CN108541108B - LED lamp bead packaging structure and LED display screen - Google Patents
LED lamp bead packaging structure and LED display screen Download PDFInfo
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- CN108541108B CN108541108B CN201810442082.3A CN201810442082A CN108541108B CN 108541108 B CN108541108 B CN 108541108B CN 201810442082 A CN201810442082 A CN 201810442082A CN 108541108 B CN108541108 B CN 108541108B
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- 239000011324 bead Substances 0.000 title claims abstract description 69
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 42
- 235000012431 wafers Nutrition 0.000 claims abstract description 103
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 230000002159 abnormal effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
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- 229920005989 resin Polymers 0.000 description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
Abstract
The invention discloses an LED lamp bead packaging structure and an LED display screen. The LED lamp bead driving circuit comprises a packaging substrate, a packaging layer, a driving circuit combined chip and n LED wafers, wherein the driving circuit combined chip and the n LED wafers are packaged on the packaging substrate through the packaging layer, n is a positive integer, n wafer driving circuits are integrated in the driving circuit combined chip, and each LED wafer is controlled to be turned on and off through one wafer driving circuit; each wafer drive circuit is used for receiving a row drive signal and a column drive signal, and when the wafer drive circuits commonly receive the row drive signal and the column drive signal, the wafer drive circuits light the corresponding LED wafers. The invention further provides an LED display screen based on the LED lamp bead packaging structure.
Description
Technical Field
The invention relates to the technical field of LED display screens, in particular to an LED lamp bead driving circuit, a driving system, an LED lamp bead packaging structure and an LED display screen.
Background
The LED has the advantages of low voltage, energy saving, long service life and the like, and is widely applied to various fields at present.
According to the scanning mode of the LED display screen, the LED display screen can be divided into a dynamic screen and a static screen, wherein the static screen means that each scanning line is simultaneously opened, and each LED lamp is controlled by a different driving chip; the dynamic screen uses the visual stop of human eyes, which displays only one line at a certain time, then displays the next line at the next time until all lines are displayed, then displays the first line, and so on, and circularly displays the images so as to achieve the purpose of displaying the whole image.
As shown in fig. 1, the eight-scan LED display screen is composed of eight time-sharing lines, for example, one diagonal stripe can be displayed in sequence by eight time-sharing lines, and each line is composed of one LED lamp; the LED display screen structure is shown in fig. 2, and the following electronic components are directly attached on a conventional PCB 02: an LED lamp 01, a column constant current driving chip 03, and a row driving chip 04; as shown in fig. 3, the internal structure of the LED lamp includes a holder 04, a red die 01, a green die 02, a blue die 03, and bonding wires 05 (gold wires, copper wires, or alloy wires) inside the LED lamp packaged with a material such as PPA or resin as a case.
However, in the conventional scanning display mode of the dynamic screen, the number of the LED display screen chips is large, so that the number of the PCB wiring lines is increased, and the space of the PCB is limited, so that the wiring difficulty is increased, the wiring of an analog circuit (a signal output by a driving chip) on the PCB is complicated, and the circuit is difficult to meet the electrical performance requirement of a lamp tube, so that the phenomena of uneven low gray, low gray color cast, high-low gray contrast coupling and cross-board color difference appear on the display effect; the anodes of the same row of LED lamps (i.e., the anodes of the LED chips) are directly interconnected, and the cathodes of the same column of LED lamps (i.e., the cathodes of the LED chips) are directly interconnected, which directly accompanies abnormal phenomena such as dark and bright rows, dark and bright columns, normally bright columns, abnormal colors of columns, and the like on the display effect.
In summary, the existing dynamic LED display screen has the problems that the number of application chips is large, the wiring of a PCB is complex, the application reliability is poor, and the existing COB display screen can not realize the light splitting and color separation of the LED lamp and repair and replacement after the LED lamp is damaged; the LED display screen has the advantages of dark and bright rows, dark and bright columns, extremely bright columns, different colors of columns, low gray uneven, low gray color cast, high and low gray contrast coupling, cross-board color difference, incapability of realizing the pixel spacing of less than 1.0mm and the like.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an LED lamp bead packaging structure and an LED display screen.
In order to achieve the above purpose, the invention adopts the following technical scheme that the LED lamp bead packaging structure is characterized in that: the LED packaging structure comprises a packaging substrate, a packaging layer, a driving circuit combined chip and n LED wafers, wherein the driving circuit combined chip and the n LED wafers are packaged on the packaging substrate through the packaging layer, n is a positive integer, n wafer driving circuits are integrated in the driving circuit combined chip, and each LED wafer is controlled to be turned on and off through one wafer driving circuit; each wafer drive circuit is used for receiving a row drive signal and a column drive signal, and when the wafer drive circuits commonly receive the row drive signal and the column drive signal, the wafer drive circuits light the corresponding LED wafers.
Preferably, the package substrate is a PCB board.
Preferably, the LED chip comprises a drive circuit, a bonding pad and a conductive wire, wherein the drive circuit is arranged on the LED chip and is used for connecting the LED chip and the bonding pad; the bonding pads are assembled on the packaging substrate through the through holes of the packaging substrate.
Preferably, one end of each wafer driving circuit is connected to VDD, and the other end is grounded, and comprises a row driving chip, a single-channel constant current source and a column driving chip, wherein the row driving chip, the single-channel constant current source, the column driving chip and the LED wafer are connected in series between VDD and ground; one switching element in the row driving chip and the column driving chip is used for controlling on-off according to the row driving signal, and the other switching element is used for controlling on-off according to the column driving signal.
Preferably, the row driving chip and the column driving chip are both MOS transistors.
The LED display screen comprises a plurality of LED display screen modules, and each LED lamp bead in each LED display screen module is provided with any LED lamp bead packaging structure.
Preferably, the LED display screen module further comprises a driving system for driving a plurality of LED display screen modules, wherein the driving system comprises a row control chip, a column control chip and a wafer driving circuit in any LED lamp bead packaging structure, and each wafer driving circuit controls the LED wafers in the corresponding LED lamp beads in the LED display screen to be on or off; the row control chip and the column control chip are respectively connected with each wafer driving circuit, the row control chip sends row driving signals to the wafer driving circuits, and the column control chip sends column driving signals to the wafer driving circuits.
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
1. in the LED lamp bead packaging structure, LED wafers of the LED lamp beads are not connected with each other and are controlled to be on or off independently through corresponding wafer driving circuits, so that abnormal phenomena such as dark and bright rows, dark and bright columns, normally bright columns, abnormal colors of columns and the like are radically avoided;
2. one end of each wafer driving circuit is connected with VDD, the other end of each wafer driving circuit is grounded and comprises a row driving chip, a single-way constant current source and a column driving chip, the row driving chip, the single-way constant current source, the column driving chip and the LED wafer are connected in series between the VDD and the ground, and a constant current source is utilized to provide stable current, so that the stability of LED wafer luminescence in each lens driving circuit is ensured, and the possibility of difference of LED wafer luminescence brightness in different wafer driving circuits is reduced;
3. only pure digital signals and no analog signal circuit exist in the driving system of the LED display screen, so that the number of the applied chips is small, wiring difficulty is greatly reduced, and the electrical performance requirement of the LED lamp tube is easily met; moreover, the display effect realized by the driving system has no low gray uneven, no low gray color cast, no high and low gray contrast coupling and no cross-plate color difference phenomenon.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a schematic diagram of a prior art drive system;
FIG. 2 is a schematic side view of a prior art LED display;
FIG. 3 is a schematic diagram of the internal structure of a prior art LED lamp;
fig. 4 is a schematic structural diagram of an LED lamp bead driving circuit in the LED lamp bead package structure according to the embodiment of the present invention;
FIG. 5 is a schematic diagram of the driving circuit of the LED lamp bead shown in FIG. 4;
fig. 6 is a schematic structural diagram of a driving system of an LED display screen according to an embodiment of the present invention;
FIG. 7 is a schematic side view of an embodiment of an LED bead package structure according to an embodiment of the present invention;
FIG. 8 is a schematic top view of the LED bead package structure shown in FIG. 7;
FIG. 9 is a schematic side view of another embodiment of an LED bead package structure according to an embodiment of the present invention;
fig. 10 is a schematic top view of the LED lamp bead package structure shown in fig. 9.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear and obvious, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the claims, specification and drawings of the present invention, the terms "comprising," having, "and variations thereof as used herein, are intended to be" including but not limited to.
As shown in fig. 4, an LED lamp bead driving circuit 100 includes at least one LED chip 10 and at least one chip driving circuit 20, both of which are encapsulated in an LED lamp bead, and each of the chip driving circuits 20 is used for controlling on/off of one of the LED chips 10. In this embodiment, the LED chip in the LED lamp bead may include one or a combination of at least two of a blue LED chip, a red LED chip and a green LED chip.
Wherein each of the wafer drive circuits 20 is configured to receive a row drive signal and a column drive signal, and when the wafer drive circuits 20 commonly receive the row drive signal and the column drive signal, the wafer drive circuits 20 illuminate the corresponding LED wafer 10.
Specifically, one end of each wafer driving circuit 20 is connected to VDD, the other end is grounded, and the wafer driving circuits include a row driving chip 21, a single-channel constant current source 22 and a column driving chip 23, and the row driving chip 21, the single-channel constant current source 22, the column driving chip 23 and the LED wafer 10 are connected in series between VDD and ground. Preferably, the row driver chip 21 and the column driver chip 22 are MOS transistors. The MOS tube comprises an NMOS tube and a PMOS tube. Of course, the present embodiment is not limited to the above embodiment, and the row driving chip 21 and the column driving chip 22 may be control chips such as a single chip with a switching function, which is not limited in the present invention.
In this embodiment, the row driving chip 21, the single-channel constant current source 22, the column driving chip 23 and the LED chip 10 are sequentially connected in series, and the row driving chip 21 is connected to VDD, and the LED chip 10 is grounded. It should be understood that, without limiting the present embodiment, the serial connection sequence of the electronic components in the wafer driving circuit 20 may be selected according to the actual needs, which is not limited by the present invention.
The row driving chip 21 receives the row driving signal and controls on/off according to the row driving signal, and the column driving chip 23 receives the column driving signal and controls on/off according to the column driving signal. Alternatively, the row driving chip 21 may also receive the column driving signal and control on/off according to the column driving signal, and the column driving chip 23 may also receive the row driving signal and control on/off according to the row driving signal.
In this embodiment, the working principle of the LED lamp bead driving circuit is as follows:
when the row driving chip 21 receives the row driving signal and turns on, and the column driving chip 23 receives the column driving signal and turns on, the wafer driving circuit 20 turns on the corresponding LED wafer 10.
It should be understood that, since one LED die may be packaged in a single LED lamp bead, at least two LED dies may also be packaged; and one or at least two full-color pixel points can be arranged in each LED lamp bead, and each full-color pixel point corresponds to one red wafer, one blue wafer and one green wafer. Correspondingly, the LED lamp bead driving circuit 100 is provided with one chip driving circuit 20 for controlling on/off of each LED chip.
For example, as shown in fig. 5, the LED lamp bead driving circuit 100 of a single LED lamp bead includes a red wafer driving circuit 121 for controlling the on/off of the red wafer 101, a green wafer driving circuit 122 for controlling the on/off of the green wafer 102, and a blue wafer driving circuit 123 for controlling the on/off of the blue wafer 103, each of the wafer driving circuits 121, 122, 123 has the same structure, and includes an NMOS transistor 1201, a single constant current source 1202, and a PMOS transistor 1203 connected in series in order;
in addition, each of the chip driving circuits 121, 122, 123 is powered by the external VDD and GND, and for the blue chip driving circuit 123, the blue chip driving circuit 121 determines the on/off of the NMOS transistor 1201 by the row driving signal H0 and determines the on/off of the PMOS transistor 1203 by the column driving signals V0-B; when the NMOS transistor 1201 and the PMOS transistor 1203 are turned on, the single-channel constant current source 1202 provides accurate current to light the corresponding blue wafer 103. Similarly, when the row driving signal H0 and the column driving signals V0-R or V0-G respectively provide pure digital signals, the corresponding red chip 101 or green chip 102 is illuminated.
Moreover, the wafer drive circuit is of a basic circuit structure, but the invention is not limited to the improved circuit of the circuit, and any improved concept of the wafer drive circuit for controlling the independent operation between the wafers falls within the scope of the invention.
In the conventional LED lamp beads, the LED chips are usually connected by a common cathode or a common anode, so that abnormal phenomena such as dark brightness, normal brightness, and abnormal color are often generated in the display effect. However, in the LED lamp bead driving circuit, the LED chips of the LED lamp beads are not connected with each other, and are controlled to be turned on or off independently through the corresponding chip driving circuit, so that abnormal phenomena such as dark and bright rows, dark and bright columns, normal and bright columns, abnormal colors of columns and the like are radically eliminated.
As shown in fig. 6, a driving system includes a row control chip 210, a column control chip 220, and a plurality of LED bead driving circuits 100 shown in fig. 1, where each LED bead driving circuit 100 controls the corresponding LED bead in the LED display screen to be turned on or off.
Specifically, the row control chip 210 and the column control chip 220 are respectively connected to each wafer driving circuit (not shown) in all the LED bead driving circuits, and the row control chip 210 sends a row driving signal to the wafer driving circuit, and the column control chip 220 sends a column driving signal to the wafer driving circuit.
The driving principle of the driving system is as follows:
in the driving process of the LED display screen, the row control chip 210 sends a row driving signal to each wafer driving circuit in the LED bead driving circuit 100; the column control chip 220 sends a column driving signal to each wafer driving circuit in the LED bead driving circuit 100;
a wafer driving circuit commonly receiving the row driving signals and the column driving signals controls the corresponding LED wafers to be lightened;
the wafer drive circuit receiving only the row drive signal or the column drive signal does not illuminate the corresponding LED wafer.
For example, in the driving system 200, the control system generates ABC digital signals, outputs the ABC digital signals to the row control chip 210, decodes the ABC digital signals by the row control chip 210, outputs n+1 pure digital signals from H0 to Hn, and directly transmits the pure digital signals to one signal input end of the LED lamp bead driving circuit 100 in n+1 columns;
in addition, the control system also generates CLK, OE, LAT digital signals to be output to the column control chip 220, and n+1 pure digital signals of V0 to Vn are output after being decoded by the column control chip 220 and are directly transmitted to the other signal input end of the n+1 row of the LED lamp bead driving circuit 100;
for example, when H0 and V0 simultaneously output pure digital signals to the LED lamp bead driving circuit 100, the LED chip in the corresponding LED lamp bead may be turned on, and so on, and the LED display screen may be easily obtained, and the pure digital signals output by different row control chips and the pure digital signals output by different column control chips may be output to the LED lamp bead driving circuit 100 of the corresponding LED lamp bead to display content.
In addition, as the driving system has only pure digital signals and no analog signal circuit, the number of the applied chips is small, so that the wiring difficulty is greatly reduced, and the electrical performance requirement of the LED lamp tube is easily met; moreover, the display effect realized by the driving system has no low gray uneven, no low gray color cast, no high and low gray contrast coupling and no cross-plate color difference phenomenon.
An LED display screen comprises a plurality of LED display screen modules. Specifically, the LED bead packaging structure of the LED beads in each LED display module includes a packaging substrate, a packaging layer, a driving circuit combined chip and n LED chips packaged on the packaging substrate by the packaging layer, and conductive wires and pads, where n is a positive integer. Optionally, the package substrate is a PCB board.
The driving circuit combined chip is internally integrated with n wafer driving circuits in the LED lamp bead driving circuit; each LED chip is controlled to be on or off by one chip driving circuit.
The conductive wire is connected with a wafer driving circuit in the LED wafer and the driving circuit combined chip, and is also connected with the LED wafer and the bonding pad; the bonding pads are assembled on the packaging substrate through the through holes of the packaging substrate.
Next, the LED lamp bead packaging structure is described in detail according to the number of full-color pixels in each LED lamp bead packaging structure.
For example, each LED bead package structure includes a full-color pixel, i.e., each LED bead package structure encapsulates a red wafer, a green wafer, and a blue wafer; for convenience of description, the red wafer, the green wafer, and the blue wafer constituting one full-color pixel are referred to as a full-color wafer group.
As shown in fig. 7, the LED lamp bead package structure 400 includes a PCB board 410, a full-color chipset 420, a driving circuit combined chip 430, a bonding pad 440, a package layer 450 and a conductive wire 460. The material of the encapsulation layer 450 is resin or silicone encapsulation material, and the conductive wires 460 are wires such as gold wires, copper wires or alloy wires.
The driving circuit combined chip 430 is integrated with a chip driving circuit for driving the full-color chip set 420, the full-color chip set 420 and the driving circuit combined chip 430 are both packaged on the PCB 410 through the packaging layer 450, the bonding pad 440 is assembled on the PCB 410 through a via hole of the PCB 410, the full-color chip set 420 and the driving circuit combined chip 430 are connected through a conductive wire 460, and the full-color chip set 420 and the bonding pad 440 are connected through the conductive wire 460.
As shown in fig. 8, the full-color chip set 420 in the LED lamp bead package structure 400 includes a red chip 401, a green chip 402 and a blue chip 403, and the bonding pads 440 include bonding pads 405, 406, 407, 408, 409, 410 and a sub-set of bonding pads 411. It should be understood that three of the wafer driving circuits are integrated in the driving circuit combined chip 430, that is, three NMOS transistors, three constant current sources, and three PMOS transistors are integrated therein.
For another example, each LED bead package structure includes 2×2 full-color pixels, that is, four red chips, four green chips, and four blue chips are packaged in each LED bead package structure. Herein, for convenience of description, a red wafer, a green wafer, and a blue wafer constituting one full-color pixel point are referred to as a full-color wafer group.
As shown in fig. 9, the LED lamp bead package structure 500 includes a PCB board 510, a full-color chipset 520, a driving circuit combined chip 530, a bonding pad 540, a package layer 550, and a conductive trace 560. The material of the encapsulation layer 550 is resin or silicone encapsulation material, and the conductive circuit 560 is a printed circuit on the surface of the PCB.
The driving circuit combined chip 530 is integrated with a chip driving circuit for driving the full-color chip set 520, the full-color chip set 520 and the driving circuit combined chip 530 are packaged on the PCB 510 through the packaging layer 550, the bonding pad 540 is assembled on the PCB 410 through a via hole of the PCB 510, the full-color chip set 520 and the driving circuit combined chip 530 are connected through a conductive circuit 560, and the full-color chip set 520 and the bonding pad 540 are connected through the conductive circuit 560.
As shown in fig. 10, the LED lamp bead package structure 500 includes 2×2 full-color die sets 510, driving circuit combination chips 520, pads 506, 507, 508, 509, 510, 511. It should be understood that 12 wafer driving circuits, that is, twelve NMOS transistors, twelve constant current sources, and twelve PMOS transistors are integrated in the driving circuit combined chip 520.
It should be understood that each of the LED bead package structures may further include 3 or at least 5 full-color pixels, and the LED bead package structure including 3 or at least 5 full-color pixels is substantially the same as the above-described LED bead package structure, which is not described herein.
It should be understood that the above composite electronic component may be regarded as one type of COB device, the chip and the wafer inside the COB device may be processed by a flip-chip process, and the LED display screen on which the composite electronic component is mounted may also be regarded as one type of COB LED display screen.
While the foregoing description illustrates and describes the preferred embodiments of the present invention, as noted above, it is to be understood that the invention is not limited to the forms disclosed herein but is not to be construed as excluding other embodiments, and that various other combinations, modifications and environments are possible and may be made within the scope of the inventive concepts described herein, either by way of the foregoing teachings or by those of skill or knowledge of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (6)
1. The utility model provides a LED lamp pearl packaging structure which characterized in that: comprises a packaging substrate, a packaging layer, a driving circuit combined chip and n LED wafers which are packaged on the packaging substrate through the packaging layer, wherein n is a positive integer,
n wafer driving circuits are integrated in the driving circuit combined chip, and each LED wafer is controlled to be turned on and off through one wafer driving circuit;
each wafer driving circuit is used for receiving a row driving signal sent by a row control chip and a column driving signal sent by a column control chip, and when the wafer driving circuits jointly receive the row driving signal and the column driving signal, the wafer driving circuits lighten the corresponding LED wafers; one end of each wafer driving circuit is connected with VDD, the other end of each wafer driving circuit is grounded, each wafer driving circuit comprises a row driving chip, a single-way constant current source and a column driving chip, and the row driving chips, the single-way constant current source, the column driving chips and the LED wafers are connected in series between VDD and the ground; one switching element in the row driving chip and the column driving chip is used for controlling on-off according to the row driving signal, and the other switching element is used for controlling on-off according to the column driving signal.
2. The LED lamp bead package structure of claim 1, wherein: the packaging substrate is a PCB.
3. The LED lamp bead package structure of claim 1, wherein: the LED chip comprises an LED chip, a driving circuit, a bonding pad, a conductive wire and a power supply, wherein the LED chip is connected with the bonding pad through the conductive wire;
the bonding pads are assembled on the packaging substrate through the through holes of the packaging substrate.
4. The lamp bead package structure of claim 1, wherein: the row driving chip and the column driving chip are MOS transistors.
5. An LED display screen, characterized in that: the LED display screen module comprises a plurality of LED display screen modules, wherein each LED lamp bead in each LED display screen module is provided with the LED lamp bead packaging structure as claimed in any one of claims 1-4.
6. An LED display screen as set forth in claim 5, wherein: the driving system is used for driving the LED display screen modules;
the driving system comprises a row control chip, a column control chip and wafer driving circuits in the LED lamp bead packaging structure according to any one of claims 1-4, wherein each wafer driving circuit controls the LED wafers in the corresponding LED lamp beads to be on or off;
the row control chip and the column control chip are respectively connected with each wafer driving circuit, the row control chip sends row driving signals to the wafer driving circuits, and the column control chip sends column driving signals to the wafer driving circuits.
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| CN201810442082.3A CN108541108B (en) | 2018-05-10 | 2018-05-10 | LED lamp bead packaging structure and LED display screen |
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| CN201810442082.3A CN108541108B (en) | 2018-05-10 | 2018-05-10 | LED lamp bead packaging structure and LED display screen |
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| CN108541108A CN108541108A (en) | 2018-09-14 |
| CN108541108B true CN108541108B (en) | 2023-10-24 |
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| CN101329044A (en) * | 2008-05-20 | 2008-12-24 | 北京巨数数字技术开发有限公司 | LED luminous element of integrated drive circuit |
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2018
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| CN101877350A (en) * | 2010-04-20 | 2010-11-03 | 蒋伟东 | Integrated chip unit |
| CN206441724U (en) * | 2015-12-29 | 2017-08-25 | 中山市圣上光电科技有限公司 | The CSP LEDs of secondary optics processing |
| CN207146079U (en) * | 2017-06-18 | 2018-03-27 | 鞍山市祺亚德农业照明科技有限公司 | The LED light supplementing lamp for plants of one lamp multipotency |
| CN107134252A (en) * | 2017-06-30 | 2017-09-05 | 深圳市洲明科技股份有限公司 | A kind of LED display driving structure and driving method |
| CN208063525U (en) * | 2018-05-10 | 2018-11-06 | 厦门强力巨彩光电科技有限公司 | A kind of LED lamp bead encapsulating structure and LED display |
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