CN108602127A - The manufacturing method of the porous composite component of copper porous body, copper, the manufacturing method of copper porous body and the porous composite component of copper - Google Patents
The manufacturing method of the porous composite component of copper porous body, copper, the manufacturing method of copper porous body and the porous composite component of copper Download PDFInfo
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- CN108602127A CN108602127A CN201780008127.XA CN201780008127A CN108602127A CN 108602127 A CN108602127 A CN 108602127A CN 201780008127 A CN201780008127 A CN 201780008127A CN 108602127 A CN108602127 A CN 108602127A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1103—Making porous workpieces or articles with particular physical characteristics
- B22F3/1112—Making porous workpieces or articles with particular physical characteristics comprising hollow spheres or hollow fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1143—Making porous workpieces or articles involving an oxidation, reduction or reaction step
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/23—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces involving a self-propagating high-temperature synthesis or reaction sintering step
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/062—Fibrous particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2301/00—Metallic composition of the powder or its coating
- B22F2301/10—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/08—Alloys with open or closed pores
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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Abstract
The copper porous body of the present invention is the copper porous body in the skeleton portion with tridimensional network, the copper porous body is characterized in that, the porosity is located in 50% or more and 90% or less range, and the conductivity of the copper porous body determined by four-terminal method divided by the apparent density of the copper porous body standardize conductivity σ than carrying out the defined porosityNIt is set as 20%IACS or more.
Description
Technical field
Engaged with article body the present invention relates to a kind of copper porous body being made of copper or copper alloy and the copper porous body and
At the porous composite component of copper, the manufacturing method of copper porous body and the manufacturing method of the porous composite component of copper.
This application claims based on April 27th, 2016 in the priority of the patent application 2016-089358 of Japanese publication,
And its content is applied at this.
Background technology
Above-mentioned copper porous body and the porous composite component of copper are used for example as the electrode in various batteries and collector, heat exchanger
With component, heat pipe etc..
For example, in patent document 1, the system as the metal sinter (copper porous sintered body) in tridimensional network body
Method is made, the method using following formed body is disclosed：Adhesive is coated on and is made of the material of burn off by heating
Tridimensional network body is (for example, polyurethane foam, polyethylene etc. have the synthetic resin foaming body, natural of continuous air bubbles
Fiber cloth, Artificial Fibers cloth etc.) skeleton, and the formed body for being stained with metal powder or burn off by by by heating
Material constitute and can be formed incorporation metal powder in the material (for example, paper pulp, wool fiber) of tridimensional network body and
The sheet-like formed body etc. obtained.
Also, it discloses obtain porous material by carrying out electrified regulation to copper fiber under elevated pressure in patent document 2
The method of material.
Patent document 1：Japanese Unexamined Patent Publication 08-145592 bulletins
Patent document 2：No. 3735712 bulletins of Japanese Patent No.
However, in above-mentioned copper porous body, other than with high porosity and open-celled structure, it is used as electrode and collector
Excellent electric conductivity is also required when equal conductive components, is required when as conducting-heat elements such as heat exchanger component, heat pipes excellent
Thermal conductivity.
In patent document 1 and patent document 2 in recorded copper porous body, electric conductivity and thermal conductivity are not considered, especially
When the porosity is high, copper powder or the mutual engagement of copper fiber are insufficient, as a result, electric conductivity and thermal conductivity may be insufficient.
Invention content
The present invention is to complete situation as described above as background, its purpose is to provide a kind of copper porous body,
The porous composite component of copper, the manufacturing method of copper porous body and the porous composite part of copper made of the copper porous body is engaged with article body
The manufacturing method of part, even if the copper porous body is in the case of porosity height, it may have enough electric conductivity and thermal conductivity, especially
It is suitable as conductive component and conducting-heat elements.
In order to solve this problem and realize the purpose, the copper porous body of the mode as the present invention is with three-dimensional
The copper porous body in the skeleton portion of reticular structure, the copper porous body are characterized in that the porosity is 50% or more and 90% or less
In the range of, the conductivity of the copper porous body determined by four-terminal method divided by the apparent density ratio of the copper porous body
The porosity as defined in coming standardizes conductivity σNFor 20%IACS or more.
According to the copper porous body of the structure, even if the case where in the range that the porosity is up to 50% or more and 90% or less
Under, since the conductivity of the copper porous body divided by the apparent density ratio of the copper porous body that are determined by four-terminal method are come
The defined porosity standardizes conductivity σNIt is set as 20%IACS or more, therefore excellent electric conductivity, is particularly suited for conductive component.And
And it about heat conduction, is undertaken by free electron in the same manner as conduction, thereby, it is ensured that also assuring thermal conductivity while electric conductivity.As a result,
The thermal conductivity of the copper porous body of the present invention is also excellent, is particularly suited for conducting-heat elements.
Here, in the copper porous body as the mode of the present invention, preferably formed on the surface in the skeleton portion aerobic
Change reduction zone.
In this case, it is formed with redox layer on the surface in the skeleton portion, therefore is formed concave-convex on surface and is compared
Surface area becomes larger, such as can greatly improve via various characteristics such as the heat exchanger effectiveness on porous body skeleton surface.Also, pass through
Redox processing is carried out, porosity standardization conductivity σ can be further increasedN。
Also, in the copper porous body as the mode of the present invention, the skeleton portion can be by copper or copper alloy structure
At copper powders and at least one of copper fiber or two kinds of sintered body.
In this case, it by adjusting the filling rate of the copper powders and copper fiber that are made of copper or copper alloy, can obtain
Copper porous body of the porosity in 50% or more and 90% or less range.
Moreover, in the copper porous body as the mode of the present invention, the diameter R of the preferably described copper fiber 0.02mm with
In the upper and range of 1.0mm or less, and the ratio between length L and diameter R L/R are in 4 or more and 2500 or less range.
In this case, the diameter R of copper fiber is in the range of 0.02mm or more and 1.0mm or less, and length L and diameter
The ratio between R L/R can ensure sufficient gap in 4 or more and 2500 or less range between copper fiber, and
Inhibit shrinking percentage when sintering, the porosity can be made to get higher, and dimensional accuracy is excellent.
Also, in the copper porous body as the mode of the present invention, preferably in the copper powders and copper fiber extremely
Few one or two kinds of engaging portion, is formed in the redox layer combination integral with one another on surface each other.
In this case, at least one of the copper powders and copper fiber or two kinds of engaging portion, redox
Layer combination integral with one another, thus bond strength is excellent.Also, copper fiber and copper powders are bonded to each other strongly, additionally it is possible to be improved
Electric conductivity, thermal conductivity.
The porous composite component of copper of a mode as the present invention is characterized in that be made of conjugant, which is
The conjugant of article body and above-mentioned copper porous body.
According to the porous composite component of the copper of the structure, it is set as the copper porous body and article body of electric conductivity and excellent thermal conductivity
Conjugant, thus be used as the porous composite component of copper, excellent electric conductivity and thermal conductivity can be played.
Here, as the present invention a mode the porous composite component of copper in, in the preferably described article body with it is described
The joint surface of copper porous body is made of copper or copper alloy, and the joint portion of the copper porous body and the article body is sinter layer.
In this case, the joint portion of the copper porous body and the article body is set as sinter layer, therefore the copper
Porous body is securely engaged with the article body, as the porous composite component of copper, can obtain excellent intensity, electric conductivity
And thermal conductivity etc..
Also, the manufacturing method of the copper porous body of the mode as the present invention is characterized in that, more to manufacture above-mentioned copper
The manufacturing method of the copper porous body of hole body, in this manufacturing method, for the skeleton portion of tridimensional network, under oxidizing atmosphere
It is 500 DEG C or more and 1050 DEG C conditions progress oxidation processes below to keep temperature, and under reducing atmosphere to keep temperature
Degree carries out reduction treatment for 500 DEG C or more and 1050 DEG C conditions below, and the porosity is thus standardized conductivity σNIt is set as
20%IACS or more.
According to the manufacturing method of the copper porous body of the structure, the skeleton portion of tridimensional network is carried out under these conditions
Oxidation processes and reduction treatment, thus, it is possible to improve electric conductivity and the porosity is standardized conductivity σNBe set as 20%IACS with
On.
Also, the manufacturing method of the copper porous body of the mode as the present invention is characterized in that, porous to manufacture above-mentioned copper
The manufacturing method of the copper porous body of body, in this manufacturing method, at least one of the copper powders and the copper fiber
Or two kinds, to keep temperature for 500 DEG C or more and 1050 DEG C conditions progress oxidation processes below under oxidizing atmosphere, and
To keep temperature to carry out reduction treatments for 500 DEG C or more and 1050 DEG C conditions below under reducing atmosphere, it is consequently formed by described
The skeleton portion that the sintered body of at least one of copper powders and the copper fiber or two kinds is constituted, and by porosity standard
Change conductivity σNIt is set as 20%IACS or more.
According to the manufacturing method of the copper porous body of the structure, under these conditions in the copper powders and the copper fiber
It is at least one or two carry out oxidation processes and reduction treatment, thus, it is possible to be formed by the copper powders and the copper fiber
The skeleton portion that constitutes of at least one or two sintered body, the copper porous body comprising the sintered body can be obtained.And
And electric conductivity can be improved and the porosity is standardized into conductivity σNIt is set as 20%IACS or more.
The manufacturing method of the porous composite component of copper of a mode as the present invention is characterized in that, to manufacture by component master
The manufacturing method of the porous composite component of copper for the porous composite component of copper that the conjugant of body and copper porous body is constituted, the manufacturing method
Have bonding process, the copper porous body manufactured by the manufacturing method of above-mentioned copper porous body is connect with the article body
It closes.
According to the manufacturing method of the porous composite component of the copper of the structure, has manufacturer's legal system by above-mentioned copper porous body
The copper porous body made can manufacture the porous composite component of copper of electric conductivity and excellent thermal conductivity.In addition, the shape as article body
Shape, such as plate, stick, pipe can be enumerated etc..
Here, as the present invention a mode the porous composite component of copper manufacturing method in, the preferably described article body
In the joint surface of the engagement copper porous body be made of copper or copper alloy, by sintering by the copper porous body and the component
Main body is engaged.
In this case, the article body can be made integrated with the copper porous body by sintering, spy can be manufactured
The porous composite component of copper of the excellent in stability of property.
In accordance with the invention it is possible to provide a kind of copper porous body, copper is porous made of the copper porous body is engaged with article body
The manufacturing method of composite component, the manufacturing method of copper porous body and the porous composite component of copper, even if the copper porous body is in stomata
In the case of rate height, it may have enough electric conductivity and thermal conductivity is particularly suitable as conductive component and conducting-heat elements.
Description of the drawings
Fig. 1 is the enlarged diagram of the copper porous body of the first embodiment of the present invention.
Fig. 2 is the flow chart of an example for the manufacturing method for indicating copper porous body shown in FIG. 1.
Fig. 3 is the definition graph for indicating to manufacture the manufacturing process of copper porous body shown in FIG. 1.
Fig. 4 is the appearance definition graph of the porous composite component of copper of second embodiment of the present invention.
Fig. 5 is the flow chart of an example for the manufacturing method for indicating the porous composite component of copper shown in Fig. 4.
Fig. 6 is the outside drawing of the porous composite component of copper of the other embodiment of the present invention.
Fig. 7 is the outside drawing of the porous composite component of copper of the other embodiment of the present invention.
Fig. 8 is the outside drawing of the porous composite component of copper of the other embodiment of the present invention.
Fig. 9 is the outside drawing of the porous composite component of copper of the other embodiment of the present invention.
Figure 10 is the outside drawing of the porous composite component of copper of the other embodiment of the present invention.
Figure 11 is the outside drawing of the porous composite component of copper of the other embodiment of the present invention.
Specific implementation mode
Hereinafter, refer to the attached drawing, to the porous composite components of copper porous body, copper of embodiments of the present invention, copper porous body
Manufacturing method and the manufacturing method of the porous composite component of copper illustrate.
(first embodiment)
First, referring to figs. 1 to Fig. 3, the copper porous body 10 of the first embodiment of the present invention is illustrated.
As shown in Figure 1, the copper porous body 10 of present embodiment has skeleton portion 12 made of the sintering of multiple copper fibers 11.
Here, copper fiber 11 is made of copper or copper alloy, diameter R is long in the range of 0.02mm or more and 1.0mm or less
The ratio between L and diameter R L/R are spent in 4 or more and 2500 or less range.In present embodiment, copper fiber 11 is for example by C1020
(oxygen-free copper) is constituted.
In addition, in present embodiment, torsion or bending etc. are applied to copper fiber 11 and assign shape.Also, this embodiment party
In the copper porous body 10 of formula, apparent density ratio DAFor the real density D of copper fiber 11T51% or less.Shape about copper fiber 11
Shape, the apparent density ratio DAAs long as the real density D of copper fiber 11T51% hereinafter, can be linear, be curve-like etc.
Arbitrary shape, if but being applied with defined shape tax by reversing processing or bending machining etc. at least part of copper fiber 11
The copper fiber of processing is given, then can be three-dimensional and isotropically forms the void shape between fiber, as a result, bringing copper
Isotropic raising of the various characteristics such as the thermal conduction characteristic of porous body 10 and electric conductivity.
In addition, copper fiber 11 is adjusted to provide by hubbing, coil cutting method, steel wire cutting method, fusing spin processes etc.
Circle conversion diameter R, it is adjusted into length to cut in a manner of L/R as defined in satisfaction, is thus manufactured.
Here, circle conversion diameter R refers to the calculated value based on the sectional area A of each fiber, it is unrelated with cross sectional shape
Ground is assumed to be positive round, is defined by following formula.
R=(A/ π)1/2×2
Also, in the copper porous body 10 of present embodiment, oxidation is formed with also on the surface of skeleton portion 12 (copper fiber 11)
Former layer is formed in the redox layer combination integral with one another on surface each other in copper fiber 11,11 mutual engaging portions.
In addition, the redox layer is porous structure, subtle bumps are generated on the surface of skeleton portion 12 (copper fiber 11).
The whole specific surface area of copper porous body 10 is set as 0.01m as a result,2/ g or more.The whole specific surface area of copper porous body 10 is preferred
For 0.03m2/ g or more, but it's not limited to that.
Also, in the copper porous body 10 as present embodiment, porosity P is located at 50% or more and 90% is below
In range, pass through the conductivity σ for the copper porous body 10 that four-terminal method determinesPDivided by the apparent density ratio D of copper porous body 10ACome
The defined porosity standardizes conductivity σN(%IACS) is set as 20%IACS or more.In addition, the porosity standardizes conductivity σN、
Apparent density ratio DA, porosity P calculates by following formula respectively.
σN=σP×(1/DA)
DA=m/ (V × DT)
P (%)=(1- (m/ (V × DT)))×100
Wherein, m is the quality (g) of copper porous body 10, and V is the volume (cm of copper porous body 103), DTTo constitute copper porous body
Real density (the g/cm of 10 copper fiber 113)。
Porosity P is preferably in 70% or more and 90% or less range, but it's not limited to that.
Then, with reference to the flow chart of figure 2 and the process chart etc. of Fig. 3, to the manufacturer of the copper porous body 10 of present embodiment
Method illustrates.
First, as shown in figure 3, spraying and accumulating the copper fiber of filling in from spraying machine 31 towards stainless steel vessel 32
11, stacking copper fiber 11 (copper fiber lamination process S01).
Here, in copper fiber lamination process S01, with the bulk density D after fillingPAs the real density of copper fiber 11
DTThe multiple copper fibers of 50% mode laminated configuration below 11.In addition, in present embodiment, torsion is applied to copper fiber 11 and is added
The shapes such as work or bending machining assign processing, therefore copper fiber 11 ensures three-dimensional and isotropic sky each other when stacking
Gap.
Then, the copper fiber 11 in stainless steel vessel 32 is filled into accumulation and carries out redox processing (redox
Treatment process S02).
As shown in Figures 2 and 3, in redox treatment process S02, have the oxidation processes for carrying out copper fiber 11
The oxidation processes process S21 and reduction treatment process S22 that reduction sintering is carried out to oxidation-treated copper fiber 11.
In present embodiment, as shown in figure 3, the stainless steel vessel 32 that will be filled with copper fiber 11 is packed into heating furnace 33
Interior, heating is to the progress oxidation processes of copper fiber 11 (oxidation processes process S21) under oxidizing atmosphere.Pass through the oxidation processes process
S21, it is 1 μm or more and 100 μm of oxide skin(coating)s below to form such as thickness on the surface of copper fiber 11.
The condition of oxidation processes process S21 in present embodiment is set as：Atmosphere is air atmosphere (air atmosphere (a)),
It maintains the temperature in 500 DEG C or more and 1050 DEG C or less of range, the retention time was in 5 minutes or more and 300 minutes models below
In enclosing.
Here, the holding temperature in oxidation processes process S21 is less than in the case of 500 DEG C, it is possible to which causing cannot be in copper
It is sufficiently formed oxide skin(coating) on the surface of fiber 11.On the other hand, the holding temperature in oxidation processes process S21 is more than 1050 DEG C
In the case of, it is possible to cause oxidation to carry out to the inside of copper fiber 11.
According to the above, in present embodiment, by the holding temperature in oxidation processes process S21 be set as 500 DEG C with
It is upper and 1050 DEG C or less.In addition, in order to be reliably formed oxide skin(coating) on the surface of copper fiber 11, preferably by oxidation processes process
The lower limit of holding temperature in S21 is set as 600 DEG C or more, and the upper limit of temperature will be kept to be set as 1000 DEG C or less.
Also, in the case that the retention time in oxidation processes process S21 is less than 5 minutes, it is possible to which causing cannot be in copper
The surface of fiber 11 is sufficiently formed oxide skin(coating).On the other hand, the retention time in oxidation processes process S21 is more than 300 minutes
In the case of, it is possible to cause oxidation to carry out to the inside of copper fiber 11.
According to the above, in present embodiment, by the retention time in oxidation processes process S21 be set in 5 minutes with
In upper and 300 minutes or less ranges.In addition, in order to be reliably formed oxide skin(coating) on the surface of copper fiber 11, preferably by oxygen
The lower limit for changing the retention time in treatment process S21 is set as 10 minutes or more.Also, it is oxidizing to copper fiber to be reliably suppressed
The upper limit of retention time in oxidation processes process S21 is preferably set as 100 minutes or less by 11 inside.
Then, in present embodiment, as shown in figure 3, after implementing oxidation processes process S21, it will be filled with copper fiber 11
Stainless steel vessel 32 be packed into heating furnace 34 in, heated under reducing atmosphere, already oxidised copper fiber 11 gone back
Original place reason forms redox layer, and forms skeleton portion 12 (reduction treatment process S22) each other in conjunction with copper fiber 11.
The condition of reduction treatment process S22 in present embodiment is that atmosphere is the mixed-gas atmosphere (Ar+ of argon and hydrogen
H2Atmosphere (b)), it maintains the temperature in 500 DEG C or more and 1050 DEG C or less of range, the retention time was at 5 minutes or more and 300 points
In range below clock.
Here, in the case that the holding temperature in reduction treatment process S22 is less than 500 DEG C, it is possible to cause to fill
The oxide skin(coating) for dividing reduction to be formed in 11 surface of copper fiber.On the other hand, the holding temperature in reduction treatment process S22 is more than
It in the case of 1050 DEG C, is heated near the fusing point of copper, it is possible to intensity and the porosity be caused to reduce.
According to the above, in present embodiment, by the holding temperature in reduction treatment process S22 be set as 500 DEG C with
It is upper and 1050 DEG C or less.In addition, in order to reliably restore the oxide skin(coating) for being formed in 11 surface of copper fiber, preferably by reduction treatment
The lower limit of holding temperature in process S22 is set as 600 DEG C or more.Also, it is reduced to be reliably suppressed intensity and the porosity, it is excellent
The upper limit of holding temperature in reduction treatment process S22 is set as 1000 DEG C or less by choosing.
Also, in the case that the retention time in reduction treatment process S22 is less than 5 minutes, it is possible to which causing cannot be abundant
Ground restores the oxide skin(coating) for being formed in 11 surface of copper fiber, and it is possible to cause to be sintered insufficient.On the other hand, reduction treatment
Retention time in process S22 is more than in the case of 300 minutes, it is possible to cause thermal contraction caused by being sintered to become larger, and strong
Degree reduces.
According to the above, in present embodiment, by the retention time in reduction treatment process S22 be set in 5 minutes with
In upper and 300 minutes or less ranges.In addition, in order to reliably restore the oxide skin(coating) for being formed in 11 surface of copper fiber, and
It is sufficiently carried out sintering, is preferably set as the lower limit of the holding temperature in reduction treatment process S22 10 minutes or more.Also, it is
It is reliably suppressed caused by sintering and is heat-shrinked or strength reduction, it is preferably upper by retention time in reduction treatment process S22
Limit is set as 100 minutes or less.
By the oxidation processes process S21 and reduction treatment process S22, formed on the surface of copper fiber 11 (skeleton portion 12)
Redox layer generates the bumps with distinctive fine porous structure.That is, redox layer 12 is set as porous structure,
The surface of copper fiber 11 generates subtle bumps.The whole specific surface area of copper porous body 20 is set as 0.01m as a result,2/ g or more.
Also, oxide skin(coating) is formed on 11 surface of copper fiber by oxidation processes process S21, multiple copper fibers 11 are led to each other
The oxide skin(coating) is crossed to be crosslinked.Later, by carrying out reduction treatment process S22, it is formed in the oxide skin(coating) on 11 surface of copper fiber
It is reduced, forms above-mentioned redox layer, and the redox layer is bonded to each other, thus copper fiber 11 is sintered and shape each other
At skeleton portion 12.
By the above-mentioned manufacture method, copper fiber 11,11 is sintered and forms skeleton portion 12 each other, and in skeleton portion 12
The surface of (copper fiber 11) forms redox layer.Moreover, the above-mentioned porosity standardizes conductivity σNAs 20%IACS or more.
Copper porous body 10 of the manufacture as present embodiment as a result,.
According to present embodiment formed as described above, that is, copper porous body 10, porosity P be up to 50% or more and 90% with
Under range in, and the porosity is standardized into conductivity σNIt is set as 20%IACS or more, therefore electric conductivity and excellent thermal conductivity,
There is excellent characteristic as conductive component and conducting-heat elements.
Also, according to the copper porous body 10 as present embodiment, it is formed with redox layer on the surface in skeleton portion 12,
Therefore the bumps with distinctive fine porous structure are formed on surface, thus specific surface area becomes larger, such as can greatly improve
The various characteristics such as the heat exchanger effectiveness via porous body skeleton surface.Also, it, can be further by carrying out redox processing
It improves the porosity and standardizes conductivity σN。
Moreover, in the present embodiment, in 11 mutual engaging portion of copper fiber, being formed in the redox on surface each other
Layer combination integral with one another, therefore bond strength is excellent.
Also, copper porous body 10 according to the present embodiment, by diameter R 0.02mm or more and 1.0mm it is below
In range, the ratio between length L and diameter R copper fibers 11 of the L/R in 4 or more and 2500 or less range be sintered to form
Skeleton portion 12, therefore can ensure sufficient gap between copper fiber 11, and inhibit shrinking percentage when sintering, stomata
Rate is higher and dimensional accuracy is excellent.
Also, in present embodiment, have with bulk density DPAs the real density D of copper fiber 11T50% side below
Formula laminated configuration diameter R in the range of 0.02mm or more and 1.0mm or less, the ratio between length L and diameter R L/R 4 or more and
The copper fiber lamination process S01 of copper fiber 11 in 2500 or less range, therefore can ensure between copper fiber 11
Gap can inhibit to shrink.Thereby, it is possible to manufacture the copper porous body 10 that the porosity is higher and dimensional accuracy is excellent.
Here, in the case that the diameter R of copper fiber 11 is less than 0.02mm, 11 mutual bonding area of copper fiber is smaller, has
Sintering strength may be caused insufficient.On the other hand, in the case that the diameter R of copper fiber 11 is more than 1.0mm, copper fiber 11 connects each other
The lazy weight of tactile contact, in this case it is still possible to cause sintering strength insufficient.
According to the above, in present embodiment, by the diameter R of copper fiber 11 be set in 0.02mm or more and 1.0mm with
Under range in.In addition, in order to further increase intensity, the lower limit of the diameter R of copper fiber 11 is preferably set as 0.05mm or more,
It is preferred that the upper limit of the diameter R of copper fiber 11 is set as 0.5mm or less.
Also, in the case that the ratio between the length L and diameter R of copper fiber 11 L/R are less than 4, when laminated configuration, is difficult to accumulate
Density DPIt is set as the real density D of copper fiber 11T50% hereinafter, being likely to result in being difficult to obtain the higher copper porous bodies of porosity P
10.On the other hand, in the case that the ratio between length L and diameter R of copper fiber 11 L/R are more than 2500, copper fibre cannot be uniformly dispersed
Dimension 11, it is possible to cause to be difficult to obtain the copper porous body 10 with the uniform porosity.
According to the above, in present embodiment, the ratio between the length L of copper fiber 11 and diameter R L/R are set in 4 or more
And in 2500 or less range.In addition, in order to further increase the porosity, preferably by the ratio between the length L of copper fiber 11 and diameter R
The lower limit of L/R is set as 10 or more.Also, in order to reliably obtain the uniform copper porous bodies 10 of porosity P, preferably by copper fiber 11
Length L and the ratio between the diameter R L/R upper limits be set as 500 or less.
Also, the manufacturing method of copper porous body according to the present embodiment, has：Oxidation processes process S21, makes copper fiber
11 oxidations；And reduction treatment process S22, already oxidised copper fiber 11 is restored, therefore can be in copper fiber 11 (skeleton portion 12)
Surface forms redox layer.Also, it, can be by the porosity by these oxidation processes process S21 and reduction treatment process S22
Standardize conductivity σNIt is set as 20%IACS or more.
(second embodiment)
Then, refer to the attached drawing illustrates the porous composite component of the copper of second embodiment of the present invention 100.
Fig. 4 shows the porous composite component of the copper of present embodiment 100.The porous composite component of the copper 100 has by copper or copper
The copper coin 120 (article body) of alloy composition and the copper porous body 110 for being engaged in 120 surface of copper coin.
Here, identical with first embodimently, the copper porous body 110 involved by present embodiment is by multiple copper fiber quilts
It is sintered and forms skeleton portion.Here, copper fiber is made of copper or copper alloy, diameter R is in 0.02mm or more and 1.0mm models below
In enclosing, the ratio between length L and diameter R L/R are in 4 or more and 2500 or less range.In present embodiment, copper fiber for example by
C1020 (oxygen-free copper) is constituted.
In addition, in present embodiment, torsion or bending etc. are applied to copper fiber and assign shape.Also, present embodiment
Copper porous body 110 in, apparent density ratio DAFor the real density D of copper fiberT51% or less.
Moreover, in present embodiment, (oxidation processes and reduction treatment) is handled by carrying out redox as be described hereinafter,
It constitutes and is formed with redox layer in the copper fiber (skeleton portion) and the surface of copper coin 120 of copper porous body 110, as a result, in copper fibre
The surface of dimension (skeleton portion) and copper coin 120 generates subtle bumps.In present embodiment, the whole specific surface of copper porous body 110
Product is 0.01m2/ g or more.The whole specific surface area of copper porous body 110 is preferably 0.03m2/ g or more, but it's not limited to that.
Also, in the engaging portion for constituting the copper fiber of copper porous body 110 and the surface of copper coin 120, it is formed in copper fiber table
The redox layer in face and the redox layer for being formed in copper coin surface are joined integrally.
Also, in the copper porous body 110 involved by present embodiment, by porosity P be located at 50% or more and 90% with
Under range in, pass through the conductivity σ for the copper porous body 110 that four-terminal method determinesPDivided by the apparent density of copper porous body 110
Compare DAThe porosity as defined in coming standardizes conductivity σNIt is set as 20%IACS or more.
Porosity P is preferably in 70% or more and 90% or less range, but it's not limited to that.
Then, with reference to the flow chart of figure 5, the method for the porous composite component of the copper of manufacture present embodiment 100 is said
It is bright.
First, prepare article body, that is, copper coin 120 (copper coin arrangement step S100).Then, on the surface of the copper coin 120 point
Dissipate simultaneously laminated configuration copper fiber (copper fiber lamination process S101).Here, in copper fiber lamination process S101, it is close to accumulate
Spend DPAs the real density D of copper fiberTThe 50% multiple copper fibers of mode laminated configuration below.
Then, the copper fiber to laminated configuration in 120 surface of copper coin is sintered each other to be molded copper porous body 110, and
And combine copper porous body 110 and copper coin 120 (sintering circuit S102 and bonding process S103).As shown in figure 5, the sintering circuit
S102 and bonding process S103 has carries out the oxidation processes process S121 of oxidation processes and to through oxygen to copper fiber and copper coin 120
Change the copper fiber handled and copper coin 120 carries out the reduction treatment process S122 of reduction sintering.
In present embodiment, there is the copper coin 120 of copper fiber to be packed into heating furnace laminated configuration, carried out under oxidizing atmosphere
Heating to carry out oxidation processes (oxidation processes process S121) to copper fiber.By oxidation processes process S121, in copper fiber
And the surface of copper coin 120 forms such as 1 μm of thickness or more and 100 μm of oxide skin(coating)s below.
Here, the condition of the oxidation processes process S121 in present embodiment is to maintain the temperature at 500 DEG C or more and 1050
DEG C or less range in, preferably in 600 DEG C or more and 1000 DEG C or less of range, the retention time was at 5 minutes or more and 300 points
In range below clock, preferably in 10 minutes or more and 100 minutes or less ranges.
Then, in present embodiment, after implementing oxidation processes process S121, laminated configuration is had to the copper coin of copper fiber
120 are packed into calcining furnace, are heated under reducing atmosphere, and reduction treatment, knot are carried out to already oxidised copper fiber and copper coin 120
It closes copper fiber each other, and combines copper fiber and copper coin 120 (reduction treatment process S122).
Here, the condition of the reduction treatment process S122 in present embodiment is, atmosphere is the mixed gas gas of nitrogen and hydrogen
Atmosphere maintains the temperature in 500 DEG C or more and 1050 DEG C or less of range, preferably in 600 DEG C or more and 1000 DEG C of ranges below
It is interior, the retention time in 5 minutes or more and 300 minutes or less ranges, preferably in 10 minutes or more and 100 minutes models below
In enclosing.
By the oxidation processes process S121 and reduction treatment process S122, in copper fiber (skeleton portion) and copper coin 120
Surface forms redox layer, generates subtle bumps.
Also, oxide skin(coating) is formed on the surface of copper fiber (skeleton portion) and copper coin 120 by oxidation processes process S121,
Multiple copper fibers are each other and copper coin 120 is crosslinked by the oxide skin(coating).Later, by carrying out reduction treatment process S122, shape
It is reduced at the oxide skin(coating) in copper fiber (skeleton portion) and 120 surface of copper coin, copper fiber is burnt across redox layer each other
It ties to form skeleton portion, and copper porous body 110 is made to be combined with copper coin 120.Moreover, the porosity standardization of copper porous body 110
Conductivity σNAs 20%IACS or more.
By method manufactured as above, the porous composite component of copper 100 of present embodiment is manufactured.
According to the porous composite component 100 of present embodiment, that is, copper formed as described above, by the porosity of copper porous body 110
Standardize conductivity σNIt is set as 20%IACS or more, therefore electric conductivity and excellent thermal conductivity, the porous composite part of the copper can be improved
Part 100 whole electric conductivity and thermal conductivity.
Moreover, in present embodiment, the surface of the copper fiber and copper coin 120 that constitute copper porous body 110 is formed with oxidation also
Former layer, the whole specific surface area of copper porous body 110 are 0.01m2/ g or more, porosity P are in 50% or more and 90% model below
In enclosing, the various characteristics such as heat exchanger effectiveness, water-retaining property can be greatly improved.
Also, in present embodiment, constitute in the copper fiber of copper porous body 110 and the engaging portion on 120 surface of copper coin, is formed
It is joined integrally in the redox layer on copper fiber surface and the redox layer that is formed in 120 surface of copper coin, therefore copper porous body
110 firmly engage with copper coin 120, intensity, electric conductivity and the excellent thermal conductivity of joint interface.
The manufacturing method of the porous composite component of copper according to the present embodiment 100, in the copper coin being made of copper and copper alloy
120 surface laminated configuration copper fiber, while implementing sintering circuit S102 and bonding process S103, therefore manufacture work can be simplified
Skill.
Also, by implementing oxidation processes process S121 and reduction treatment process S122, the porosity can be standardized and be led
Electric rate σNIt is set as 20%IACS or more.
More than, embodiments of the present invention are illustrated, but the present invention is not limited to this, can not depart from this
It is suitably changed in the range of the technological thought of invention.
For example, using manufacturing equipment shown in Fig. 3, the manufacturing equipment as manufacture copper porous body is illustrated, but simultaneously
It is not limited to this, other manufacturing equipments can also be used to manufacture copper porous body.
About the atmosphere of oxidation processes process S21, S121, as long as the oxidation of copper oxide or copper alloy at the specified temperature
Atmosphere, specifically, be not limited in an atmosphere, as long as in inert gas (for example, nitrogen) containing 0.5vol% or more
The atmosphere of oxygen.Also, about the atmosphere of reduction treatment process S22, S122, as long as also the same copper oxygen at the specified temperature
Compound is reduced into metallic copper or decomposes the reducing atmosphere of copper oxide, specifically, additionally it is possible to be suitably used containing several
Nitrogen-hydrogen mixed gas, argon-hydrogen mixed gas, pure hydrogen gas or the decomposed ammonia for being usually used in industry of the hydrogen of vol% or more
Body, propane decompose gas etc..
Moreover, in the present embodiment, as by being sintered copper fiber to form skeleton portion the case where of copper porous body
It is illustrated, but it's not limited to that, such as prepare the copper porous bodies such as fabric nonwoven cloth, metallic filter, for the copper
Porous body, to keep temperature for 500 DEG C or more and 1050 DEG C conditions progress oxidation processes below under oxidizing atmosphere, and
To keep temperature to carry out reduction treatments for 500 DEG C or more and 1050 DEG C conditions below under reducing atmosphere, it is possible thereby to by stomata
Rate standardizes conductivity σNIt is set as 20%IACS or more.
Moreover, in the present embodiment, being said as the case where the surface in skeleton portion forms redox layer
It is bright, but it's not limited to that, redox layer can be deficiently formed, as long as the porosity is standardized conductivity σNIt is set as
20%IACS or more.
Also, in the present embodiment, using by oxygen-free copper (JIS C1020), phosphorized copper (JIS C1201,
C1220 it), is illustrated the case where the copper fiber of compositions such as tough pitch copper (JIS C1100), but it's not limited to that, as
The material of copper fiber 11 can use the copper alloy of the high conductivity such as other Cr copper (C18200), Cr-Zr copper (C18150).
In present embodiment, used copper fiber, but can use copper powders or copper fiber and copper powders both.Copper powders are put down
Equal grain size is preferably 0.005mm or more and 0.3mm hereinafter, more preferably 0.01mm or more and 0.1mm be not hereinafter, limit still
In this.Also, using copper fiber and copper powders both in the case of, preferably with respect to copper fiber contain 5% or more and
20% copper powders below, but it's not limited to that.
Also, in second embodiment, carried out with the porous composite component of the copper of structure shown in Fig. 4 for example, but
It's not limited to that, or the porous composite component of copper of the structure as shown in Fig. 6 to Figure 11.
Moreover, in this second embodiment, the engagement in copper porous body and article body is instantiated as preferred method
Portion is formed with the joint method for the sinter layer being made of redox layer, but it's not limited to that, even if to utilize various welderings
Connection (method of laser welding, resistance welding method), used the brazing material melted at low temperature method for brazing joint method, only
It wants the porosity of copper porous body be standardized conductivity σNIt is set as 20%IACS or more.
For example, as shown in Figure 6, or as article body inserted with multiple copper pipes 220 in copper porous body 210
The porous composite component of the copper of structure 200.
Alternatively, as shown in Figure 7, or as article body inserted with the copper for bending to U-shaped in copper porous body 310
The porous composite component of the copper of the structure of pipe 320 300.
Moreover, as shown in Figure 8, or be bonded to copper porous body in the inner peripheral surface of the copper pipe 420 as article body
The porous composite component of the copper of 410 structure 400.
Also, as shown in Figure 9, or be bonded to copper porous body in the peripheral surface of the copper pipe 520 as article body
The porous composite component of the copper of 510 structure 500.
Moreover, as shown in Figure 10, or be bonded in the inner peripheral surface and peripheral surface of the copper pipe 620 as article body
The porous composite component of the copper of the structure of copper porous body 610 600.
Also, copper porous body 710 as shown in figure 11, can also be bonded on the two sides of the copper coin 720 as article body
Structure the porous composite component of copper 700.
Embodiment
Hereinafter, the result of the confirmation experiment to being carried out to confirm the effect of the present invention illustrates.
(embodiment 1)
The various porous bodies produced by material and manufacturing method shown in table 1 are prepared.First, before to heat treatment
The porosity and the porosity standardization conductivity be determined.Then, oxidation processes are carried out under conditions of recorded in table 1
And reduction treatment, to after oxidation processes and reduction treatment the porosity and the porosity standardization conductivity be determined.Separately
Outside, the porosity and porosity standardization conductivity are determined as follows.It will be evaluation result is shown in table in 1.
(porosity)
Real density D is measured by method in water using precision balanceT(g/cm3), porosity P is calculated by following formula.Separately
Outside, the quality of copper porous body is set as m (g), and the volume of copper porous body is set as V (cm3)。
Porosity P (%)=(1- (m/ (V × DT)))×100
(porosity standardization conductivity)
It is used according to JIS C2525 using the sample for the plate for cutting into width 30mm × length 200mm × thickness 5mm
Hioki E.E.Corporation Micro ohm hitester3227 are divided into 150mm between voltage terminal, and measure electricity
It flows to determine conductivity σ by four-terminal method under conditions of 0.5AP(%IACS).Also, by following formula, calculate venthole
Rate standardizes conductivity σN。
The porosity standardizes conductivity σN(%IACS)=σP×(1/DA)
In addition, calculating apparent density ratio D by following formulaA(%).
Apparent density ratio DA=100 × m/ (V × DT)
Wherein, m is the quality (g) of copper porous body, and V is the volume (cm of copper porous body3), DTTo constitute the copper of copper porous body
Or real density (the g/cm of copper alloy3)。
[table 1]
It implements under conditions of defined in oxidation processes and the example of the present invention 1~4 of reduction treatment, will in the present invention
Porosity P is located in 50% or more and 90% or less range, and porosity standardization conductivity has been more than 20%IACS.
In contrast, the comparison low in the temperature condition of the low comparative example 1 of the temperature condition of oxidation processes and reduction treatment
In example 2, even if not being improved fully if conductivity after oxidation processes and reduction treatment, porosity standardization is conductive
Rate σNLess than 20%IACS.
(embodiment 2)
Using copper powders shown in table 2, redox processing is carried out under the conditions of shown in table 2, it is more to have manufactured copper
Hole body.About the copper porous body obtained, the porosity and porosity standardization conductivity are determined.In addition, about gas
Porosity and the porosity standardize conductivity, are determined by method same as Example 1, but in example 2, it will
Calculate D when porosity standardization conductivityTIt is set as constituting the real density (g/cm of the copper powders of copper porous body3).By evaluation result
It is shown in Table 2.
[table 2]
It is implemented under conditions of defined in the present invention in oxidation processes and the example of the present invention 11~14 of reduction treatment,
Porosity P is located in 50% or more and 90% or less range, and porosity standardization conductivity has been more than 20%IACS.
In contrast, the comparison low in the temperature condition of the low comparative example 11 of the temperature condition of oxidation processes and reduction treatment
In example 12, the porosity standardizes conductivity σNLess than 20%IACS.
(embodiment 3)
Using copper fiber shown in table 3, redox processing is carried out under the conditions of shown in table 3, it is more to have made copper
Hole body.In addition, determining the fiber footpath R and fibre length L of copper fiber by the following method.
(fiber footpath R)
Fiber footpath R (mm), which has been used, utilizes Malvern Instruments Ltd particle analysing devices " Morphologi
G3 " passes through the calculated equivalent diameter of image analysis (Heywood diameters) R=(A/ π) according to JIS Z 8827-11/2× 2
Average value.
(the long L of fiber)
The long L of fiber (mm) of copper fiber, which has been used, utilizes Malvern Instruments Ltd particle analysing devices
" Morphologi G3 " passes through the calculated simple average value of image analysis.
About the copper porous body obtained, the porosity and porosity standardization conductivity are determined.In addition, about
The porosity and the porosity standardize conductivity, are determined by method same as Example 1, but in embodiment 3,
The D when porosity standardizes conductivity will be calculatedTIt is set as constituting the real density (g/cm of the copper fiber of copper porous body3).Evaluation is tied
Fruit is shown in Table 3.
[table 3]
Oxidation processes and example of the present invention 21~present invention of reduction treatment are implemented under conditions of defined in the present invention
In example 26, porosity P is located in 50% or more and 90% or less range, and porosity standardization conductivity is more than
20%IACS.
In contrast, the comparison low in the temperature condition of the low comparative example 21 of the temperature condition of oxidation processes and reduction treatment
In example 22, the porosity standardizes conductivity σNLess than 20%IACS.
By identified above to according to example of the present invention, even if being capable of providing one kind in the case of porosity height, it may have foot
Enough electric conductivity and thermal conductivity is particularly suitable as the copper porous body of conductive component and conducting-heat elements.
Industrial availability
The porous composite component of copper, copper made of copper porous body according to the present invention, the copper porous body are engaged with article body
The manufacturing method of the porous composite component of manufacturing method and copper of porous body, can obtain even if in the case of porosity height
Copper porous body with enough electric conductivity and thermal conductivity.The copper porous body is suitable as conductive component and conducting-heat elements.
Symbol description
10,110- copper porous body, 11- copper fibers, 12- skeletons portion, the porous composite component of 100- copper, 120- copper coin (components
Main body).
Claims (11)
1. a kind of copper porous body, the skeleton portion with tridimensional network, the copper porous body are characterized in that,
The porosity in 50% or more and 90% or less range,
The conductivity of the copper porous body determined by four-terminal method divided by the apparent density ratio of the copper porous body are advised
The fixed porosity standardizes conductivity σNIt is set as 20%IACS or more.
2. copper porous body according to claim 1, which is characterized in that
It is formed with redox layer on the surface in the skeleton portion.
3. copper porous body according to claim 1 or 2, which is characterized in that
The skeleton portion is at least one of the copper powders being made of copper or copper alloy and copper fiber or two kinds of sintered body.
4. copper porous body according to claim 3, which is characterized in that
The diameter R of the copper fiber is in the range of 0.02mm or more and 1.0mm or less, and the ratio between length L and diameter R L/R are 4
Above and in 2500 or less range.
5. copper porous body according to claim 3 or 4, which is characterized in that
In at least one of the copper powders and copper fiber or two kinds of engaging portion, it is formed in the redox layer on surface each other
Combination integral with one another.
6. a kind of porous composite component of copper, which is characterized in that be made of conjugant, which is article body and claim
The conjugant of copper porous body described in any one of 1 to 5.
7. the porous composite component of copper according to claim 6, which is characterized in that
Being made of copper or copper alloy with the joint surface of the copper porous body in the article body, the copper porous body with it is described
The joint portion of article body is sinter layer.
8. a kind of manufacturing method of copper porous body, which is characterized in that the copper for the porous body described in manufacturing claims 1 or 2 is more
The manufacturing method of hole body, in the manufacturing method,
For the skeleton portion of tridimensional network, to keep temperature below for 500 DEG C or more and 1050 DEG C under oxidizing atmosphere
Condition carries out oxidation processes, and is under reducing atmosphere that 500 DEG C or more and 1050 DEG C conditions below carry out to keep temperature
Thus the porosity is standardized conductivity σ by reduction treatmentNIt is set as 20%IACS or more.
9. a kind of manufacturing method of copper porous body, which is characterized in that more for the copper described in any one of manufacturing claims 3 to 5
The manufacturing method of hole body, in the manufacturing method,
For at least one of the copper powders and the copper fiber or two kinds, to keep temperature for 500 under oxidizing atmosphere
DEG C or more and 1050 DEG C of conditions below carry out oxidation processes, and under reducing atmosphere with keep temperature be 500 DEG C or more and
1050 DEG C of conditions below carry out reduction treatment, are consequently formed by least one of the copper powders and the copper fiber or two
The skeleton portion that the sintered body of kind is constituted, and the porosity is standardized into conductivity σNIt is set as 20%IACS or more.
10. a kind of manufacturing method of the porous composite component of copper, which is characterized in that the porous composite component of copper is by conjugant structure
At the conjugant is the conjugant of the copper porous body described in any one of article body and claim 1 to 5, the manufacturer
Method has bonding process, and the copper porous body described in any one of claim 1 to 5 is engaged with the article body.
11. the manufacturing method of the porous composite component of copper according to claim 10, which is characterized in that
The joint surface of the engagement copper porous body in the article body is made of copper or copper alloy, in the bonding process,
The copper porous body is engaged with the article body by being sintered.
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| JP2016089358A JP6733286B2 (en) | 2016-04-27 | 2016-04-27 | Method for producing copper porous body, and method for producing copper porous composite member |
| PCT/JP2017/014522 WO2017187938A1 (en) | 2016-04-27 | 2017-04-07 | Copper porous body, copper porous composite member, method for producing copper porous body, and method for producing copper porous composite member |
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| US (1) | US20190076927A1 (en) |
| EP (1) | EP3450061A4 (en) |
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| JP2019086259A (en) * | 2017-11-09 | 2019-06-06 | 三菱マテリアル株式会社 | Copper porous body for vaporization member, ebullition cooler, and heat pipe |
| CN115740431A (en) * | 2022-12-21 | 2023-03-07 | 北京有研粉末新材料研究院有限公司 | Compound copper powder and preparation method and application thereof |
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| JP6065059B2 (en) * | 2015-06-12 | 2017-01-25 | 三菱マテリアル株式会社 | Copper porous body, copper porous composite member, method for producing copper porous body, and method for producing copper porous composite member |
| JP6107888B2 (en) * | 2015-06-12 | 2017-04-05 | 三菱マテリアル株式会社 | Copper porous body, copper porous composite member, method for producing copper porous body, and method for producing copper porous composite member |
| JP6065058B2 (en) * | 2015-06-12 | 2017-01-25 | 三菱マテリアル株式会社 | Copper porous body and copper porous composite member |
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2016
- 2016-04-27 JP JP2016089358A patent/JP6733286B2/en active Active
-
2017
- 2017-04-07 KR KR1020187023139A patent/KR20190002422A/en unknown
- 2017-04-07 EP EP17789225.4A patent/EP3450061A4/en not_active Withdrawn
- 2017-04-07 WO PCT/JP2017/014522 patent/WO2017187938A1/en active Application Filing
- 2017-04-07 CN CN201780008127.XA patent/CN108602127A/en active Pending
- 2017-04-07 US US16/081,527 patent/US20190076927A1/en not_active Abandoned
- 2017-04-17 TW TW106112787A patent/TW201806751A/en unknown
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| US4066450A (en) * | 1974-11-26 | 1978-01-03 | Kabushiki Kaisha Toyota Cho Kenkyusho | Metal body having large surface area and process for producing same |
| JP3387158B2 (en) * | 1993-06-16 | 2003-03-17 | 株式会社ユアサコーポレーション | Zinc plate |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201806751A (en) | 2018-03-01 |
| KR20190002422A (en) | 2019-01-08 |
| EP3450061A4 (en) | 2019-10-02 |
| JP6733286B2 (en) | 2020-07-29 |
| EP3450061A1 (en) | 2019-03-06 |
| WO2017187938A1 (en) | 2017-11-02 |
| JP2017197811A (en) | 2017-11-02 |
| US20190076927A1 (en) | 2019-03-14 |
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