CN112254872A - High-temperature pressure sensor with vacuum heat insulation cavity - Google Patents
High-temperature pressure sensor with vacuum heat insulation cavity Download PDFInfo
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- CN112254872A CN112254872A CN202011542289.1A CN202011542289A CN112254872A CN 112254872 A CN112254872 A CN 112254872A CN 202011542289 A CN202011542289 A CN 202011542289A CN 112254872 A CN112254872 A CN 112254872A
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- pressure
- sensor
- pressure sensor
- high temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0681—Protection against excessive heat
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0672—Leakage or rupture protection or detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a high-temperature pressure sensor of a vacuum heat insulation cavity, which comprises: the first end of the pressure guide nozzle is communicated with the outside; the pressure sensing core body is fixedly connected to a second end, opposite to the first end, of the pressure guide nozzle; the first inner shell is fixedly connected with the second end of the pressure-inducing nozzle to form a first vacuum cavity for accommodating the pressure-sensing core body; the second inner shell is fixedly connected with the second end of the pressure leading nozzle to form a second vacuum cavity for accommodating the first vacuum cavity; the circuit board is arranged in the second vacuum cavity and is electrically connected with the pressure sensing core body; and the sensor shell is fixedly connected with the second end of the pressure guide nozzle to form a third vacuum cavity for accommodating the second vacuum cavity. The invention realizes the measurement of high-temperature pressure with low cost, and the integrated design of the sensor and the circuit is realized because the sensor is internally provided with the circuit, so that the standard electric signal can be directly output for a back-end system to use.
Description
Technical Field
The invention belongs to the field of sensors, and particularly relates to a three-vacuum heat insulation cavity high-temperature pressure sensor capable of measuring plate temperature.
Background
The measurement of the pressure of high-temperature medium or high-temperature environment needs to use a high-temperature pressure sensor. The high-temperature pressure sensor on the market at present generally adopts a split type design, namely, a pressure sensing core body and a circuit board are packaged in two shells and connected through a section of cable, and the form is inflexible in installation and occupies relatively large space; or use high temperature components and parts in order to realize the integration encapsulation, the high temperature components and parts that this kind of design chose for use are difficult to purchase, and are with high costs, and the selection scope is narrow, and mostly need import.
Therefore, it is necessary to design a sensor suitable for high temperature environment or high temperature medium pressure measurement to meet the market demand.
Disclosure of Invention
In order to achieve the above object, the present invention provides a three-vacuum thermal insulation chamber high temperature pressure sensor capable of measuring a plate temperature. The specific scheme is as follows:
a vacuum insulated chamber high temperature pressure sensor, the high temperature pressure sensor comprising:
the first end of the pressure guide nozzle is communicated with the outside;
the pressure sensing core body is fixedly connected to a second end, opposite to the first end, of the pressure guide nozzle;
the first inner shell is fixedly connected with the second end of the pressure-inducing nozzle to form a first vacuum cavity for accommodating the pressure-sensing core body;
the second inner shell is fixedly connected with the second end of the pressure leading nozzle to form a second vacuum cavity for accommodating the first vacuum cavity;
the circuit board is arranged in the second vacuum cavity and is electrically connected with the pressure sensing core body;
and the sensor shell is fixedly connected with the second end of the pressure guide nozzle to form a third vacuum cavity for accommodating the second vacuum cavity.
Optionally, the sensor further comprises an electrical connector connected with the sensor housing, and the electrical connector is electrically connected with a back-end system and outputs the high-temperature pressure sensor electrical signal.
Optionally, the electrical connector is a sintered metal shipping insert.
Optionally, the outer surface of the second inner housing and/or the sensor housing is mirror finished.
Optionally, the circuit board is fixedly connected to the inner side of the second inner housing.
Optionally, the device further comprises a temperature sensor arranged on the circuit board.
Optionally, the temperature sensor is a platinum resistance temperature sensor.
Optionally, the fixed connection is vacuum electron beam welding.
Optionally, the pressure guiding nozzle comprises a pressure guiding cavity communicated with the outside.
Optionally, the pressure sensing core comprises a MEMS pressure sensor.
The invention provides a novel high-temperature pressure sensor, wherein a circuit board using components in a common temperature range is arranged in a shell of three vacuum heat insulation cavities, so that the cost is reduced, meanwhile, mirror polishing treatment is carried out on the outer surfaces of a stainless steel inner shell and the sensor shell so as to prevent convection heat transfer and radiation heat transfer, and the working time of the sensor in a high-temperature environment is prolonged so as to realize the measurement of the pressure in the high-temperature environment. In addition, a platinum resistor temperature sensor is arranged on the circuit board, the temperature of the circuit board is monitored in real time, whether the vacuum cavity leaks air or not is indirectly verified, and the risk of high-temperature damage of the product is reduced. And because the sensor is internally provided with a circuit, the integrated design of the sensor and the circuit is realized, and the standard electric signal can be directly output for a back-end system to use.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic structural diagram of a high-temperature pressure sensor in a vacuum insulation chamber according to an embodiment of the present invention.
In the figure: 1. the pressure-inducing core body 2, the pressure-sensing core body 3, the first inner shell 4, the second inner shell 5, the screw 6, the metal elastic pad 7, the flat pad 8, the circuit board 9, the stud 10, the temperature sensor 11, the sensor shell 12 and the electric connector.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments. The following embodiments are divided for convenience of description, and should not constitute any limitation to the specific implementation manner of the present invention, and the embodiments may be mutually incorporated and referred to without contradiction.
The first embodiment of the invention relates to a high-temperature pressure sensor with a vacuum heat insulation cavity, and the specific structure of the high-temperature pressure sensor is shown in figure 1.
The high temperature referred to in the present invention means that the temperature of the tested environment or medium is above 200 ℃, and provides a high temperature pressure sensor of a vacuum heat insulation cavity, which comprises: the pressure guide nozzle 1 is communicated with the outside at the first end of the pressure guide nozzle 1; for example, a pressure guiding cavity may be formed inside the pressure guiding nozzle 1, and the outside refers to a test environment or a test medium; the pressure sensing core body 2 is fixedly connected to a second end, opposite to the first end, of the pressure guide nozzle 1, for example, the pressure sensing core body is fixed on the pressure guide nozzle 1 in a welding mode so as to realize the sealing of a measured medium, and fluid transmits pressure to the pressure sensing core body 2 through the pressure guide cavity; the pressure sensing core 2 is used for testing the environmental or medium pressure transmitted through the pressure guiding nozzle 1, and can be various pressure sensors suitable for the field, such as a MEMS pressure sensor; a first inner shell 3 fixedly connected with a second end of the pressure-leading nozzle to form a first vacuum cavity for accommodating the pressure-sensing core body 2; the second inner shell 4 is fixedly connected with the second end of the pressure guiding nozzle 1 to form a second vacuum cavity for accommodating the first vacuum cavity; the circuit board 8 is arranged in the second vacuum cavity and is electrically connected with the pressure sensing core body 2; a circuit for processing the signal transmitted by the pressure-sensitive core body 2 is arranged on the circuit board 8; the sensor housing 11 is fixedly connected to the second end of the pressure nozzle 1 to form a third vacuum chamber for accommodating the second vacuum chamber.
Specifically, in order to avoid the influence of high-temperature environment or medium on the device, the invention forms three heat-insulating vacuum cavities, wherein the outer surfaces of the second inner shell 4 and the sensor shell 11 are subjected to mirror polishing treatment, and the inner surface of the first inner shell is subjected to mirror polishing treatment, so that the heat transfer by convection and the heat transfer by radiation are effectively prevented.
The first inner shell 3, the second inner shell 4 and the sensor shell 11 can be made of stainless steel materials due to the need of welding.
Alternatively, vacuum electron beam welding can be used for the fixed connection of the first inner shell 3, the second inner shell 4, the sensor housing 11 and the pressure nozzle 1.
Alternatively, the circuit board 8 of the present invention may be a component with a common temperature range, and it may be fixed inside the second inner case 4 by two studs 9, screws 5, metal elastic pads 6 and flat pads 7. The stud 9 is fixed to the second inner housing 4 by means of a screw thread.
In order to monitor the temperature of the circuit board 8 in real time, in one embodiment of the present invention, a temperature sensor 10 is installed on the circuit board 8, and the temperature sensor 10 is, for example, a platinum resistor temperature sensor, so that it is possible to indirectly verify whether the vacuum chamber leaks air while monitoring the temperature of the circuit board 8, thereby reducing the risk of high-temperature damage to the product and protecting the internal circuit board.
Optionally, the sensor housing 11 further includes an electrical connector 12, so as to electrically connect the vacuum insulation cavity high-temperature pressure sensor with the back-end system and output an electrical signal of the high-temperature pressure sensor; in particular, the electrical connector 12 is, for example, a sintered metal aviation plug, which is connected to the sensor housing 11 by vacuum electron beam welding.
The invention provides a three-vacuum heat insulation cavity high-temperature pressure sensor capable of measuring the plate temperature, wherein a circuit board using components in a common temperature range is arranged in a shell of the three-vacuum heat insulation cavity, so that the cost is reduced, meanwhile, mirror polishing treatment is carried out on the outer surfaces of a stainless steel inner shell and the shell of the sensor so as to prevent convection heat transfer and radiation heat transfer, and the working time of the sensor in a high-temperature environment is prolonged so as to realize the measurement of the pressure in the high-temperature environment. In addition, a platinum resistor temperature sensor is arranged on the circuit board, the temperature of the circuit board is monitored in real time, whether the vacuum cavity leaks air or not is indirectly verified, and the risk of high-temperature damage of the product is reduced. And because the sensor is internally provided with a circuit, the integrated design of the sensor and the circuit is realized, and the standard electric signal can be directly output for a back-end system to use.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (10)
1. A high temperature pressure sensor for a vacuum insulated chamber, the high temperature pressure sensor comprising:
the first end of the pressure guide nozzle is communicated with the outside;
the pressure sensing core body is fixedly connected to a second end, opposite to the first end, of the pressure guide nozzle;
the first inner shell is fixedly connected with the second end of the pressure-inducing nozzle to form a first vacuum cavity for accommodating the pressure-sensing core body;
the second inner shell is fixedly connected with the second end of the pressure leading nozzle to form a second vacuum cavity for accommodating the first vacuum cavity;
the circuit board is arranged in the second vacuum cavity and is electrically connected with the pressure sensing core body;
and the sensor shell is fixedly connected with the second end of the pressure guide nozzle to form a third vacuum cavity for accommodating the second vacuum cavity.
2. The vacuum insulated chamber high temperature pressure sensor according to claim 1, further comprising an electrical connector connected to the sensor housing, the electrical connector being electrically connected to a back-end system for outputting the high temperature pressure sensor electrical signal.
3. The vacuum insulated chamber high temperature pressure sensor of claim 2, wherein the electrical connector is a sintered metal boat.
4. The vacuum insulated chamber high temperature pressure sensor according to claim 1, wherein the outer surface of the second inner casing and/or the sensor housing is mirror polished.
5. The vacuum insulated chamber high temperature pressure sensor of claim 1, wherein the circuit board is fixedly attached to the inside of the second inner shell.
6. The vacuum insulated chamber high temperature pressure sensor according to claim 1 or 5, further comprising a temperature sensor disposed on the circuit board.
7. The high temperature and pressure sensor of claim 6, wherein the temperature sensor is a platinum resistance temperature sensor.
8. The vacuum insulated chamber high temperature pressure sensor of claim 1, wherein the fixed connection is a weld.
9. The high temperature and pressure sensor with vacuum insulated cavity as claimed in claim 1, wherein the pressure guiding nozzle comprises a pressure guiding cavity communicated with the outside.
10. The vacuum insulated chamber high temperature pressure sensor of claim 1, wherein the pressure sensitive core comprises a MEMS pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011542289.1A CN112254872B (en) | 2020-12-24 | 2020-12-24 | High-temperature pressure sensor with vacuum heat insulation cavity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011542289.1A CN112254872B (en) | 2020-12-24 | 2020-12-24 | High-temperature pressure sensor with vacuum heat insulation cavity |
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| Publication Number | Publication Date |
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| CN112254872A true CN112254872A (en) | 2021-01-22 |
| CN112254872B CN112254872B (en) | 2021-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011542289.1A Active CN112254872B (en) | 2020-12-24 | 2020-12-24 | High-temperature pressure sensor with vacuum heat insulation cavity |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113899493A (en) * | 2021-11-02 | 2022-01-07 | 西安交通大学苏州研究院 | Pressure sensor applied to ultralow temperature environment |
| CN114046926A (en) * | 2021-11-11 | 2022-02-15 | 西安热工研究院有限公司 | High-temperature-resistant dynamic pressure sensor |
| CN114088231A (en) * | 2021-11-05 | 2022-02-25 | 中国航发沈阳发动机研究所 | Temperature testing device for rotor part of low-pressure turbine in complete state of aircraft engine |
| CN114112179A (en) * | 2021-11-05 | 2022-03-01 | 天津航空机电有限公司 | Current type high-precision pressure sensor with heat insulation structure |
| CN114112182A (en) * | 2021-11-05 | 2022-03-01 | 天津航空机电有限公司 | High-reliability pressure sensor structure with support structure |
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| JP2012211869A (en) * | 2011-03-31 | 2012-11-01 | Azbil Corp | Pressure sensor device |
| CN108593195A (en) * | 2018-05-04 | 2018-09-28 | 中北大学 | High temperature hydraulic pressure sensor-packaging structure |
| CN111780919A (en) * | 2020-06-17 | 2020-10-16 | 慧石（上海）测控科技有限公司 | High-temperature-resistant heat-insulation pressure sensor |
| CN211784045U (en) * | 2020-05-22 | 2020-10-27 | 无锡市凯丰压力表有限公司 | Pressure gauge with high temperature resistance and corrosion resistance |
| CN212007063U (en) * | 2020-06-23 | 2020-11-24 | 扬州熙源电子科技有限公司 | Piezoelectric type vibration displacement measuring sensor |
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2020
- 2020-12-24 CN CN202011542289.1A patent/CN112254872B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012211869A (en) * | 2011-03-31 | 2012-11-01 | Azbil Corp | Pressure sensor device |
| CN108593195A (en) * | 2018-05-04 | 2018-09-28 | 中北大学 | High temperature hydraulic pressure sensor-packaging structure |
| CN211784045U (en) * | 2020-05-22 | 2020-10-27 | 无锡市凯丰压力表有限公司 | Pressure gauge with high temperature resistance and corrosion resistance |
| CN111780919A (en) * | 2020-06-17 | 2020-10-16 | 慧石（上海）测控科技有限公司 | High-temperature-resistant heat-insulation pressure sensor |
| CN212007063U (en) * | 2020-06-23 | 2020-11-24 | 扬州熙源电子科技有限公司 | Piezoelectric type vibration displacement measuring sensor |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113899493A (en) * | 2021-11-02 | 2022-01-07 | 西安交通大学苏州研究院 | Pressure sensor applied to ultralow temperature environment |
| CN114088231A (en) * | 2021-11-05 | 2022-02-25 | 中国航发沈阳发动机研究所 | Temperature testing device for rotor part of low-pressure turbine in complete state of aircraft engine |
| CN114112179A (en) * | 2021-11-05 | 2022-03-01 | 天津航空机电有限公司 | Current type high-precision pressure sensor with heat insulation structure |
| CN114112182A (en) * | 2021-11-05 | 2022-03-01 | 天津航空机电有限公司 | High-reliability pressure sensor structure with support structure |
| CN114112179B (en) * | 2021-11-05 | 2024-04-09 | 天津航空机电有限公司 | Current type high-precision pressure sensor with heat insulation structure |
| CN114112182B (en) * | 2021-11-05 | 2024-04-09 | 天津航空机电有限公司 | High-reliability pressure sensor structure with support structure |
| CN114088231B (en) * | 2021-11-05 | 2024-07-05 | 中国航发沈阳发动机研究所 | Temperature testing device for low-pressure turbine rotor component in complete machine state of aero-engine |
| CN114046926A (en) * | 2021-11-11 | 2022-02-15 | 西安热工研究院有限公司 | High-temperature-resistant dynamic pressure sensor |
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| CN112254872B (en) | 2021-09-21 |
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