CN108646508B - Light emitting device and related projection system - Google Patents
Light emitting device and related projection system Download PDFInfo
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- CN108646508B CN108646508B CN201810408028.7A CN201810408028A CN108646508B CN 108646508 B CN108646508 B CN 108646508B CN 201810408028 A CN201810408028 A CN 201810408028A CN 108646508 B CN108646508 B CN 108646508B
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Abstract
The embodiment of the invention discloses a light-emitting device and a projection device, comprising: an excitation light source that generates excitation light; a wavelength conversion device including a wavelength conversion layer that absorbs the excitation light and emits the excited light; the driving device drives the wavelength conversion layer to rotate periodically, so that light spots incident on the wavelength conversion layer move along a preset circular track, and the linear velocity of at least partial area of the wavelength conversion device is greater than or equal to 75 m/s; the sealing device comprises a light-transmitting area and a heat-conducting area, the wavelength conversion device is arranged in the sealing device, the light-transmitting area transmits emergent light of the wavelength conversion device, the distance between the heat-conducting area and the light emergent surface of the wavelength conversion device or the surface opposite to the light emergent surface is smaller than or equal to 1 millimeter, heat is conducted to the outside of the sealing device, and the area of the heat-conducting area is larger than or equal to the area of an incident light spot of exciting light. The embodiment of the invention provides a light-emitting device and a related projection system which take account of dust prevention and effectively reduce the working temperature of a wavelength conversion device.
Description
The present application is a divisional application with application numbers 201210558409.6 filed on 12/20/2012 of the applicant, and with application numbers 12/20/2012 of the applicant, entitled "light emitting device and related projection system".
Technical Field
The present invention relates to the field of illumination and display technologies, and in particular, to a light emitting device and a related projection system.
Background
The use of colored light generated by exciting phosphors as a light source is a widely used solution in the fields of projection displays and the like. Generally, fluorescent powder is arranged on a color wheel rotating at a high speed, exciting light such as laser enters the color wheel and excites the fluorescent powder to generate excited light and simultaneously generate a large amount of heat, the high-speed rotation of the color wheel is used for enabling the fluorescent powder in different areas to be in irradiation of the exciting light in turn, and the different areas can share the heat, so that the temperature of the color wheel is reduced.
Since the conversion efficiency of the phosphor to the excitation light is not 100%, the phosphor generates a large amount of heat, and the heat dissipation of the color wheel is mainly achieved by the heat convection between the color wheel and the air. Although the color wheel exposed to the air can conduct heat to the air to lower the working temperature, because of the existence of a large amount of dust particles in the air, when the dust particles adhere to the surface of the color wheel, a large amount of heat is accumulated around the dust particles, which may cause the temperature of the color wheel to rise sharply, even burn out the color wheel.
Disclosure of Invention
The invention mainly solves the technical problem of providing a light-emitting device and a related projection system which can prevent dust of a wavelength conversion device and effectively reduce the working temperature of the wavelength conversion device.
An embodiment of the present invention provides a light emitting device, including:
an excitation light source for generating excitation light;
a wavelength conversion device including a wavelength conversion layer for absorbing the excitation light and emitting the excited light;
the driving device is used for driving the wavelength conversion layer to rotate periodically, so that a light spot of exciting light incident on the wavelength conversion layer moves periodically along a preset circular track, and the linear velocity of at least part of the region of the wavelength conversion device is greater than or equal to 75 m/s;
the sealing device comprises a light transmitting area and a heat conducting area, the light transmitting area is used for transmitting light emitted to the light transmitting area from the wavelength conversion device, the distance between the heat conducting area and the light emitting surface of the wavelength conversion device or the surface opposite to the light emitting surface is smaller than or equal to 1 mm, the heat conducting area is used for conducting heat transmitted to the heat conducting area by the wavelength conversion device to the outside of the sealing device, and the area of the heat conducting area is larger than or equal to the area of light spots of the wavelength conversion layer incident to exciting light.
Preferably, the heat conducting area is located on the sealing means opposite to the light spot.
Preferably, the area of the heat conducting area is equal to the area of the surface of the wavelength converting device close to the heat conducting area.
Preferably, the drive means is fixed to the side wall of the sealing means.
Preferably, the wavelength conversion device further comprises a substrate for carrying the wavelength conversion layer, the substrate being located on a side of the wavelength conversion layer close to the heat conducting area.
Preferably, the thermal conductivity of the substrate is greater than the thermal conductivity of the wavelength conversion layer.
Preferably, a reflective layer is provided on the substrate of the wavelength conversion device, the reflective layer reflecting light incident on the reflective layer to the light exit face of the wavelength conversion device.
Preferably, the light-emitting device further comprises a heat dissipation device for accelerating heat transfer from the heat conduction area to the outside air.
The invention also provides a projection system comprising the light-emitting device.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
in the embodiment of the invention, the wavelength conversion device is positioned in the sealing device, so that the wavelength conversion device cannot be attached by dust. When the distance between the light emitting surface of the wavelength conversion device or the surface opposite to the light emitting surface and the heat conducting area is less than or equal to 1 mm, and the linear velocity of at least one part of area on the wavelength conversion layer is more than or equal to 75 m/s, the at least one part of area can generate a larger shearing force to the air layer between the wavelength conversion device and the sealing device, so that the air in the thinner air layer generates disturbance, the thermal resistance of the air layer is rapidly reduced relative to the thermal resistance of the air layer when the air layer is static, the heat of the wavelength conversion device can be rapidly conducted to the heat conducting area of the sealing device through the air layer, and the heat is led out of the sealing device through the heat conducting area, so that the working temperature of the wavelength conversion device is effectively reduced, and both dust prevention and effective reduction of the working temperature of the.
Drawings
FIG. 1 is a schematic structural diagram of a light-emitting device according to an embodiment of the present invention;
FIG. 2 is a view of the embodiment of FIG. 1 between the wavelength conversion device and the thermally conductive region of the encapsulant
A relationship diagram of the thermal resistance and the distance between the thermal resistance and the thermal resistance;
FIG. 3 is a schematic structural diagram of a light-emitting device according to another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a light-emitting device according to another embodiment of the present invention;
fig. 5 is a schematic structural diagram of a light-emitting device according to still another embodiment of the invention.
Detailed Description
The following describes an embodiment of the present invention with reference to the drawings and embodiments.
The first embodiment is as follows:
fig. 1 is a schematic structural diagram of a light emitting device according to an embodiment of the present invention, and as shown in fig. 1, the light emitting device includes an excitation light source 110, a wavelength conversion device 120, a driving device 130, and a sealing device 140.
The excitation light source 110 is specifically a laser light source that can generate laser light as excitation light for exciting the wavelength conversion material. Of course, in other embodiments of the present invention, the excitation light source 110 may also be an LED light source or the like.
The wavelength conversion device 120 includes a wavelength conversion layer 121. The wavelength conversion layer 121 is provided with a wavelength conversion material that can absorb the excitation light emitted from the light source 110 and emit the excited light. The wavelength conversion material in this embodiment is specifically a phosphor, and in other embodiments of the present invention, the wavelength conversion material may also be a material having wavelength conversion capability, such as a quantum dot, a fluorescent dye, and the like, and is not limited to a phosphor.
The driving device 130 may drive the wavelength conversion device 120 to rotate periodically, so that the light spot of the excitation light incident on the wavelength conversion layer moves periodically along a predetermined circular trajectory, so that each part of the circular trajectory can share the heat. Preferably, the wavelength conversion device 120 has a disk shape, the wavelength conversion layer 121 has a ring shape concentric with the disk, the driving device 130 is a motor having a cylindrical shape, and the driving device 130 is fixed coaxially with the wavelength conversion device 120.
In order to protect the wavelength conversion device 120 from dust, the wavelength conversion device 120 is disposed in a sealing device 140, and the sealing device 140 includes a heat conducting region 141, a light transmitting region 142, and a light incident region 143.
In this embodiment, the light-transmitting region 142 is a transparent region provided on the sidewall of the sealing device 140, and the transparent region can transmit light emitted from the wavelength conversion device 120 to the light-transmitting region 142. Specifically, the light-transmitting region 142 is provided with a transparent material such as glass or PMMA (polymethyl methacrylate). In other embodiments of the present invention, the light-transmitting region 142 may also be provided with a filter, and at the same time, the light with different wavelengths in the emergent light of the wavelength conversion device is selectively filtered. Similarly, the light incident region 143 is also a transparent region provided on the side wall of the sealing device, and is different from the light transmitting region 142 in that the light incident region 143 is provided on the optical path between the excitation light source 110 and the wavelength conversion device 140, and can transmit the outgoing light of the excitation light source 110.
As is well known to those skilled in the art, absorption of excitation light by the wavelength converting material of the wavelength conversion device generates a large amount of heat, and the heat of the wavelength conversion device is first conducted to the air in the sealing device, then the air in the sealing device 140 is conducted to the sealing device 140, and finally the heat is dissipated to the outside air by the sealing device 140. The thinner the air layer between the wavelength conversion device 120 and the sealing device 140 is, the smaller the thermal resistance is, and the linear relationship between the thermal resistance and the thickness of the air layer is, and thus the smaller the distance between the wavelength conversion device 120 and the sealing device 140 is, the smaller the thermal resistance between them is, which is linear relationship with the distance. But even if the distance between the wavelength conversion device 120 and the sealing device 140 is small, the thermal resistance of the air layer is still large.
Here, the heat dissipation of the wavelength conversion device 120 in the sealing device 140 was investigated through experiments. According to experiments, when the rotation speed of the wavelength conversion device 120 is set to 6000 rpm, the diameter of the wavelength conversion device is equal to 30 cm, and for better heat dissipation, the other regions of the outer wall of the sealing device 140 except for the light incident region 143 and the light transmission region 142 are made of metal materials to serve as the heat conduction regions 141, and the relationship between the thermal resistance between the wavelength conversion device 120 and the heat conduction regions 141 of the sealing device 140 and the distance between the two is as shown in fig. 2, when the distance between the wavelength conversion device 120 and the heat conduction regions 141 of the sealing device 140 is greater than 1 mm, the thermal resistance between the two is substantially linear with the distance, and the smaller the distance, the smaller the thermal resistance between the wavelength conversion device 120 and the heat conduction regions 141 of the sealing device 140; when the distance between the wavelength conversion device 120 and the heat conduction region 141 of the sealing device 140 is 1 mm or less, the thermal resistance between the two is no longer linear with the distance but sharply decreases as the distance decreases, which is different from the prior knowledge.
It has been found experimentally that when the distance between the wavelength conversion device 120 and the heat conducting area 141 of the sealing device 140 is reduced to less than 1 mm, the heat conduction manner of the air layer between the two changes: the air in the air layer creates a disturbance resulting in a sharp drop in thermal resistance and no longer merely transfers heat by thermal convection, which is caused by the shear force generated by the wavelength conversion device 120 rotating at high speed to the air layer.
In the present embodiment, the diameter of the wavelength conversion device is 30 cm and the rotation speed is 6000 rpm, and the rotation speed of the outermost region of the wavelength conversion device 120 is 188 m/s, but a series of experiments by changing the diameter and the rotation speed of the wavelength conversion device 120 have found that the effect of greatly reducing the thermal resistance of the air layer between the wavelength conversion device 120 and the sealing device 140 can be achieved only by setting the linear velocity of a partial region of the wavelength conversion device 120 to 75 m/s and setting the distance between the wavelength conversion device 120 and the heat conduction region 141 to 1 mm or less.
In the above experiment, the region of the sealing device 140 except for the light incident region 143 and the light transmitting region 142 was set as the metal material as the heat conducting region 141, and through the experiment, while keeping other conditions unchanged, only the area and the position of the heat conducting region were changed, it was found that it is effective to set the heat conducting material only in the region of the inner surface of the sealing device 140 opposed to the wavelength conversion device 120. Further reduce the area discovery of heat conduction district, only need set up one and wavelength conversion device 120 relative heat conduction district, and guarantee the area of this heat conduction district area more than or equal to wavelength conversion device's incident facula area, satisfy the linear velocity of partial region of wavelength conversion device simultaneously and reach 75 meters per second, and the distance between wavelength conversion device 120 and the heat conduction district is less than or equal to 1 millimeter, just can realize good heat dissipation, thereby can effectively reduce wavelength conversion device 120's operating temperature, in order to realize giving consideration to dustproof and effectively reduce wavelength conversion device 120's operating temperature.
The metal material of the heat conducting area 141 in this embodiment is specifically an aluminum plate, which is a high heat conducting material and has good heat conducting capability. The heat conducting area 141 may conduct heat transferred from the wavelength conversion device 120 to the heat conducting area 141 to the outside of the sealing device 140. In other embodiments of the present invention, the heat conducting area 141 may be provided with a metal heat conducting material such as copper and silver, a ceramic heat conducting material such as alumina, aluminum nitride, gallium nitride and diamond film, and a cooling device such as a semiconductor refrigerator, which all can perform a heat transferring function.
It is to be noted that the light emitting surface of the wavelength conversion device 120 and the heat conduction region 141 are arranged in parallel in this embodiment, but due to error and the like, they may not be completely parallel, as long as the maximum distance between them is ensured to be less than or equal to 1 mm. The light emitting surface here refers to a surface of the wavelength conversion device 120 for emitting the stimulated light or the mixed light of the stimulated light and the excitation light, and specifically, the surface of the wavelength conversion layer 121 close to the heat conduction region 141 in the present embodiment. Of course, it is easily understood that the closer the light emitting surface of the wavelength conversion device 120 and the heat conducting area 141 are parallel, the smaller the distance therebetween can be set, which is more advantageous for heat dissipation.
In this embodiment, the driving device 130 is preferably a hydraulic bearing motor, which has the advantages of long service life and low noise, and more importantly, the hydraulic bearing motor has good rotational stability, so that the distance between the light emitting surface and the heat conducting area of the wavelength conversion device can be closer.
In this embodiment, the wavelength conversion device 120 further includes a substrate 122, and the substrate 122 is transparent glass and can support the wavelength conversion layer 121. Preferably, a filter film is disposed on the surface of the substrate 122, and the filter film can transmit the excitation light and reflect the stimulated light, so as to improve the utilization rate of the stimulated light; furthermore, the filter film can transmit the exciting light with small angle incidence and reflect the exciting light and the exciting light with large angle incidence, and the utilization rate of the exciting light and the stimulated light can be improved simultaneously. However, in the case where the wavelength conversion layer itself is rigid enough (for example, the wavelength conversion layer is formed by doping a phosphor in a transparent glass), the substrate may be omitted, and the filter may be plated on the surface of the wavelength conversion layer, and the same effect may be obtained.
In this embodiment, the heat conducting area 141 is disposed on the sealing device 140 away from the excitation light spot, but when the heat conducting area 141 is made of transparent heat conducting material such as sapphire, gallium nitride, diamond film, etc., the heat conducting area 141 may be disposed at the position of the light transmitting area 142, and the light transmitting area and the heat conducting area are combined into one area.
Example two
Fig. 3 is a schematic structural diagram of a light-emitting device according to another embodiment of the present invention, and as shown in fig. 3, the light-emitting device includes an excitation light source 210, a wavelength conversion device 220, a driving device 230, and a sealing device 240. The wavelength conversion device 220 includes a wavelength conversion layer 221 and a substrate 222. The sealing device 240 includes a heat conducting area 241 and a light transmitting area 242.
The light-emitting device of the present embodiment is different from the light-emitting device shown in fig. 1 in that:
(1) the area of the heat conducting area 241 in this embodiment is small, and the area is equal to the area of the light spot, so that the heat conduction to the wavelength conversion device 220 can still be ensured, and meanwhile, the flatness of the heat conducting area 241 is high because only the surface of the heat conducting area 241 needs to be processed, and other areas of the sealing device 240 do not need, so that the cost of the sealing device 240 can be reduced.
(2) The excitation light source 210 in this embodiment is disposed inside the sealing device 240, the sealing device 240 can prevent dust from entering the light source, and the sealing device 240 does not need to be disposed in the light entrance area. It will be readily appreciated that other elements may also be provided within the sealing device 240.
(3) In this embodiment, the light-transmitting region 242 of the light-emitting device is a lens. Since the emergent light of the wavelength conversion materials such as the fluorescent powder is full-angle light, a lens is required to be arranged for collection so as to reduce the divergence angle of the emergent light. In order to improve the collecting effect of the lens 242, the lens 242 needs to be relatively close to the wavelength conversion layer, so the lens 242 is disposed in the sealing device 240 and is used for collecting the emergent light of the wavelength conversion device 220, and at this time, the lens 242 can be disposed at a position close to the wavelength conversion device 220 and is easy to fix.
EXAMPLE III
Fig. 4 is a schematic structural diagram of a light-emitting device according to another embodiment of the present invention, and as shown in fig. 4, the light-emitting device includes an excitation light source 310, a wavelength conversion device 320, a driving device 330, and a sealing device 340. The wavelength conversion device 320 includes a wavelength conversion layer 321 and a substrate 322. The sealing device 340 includes a heat conductive area 341 and a light transmissive area 342.
The light-emitting device in this embodiment is different from the light-emitting device shown in fig. 1 in that:
(1) the wavelength conversion device 320 is a reflective color wheel, and a reflective layer is disposed on a surface of the substrate 322, and the reflective layer is disposed on a surface of the substrate 322 close to the wavelength conversion layer 321 and can reflect the emergent light incident on the reflective layer. The excitation light is transmitted from the light-transmitting region 342 to the wavelength conversion device 320, and the exit light of the wavelength conversion device 320 is also transmitted from the light-transmitting region 342 out of the sealing device 340. Since the wavelength conversion layer 321 and the substrate 322 are in close contact, the heat of the wavelength conversion layer 321 can be easily conducted to the substrate 322, and the light emitting surface of the wavelength conversion layer 321 and the surface of the substrate 322 far from the wavelength conversion layer 321 are very close in temperature, so in this embodiment, when the surface of the substrate 322 far from the wavelength conversion layer, that is, the surface of the wavelength conversion device 320 opposite to the light emitting surface, is less than or equal to 1 mm away from the heat conduction region 341, the operating temperature of the wavelength conversion device 320 can be effectively reduced.
In this embodiment, the substrate 322 of the wavelength conversion device 320 is adjacent to the heat conducting area 341 of the sealing device 340. The substrate can have a higher surface flatness than a wavelength conversion material such as phosphor, and thus the distance between the substrate 322 and the heat conductive region 341 can be smaller. Preferably, the substrate material has a higher thermal conductivity than the wavelength converting material, in which case the heat of the wavelength converting device 320 is more easily conducted to the heat conducting area 341. For example, the substrate 322 is a metal material, and the metal has a high thermal conductivity, and is easy to machine and can obtain a high surface flatness.
The substrate 322 may be a hard material having a highly reflective surface, such as a highly reflective aluminum plate, and in this case, the reflective layer and the other part of the substrate may be regarded as a single body. In order to distinguish the optical paths of the excitation light and the light emitted from the wavelength conversion device, the light emitting device is further provided with a filter 350 for light splitting.
(2) The position of the heat conducting area 341 can be more optimized for the reflective wavelength conversion device. In this embodiment, the thermal conduction region 341 is disposed on the surface of the sealing device 340 close to the substrate 322, and is located at a position opposite to the excitation light spot on the wavelength conversion layer. It is clear that the region of the wavelength conversion device 320 where the temperature is highest is the region where the spot of excitation light is located, and therefore the location of the heat conduction region 341 here allows heat to be conducted more quickly from the wavelength conversion device 320 to the heat conduction region 341. Of course, in the first embodiment mentioned above, the heat conducting area 341 can be made of transparent heat conducting material, and can also be located at the position of the side wall of the sealing device opposite to the excitation light spot, and can also radiate heat more effectively, but the cost of the transparent heat conducting material is undoubtedly higher than that of the general heat conducting material.
(3) In this embodiment, the driving device 330 is fixed on the sidewall of the sealing device 340. This manner of attachment more readily enables a smaller air gap between the wavelength conversion device 320 and the thermally conductive region 341. If the driver and the seal are not relatively fixed, such as the driver shown in fig. 1, precise adjustments are typically required to bring the wavelength conversion device into close proximity with the seal during assembly. While relatively fixed, it is easier to ensure a small air gap between the two directly through the precision of the mechanical parts.
Example four
Fig. 5 is a schematic structural diagram of a light-emitting device according to another embodiment of the invention, and as shown in fig. 5, the light-emitting device includes an excitation light source 410, a wavelength conversion device 420, a driving device 430, a sealing device 440, and a filter 470. The wavelength conversion device 420 includes a wavelength conversion layer 421 and a substrate 422. The sealing device 440 includes a heat conductive region 441 and a light transmissive region 442.
The light-emitting device of the present embodiment is different from the light-emitting device shown in fig. 4 in that:
(1) the area of the heat conduction region 441 in this embodiment is larger than the area of the excitation light spot incident to the wavelength conversion layer, and is close to the area of the substrate 422. It will be readily appreciated that the larger the area of the heat transfer area 441, the greater the heat transfer capability. In consideration of both the material cost and the heat conduction capability of the heat conduction region 441, the area of the heat conduction region 441 is equal to the area of the surface of the wavelength conversion device 420 close to the heat conduction region 441, specifically, in the embodiment, the area of the heat conduction region 441 is equal to the area of the substrate 422.
(2) In this embodiment, the light emitting device further comprises a heat sink 450, wherein the heat sink 450 abuts against a first outer surface, which is an outer surface of the sidewall of the sealing device where the heat conducting area 441 is located. The heat dissipation device 450 is embodied as a heat sink, and includes heat dissipation fins and a heat pipe connecting the heat dissipation fins and the first outer surface, and in fact, the heat pipe is indirectly connected to the heat conduction region 441, so as to accelerate the heat transfer of the heat conduction region 441, and thus indirectly accelerate the heat transfer of the wavelength conversion device 420. Further, the light emitting device may further include a fan 460, and the fan 460 is also disposed on the first outer surface of the sealing device 440 and may blow air against the heat sink to accelerate heat dissipation of the heat sink. Of course, the heat dissipation fins and the fan 460 may be disposed on other surfaces instead of the first outer surface, and may also serve to accelerate the heat dissipation of the heat conduction region 441.
On the other hand, since the driving device 430 is fixedly connected to the wavelength conversion device 420, heat of the wavelength conversion device 420 is conducted to the driving device 430, and the temperature of the driving device 430 is also high. Here, the driving device 430 is fixed on the sidewall where the heat conducting area is located, and the protruding portion on the first outer surface generates heat convection to the surrounding heat dissipating fins to accelerate the heat dissipation of the driving device 430. Further, the non-rotating part of the driving device 430 may contact the heat dissipation fins, so that the heat dissipation of the driving device 430 is faster. Similarly, the fan 460 disposed on the first outer surface can also accelerate the heat dissipation of the driving device 430.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The embodiment of the invention also provides a projection system, which comprises a light-emitting device, wherein the light-emitting device can have the structure and the function in the embodiments. The projection system may employ various projection technologies, such as Liquid Crystal Display (LCD) projection technology, Digital Light Processor (DLP) projection technology.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A light-emitting device, comprising:
an excitation light source for generating excitation light;
the wavelength conversion device comprises a wavelength conversion layer, and the wavelength conversion layer is used for absorbing the exciting light and emitting excited light;
the driving device is used for driving the wavelength conversion device to rotate periodically;
a sealing device including a light-transmitting area and a heat-conducting area, the wavelength conversion device and the excitation light source being disposed in the sealing device, the light-transmitting area being configured to transmit light emitted from the wavelength conversion device to the light-transmitting area, the heat-conducting area being configured to conduct heat transferred from the wavelength conversion device to the heat-conducting area to the outside of the sealing device;
the distance between the heat conduction area and the light emitting surface of the wavelength conversion device or the surface opposite to the light emitting surface is smaller than or equal to 1 mm, and the linear velocity of at least partial area of the wavelength conversion device is larger than or equal to 75 m/s, so that the thermal resistance between the heat conduction area and the light emitting surface of the wavelength conversion device or the surface opposite to the light emitting surface is reduced in a parabolic manner.
2. The lighting device of claim 1, wherein: the light emitting surface of the wavelength conversion device is parallel to the heat conducting area.
3. The lighting device of claim 1, wherein: the driving device is fixed on the wavelength conversion device and is positioned in the sealing device; or
The driving device is fixed on the side wall of the sealing device.
4. The lighting device of claim 1, wherein: the wavelength conversion device is provided with a filter film, and the filter film is used for transmitting the exciting light and reflecting the stimulated light.
5. The lighting device of claim 1, wherein: the wavelength conversion device further comprises a substrate, the substrate is used for bearing the wavelength conversion layer, and the substrate is located on one side, close to the heat conduction area, of the wavelength conversion layer.
6. The light-emitting device according to claim 5, wherein: a reflective layer is disposed on a substrate of the wavelength conversion device, the reflective layer reflecting light incident on the reflective layer to a light exit surface of the wavelength conversion device.
7. The lighting device of claim 1, wherein: the light-emitting device further comprises a heat dissipation device, and the heat dissipation device is used for accelerating the heat transfer of the heat conduction area to the outside air.
8. The lighting device according to claim 7, wherein: the heat dissipation device is a radiator, the radiator comprises heat dissipation fins and a heat pipe connecting the heat dissipation fins and a first outer surface, and the first outer surface is the outer surface of the side wall of the sealing device where the heat conduction area is located.
9. A projection system comprising a light-emitting device according to any one of claims 1 to 8.
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| CN201810408028.7A CN108646508B (en) | 2012-12-20 | 2012-12-20 | Light emitting device and related projection system |
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| CN201810408028.7A CN108646508B (en) | 2012-12-20 | 2012-12-20 | Light emitting device and related projection system |
| CN201210558409.6A CN103885274B (en) | 2012-12-20 | 2012-12-20 | Light-emitting device and relevant projecting system |
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Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9897795B2 (en) | 2014-12-08 | 2018-02-20 | Delta Electronics, Inc. | Color wheel device |
| TWI576650B (en) * | 2014-12-08 | 2017-04-01 | 台達電子工業股份有限公司 | Color wheel device |
| CN106054510A (en) * | 2015-01-31 | 2016-10-26 | 杨毅 | Wavelength conversion device and light-emitting device |
| CN106324956A (en) * | 2015-06-30 | 2017-01-11 | 海信集团有限公司 | Laser light source heat dissipation system and laser projection system |
| CN105068367B (en) * | 2015-08-04 | 2017-08-29 | 杨毅 | Light-emitting device, projection display equipment and light fixture |
| CN106444241A (en) | 2015-08-04 | 2017-02-22 | 海信集团有限公司 | Laser light source and laser projection display device |
| CN106444239A (en) * | 2015-08-04 | 2017-02-22 | 杨毅 | Illuminating device, lighting fitting, projection display device |
| CN105301750B (en) * | 2015-10-12 | 2018-12-25 | 杨毅 | Optics module, light emitting device and projection display equipment |
| CN105301881B (en) * | 2015-10-12 | 2017-11-07 | 杨毅 | Light-emitting device and projection display equipment |
| CN106597785B (en) * | 2015-10-14 | 2019-02-22 | 海信集团有限公司 | A kind of fluorescent wheel and two-color laser light source |
| JP6888381B2 (en) * | 2017-04-06 | 2021-06-16 | セイコーエプソン株式会社 | Light source device and projector |
| WO2019035307A1 (en) * | 2017-08-17 | 2019-02-21 | ソニー株式会社 | Light source device and projection type display device |
| CN110376728B (en) | 2018-04-12 | 2022-03-15 | 深圳光峰科技股份有限公司 | Color wheel assembly, light source system and projection equipment |
| CN112666780B (en) | 2019-10-15 | 2022-06-24 | 台达电子工业股份有限公司 | Wavelength conversion device |
| US11753999B2 (en) | 2021-06-17 | 2023-09-12 | General Electric Company | Gas turbine sensor assembly and associated shutter mechanism |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1725100A (en) * | 2004-07-19 | 2006-01-25 | 精碟科技股份有限公司 | Color wheel set |
| WO2010116444A1 (en) * | 2009-03-30 | 2010-10-14 | Ｎｅｃディスプレイソリューションズ株式会社 | Projection type display device |
| CN102305386A (en) * | 2008-01-29 | 2012-01-04 | 绎立锐光科技开发(深圳)有限公司 | Light source structure and method for improving light conversion efficiency based on fluorescent powder |
| CN102455580A (en) * | 2010-10-21 | 2012-05-16 | 中强光电股份有限公司 | Cooling module for optical projection system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4022344B2 (en) * | 1999-09-27 | 2007-12-19 | 株式会社日立製作所 | Rotating color filter unit and projection system using the same |
| US6755554B2 (en) * | 2000-05-25 | 2004-06-29 | Matsushita Electric Industrial Co., Ltd. | Color wheel assembly and color sequential display device using the same, color wheel unit and color sequential display device using the same, and color sequential display device |
| CN2812047Y (en) * | 2005-03-31 | 2006-08-30 | 联想(北京)有限公司 | Dust-proof protector for color wheel of projector |
| JP2008052176A (en) * | 2006-08-28 | 2008-03-06 | Minebea Co Ltd | Color wheel unit |
| JP2008225407A (en) * | 2007-03-16 | 2008-09-25 | Seiko Epson Corp | Projector |
| CN202549931U (en) * | 2011-11-25 | 2012-11-21 | 深圳市光峰光电技术有限公司 | Wavelength conversion device and light emitting device |
-
2012
- 2012-12-20 CN CN201810408028.7A patent/CN108646508B/en active Active
- 2012-12-20 CN CN201210558409.6A patent/CN103885274B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1725100A (en) * | 2004-07-19 | 2006-01-25 | 精碟科技股份有限公司 | Color wheel set |
| CN102305386A (en) * | 2008-01-29 | 2012-01-04 | 绎立锐光科技开发(深圳)有限公司 | Light source structure and method for improving light conversion efficiency based on fluorescent powder |
| WO2010116444A1 (en) * | 2009-03-30 | 2010-10-14 | Ｎｅｃディスプレイソリューションズ株式会社 | Projection type display device |
| CN102455580A (en) * | 2010-10-21 | 2012-05-16 | 中强光电股份有限公司 | Cooling module for optical projection system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103885274B (en) | 2018-05-15 |
| CN103885274A (en) | 2014-06-25 |
| CN108646508A (en) | 2018-10-12 |
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