CN108593195A - High temperature hydraulic pressure sensor-packaging structure - Google Patents

High temperature hydraulic pressure sensor-packaging structure Download PDF

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Publication number
CN108593195A
CN108593195A CN201810417624.1A CN201810417624A CN108593195A CN 108593195 A CN108593195 A CN 108593195A CN 201810417624 A CN201810417624 A CN 201810417624A CN 108593195 A CN108593195 A CN 108593195A
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CN
China
Prior art keywords
base
inner cylinder
ceramic
high temperature
outer cover
Prior art date
Application number
CN201810417624.1A
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Chinese (zh)
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CN108593195B (en
Inventor
朱平
裴振伟
郭学敏
冷贺彬
雷武
Original Assignee
中北大学
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Priority to CN201810417624.1A priority Critical patent/CN108593195B/en
Priority claimed from CN201810417624.1A external-priority patent/CN108593195B/en
Publication of CN108593195A publication Critical patent/CN108593195A/en
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Publication of CN108593195B publication Critical patent/CN108593195B/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0609Pressure pulsation damping arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627Protection against aggressive medium in general
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0681Protection against excessive heat
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/142Multiple part housings

Abstract

The present invention relates to a kind of high temperature hydraulic pressure sensor-packaging structures, including base of ceramic, gland, central tube, inner cylinder, cylinder barrel, outer cover, the outer enclosure and interior cap;The upper and lower surface of the base of ceramic in an axial direction opens up the first groove and the second groove respectively, and substrate is placed in the first groove, and SOI chip varistors are bonded on substrate, the first heat sink structure is placed in the second groove.Central tube, which is configured at base of ceramic periphery and is limited with base of ceramic, to be coordinated, and cylinder barrel is configured at central tube top, forms gap between cylinder barrel and inner cylinder, and the second heat sink structure and piston are installed in lower part and top respectively in the gap;Enclosure configurations are equipped with ring key on the outside of inner cylinder between inner cylinder and outer cover;The ring key is embedded in the annular groove between inner cylinder and outer cover, and the outer enclosure is fixedly mounted in shield base.The encapsulating structure can effectively reduce the influence of technology stress and high temperature thermal stress to pressure sensor sensitive chip, achieve the purpose that ensure sensor reliable measurements.

Description

High temperature hydraulic pressure sensor-packaging structure

Technical field

The present invention relates to pressure sensor, especially a kind of SOI pressure sensor package knots applied in hydraulic system Structure.

Background technology

Hydraulic system develops towards high-pressure trend, high-power direction, system in effective power will can be brought to increase, oil contamination And the problems such as pressure fluctuation.Hydraulic system reactance capacity is mainly reflected in generate a large amount of thermal energy, these thermal energy essentially from Pumping source volumetric loss and mechanical loss, hydraulic long-pipe road linear loss, the restriction loss of electro hydraulic valve, pressurized strut volumetric loss with And hydraulic system temperature liter etc. caused by Aerodynamic force action in revesal;High Temperature in Hydraulic System makes hydraulic oil liquid viscosity reduce, slides Face oil film breakdown, abrasion quickening, sealing element premature ageing, oil liquid leakage increase, and high temperature also makes fluid accelerated oxidation go bad, move Pair asks that gap reduces, and the deposit of generation can clogging hydraulic element;Pipeline vibration caused by pressure fluctuation is many hydraulic systems The main reason for failure, with the high-pressure trend of hydraulic system, pressure fluctuation and pipeline vibration, not only bring caused by flow pulsation More serious noise, and can make the pipe-line system and corresponding measuring system disaster occur under overload or fatigue load Sexual behavior event.Therefore, accurate reliable feedback signal is Failure Diagnosis of Hydraulic System and high-precision servo-controlled premise, wherein pressure Signal is mostly important hydraulic system operating mode feedback signal.

The operating temperature of high-power hydraulic system is since temperature is higher, the measuring temperature of the hydraulic pressure sensor of commercialization 125 DEG C of temperature are below, can not also be worked in 150 DEG C of temperature ranges.Main cause is existing hydraulic pressure sensor encapsulation Technology can't ensure sensor long-term stable operation under the severe hydraulic environment such as high temperature, strong vibration, corrosivity.Sensor seals Assembling structure is the connection of presser sensor chip and carrier or shell, and the quality of encapsulation directly affects the performance of sensor.Pressure The packaging method of sensor mainly has two kinds of soft sealing-in and hard sealing-in.Soft sealing-in refers to silica gel and adhering with epoxy resin.Hard envelope It connects and refers to anode linkage, Si direct bonding, eutectic bonding and glass capsulation etc..Since pressure sensor is needed severe It works under hydraulic environment, common encapsulation technology cannot meet the encapsulation requirement of hydraulic pressure sensor well.

From the above analysis, the pressure sensor package being used under the severe hydraulic environment such as high temperature, strong vibration, corrosivity The greatest problem faced is to ensure that presser sensor chip can carry out pressure measurement steadily in the long term in large temperature range.

Invention content

The technical problem to be solved in the present invention is to provide a kind of high temperature hydraulic pressure sensor-packaging structures, to realize pressure Sensitive chip being capable of steady operation in large temperature range.

In order to solve the above technical problems, the technical solution adopted by the present invention is:A kind of high temperature hydraulic pressure sensor encapsulation Structure, including base of ceramic, gland, central tube, inner cylinder, cylinder barrel, outer cover, the outer enclosure and interior cap;

The upper and lower surface of the base of ceramic in an axial direction opens up the first groove and the second groove respectively, is put in the first groove Substrate is set, SOI chip varistors are bonded on substrate, the first heat sink structure is placed in the second groove;Base of ceramic bottom configures gland, The mounting hole for installing stem is accordingly provided on base of ceramic and gland;

Central tube, which is configured at base of ceramic periphery and is limited with base of ceramic, to be coordinated, and the gland side is contacted with center inside pipe wall Cooperation;

Inner cylinder is configured on the outside of central tube and is threadably secured with center pipe outer wall and connect;

The cylinder barrel is configured at central tube top, forms gap between cylinder barrel and inner cylinder, lower part and top difference in the gap Second heat sink structure and piston are installed;

The outer cover has closing top surface and open bottom, and enclosure configurations are equipped with ring on the outside of inner cylinder between inner cylinder and outer cover Key;The ring key is embedded in the annular groove between inner cylinder and outer cover;

The outer enclosure is fixedly mounted in shield base;

Interior cap of the outer cover internal upper part configuration with centre bore, interior cap form first chamber, the first chamber with outer cover inside top surface Indoor location needle stand;Interior cap forms second chamber with gland, and the base of ceramic is installed in second chamber;Needle stand have with The central boss of the centre bore cooperation of interior cap, thimble is provided between the central boss and SOI chip varistors.

Further, the central tube upper inner is recessed to form step body structure, the step body structure upper and pottery Gap is formed between porcelain pedestal, the first glass is housed in the gap.

Further, annular recess is arranged in base of ceramic bottom margin, and step body structure bottom is limited with the recessed portion Position cooperation.

Further, the inner wall of the hole installing configures the second glass.

Further, iron nickel cobalt kovar alloy lead is pre-oxidized before the second glass sealing, is allowed to Surface Creation One layer of FeO and Fe3O4Oxidation film.

Further, first heat sink structure and the second heat sink structure are made of fin and phase-change material, wherein phase transformation Material is that additive amount is 30%(Mass percent)Long wall carbon nano tube and paraffin mixture.

Further, Double-conical-surface rubber seal ring is set on the contact surface of the outer enclosure and outer cover.

Further, " O " type rubber seal, contact of the outer cover with inner cylinder are set on one or more contact surfaces below Face, the contact surface of inner cylinder and piston, inner cylinder and the contact surface and cylinder barrel of cylinder barrel and the contact surface of piston.

Further, the encapsulating structure generally cylinder, the diameter of cylinder and the ratio of length are D/L=0.4- 0.5。

Further, the outer cover end face radially converges 2 ° of taper with micron order.

In the present invention, the expansive force generated after the heated thawing that softens of the second heat sink structure pushes piston, and piston is made to slip over lock The firmly position of ring key is fallen into after the unlock of ring key on cylinder barrel, and outer cover and inner cylinder produce relative sliding, to realize the work in thermal stress With the micro expansion of lower each component of compensation.The encapsulating structure can not only effectively reduce technology stress and high temperature thermal stress and be passed to pressure The influence of sensor sensitive chip, but also energy anti-vibration, corrosion resistance liquid, achieve the purpose that ensure sensor reliable measurements.

Description of the drawings

Attached drawing herein is used for providing the further explanation to the present invention, constitutes part of this application, of the invention shows Meaning property embodiment and its explanation are used for explaining the present invention, not constitute improper limitations of the present invention.

Fig. 1 is pressure sensor packaging structure schematic diagram.

Fig. 2 is cover structure schematic diagram.

Fig. 3 is the structural schematic diagram of base of ceramic.

In figure, 1- base of ceramic, 2- glands, 3- central tubes, 4- inner cylinders, 5- cylinder barrels, 6- outer covers, the outer enclosures of 7-, 8- inner covers Cap, the first grooves of 9-, the second grooves of 10-, 11- substrates, 12-SOI chip varistors, the first heat sink structures of 13-, 14- stems, 15- mounting holes, the second heat sink structures of 16-, 17- pistons, 18- ring keys, 19- needle stands, 20- thimbles, the first glass of 21-, 22- second Glass, 23- Double-conical-surface rubber seal rings, 24- " O " type rubber seal.

Specific implementation mode

In order to make those skilled in the art be better understood from the present invention, below in conjunction with refer to the attached drawing and in conjunction with the embodiments to this Further clear, complete explanation is made in invention.It should be noted that in the absence of conflict, embodiment in the application and Feature in embodiment can be combined with each other.

In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", "upper", "lower", The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark Show that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as pair The limitation of the present invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can To express or implicitly include one or more this feature.In the description of the present invention, unless otherwise indicated, " multiple " It is meant that two or more.

For under the severe hydraulic environment such as high temperature, strong vibration, corrosivity, pressure sensor haves the shortcomings that reliability is low, Around the pressure measurement requirement of hydraulic system, the present invention devises a kind of pressure sensing that can be applied in high-power hydraulic system Device encapsulating structure, since high-temp pressure sensor needs to work at very high temperatures, the selection of suitable encapsulation scheme is high The key factor that can temperature and pressure force snesor work normally.

A kind of high temperature hydraulic pressure sensor-packaging structure that typical embodiment provides of the present invention, with reference to figure 1, including Base of ceramic 1, gland 2, central tube 3, inner cylinder 4, cylinder barrel 5, outer cover 6, the outer enclosure 7 and interior cap 8.

With reference to figure 3, the upper and lower surface of base of ceramic 1 in an axial direction opens up the first groove 9 and the second groove 10 respectively, Substrate 11 is placed in first groove 9, and SOI chip varistors 12 are bonded on substrate 11, the first heat sink structure is placed in the second groove 10 13;1 bottom of base of ceramic configures gland 2, and the installation for installing stem 14 is accordingly provided on base of ceramic 1 and gland 2 Hole 15.

In above-mentioned pressure sensor packaging structure, SOI chip varistor bearing modes use substrate embedded type, i.e., by SOI Chip varistor is embedded in thermal conductivity height, with the matched substrate of chip CTE, not only can guarantee hot property, but also do not reduce ring Border isolation capacity.Substrate is consistent with chip substrates, is all SOI materials.

First heat sink structure 13 is used to, to the transient state heat management of chip, deposit to reduce operating temperature cataclysm and temperature gradient The chip Under Thermal Fatigue Damage caused by.

Central tube 3, which is configured at 1 periphery of base of ceramic and is limited with base of ceramic, to be coordinated, 2 side of the gland and central tube 3 Inner wall is engaged.

Inner cylinder 4 is configured at 3 outside of central tube and is threadably secured with 3 outer wall of central tube and connect.

The cylinder barrel 5 is configured at 3 top of central tube, forms gap between cylinder barrel 5 and inner cylinder 4, in the gap lower part and Top is installed by the second heat sink structure 16 and piston 17 respectively.

With reference to figure 1 and Fig. 2, there is outer cover 6 closing top surface and open bottom, outer cover 6 to be configured at 4 outside of inner cylinder, inner cylinder 4 Ring key 18 is equipped between outer cover 6;The ring key 18 is embedded in the annular groove between inner cylinder 4 and outer cover 5, is prevented under normal conditions Cylinder 4 generates displacement in the axial direction with outer cover 5.The outer cover 5 bears each component weight and central tube 3, interior by hang The expansive force that the flexible compensation of the components compositions such as cylinder 4 and the heated softening of the second heat sink structure generate after melting.

The outer enclosure 7 is fixedly mounted in 6 bottom of outer cover.The outer enclosure 7 is to be connected through a screw thread to be fixed together with outer cover 6. For the outer enclosure 7 including bottom cover body and along the side edge that cover body inner edge convexes to form, the side is central tube 3 and outer cover respectively along both sides 6, side is connect along outside with 6 inner thread of outer cover.

Interior cap 8 of 6 internal upper part of the outer cover configuration with centre bore, interior cap 8 form the first chamber with 6 inside top surface of outer cover Room, first chamber is interior to install needle stand 19;Interior cap 8 forms second chamber with gland 2, and the ceramic base is installed in second chamber Seat 1;Needle stand 19 has the central boss coordinated with the centre bore of interior cap 8, between the central boss and SOI chip varistors 12 It is provided with thimble 20.

According to embodiment of above, the expansive force generated after the heated thawing that softens of the second heat sink structure 16 pushes piston 17, Piston 17 is set to slip over the position for lockking ring key 18, ring key 18 is fallen into after unlocking on cylinder barrel 5, and outer cover 6 and inner cylinder 4 are generated and slided relatively It is dynamic, to realize the micro expansion for compensating each component under the action of thermal stress.

As a preferred embodiment, with reference to figure 1,3 upper inner of the central tube is recessed to form step body structure, Gap is formed between the step body structure upper and base of ceramic 1, the first glass 21 is housed in the gap.

As a kind of opposite specific embodiment, with reference to figure 1, annular recess is arranged in 1 bottom margin of base of ceramic, in The step body structure bottom of heart pipe 3 coordinates with recessed portion limit.

As a preferred embodiment, with reference to figure 1,15 the second glass of inner wall arrangement 22 of the mounting hole.In ceramics The embedding of glass process for sealing realization lead is broken using using crystallization in pedestal 1, original glass tensile strength can be made to reach 5 times More than.

As a preferred embodiment, carrying out pre- oxygen to iron nickel cobalt kovar alloy lead before 22 sealing-in of the second glass Change, is allowed to one layer of FeO and Fe of Surface Creation3O4Oxidation film effectively controls sealing-in to improve glass in the wellability of metal surface Quality.

As a preferred embodiment, first heat sink structure, 13 and second heat sink structure 16 is by fin and phase transformation Material is constituted, and it is 30% that wherein phase-change material, which is additive amount,(Mass percent)Long wall carbon nano tube and paraffin mixture, institute Heat sink structure is stated to adapt to have interval heat generation characteristic or the workplace under pulsed temperature environment.Using paraffin with The capillary force and the characteristics such as porous structure and nonpolarity of solid-liquid surface tension, pore structure between long wall carbon nano tube, Long wall carbon nano tube is blended with paraffin in the water bath of 100oC to absorption 8 hours, prepares composite heat sink material.

As a preferred embodiment, with reference to figure 1, the outer enclosure 7 and setting Double-conical-surface rubber on the contact surface of outer cover 6 Sealing ring 23.The outer enclosure 7 is to be connected through a screw thread to be fixed together, and pass through above-mentioned 1 Double-conical-surface rubber seal ring with outer cover 6 23 realize first order sealing, to reduce the Thermal-mechanical Coupling deformation and hydrostatic lubrication of the entire seal face in hyperbaric environment Effect causes the influence of sealing ring deformation.

As a preferred embodiment, setting " O " type rubber seal 24 on following one or more contact surface:Outside The contact surface and cylinder barrel 5 and piston of cover 6 and the contact surface of inner cylinder 4, the contact surface of inner cylinder 4 and piston 17, inner cylinder 4 and cylinder barrel 5 17 contact surface.

To prevent high temperature high pressure liquid from being leaked from outer cover 6 between inner cylinder, 1 " O " type rubber is housed between them Glue sealing ring realizes second level sealing.And between inner cylinder 4 and cylinder barrel 5, cylinder barrel 5 and piston 17, piston 17 and inner cylinder 4, also pacify " O " type of dress rubber seal 24 so that it is empty that the liquid of high temperature and pressure cannot be introduced into the sealing that inner cylinder 4, cylinder barrel 5 and piston 17 form Between, the second heat sink structure 16 in sealing space will not be polluted.

As a preferred embodiment, the encapsulating structure generally cylinder, the diameter of cylinder and length Ratio is D/L=0.4-0.5.The extensional vibration that pulse shock resilient support cylinder in hydraulic system can be limited is responded one Determine range, reduce pressure peak as far as possible, to avoid mechanical resonance.

As a preferred embodiment, with reference to figure 2,6 end face of the outer cover radially converges 2 ° of taper with micron order, To realize that outer cover realizes the mechanical seal between hydraulic pipeline.

All hardwares can be used electrostatic painting process painting and be covered with polyphenylene sulfide/polytetrafluoroethylene (PTFE) in the present invention Coating, to reach high temperature resistant, anti-corrosive properties, scale inhibition performance, super-hydrophobicity and wear resistance.

The method design that encapsulating structure provided by the invention is combined using soft sealing-in and hard sealing-in, each encapsulating structure There is good thermal conductivity between component, is not in some component or the excessively high phenomenon of spot temperature;Entire encapsulating structure is each The coefficient of thermal expansion of component is more close, there is preferable thermal shock resistance;Between each component of encapsulating structure and each component There is good thermo-chemical stability, do not occur at high operating temperatures or chemically reacts less as far as possible;The encapsulating structure Can not only effectively reduce the influence of technology stress and high temperature thermal stress to pressure sensor sensitive chip, but also can anti-vibration, Corrosion resistance liquid achievees the purpose that ensure sensor reliable measurements.

The scope of protection of present invention is not limited to the above specific implementation mode, to those skilled in the art, this Invention can there are many deformation and change, it is all the present invention design within principle made by it is any modification, improve and be equal Replacement should be all included within protection scope of the present invention.

Claims (10)

1. a kind of high temperature hydraulic pressure sensor-packaging structure, including base of ceramic, gland, central tube, inner cylinder, cylinder barrel, outer cover, The outer enclosure and interior cap;
The upper and lower surface of the base of ceramic in an axial direction opens up the first groove and the second groove respectively, is put in the first groove Substrate is set, SOI chip varistors are bonded on substrate, the first heat sink structure is placed in the second groove;Base of ceramic bottom configures gland, The mounting hole for installing stem is accordingly provided on base of ceramic and gland;
Central tube, which is configured at base of ceramic periphery and is limited with base of ceramic, to be coordinated, and the gland side is contacted with center inside pipe wall Cooperation;
Inner cylinder is configured on the outside of central tube and is threadably secured with center pipe outer wall and connect;
The cylinder barrel is configured at central tube top, forms gap between cylinder barrel and inner cylinder, lower part and top difference in the gap Second heat sink structure and piston are installed;
The outer cover has closing top surface and open bottom, and enclosure configurations are equipped with ring on the outside of inner cylinder between inner cylinder and outer cover Key;The ring key is embedded in the annular groove between inner cylinder and outer cover;
The outer enclosure is fixedly mounted in shield base;
Interior cap of the outer cover internal upper part configuration with centre bore, interior cap form first chamber, the first chamber with outer cover inside top surface Indoor location needle stand;Interior cap forms second chamber with gland, and the base of ceramic is installed in second chamber;Needle stand have with The central boss of the centre bore cooperation of interior cap, thimble is provided between the central boss and SOI chip varistors.
2. high temperature hydraulic pressure sensor-packaging structure according to claim 1, it is characterised in that:The central tube top Inside is recessed to form step body structure, and gap is formed between the step body structure upper and base of ceramic, is housed in the gap First glass.
3. high temperature hydrostatic sensor encapsulating structure according to claim 2, it is characterised in that:Base of ceramic bottom margin is set Annular recess is set, step body structure bottom coordinates with recessed portion limit.
4. high temperature hydrostatic sensor encapsulating structure according to claim 1 or 2 or 3, it is characterised in that:In the mounting hole Wall configures the second glass.
5. high temperature hydrostatic sensor encapsulating structure according to claim 4, it is characterised in that:It is right before the second glass sealing Iron nickel cobalt kovar alloy lead is pre-oxidized, and one layer of FeO and Fe of Surface Creation is allowed to3O4Oxidation film.
6. the high temperature hydrostatic sensor encapsulating structure according to claim 1,2,3 or 5, it is characterised in that:First heat Sink structure and the second heat sink structure are made of fin and phase-change material, and it is 30% that wherein phase-change material, which is additive amount,(Quality percentage Than)Long wall carbon nano tube and paraffin mixture.
7. high temperature hydrostatic sensor encapsulating structure according to claim 6, it is characterised in that:Contact of the outer enclosure with outer cover Double-conical-surface rubber seal ring is set on face.
8. high temperature hydrostatic sensor encapsulating structure according to claim 7, it is characterised in that:Following one or more contacts " O " type rubber seal is set on face, and outer cover and the contact surface of inner cylinder, the contact surface of inner cylinder and piston, inner cylinder and cylinder barrel connect The contact surface of contacting surface and cylinder barrel and piston.
9. high temperature hydrostatic sensor encapsulating structure according to claim 7 or 8, it is characterised in that:The encapsulating structure is whole Body is cylinder, and the diameter of cylinder and the ratio of length are D/L=0.4-0.5.
10. high temperature hydrostatic sensor encapsulating structure according to claim 9, it is characterised in that:The outer cover end face carries Micron order radially converges 2 ° of taper.
CN201810417624.1A 2018-05-04 High-temperature hydraulic pressure sensor packaging structure CN108593195B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810417624.1A CN108593195B (en) 2018-05-04 High-temperature hydraulic pressure sensor packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810417624.1A CN108593195B (en) 2018-05-04 High-temperature hydraulic pressure sensor packaging structure

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Publication Number Publication Date
CN108593195A true CN108593195A (en) 2018-09-28
CN108593195B CN108593195B (en) 2020-03-17

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Publication number Priority date Publication date Assignee Title
US4832081A (en) * 1984-03-01 1989-05-23 Mannesmann Rexroth Gmbh Control valve
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CN203385509U (en) * 2013-06-13 2014-01-08 安徽艾可蓝节能环保科技有限公司 Antifreezing packaging for ceramic pressure sensor

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