CN108597990A - 一种半导体晶圆前处理工艺 - Google Patents
一种半导体晶圆前处理工艺 Download PDFInfo
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- CN108597990A CN108597990A CN201810571749.XA CN201810571749A CN108597990A CN 108597990 A CN108597990 A CN 108597990A CN 201810571749 A CN201810571749 A CN 201810571749A CN 108597990 A CN108597990 A CN 108597990A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810571749.XA CN108597990B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体晶圆前处理工艺 |
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CN201810571749.XA CN108597990B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体晶圆前处理工艺 |
Publications (2)
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CN108597990A true CN108597990A (zh) | 2018-09-28 |
CN108597990B CN108597990B (zh) | 2020-10-27 |
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CN201810571749.XA Active CN108597990B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体晶圆前处理工艺 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060073683A1 (en) * | 2000-08-11 | 2006-04-06 | Applied Materials, Inc. | Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage |
TW201344771A (zh) * | 2012-01-19 | 2013-11-01 | Tokyo Electron Ltd | 電漿處理裝置 |
JP2016092347A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社ディスコ | エッチング方法 |
CN106384756A (zh) * | 2016-10-19 | 2017-02-08 | 中国人民解放军国防科学技术大学 | 基于石墨烯量子点的THz单光子探测器及其制备方法 |
CN107078015A (zh) * | 2014-09-19 | 2017-08-18 | 应用材料公司 | 用于等离子体切割的接近接触盖环 |
CN105470110B (zh) * | 2014-09-30 | 2018-12-07 | 英飞凌科技股份有限公司 | 处理载体的方法、操作处理腔的方法和处理晶圆的方法 |
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2018
- 2018-05-29 CN CN201810571749.XA patent/CN108597990B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060073683A1 (en) * | 2000-08-11 | 2006-04-06 | Applied Materials, Inc. | Plasma immersion ion implantation process using a capacitively coupled plasma source having low dissociation and low minimum plasma voltage |
TW201344771A (zh) * | 2012-01-19 | 2013-11-01 | Tokyo Electron Ltd | 電漿處理裝置 |
CN107078015A (zh) * | 2014-09-19 | 2017-08-18 | 应用材料公司 | 用于等离子体切割的接近接触盖环 |
CN105470110B (zh) * | 2014-09-30 | 2018-12-07 | 英飞凌科技股份有限公司 | 处理载体的方法、操作处理腔的方法和处理晶圆的方法 |
JP2016092347A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社ディスコ | エッチング方法 |
CN106384756A (zh) * | 2016-10-19 | 2017-02-08 | 中国人民解放军国防科学技术大学 | 基于石墨烯量子点的THz单光子探测器及其制备方法 |
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Publication number | Publication date |
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CN108597990B (zh) | 2020-10-27 |
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Effective date of registration: 20200929 Address after: Building 39, Weile neighborhood life square, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province Applicant after: Suzhou yinzhicheng new energy Co.,Ltd. Address before: 210008 Nanjing University, 22 Hankou Road, Jiangsu, Nanjing Applicant before: Hou Yuchuang |
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TR01 | Transfer of patent right |
Effective date of registration: 20230825 Address after: 518131, 401-402, Building 3, Minle Industrial Zone, Minle Community, Minzhi Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Leading Industrial Development Co.,Ltd. Address before: Building 39, Weile Neighborhood Life Plaza, Luzhi Town, Wuzhong District, Suzhou City, Jiangsu Province, 215125 Patentee before: Suzhou yinzhicheng new energy Co.,Ltd. |
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