The conductive blind hole in axle center having the same.
Specifically, referring to Fig. 4, being first to form the to opening up inside the circuit board 30 on 12 surface of the second copper foil layer
One blind hole 301 opens up consistent with 301 quantity of the first blind hole from the surface of third copper foil layer 23 to the inside of circuit board 30
Two blind holes 302 and at least one first through hole 303 through the circuit board 30.
First blind hole 301 is through the second copper foil layer 12 and the first base material layer 13 and appears first power cord 112
One of surface；Second blind hole 302 is through third copper foil layer 23, the second substrate layer 22 and bonding sheet 21 and until described the
One power cord 112, the second blind hole 302 appear another surface of first power cord 112, namely in the first power cord
112 opposite both sides are respectively formed the first blind hole 301 and the second blind hole 302 not through first power cord 112.Described
One through-hole 303 is through entire circuit board 30.First blind hole 301, the quantity of the second blind hole 302 are respectively 2.In other realities
It applies in mode, the quantity of first blind hole, 301 and second blind hole 302 can be with more than two.
Referring to Fig. 5, the first blind hole 301, the second blind hole 302 and first through hole 303 are electroplated to form first respectively
Conductive column 31, the second conductive column 32 and third conductive hole 33.When the first conductive column 31 and the second conductive column 32 are conductive through hole,
It is the conductive through hole that makes the first conductive column 31 and the second conductive column 32 be formed through the second copper foil layer 12, the first base material layer 13, the
One power cord 112, bonding sheet 21, the second substrate layer 22 and third copper foil layer 23.
The purpose for forming the first conductive column 31 is the second source line (VBUS2) and the first power cord in order to subsequently make to be formed
112 (VBUS1) are in parallel；The purpose for forming the second conductive column 32 is to make third power cord (VBUS3) and the first power cord
112 (VBUS1) are in parallel.
The third conductive hole 33 is through the second copper foil layer 12, the first base material layer 13, the first power supply conductive layer 112, bonding
Piece 21, the second substrate layer 22 and third copper foil layer 23.The purpose for forming third conductive hole 33 be in order to make the first conductive layer 110 with
The second conductive layer 120 and third conductive layer 230 being subsequently formed mutually electrically conduct.
4th step please refers to Fig. 6 and Fig. 7, and the second copper foil layer 12 and third copper foil layer 23 are made and form the second conductive layer
120 and third conductive layer 230.The forming method of second conductive layer 120 and third conductive layer 230 is known lithographic techniques,
Which is not described herein again.
Second conductive layer 120 includes second source line 122, and third conductive layer 230 includes third power cord 232, institute
Stating second source line has second resistance R2；The third power cord has 3rd resistor R3；The position of first power cord 112
It sets, the position of the position of second source line 122 and third power cord 232 is corresponding and length is consistent.
It is respectively bowing for the first conductive layer 110, the second conductive layer 120 and third conductive layer 230 also referring to Fig. 7, Fig. 7
View.Two the first conductive columns 31 are located at the opposite end of first power cord 112, and the aperture of first conductive column 31
It is less than the line width of first power cord 112, and the position of the first conductive column 31 and the second conductive column 32 is face and has
There is identical axle center setting.First conductive column 31 and the second conductive column 32 are separately positioned on the first power cord 112 and second
The both ends of power cord 122 are to make signal from second source line 122 into fashionable, the first conductive column 31 and second on the diagram left side
The position punishment stream of conductive column 32, is transmitted along the first power cord 112, second source line 122 and third power cord 232 respectively, then
It is converged at 32 position of the first conductive column 31 and the second conductive column on the right of diagram, realizes the first power cord 112, second source line
122 and third power cord 232 parallel connection.
The second source line 122 and first power cord 112 are parallel with one another via first conductive column 31 and have
There are the 4th resistance R4, the third power cord 232 and first power cord 112 parallel with one another via second conductive column 32
And there is the 5th resistance R5, the 4th resistance R4=(R1*R2)/(R1+R2), then R4 is less than the first resistor R1 or described
Second resistance R2, the 5th resistance R5=(R1*R3)/(R1+R3), then R5 is less than first resistor R1 or described thirds electricity
R3 is hindered, with the all-in resistance of this power cord for reducing signal transmssion line ontology.
According to Joule's law：The heat that electric current is generated by conductor is directly proportional with the quadratic power of electric current, with the resistance of conductor
It is directly proportional, it is directly proportional with the time of energization.It is in parallel since parallel connection makes the all-in resistance of the first power cord and second source line reduce
The all-in resistance of the first power cord and third power cord is set to reduce, then calorific value when signal transmssion line ontology 100 works can then drop
It is low.
In the present embodiment, the second conductive layer 120 of formation further includes multiple parallel with second source line 122 first
Signal wire, third conductive layer 230 further include multiple second signal lines parallel with third power cord 232.First signal wire and
Binary signal line respectively includes：Ground terminal sends Difference signal pair (TX1+, TX1-) to (GND1, GND2), high speed, high speed receives
Difference signal pair (RX2-, RX2+), low speed Difference signal pair (D+, D-), inspection terminal (CC1) and reserved conducting terminal
(RFU1).Specifically, the arrangement of the power cord, signal wire of the first conductive layer 110, the second conductive layer 120 and third conductive layer 230
As the signal wire of following table, second conductive layer 120 is arranged with the signal wire with third conductive layer 230 after the overturning of 180 degree angle
It arranges identical, so that the USB Type C that signal transmssion line ontology 100 is formed can support positive and negative inserting function.
Further include being formed to lead with the second conductive layer 120 and third when forming the second conductive layer 120 and third conductive layer 230
The pin pad 124,234 (Pin Pad) that electric layer 230 is electrically connected, the pin pad 124,234 is for making the letter
Number 100 installation settings plate of transmission line ontology to plate electron-like element (Board To Board), with realize extraneous electronic component with
Signal wire transmits the signal transmission between ontology 100.
5th step, please refers to 8, and the first cover film is pressed respectively on the surface of the second conductive layer 120 and third conductive layer 230
34 and second cover film 35, and in the first cover film 34 and the second cover film 35 to be respectively formed the 4th blind hole 304 and the 5th blind
Second conductive layer 120 and part third described in hole 305, the 4th blind hole 304 and the 5th blind hole 305 difference expose portion are conductive
Layer 230.Since the opposite end of the second conductive layer 120 and the opposite end of third conductive layer 230 are eventually for formation USB
The tongue of type C, it is therefore to be understood that first cover film, 304 and second cover film 305 is to appear to be subsequently used for respectively
Form the second conductive layer of part 120 and third conductive layer 230 of the tongue of USB type C.
6th step, referring to Fig. 9, the first electro-magnetic screen layer 36 is formed on 34 surface of the first cover film, in the second cover film
35 surfaces form the second electro-magnetic screen layer 37, and first electro-magnetic screen layer 36 also fills up the 4th blind hole 304, the second electromagnetic shielding
Layer 37 also fills up the 5th blind hole 305, and first electro-magnetic screen layer, 36 and second electro-magnetic screen layer 37 is a floor height metallic conduction
Body thin film forms signal transmssion line ontology in this way, just making.
Referring to Fig. 9, the invention further relates to a kind of signal transmssion line ontologies 100 comprising：The first base material layer 13,
It is formed in first conductive layer 110 on 13 opposite two surface of the first base material layer and the second conductive layer 120, is formed in the second conductive layer
First cover film 34 on 120 surfaces, the first electro-magnetic screen layer 35 for being formed in 34 surface of the first cover film are formed in the first conduction
The bonding sheet 21 on 110 surface of layer, is formed in 22 table of the second substrate layer at the second substrate layer 22 for being formed in 21 surface of the bonding sheet
The third conductive layer 230 in face, is formed in 35 table of the second cover film at the second cover film 35 for being formed in 230 surface of third conductive layer
Second electro-magnetic screen layer 37, the first conductive column 31, the second conductive column 32 and the third conductive hole 33 in face.
First conductive layer 110 includes there are two the first power cord 112, and first power cord 112 has the first electricity
Hinder R1.
Second conductive layer 120 includes there are two second source line 122, and the second source line has second resistance R2, institute
State the first signal wire 126 and 122 position face of the second source line.
Second conductive layer 120 further includes between second source line 122 and multiple first signal wires 126 of both sides,
In present embodiment, the quantity of the first signal wire 126 is 10, the both ends of each second source line 122 and each first signal
The opposite end of line 126 is respectively arranged with the pin being electrically connected with 122 and first signal wire of second source line, 126 phase and welds
Disk 124.
Third conductive layer 230 includes there are two third power cord 232, and the third power cord has 3rd resistor R3.Institute
The position for stating the position of the first power cord 112, the position of second source line 122 and third power cord 232 is corresponding.In this implementation
In mode, the quantity of second signal line 236 is 10, the both ends of each third power cord 232 and each second signal line 236
Opposite end is respectively arranged with the pin pad 234 with the second source line 122 and the electric connection of 236 phase of second signal line.
First conductive column 31 through the second source line 122 and the first base material layer 13 until the first power cord 112,
Second conductive column 32 is through 232 and second substrate layer 22 of the third power cord, bonding sheet 21 until the first power cord 112.Institute
At least two first conductive columns 31 are stated to be separately positioned on close to the position of the pin pad 124.Described at least two second lead
Electric column 32 is separately positioned on close to the position of the pin pad 234.122 and first power cord 112 of the second source line is logical
It is parallel with one another and there is the 4th resistance R4 to cross first conductive column 31, the third power cord 232 and first power cord
112 have the 5th resistance R5 by second conductive column 32 is parallel with one another.
First conductive column, 31 and second conductive column 32 is position face and concentric conductive blind hole, specifically
Make the first conductive column 31 through the second copper foil layer 12 and the first base material layer 13 and until first power cord 112 in the longitudinal direction
Surface；Make the second conductive column 32 through third copper foil layer 23, the second substrate layer 22 and bonding sheet 21 and until described first
Power cord 112, namely it is respectively formed first not through first power cord 112 in the opposite both sides of the first power cord 112
Conductive column 31 and the second conductive column 32.
The 4th resistance R4 is less than the first resistor R1 or described second resistance R2, wherein the 5th resistance R5 is small
In the first resistor R1 or described 3rd resistors R3.
4th blind hole 304 appears part second conductive layer 120 through first cover film 34, and the described 5th
Blind hole 305 is also filled out through the aobvious 35 dew part third conductive layer 230 of second cover film, first electro-magnetic screen layer 36
The 4th blind hole 304 is filled, the second electro-magnetic screen layer 37 also fills up the 5th blind hole 305, first electro-magnetic screen layer, 36 and second electricity
Magnetic masking layer 37 is a floor height metallic conduction body thin film.
Referring to Fig. 10, Figure 10 is a kind of USB Type C connectors 200 that second embodiment of the invention provides.It is described
USB Type C connectors 200 include the signal transmssion line ontology 100 and shielding casing 201.The shielding casing 201 is
There is hollow annular structure an accommodating space 203, the signal transmssion line ontology 100 to be housed in the receiving space 203,
Part of the signal wire transmission line ontology 100 for tongue is emerging in the receiving space 203, to support positive and negative grafting
Function.
In conclusion signal transmssion line ontology production method provided by the invention and the signal transmssion line being thus made
Ontology 100 and it is a kind of include the signal transmssion line ontology USB Type C connectors 200, by increase by one layer first lead
Electric layer 110, and two first power cords 112 arranged side by side are only set in the first conductive layer 110, and make the second conductive layer
The third power cord 232 that the 120 second source lines 122 for including and third conductive layer 230 include passes through the first conductive column 31 and
Two conductive columns 32 are in parallel with the first power cord 112 respectively reduces the all-in resistance of power cord with this.
It is that copper is thick according to power cord line width calculation formula W=A/ (1.378*D), wherein D, it is different compared to prior art
The corresponding power cord in position that conductive layer includes is connected in parallel, and thick (the conductor thickness of copper is increased in the longitudinal direction to be equivalent to
Degree), so, the line width of power cord is to reduce, in this way, resistance can be reduced, is worked to reduce signal transmssion line ontology 100
When temperature；Loss of signal when power cord work can also so be reduced.
It can certainly be understood that, since the corresponding power cord in position that different conductive layers include is connected in parallel,
Then according to the calculation formula of parallel resistance, the second source line 122 all-in resistance R4=in parallel with first power cord 112
(R1*R2)/(R1+R2), the third power cord 232 all-in resistance R5=(R1*R3)/(R1 in parallel with first power cord 112
+ R3), to the first power cord 112 it is in parallel with second source line 122 after resistance R4 less than single power line resistance (R1 or
R2), the resistance R5 after the first power cord 112 is in parallel with third power cord 232 is less than the resistance (R1 or R3) of single power line, root
According to Joule's law：The heat that electric current is generated by conductor is directly proportional with the quadratic power of electric current, directly proportional with the resistance of conductor, with logical
The time of electricity is directly proportional, and since all-in resistance reduces, then calorific value when this body running of signal transmssion line can then reduce.
It is understood that above example is only used for illustrating the present invention, it is not used as limitation of the invention.For this
For the those of ordinary skill in field, the various other corresponding changes and deformation that technique according to the invention design is made, all
It falls within the claims in the present invention protection domain.
Claims (11)
1. a kind of signal transmssion line ontology production method comprising step：
There is provided double-sided copper-clad substrate, the double-sided copper-clad substrate includes the first base material layer and is formed in the of the first base material layer surface
One copper foil layer and the second copper foil layer, the first copper foil layer is made to form the first conductive layer, which includes the first electricity
Source line, first power cord have first resistor R1；
Second substrate layer is provided and is formed in the third copper foil layer of the second base material layer surface, second substrate layer is pressed
Circuit board is formed in first conductive layer surface；
In the precalculated position of second copper foil layer to opening up to form the first conductive column inside the circuit board, described first leads
Electric column through first copper foil layer until first power cord, in the precalculated position of the third copper foil layer to the circuit
It opens up to form the second conductive column inside substrate, second conductive column faces with first conductive column position and has identical
Axle center；
Second copper foil layer and third copper foil layer are made respectively and form the second conductive layer and third conductive layer, the second conductive layer
Include second source line, the second source line has second resistance R2, and third conductive layer includes third power cord, described
Third power cord have 3rd resistor R3, first power cord, the second source line and the third power cord position
It is corresponding, the second source line and first power cord it is parallel with one another via first conductive column and have the 4th resistance
R4, the third power cord and first power cord it is parallel with one another via second conductive column and have the 5th resistance R5,
The wherein described 4th resistance R4 is less than the first resistor R1 or described second resistance R2, wherein the 5th resistance R5 is less than institute
State first resistor R1 or described 3rd resistors R3.
2. signal transmssion line ontology production method as described in claim 1, which is characterized in that provide second substrate layer
Further include that a bonding sheet is provided simultaneously, the bonding sheet is used to second substrate layer affixing to first conductive layer.
3. signal transmssion line ontology production method as described in claim 1, which is characterized in that second substrate layer of offer
For bonding sheet, for the third copper foil layer to be affixed to first conductive layer.
4. signal transmssion line ontology production method as claimed in claim 2 or claim 3, which is characterized in that led forming described second
Further include step after electric layer and the third conductive layer：
The first cover film and the second cover film are pressed respectively on the surface of second conductive layer and the third conductive layer.
5. signal transmssion line ontology production method as claimed in claim 4, which is characterized in that pressing first cover film
And second cover film further includes later step：
The first electro-magnetic screen layer is formed in the first covering film surface, the second electromagnetic screen is formed in the second covering film surface
Cover layer.
6. signal transmssion line ontology production method as claimed in claim 5, which is characterized in that forming second conductive layer
And when the third conductive layer further include being respectively formed arranged in parallel with the second source line and the third power cord
One signal wire and second signal line.
7. a kind of signal transmssion line ontology comprising：First conductive layer, the second conductive layer, third conductive layer, the first conductive column and
Second conductive column, for first conductive layer between second conductive layer and the third conductive layer, described first is conductive
Layer includes the first power cord, and first power cord has first resistor R1；Second conductive layer includes second source
Line, the second source line have second resistance R2；The third conductive layer includes third power cord, the third power cord
With 3rd resistor R3；The position of first power cord, the second source line and the third power cord is corresponding, described
First conductive column is through the second source line until first power cord, second conductive column run through the third power supply
Line is until the second source line, second conductive column face and axis having the same with first conductive column position
The heart, the second source line and the first power cord it is parallel with one another via first conductive column and have the 4th resistance R4, it is described
Third power cord is parallel with one another via second conductive column with first power cord and has the 5th resistance R5, and the described 4th
Resistance R4 is less than the first resistor R1 or described second resistances R2, and the 5th resistance R5 is less than the first resistor R1 or institute
State 3rd resistor R3.
8. signal transmssion line ontology as claimed in claim 7, which is characterized in that the signal transmssion line ontology further includes third
Conductive hole, the third conductive hole run through the second conductive layer, the first conductive layer and third conductive layer, and the third conductive hole is electrical
The second conductive layer, the first conductive layer and third conductive layer is connected.
9. signal transmssion line ontology as claimed in claim 8, which is characterized in that second conductive layer and the third are conductive
The surface of layer is respectively formed with the first cover film and the second cover film.
10. signal transmssion line ontology as claimed in claim 9, which is characterized in that second conductive layer and the third are led
Further include forming the first signal wire arranged in parallel with the second source line and the third power cord respectively and when electric layer
Binary signal line.
11. a kind of USB Type C connectors comprising the signal transmssion line ontology as described in claim 7~10 any one
And shielding casing, the shielding casing include a receiving space, it is empty that the signal wire transmission ontology is housed in the receiving
Between.
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| CN201710206455.2A CN108668425B (en) | 2017-03-31 | 2017-03-31 | Signal transmission line body, manufacturing method thereof and USB Type C connector |
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| CN201710206455.2A CN108668425B (en) | 2017-03-31 | 2017-03-31 | Signal transmission line body, manufacturing method thereof and USB Type C connector |
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| CN108668425B CN108668425B (en) | 2020-03-31 |
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