CN108531862A - A kind of metal mask plate and preparation method thereof - Google Patents
A kind of metal mask plate and preparation method thereof Download PDFInfo
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- CN108531862A CN108531862A CN201710123618.0A CN201710123618A CN108531862A CN 108531862 A CN108531862 A CN 108531862A CN 201710123618 A CN201710123618 A CN 201710123618A CN 108531862 A CN108531862 A CN 108531862A
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- mask plate
- barrier layer
- metal mask
- viewing area
- metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of metal mask plates and preparation method thereof.The metal mask plate includes viewing area and is at least set to the Support of the viewing area opposite sides;The viewing area includes multiple pixel trepannings and latticed light shielding part;The thickness of the Support is more than the thickness of the latticed light shielding part.Metal mask plate provided in an embodiment of the present invention includes viewing area and is at least set to the Support of the viewing area opposite sides, the viewing area includes multiple pixel trepannings and latticed light shielding part, the thickness of the Support is more than the thickness of the latticed light shielding part, the thickness of metal mask plate Support is set to thicken compared to the prior art, it no longer needs to collapse flat metal mask plate using the technology of throwing the net, under the premise of ensureing that metal mask plate prepares precision, avoid metal mask plate deformation problems caused by the pulling force that the technology of throwing the net uses, reduce yield loss of the metal mask plate in evaporator use.
Description
Technical field
The present embodiments relate to mask plate manufacturing technologies more particularly to a kind of metal mask plate and preparation method thereof.
Background technology
Organic light emitting display function admirable receives user's favor.Pixel juxtaposition method is to use relatively broad one kind
The preparation method of organic light emitting display, the organic luminescent device produced in this way shows that color is pure, and sends out
Light efficiency is high.
Solder mask frame component is that pixel juxtaposition method prepares jig required when organic light emitting display.It covers in the prior art
Film frame assembly is made of frame, support chip, shielding plate, metal mask plate and side mask plate, support chip, shielding plate, gold
Belong to mask plate and side mask plate to be fixed on frame in a manner of throwing the net in conjunction with welding.In fixing for above-mentioned each component
It needs corresponding component is allowed to collapse in a manner of applying pulling force in journey flat, wherein metal mask plate is relatively thin, and the pulling force of application can make metal
Mask plate generates the deformation of different directions, causes the yield loss in evaporator use.
Invention content
The present invention provides a kind of metal mask plate and preparation method thereof, to avoid metal mask plate during throwing the net by
Pulling force influences to generate deformation, reduces its yield loss in evaporator use.
In a first aspect, an embodiment of the present invention provides a kind of metal mask plate, the metal mask plate include viewing area with
And at least it is set to the Support of the viewing area opposite sides;
The viewing area includes multiple pixel trepannings and latticed light shielding part;
The thickness of the Support is more than the thickness of the latticed light shielding part.
Second aspect, the embodiment of the present invention additionally provide a kind of preparation method of metal mask plate, the method includes:
One substrate is provided;
The first barrier layer is formed on the substrate, and first barrier layer includes multiple mutually independent stoppers, more
Gap region between a stopper and each stopper is viewing area, and the viewing area corresponds to the substrate
Central area setting;
Region except first barrier layer forms the first metal layer, and the first metal layer region is support
Area;
The second barrier layer is formed in the corresponding region in the viewing area;
Region except second barrier layer forms second metal layer;
The substrate, first barrier layer and second barrier layer are removed, to obtain the metal mask plate.
The third aspect, the embodiment of the present invention additionally provide a kind of preparation method of metal mask plate, the method includes:
One substrate is provided
The first metal layer is formed on the substrate;
Third barrier layer is formed on the first metal layer, third barrier layer region is viewing area, corresponding
The central area of the substrate is arranged;
Region except the third barrier layer forms second metal layer, and the region except the third barrier layer is branch
Support area;
Remove the substrate and the third barrier layer;And
Multiple mutually independent pixel vias are formed on the first metal layer in the corresponding region of the third barrier layer, with
Obtain the metal mask plate.
Metal mask plate provided in an embodiment of the present invention includes viewing area and is at least set to the viewing area with respect to two
The Support of side, the viewing area include multiple pixel trepannings and latticed light shielding part, and the thickness of the Support is more than institute
The thickness for stating latticed light shielding part makes the thickness of metal mask plate Support thicken compared to the prior art, no longer needs to use and open
Network technology collapses flat metal mask plate, under the premise of ensureing that metal mask plate prepares precision, avoids metal mask plate because opening
Deformation problems caused by the pulling force that network technology uses reduce yield loss of the metal mask plate in evaporator use.
Description of the drawings
In order to clearly illustrate the technical solution of exemplary embodiment of the present, below to required in description embodiment
The attached drawing to be used does a simple introduction.Obviously, the attached drawing introduced is a part of the embodiment of the invention to be described
Attached drawing, rather than whole attached drawings without creative efforts, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of metal mask plate provided in an embodiment of the present invention;
Fig. 2 is the cross-sectional view of the dotted line AA ' along Fig. 1;
Fig. 3 is the structural schematic diagram of another metal mask plate provided in an embodiment of the present invention;
Fig. 4 is a kind of flow diagram of the preparation method of metal mask plate provided in an embodiment of the present invention;
Fig. 5 a, Fig. 5 c, Fig. 5 e, Fig. 5 g are the preparation process schematic diagrames of metal mask plate provided by Embodiment 2 of the present invention;
Fig. 5 b are the cross-sectional views of the dotted line BB ' along Fig. 5 a;
Fig. 5 d are the cross-sectional views of the dotted line CC ' along Fig. 5 c;
Fig. 5 f are the cross-sectional views of the dotted line DD ' along Fig. 5 e;
Fig. 5 h are the cross-sectional views of the dotted line EE ' along Fig. 5 g;
Fig. 6 is the flow diagram of the preparation method of another metal mask plate provided in an embodiment of the present invention;
Fig. 7 a, Fig. 7 c, Fig. 7 e, Fig. 7 g, Fig. 7 i are that the preparation process for the metal mask plate that the embodiment of the present invention three provides is shown
It is intended to;
Fig. 7 b are the cross-sectional views of the dotted line FF ' along Fig. 7 a;
Fig. 7 d are the cross-sectional views of the dotted line GG ' along Fig. 7 c;
Fig. 7 f are the cross-sectional views of the dotted line HH ' along Fig. 7 e;
Fig. 7 h are the cross-sectional views of the dotted line II ' along Fig. 7 g;
Fig. 7 j are the cross-sectional views of the dotted line JJ ' along Fig. 7 i.
Specific implementation mode
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limitation of the invention.It also should be noted that in order to just
In description, only some but not all contents related to the present invention are shown in the drawings.Exemplary reality is being discussed in greater detail
It should be mentioned that some exemplary embodiments are described as the processing described as flow chart or method before applying example.Although
Operations (or step) are described as the processing of sequence by flow chart, but many of which operation can be by concurrently, concurrently
Ground is implemented simultaneously.In addition, the sequence of operations can be rearranged.The processing when its operations are completed can be by
It terminates, it is also possible to the additional step being not included in attached drawing.It is described processing can correspond to method, function, regulation,
Subroutine, subprogram etc..
Embodiment one
Fig. 1 is a kind of structural schematic diagram of metal mask plate provided in an embodiment of the present invention.Fig. 2 is the dotted line AA ' along Fig. 1
Cross-sectional view.As depicted in figs. 1 and 2, metal mask plate 10 includes viewing area 110 and is at least set to described aobvious
Show that the Support 120 of 110 opposite sides of area, the viewing area 110 include multiple pixel trepannings 111 and latticed light shielding part
112, the thickness of the Support 120 is more than the thickness of the latticed light shielding part 112.
It should be noted that the thickness of setting Support 120 is more than the thickness of latticed light shielding part 112 so that by metal
When mask plate 10 is fixed on frame, no longer needs to collapse flat metal mask plate 10 using the technology of throwing the net, can be covered ensureing metal
Under the premise of diaphragm plate 10 prepares precision, the deformation problems caused by pulling force in the technology of throwing the net of metal mask plate 10 are avoided, are reduced
Yield loss of the metal mask plate 10 in evaporator use.
Significantly, since the thickness of latticed light shielding part 112 affects gold to a certain extent in viewing area 110
Belong to 10 coating film thickness of mask plate and precision, therefore to improve plated film precision, the thickness of the latticed light shielding part 112 in the present invention
It is close with the thickness of metal mask plate 10 in the prior art, specifically, the Thickness range of the latticed light shielding part 112 can
Think 8-50 μm.On the other hand, Support 120 is located at at least both sides of viewing area 110, illustratively, can enclose as shown in Figure 1
It is arranged around 110 surrounding of viewing area, the opposite both sides in viewing area 110 or arbitrary three side can also be set to.When setting Support 120
Thickness be more than viewing area 110 in latticed light shielding part 112 thickness when, be set to the Support of at least both sides of viewing area 110
120 can make entire metal mask plate 10 flatten, without applying the pulling force for collapsing flat metal mask plate 10, Jin Erneng again
Enough avoid the problem that above-mentioned pulling force leads to 10 deformation of metal mask plate.Optionally, the Thickness range of the Support 120 can
Think 700-1000 μm.It is understood that if the relatively thick Support 120 of thickness is set to the side of viewing area 110
It is unable to reach the purpose for making metal mask plate 10 flatten, therefore, Support 120 is set to viewing area 110 by the present embodiment
At least both sides.
It should be noted that referring to Fig. 2, Support 120 includes lower metal layer 122 and upper metal layer 121, wherein lower metal
Layer 122 is formed simultaneously with latticed light shielding part 112, and upper metal layer 121 is formed on lower metal layer 122.It is understood that
The material of upper metal layer 121 and lower metal layer 122 may be the same or different, since the property of same material is more like, on
Metal layer 121 and lower metal layer 122 are preferably formed using same material.
With continued reference to Fig. 1, the Support 120 includes at least and is respectively arranged at the two of 110 opposite sides of the viewing area
A fixed groove 130.
It should be noted that fixed groove 130 for metal mask plate 10 to be attached with frame, optionally, connects
Mode can be welding or gluing etc..Therefore, to avoid metal mask plate 10 from fixing shakiness, fixed groove 130, which includes at least, to be divided
It is not set to two of 110 opposite sides of viewing area, it is to be understood that increase fixing intensity, fixed groove 130 can be with
It is set to other sides of viewing area 110 simultaneously, and multiple fixed grooves 130 can be arranged in every side of viewing area 110.The present embodiment
Arrangement mode, shape and the extending direction of fixed groove 130 to being set to 110 the same side of viewing area do not limit specifically
Fixed, under the premise of metal mask plate 10 can be fixed on frame, designer can be according to hobby and practical application feelings
Condition is adjusted above-mentioned aspect.
In evaporation process, usual metal mask plate 10 relative to frame closer to evaporation source, it is described for such situation
Fixed groove 130 can be set on the vapor deposition face of the metal mask plate 10.
It should be noted that fixed groove 130 is set to Support 120, therefore its depth is less than the thickness of Support 120
Degree, on the other hand, too deep fixed groove 130 can cause the intensity of corresponding Support 120 smaller, consider the above situation,
The depth value range that the fixed groove 130 is arranged in the present embodiment can be less than 500 μm.
Illustratively, as shown in Figure 1, the multiple pixel trepanning 111 can be in matrix arrangement.Further, the picture
The shape of plain trepanning 111 can be rectangle.Optionally, the shape of pixel trepanning 111 can also be polygonal or round.Fig. 1 institutes
Show structure only as the example of technical solution of the present invention, not to the restriction of 111 arrangement mode of pixel trepanning and shape, pixel is opened
111 arrangement mode of hole and shape can be adjusted according to application demand.
Fig. 3 is the structural schematic diagram of another metal mask plate provided in an embodiment of the present invention.As shown in figure 3, metal is covered
Diaphragm plate 20 includes multiple metal mask items 21 disposed in parallel, each metal mask item 21 include sub- viewing area 211 and
Sub- Support 212, wherein sub- Support 212 includes the first sub- Support 1/212 and the second sub- Support 2/212, along described
The vertical direction Y of 21 orientation X of multiple metal mask items, the first sub- Support 1/212 and the second sub- Support 2/212 are divided
It is not set to the opposite both sides in the sub- viewing area 211, is set to sub- Support 212 of the sub- viewing area 211 per side and wraps
A sub- fixed groove 2121 is included, the multiple sub- viewing area 211 constitutes the viewing area, the multiple 212 structure of sub- Support
At the Support, the multiple sub- fixed groove 2121 constitutes the fixed groove.
Optionally, multiple pixel trepannings 2111 in each sub- viewing area 211 are along multiple mask strip arrangement sides
Vertical direction Y arrangements to X.
Metal mask plate provided in this embodiment includes viewing area and is at least set to the viewing area opposite sides
Support, the viewing area include multiple pixel trepannings and latticed light shielding part, and the thickness of the Support is more than the net
The thickness of trellis light shielding part makes the thickness of metal mask plate Support thicken compared to the prior art, no longer needs to using skill of throwing the net
Art collapses flat metal mask plate, under the premise of ensureing that metal mask plate prepares precision, avoids metal mask plate because of skill of throwing the net
Deformation problems caused by the pulling force that art uses reduce yield loss of the metal mask plate in evaporator use.
Embodiment two
Fig. 4 is a kind of flow diagram of the preparation method of metal mask plate provided in an embodiment of the present invention.Such as Fig. 4 institutes
Show, the preparation method of the metal mask plate can specifically include as follows:
Step 11 provides a substrate.
Step 12 forms the first barrier layer on the substrate, and first barrier layer includes multiple mutually independent resistances
Block, the gap region between multiple stoppers and each stopper are viewing area, and the viewing area corresponds to
The central area of the substrate is arranged.
Optionally, the first barrier layer further includes the multiple barrier ribs for being at least respectively arranged at the viewing area opposite sides.
Step 13, the region except first barrier layer form the first metal layer, the first metal layer location
Domain is Support.
Step 14 forms the second barrier layer in the corresponding region in the viewing area.
Step 15, the region except second barrier layer form second metal layer.
Optionally, the first metal layer and the second metal layer are formed using electroforming process.
Step 16, the removal substrate, first barrier layer and second barrier layer, are covered with obtaining the metal
Diaphragm plate.
Optionally, the material on first barrier layer and second barrier layer can be photoresist.
It is arranged below around viewing area with Support, and fixed groove is set in the Support of viewing area opposite sides
For structure, the preparation method of the metal mask plate described in the present embodiment is illustrated.
Shown in Fig. 5 a and Fig. 5 b, a substrate 510 is provided, forms the first barrier layer 520 on substrate 510, described
One barrier layer 520 includes multiple mutually independent stoppers 521, multiple stoppers 521 and each stopper 521 it
Between gap region be viewing area.First barrier layer 520 further includes be respectively arranged at the viewing area opposite sides two
A barrier rib 522.
Shown in Fig. 5 c and Fig. 5 d, the region except first barrier layer 520 forms the first metal layer 530.It needs
It is noted that 530 region of the first metal layer is Support
Shown in Fig. 5 e and Fig. 5 f, the second barrier layer 540 is formed in the corresponding region in the viewing area.
Shown in Fig. 5 g and Fig. 5 h, the region except second barrier layer 540 forms second metal layer 550.
It should be noted that metal material of the same race or not of the same race may be used in the first metal layer 530 and second metal layer 550
It is formed, manufacture craft equally can be the same or different.Illustratively, the first metal layer 530 and second metal layer 550 use
Same material same process is formed, such as manufacture craft can be electroforming, and the material of use can be copper or iron etc. and electricity
The material of casting process compatibility.
Finally, the substrate, first barrier layer and second barrier layer are removed, to obtain the metal mask
Plate, the structure of the metal mask plate is referring to Fig. 1 and Fig. 2.
It should be noted that the first barrier layer and the second barrier layer may be used of the same race or same material is not formed.Example
Property, the first barrier layer and the second barrier layer can be all made of photoresist and be formed.Correspondingly, removal the first barrier layer and second
Developer solution may be used when barrier layer and carry out dissolving removal.
Technical solution provided in this embodiment, by forming the first barrier layer on substrate, the first barrier layer includes multiple
Mutually independent stopper, the gap region between multiple stoppers and each stopper are viewing area, and viewing area corresponds to
The central area of substrate is arranged, and the region except the first barrier layer forms the first metal layer, and the first metal layer region is
Support forms the second barrier layer in the corresponding region in viewing area, and the region except the second barrier layer forms second metal layer,
Removal substrate, the first barrier layer and the second barrier layer make the thickness phase of metal mask plate Support to obtain metal mask plate
It is thickened compared with the prior art, no longer needs to collapse flat metal mask plate using the technology of throwing the net, ensureing metal mask plate preparation precision
Under the premise of, metal mask plate deformation problems caused by the pulling force that the technology of throwing the net uses are avoided, metal mask plate is reduced
Yield loss in evaporator use.
Apply example three
Fig. 6 is the flow diagram of the preparation method of another metal mask plate provided in an embodiment of the present invention.Such as Fig. 6 institutes
Show, the preparation method of the metal mask plate can specifically include as follows:
Step 21 provides a substrate.
Step 22 forms the first metal layer on the substrate.
Step 23 forms third barrier layer on the first metal layer, and third barrier layer region is display
Area, the central area setting of the corresponding substrate.
Step 24, region except the third barrier layer form second metal layer, except the third barrier layer
Region is Support.
Illustratively, the first metal layer and the second metal layer may be used electroforming process and formed.
Optionally, it is formed before the first metal layer on substrate, can also include:The 4th blocking is formed on the substrate
Layer, the 4th barrier layer includes the multiple barrier ribs for being at least respectively arranged at the viewing area opposite sides;Correspondingly, institute
It states the region except third barrier layer to be formed after second metal layer, further includes:Remove the 4th barrier layer.
Illustratively, the material on the third barrier layer and the 4th barrier layer can be photoresist.
Step 25 removes the substrate and the third barrier layer.
Multiple mutually independent pixels are formed in step 26, the first metal layer in the corresponding region of the third barrier layer
Through-hole, to obtain the metal mask plate.
Illustratively, may be used laser formed on the first metal layer in the corresponding region of the third barrier layer it is multiple
Pixel trepanning.
It is arranged below around viewing area with Support, and fixed groove is set in the Support of viewing area opposite sides
For structure, the preparation method of the metal mask plate described in the present embodiment is illustrated.
Shown in Fig. 7 a and Fig. 7 b, a substrate 710 is provided, forms the 4th barrier layer 720 on substrate 710, described the
Four barrier layers 720 include two barrier ribs for being respectively arranged at viewing area opposite sides.
Shown in Fig. 7 c and Fig. 7 d, the region except the 4th barrier layer 720 forms the first metal layer 730.
Shown in Fig. 7 e and Fig. 7 f, third barrier layer 740, third barrier layer are formed on the first metal layer 730
740 regions are viewing area, and the central area of counterpart substrate 710 is arranged.
Shown in Fig. 7 g and 7h, the region except the third barrier layer 740 forms second metal layer 750, described
Region except third barrier layer 740 is Support.
It should be noted that metal material of the same race or not of the same race may be used in the first metal layer 730 and second metal layer 750
It is formed, manufacture craft equally can be the same or different.Illustratively, the first metal layer 730 and second metal layer 750 use
Same material same process is formed, such as manufacture craft can be electroforming, and the material of use can be copper or iron etc. and electricity
The material of casting process compatibility.
Shown in Fig. 7 i and 7j, the substrate, the 4th barrier layer and the third barrier layer, remaining first gold medal are removed
Belong to layer 730 and second metal layer 750.
It should be noted that third barrier layer and the 4th barrier layer may be used of the same race or same material is not formed.Example
Property, third barrier layer and the 4th barrier layer can be all made of photoresist and be formed.Correspondingly, removal third barrier layer and the 4th
Developer solution may be used when barrier layer and carry out dissolving removal.
Finally, multiple pixel vias are formed on the first metal layer in the corresponding region of the third barrier layer, to obtain
The metal mask plate, the structure of the metal mask plate is referring to Fig. 1 and Fig. 2.
Technical solution provided in this embodiment is formed on the first metal layer by forming the first metal layer on substrate
Third barrier layer, third barrier layer region are viewing area, and the central area of counterpart substrate is arranged, except third barrier layer
Region form second metal layer, the region except third barrier layer is Support, removes substrate and third barrier layer, the
Multiple mutually independent pixel vias are formed on the first metal layer in three barrier layers corresponding region, to obtain metal mask plate,
So that the thickness of metal mask plate Support is thickened compared to the prior art, no longer needs to collapse flat metal mask using the technology of throwing the net
Plate avoids metal mask plate because the pulling force that the technology of throwing the net uses causes under the premise of ensureing that metal mask plate prepares precision
Deformation problems, reduce yield loss of the metal mask plate in evaporator use.
Note that above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiments described here, can carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out to the present invention by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
May include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (19)
1. a kind of metal mask plate, which is characterized in that including viewing area and be at least set to the viewing area opposite sides
Support;
The viewing area includes multiple pixel trepannings and latticed light shielding part;
The thickness of the Support is more than the thickness of the latticed light shielding part.
2. metal mask plate according to claim 1, which is characterized in that the Support includes at least and is respectively arranged at institute
State two fixed grooves of viewing area opposite sides.
3. metal mask plate according to claim 2, which is characterized in that two fixed grooves are set to the metal
On the vapor deposition face of mask plate.
4. metal mask plate according to claim 1, which is characterized in that the Thickness range of the latticed light shielding part
It is 8-50 μm.
5. metal mask plate according to claim 1, which is characterized in that the Thickness of the Support ranging from 700-
1000μm。
6. metal mask plate according to claim 2, which is characterized in that the depth value range of the fixed groove is small
In 500 μm.
7. metal mask plate according to claim 1, which is characterized in that multiple pixel trepannings are arranged in matrix.
8. metal mask plate according to claim 1, which is characterized in that the shape of the pixel trepanning is selected from following shape
One of:It is rectangle, polygonal and round.
9. metal mask plate according to claim 1, which is characterized in that the metal mask plate includes multiple is arranged in parallel
Metal mask item;
Each metal mask item includes sub- viewing area and sub- Support, along the multiple metal mask orientation
Vertical direction, the sub- Support are set to the opposite both sides in the sub- viewing area;
It includes a sub- fixed groove to be set to sub- Support of the sub- viewing area per side;
The multiple sub- viewing area constitutes the viewing area, and the multiple sub- Support constitutes the Support, the multiple son
Fixed groove constitutes the fixed groove.
10. metal mask plate according to claim 9, which is characterized in that multiple pixels in each sub- viewing area
Trepanning is arranged along the vertical direction of multiple mask strip orientations.
11. a kind of preparation method of metal mask plate, which is characterized in that including:
One substrate is provided;
The first barrier layer is formed on the substrate, and first barrier layer includes multiple mutually independent stoppers, Duo Gesuo
The gap region stated between stopper and each stopper is viewing area, and the viewing area corresponds in the substrate
Heart district domain is arranged;
Region except first barrier layer forms the first metal layer, and the first metal layer region is Support;
The second barrier layer is formed in the corresponding region in the viewing area;
Region except second barrier layer forms second metal layer;
The substrate, first barrier layer and second barrier layer are removed, to obtain the metal mask plate.
12. according to the method for claim 11, which is characterized in that first barrier layer further includes at least being respectively arranged at
Multiple barrier ribs of the viewing area opposite sides.
13. according to the method for claim 11, which is characterized in that first barrier layer and second barrier layer
Material is photoresist.
14. according to the method for claim 11, which is characterized in that the first metal layer and the second metal layer use
Electroforming process is formed.
15. a kind of preparation method of metal mask plate, which is characterized in that including:
One substrate is provided
The first metal layer is formed on the substrate;
Third barrier layer is formed on the first metal layer, third barrier layer region is viewing area, it is corresponding described in
The central area of substrate is arranged;
Region except the third barrier layer forms second metal layer, and the region except the third barrier layer is support
Area;
Remove the substrate and the third barrier layer;And
Multiple mutually independent pixel vias are formed on the first metal layer in the corresponding region of the third barrier layer, to obtain
The metal mask plate.
16. according to the method for claim 15, which is characterized in that before the step of forming the first metal layer on substrate,
Further include:
The 4th barrier layer is formed on the substrate, and the 4th barrier layer is opposite including being at least respectively arranged at the viewing area
Multiple barrier ribs of both sides;Correspondingly, after the step of region except the third barrier layer forms second metal layer, also
Including:
Remove the 4th barrier layer.
17. according to the method for claim 15, which is characterized in that using laser in the corresponding region of the third barrier layer
The first metal layer on form multiple pixel trepannings.
18. according to the method for claim 16, which is characterized in that the third barrier layer and the 4th barrier layer
Material is photoresist.
19. according to the method for claim 15, which is characterized in that the first metal layer and the second metal layer use
Electroforming process is formed.
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---|---|---|---|---|
CN111384141A (en) * | 2020-03-24 | 2020-07-07 | 京东方科技集团股份有限公司 | OLED display panel, manufacturing method thereof and display device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090003014A (en) * | 2007-07-05 | 2009-01-09 | 네오뷰코오롱 주식회사 | Mask frame assembly for thin layer deposition |
CN103668052A (en) * | 2012-09-07 | 2014-03-26 | 昆山允升吉光电科技有限公司 | Composite mask plate assembly |
KR20150006244A (en) * | 2013-07-08 | 2015-01-16 | 삼성디스플레이 주식회사 | Mask assembly and method of fabricating the same |
CN204529949U (en) * | 2015-03-25 | 2015-08-05 | 上海天马有机发光显示技术有限公司 | Mask plate |
CN204825028U (en) * | 2015-08-06 | 2015-12-02 | 鄂尔多斯市源盛光电有限责任公司 | Mask plate and display substrates coating by vaporization system |
CN105951042A (en) * | 2016-07-01 | 2016-09-21 | 京东方科技集团股份有限公司 | Mask plate and manufacturing method thereof |
-
2017
- 2017-03-03 CN CN201710123618.0A patent/CN108531862B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090003014A (en) * | 2007-07-05 | 2009-01-09 | 네오뷰코오롱 주식회사 | Mask frame assembly for thin layer deposition |
CN103668052A (en) * | 2012-09-07 | 2014-03-26 | 昆山允升吉光电科技有限公司 | Composite mask plate assembly |
KR20150006244A (en) * | 2013-07-08 | 2015-01-16 | 삼성디스플레이 주식회사 | Mask assembly and method of fabricating the same |
CN204529949U (en) * | 2015-03-25 | 2015-08-05 | 上海天马有机发光显示技术有限公司 | Mask plate |
CN204825028U (en) * | 2015-08-06 | 2015-12-02 | 鄂尔多斯市源盛光电有限责任公司 | Mask plate and display substrates coating by vaporization system |
CN105951042A (en) * | 2016-07-01 | 2016-09-21 | 京东方科技集团股份有限公司 | Mask plate and manufacturing method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111384141A (en) * | 2020-03-24 | 2020-07-07 | 京东方科技集团股份有限公司 | OLED display panel, manufacturing method thereof and display device |
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