CN108531862B - Metal mask plate and preparation method thereof - Google Patents
Metal mask plate and preparation method thereof Download PDFInfo
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- CN108531862B CN108531862B CN201710123618.0A CN201710123618A CN108531862B CN 108531862 B CN108531862 B CN 108531862B CN 201710123618 A CN201710123618 A CN 201710123618A CN 108531862 B CN108531862 B CN 108531862B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a metal mask plate and a preparation method thereof. The metal mask plate comprises a display area and support areas at least arranged on two opposite sides of the display area; the display area comprises a plurality of pixel openings and a grid-shaped shading part; the thickness of the support area is larger than that of the grid-shaped shading part. The metal mask plate provided by the embodiment of the invention comprises a display area and support areas at least arranged at two opposite sides of the display area, wherein the display area comprises a plurality of pixel openings and latticed shading parts, the thickness of the support areas is larger than that of the latticed shading parts, so that the thickness of the support areas of the metal mask plate is thicker than that of the support areas of the metal mask plate in the prior art, the metal mask plate does not need to be flattened by adopting a mesh stretching technology, the problem of deformation of the metal mask plate caused by tension used by the mesh stretching technology is avoided on the premise of ensuring the preparation precision of the metal mask plate, and the yield loss of the metal mask plate in the use of an evaporation machine is reduced.
Description
Technical Field
The embodiment of the invention relates to a mask plate manufacturing technology, in particular to a metal mask plate and a preparation method thereof.
Background
The organic light emitting display device has excellent performance and is popular with users. The pixel juxtaposition method is a preparation method of an organic light-emitting display device which is widely used, and the organic light-emitting display device prepared by the method has pure display color and high light-emitting efficiency.
The mask frame assembly is a jig required when the organic light emitting display device is prepared by a pixel juxtaposition method. In the prior art, a mask frame assembly consists of a frame, a supporting sheet, a shielding sheet, a metal mask plate and a side mask plate, wherein the supporting sheet, the shielding sheet, the metal mask plate and the side mask plate are all fixed on the frame in a mesh-bonding welding mode. The corresponding parts need to be collapsed and leveled in a mode of applying tension in the fixing process of each part, wherein the metal mask plate is thin, and the applied tension can enable the metal mask plate to deform in different directions, so that yield loss in the use of the evaporation machine is caused.
Disclosure of Invention
The invention provides a metal mask plate and a preparation method thereof, which are used for preventing the metal mask plate from being deformed due to the influence of tension in the screen-stretching process and reducing the yield loss of the metal mask plate in the use of an evaporation machine.
In a first aspect, an embodiment of the present invention provides a metal mask plate, where the metal mask plate includes a display region and support regions at least disposed on two opposite sides of the display region;
the display area comprises a plurality of pixel openings and a grid-shaped shading part;
the thickness of the support area is larger than that of the grid-shaped shading part.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a metal mask, where the method includes:
providing a substrate;
forming a first barrier layer on the substrate, wherein the first barrier layer comprises a plurality of mutually independent barrier blocks, the plurality of barrier blocks and a region where a gap between the barrier blocks is located are display regions, and the display regions are arranged corresponding to the central region of the substrate;
forming a first metal layer in an area outside the first barrier layer, wherein the area where the first metal layer is located is a support area;
forming a second barrier layer in a region corresponding to the display region;
forming a second metal layer in a region outside the second barrier layer;
and removing the substrate, the first blocking layer and the second blocking layer to obtain the metal mask plate.
In a third aspect, an embodiment of the present invention further provides a method for manufacturing a metal mask plate, where the method includes:
providing a substrate
Forming a first metal layer on the substrate;
forming a third barrier layer on the first metal layer, wherein the area where the third barrier layer is located is a display area and is arranged corresponding to the central area of the substrate;
forming a second metal layer in a region outside the third barrier layer, wherein the region outside the third barrier layer is a support region;
removing the substrate and the third barrier layer; and
and forming a plurality of mutually independent pixel through holes on the first metal layer in the area corresponding to the third barrier layer to obtain the metal mask plate.
The metal mask plate provided by the embodiment of the invention comprises a display area and support areas at least arranged at two opposite sides of the display area, wherein the display area comprises a plurality of pixel openings and latticed shading parts, the thickness of the support areas is larger than that of the latticed shading parts, so that the thickness of the support areas of the metal mask plate is thicker than that of the support areas of the metal mask plate in the prior art, the metal mask plate does not need to be flattened by adopting a mesh stretching technology, the problem of deformation of the metal mask plate caused by tension used by the mesh stretching technology is avoided on the premise of ensuring the preparation precision of the metal mask plate, and the yield loss of the metal mask plate in the use of an evaporation machine is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, a brief description is given below of the drawings used in describing the embodiments. It should be clear that the described figures are only views of some of the embodiments of the invention to be described, not all, and that for a person skilled in the art, other figures can be derived from these figures without inventive effort.
Fig. 1 is a schematic structural diagram of a metal mask according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along the dashed line AA' in FIG. 1;
fig. 3 is a schematic structural diagram of another metal mask provided in an embodiment of the present invention;
fig. 4 is a schematic flow chart of a method for manufacturing a metal mask according to an embodiment of the present invention;
fig. 5a, 5c, 5e, and 5g are schematic diagrams of a manufacturing process of a metal mask according to a second embodiment of the present invention;
FIG. 5b is a schematic cross-sectional view taken along the dashed line BB' in FIG. 5 a;
FIG. 5d is a schematic cross-sectional view taken along the dashed line CC' in FIG. 5 c;
FIG. 5f is a schematic cross-sectional view taken along the dotted line DD' in FIG. 5 e;
FIG. 5h is a schematic cross-sectional view taken along dashed line EE' in FIG. 5 g;
fig. 6 is a schematic flow chart of a further method for manufacturing a metal mask according to an embodiment of the present invention;
fig. 7a, 7c, 7e, 7g, and 7i are schematic diagrams of a manufacturing process of a metal mask according to a third embodiment of the present invention;
FIG. 7b is a schematic cross-sectional view taken along the dashed line FF' in FIG. 7 a;
FIG. 7d is a schematic cross-sectional view taken along dotted line GG' in FIG. 7 c;
FIG. 7f is a schematic cross-sectional view taken along dashed line HH' in FIG. 7 e;
FIG. 7h is a schematic cross-sectional view taken along the dashed line II' in FIG. 7 g;
fig. 7j is a schematic sectional view along a dotted line JJ' in fig. 7 i.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
Example one
Fig. 1 is a schematic structural diagram of a metal mask provided in an embodiment of the present invention. Fig. 2 is a schematic sectional view along the broken line AA' in fig. 1. As shown in fig. 1 and 2, the metal mask plate 10 includes a display area 110 and support areas 120 at least disposed on two opposite sides of the display area 110, the display area 110 includes a plurality of pixel openings 111 and a grid-shaped light-shielding portion 112, and a thickness of the support area 120 is greater than a thickness of the grid-shaped light-shielding portion 112.
It should be noted that the thickness of the support region 120 is greater than the thickness of the grid-shaped shading portion 112, so that when the metal mask plate 10 is fixed on the frame, the metal mask plate 10 does not need to be flattened by adopting a mesh stretching technology, the problem of deformation of the metal mask plate 10 due to tension in the mesh stretching technology can be avoided on the premise of ensuring the preparation precision of the metal mask plate 10, and the yield loss of the metal mask plate 10 in the use of the evaporation machine is reduced.
It should be noted that, since the thickness of the grid-shaped shading part 112 in the display area 110 affects the thickness and the precision of the metal mask plate 10 to a certain extent, in order to improve the precision of the metal coating, the thickness of the grid-shaped shading part 112 in the present invention is similar to the thickness of the metal mask plate 10 in the prior art, and specifically, the thickness of the grid-shaped shading part 112 may range from 8 μm to 50 μm. On the other hand, the support regions 120 are located on at least two sides of the display region 110, and may be exemplarily disposed around the periphery of the display region 110 as shown in fig. 1, or disposed on two opposite sides or any three sides of the display region 110. When the thickness of the support region 120 is larger than the thickness of the grid-like shading portion 112 in the display region 110, the support regions 120 disposed on at least two sides of the display region 110 can flatten the entire metal mask plate 10 without applying a pulling force for flattening the metal mask plate 10, thereby avoiding the problem of deformation of the metal mask plate 10 caused by the pulling force. Optionally, the thickness of the support region 120 may range from 700-. It can be understood that if the support region 120 with a relatively thick thickness is disposed on one side of the display region 110, the purpose of flattening the metal mask 10 cannot be achieved, and therefore, the support region 120 is disposed on at least two sides of the display region 110 in this embodiment.
It should be noted that, referring to fig. 2, the support region 120 includes a lower metal layer 122 and an upper metal layer 121, wherein the lower metal layer 122 is formed simultaneously with the grid-shaped light-shielding portion 112, and the upper metal layer 121 is formed on the lower metal layer 122. It is understood that the materials of upper metal layer 121 and lower metal layer 122 may be the same or different, and since the properties of the same material are more similar, upper metal layer 121 and lower metal layer 122 are preferably formed of the same material.
With continued reference to fig. 1, the supporting region 120 at least includes two fixing grooves 130 respectively disposed on two opposite sides of the display region 110.
It should be noted that the fixing groove 130 is used to connect the metal mask plate 10 with the frame, and optionally, the connection manner may be welding or gluing. Therefore, in order to avoid unstable fixing of the metal mask 10, the fixing grooves 130 include at least two grooves respectively disposed on opposite sides of the display region 110, and it can be understood that, in order to increase the fixing strength, the fixing grooves 130 may also be disposed on other sides of the display region 110, and each side of the display region 110 may be disposed with a plurality of fixing grooves 130. In this embodiment, the arrangement, shape, and extending direction of the fixing grooves 130 disposed on the same side of the display region 110 are not specifically limited, and the designer can adjust the above aspects according to the preference and the practical application condition on the premise that the metal mask plate 10 can be fixed on the frame.
In the evaporation process, usually, the metal mask 10 is closer to the evaporation source relative to the frame, and for this case, the fixing groove 130 may be disposed on the evaporation surface of the metal mask 10.
It should be noted that, the fixing groove 130 is disposed in the supporting region 120, and therefore, the depth thereof is smaller than the thickness of the supporting region 120, on the other hand, the too deep fixing groove 130 may cause the strength of the corresponding supporting region 120 to be smaller, and in consideration of the above situation, the depth of the fixing groove 130 provided in this embodiment may be set to be less than 500 μm.
Illustratively, as shown in fig. 1, the plurality of pixel openings 111 may be arranged in a matrix. Further, the pixel opening 111 may be rectangular in shape. Alternatively, the shape of the pixel opening 111 may be polygonal or circular. The structure shown in fig. 1 is only an example of the technical solution of the present invention, and the arrangement and shape of the pixel openings 111 are not limited, and the arrangement and shape of the pixel openings 111 can be adjusted according to the application requirements.
Fig. 3 is a schematic structural diagram of another metal mask provided in an embodiment of the present invention. As shown in fig. 3, the metal mask plate 20 includes a plurality of metal mask stripes 21 arranged in parallel, each metal mask stripe 21 includes a sub-display region 211 and a sub-support region 212, wherein the sub-support region 212 includes a first sub-support region 1/212 and a second sub-support region 2/212, the first sub-support region 1/212 and the second sub-support region 2/212 are respectively disposed on two opposite sides of the sub-display region 211 along a vertical direction Y of an arrangement direction X of the plurality of metal mask stripes 21, the sub-support region 212 disposed on each side of the sub-display region 211 includes a plurality of sub-fixing grooves 2121, the plurality of sub-display regions 211 constitute the display region, the plurality of sub-support regions 212 constitute the support region, and the plurality of sub-fixing grooves 2121 constitute the fixing grooves.
Optionally, the plurality of pixel openings 2111 in each sub-display region 211 are arranged along a vertical direction Y of the mask stripe arrangement direction X.
The metal mask plate that this embodiment provided includes the display area and set up at least in the support area of the relative both sides of display area, the display area includes a plurality of pixel trompils and latticed shading portion, the thickness in support area is greater than the thickness of latticed shading portion makes the thickness in metal mask plate support area compare in prior art bodiness, need not to adopt the stretch-net technique again to collapse flat metal mask plate, under the prerequisite of guaranteeing metal mask plate preparation precision, has avoided the metal mask plate because of the deformation problem that the pulling force that the stretch-net technique used leads to, has reduced the yield loss of metal mask plate on the coating by vaporization machine uses.
Example two
Fig. 4 is a schematic flow chart of a method for manufacturing a metal mask according to an embodiment of the present invention. As shown in fig. 4, the preparation method of the metal mask plate may specifically include the following steps:
step 11, providing a substrate.
Step 12, forming a first blocking layer on the substrate, where the first blocking layer includes a plurality of mutually independent blocking blocks, the plurality of blocking blocks and a region where a gap between the blocking blocks is located are display regions, and the display regions are arranged corresponding to a central region of the substrate.
Optionally, the first blocking layer further includes a plurality of blocking bars respectively disposed at least on two opposite sides of the display area.
And step 13, forming a first metal layer in an area outside the first barrier layer, wherein the area where the first metal layer is located is a support area.
And 14, forming a second barrier layer in the area corresponding to the display area.
And step 15, forming a second metal layer in the region except the second barrier layer.
Optionally, the first metal layer and the second metal layer are formed by an electroforming process.
And 16, removing the substrate, the first blocking layer and the second blocking layer to obtain the metal mask plate.
Optionally, the material of the first barrier layer and the second barrier layer may be a photoresist material.
The following description specifically describes the manufacturing method of the metal mask plate according to this embodiment, taking a structure in which the support region is disposed around the display region, and the fixing grooves are disposed in the support regions on opposite sides of the display region as an example.
Referring to fig. 5a and 5b, a substrate 510 is provided, a first barrier layer 520 is formed on the substrate 510, the first barrier layer 520 includes a plurality of mutually independent barrier blocks 521, and a display area is an area where a gap between the plurality of barrier blocks 521 and each barrier block 521 is located. The first barrier layer 520 further includes two barrier ribs 522 respectively disposed at opposite sides of the display region.
Referring to fig. 5c and 5d, a first metal layer 530 is formed in a region except for the first barrier layer 520. It should be noted that the region where the first metal layer 530 is located is a support region.
Referring to fig. 5e and 5f, a second blocking layer 540 is formed in a region corresponding to the display region.
Referring to fig. 5g and 5h, a second metal layer 550 is formed in a region other than the second barrier layer 540.
It should be noted that the first metal layer 530 and the second metal layer 550 may be formed by using the same or different metal materials, and the manufacturing processes may be the same or different. For example, the first metal layer 530 and the second metal layer 550 are formed by the same material and the same process, for example, the manufacturing processes may be both electroforming, and the materials used may be both copper or iron, which are compatible with the electroforming process.
And finally, removing the substrate, the first blocking layer and the second blocking layer to obtain the metal mask plate, wherein the structure of the metal mask plate is shown in fig. 1 and fig. 2.
It should be noted that the first barrier layer and the second barrier layer may be formed of the same material or different materials. Illustratively, the first barrier layer and the second barrier layer may both be formed using a photoresist material. Accordingly, when the first barrier layer and the second barrier layer are removed, a developer may be used for dissolution removal.
In the technical scheme provided by the embodiment, a first barrier layer is formed on a substrate, the first barrier layer comprises a plurality of mutually independent barrier blocks, the area where the gaps between the plurality of barrier blocks and each barrier block are located is a display area, the display area is arranged corresponding to the central area of the substrate, a first metal layer is formed in the area outside the first barrier layer, the area where the first metal layer is located is a support area, a second barrier layer is formed in the area corresponding to the display area, a second metal layer is formed in the area outside the second barrier layer, the substrate, the first barrier layer and the second barrier layer are removed to obtain a metal mask plate, the thickness of the support area of the metal mask plate is thicker than that of the prior art, the metal mask plate is not required to be flattened by adopting a stretching technology, and the problem of deformation of the metal plate caused by the tension force used by the stretching technology is avoided on the premise of ensuring the preparation precision of the metal mask plate, the yield loss of the metal mask plate in the use of the evaporator is reduced.
EXAMPLE III
Fig. 6 is a schematic flow chart of a further method for manufacturing a metal mask according to an embodiment of the present invention. As shown in fig. 6, the preparation method of the metal mask plate may specifically include the following steps:
Step 22, forming a first metal layer on the substrate.
And 23, forming a third barrier layer on the first metal layer, wherein the area where the third barrier layer is located is a display area and is arranged corresponding to the central area of the substrate.
And 24, forming a second metal layer in the region outside the third barrier layer, wherein the region outside the third barrier layer is a support region.
For example, the first metal layer and the second metal layer may be formed using an electroforming process.
Optionally, before forming the first metal layer on the substrate, the method may further include: forming a fourth barrier layer on the substrate, wherein the fourth barrier layer comprises a plurality of barrier strips at least respectively arranged on two opposite sides of the display area; correspondingly, after forming the second metal layer in the region outside the third barrier layer, the method further includes: and removing the fourth barrier layer.
For example, the material of the third barrier layer and the fourth barrier layer may be a photoresist material.
And 25, removing the substrate and the third barrier layer.
And 26, forming a plurality of mutually independent pixel through holes on the first metal layer in the region corresponding to the third barrier layer to obtain the metal mask plate.
For example, a laser may be used to form a plurality of pixel openings in the first metal layer in the corresponding region of the third barrier layer.
The following description specifically describes the manufacturing method of the metal mask plate according to this embodiment, taking a structure in which the support region is disposed around the display region, and the fixing grooves are disposed in the support regions on opposite sides of the display region as an example.
Referring to fig. 7a and 7b, a substrate 710 is provided, and a fourth barrier layer 720 is formed on the substrate 710, where the fourth barrier layer 720 includes two barrier ribs respectively disposed on two opposite sides of the display area.
Referring to fig. 7c and 7d, a first metal layer 730 is formed in a region other than the fourth barrier layer 720.
Referring to fig. 7e and 7f, a third barrier layer 740 is formed on the first metal layer 730, and the region where the third barrier layer 740 is located is a display region and is disposed corresponding to the central region of the substrate 710.
Referring to fig. 7g and 7h, a second metal layer 750 is formed in a region outside the third barrier layer 740, and the region outside the third barrier layer 740 is a support region.
The first metal layer 730 and the second metal layer 750 may be formed of the same or different metal materials, and the manufacturing processes may be the same or different. For example, the first metal layer 730 and the second metal layer 750 are formed by the same material and the same process, for example, the manufacturing processes may be both electroforming, and the materials used may be both copper or iron, which are compatible with the electroforming process.
Referring to fig. 7i and 7j, the substrate, the fourth barrier layer, and the third barrier layer are removed, and the first metal layer 730 and the second metal layer 750 remain.
It should be noted that the third barrier layer and the fourth barrier layer may be formed of the same material or different materials. Illustratively, the third barrier layer and the fourth barrier layer may both be formed using a photoresist material. Accordingly, when the third barrier layer and the fourth barrier layer are removed, a developer may be used for dissolution removal.
And finally, forming a plurality of pixel through holes on the first metal layer in the region corresponding to the third barrier layer to obtain the metal mask plate, wherein the structure of the metal mask plate is shown in fig. 1 and fig. 2.
In the technical solution provided by this embodiment, a first metal layer is formed on a substrate, a third barrier layer is formed on the first metal layer, a region where the third barrier layer is located is a display region, forming a second metal layer in the region except the third barrier layer, which is a support region, corresponding to the central region of the substrate, removing the substrate and the third barrier layer, forming a plurality of pixel through holes independent of each other on the first metal layer in the region corresponding to the third barrier layer, so as to obtain the metal mask plate, the thickness of the supporting area of the metal mask plate is thicker than that of the prior art, the metal mask plate is not required to be flattened by adopting a mesh-stretching technology, under the prerequisite of guaranteeing metal mask plate preparation precision, avoided the metal mask plate because of the deformation problem that the pulling force that the screen technique used leads to, reduced the yield loss of metal mask plate on the coating by vaporization machine uses.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (18)
1. A metal mask plate is characterized by comprising a display area and support areas at least arranged on two opposite sides of the display area;
the display area comprises a plurality of pixel openings and a grid-shaped shading part;
the support region comprises a lower metal layer and an upper metal layer, wherein the lower metal layer and the latticed shading part are formed simultaneously, and the upper metal layer is formed on the lower metal layer;
the thickness of the support area is larger than that of the grid-shaped shading part.
2. A metal mask according to claim 1, wherein the support region comprises at least two fixing grooves respectively disposed on opposite sides of the display region.
3. The metal mask according to claim 2, wherein two fixing grooves are provided on the evaporation surface of the metal mask.
4. A metal mask according to claim 1, wherein the thickness of the latticed light-blocking part ranges from 8 μm to 50 μm.
5. A metal mask according to claim 2, wherein the depth of the fixing grooves is in a range of less than 500 μm.
6. The metal mask of claim 1, wherein the plurality of pixel openings are arranged in a matrix.
7. The metal mask of claim 1, wherein the shape of the pixel opening is selected from one of the following shapes: rectangular, polygonal, and circular.
8. The metal mask plate according to claim 1, wherein the metal mask plate comprises a plurality of metal mask strips arranged in parallel;
each metal mask strip comprises a sub-display area and a sub-support area, and the sub-support areas are arranged on two opposite sides of the sub-display area along the vertical direction of the arrangement direction of the plurality of metal mask strips;
the sub-supporting area arranged on each side of the sub-display area comprises a sub-fixing groove;
the plurality of sub-display areas form the display area, the plurality of sub-supporting areas form the supporting area, and the plurality of sub-fixing grooves form the fixing grooves.
9. A metal mask according to claim 8, wherein the plurality of pixel openings in each of the sub-display regions are arranged in a direction perpendicular to an arrangement direction of the plurality of mask stripes.
10. A preparation method of a metal mask plate is characterized by comprising the following steps:
providing a substrate;
forming a first barrier layer on the substrate, wherein the first barrier layer comprises a plurality of mutually independent barrier blocks, the plurality of barrier blocks and a region where a gap between the barrier blocks is located are display regions, and the display regions are arranged corresponding to the central region of the substrate;
forming a first metal layer in an area outside the first barrier layer, wherein the area where the first metal layer is located is a support area;
forming a second barrier layer in a region corresponding to the display region;
forming a second metal layer in a region outside the second barrier layer;
and removing the substrate, the first blocking layer and the second blocking layer to obtain the metal mask plate.
11. The method of claim 10, wherein the first barrier layer further comprises a plurality of barrier ribs disposed on at least two opposite sides of the display area, respectively.
12. The method of claim 10, wherein the material of the first and second barrier layers is a photoresist material.
13. The method of claim 10, wherein the first metal layer and the second metal layer are formed using an electroforming process.
14. A preparation method of a metal mask plate is characterized by comprising the following steps:
providing a substrate
Forming a first metal layer on the substrate;
forming a third barrier layer on the first metal layer, wherein the area where the third barrier layer is located is a display area and is arranged corresponding to the central area of the substrate;
forming a second metal layer in a region outside the third barrier layer, wherein the region outside the third barrier layer is a support region;
removing the substrate and the third barrier layer; and
and forming a plurality of mutually independent pixel through holes on the first metal layer in the area corresponding to the third barrier layer to obtain the metal mask plate.
15. The method of claim 14, further comprising, prior to the step of forming the first metal layer on the substrate:
forming a fourth barrier layer on the substrate, wherein the fourth barrier layer comprises a plurality of barrier strips at least respectively arranged on two opposite sides of the display area; correspondingly, after the step of forming the second metal layer in the region outside the third barrier layer, the method further includes:
and removing the fourth barrier layer.
16. The method of claim 14, wherein a laser is used to form a plurality of pixel openings in the first metal layer in the corresponding areas of the third barrier layer.
17. The method of claim 15, wherein the material of the third barrier layer and the fourth barrier layer is a photoresist material.
18. The method of claim 14, wherein the first metal layer and the second metal layer are formed using an electroforming process.
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| CN201710123618.0A CN108531862B (en) | 2017-03-03 | 2017-03-03 | Metal mask plate and preparation method thereof |
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| CN201710123618.0A CN108531862B (en) | 2017-03-03 | 2017-03-03 | Metal mask plate and preparation method thereof |
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| CN108531862A (en) | 2018-09-14 |
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