CN108667991A - Housing unit and electronic device - Google Patents
Housing unit and electronic device Download PDFInfo
- Publication number
- CN108667991A CN108667991A CN201810597758.6A CN201810597758A CN108667991A CN 108667991 A CN108667991 A CN 108667991A CN 201810597758 A CN201810597758 A CN 201810597758A CN 108667991 A CN108667991 A CN 108667991A
- Authority
- CN
- China
- Prior art keywords
- chip
- shell
- extension
- receiving part
- housing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of housing unit, which includes：Shell forms radiating area on shell；Shielding case is connected to by a circuit board on shell, and shielding case includes multiple connecting plates, and multiple connecting plates, which enclose, to be set to form accommodating cavity；Chip, chip are set in accommodating cavity；Heat pipe, heat pipe includes receiving part and extension, and receiving part is at least one piece of connecting plate in shielding case, and extension is at least partially disposed on shell and extends to radiating area towards far from chip direction, so that the heat that chip is sent out is transferred to extension by receiving part, and radiating area is transferred to by extension.The heat that chip generates is enable to be transferred directly to receiving part using the above structure, and extension is transferred to by receiving part, radiating area is transferred to by extension, and then the heat that chip generates is dispersed to the lower radiating area of temperature, to improve setting chip position temperature locally excessively high problem.It includes electronic device with upper housing component that the application, which also provides a kind of,.
Description
Technical field
This application involves structure-design technique fields, more particularly to a kind of housing unit and electronic device.
Background technology
With the continuous development of technology, the function of the electronic devices such as mobile phone is more and more at present so that electronic device is being transported
When some functions of row or multiple functions are run simultaneously, the working frequency of chip is higher and higher, and then is easy so that installation
The position temperature part of chip is higher.
Invention content
It is easy the higher technical problem of local temperature in setting chip position for electronic devices such as mobile phones, the application provides
A kind of housing unit and electronic device.
The application use a technical solution be：A kind of housing unit is provided comprising：
Shell forms radiating area on the shell；
Shielding case is connected to by a circuit board on shell, and the shielding case includes multiple connecting plates, multiple connections
Plate, which encloses, to be set to form accommodating cavity；
Chip, the chip are set in the accommodating cavity；
Heat pipe, the heat pipe include receiving part and extension, and the receiving part is at least one piece of company in the shielding case
Fishplate bar, the extension are at least partially disposed on the shell and extend to the radiating area towards far from the chip direction, make
It obtains the heat that the chip is sent out and is transferred to the extension by the receiving part, and described dissipate is transferred to by the extension
Hot-zone.
The application also provides a kind of electronic device, including housing unit described above.
The chip and screen that housing unit and electronic device in the application include shell, is arranged on shell by circuit board
Cover is covered, forms radiating area on shell, shielding case includes multiple connecting plates, and multiple connecting plates, which enclose, to be set to form accommodating cavity, and chip is located at
In accommodating cavity.Heat pipe includes receiving part and extension, and wherein receiving part is one piece of connecting plate in shielding case so that heat pipe is direct
It is contacted with chip.Extending part towards far from chip direction on shell in extending to radiating area simultaneously, so that chip generated
Heat can be transferred directly to receiving part, and be transferred to extension by receiving part, and radiating area is transferred to by extension, and then by core
The heat that piece generates is dispersed to the lower radiating area of temperature, to improve setting chip position temperature locally excessively high problem.
Description of the drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present application, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is the structural schematic diagram of one embodiment of the application electronic device；
Fig. 2 is the distributed architecture schematic diagram of one embodiment middle casing component critical piece of the application；
Fig. 3 is the partial cross-sectional structural diagram in one embodiment middle casing component thickness direction of the application；
Fig. 4 is the distributed architecture schematic diagram of another embodiment middle casing component critical piece of the application；
Fig. 5 is the structural schematic diagram at battery compartment bottom in one embodiment of the application；
Fig. 6 is the distributed architecture schematic diagram of the another embodiment middle casing component critical piece of the application；
Fig. 7 is the distributed architecture schematic diagram of the application another embodiment middle casing component critical piece.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application
It is fixed.It also should be noted that illustrating only for ease of description, in attached drawing and the relevant part of the application and not all knot
Structure.Based on the embodiment in the application, those of ordinary skill in the art are obtained without creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Term " first " in the application, " second ", " third " are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second ", " are defined as a result,
Three " feature can explicitly or implicitly include at least one of the features.In the description of the present application, the meaning of " plurality " is extremely
It is two few, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present application
Such as up, down, left, right, before and after ...) it is only used for explaining the phase under a certain particular pose (as shown in the picture) between each component
To position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.In addition, term " comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It further includes the steps that optionally not listing or unit to be, or further includes optionally for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Referring to Fig. 1 to Fig. 3, housing unit 100 and electronic device 200 provided by the present application are mainly used for being produced chip
For raw heat transfer to the lower region of temperature or conducive to the region of heat dissipation, the position local temperature for improving setting chip is excessively high
The case where.The housing unit 100 includes shell 10, by circuit board connection shielding case 20 on the housing 10, be located at shielding case
Chip 30 in 20 and the heat pipe 40 being connect with chip 30.
Specifically, in an embodiment, shell 10 be used to carry as carrier the glass cover-plate of electronic device 200, display screen,
Circuit board and numerous electronic components etc..Specifically, in different embodiments, shell 10 can be electronic device 200 center,
One in battery cover or front housing, this is not specifically limited.Radiating area is formed on shell 10, specifically, radiating area is will not
Heat is generated, either generation heat is relatively low or is conducive to the region of heat dissipation, hereafter by different embodiments illustrate
It is bright.
Shielding case 20 is connected to by circuit board 50 on shell 10, and shielding case 20 includes multiple connecting plates 22, multiple connections
Plate 22, which encloses, to be set to form accommodating cavity 24, and chip 30 is set in accommodating cavity 24.It should be understood that chip 30 include CPU processor,
Gpu processors or audio frequency process etc., therefore can be according to different operative scenarios when the work of chip 30, such as swim online
Play, Online Video etc. adjust the working frequency of chip 30.The frequency multiplication of different working frequencies and the working frequency is possible to
Interference is generated to the communication signal of antenna, it is therefore desirable to a shielding case 20 be set, and chip 30 is set in shielding case 20.
In one embodiment, the accommodating cavity 24 in shielding case 20 is shield effectiveness of the closed space to reach as well as possible.Other are implemented
In example, some slots can also be opened up on shielding case 20 for housing the components such as capacitance.Specifically, in different embodiments, it is more
A connecting plate 22, which encloses, sets the shielding case 20 to be formed as cuboid, terrace with edge or other irregular shapes, this is not specifically limited.
Heat pipe 40 is used to the heat that chip 30 generates being partly delivered to radiating area.Specifically, in the present embodiment, heat pipe 40
Including receiving part 42 and extension 44, receiving part 42 is at least one piece of connecting plate 22 in shielding case 20.So that heat pipe 40
Receiving part 42 directly contacted with chip 30 or with chip 30 very close to so that chip 30 generate heat can be fast
Speed is transferred to receiving part 42.Extension 44 is at least partially disposed on shell 10 and extends to radiating area towards far from 30 direction of chip,
So that the heat that chip 30 is sent out is transferred to extension 44 by receiving part 42, and radiating area is transferred to by extension 44.Specifically
, during one implements, storage tank (not shown) is opened up on shell 10, storage tank forms extension 44 from 30 position of chip to radiating area
The extension 44 in the path of position, heat pipe 40 is set in storage tank.
Using this structure design, the part of the receiving part 42 of heat pipe 40 as shielding case 20 so that chip 30 is produced
Raw heat can be directly passed to heat pipe 40 so that the heat that chip generates faster, more passes to heat pipe 40, by heat pipe
40 are transferred to radiating area.
Specifically, during one implements, receiving part 42 is that shielding case 20 is parallel to the part of chip 30, that is, shielding case 20
Bottom or top, one piece of connecting plate 22 in receiving part 42 is only shielding case 20, can using such setting
Utmostly increase the contact area of heat pipe 40 and chip 30 or the area close to chip 30, so that chip 30 generated
Heat can be transferred to heat pipe 40 faster and more.Specifically, the application define it is parallel with 30 plane of chip in shielding case 20
Connecting plate 22 is bottom and top, and bottom is the connecting plate 22 close to electronic device display screen, and top is opposing floor portion far from aobvious
The connecting plate 22 of display screen setting, the connecting plate 22 for connecting bottom and top is the side wall of shielding case 20.
In other embodiment, receiving part 42 includes multiple portions, and multiple part is respectively multiple companies in shielding case 20
Fishplate bar 22, for example, shielding case 20 top and bottom be receiving part 42 or shielding case 20 top and bottom in one
And the entire side wall (or part of side wall) of shielding case is receiving part.And then it greatly increases heat pipe 40 and is contacted with chip 30
Or close area, there are more heats to be not necessarily to the part being made up of non-reception portion 42 in shielding case 20 by heat in this way
Heat pipe 40 is passed to, but directly reaches the receiving part 42 of heat pipe 40 after the generation heat of chip 30.
In one embodiment, all connecting plates 22 in shielding case 20 are the receiving part 42 of heat pipe 40, that is, entire screen
It covers cover 20 to be made by the receiving part 42 of heat pipe 40, entire shielding case 20 is a part for heat pipe 40.So that chip 30 generates
Heat be quickly transferred to the receiving part 42 of heat pipe 40, by the extension 44 of heat pipe 40 be transferred to temperature on shell 10 it is lower its
His region.
It should be understood that if receiving part 42 is in direct contact with chip 30, it is easy so that being deposited between receiving part 42 and chip 30
In narrow gap, cause between chip 30 and receiving part 42 be not it is seamless be fitted and connected, influence the transmission effect of heat.Into one
It walks, in an embodiment, soft heat-conducting piece 50 is set so that the company of receiving part 42 and chip 30 between receiving part 42 and chip 30
It connects more closely.Heat-conducting piece 50 is made of soft Heat Conduction Material, thus the setting of heat-conducting piece 50 receiving part 42 and chip 30 it
Between after by external force extruding can be generated deformation, two-sided seamless connects chip 30 and receiving part 42, so that chip 30 generates
Heat can be transferred to receiving part 42 faster and more.
Optionally, in an embodiment, heat-conducting piece 60 is at least one of estersil, silica gel or silicon chip, this does not do specifically
It limits.
By taking shell 10 is the center of mobile phone as an example, the battery compartment 14 for battery to be arranged, radiating area are provided on shell 10
For at least partly region of 14 position of battery compartment.Specifically, in an embodiment, battery compartment 14 includes orlop 142, by orlop 142
Remove a part away from battery side so that orlop 142 is made thinner, to form radiating area away from battery side in orlop 142.
Or orlop 142 removes a part of region and forms the straight slot 1422 (as shown in Figure 5) being interconnected with battery compartment 142, to be formed
Radiating area.One side battery only just will produce heat when charging, and the corresponding position of another aspect battery compartment has larger
Area, provide advantage to form larger radiating area.In the present embodiment, extension 44 is from receiving part 42 towards far from chip
30 directions extend to battery compartment 14 and deviate from battery side so that at least partly heat that chip 30 generates can be passed by heat pipe 40
14 corresponding position of battery compartment is passed, 30 position temperature of setting chip locally excessively high problem is improved.
Further, in an embodiment, the end of extension 44 includes extension 442 to increase heat pipe 40 in the face of radiating area
Product, so that heat being capable of the more uniform dispersedly radiating area at battery compartment 14.I.e. in the present embodiment in heat pipe 40
Between position be elongate in shape, the area at heat pipe both ends will be significantly greater than the area at 40 intermediate position of heat pipe.For example, the expansion of heat pipe 40
Exhibition portion 442 is sheet, or curves around structure, as shown in Figure 4.When optionally, extension 442 is sheet in an embodiment
Area is suitable with the area of orlop 142.Multiple straight slots 1422 are opened up in another embodiment in orlop 142 so that the formation of orlop 142
Engraved structure, as shown in figure 5, the extension 442 of heat pipe 40 forms corresponding with hollow out shape structure, and by extension 442
In straight slot 1422.
Further, in order to improve electronic device 200 during the use in charging, the heat transfer of the generation of chip 30
To battery, the case where causing battery overheat to reduce charging rate.Thermal insulation layer 70 is set between heat pipe 40 and battery, as shown in Figure 3.
Specific thermal insulation layer 70 is located at orlop 142 far from battery side, is located between extension 442 and orlop 142.Optionally, no
With in embodiment, thermal insulation layer 70 can be foam, mineral wool or high silica wool etc., this is not specifically limited.
In one embodiment, thermal insulation layer 70 is engraved structure.Made using such structure, when battery charges, battery
The heat of generation can also be radiated by the part of hollow out.
Referring to Fig. 6, in another embodiment, radiating area is the side of shell 10, specifically, shell is front housing or center.
Shell 10 is rectangle, has two longer sides 16, therefore the heat for generating chip 30 in the present embodiment passes through heat pipe 40
It is transferred to the side 16 of shell 10, and then improves 30 position temperature of setting chip locally excessively high problem.
Further, extension 44 include the changeover portion 444 of 10 side of shell is transitioned into from chip 30, and with shell 10
The contact-segment 446 of the fitting setting of side 16.So that the side that the heat that chip 30 generates passes through contact-segment 446 and shell 10
16 close contact is transferred to 10 side of shell, 16 position, the partial heat generated with dispersed chip 30.
In one embodiment, when the side of shell 10 16 and very close battery, exist to improve electronic device 200
In charging during use, the heat transfer that chip 30 generates causes battery overheat to reduce the feelings of charging rate to battery
Condition.Positioned at 16 position of the side of shell 10, thermal insulation layer 70 is set, specific thermal insulation layer 70 is strip between heat pipe 40 and battery
Shape, between contact-segment 446 and battery.
Referring to Fig. 7, SIM card area 18 is set for SIM card to be arranged in another embodiment, on shell 10.Specifically, SIM card
On circuit boards by deck (not shown) setting, and then by circuit board setting on the housing 10.Specifically, being provided with
The region of SIM card is SIM card area 18, and since SIM card not will produce heat in use, SIM card area is opposite to be set
The position for setting chip is low-temperature space.Ennation 44 extends to the region of setting SIM card towards separate 30 direction of chip in the present embodiment,
So that the partial heat that chip 30 generates can be transferred to SIM card area 18 and be disperseed.Optionally, the end of extension 44
Extension 442 is formed, extension 442 is bonded setting with SIM card or deck, to increase the area that heat pipe 40 is located at SIM card area,
And then allow more heats that can transmit sub- SIM card location.Specifically, extension 442 can be sheet or curve around knot
Structure or engraved structure, this is not specifically limited.
In other embodiment, radiating area can also be rear shell (not shown) or electronic device 200 other empty regions,
This is not specifically limited.
In one embodiment, in the case where spatial position allows, the extension 44 of heat pipe 40 can be simultaneously to shell 10
At least two regions extend in side 16, at least partly region of 14 position of battery compartment or SIM card area 18 etc..So that core
The heat that piece 30 generates can share heat by multiple and different regions simultaneously.
Electronic device 200 provided by the present application includes housing unit 100 described in any of the above embodiment.Difference is implemented
In example, which can be any one of multiple electronic equipments, and multiple electronic equipments include but not limited to honeycomb
Phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, music note
Record device, video recorder, camera, other medium recorders, radio, Medical Devices, calculator, programmable remote control, pager,
Netbook computer, personal digital assistant (PDA), portable media player (PMP), Motion Picture Experts Group (MPEG-1 or
MPEG-2) audio layer 3 (MP3) player, portable medical device and digital camera and combinations thereof.
With continued reference to Fig. 1-Fig. 3, in an embodiment, which further includes display screen 210, which sets
It is placed on shell 10, the interface that display screen 210 is interacted as electronic device 200 with user, for showing picture or video etc..
It should be understood that display screen 210 also will produce heat in use, in order to reduce heat transfer to electronic device 200
Front influences the touch sense of user.In the present embodiment, graphite linings 80 are also provided between display screen 210 and shell 10, the graphite
The heat that the setting of layer 80 enables to display screen 210 to generate radiates toward close to 10 side of shell as far as possible.
It should be understood that the area of graphite linings 80 can be big as the area of display screen 210, or only local location
Graphite linings 80 are set, this is not especially limited.Further, due to being difficult to ensure surface of the heat pipe 40 adjacent to 210 side of display screen
Flat even everywhere is possible to cause graphite linings 80 uneven if heat pipe 40 is in direct contact with graphite linings 80, and then having can
It can influence the display effect of display screen 210.Therefore, in the present embodiment, graphite linings 80 and the extension 44 of heat pipe 40 are spaced apart
Setting.Specifically, being to reserve a thin plate 90 on gapping interval setting or shell 10 by stone between graphite linings 80 and heat pipe 40
44 separation spacing of extension of layer of ink 80 and heat pipe 40 is arranged.
The housing unit 100 and electronic device 200 of the application replaces a part for shielding case 20 by heat pipe so that chip
30 heats generated directly can be quickly transferred on the receiving part 42 of heat pipe 40, and be transferred to not by the extension of heat pipe 40 44
Generation heat, or generation heat are fewer, or are conducive to the region of heat dissipation.So that heat caused by chip 30
It can be dispersed to low-temperature space, avoid setting 30 position temperature of chip locally excessively high.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the claims of the application, every to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field includes similarly in the scope of patent protection of the application.
Claims (15)
1. a kind of housing unit, which is characterized in that including：
Shell forms radiating area on the shell；
Shielding case is connected to by a circuit board on shell, and the shielding case includes multiple connecting plates, and multiple connecting plates enclose
If forming accommodating cavity；
Chip, the chip are set in the accommodating cavity；
Heat pipe, the heat pipe include receiving part and extension, and the receiving part is at least one piece of connecting plate in the shielding case,
The extension is at least partially disposed on the shell and extends to the radiating area towards far from the chip direction so that described
The heat that chip is sent out is transferred to the extension by the receiving part, and is transferred to the radiating area by the extension.
2. housing unit according to claim 1, which is characterized in that the receiving part is described in the shielding case is parallel to
The part of chip.
3. housing unit according to claim 1, which is characterized in that be arranged between the receiving part and the chip soft
Heat-conducting piece so that the connection of the receiving part and the chip is more closely.
4. housing unit according to claim 3, which is characterized in that the heat-conducting piece is in estersil, silica gel or silicon chip
At least one.
5. housing unit according to claim 1, which is characterized in that the radiating area is the side of shell；Or it is described
Battery compartment is set on shell, and the radiating area is at least partly region of the battery bin location；Or it is arranged on the shell
SIM card area, the radiating area are the SIM card area.
6. housing unit according to claim 5, which is characterized in that the radiating area is the SIM card area or the electricity
When at least partly region of pond bin location, the end of the extension includes extension, to increase the end position of the extension
In SIM card area or the area of battery compartment.
7. housing unit according to claim 6, which is characterized in that sheet is in the extension or curves around knot
Structure.
8. housing unit according to claim 5, which is characterized in that further include the battery being set on the shell, institute
State radiating area be battery compartment or shell side when, thermal insulation layer is set between the heat pipe and the battery.
9. housing unit according to claim 8, which is characterized in that the thermal insulation layer is engraved structure.
10. housing unit according to claim 5, which is characterized in that described to prolong when the radiating area is the side of shell
Extending portion includes the changeover portion being connect with chip and connect and be bonded on the side for being set to the shell with the changeover portion
Contact-segment.
11. housing unit according to claim 1, which is characterized in that all connecting plates in the shielding case are equal
For the receiving part of the heat pipe.
12. housing unit according to claim 1, which is characterized in that storage tank is opened up on the shell, the heat pipe
Extension is set in the storage tank.
13. a kind of electronic device, which is characterized in that including any one of the claim 1-12 housing units.
14. electronic device according to claim 13, which is characterized in that further include the display being set on the shell
Screen, graphite linings are provided between the display screen and the shell.
15. electronic device according to claim 14, which is characterized in that between the graphite linings and the extension of the heat pipe
Every separately positioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597758.6A CN108667991B (en) | 2018-06-11 | 2018-06-11 | Shell assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810597758.6A CN108667991B (en) | 2018-06-11 | 2018-06-11 | Shell assembly and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108667991A true CN108667991A (en) | 2018-10-16 |
| CN108667991B CN108667991B (en) | 2020-09-04 |
Family
ID=63775685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810597758.6A Active CN108667991B (en) | 2018-06-11 | 2018-06-11 | Shell assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108667991B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278688A (en) * | 2019-06-18 | 2019-09-24 | Oppo广东移动通信有限公司 | Housing unit and electronic equipment |
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| CN104582459A (en) * | 2013-10-25 | 2015-04-29 | 纬创资通股份有限公司 | Electronic device and electromagnetic wave shielding module thereof |
| JP2015088888A (en) * | 2013-10-30 | 2015-05-07 | キヤノン株式会社 | Heat radiation structure for imaging device |
| CN104813760A (en) * | 2014-03-18 | 2015-07-29 | 华为终端有限公司 | Heat radiation assembly and electric device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278688A (en) * | 2019-06-18 | 2019-09-24 | Oppo广东移动通信有限公司 | Housing unit and electronic equipment |
| CN110278688B (en) * | 2019-06-18 | 2020-07-24 | Oppo广东移动通信有限公司 | Shell assembly and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108667991B (en) | 2020-09-04 |
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